Relevant bibliographies by topics / INTERFACE TEMPERATURE

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  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'INTERFACE TEMPERATURE'

Author: Grafiati
Published: 11 September 2023

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Journal articles on the topic "INTERFACE TEMPERATURE"

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Di Donna, Alice, Alessio Ferrari, and Lyesse Laloui. "Experimental investigations of the soil–concrete interface: physical mechanisms, cyclic mobilization, and behaviour at different temperatures." Canadian Geotechnical Journal 53, no. 4 (April 2016): 659–72. http://dx.doi.org/10.1139/cgj-2015-0294.

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Behaviour of the pile–soil interface is important to correctly predict the response of floating piles in terms of displacement and lateral friction. Regarding energy piles, which couple the structural roles of deep foundations with the principle of shallow geothermal energy, the response of pile–soil interfaces is influenced by seasonal and daily cyclic thermal variations. Accordingly, the goal of this paper is to experimentally investigate the response of the pile–soil interface at different temperatures. This experimental campaign aims to analyse (i) the cyclic mobilization of the shear strength of the soil–pile interface that is induced by thermal deformation of the pile and (ii) the direct influence of temperature variations on the soil and soil–pile interface behaviour. In this study, a direct shear device was developed and calibrated for nonisothermal soil–structure interface testing. It appears that the sand–concrete interface was affected by cyclic degradation but not affected directly by temperature. Conversely, the response of the clay–concrete interface changed at different temperatures, showing an increase of strength with increasing temperature, presumably due to the effects of temperature on clay deformation.
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Motoyama, Munekazu, Masaharu Hirota, and Yasutoshi Iriyama. "(Invited) Temperature Effects on Li Nucleation at Cu/Lipon Interfaces." ECS Meeting Abstracts MA2022-01, no. 23 (July 7, 2022): 1173. http://dx.doi.org/10.1149/ma2022-01231173mtgabs.

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This study reports the effect of temperature on Li nucleation at the Cu/lithium phosphorus oxynitride (LiPON) interface.1 Galvanostatic Li plating is performed on LiPON glass electrolytes at different temperatures ranging from 25 to 100 °C. At any temperature, the negative voltage peak appears, indicating Li nucleation, immediately after starting Li plating. The nucleation overpotential and nucleation number density decrease with increasing temperature. This is because the diffusivity of Li adatoms/ions along the Cu/LiPON interface increases with temperature, resulting in an increase in the amount of Li atoms incorporated into a single Li nucleus. The critical nucleation area also extends with increasing temperature. It is found that the activation energy for the interfacial diffusion of Li adatoms/ions along the Cu/LiPON interface is 51 kJ mol–1 (0.53 eV), which is close to the activation energy for Li+ conduction in LiPON. Reference M. Motoyama, M. Hirota, T. Yamamoto, and Y. Iriyama, ACS Appl. Mater. Interfaces, 12, 38045–38053 (2020). Figure 1
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Shi, Linquan, and Qiang Li. "Numerical simulation and experimental study of contact thermal resistance under high temperature conditions." Thermal Science and Engineering 5, no. 1 (February 27, 2022): 1. http://dx.doi.org/10.24294/tse.v5i1.1523.

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Contact thermal resistance is an important indicator of the efficiency of heat transfer between contact interfaces.The contact thermal resistance between the interfaces of superalloy GH4169 in high temperature was investigated byusing ANSYS. The real surface morphology of superalloy was obtained with optical microscope, and its surface modelwas reconstructed in ANSYS. Based on the theory of structural mechanics, the elastoplastic deformation of the microstructure of the contact interface is simulated, and analyzed and obtained the contact thermal resistance between contactinterfaces. The effect of interface temperature on the radiative heat transfer between the contact interfaces was studied.At the same time, the impact of radiation heat transfer between contact interfaces in high temperature is considered.Finally, it was tested by using an experimental test device. The result show that the maximum deviation between thecontact thermal resistance and the contact thermal resistance was 12.60%, and the contact thermal resistance betweensuperalloy interfaces decreases with the increase of interface temperature and contact pressure; the contact interfacetemperature difference increases first and then decreases with the increase of interface temperature.
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Wang, Lili, Xucun Ma, and Qi-Kun Xue. "Interface high-temperature superconductivity." Superconductor Science and Technology 29, no. 12 (October 11, 2016): 123001. http://dx.doi.org/10.1088/0953-2048/29/12/123001.

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Gozar, A., and I. Bozovic. "High temperature interface superconductivity." Physica C: Superconductivity and its Applications 521-522 (February 2016): 38–49. http://dx.doi.org/10.1016/j.physc.2016.01.003.

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Logvenov, G., A. Gozar, and I. Bozovic. "High Temperature Interface Superconductivity." Journal of Superconductivity and Novel Magnetism 26, no. 9 (April 26, 2013): 2863–65. http://dx.doi.org/10.1007/s10948-013-2215-3.

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Ji, Koochul, Lauren K. Stewart, and Chloe Arson. "Molecular Dynamics Analysis of Silica/PMMA Interface Shear Behavior." Polymers 14, no. 5 (March 4, 2022): 1039. http://dx.doi.org/10.3390/polym14051039.

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The mechanical properties of cementitious materials injected by epoxy have seldom been modeled quantitatively, and the atomic origin of the shear strength of polymer/concrete interfaces is still unknown. To understand the main parameters that affect crack filling and interface strength in mode II, we simulated polymethylmethacrylate (PMMA) injection and PMMA/silica interface shear deformation with Molecular Dynamics (MD). Injection simulation results indicate that the notch filling ratio increases with injection pressure (100 MPa–500 MPa) and temperature (200 K–400 K) and decreases with the chain length (4–16). Interface shear strength increases with the strain rate (1×108 s−1–1×109 s−1). Smooth interfaces have lower shear strengths than polymer alone, and under similar injection conditions, rough interfaces tend to be stronger than smooth ones. The shear strength of rough interfaces increases with the filling ratio and the length of the polymer chains; it is not significantly affected by temperatures under 400 K, but it drops dramatically when the temperature reaches 400 K, which corresponds to the PMMA melting temperature for the range of pressures tested. For the same injection work input, a higher interface shear strength can be achieved with the entanglement of long molecule chains rather than with asperity filling by short molecule chains. Overall, the mechanical work needed to break silica/PMMA interfaces in mode II is mainly contributed by van der Waals forces, but it is noted that interlocking forces play a critical role in interfaces created with long polymer chains, in which less non-bond energy is required to reach failure in comparison to an interface with the same shear strength created with shorter polymer chains. In general, rough interfaces with low filling ratios and long polymer chains perform better than rough interfaces with high filling ratios and short polymer chains, indicating that for the same injection work input, it is more efficient to use polymers with high polymerization.
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Liu, Yuwei, Yameng Ji, Fuhao Ye, Weizheng Zhang, and Shujun Zhou. "Effects of contact pressure and interface temperature on thermal contact resistance between 2Cr12NiMoWV/BH137 and γ-TiAl/2Cr12NiMoWV interfaces." Thermal Science 24, no. 1 Part A (2020): 313–24. http://dx.doi.org/10.2298/tsci191018470l.

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Thermal contact resistance between interfaces is an important parameter in the analysis of temperature distribution for structural components. Thermal contact resistance between heat resistant steel 2Cr12NiMoWV/aluminum alloy BH137 interfaces and 2Cr12NiMoWV/titanium alloy ?-TiAl interfaces were experimentally investigated in the present paper. The effects of contact pressure and interface tem-perature were detailed. The temperature of contacting surfaces was from 80- 250?, and the contact pressure ranged from 2-17 MPa. All experiments were conducted in ambient atmosphere. Results showed that thermal contact resistance decreases with an increment of interface temperature or contact pressure. Under the same conditions of contact pressure and interface temperature, thermal contact resistance between 2Cr12NiMoWV and BH137 interfaces is lower than that between 2Cr12NiMoWV and ?-TiAl interfaces. The temperature dependence of thermal conductivity and mechanical properties was analyzed to explain the results. Furthermore, with the piston and piston pin as the research object, steady state temperature fields were simulated in cases of considering thermal contact resistance and without considering thermal contact resistance, respectively. The results showed that the maximum temperature of the piston pin will be lower when thermal contact resistance is considered.
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Hasan, Md Zahid. "Interface Failure of Heated GLARETM Fiber–Metal Laminates under Bird Strike." Aerospace 7, no. 3 (March 17, 2020): 28. http://dx.doi.org/10.3390/aerospace7030028.

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Many high-strength composite materials have been developed for aircraft structures. GLAss fiber REinforced aluminum (GLARE) is one of the high-performance composites. The review of articles, however, yielded no study on the impact damage of heated GLARE laminates. This study, therefore, aimed at developing a numerical model that can delineate the continuum damage of GLARE 5A-3/2-0.3 laminates at elevated temperatures. In the first stage, the inter-laminar interface failure of heated GLARE laminate had been investigated at room temperature and 80 °C. The numerical analysis employed a three-dimensional GLARE 5A-3/2-0.3 model that accommodated volumetric cohesive interfaces between mating material layers. Lagrangian smoothed particles populated the projectile. The model considered the degradation of tensile and shear modulus of glass fiber reinforced epoxy (GF/EP) at 80 °C, while incorporated temperature-dependent critical strain energy release rate of cohesive interfaces. When coupled with the material particulars, an 82 m/s bird impact at room temperature exhibited delamination first in the GF/EP 90°/0° interface farthest from the impacted side. Keeping the impact velocity, interface failure propagated at a slower rate at 80 °C than that at room temperature, which was in agreement with the impact damage determined in the experiments. The outcomes of this study will help optimize a GLARE laminate based on the anti-icing temperature of aircraft.
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Zhong, Zhi Qin, Lu Da Zheng, Shu Ya Wang, Li Ping Dai, and Guo Jun Zhang. "Morphological and Compositional Changes in the SiO2/SiC Interfacial Layer Induced by Thermal Annealing of Different Temperature." Advanced Materials Research 884-885 (January 2014): 304–7. http://dx.doi.org/10.4028/www.scientific.net/amr.884-885.304.

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The authors have systematically investigated the effects of different annealing temperatures in Ar atmosphere on the SiO2/4H-SiC interfaces by scan electron microscope (SEM) and energy dispersive spectrometer (EDS). Results show that the annealing temperatures are strongly correlated with the morphological and compositional changes of SiO2/4H-SiC interface. Annealing at 600 °C can significantly improve the quality of SiO2/4H-SiC interface. However, the sample annealed at 350 °C and 900 °C displays some particles. The reason for such improvement in the quality of the SiO2/4H-SiC interface after moderate temperature annealing at 600 °C can be explained by the formation and consumption of carbon clusters and silicon oxycarbides during annealing.
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Dissertations / Theses on the topic "INTERFACE TEMPERATURE"

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Karademir, Tanay. "Elevated temperature effects on interface shear behavior." Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/42764.

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Environmental conditions such as temperature inevitably impact the long term performance, strength and deformation characteristics of most materials in infrastructure applications. The mechanical and durability properties of geosynthetic materials are strongly temperature dependent. The interfaces between geotextiles and geomembranes as well as between granular materials such as sands and geomembranes in landfill applications are subject to temperature changes due to seasonal temperature variations as well as exothermic reactions occurring in the waste body. This can be a critical factor governing the stability of modern waste containment lining systems. Historically, most laboratory geosynthetic interface testing has been performed at room temperature. Information today is emerging that shows how temperatures in the liner systems of landfills can be much higher. An extensive research study was undertaken in an effort to investigate temperature effects on interface shear behavior between (a) NPNW polypropylene geotextiles and both smooth PVC as well as smooth and textured HDPE geomembranes and (b) sands of different angularity and smooth PVC and HDPE geomembranes. A temperature controlled chamber was designed and developed to simulate elevated temperature field conditions and shear displacement-failure mechanisms at these higher temperatures. The physical laboratory testing program consisted of multiple series of interface shear tests between material combinations found in landfill applications under a range of normal stress levels from 10 to 400 kPa and at a range of test temperatures from 20 to 50 °C. Complementary geotextile single filament tensile tests were performed at different temperatures using a dynamic thermo-mechanical analyzer (DMA) to evaluate tensile strength properties of geotextile single filaments at elevated temperatures. The single filament studies are important since the interface strength between geotextiles and geomembranes is controlled by the fabric global matrix properties as well as the micro-scale characteristics of the geotextile and how it interacts with the geomembrane macro-topography. The peak interface strength for sand-geomembrane as well as geotextile-geomembrane interfaces depends on the geomembrane properties such as hardness and micro texture. To this end, the surface hardness of smooth HDPE and PVC geomembrane samples was measured at different temperatures in the temperature controlled chamber to evaluate how temperature changes affect the interface shear behavior and strength of geomembranes in combination with granular materials and/or geotextiles. The focus of this portion of the experimental work was to examine: i) the change in geomembrane hardness with temperature; ii) develop empirical relationships to predict shear strength properties of sand - geomembrane interfaces as a function of temperature; and iii) compare the results of empirically predicted frictional shear strength properties with the results of direct measurements from the interface shear tests performed at different elevated temperatures.
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Berber, Feyza. "CMOS temperature sensor utilizing interface-trap charge pumping." Texas A&M University, 2005. http://hdl.handle.net/1969.1/4157.

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The objective of this thesis is to introduce an alternative temperature sensor in CMOS technology with small area, low power consumption, and high resolution that can be easily interfaced. A novel temperature sensor utilizing the interface–trap charge pumping phenomenon and the temperature sensitivity of generation current is proposed. This thesis presents the design and characterization of the proposed temperature sensor fabricated in 0.18µm CMOS technology. The prototype sensor is characterized for the temperature range of 27oC–120oC. It has frequency output and exhibits linear transfer characteristics, high sensitivity, and high resolution. This temperature sensor is proposed for microprocessor thermal management applications.
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MOISELLO, ELISABETTA. "Integrated Interface Circuits for MEMS Contact-less Temperature Sensors." Doctoral thesis, Università degli studi di Pavia, 2020. http://hdl.handle.net/11571/1370177.

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Thermal sensors, exploiting the relation between the thermal radiation emitted by an object and its temperature, as expressed by the Stefan-Boltzmann law, allow realizing contact-less temperature measurements, required in a wide range of applications, ranging from fever measurements to presence detection for security and climate control systems. With the advent of smart homes and Internet of Things (IoT) and the wide spreading of mobile and wearable devices, the need for low-cost low-power thermal sensors has arisen, therefore moving the focus of the research away from standard bolometers and pyroelectric detectors and towards uncooled infrared (IR) sensors solutions that can be easily integrated. Bolometers and pyroelectric detectors, which are the main types of thermal sensors found nowadays on the market, in fact, do not comply with the low-cost and easy integration specifications. Integration of thermal sensors is possible through Micro-Electro Mechanical Systems (MEMS) technology, which allows combining on the same substrate or chip both electrical and mechanical structures with dimensions in the micro-meter range, thus providing structures with high thermal isolation and low thermal mass. The micromachining processes that are required to thermally isolate the sensing element from the substrate are versatile and include anisotropic wet etching, dry and wet etching, electrochemical etch stop, or the use of silicon-on-insulator (SOI). In this scenario, STMicroelectronics has fabricated two different novel thermal sensors, which fulfill the low-cost low-power specifications for smart homes, IoT and mobile and wearable devices, while also being compatible with CMOS processes and thus easily integrated: a polysilicon thermopile and a micromachined CMOS transistor, from now on referred to as TMOS. During my Ph.D. activity I was involved in a cooperation between the STMicroelectronics Analog MEMS and Sensors R&D group and the University of Pavia, that led to the design of two readout circuits specifically tailored on the sensors characteristics, one for the thermopile sensor and one for the TMOS (developed by the Technion-Israel Institute of Technology), which were integrated in two test-chip prototypes and thoroughly characterized through measurements as stand-alone devices and as a system with the sensor they were designed for.
Thermal sensors, exploiting the relation between the thermal radiation emitted by an object and its temperature, as expressed by the Stefan-Boltzmann law, allow realizing contact-less temperature measurements, required in a wide range of applications, ranging from fever measurements to presence detection for security and climate control systems. With the advent of smart homes and Internet of Things (IoT) and the wide spreading of mobile and wearable devices, the need for low-cost low-power thermal sensors has arisen, therefore moving the focus of the research away from standard bolometers and pyroelectric detectors and towards uncooled infrared (IR) sensors solutions that can be easily integrated. Bolometers and pyroelectric detectors, which are the main types of thermal sensors found nowadays on the market, in fact, do not comply with the low-cost and easy integration specifications. Integration of thermal sensors is possible through Micro-Electro Mechanical Systems (MEMS) technology, which allows combining on the same substrate or chip both electrical and mechanical structures with dimensions in the micro-meter range, thus providing structures with high thermal isolation and low thermal mass. The micromachining processes that are required to thermally isolate the sensing element from the substrate are versatile and include anisotropic wet etching, dry and wet etching, electrochemical etch stop, or the use of silicon-on-insulator (SOI). In this scenario, STMicroelectronics has fabricated two different novel thermal sensors, which fulfill the low-cost low-power specifications for smart homes, IoT and mobile and wearable devices, while also being compatible with CMOS processes and thus easily integrated: a polysilicon thermopile and a micromachined CMOS transistor, from now on referred to as TMOS. During my Ph.D. activity I was involved in a cooperation between the STMicroelectronics Analog MEMS and Sensors R&D group and the University of Pavia, that led to the design of two readout circuits specifically tailored on the sensors characteristics, one for the thermopile sensor and one for the TMOS (developed by the Technion-Israel Institute of Technology), which were integrated in two test-chip prototypes and thoroughly characterized through measurements as stand-alone devices and as a system with the sensor they were designed for.
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Ella, Samantha. "Rubber snow interface and friction." Thesis, University of Edinburgh, 2014. http://hdl.handle.net/1842/17941.

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Tyres are used in everyday life for a variety of practical and recreational tasks. Frictional behaviour of tyres on any surface is important for vehicle safety and control; this behaviour becomes more important when that surface is snow. The interaction of rubber and a snow surface is complex and a deeper understanding of both is needed in order to help develop better tyres. Outdoor full scale tyre test results were compared to results from indoor laboratory tests using a linear tribometer and a surface of compacted artificial snow; these were in excellent correlation allowing a systematic and comprehensive study of rubber friction on snow to be conducted in the laboratory. Rubber samples of varied rubber compositions and geometries were used to gain an understanding of friction on snow. Samples with varying glass transition temperature (Tg), dynamic rigidity (G*) and Payne effect (dependence of the dynamic moduli on the amplitude of the applied strain) were investigated along with samples with and without sipes. The rubber friction coefficient (μ) was measured as a function of velocity and temperature. The siped samples exhibited a higher μ than those without sipes. FE simulations, rubber friction tests for varying contact pressures and steel blade force tests were performed to evaluate contributions from ‘surface’ friction and ploughing separately. The increased μ was attributed to the ploughing force from the front edges of the ‘subblocks’ created by the sipes. Although it is well known in the industry that siped tyres grip well, this is the first time it has been explained how sipes grip effectively through a combination of ploughing and rubber snow interaction. A comprehensive study of varying rubber properties (Tg, G* and Payne effect) was conducted to better understand their impact on snow friction. The findings were evaluated using the WLF shift factor to account for the running frequency of the rubber from the snow surface roughness. G* was found to be the dominant parameter for rubber μ when considering running frequency. Increased μ values were exhibited by rubbers with a lower G*. The decreased G* makes the rubber more compliant, thus increasing the contact area between the rubber and the snow, in turn increasing μ. A better knowledge of the surface roughness of snow will aid the understanding of the interaction between rubber and snow for tyres. A method was developed to characterise the artificial snow surface utilising sectioning and imaging of chemically stabilised snow samples. From images of the snow surface before friction testing the average indentor size can be found, this is used to analyse the running frequency of the rubber. Qualitatively comparing the surfaces before and after rubber friction testing shows a decrease in surface profile aggressivity after a test; this is attributed to melting of the snow from frictional heating and snow grain fracture. Friction tests were conducted to directly compare rubber friction on snow and ice using round edged samples. Again it was found that the rubber with the decreased G* exhibited higher friction; this was seen on both snow and ice confirming G* as the dominant rubber property for both surfaces, regardless of the surface roughness change. It was found that at low temperatures ice had a higher μ than snow, while at high temperatures snow exhibited a higher μ than ice. It is hypothesised that this intriguing switch is due to the surface roughness change leading to differing contact areas both with and without melt water. This switch is not seen when a simple heat transfer model is used, confirming the effect as a surface roughness change. The use of a modified Hertz model shows that indentation is the dominant mechanism at low velocities on snow. It is hypothesised that at high velocities melt water dominates on both snow and ice while adhesion may have a more significant role on ice at low velocities. These findings provide knowledge that can be used in the design of tyres for snow and ice in the future.
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Amoah-Kusi, Christian. "Constant Interface Temperature Reliability Assessment Method: An Alternative Method for Testing Thermal Interface Material in Products." PDXScholar, 2015. https://pdxscholar.library.pdx.edu/open_access_etds/2295.

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As electronic packages and their thermal solutions become more complex the reliability margins in the thermal solutions diminish and become less tolerant to errors in reliability predictions. The current method of thermally stress testing thermal solutions can be over or under predicting end of life thermal performance. Benefits of accurate testing and modeling are improved silicon yield in manufacturing, improved performance, lower cost thermal solutions, and shortened test times. The current method of thermally stress testing is to place the entire unit in an elevated isothermal temperature and periodically measure thermal performance. Isothermally aging is not an accurate representation of how the unit will be used by the customer and does not capture the thermal gradients and mechanical stresses due to different coefficients of thermal expansion of the materials used in the thermal solution. A new testing system, CITRAM which is an acronym for Constant Interface Temperature Reliability Method, has been developed that uses an electronic test board. The approach captures the thermal and mechanical stresses accurately and improves test time by 20-30% as a result of automation. Through this study a difference in the two methods has been identified and the new CITRAM method should be adopted as current practice.
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Le, Poul Nicolas. "Charge transfer at the high-temperature superconductor/liquid electrolyte interface." Thesis, University of Exeter, 2001. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.391279.

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Narayanaswamy, Anand Subramanian. "A Non-Contact Sensor Interface for High-Temperature, MEMS Capacitive Sensors." Case Western Reserve University School of Graduate Studies / OhioLINK, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=case1275675071.

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Solak, Nuri. "Interface stability in solid oxide fuel cells for intermediate temperature applications." [S.l. : s.n.], 2007. http://nbn-resolving.de/urn:nbn:de:bsz:93-opus-31048.

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MOURA, VICTOR NOCRATO. "Ginzbutrg-Landau theory with hidden order parameter applied to interface superconductivity." Universidade Federal do CearÃ, 2017. http://www.teses.ufc.br/tde_busca/arquivo.php?codArquivo=19046.

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Conselho Nacional de Desenvolvimento CientÃfico e TecnolÃgico
In recent years, several experiments have been reported in which interface superconductivity was observed in heterostructures of different materials, inclunding non-superconductors. The origin of this superconductivity has not yet been elucidated and there is no well-established theory to explain this phenomenon. In 2015 a model based on the Ginzburg-Landau theory was proposed that would explain the interface superconductivity phenomenon assuming a system with two order parameters. It has been proposed that the order parameter characterizing the bulk material with a defective or doped layer permits the formation of a second parameter which competes with the former and prevails over it in the vicinity of the interface. The superconductivity at the interface is then explained by the growth of this second order parameter only in this region, remaining still ``hidden" inside the bulk. The model was applied to a one-dimensional system with an interface, which presented a surprising result: the ``hidden" superconductivity appers in quantized critical temperatures, this allowing the existence of several eigenstates of the system, with different critical temperatures. In this dissertation, we use this model and investigate the unfolding of hidden superconductivity and its quantized temperatures. We observe that the interfaces resemble one-dimensional quantum wells, with the critical temperature playing the role of the energy in the quantum case. Following this idea we use numerical methods to solve the Ginzburg-Landau equations for a system with an arbitrary number of parallel interfaces. Our results show that in this case, the critical temperatures are quantized and degenerate when the interfaces are very separated, but it has its degeneracy broken when we approach the interfaces, as it happens in a lattice of square wells. We then proposed a tight-binding model to estimate critical temperatures on parallel interfaces and verified the validity of this approximation through the numerical solution of the complete problem. We also analyze the vortex states for a square two-dimensional defect, verifying the possibility of creating or destroying vortices in the region of `` hidden" superconductivity through an external magnetic field.
Nos Ãltimos anos foram reportados diversos experimentos em que a supercondutividade de interface foi observada em heteroestruturas de diferentes materiais, inclusive em nÃo-supercondutores extit{a priori}. A origem dessa supercondutividade ainda nÃo foi elucidada e nÃo existe uma teoria bem estabelecida para explicar esse fenÃmeno. Em 2015 foi proposto um modelo com base na teoria de Ginzburg-Landau que explicaria o fenÃmeno de supercondutividade de interface assumindo um sistema com dois parÃmetros de ordem. Foi proposto que o parÃmetro de ordem que caracteriza o material extit{bulk} com uma camada defeituosa, ou dopada, permite a formaÃÃo de um segundo parÃmetro que compete com o primeiro e prevalece sobre ele nas proximidades da interface. A supercondutividade na interface à entÃo explicada pelo crescimento deste segundo parÃmetro de ordem apenas nesta regiÃo, permancecendo ainda ``escondido" dentro do extit{bulk}. O modelo foi aplicado para um sistema unidimensional com uma interface, apresentando um resultado surpreendente: a supercondutividade escondida aparece em temperaturas crÃticas quantizadas, podendo entÃo existir vÃrios autoestados do sistema, com diferentes temperaturas crÃticas. Nessa dissertaÃÃo utilizamos esse modelo e investigamos os desdobramentos da supercondutividade escondida e suas temperaturas quantizadas. Percebemos que as interfaces assemelham-se com poÃos quÃnticos unidimensionais, com a temperatura crÃtica fazendo o anÃlogo ao da energia no caso quÃntico. Seguindo essa ideia utilizamos mÃtodos numÃricos para resolver as equaÃÃes de Ginzburg-Landau para um sistema com um nÃmero arbitrÃrio de interface paralelas. Nossos resultados mostram que neste caso, as temperaturas crÃticas, alÃm de quantizadas, sÃo degeneradas quando as interfaces estÃo muito separadas, mas tem essa degenerescÃncia quebrada quando aproximamos as interfaces, como ocorre em uma rede de poÃos quadrados. Propusemos entÃo um modelo tipo extit{tight-binding} para estimar temperaturas crÃticas em interfaces paralelas e verificamos a validade dessa aproximaÃÃo atravÃs da soluÃÃo numÃrica do problema completo. Analisamos tambÃm os estados de vÃrtices para um defeito bidimensional quadrado, verificando a possibilidade de se criar ou destruir vÃrtices na regiÃo de supercondutividade escondida atravÃs de um campo magnÃtico externo.
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Paruchuri, Bhavya. "Effects of Freezing Temperature on Interface Shear Strength of Landfill Geosynthetic Liner." University of Toledo / OhioLINK, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1321651367.

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Books on the topic "INTERFACE TEMPERATURE"

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Toner, Edwina. 3-2-1 temperature sensing interface. [S.l: The Author], 1994.

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A, Patkós, United States. National Aeronautics and Space Administration., and Fermi National Accelerator Laboratory, eds. Chiral interface at the finite temperature transition point of QCD. [Batavia, Ill.]: Fermi National Accelerator Laboratory, 1990.

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H, Fabik Richard, and Lewis Research Center, eds. Using silicon diodes for detecting the liquid-vapor interface in hydrogen. Cleveland, Ohio: National Aeronautics and Space Administration, Lewis Research Center, 1992.

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United States. National Aeronautics and Space Administration., ed. Adaptive control of interface by temperature and interface profile feedback in transparent multi-zone crystal growth furnace: Final technical report for NCC3 150. [Washington, DC: National Aeronautics and Space Administration, 1991.

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Lee, Benjamin Chi-Pui. Temperature gradient-driven Marangoni convection of a spherical liquid-liquid interface under reduced gravity conditions. Ottawa: National Library of Canada, 1999.

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Bell, L. D. Evidence of momentum conservation at a nonepitaxial metal/semiconductor interface using ballistic electron emission microscopy. [Washington, DC: National Aeronautics and Space Administration, 1996.

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Bell, L. D. Evidence of momentum conservation at a nonepitaxial metal/semiconductor interface using ballistic electron emission microscopy. [Washington, DC: National Aeronautics and Space Administration, 1996.

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C, Gillies Daniel, Lehoczky S. L, and United States. National Aeronautics and Space Administration., eds. Fluctuations of thermal conductivity and morphological stability. [Washington, DC: National Aeronautics and Space Administration, 1995.

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United States. National Aeronautics and Space Administration., ed. Final technical report on cooperative agreeement NCC 3-109: Temperature and melt solid interface control during crystal growth. [Washington, DC: National Aeronautics and Space Administration, 1990.

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1935-, Aboudi Jacob, Arnold S. M, and NASA Glenn Research Center, eds. The effect of interface roughness and oxide film thickness on the inelastic response of thermal barrier coatings to thermal cycling. Cleveland, Ohio: National Aeronautics and Space Administration, Glenn Research Center, 1999.

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Book chapters on the topic "INTERFACE TEMPERATURE"

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Singh, Ajay V. "Temperature." In Encyclopedia of Wildfires and Wildland-Urban Interface (WUI) Fires, 1–12. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-51727-8_39-1.

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Singh, Ajay V. "Temperature." In Encyclopedia of Wildfires and Wildland-Urban Interface (WUI) Fires, 993–1004. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-319-52090-2_39.

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Bhushan, Bharat. "Interface Temperature of Sliding Surfaces." In Tribology and Mechanics of Magnetic Storage Devices, 366–411. New York, NY: Springer US, 1990. http://dx.doi.org/10.1007/978-1-4684-0335-0_5.

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Bhushan, Bharat. "Interface Temperature of Sliding Surfaces." In Tribology and Mechanics of Magnetic Storage Devices, 366–411. New York, NY: Springer New York, 1996. http://dx.doi.org/10.1007/978-1-4612-2364-1_5.

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Singh, R. Arvind. "Interface Temperature of Sliding Surfaces." In Tribology for Scientists and Engineers, 177–93. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-1945-7_5.

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Steinbach, Ingo, and Hesham Salama. "Temperature." In Lectures on Phase Field, 41–47. Cham: Springer Nature Switzerland, 2023. http://dx.doi.org/10.1007/978-3-031-21171-3_4.

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AbstractIn this chapter the coupling of the phase field to a second, external field is discussed for the case of non-isothermal systems. A thermodynamic consistent derivation of the set of equations for the phase-field and temperature field is presented, starting from an entropy functional. In the second part of the chapter the systematic error, which arises in a phase-field model at the mesoscopic scale, is discussed. Finally, the so-called thin interface limit is presented, which is an elegant remedy of this systematic error by an asymptotic matching condition. The example in this section relates to solidification under additive manufacturing conditions.
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Kusuhiro, Mukai, and Matsushita Taishi. "Fundamentals of Treating the Interface." In Interfacial Physical Chemistry of High-Temperature Melts, 4–59. Boca Raton : Taylor & Francis, a CRC title, part of the Taylor & Francis imprint, a member of the Taylor & Francis Group, the academic division of T&F Informa, plc, [2020]: CRC Press, 2019. http://dx.doi.org/10.1201/9780429265341-2.

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Ma, Yali, and Xueyi Wang. "Temperature Controller Based on USB Interface." In Data Processing Techniques and Applications for Cyber-Physical Systems (DPTA 2019), 369–74. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-15-1468-5_46.

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Kerans, Ronald J., Randall S. Hay, Emmanuel E. Boakye, Kristen A. Keller, Tai-il Mah, Triplicane A. Parthasarathy, and Michael K. Cinibulk. "Oxide Fiber-Coatings for Interface Control in Ceramic Composites." In High Temperature Ceramic Matrix Composites, 127–35. Weinheim, FRG: Wiley-VCH Verlag GmbH & Co. KGaA, 2006. http://dx.doi.org/10.1002/3527605622.ch22.

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Yasuda, Hirotsugu K. "Interface Engineering by Low Temperature Plasma Processes." In Plasma Processing of Polymers, 289–303. Dordrecht: Springer Netherlands, 1997. http://dx.doi.org/10.1007/978-94-015-8961-1_14.

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Conference papers on the topic "INTERFACE TEMPERATURE"

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Saitoh, Y., T. Ueda, F. Ogasawara, H. Abe, R. Nomura, and Y. Okuda. "Solid-Liquid Interface Motion of 4He Induced by Heat Pulse." In LOW TEMPERATURE PHYSICS: 24th International Conference on Low Temperature Physics - LT24. AIP, 2006. http://dx.doi.org/10.1063/1.2354729.

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Ban, S. L., and Xiaolong Yu. "Cyclotron Resonance of Interface Polarons in a Realistic Heterojunction under Pressure." In LOW TEMPERATURE PHYSICS: 24th International Conference on Low Temperature Physics - LT24. AIP, 2006. http://dx.doi.org/10.1063/1.2355290.

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de Jong, Paul C., and Gerard C. M. Meijer. "High-temperature pressure transducer interface." In 5th Annual International Symposium on Smart Structures and Materials, edited by Vijay K. Varadan, Paul J. McWhorter, Richard A. Singer, and Michael J. Vellekoop. SPIE, 1998. http://dx.doi.org/10.1117/12.320180.

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Lall, Pradeep, Padmanava Choudhury, and Jaimal Williamson. "Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging." In ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2022. http://dx.doi.org/10.1115/ipack2022-97440.

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Abstract Modern computing platforms used in data centers or harsh environment platforms would be exposed to sustained high temperatures over an extended period of time. Thermal interface materials are extensively used to transport heat from the die surfaces to the Cu-heat spreader. The TIM interface may be exposed to compression in addition to thermal mismatch during power cycling and environmental temperature cycling. Failure of the interface may be a precursor of system failure owing to the subsequent temperature rise. Reliability assurance in the use case scenario requires a fundamental understanding of the interface’s robustness and evolution under operational loads. In this study, the TIM-Cu interfaces were subjected to high temperatures prior to measuring the interface’s critical stress intensity factors. Four-point bend specimens were fabricated and subjected to sustained high temperatures for 15 days, 30 days, 45 days, 60 days, 90 days, and 120 days at temperatures of 100°C, and 150°C. Tests were conducted to determine interfacial delamination of the sample specimen and identify the critical steady-state energy release rates. A digital image correlation approach was also employed to comprehend the progression of crack growth and the crack tip opening displacement (CTOD) to assess the deterioration of various TIM interfaces at various aging durations.
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Park, Wan Kyu, Laura H. Greene, John L. Sarrao, and Joe D. Thompson. "Andreev Reflection at the Normal-Metal / Heavy-Fermion Superconductor CeCoIn5 Interface by Point-Contact Spectroscopy." In LOW TEMPERATURE PHYSICS: 24th International Conference on Low Temperature Physics - LT24. AIP, 2006. http://dx.doi.org/10.1063/1.2354907.

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Bradley, D. I., S. N. Fisher, A. M. Guénault, R. P. Haley, H. Martin, G. R. Pickett, J. E. Roberts, and V. Tsepelin. "The Thermal Boundary Resistance of the Superfluid 3He A-B Phase Interface in the Low Temperature Limit." In LOW TEMPERATURE PHYSICS: 24th International Conference on Low Temperature Physics - LT24. AIP, 2006. http://dx.doi.org/10.1063/1.2354617.

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Hashimoto, Yoshiaki, Toshiyuki Yamagishi, Shingo Katsumoto, and Yasuhiro Iye. "Large Magnetoconductance through an Interface between a Two-Dimensional Hole System and a (Ga,Mn)As Layer." In LOW TEMPERATURE PHYSICS: 24th International Conference on Low Temperature Physics - LT24. AIP, 2006. http://dx.doi.org/10.1063/1.2355268.

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Gardner, P. D., and S. Y. Narayan. "InP/Low-Temperature-Deposited SiO 2 Interface." In 1st Intl Conf on Idium Phosphide and Related Materials for Advanced Electronic and Optical Devices, edited by Louis J. Messick and Rajendra Singh. SPIE, 1989. http://dx.doi.org/10.1117/12.962001.

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Bhattacharjee, Mitradip, Pablo Escobedo, Fatemeh Nikbakhtnasrabadi, and Ravinder Dahiya. "Printed Flexible Temperature Sensor with NFC Interface." In 2020 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS). IEEE, 2020. http://dx.doi.org/10.1109/fleps49123.2020.9239503.

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Pfahni, A. C., J. H. Lienhard, and A. H. Slocum. "Temperature control of a handler test interface." In Proceedings International Test Conference 1998. IEEE, 1998. http://dx.doi.org/10.1109/test.1998.743144.

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Reports on the topic "INTERFACE TEMPERATURE"

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Amoah-Kusi, Christian. Constant Interface Temperature Reliability Assessment Method: An Alternative Method for Testing Thermal Interface Material in Products. Portland State University Library, January 2000. http://dx.doi.org/10.15760/etd.2292.

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Ian Mckirdy. Reactor User Interface Technology Development Roadmaps for a High Temperature Gas-Cooled Reactor Outlet Temperature of 750 degrees C. Office of Scientific and Technical Information (OSTI), December 2010. http://dx.doi.org/10.2172/1004234.

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Buckner, M. A. et al. Development of a High-Temperature Smart Transducer Interface Node and Telemetry System (HSTINTS). Office of Scientific and Technical Information (OSTI), November 2006. http://dx.doi.org/10.2172/939626.

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Tomar, Vikas. An Investigation into the Effects of Interface Stress and Interfacial Arrangement on Temperature Dependent Thermal Properties of a Biological and a Biomimetic Material. Office of Scientific and Technical Information (OSTI), January 2015. http://dx.doi.org/10.2172/1167156.

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Grummon, D. S. High temperature stability, interface bonding, and mechanical behavior in. beta. -NiAl and Ni sub 3 Al matrix composites with reinforcements modified by ion beam enhanced deposition. Office of Scientific and Technical Information (OSTI), January 1992. http://dx.doi.org/10.2172/7067772.

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Grummon, D. S. High temperature stability, interface bonding, and mechanical behavior in [beta]-NiAl and Ni[sub 3]Al matrix composites with reinforcements modified by ion beam enhanced deposition. Office of Scientific and Technical Information (OSTI), January 1993. http://dx.doi.org/10.2172/6583595.

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Lever, James, Emily Asenath-Smith, Susan Taylor, and Austin Lines. Assessing the mechanisms thought to govern ice and snow friction and their interplay with substrate brittle behavior. Engineer Research and Development Center (U.S.), December 2021. http://dx.doi.org/10.21079/1168142742.

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Sliding friction on ice and snow is characteristically low at temperatures common on Earth’s surface. This slipperiness underlies efficient sleds, winter sports, and the need for specialized tires. Friction can also play micro-mechanical role affecting ice compressive and crushing strengths. Researchers have proposed several mechanisms thought to govern ice and snow friction, but directly validating the underlying mechanics has been difficult. This may be changing, as instruments capable of micro-scale measurements and imaging are now being brought to bear on friction studies. Nevertheless, given the broad regimes of practical interest (interaction length, temperature, speed, pressure, slider properties, etc.), it may be unrealistic to expect that a single mechanism accounts for why ice and snow are slippery. Because bulk ice, and the ice grains that constitute snow, are solids near their melting point at terrestrial temperatures, most research has focused on whether a lubricating water film forms at the interface with a slider. However, ice is extremely brittle, and dry-contact abrasion and wear at the front of sliders could prevent or delay a transition to lubricated contact. Also, water is a poor lubricant, and lubricating films thick enough to separate surface asperities may not form for many systems of interest. This article aims to assess our knowledge of the mechanics underlying ice and snow friction.
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Grummon, D. S. High temperature stability, interface bonding, and mechanical behavior in {beta}-NiAl and Ni{sub 3}Al matrix composites with reinforcements modified by ion beam enhanced deposition. Progress report, June 1, 1991--May 31, 1992. Office of Scientific and Technical Information (OSTI), January 1992. http://dx.doi.org/10.2172/10177689.

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Grummon, D. S. High temperature stability, interface bonding, and mechanical behavior in {beta}-NiAl and Ni{sub 3}Al matrix composites with reinforcements modified by ion beam enhanced deposition. Progress summary report, June 1, 1993--May 31, 1994. Office of Scientific and Technical Information (OSTI), January 1993. http://dx.doi.org/10.2172/10150426.

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Weaver, John H. High Temperature Superconducting Materials: Thin Films, Surfaces, and Interfaces. Fort Belvoir, VA: Defense Technical Information Center, June 1991. http://dx.doi.org/10.21236/ada237359.

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