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Relevant bibliographies by topics / Interface phenomenon

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Journal articles

Academic literature on the topic 'Interface phenomenon'

Author: Grafiati

Published: 19 October 2024

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Journal articles on the topic "Interface phenomenon"

1

Agrawal, S. "Bubble dynamics and interface phenomenon." Journal of Engineering and Technology Research 5, no. 3 (2013): 42–50. http://dx.doi.org/10.5897/jetr2013.0297.

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2

Dai, Jinghang, and Zhiting Tian. "Nanoscale thermal interface rectification in the quantum regime." Applied Physics Letters 122, no. 12 (2023): 122204. http://dx.doi.org/10.1063/5.0143038.

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To enable the on-demand control of heat flow for sustainable energy solutions, we have been longing for functional thermal components at the nanoscale, in analogue to electronic diodes and transistors. Understanding and discovering fundamental mechanisms that drive thermal rectification are critical to advancing this field. Different mechanisms have been proposed for thermal rectification effects in the classical regime. Using anharmonic atomistic Green's function, we discovered a thermal rectification phenomenon in the quantum regime for nanometer-thick three-dimensional solid interfaces. We found that the anharmonic phonon scatterings across the interface act on the temperature-dependent phonon populations on both sides of the interface, generating the necessary nonlinearity to achieve thermal rectification. This intrinsic thermal interface rectification is a universal phenomenon that can be observed and engineered for nanoscale interfaces.

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3

ROJAS, RENÉ G., RICARDO G. ELÍAS, and MARCEL G. CLERC. "DYNAMICS OF AN INTERFACE CONNECTING A STRIPE PATTERN AND A UNIFORM STATE: AMENDED NEWELL–WHITEHEAD–SEGEL EQUATION." International Journal of Bifurcation and Chaos 19, no. 08 (2009): 2801–12. http://dx.doi.org/10.1142/s0218127409024499.

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The dynamics of an interface connecting a stationary stripe pattern with a homogeneous state is studied. The conventional approach which describes this interface, Newell–Whitehead–Segel amplitude equation, does not account for the rich dynamics exhibited by these interfaces. By amending this amplitude equation with a nonresonate term, we can describe this interface and its dynamics in a unified manner. This model exhibits a rich and complex transversal dynamics at the interface, including front propagations, transversal patterns, locking phenomenon, and transversal localized structures.

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4

Habert, J., T. Machej, and T. Czeppe. "The phenomenon of wetting at solid/solid interface." Surface Science Letters 151, no. 1 (1985): A80. http://dx.doi.org/10.1016/0167-2584(85)90633-4.

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5

Haber, J., T. Machej, and T. Czeppe. "The phenomenon of wetting at solid/solid interface." Surface Science 151, no. 1 (1985): 301–10. http://dx.doi.org/10.1016/0039-6028(85)90468-6.

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6

Rezaee, Nastaran, John Aunna, and Jamal Naser. "Marangoni Flow Investigation in Foam Fractionation Phenomenon." Fluids 8, no. 7 (2023): 209. http://dx.doi.org/10.3390/fluids8070209.

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In this study, a numerical investigation of the Marangoni flow in foam fractionation was conducted, with a specific focus on the film of micro-foams in both the interior and exterior regions. A three-dimensional node–film–plateau border system was employed to model the system, utilizing time-dependent mass conservation equations. The study emphasized the influence of the surfactant concentration in the foam fractionation column and the mobility of the air–liquid interface on the Marangoni velocity within the film. The results indicated that higher surfactant concentration in the reflux column resulted in a significant increase in Marangoni velocities. Furthermore, a mobile interface enhanced the Marangoni flow, whereas a rigid interface reduced its intensity. The behaviour of the Marangoni flow was explored in both interior and exterior foams, revealing distinct characteristics. The presence of a wall in the exterior foam altered the flow dynamics, leading to a reduced Marangoni velocity compared to interior films.

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7

Yin, Lan, S. Balaji, and S. Seetharaman. "Effects of Nickel on Interface Morphology during Oxidation of Fe-Cu-Ni Alloys." Defect and Diffusion Forum 297-301 (April 2010): 318–29. http://dx.doi.org/10.4028/www.scientific.net/ddf.297-301.318.

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Steel produced in Electric Arc Furnaces (EAF) contain a high amount of copper that causes a detrimental surface cracking phenomenon called hot shortness. Studies have found that nickel can alleviate hot shortness by increasing copper solubility in the Fe phase, decreasing oxidation rate and promoting occlusion [1-3]. Occlusion is a phenomenon whereby the copper-rich phase becomes incorporated into iron oxides. Nickel promotes occlusion by causing an uneven interface and increasing the number of internal oxides. The uneven interface is likely a result of the two concentration fields resulting from ternary diffusion of nickel, copper and iron in the Fe phase. This work is aimed at explaining why nickel causes wavy oxide/liquid-Cu and liquid-Cu/Fe interfaces. Constitutional super-saturation criterion [4] was applied to explain uneven interfaces caused by nickel. A model simulating diffusion behaviors of copper and nickel in Fe was developed by coupling Comsol Multiphysics® and Matlab®. Interface concentrations of copper and nickel and perturbation criterion values were calculated as a function of time. Modeling results show that (i) the nickel interface concentration first increases to a peak value then decreases slowly during oxidation process as a result of the change in oxidation rates, and (ii) the alloys with higher nickel contents have more potential for interface breakdown and this occurs within the initial linear oxidation regime.

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8

Fujii, Nobutoshi, Shunsuke Furuse, Hirotaka Yoshioka, et al. "(Invited) Bonding Strength of Cu-Cu Hybrid Bonding for 3D Integration Process." ECS Transactions 112, no. 3 (2023): 3–14. http://dx.doi.org/10.1149/11203.0003ecst.

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Cu-Cu hybrid bonding is a significant technology for fabricating 3D stacked semiconductor devices. In hybrid bonding, the calculation of bonding strength is complex due to the various materials present in the bonding interface. This interface not only includes Cu/Cu and dielectric/dielectric interfaces, but also the Cu/dielectric interface because of the misalignment of Cu pads. In this study, we developed an integrated model regarding total bonding strength, considering the different interfaces. Additionally, considering the thermal expansion of Cu pads, we demonstrated the dependence of bonding strength on misalignment using simulations. At the dielectric/dielectric bonding interface, a phenomenon was observed, in which the H2O contained in the dielectric enhanced the bonding strength. We proposed a model for the increase of the bonding strength by filling the bonding interface gap with thermally expanded dielectrics. These results provide understanding regarding a part of the mechanism involved in bonding strength in Cu-Cu hybrid bonding.

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9

Korpan, Lidiya. "Cultural Phenomenon Attributes in the Graphic User Interface Design." Vestnik Volgogradskogo gosudarstvennogo universiteta. Serija 7. Filosofiya. Sociologiya i socialnye tehnologii, no. 1 (May 2016): 130–36. http://dx.doi.org/10.15688/jvolsu7.2016.1.17.

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10

Kushwaha, R. L., and J. Shen. "Numeric Simulation of Friction Phenomenon at Soil-Tool Interface." Tribology Transactions 38, no. 2 (1995): 424–30. http://dx.doi.org/10.1080/10402009508983424.

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