Journal articles: 'Interfacial melting'

1

Mouritsen, Ole G., and Martin J. Zuckermann. "Model of interfacial melting." Physical Review Letters 58, no. 4 (January 26, 1987): 389–92. http://dx.doi.org/10.1103/physrevlett.58.389.

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Besold, Gerhard, and Ole G. Mouritsen. "Competition between domain growth and interfacial melting." Computational Materials Science 18, no. 2 (August 2000): 225–44. http://dx.doi.org/10.1016/s0927-0256(00)00101-4.

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3

Mondolfo, L. F., N. L. Parisi, and G. J. Kardys. "Interfacial energies in low melting point metals." Materials Science and Engineering 68, no. 2 (January 1985): 249–66. http://dx.doi.org/10.1016/0025-5416(85)90414-8.

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Chou, T. C., A. Joshi, and J. Wadsworth. "Solid state reactions of SiC with Co, Ni, and Pt." Journal of Materials Research 6, no. 4 (April 1991): 796–809. http://dx.doi.org/10.1557/jmr.1991.0796.

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Solid state reactions between SiC ceramics and Co, Ni, and Pt metals have been studied at temperatures between 800 and 1200 °C for various times under He or vacuum conditions. Reactions between the metals and SiC were extensive above 900 °C. Various metal silicides and carbon precipitates were formed in layered reaction zones. Interfacial melting was also observed at certain temperatures; teardrop-shaped reaction zones, porosity, and dendritic microstructure resulting from melting/solidification were evident. The metal/ceramic interfaces exhibited either planar or nonplanar morphologies, depending upon the nature of the metal/ceramic reactions. Concave interfacial contours were observed when interfacial melting occurred. By contrast, planar interfaces were observed in the absence of interfacial melting. In all cases, the decomposition of SiC was sluggish and may serve as a rate limiting step for metal/ceramic reactions. Free unreacted carbon precipitates were formed in all the reaction zones and the precipitation behavior was dependent upon the metal system as well as the location with respect to the SiC reaction interface. Modulated carbon bands, randomly scattered carbon precipitates, and/or carbon-denuded bands were formed in many of the reaction zones, and the carbon existed in a mixed state containing both amorphous and graphitic forms.

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Shakya, Gazendra, Samuel E. Hoff, Shiyi Wang, Hendrik Heinz, Xiaoyun Ding, and Mark A. Borden. "Vaporizable endoskeletal droplets via tunable interfacial melting transitions." Science Advances 6, no. 14 (April 2020): eaaz7188. http://dx.doi.org/10.1126/sciadv.aaz7188.

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Liquid emulsion droplet evaporation is of importance for various sensing and imaging applications. The liquid-to-gas phase transformation is typically triggered thermally or acoustically by low–boiling point liquids, or by inclusion of solid structures that pin the vapor/liquid contact line to facilitate heterogeneous nucleation. However, these approaches lack precise tunability in vaporization behavior. Here, we describe a previously unused approach to control vaporization behavior through an endoskeleton that can melt and blend into the liquid core to either enhance or disrupt cohesive intermolecular forces. This effect is demonstrated using perfluoropentane (C5F12) droplets encapsulating a fluorocarbon (FC) or hydrocarbon (HC) endoskeleton. FC skeletons inhibit vaporization, whereas HC skeletons trigger vaporization near the rotator melting transition. Our findings highlight the importance of skeletal interfacial mixing for initiating droplet vaporization. Tuning molecular interactions between the endoskeleton and droplet phase is generalizable for achieving emulsion or other secondary phase transitions, in emulsions.

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6

Li, Chong He, Yong Hui Gao, Xiong Gang Lu, Wei Zhong Ding, Zhong Ming Ren, and Kang Deng. "Interaction between the Ceramic CaZrO₃ and the Melt of Titanium Alloys." Advances in Science and Technology 70 (October 2010): 136–40. http://dx.doi.org/10.4028/www.scientific.net/ast.70.136.

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The CaZrO3 complex oxide ceramic was synthesized in the development of the potential refractory for melting of titanium alloy, the crucible ( 40XH40mm) was prepared by the solid sintering of mixture of powder (CaO:ZrO2 =1:1) with a small amount of TiO2 as additive at 1750°C. The melting of TiNi and Ti6Al4V was carried out in the inducting furnace under vacuum or/and Ar atmosphere. The interfacial reaction between the melts of alloys and CaZrO3 refractory was investigated by scanning electron microscope (SEM) with energy dispersive X-ray spectroscopy (EDS). It is found that, the thickness of interfacial reaction layer between the ceramic CaZrO3 and the melt of titanium alloys (TiNi and Ti6Al4V) is approximately 30-300 μm, there are few elements such as Ca, Zr, Ti, and Ni diffused through the interfacial reaction layer. These results may provide the basement to designing a novel refractory for melting of titanium alloys.

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Kruskopf, Ari, and Lauri Holappa. "Scrap melting model for steel converter founded on interfacial solid/liquid phenomena." Metallurgical Research & Technology 115, no. 2 (December 5, 2017): 201. http://dx.doi.org/10.1051/metal/2017091.

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The primary goal in steel converter operation is the removal of carbon from the hot metal. This is achieved by blowing oxygen into the melt. The oxidation of carbon produces a lot of heat. To avoid too high temperatures in the melt cold scrap (recycled steel) is charged into the converter. The melting rate is affected by heat and carbon mass transfer. A process model for steel converter is in development. This model is divided into several modules, which are fluid dynamics, heat- and mass-transfer, scrap melting and chemical reactions. This article focuses on the development of the scrap melting module. A numerical model for calculating temperature and carbon concentration in the melt is presented. The melt model is connected with the solid scrap model via solid/liquid interface. The interface model can take into account solidification of iron melt, melting of solidified layer, a situation without such phase changes, and scrap melting. The aim is to predict the melting rate of the scrap including the properties of the hot metal. The model is tested by calculating the melting rates for different scrap thicknesses. All of the stages in the interface model were taking place in the test calculations.

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Tsao, J. Y., P. S. Peercy, and Michael O. Thompson. "Interfacial overheating during melting of Si at 190 m/s." Journal of Materials Research 2, no. 1 (February 1987): 91–95. http://dx.doi.org/10.1557/jmr.1987.0091.

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An upper limit is placed on the overheating at the liquid/solid interface during melting of (100) Si at high interface velocity. The limit is based on an energy-balance analysis of melt depths measured in real time during pulsed-laser melting of Si on sapphire. When combined with previous measurements of the freezing kinetics of Si, this limit indicates that the kinetics of melting and freezing are nonlinear, i.e., the undercooling required to freeze at modest (15 m/s) velocities is proportionately much greater than the overheating required to melt at high (190 m/s) velocities.

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9

Chen, Mingguang, Junzhu Li, Bo Tian, Yas Mohammed Al-Hadeethi, Bassim Arkook, Xiaojuan Tian, and Xixiang Zhang. "Predicting Interfacial Thermal Resistance by Ensemble Learning." Computation 9, no. 8 (August 2, 2021): 87. http://dx.doi.org/10.3390/computation9080087.

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Interfacial thermal resistance (ITR) plays a critical role in the thermal properties of a variety of material systems. Accurate and reliable ITR prediction is vital in the structure design and thermal management of nanodevices, aircraft, buildings, etc. However, because ITR is affected by dozens of factors, traditional models have difficulty predicting it. To address this high-dimensional problem, we employ machine learning and deep learning algorithms in this work. First, exploratory data analysis and data visualization were performed on the raw data to obtain a comprehensive picture of the objects. Second, XGBoost was chosen to demonstrate the significance of various descriptors in ITR prediction. Following that, the top 20 descriptors with the highest importance scores were chosen except for fdensity, fmass, and smass, to build concise models based on XGBoost, Kernel Ridge Regression, and deep neural network algorithms. Finally, ensemble learning was used to combine all three models and predict high melting points, high ITR material systems for spacecraft, automotive, building insulation, etc. The predicted ITR of the Pb/diamond high melting point material system was consistent with the experimental value reported in the literature, while the other predicted material systems provide valuable guidelines for experimentalists and engineers searching for high melting point, high ITR material systems.

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10

Sadtchenko, Vlad, and George E. Ewing. "Interfacial melting of thin ice films: An infrared study." Journal of Chemical Physics 116, no. 11 (March 15, 2002): 4686–97. http://dx.doi.org/10.1063/1.1449947.

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11

Chen, Qicheng, Yuwen Zhang, and Mo Yang. "An Interfacial Tracking Model for Convection-Controlled Melting Problems." Numerical Heat Transfer, Part B: Fundamentals 59, no. 3 (March 7, 2011): 209–25. http://dx.doi.org/10.1080/10407790.2011.550531.

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12

Maruyama, M., M. Bienfait, J. G. Dash, and G. Coddens. "Interfacial melting of ice in graphite and talc powders." Journal of Crystal Growth 118, no. 1-2 (March 1992): 33–40. http://dx.doi.org/10.1016/0022-0248(92)90046-l.

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13

Bian, Hao, Lu Ai, Klaus Hellgardt, Geoffrey C. Maitland, and Jerry Y. Y. Heng. "Phase Behaviour of Methane Hydrates in Confined Media." Crystals 11, no. 2 (February 18, 2021): 201. http://dx.doi.org/10.3390/cryst11020201.

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In a study designed to investigate the melting behaviour of natural gas hydrates which are usually formed in porous mineral sediments rather than in bulk, hydrate phase equilibria for binary methane and water mixtures were studied using high-pressure differential scanning calorimetry in mesoporous and macroporous silica particles having controlled pore sizes ranging from 8.5 nm to 195.7 nm. A dynamic oscillating temperature method was used to form methane hydrates reproducibly and then determine their decomposition behaviour—melting points and enthalpies of melting. Significant decreases in dissociation temperature were observed as the pore size decreased (over 6 K for 8.5 nm pores). This behaviour is consistent with the Gibbs–Thomson equation, which was used to determine hydrate–water interfacial energies. The melting data up to 50 MPa indicated a strong, essentially logarithmic, dependence on pressure, which here has been ascribed to the pressure dependence of the interfacial energy in the confined media. An empirical modification of the Gibbs–Thomson equation is proposed to include this effect.

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14

Yang, Ying, and Ning Yan. "Understanding the cooperative atomic motion and shape change of ultrasmall Au nanoparticles below the premelting temperature." RSC Advances 7, no. 88 (2017): 55807–11. http://dx.doi.org/10.1039/c7ra11604g.

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15

Li, Ping, Xiao Long Gu, Xiao Gang Liu, and Hai Feng Zhong. "Effect of Silver Content on Bulk Properties and Interfacial Morphology of Sn-xAg-Cu Solders." Advanced Materials Research 818 (September 2013): 83–87. http://dx.doi.org/10.4028/www.scientific.net/amr.818.83.

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The bulk microstructure, melting behavior, mechanical property, and interfacial Intermetallic compound (IMC) morphology were investigated on Sn-Ag-Cu (SAC) lead free solders with different Ag content (0.3,1.0,2.0,3.0,3.8wt%). The result indicates that SAC solders with higher Ag content present finer and denser intermetallic particles in the bulk solder, as a result that the tensile strength of SAC solders increased with the increasing of Ag content, while the ductility decreased. The melting temperature of SAC305 and SAC387 solders are close to eutectic point from the narrow melting range. It was found that the interfacial IMC morphology didnt appear obvious difference regardless of Ag content for as-soldered. Furthermore, the higher Ag contained solders present smaller IMC grain at the interface of aged joints and all aged joints have a tendency of polyhedron morphology.

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16

Xu, X., C. P. Grigoropoulos, and R. E. Russo. "Heat Transfer in Excimer Laser Melting of Thin Polysilicon Layers." Journal of Heat Transfer 117, no. 3 (August 1, 1995): 708–15. http://dx.doi.org/10.1115/1.2822634.

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A pulsed KrF excimer laser with nanosecond pulse duration is used for surface melting of thin polycrystalline silicon films. The velocity of the moving phase boundary during melting and solidification, the maximum melting depth, as well as the melting duration are experimentally determined by combined optical and electrical methods. A melting interface tracking model is used to calculate the melt front propagation and the transient temperature field in the semiconductor. A phase-change model, which allows the occurrence of melting and solidification at temperatures other than the equilibrium melting temperature, is employed in the numerical calculation. The effect of interfacial superheating/undercooling is discussed.

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17

Golubina, E. N., and N. F. Kizim. "Interfacial Synthesis: Morphology, Structure, and Properties of Interfacial Formations in Liquid–Liquid Systems." Russian Journal of Physical Chemistry A 95, no. 4 (April 2021): 659–76. http://dx.doi.org/10.1134/s0036024421040075.

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Abstract The results of studies in the field of interfacial synthesis and interfacial formations in liquid–liquid systems are summarized. The mechanisms of the processes of interfacial synthesis are considered. Data on the self-assembly of nanoparticles, films, and 3D materials are given. The properties of materials of interfacial formations in systems with rare-earth elements and di(2-ethylhexyl)phosphoric acid, obtained both in the presence and absence of local vibrations, are described. It was established that materials obtained in the presence of local vibrations in the interfacial layer have higher density, melting point, and magnetic susceptibility and lower electric conductivity. The effect of force field parameters on the properties of interfacial formations is considered. Practical applications and prospects for research in the field of interfacial formations are discussed.

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18

Sadtchenko, V., and G. E. Ewing. "A new approach to the study of interfacial melting of ice: infrared spectroscopy." Canadian Journal of Physics 81, no. 1-2 (January 1, 2003): 333–41. http://dx.doi.org/10.1139/p03-009.

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Faraday observed in 1850 "that a particle of water which could retain the liquid state whilst touching ice on only one side, could not retain the liquid if it were touched by ice on both" (M. Faraday, Royal Institution Discourse, June 7, 1850; Experimental Researches in Chemistry and Physics (Taylor and Francis, New York, 1991)). Thus began the concept of interfacial melting, and the presence of a liquid water film on the surface of ice at temperatures of 0°C and below. Over the past few decades, there have been a number of measurements of interfacial melting. In some studies, the thickness of the thin film, variously called the quasi-liquid layer (QLL), liquid-like layer, surface melting layer, or premelting layer, has been determined. The results of these measurements demonstrate a striking variation depending on the experimental method and the nature of the ice samples. For example, at 0.1°C, the thickness values range over two orders of magnitude from around 1 to 100 nm. Although the disagreement can be partially explained by the differences in ice samples, the experimental techniques employed in measurements of the QLL thickness are based on different physical principals, and involve a web of assumptions for their deconvolution. We describe here the technique of infrared attenuated total reflection (ATR) spectroscopy that has been directed to the study of interfacial melting of ice for the first time. PACS No.: 83.50Lh

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19

Masson, D. Bruce, and Mohammad M. Taghiei. "Interfacial Reactions between Aluminum Alloys and Salt Flux during Melting." Materials Transactions, JIM 30, no. 6 (1989): 411–22. http://dx.doi.org/10.2320/matertrans1989.30.411.

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20

Basu, J. K., M. K. Sanyal, S. Banerjee, and M. Mukherjee. "Role of interfacial correlation in melting of Langmuir–Blodgett films." Physica B: Condensed Matter 283, no. 1-3 (June 2000): 6–11. http://dx.doi.org/10.1016/s0921-4526(99)01881-5.

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21

Schwartz, Andrew J., and Gerald H. Pollack. "Ice-Melting Dynamics: The Role of Protons and Interfacial Geometry." Langmuir 33, no. 22 (May 25, 2017): 5585–91. http://dx.doi.org/10.1021/acs.langmuir.7b00317.

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22

Eastman, Timothy, and Da-Ming Zhu. "Influence of an AFM Tip on Interfacial Melting on Ice." Journal of Colloid and Interface Science 172, no. 2 (June 1995): 297–301. http://dx.doi.org/10.1006/jcis.1995.1255.

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23

Wang, Yan, and Pawel Keblinski. "Effect of interfacial interactions and nanoscale confinement on octane melting." Journal of Applied Physics 111, no. 6 (March 15, 2012): 064321. http://dx.doi.org/10.1063/1.3698497.

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24

Turnbull, D., J. S. C. Jang, and C. C. Koch. "Model for melting enthalpy of Sn in Ge–Sn composites." Journal of Materials Research 5, no. 8 (August 1990): 1731–32. http://dx.doi.org/10.1557/jmr.1990.1731.

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The finding of Jang and Koch that the melting enthalpy/mass, ΔHm, of a Sn matrix containing a fine dispersion of Ge particles sharply decreases with increasing Ge volume fraction, νGe, >0.5 and vanishes at νGe = ν°Ge ≍ 0.81, is accounted for by supposing that the Sn is distributed between an interfacial and bulk state. The interfacial statc is one in which the Sn is assumed to be in a disordered, possibly amorphous, structure coating the Ge particles uniformly to a constant thickness, δ. The remaining “bulk” Sn is assumed to exhibit the normal enthalpy of fusion, ΔH°m. The model accounts for the dependence of ΔHm on νGe within the experimental uncertainty. With the average width of Ge particles −10 nm, δ is estimated to be −0.23 nm; i.e., of the order of the thickness of one Sn monolayer.

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Wang, Yuan, Xiu Chen Zhao, Ying Liu, Jing Wei Cheng, Hong Li, and Xiao Chen Xie. "Effect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder." Materials Science Forum 815 (March 2015): 109–14. http://dx.doi.org/10.4028/www.scientific.net/msf.815.109.

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The research on a new low-Ag lead-free solder has become a hot spot in the field of electronic packaging. In this work, the effects of Bi addition on microstructure, melting temperature, wettability of low-Ag solder, shear strength of solder joint and the growth of interfacial intermetallic compound (IMC) before and after thermal cycling were investigated. A moderate amount of Bi element resulted in the microstructural refinement and melting temperature reduction of Sn-0.2Ag-0.7Cu solder. Wetting test results showed that a small amount of Bi produced the significant effect on improving the wettability. In addition, it is shown that the thickness of interfacial IMC during thermal cycling decreased first and then increased; the shear strength of solder joint increased with the increase of Bi.

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Kwon, Young Soon, Pyuck Pa Choi, Ji Soon Kim, Dae Hwan Kwon, and K. B. Gerasimov. "Investigation of the Particle Size Effect on the Peritectic Melting of FeSn₂ Particles in FeSn₂-FeSn Nanocomposites." Solid State Phenomena 118 (December 2006): 651–54. http://dx.doi.org/10.4028/www.scientific.net/ssp.118.651.

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The particle size effect on the peritectic melting of FeSn2 particles in FeSn-FeSn2 nanocomposites was studied using differential scanning calorimetry and X-ray diffraction. FeSn-10 wt.% FeSn2 compounds, mechanically milled for 30 min and slowly heated in a differential scanning calorimeter, showed incongruent melting at 680 K. Although FeSn2 grains grew from 10 to 40 nm upon heating before peritectic melting set in, the melting temperature was more than 100 K lower than the equilibrium value. A small latent heat during peritectic melting and a large amount of interfacial energy of FeSn-FeSn2 nanocomposites are held responsible for this large particle size effect. Grain growth is hardly possible in the case of rapid local heating during mechanical milling. Therefore, a decrease in the peritectic melting temperature is even expected to be substantially larger.

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Zhao, Meng, Liang Zhang, Lei Sun, Ming-yue Xiong, Nan Jiang, and Kai-kai Xu. "Effects of nanoparticles on properties and interface reaction of Sn solder for microelectronic packaging." International Journal of Modern Physics B 34, no. 08 (March 24, 2020): 2050064. http://dx.doi.org/10.1142/s0217979220500642.

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In this study, the effects of Cu nanoparticles on the melting characteristics, wettability, interfacial reaction and mechanical properties of [Formula: see text]–[Formula: see text] [Formula: see text], [Formula: see text], [Formula: see text], [Formula: see text], [Formula: see text], [Formula: see text] composite solders were investigated. Results show that the properties of the composite solder containing Cu nanoparticles were improved effectively. With the addition of Cu nanoparticles, the melting point of [Formula: see text]–[Formula: see text] solder decreased significantly, and the spreading area and the shear strength were increased by 10.3% and 23.2%, respectively. For the performance, the optimal addition of Cu nanoparticles was 0.7%. In addition, the growth of interfacial intermetallic compounds in [Formula: see text]–[Formula: see text] solder joints was inhibited by adding Cu nanoparticles.

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28

Zhao, Zhanyong, Shijie Chang, Jie Wang, Peikang Bai, Wenbo Du, and Wenjie Zhao. "First-Principles Study on Graphene/Mg2Si Interface of Selective Laser Melting Graphene/Aluminum Matrix Composites." Metals 11, no. 6 (June 10, 2021): 941. http://dx.doi.org/10.3390/met11060941.

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The bonding strength of a Gr/Mg2Si interface was calculated by first principles. Graphene can form a stable, completely coherent interface with Mg2Si. When the (0001) Gr/(001) Mg2Si crystal plane is combined, the mismatch degree is 5.394%, which conforms to the two-dimensional lattice mismatch theory. At the interface between Gr/Mg2Si, chemical bonds were not formed, there was only a strong van der Waals force; the interfaces composed of three low index surfaces (001), (011) and (111) of Mg2Si and Gr (0001) have smaller interfacial adhesion work and larger interfacial energy, the interfacial energy of Gr/Mg2Si is much larger than that of α-Al/Al melt and Gr/Al interfacial (0.15 J/m2, 0.16 J/m2), and the interface distance of a stable interface is larger than the bond length of a chemical bond. The interface charge density difference diagram and density of states curve show that there is only strong van der Waals force in a Gr/Mg2Si interface. Therefore, when the Gr/AlSi10Mg composite is stressed and deformed, the Gr/Mg2Si interface in the composite is easy to separate and become the crack propagation source. The Gr/Mg2Si interface should be avoided in the preparation of Gr/AlSi10Mg composite.

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Zhao, Wenjie, Zhanyong Zhao, Peikang Bai, Lizheng Zhang, Bing Han, and Wenbo Du. "The Interfacial Characteristics of Graphene/Al4C3 in Graphene/AlSi10Mg Composites Prepared by Selective Laser Melting: First Principles and Experimental Results." Materials 13, no. 3 (February 4, 2020): 702. http://dx.doi.org/10.3390/ma13030702.

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The Al4C3 phase was precipitated via a reaction of graphene (Gr) with Al during selective laser melting (SLM). The interfacial nature of the Gr (0001)/Al4C3 (0001) interface was determined using the first-principle calculation. The simulation results showed that the influence of the stacking site on the interfacial structure was limited and the Al-termination interface presented a more stable structure than the C-termination interface. The Al-termination-CH site interface had the largest work of adhesion (6.28 J/m2) and the smallest interfacial distance (2.02 Å) among the four interfacial structures. Mulliken bond population analysis showed that the bonding of the Al-termination interface was a mixture of covalent and ionic bonds and there was no chemical bonding in the C-termination interface.

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Ellis, J. D., P. Grieveson, and D. R. F. West. "Inclusion/Metal Interfacial Effects in Electron Beam Button Melting of Superalloys." Materials Science Forum 189-190 (July 1995): 423–28. http://dx.doi.org/10.4028/www.scientific.net/msf.189-190.423.

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Digilov, Rafael M. "Solid–liquid interfacial tension in metals: correlation with the melting point." Physica B: Condensed Matter 352, no. 1-4 (October 2004): 53–60. http://dx.doi.org/10.1016/j.physb.2004.06.054.

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Wang, Ying, Monica D. Chahal, J. J. Wang, A. B. Limanov, A. M. Chitu, and James S. Im. "Analysis of Si-SiO2 Interfacial-Energy Hierarchy via Mixed-Phase Solidification of Si Films on SiO2." MRS Proceedings 1770 (2015): 55–60. http://dx.doi.org/10.1557/opl.2015.823.

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ABSTRACTWe have experimentally investigated the anisotropy of Si-SiO2 interfacial energy by leveraging the mixed-phase solidification (MPS) method. By examining the microstructure evolution resulting from partial-melting-and-solidification cycles, and interpreting the changes in the surface-orientation distribution of the grains in terms of the thermodynamic model, we have identified the orientation-dependent hierarchical order of Si-SiO2 interfacial energies, σ{hkl}, as: σ{100} < σ{310} < σ{113} < σ{112} < σ{221} < σ{210}∼σ{331} < σ{111}, σ{110}.

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Jang, J. S. C., and C. C. Koch. "Melting and possible amorphization of Sn and Pb in Ge/Sn and Ge/Pb mechanically milled powders." Journal of Materials Research 5, no. 2 (February 1990): 325–33. http://dx.doi.org/10.1557/jmr.1990.0325.

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Mixtures of Ge–Sn and Ge–Pb powders were ball-milled to form a fine dispersion. After 32 h of milling the average diameter of the hard Ge particles embedded in the Sn (or Pb) matrix was about 10 nm. As the Ge concentration was increased in each system, the melting point, TM, and the enthalpy of fusion, ΔHM, of Sn (or Pb) decreased. Only small changes in ΔTM and ΔHM were observed after heating cycles in the DSC to above the melting point. The melting endotherm measured by DSC disappeared for Ge-rich compositions (88 and 95 vol.% Ge for Ge–Sn; 93.5 vol.% Ge for Ge–Pb). It is suggested that atomic disorder/melting is nucleated at the Ge/Sn (or Ge/Pb) interfaces and the melting point and enthalpy of fusion decrease as the interfacial area increases. When the Ge volume reaches a value where essentially all the Sn (or Pb) atoms are adjacent to the Ge particle surfaces, the Sn is in a disordered–perhaps amorphous–state such that no melting transition is observed.

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Wang, Chao-Hong, Chen-Nan Chiu, and Sinn-Wen Chen. "Investigations on interfacial reactions at reentrant corners." Journal of Materials Research 25, no. 5 (May 2010): 999–1003. http://dx.doi.org/10.1557/jmr.2010.0121.

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Interfacial reactions in Bi/Ni, Sn/Co, and Sn/Te systems that exhibit unique cruciform pattern formation are investigated. Different from the couples examined in the past, the solid substrates, Ni, Co, and Te, are placed outside the couples while constituents of low melting temperature, Bi and Sn, are placed in the center. With interfacial reactions proceeding in these couples, the reaction products grow inwardly at reentrant corners, and shrinking of the reaction layer at the corner is observed. As a result of the volumetric changes caused by interfacial reactions, stresses are built up in the couples, and stress-intensified locations are found at reentrant corners. The built-up stresses alter the diffusion rates and thus retard the reaction at the corners. Instead of forming cruciform patterns, the inner reactant is of flat shuriken shape after reactions.

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Allem, R., F. Lavallée, G. L'Espérance, R. Schulz, and M. L. Trudeau. "Interfacial reactions between Y1Ba2Cu3O7−x and Ag–Pd alloys during high temperature heat treatments." Journal of Materials Research 7, no. 11 (November 1992): 2936–41. http://dx.doi.org/10.1557/jmr.1992.2936.

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The interfacial reactions between the Y1Ba2Cu3O7−x (123) compound and a Ag70Pd30 alloy have been studied for several heat treatments below and above the melting point of the superconductor. Scanning and transmission electron microscopy, energy dispersive x-ray analysis, Auger spectroscopy, and x-ray diffraction have been used to characterize the reaction products. For the heat treatments below the melting point of the superconductor (950 °C), the Ba and Cu of the 123 compound migrate to the interface and react with the Pd to form a body-centered cubic phase Ba(Pd, Cu)O2. This structure is formed by substitution of Cu by Pd on the Cu+2 sites of the BaCuO2 structure (Im3m space group). CuO is also found in some areas as a product of the reaction. For the thermal treatments above the melting point of the superconductor, the reaction products are the same but, in this case, a large number of Y2BaCuO5 precipitates are found in the bulk of the superconductor near the interface. Pure Ag particles have also been observed in the 123 compound at distances relatively far from the interface.

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36

Guttman, Shani, Zvi Sapir, Moty Schultz, Alexander V. Butenko, Benjamin M. Ocko, Moshe Deutsch, and Eli Sloutskin. "How faceted liquid droplets grow tails." Proceedings of the National Academy of Sciences 113, no. 3 (January 5, 2016): 493–96. http://dx.doi.org/10.1073/pnas.1515614113.

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Liquid droplets, widely encountered in everyday life, have no flat facets. Here we show that water-dispersed oil droplets can be reversibly temperature-tuned to icosahedral and other faceted shapes, hitherto unreported for liquid droplets. These shape changes are shown to originate in the interplay between interfacial tension and the elasticity of the droplet’s 2-nm-thick interfacial monolayer, which crystallizes at some T = Ts above the oil’s melting point, with the droplet’s bulk remaining liquid. Strikingly, at still-lower temperatures, this interfacial freezing (IF) effect also causes droplets to deform, split, and grow tails. Our findings provide deep insights into molecular-scale elasticity and allow formation of emulsions of tunable stability for directed self-assembly of complex-shaped particles and other future technologies.

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37

Chen, Qicheng, Mo Yang, Yuwen Zhang, and Ya-Ling He. "Numerical Simulation of Melting in Porous Media via an Interfacial Tracking Model." Journal of Thermophysics and Heat Transfer 25, no. 3 (July 2011): 401–7. http://dx.doi.org/10.2514/1.t3693.

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38

Wen, Jianguo, Yulin Lin, Xiao-Min Lin, and Aiwen Lei. "Low Dose HRTEM of Interfacial Melting of Cubic Ice at Low Temperature." Microscopy and Microanalysis 26, S2 (July 30, 2020): 2870–72. http://dx.doi.org/10.1017/s1431927620023053.

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39

Grimaldi, M. G., F. Priolo, P. Baeri, E. Rimini, A. G. Cullis, and N. G. Chew. "Evidence of interfacial melting during pulsed laser irradiation of Ni2Si on Si." Applied Physics Letters 51, no. 9 (August 31, 1987): 649–51. http://dx.doi.org/10.1063/1.98344.

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40

Hamid, S. M., and D. C. Sherrington. "Novel quaternary ammonium amphiphilic (meth)acrylates: 1. Synthesis, melting and interfacial behaviour." Polymer 28, no. 2 (February 1987): 325–31. http://dx.doi.org/10.1016/0032-3861(87)90426-5.

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41

Wang, Li Li, Jia Rong Li, Ding Zhong Tang, Guo Hong Gu, Xin Li, Jian Sheng Yao, Hong Na Fan, and Shu Xin Niu. "Effect of Directional Solidification Condition on Interfacial Reaction between DD6 Single Crystal Superalloy and Zirconia-Silica Ceramic Core." Advanced Materials Research 926-930 (May 2014): 72–76. http://dx.doi.org/10.4028/www.scientific.net/amr.926-930.72.

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The characterization of the interfaces between DD6 single crystal superalloy and zirconia-silica (ZrO2-SiO2) ceramic cores was performed by optical microscope (OM), SEM and EDS analysis in order to study the influence of directional solidification condition on the interfacial reaction. The results showed that there were chemical reactions on interfaces between DD6 melt and ZrO2-SiO2ceramic cores and the main reaction product was Al2O3. The interfacial reaction involved a complex, interdependent system including the oxidation of Al element, the destabilization of calcia stabilization zirconia (CSZ) and the formation of liquid phase with low melting point. The intensity of interfacial reaction increased with the increase of pouring temperature and solidification time, but the number and size of reaction zones could not increase together because of the limited Al content in DD6 alloy.

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42

Guo, Jian Bing, Kai Zhou Zhang, Bin Xue, and Shu Hao Qin. "Preparation and Properties of the Glass Fiber Reinforced PP Composites." Advanced Materials Research 557-559 (July 2012): 209–14. http://dx.doi.org/10.4028/www.scientific.net/amr.557-559.209.

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The effects of polypropylene grafted with maleic anhydride (PP-g-MA) and unsturated polyester (UP) on the interfacial interaction of PP/GF composites were investigated by means of scanning electron microscopy (SEM), differential scanning calorimetry (DSC), and mechanical properties. The experimental results demonstrate that PP-g-MA and UP could effectively improve interfacial interaction between the PP and GF. Based on SEM, good interfacial adhesion between PP and GF in PP/UP/GF and PP/ PP-g-MA /GF composites was observed. DSC results showed that the existense of PP-g-MA or UP caused t crystallization temperature and melting temperature shift to high temperature. All results in this paper were consistent, and showed the good interaction between PP and GF, which were proved by the mechanical properties of the composites.

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43

Zhang, Kai Zhou, Qiang Guo, Jian Bing Guo, and Dao Hai Zhang. "Effects of PP-G-MA and Epoxy Resin on Morphology and Mechanical Properties of the PP/LGF Composites." Advanced Materials Research 652-654 (January 2013): 110–15. http://dx.doi.org/10.4028/www.scientific.net/amr.652-654.110.

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The effects of polypropylene grafted with maleic anhydride (PP-g-MA) and epoxy resin (ER) on the interfacial interaction of the long glass fiber reinforced PP composites were investigated by means of scanning electron microscopy (SEM), differential scanning calorimetry (DSC), and mechanical properties. The experimental results demonstrate that PP-g-MA and ER could effectively improve interfacial interaction between the PP and LGF. Based on SEM, good interfacial adhesion between PP and LGF in PP/ PP-g-MA/ER/LGF composite was observed. DSC results showed that the existense of PP-g-MA or ER caused crystallization temperature shift to low temperature, and melting temperature shift to high temperature. All results in this paper were consistent, and showed the good interaction between PP and LGF, which were proved by the mechanical properties of the composites.

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44

Hui, S. W., M. Cheng, J. T. Ho, and R. Pindak. "Dimensionality of hexatic melting in liquid crystals by in situ electron diffraction." Proceedings, annual meeting, Electron Microscopy Society of America 50, no. 1 (August 1992): 270–71. http://dx.doi.org/10.1017/s0424820100121752.

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The theory of melting in two dimensions indicates that it is very different from the melting in three dimensions. An intermediate hexatic phase, with long range orientational but short range translational order, is proposed to exist between two dimensional solid and fluid phases. Because the long range order is limited experimentally by the domain or “grain” size, which is expected to be of sub-millimeter size, selected area electron diffraction is the method of choice for observing orientational order. Free-standing smectic liquid crystal films prove to be a most attractive system in which to verify this theory. However, multilayered liquid crystal samples are not strictly two dimensional systems because of interlayer interaction, their melting characteristics are expected to deviate from that of two dimensional systems. Furthermore, the outer layers may behave differently from the inner ones due to interfacial tension. We have applied low dose electron diffraction to study the effect of dimensionality, or number of layers, on the melting of multilayer organic liquid crystals.

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Zhao, Kuai Le, Yan Fu Yan, Yang Yang Sheng, Ning Du, and Zhan Lei Liu. "Interfacial Reaction and Solderability of Zn20SnxCu Solder." Advanced Materials Research 337 (September 2011): 402–5. http://dx.doi.org/10.4028/www.scientific.net/amr.337.402.

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Zn20Sn solder with the melting point of 383.9°C and a low cost is considered as an ideal high-temperature lead-free solder. In the paper a new solder alloys were made by adding trace Cu into Zn20Sn alloy through alloying principle. Interfacial reaction and solderability of Zn20SnxCu (x=0 wt.%, 2 wt.%, 4 wt.% and 6 wt.%) solder on the copper substrate were investigated. Results showed that β’-CuZn, γ-Cu5Zn8 and ε-CuZn5 IMC layers were formed at the interface of Zn20SnxCu/Cu. The spreading areas of the Zn20SnxCu solders were reduced linearly with the increasing of the content of copper. The spreading aera of Zn20Sn solder was 52.88 mm2 while that of Zn20Sn6Cu was 50.82mm2 which was approximately 3.9% smaller than that of matrix solder. It is mainly related to the formation of ε-CuZn5 phase and the metal intermetallic compound between the solder and the substrate.

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Peng, Yan Zhi, Cai Ju Li, Jiao Jiao Yang, Jia Tao Zhang, Ju Bo Peng, Guang Ji Zhou, Cun Ji Pu, and Jian Hong Yi. "Effects of Bismuth on the Microstructure, Properties, and Interfacial Reaction Layers of Sn-9Zn-xBi Solders." Metals 11, no. 4 (March 26, 2021): 538. http://dx.doi.org/10.3390/met11040538.

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In electronic packaging, Sn-Zn lead-free solder has great application prospects. Sn-9Zn-xBi alloys were obtained by smelting. This paper details a systematic study of the effect of Bi on the microstructure, melting behavior, wettability, mechanical behavior, antioxidant properties, and electrical conductivity of Sn-9Zn-xBi alloy, as well as the interfacial reaction in Sn-9Zn-xBi/Cu joints. The coarse Zn-rich phase became larger with an increase in the addition of Bi, which is harmful to the oxidation resistance of the solders. The melting temperature, solidus temperature, and liquidus temperature decreased with the increase in the addition of Bi, but the melting range increased. Adding a proper amount of Bi could substantially improve the spreading rate of Sn-9Zn, but reduce its oxidation resistance. Because of the solid solution effect of Bi element, the tensile strength of the Sn-9Zn solders could be enhanced, but the plastic and electrical conductivity was decreased. The IMC layer of the Sn-9Zn and Cu joints consisted of the ε-CuZn5 phase and the γ-Cu5Zn8 phase. With an increase in the Bi element, the thickness of the interfacial reaction layer was firstly increased. When the Bi element content exceeded 3 wt.%, the inhibitory effect of the aggregated Bi elements on the formation of IMC was greater than the positive effect of the longer reaction time, and the thickness of the IMC decreased.

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Murata, Ken-ichiro, Harutoshi Asakawa, Ken Nagashima, Yoshinori Furukawa, and Gen Sazaki. "Thermodynamic origin of surface melting on ice crystals." Proceedings of the National Academy of Sciences 113, no. 44 (October 17, 2016): E6741—E6748. http://dx.doi.org/10.1073/pnas.1608888113.

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Since the pioneering prediction of surface melting by Michael Faraday, it has been widely accepted that thin water layers, called quasi-liquid layers (QLLs), homogeneously and completely wet ice surfaces. Contrary to this conventional wisdom, here we both theoretically and experimentally demonstrate that QLLs have more than two wetting states and that there is a first-order wetting transition between them. Furthermore, we find that QLLs are born not only under supersaturated conditions, as recently reported, but also at undersaturation, but QLLs are absent at equilibrium. This means that QLLs are a metastable transient state formed through vapor growth and sublimation of ice, casting a serious doubt on the conventional understanding presupposing the spontaneous formation of QLLs in ice–vapor equilibrium. We propose a simple but general physical model that consistently explains these aspects of surface melting and QLLs. Our model shows that a unique interfacial potential solely controls both the wetting and thermodynamic behavior of QLLs.

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Maheshwari, P., D. Dutta, S. K. Sharma, K. Sudarshan, P. K. Pujari, M. Majumder, B. Pahari, B. Bandyopadhyay, K. Ghoshray, and A. Ghoshray. "Effect of Interfacial Hydrogen Bonding on the Freezing/Melting Behavior of Nanoconfined Liquids." Journal of Physical Chemistry C 114, no. 11 (March 2010): 4966–72. http://dx.doi.org/10.1021/jp911684m.

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Chen, Chih-Hao, Boon-Ho Lee, Hsiang-Chua Chen, Chang-Meng Wang, and Albert T. Wu. "Interfacial Reactions of Low-Melting Sn-Bi-Ga Solder Alloy on Cu Substrate." Journal of Electronic Materials 45, no. 1 (October 28, 2015): 197–202. http://dx.doi.org/10.1007/s11664-015-4142-5.

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50

Wang, Yuhai, Hao Shen, Gu Li, and Kancheng Mai. "Crystallization and melting behavior of PP/nano-CaCO3 composites with different interfacial interaction." Journal of Thermal Analysis and Calorimetry 99, no. 2 (August 13, 2009): 399–407. http://dx.doi.org/10.1007/s10973-009-0130-4.

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Journal articles on the topic 'Interfacial melting'

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