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Books on the topic 'Interconnexions (Technologie des circuits intégrés)'

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Author: Grafiati

Published: 25 July 2024

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1

Majumder, Manoj Kumar, Brajesh Kumar Kaushik, Arsalan Alam, and Vobulapuram Ramesh Kumar. Through Silicon Vias. Taylor & Francis Group, 2020.

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2

Majumder, Manoj Kumar, Brajesh Kumar Kaushik, Arsalan Alam, and Vobulapuram Ramesh Kumar. Through Silicon Vias: Materials, Models, Design, and Performance. Taylor & Francis Group, 2016.

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3

Majumder, Manoj Kumar, Brajesh Kumar Kaushik, Arsalan Alam, and Vobulapuram Ramesh Kumar. Through Silicon Vias: Materials, Models, Design, and Performance. Taylor & Francis Group, 2016.

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4

Majumder, Manoj Kumar, Brajesh Kumar Kaushik, Arsalan Alam, and Vobulapuram Ramesh Kumar. Through Silicon Vias: Materials, Models, Design, and Performance. Taylor & Francis Group, 2016.

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5

Majumder, Manoj Kumar, Brajesh Kumar Kaushik, Arsalan Alam, and Vobulapuram Ramesh Kumar. Through Silicon Vias: Materials, Models, Design, and Performance. Taylor & Francis Group, 2016.

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6

Majumder, Manoj Kumar, Brajesh Kumar Kaushik, Arsalan Alam, and Vobulapuram Ramesh Kumar. Through Silicon Vias: Materials, Models, Design, and Performance. Taylor & Francis Group, 2016.

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7

Khursheed, Afreen, and Kavita Khare. Nano Interconnects: Device Physics, Modeling and Simulation. Taylor & Francis Group, 2021.

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8

Khursheed, Afreen, and Kavita Khare. Nano Interconnects: Device Physics, Modeling and Simulation. CRC Press LLC, 2021.

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9

Shwartz, Geraldine Cogin. Handbook of Semiconductor Interconnection Technology. Taylor & Francis Group, 1997.

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10

Schwartz, Geraldine C., Kris V. Srikrishnan, and Geraldine Cogin Shwartz. Handbook of Semiconductor Interconnection Technology. Taylor & Francis Group, 2006.

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11

Handbook of semiconductor interconnection technology. 2nd ed. Boca Raton, FL: CRC/Taylor & Francis, 2005.

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12

Nicolescu, Gabriela, Mahdi Nikdast, and Sébastien Le Beux. Photonic Interconnects for Computing Systems: Understanding and Pushing Design Challenges. River Publishers, 2022.

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13

Nicolescu, Gabriela, Mahdi Nikdast, and Sébastien Le Beux. Photonic Interconnects for Computing Systems: Understanding and Pushing Design Challenges. River Publishers, 2022.

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14

Nicolescu, Gabriela, Mahdi Nikdast, and Sébastien Le Beux. Photonic Interconnects for Computing Systems: Understanding and Pushing Design Challenges. River Publishers, 2022.

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15

Nicolescu, Gabriela, Jiang Xu, Mahdi Nikdast, and Sébastien Le Beux. Photonic Interconnects for Computing Systems: Understanding and Pushing Design Challenges. River Publishers, 2017.

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16

Rahaman, Hafizur, and Debaprasad Das. Carbon Nanotube and Graphene Nanoribbon Interconnects. Taylor & Francis Group, 2017.

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17

Rahaman, Hafizur, and Debaprasad Das. Carbon Nanotube and Graphene Nanoribbon Interconnects. Taylor & Francis Group, 2017.

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18

Rahaman, Hafizur, and Debaprasad Das. Carbon Nanotube and Graphene Nanoribbon Interconnects. Taylor & Francis Group, 2014.

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19

Rahaman, Hafizur, and Debaprasad Das. Carbon Nanotube and Graphene Nanoribbon Interconnects. Taylor & Francis Group, 2017.

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20

Rahaman, Hafizur, and Debaprasad Das. Carbon Nanotube and Graphene Nanoribbon Interconnects. Taylor & Francis Group, 2017.

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21

Rahaman, Hafizur, and Debaprasad Das. Carbon Nanotube and Graphene Nanoribbon Interconnects. Taylor & Francis Group, 2017.

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22

Chrostowski, Lukas. High-Speed Photonics Interconnects. Taylor & Francis Group, 2013.

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23

Iniewski, Krzysztof, and Lukas Chrostowski. High-Speed Photonics Interconnects. Taylor & Francis Group, 2017.

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24

Iniewski, Krzysztof, and Lukas Chrostowski. High-Speed Photonics Interconnects. Taylor & Francis Group, 2013.

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25

Iniewski, Krzysztof, and Lukas Chrostowski. High-Speed Photonics Interconnects. Taylor & Francis Group, 2017.

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26

Iniewski, Krzysztof, and Lukas Chrostowski. High-Speed Photonics Interconnects. Taylor & Francis Group, 2017.

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27

Advanced Technologies for Next Generation Integrated Circuits. Institution of Engineering & Technology, 2020.

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28

Suhir, Ephraim. Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices. Taylor & Francis Group, 2020.

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29

Suhir, Ephraim. Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices. Taylor & Francis Group, 2020.

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30

Suhir, Ephraim. Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices. Taylor & Francis Group, 2020.

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31

Choi, Jung Han. High-Speed Devices and Circuits with THz Applications. Taylor & Francis Group, 2017.

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32

Choi, Jung Han. High-Speed Devices and Circuits with Thz Applications. Taylor & Francis Group, 2014.

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33

Choi, Jung Han. High-Speed Devices and Circuits with THz Applications. Taylor & Francis Group, 2017.

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34

Choi, Jung Han. High-Speed Devices and Circuits with THz Applications. Taylor & Francis Group, 2017.

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35

Iniewski, Kris, and Jung Han Choi. High-Speed Devices and Circuits with THz Applications. Taylor & Francis Group, 2014.

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