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Shi, Chuanqian, Zhanan Zou, Zepeng Lei, Pengcheng Zhu, Wei Zhang, and Jianliang Xiao. "Heterogeneous integration of rigid, soft, and liquid materials for self-healable, recyclable, and reconfigurable wearable electronics." Science Advances 6, no. 45 (November 2020): eabd0202. http://dx.doi.org/10.1126/sciadv.abd0202.
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Wearable electronics can be integrated with the human body for monitoring physical activities and health conditions, for human-computer interfaces, and for virtual/augmented reality. We here report a multifunctional wearable electronic system that combines advances in materials, chemistry, and mechanics to enable superior stretchability, self-healability, recyclability, and reconfigurability. This electronic system heterogeneously integrates rigid, soft, and liquid materials through a low-cost fabrication method. The properties reported in this wearable electronic system can find applications in many areas, including health care, robotics, and prosthetics, and can benefit the well-being, economy, and sustainability of our society.
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Chiu, J. C., and T. L. Yeh. "IRES: An integrated software and hardware interface framework for reconfigurable embedded system." IET Computers & Digital Techniques 4, no. 1 (January 1, 2010): 27–37. http://dx.doi.org/10.1049/iet-cdt.2009.0010.
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Guo, Zhiyong, Qiang Li, Haiqi Liu, Bo Yan, and Guangjun Li. "An integrated low-voltage ultra-low-power reconfigurable hardware interface in 0.18-µm CMOS." International Journal of Electronics 98, no. 6 (June 2011): 685–98. http://dx.doi.org/10.1080/00207217.2011.567038.
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Bédard, Anne-Catherine, Andrea Adamo, Kosi C. Aroh, M. Grace Russell, Aaron A. Bedermann, Jeremy Torosian, Brian Yue, Klavs F. Jensen, and Timothy F. Jamison. "Reconfigurable system for automated optimization of diverse chemical reactions." Science 361, no. 6408 (September 20, 2018): 1220–25. http://dx.doi.org/10.1126/science.aat0650.
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Chemical synthesis generally requires labor-intensive, sometimes tedious trial-and-error optimization of reaction conditions. Here, we describe a plug-and-play, continuous-flow chemical synthesis system that mitigates this challenge with an integrated combination of hardware, software, and analytics. The system software controls the user-selected reagents and unit operations (reactors and separators), processes reaction analytics (high-performance liquid chromatography, mass spectrometry, vibrational spectroscopy), and conducts automated optimizations. The capabilities of this system are demonstrated in high-yielding implementations of C-C and C-N cross-coupling, olefination, reductive amination, nucleophilic aromatic substitution (SNAr), photoredox catalysis, and a multistep sequence. The graphical user interface enables users to initiate optimizations, monitor progress remotely, and analyze results. Subsequent users of an optimized procedure need only download an electronic file, comparable to a smartphone application, to implement the protocol on their own apparatus.
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Dean, Robert N., Colin B. Stevens, and John J. Tatarchuk. "A Current-Controlled PCB Integrated MEMS Tilt Mirror." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (January 1, 2014): 000588–608. http://dx.doi.org/10.4071/2014dpc-ta32.
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Introduction: MEMS Tilt Mirror - a miniature planar micro-mirror that can experience a 1-D or 2-D tilt in response to a control signal. Commonly used technologies- electrostatic, piezoelectric, electrothermal bimorph. Applications - laser beam steering, interferometers, dynamic signal analyzers, opticcal cross-connect switches. This paper describes the design, key features and applications of a System On Chip (SOC) ASIC (Application Specific Integrated Circuit) that has been developed under an Air Force SBIR program. The SOC device has been implemented by Honeywell International using their High Temperature SOI (Silicon On Insulator) Process. The objective of the Air Force SBIR program {1} was to investigate the potential for use of available High Temperature SOI technology devices for aerospace propulsion control system applications. Several prototype designs implemented by Embedded Systems LLC (ES-LLC) using available SOI devices identified significant limitations in the performance capability and level of integration. The diversity of propulsion system interfacing requirements demanded generic solutions so that they could be deployed in multiple applications without changes. The available devices were also not affordable due to the limited size of the market for this technology. It was therefore decided to develop a generic, reconfigurable SOC chipset {2} that could be implemented using Honeywell's HT200 Family of ASIC Gate Arrays. The paper will describe the architecture and key features of the SOC chipset solution which can be reconfigured to interface with most typical aerospace control system sensors and actuators. The SOC chipset captures all of the necessary functions required to interface with sensors such as RTD (resistance Temperature Detectors), Strain Gauges (SG) and thermocouples (TC), mass flow, speed and LVDT (Linear Variable Differential Transducer) position. The excitation circuitry required to power these interfaces is embedded in the chipset and can be reconfigured as required. The SOC chipset also contains all of the pre- and post-processing functions to convert electrical signals into digital words and send them on a data bus under the control of a host microprocessor. The SOC chipset can be powered from a Mil-Std 704F compliant power source or a conditioned DC power source. The SOC chipset when combined with other external devices can be implemented as a “Smart Node” for localized management of sensors and actuators as a part of a distributed architecture or used as a scalable building block in a more complex function such as a FADEC (Full Authority Digital Engine Control). The SOC chipset thus completes the set of all High Temperature SOI Integrated circuits required for implementation of typical Smart Nodes. It is believed that the versatility of the SOC chipset makes it a well suited, affordable, scalable building block for not only aerospace controls but also for diverse applications such as down-hole drilling, energy exploration, wind farms etc. where high temperature electronics is required.
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Primiani, Rurik A., Kenneth H. Young, André Young, Nimesh Patel, Robert W. Wilson, Laura Vertatschitsch, Billie B. Chitwood, Ranjani Srinivasan, David MacMahon, and Jonathan Weintroub. "SWARM: A 32 GHz Correlator and VLBI Beamformer for the Submillimeter Array." Journal of Astronomical Instrumentation 05, no. 04 (December 2016): 1641006. http://dx.doi.org/10.1142/s2251171716410063.
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A 32[Formula: see text]GHz bandwidth VLBI capable correlator and phased array has been designed and deployed a at the Smithsonian Astrophysical Observatory’s Submillimeter Array (SMA). The SMA Wideband Astronomical ROACH2 Machine (SWARM) integrates two instruments: a correlator with 140[Formula: see text]kHz spectral resolution across its full 32[Formula: see text]GHz band, used for connected interferometric observations, and a phased array summer used when the SMA participates as a station in the Event Horizon Telescope (EHT) very long baseline interferometry (VLBI) array. For each SWARM quadrant, Reconfigurable Open Architecture Computing Hardware (ROACH2) units shared under open-source from the Collaboration for Astronomy Signal Processing and Electronics Research (CASPER) are equipped with a pair of ultra-fast analog-to-digital converters (ADCs), a field programmable gate array (FPGA) processor, and eight 10 Gigabit Ethernet (GbE) ports. A VLBI data recorder interface designated the SWARM digital back end, or SDBE, is implemented with a ninth ROACH2 per quadrant, feeding four Mark6 VLBI recorders with an aggregate recording rate of 64 Gbps. This paper describes the design and implementation of SWARM, as well as its deployment at SMA with reference to verification and science data.
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Bal, Amrita, Jeffery W. Baur, Darren J. Hartl, Geoffrey J. Frank, Thao Gibson, Hong Pan, and Gregory H. Huff. "Multi-Layer and Conformally Integrated Structurally Embedded Vascular Antenna (SEVA) Arrays." Sensors 21, no. 5 (March 4, 2021): 1764. http://dx.doi.org/10.3390/s21051764.
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This work presents the design and fabrication of two multi-element structurally embedded vascular antennas (SEVAs). These are achieved through advances in additively manufactured sacrificial materials and demonstrate the ability to embed vascular microchannels in both planar and complex-curved epoxy-filled quartz fiber structural composite panels. Frequency-reconfigurable antennas are formed by these structures through the pressure-driven transport of liquid metal through the embedded microchannels. The planar multi-layer topology examines the ability to fabricate two co-located radiating structures separated by a single ply of quartz fabric within the composite layup. The multi-element linear array topology composed of microchannels embedded on to a single-layer are used to demonstrate the ability to conformally-integrate these channels into a complex curved surface that mimics an array of antennas on the leading edge of an Unmanned Aerial Vehicle (UAV). A parallel-strip antipodal dipole feed structure provides excitation and serves as the interface for fluid displacement within the microchannels to facilitate reconfiguration. The nominal design of the SEVAs achieve over a decade of frequency reconfiguration with respect to the fundamental dipole mode of the antenna. Experimental and predicted results demonstrate the operation for canonical states of the antennas. Additional results for the array topology demonstrate beam steering and contiguous operation of interconnected elements in the multi-element structure.
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Tulpule, Bhal, Bruce Ohme, Mark Larson, Al Behbahani, John Gerety, and Al Steines. "A System On Chip (SOC) ASIC chipset for Aerospace and Energy Exploration Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, HITEC (January 1, 2014): 000278–84. http://dx.doi.org/10.4071/hitec-tha11.
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This paper describes the design, key features and applications of a System On Chip (SOC) ASIC (Application Specific Integrated Circuit) chipset which was developed by Embedded Systems LLC as a part of the Smart Node based distributed control system architecture under an Air Force SBIR (Small Business Innovative Research) program {4}. The analog part of the SOC chipset has been implemented by Honeywell International under a subcontract using their high temperature SOI (Silicon On Insulator) Process. The complete chipset is expected to be available in early 2015. The key feature of the SOC chipset is that it is a reconfigurable and scalable building block that can be used to interface with most typical aerospace control system sensors and actuators. The SOC chipset captures all of the necessary functions required to power and interface with sensors such as RTD (Resistance Temperature Detectors), Strain Gauges (SG), Thermo Couples (TC) and transducers for measuring mass flow, speed, position or angle. The SOC chipset also contains all of the pre- and post-processing functions to convert electrical signals into digital words and send them on a data bus under the control of a host microprocessor. Finally, the SOC chipset contains PWM (Pulse Width Modulation) circuitry required to interface with external drives for actuators, motors, shutoff Valves etc. The SOC chipset can be powered from a Mil-Std-704F compliant power source or a conditioned DC power source. The chipset can be combined with other devices, such as memory, processor and A to D Converter to implement a high temperature capable Smart Node for localized management of sensors and actuators as a part of a distributed architecture or used as a scalable building block in a more complex function such as a FADEC (Full Authority Digital Engine Control). It is believed that the versatility of the SOC chipset makes it a well suited, affordable, scalable building block for not only aerospace controls but also for diverse applications such as down-hole drilling, energy exploration, wind farms etc. where high temperature electronics and /or high level of miniaturization is required.
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Fresi, Francesco, Antonio Malacarne, Vito Sorianello, Gianluca Meloni, Philippe Velha, Michele Midrio, Veronica Toccafondo, Stefano Faralli, Marco Romagnoli, and Luca Poti. "Reconfigurable Silicon Photonics Integrated 16-QAM Modulator Driven by Binary Electronics." IEEE Journal of Selected Topics in Quantum Electronics 22, no. 6 (November 2016): 334–43. http://dx.doi.org/10.1109/jstqe.2016.2538725.
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Shi, Chuanqian, Zhanan Zou, Zepeng Lei, Pengcheng Zhu, Guohua Nie, Wei Zhang, and Jianliang Xiao. "Stretchable, Rehealable, Recyclable, and Reconfigurable Integrated Strain Sensor for Joint Motion and Respiration Monitoring." Research 2021 (July 29, 2021): 1–14. http://dx.doi.org/10.34133/2021/9846036.
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Cutting-edge technologies of stretchable, skin-mountable, and wearable electronics have attracted tremendous attention recently due to their very wide applications and promising performances. One direction of particular interest is to investigate novel properties in stretchable electronics by exploring multifunctional materials. Here, we report an integrated strain sensing system that is highly stretchable, rehealable, fully recyclable, and reconfigurable. This system consists of dynamic covalent thermoset polyimine as the moldable substrate and encapsulation, eutectic liquid metal alloy as the strain sensing unit and interconnects, and off-the-shelf chip components for measuring and magnifying functions. The device can be attached on different parts of the human body for accurately monitoring joint motion and respiration. Such a strain sensing system provides a reliable, economical, and ecofriendly solution to wearable technologies, with wide applications in health care, prosthetics, robotics, and biomedical devices.
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Dahiya, Ravinder S., Andrea Adami, Luigi Pinna, Cristian Collini, Maurizio Valle, and Leandro Lorenzelli. "Tactile Sensing Chips With POSFET Array and Integrated Interface Electronics." IEEE Sensors Journal 14, no. 10 (October 2014): 3448–57. http://dx.doi.org/10.1109/jsen.2014.2346742.
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Zaman, Qummar, Senan Alraho, and Andreas König. "Low-cost Indirect Measurement Methods for Self-x Integrated Sensory Electronics for Industry 4.0." tm - Technisches Messen 87, s1 (September 25, 2020): s79—s84. http://dx.doi.org/10.1515/teme-2020-0020.
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AbstractThe conventional method for testing the performance of reconfigurable sensory electronics of industry 4.0 relies on the direct measurement methods. This approach gives higher accuracy but at the price of extremely high testing cost and does not utilize the new degrees of freedom for measurement methods enabled by industry 4.0. In order to reduce the test cost and use available resources more efficiently, a primary approach, called indirect measurements or alternative testing has been proposed using a non-intrusive sensor. Its basic principle consists in using the indirect measurements, in order to estimate the sensory electronics performance parameters without measuring directly. The non-intrusive property of the proposed method offers better performance of the sensing electronics and virtually applicable to any sensing electronics. Efficiency is evaluated in terms of model accuracy by using six different classical metrics. It uses an indirect current-feedback instrumentation amplifier (InAmp) as a test vehicle to evaluate the performance parameters of the circuit. The device is implemented using CMOS 0.35 μm technology. The achieved maximum value of average expected error metrics is 0.24, and the lowest value of correlation performance metrics is 0.91, which represent an excellent efficiency of InAmp performance predictor.
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Obaid, Abdulmalik, Mina-Elraheb Hanna, Yu-Wei Wu, Mihaly Kollo, Romeo Racz, Matthew R. Angle, Jan Müller, et al. "Massively parallel microwire arrays integrated with CMOS chips for neural recording." Science Advances 6, no. 12 (March 2020): eaay2789. http://dx.doi.org/10.1126/sciadv.aay2789.
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Multi-channel electrical recordings of neural activity in the brain is an increasingly powerful method revealing new aspects of neural communication, computation, and prosthetics. However, while planar silicon-based CMOS devices in conventional electronics scale rapidly, neural interface devices have not kept pace. Here, we present a new strategy to interface silicon-based chips with three-dimensional microwire arrays, providing the link between rapidly-developing electronics and high density neural interfaces. The system consists of a bundle of microwires mated to large-scale microelectrode arrays, such as camera chips. This system has excellent recording performance, demonstrated via single unit and local-field potential recordings in isolated retina and in the motor cortex or striatum of awake moving mice. The modular design enables a variety of microwire types and sizes to be integrated with different types of pixel arrays, connecting the rapid progress of commercial multiplexing, digitisation and data acquisition hardware together with a three-dimensional neural interface.
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Wang, Yi-Lin, Hai-Tao Deng, Zhen-Yu Ren, Xin-Tian Liu, Yu Chen, Cheng Tu, Jun-Lian Chen, and Xiao-Sheng Zhang. "The Interface between Nanoenergy and Self-Powered Electronics." Sensors 21, no. 5 (February 25, 2021): 1614. http://dx.doi.org/10.3390/s21051614.
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In recent decades, nanogenerators based on several techniques such as triboelectric effects, piezoelectric effects, or other mechanisms have experienced great developments. The nanoenergy generated by nanogenerators is supposed to be used to overcome the problem of energy supply problems for portable electronics and to be applied to self-powered microsystems including sensors, actuators, integrated circuits, power sources, and so on. Researchers made many attempts to achieve a good solution and have performed many explorations. Massive efforts have been devoted to developing self-powered electronics, such as self-powered communication devices, self-powered human–machine interfaces, and self-powered sensors. To take full advantage of nanoenergy, we need to review the existing applications, look for similarities and differences, and then explore the ways of achieving various self-powered systems with better performance. In this review, the methods of applying nanogenerators in specific circumstances are studied. The applications of nanogenerators are classified into two categories, direct utilization and indirect utilization, according to whether a treatment process is needed. We expect to offer a line of thought for future research on self-powered electronics.
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Wu, Wenzhuo. "(Invited) hybrid Nanomanufacturing of Self-Powered Human-Integrated Sensors." ECS Meeting Abstracts MA2023-01, no. 34 (August 28, 2023): 1933. http://dx.doi.org/10.1149/ma2023-01341933mtgabs.
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The seamless and adaptive interactions between functional devices and their environment (e.g., the human body) are critical for advancing emerging technologies, e.g., wearable devices, consumer electronics, and human-machine interface. The state-of-the-art technologies, however, require a complex integration of heterogeneous components to interface the mechanical stimulus which is ubiquitous and abundant in the above applications. These limitations have severely hampered the advancement and broader utilization of related technologies. Moreover, all existing technologies require a power source, which complicates the system design and limits operation schemes. In this talk, I will discuss our recent progress in developing self-powered human-integrated sensors through the hybrid nanomanufacturing of heterostructured devices. This new class of wearable devices are conformable to human skins and can sustainably perform self-powered, non-invasive functions, e.g., physiological monitoring and gesture recognition, by harvesting the operation power from the human body. This research is expected to have a positive impact and immediate relevance to many societally pervasive areas, e.g., telehealth, consumer electronics, and robotics.
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Williams, Chris, and Shideh Kabiri Ameri. "(Digital Presentation) Fully Integrated Strain-Neutralized 2D Transistors." ECS Meeting Abstracts MA2022-02, no. 62 (October 9, 2022): 2295. http://dx.doi.org/10.1149/ma2022-02622295mtgabs.
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As performant and well-established as conventional silicon-based electronics have become, the era of wearable electronics and the Internet-of-Things has created a demand for robust electronic devices that can conform to the surfaces of the human body. Whereas the mechanical mismatch between rigid silicon electronics and the human body represents a fundamental limit to conventional non-invasive health sensing, wearable electronics and electrodes that can conform to the microscopic features of the skin1,2 can circumvent most of the motion artifacts inherent to conventional, rigid sensing devices, and facilitate continuous health monitoring as is required for modern, more proactive healthcare. Unfortunately, without addressing this fundamental mechanical incompatibility, devices that leverage the high density of transistors available in rigid silicon-based integrated circuits are handicapped by how well they can maintain contact with the body, and consequently are prone to failure at the sensor-circuit interface. The extraordinary properties of two-dimensional materials pose a unique opportunity for addressing this mechanical mismatch. Their unusual mechanical strength combined with their ultimate thinness, optical transparency, and favorable electronic transport properties3 makes them ideal candidates for the next generation of highly conformable wearable electronics free of the constraints of a rigid silicon circuit board—however, minimizing local strain in the vicinity of the active devices to ensure reliable operation remains a priority. Using a design informed by finite element method (FEM) simulations, our proposed strain-neutralizing 2D transistors are configured to resist applied strains on the order of the 30% strains human skin can withstand by redistributing strain away from active regions. Tight binding simulations of the transistor channels helps with further compensation of residual strain in the active regions, alongside careful consideration of materials and device architecture during fabrication. Together, these considerations help realize the possibility of fully integrated strain-neutralized 2D transistors compatible with state-of-the-art conformable wearable sensors. [1]S. Kabiri Ameri et al., “Graphene electronic tattoo sensors,” ACS Nano, 11, 7634–7641, 2017. [2] S. Kabiri Ameri et al., “Imperceptible electrooculography graphene sensor system for human–robot interface”, npj 2D Materials and Applications, 2, 1-7, 2018. [3] A. H. Castro Neto, F. Guinea, N. M. R. Peres, K. S. Novoselov, and A. K. Geim, “The electronic properties of graphene,” Rev. Mod. Phys., vol. 81, no. 1, pp. 109–162, Jan. 2009, doi: 10.1103/RevModPhys.81.109.
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Kumar, G. S. Satheesh, Chinnadurai Nagarajan, and M. Lizzy Nesa Bagyam. "A Survey on Smart Grid Distributed Power Flow: IEC61850, IEC 61499 and Intelligent Controls." Applied Mechanics and Materials 573 (June 2014): 346–51. http://dx.doi.org/10.4028/www.scientific.net/amm.573.346.
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A Recent concept of distribution infrastructure plays a vital role in the efficient utilization of energy. To avoid global warming and greenhouse gas emission, carbon based power plant should be replaced with distributed renewable energy (DRE) such as wind, solar etc. Renewable energy resources can be integrated to grid by intelligent electronic devices (IED). This paper deals with the novel automation architecture that supports power distribution systems to avoid power blackout and also it briefs the major requirement of the smart grid distribution system needed for a competitive world. International standard IEC 61850 and IEC 61499 provides a solution for substation automation through intelligent logical nodes (ILNs) which enhances interoperability and configurability.Later an open source platform is used for enhancing the communication that automatically generates the data model and communication nodes for intelligent electronic devices.However for future requirements in smart grid, the addition of new functions as well as the adaptation of function for IEDs is necessary. A concept of reconfigurable software architecture is introduced for integrating distributed and renewable energy resources. Such interfaces and services provide adaptation of the functional structure and contribute efficient Smart Grid system. This survey summarizes the communication infrastructure of smart energy system.
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Kameyama, Michitaka, and Yoshichika Fujioka. "VLSI Processor System for Robotics." Journal of Robotics and Mechatronics 8, no. 6 (December 20, 1996): 496–99. http://dx.doi.org/10.20965/jrm.1996.p0496.
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As one of the next-generation information systems, it is important to construct intelligent integrated systems that have quick response for dynamically changing environment. Therefore, it becomes essential to develop the special purpose VLSI processors which are based on the philosophy ""great reduction of the delay time."" Particularly, we call it robot electronics to develop the special purpose VLSI processors for intelligent robot control. In this article, we will review the fundamental technologies such as pipeline architecture, spacial parallel processing, reconfigurable parallel architecture and high level synthesis of the parallel processor with minimum delay time.
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Bossi, Luca, Pierluigi Falorni, and Lorenzo Capineri. "Versatile Electronics for Microwave Holographic RADAR Based on Software Defined Radio Technology." Electronics 11, no. 18 (September 12, 2022): 2883. http://dx.doi.org/10.3390/electronics11182883.
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The NATO SPS G-5014 project has shown the possibility of using a holographic RADAR for the detection of anti-personnel mines. To use the RADAR on a robotic scanning system, it must be portable, light, easily integrated with mechanical handling systems and configurable in its operating parameters for optimal performance on different terrains. The novel contribution is to use software programmable electronics to optimize performance and to use a time reference to obtain synchronization between the RADAR samples and the position in space, in order to make it easy to integrate the RADAR on robotic platforms. To achieve these goals we used the Analog Devices “ADALM Pluto” device based on Software Defined Radio technology and a time server. We have obtained a portable system, configurable via software in all its operating parameters and easily integrated on robotic scanning platforms. The paper will show experiments performed on a simulated minefield. The electronics project reported in this work makes holographic RADARs portable and easily reconfigurable, therefore adaptable to different applications from subsurface soil investigations to applications in the field of non-destructive testings.
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K, Viji. "PV FED ZETA-SEPIC based Integrated Converter for Street Light System." International Journal for Research in Applied Science and Engineering Technology 10, no. 7 (July 31, 2022): 1733–41. http://dx.doi.org/10.22214/ijraset.2022.45562.
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Abstract: This paper proposes an efficient cost-effective PV fed zeta-Sepic integrated converter for street lighting system. Generally, two separate power electronics converters are used for charging and discharging of battery.in proposed system zetaSepic converter is used as a single power electronics interface for the complete operation. Fractional order incremental conductance (FO-INC) algorithm is used for MPPT control. The integrated converter has at least components compared to those existing converter which have stepping up and stepping down capability in all modes. The proposed street light system is designed and modeled such that the performance is not affected under dynamic conditions. The suitability of proposed system at practical operation condition is demonstrated through simulation result using MATLAB/Simulink followed by an experimental validation
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Rojas, R., S. V. Kuleshov, C. Silva, G. Carvajal, A. Abusleme, H. Hakobyan, V. Arredondo, and J. Gonzalez. "VerDAQ: a Versatile Data AcQuisition system for high energy physics experiments." Journal of Instrumentation 17, no. 01 (January 1, 2022): P01023. http://dx.doi.org/10.1088/1748-0221/17/01/p01023.
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Abstract The Versatile Data AcQuisition (VerDAQ) system is a modular and flexible data acquisition platform designed to be used in a wide range of high-energy physics experiments, from small desktop detectors to large experiments in accelerators. The main characteristic of VerDAQ is its flexibility that stems from a modular design, separating the front-end electronics in a mezzanine board from the back-end electronics on a motherboard. The latter includes a programmable System-on-Chip (SoC) that provides preprocessing and communication capabilities. The VerDAQ system is hardware and firmware reconfigurable, enabling its use in standalone instruments as well as integrated into extensive data acquisition systems. In this paper, the system structure is described in detail, and a particular implementation of a laboratory prototype using the DRS4 chip is characterized and used to demonstrate standalone operation.
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Kazior, Thomas E. "Beyond CMOS: heterogeneous integration of III–V devices, RF MEMS and other dissimilar materials/devices with Si CMOS to create intelligent microsystems." Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences 372, no. 2012 (March 28, 2014): 20130105. http://dx.doi.org/10.1098/rsta.2013.0105.
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Advances in silicon technology continue to revolutionize micro-/nano-electronics. However, Si cannot do everything, and devices/components based on other materials systems are required. What is the best way to integrate these dissimilar materials and to enhance the capabilities of Si, thereby continuing the micro-/nano-electronics revolution? In this paper, I review different approaches to heterogeneously integrate dissimilar materials with Si complementary metal oxide semiconductor (CMOS) technology. In particular, I summarize results on the successful integration of III–V electronic devices (InP heterojunction bipolar transistors (HBTs) and GaN high-electron-mobility transistors (HEMTs)) with Si CMOS on a common silicon-based wafer using an integration/fabrication process similar to a SiGe BiCMOS process (BiCMOS integrates bipolar junction and CMOS transistors). Our III–V BiCMOS process has been scaled to 200 mm diameter wafers for integration with scaled CMOS and used to fabricate radio-frequency (RF) and mixed signals circuits with on-chip digital control/calibration. I also show that RF microelectromechanical systems (MEMS) can be integrated onto this platform to create tunable or reconfigurable circuits. Thus, heterogeneous integration of III–V devices, MEMS and other dissimilar materials with Si CMOS enables a new class of high-performance integrated circuits that enhance the capabilities of existing systems, enable new circuit architectures and facilitate the continued proliferation of low-cost micro-/nano-electronics for a wide range of applications.
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Ohme, Bruce W., and Mark R. Larson. "Analog Component Development for 300°C Sensor Interface Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (January 1, 2012): 000199–206. http://dx.doi.org/10.4071/hitec-2012-wp11.
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The development of Enhanced Geothermal Systems (EGS) for base-load electrical power generation will require electronics for sensing and control during exploration and drilling and also during production. The operating temperature environments for these applications will generally be more extreme than those encountered by electronics currently deployed for oil and gas development and production monitoring. To address this requirement, electronic components have been designed and fabricated for operation at temperatures of 300°C. These integrated circuits use silicon-on-insulator (SOI) fabrication processes to achieve high temperature operation. High-fidelity simulation models have been developed by characterization of SOI devices at 300°C. These device models were employed to design components required for the development of a down-hole orientation module. A wide-bandwidth, low-noise operational amplifier has been developed for use with MEMS accelerometer sensors. A multi-channel synchronous voltage-to-frequency converter with built-in reference and oscillators has also been developed for use with 3-axis flux-gate magnetometers. The components themselves are general purpose and could easily be used for other high-temperature sensor-interface applications. .
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Kothari, Rushabh, and CT Sun. "Design and analysis of multifunctional structures with embedded electronics for thermomechanical loads." Journal of Sandwich Structures & Materials 14, no. 6 (November 2012): 734–52. http://dx.doi.org/10.1177/1099636212460541.
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Multifunctional structures, of various forms, are being used in aerospace industry and there have been increasing efforts to enhance their performance. The design and analysis of a composite sandwich beam embedded avionics and integrated cooling systems is presented in this article. The integrated electronics inside a sandwich beam reduces the overall weight of a vehicle by eliminating most of the avionics housing, cables, interconnects, etc. The foam core of a sandwich beam is modified with a cavity to embed avionics. Since the presence of a cavity degrades the strength of the structure, various methods of reinforcement have been presented. The heat dissipation system has been designed to protect the structure from excessive thermal loads. The design of heat dissipating system consists of two parts, thermal interface materials and a highly efficient heat transfer device. Design guidelines for a thermal interface material consisting of particulate composites are presented here. Among various choices, heat pipes have been chosen as the preferred heat transfer device. An example is given for an unmanned aerial vehicle skin acting as the heat sink to maintain embedded electronics within their operational limit at subsonic air speeds.
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von Zitzewitz, Joachim, André Morger, Georg Rauter, Laura Marchal-Crespo, Francesco Crivelli, Dario Wyss, Tobias Bruckmann, and Robert Riener. "A reconfigurable, tendon-based haptic interface for research into human-environment interactions." Robotica 31, no. 3 (August 14, 2012): 441–53. http://dx.doi.org/10.1017/s026357471200046x.
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SUMMARYHuman reaction to external stimuli can be investigated in a comprehensive way by using a versatile virtual-reality setup involving multiple display technologies. It is apparent that versatility remains a main challenge when human reactions are examined through the use of haptic interfaces as the interfaces must be able to cope with the entire range of diverse movements and forces/torques a human subject produces. To address the versatility challenge, we have developed a large-scale reconfigurable tendon-based haptic interface which can be adapted to a large variety of task dynamics and is integrated into a Cave Automatic Virtual Environment (CAVE). To prove the versatility of the haptic interface, two tasks, incorporating once the force and once the velocity extrema of a human subject's extremities, were implemented: a simulator with 3-DOF highly dynamic force feedback and a 3-DOF setup optimized to perform dynamic movements. In addition, a 6-DOF platform capable of lifting a human subject off the ground was realized. For these three applications, a position controller was implemented, adapted to each task, and tested. In the controller tests with highly different, task-specific trajectories, the three robot configurations fulfilled the demands on the application-specific accuracy which illustrates and confirms the versatility of the developed haptic interface.
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Välimäki, Marja K., Laura I. Sokka, Heidi B. Peltola, Sami S. Ihme, Teijo M. J. Rokkonen, Timo J. Kurkela, Jyrki T. Ollila, Arttu T. Korhonen, and Jukka T. Hast. "Printed and hybrid integrated electronics using bio-based and recycled materials—increasing sustainability with greener materials and technologies." International Journal of Advanced Manufacturing Technology 111, no. 1-2 (September 26, 2020): 325–39. http://dx.doi.org/10.1007/s00170-020-06029-8.
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Abstract Printed and hybrid integrated electronics produced from recycled and renewable materials can reduce the depletion of limited material resources while obtaining energy savings in small electronic applications and their energy storage. In this work, bio-based poly(lactic acid) (PLA) and recycled polyethylene terephthalate (rPET) were fabricated in film extrusion process and utilized as a substrate in ultra-thin organic photovoltaics (OPV). In the device structure, metals and metal oxides were replaced by printing PEDOT:PSS, carbon and amino acid/heterocycles. Scalable, energy-efficient fabrication of solar cells resulted in efficiencies up to 6.9% under indoor light. Furthermore, virgin-PET was replaced with PLA and rPET in printed and hybrid integrated electronics where surface-mount devices (SMD) were die-bonded onto silver-printed PLA and virgin-PET films to prepare LED foils followed by an overmoulding process using the rPET and PLA. As a result, higher relative adhesion of PLA-PLA interface was obtained in comparison with rPET-PET interface. The obtained results are encouraging from the point of utilization of scalable manufacturing technologies and natural/recycled materials in printed and hybrid integrated electronics. Assessment showed a considerable decrease in carbon footprint, about 10–85%, mainly achieved through replacing of silver, virgin-PET and modifying solar cell structure. In outdoor light, the materials with low carbon footprint can decrease energy payback times (EPBT) from ca. 250 days to under 10 days. In indoor energy harvesting, it is possible to achieve EPBT of less than 1 year. The structures produced and studied herein have a high potential of providing sustainable energy solutions for example in IoT-related technologies.
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Niu, Simiao. "(Invited) smart Wearable Electronics for Chronic Disease Management." ECS Meeting Abstracts MA2023-01, no. 34 (August 28, 2023): 1894. http://dx.doi.org/10.1149/ma2023-01341894mtgabs.
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60% of Americans live with at least one chronic disease. These diseases and associated comorbidities are now the leading causes of death in the United States. Effective management of complex chronic diseases requires body-wide, long-term, accurate, and continuous monitoring of multiple physiological signals from wearable devices to precisely determine the pathological state. These wearable physiological signal monitoring can dramatically reduce the demand of physician visiting and increase patients’ engagement and treatment adherence rate. Although wearable bioelectronic devices have shown huge potential in chronic disease management, existing technology still mostly relies on rigid chip components, where the interface between chips and skin/tissue has been a bottleneck that limits the system performance (noise, robustness etc). To address these challenges, my research has been involved in the exploration of rational system design concepts, material and device fabrication innovation, and tailored algorithms to enable smart wearable electronics that targets next-generation chronic disease management. Here I would like to discuss two of my developed technology platforms to elaborate the concept of smart wearables. First, I will describe a body area sensor network technology platform. In the system design concept side, this technology utilizes a novel wireless hybridization strategy and an unconventional detuned RFID working regime that provide an ideal skin interface. In the material/device side, this system integrates several skin-conforming polymer-based soft devices (ring oscillators, RF diodes, antennas, transistors etc.) as an integrated soft multimode sensing sticker. (1,2) Next, I will describe a wireless closed-loop smart bandage that can accelerate and monitor the wound healing process. (3) Such smart bandage also integrates new design concepts (wireless, battery-free design that combines both sensing and stimulation), novel materials (low-impedance, high-toughness, and tunable adhesion hydrogel as skin interface) and closed-loop control algorithms. Overall, the developed technology platform could assess multiple health outcomes and treatment responses to various chronic diseases. Ultimately, this technology will help to reduce chronic disease burden, lower medical costs, and provide a better quality of life for patients. References: 1. “A Wireless Body Area Sensor Network System Based on Stretchable Passive Tags”. Nature Electronics 2019, 2, 361. 2. “High-Frequency and Intrinsically Stretchable Polymer Diodes”. Nature 2021, 600, 246-252. 3. “Wireless, closed-loop, smart bandage with integrated sensors and stimulators for advanced wound care and accelerated healing”. Nature Biotechnology 2022, DOI: 10.1038/s41587-022-01528-3.
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Colda, Cosmin, Gheorghe Marc, Sorin Burian, and Marius Darie. "Using FPGA reconfigurable integrated circuits for monitoring, controlling and managing industrial processes in potentially explosive atmospheres." MATEC Web of Conferences 354 (2022): 00039. http://dx.doi.org/10.1051/matecconf/202235400039.
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The implementation of calculation architectures, data acquisition and processing systems, VLSI type integrated circuits within driving systems shows and increased trend in the industry, due to the advantages of such circuits compared to microcontrollers and ASIC’s. In the first part of the paper is presented functional aspects of reconfigurable integrated circuits for monitoring, controlling and managing industrial processes. Compact RIO is a device developed by National Instruments and which is intended for monitoring and controlling industrial processes. This is also an “embedded” type system, which comprises a FPGA device, a processor with real-time operating system (RTOS) and various input-output modules which have to be attached by the user. Applications using such devices, usually also use an HMI (human machine interface) for creating a graphical interface with the user. The second part of the paper is allocated for establishing the requirements for using of such system in the explosive atmospheres. The practical achievement consists in the construction of a wirelessly PC-controlled robot and the analysis of measurements achieved, respectively data acquired from sensors and video recordings. Among conclusions is highlighted the opportunities brought by the use of the intrinsic safety and flame proof types of protection.
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Young, R. A. R., David T. Clark, Jennifer D. Cormack, A. E. Murphy, Dave A. Smith, Robin F. Thompson, Ewan P. Ramsay, and S. Finney. "High Temperature Digital and Analogue Integrated Circuits in Silicon Carbide." Materials Science Forum 740-742 (January 2013): 1065–68. http://dx.doi.org/10.4028/www.scientific.net/msf.740-742.1065.
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Silicon Carbide devices are capable of operating as a semiconductor at high temperatures and this capability is being exploited today in discrete power components, bringing system advantages such as reduced cooling requirements [1]. Therefore there is an emerging need for control ICs mounted on the same modules and being capable of operating at the same temperatures. In addition, several application areas are pushing electronics to higher temperatures, particularly sensors and interface devices required for aero engines and in deep hydrocarbon and geothermal drilling. This paper discusses a developing CMOS manufacturing process using a 4H SiC substrate, which has been used to fabricate a range of simple logic and analogue circuits and is intended for power control and mixed signal sensor interface applications [2]. Test circuits have been found to operate at up to 400°C. The introduction of a floating capacitor structure to the process allows the use of switched capacitor techniques in mixed signal circuits operating over an extended temperature range.
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Schevelev, S. S. "Reconfigurable Modular Computing System." Proceedings of the Southwest State University 23, no. 2 (July 9, 2019): 137–52. http://dx.doi.org/10.21869/2223-1560-2019-23-2-137-152.
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Purpose of research. A reconfigurable computer system consists of a computing system and special-purpose computers that are used to solve the tasks of vector and matrix algebra, pattern recognition. There are distinctions between matrix and associative systems, neural networks. Matrix computing systems comprise a set of processor units connected through a switching device with multi-module memory. They are designed to solve vector, matrix and data array problems. Associative systems contain a large number of operating devices that can simultaneously process multiple data streams. Neural networks and neurocomputers have high performance when solving problems of expert systems, pattern recognition due to parallel processing of a neural network.Methods. An information graph of the computational process of a reconfigurable modular system was plotted. Structural and functional schemes, algorithms that implement the construction of specialized modules for performing arithmetic and logical operations, search operations and functions for replacing occurrences in processed words were developed. Software for modelling the operation of the arithmetic-symbol processor, specialized computing modules, and switching systems was developed.Results. A block diagram of a reconfigurable computing modular system was developed. The system consists of compatible functional modules and is capable of static and dynamic reconfiguration, has a parallel connection structure of the processor and computing modules through the use of interface channels. It consists of an arithmeticsymbol processor, specialized computing modules and switching systems; it performs specific tasks of symbolic information processing, arithmetic and logical operations.Conclusion. Systems with a reconfigurable structure are high-performance and highly reliable computing systems that consist of integrated processors in multi-machine and multiprocessor systems. Reconfigurability of the structure provides high system performance due to its adaptation to computational processes and the composition of the processed tasks.
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Kastalskiy, Innokentiy, Vasily Mironov, Sergey Lobov, Nadia Krilova, Alexey Pimashkin, and Victor Kazantsev. "A Neuromuscular Interface for Robotic Devices Control." Computational and Mathematical Methods in Medicine 2018 (July 22, 2018): 1–8. http://dx.doi.org/10.1155/2018/8948145.
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A neuromuscular interface (NI) that can be employed to operate external robotic devices (RD), including commercial ones, was proposed. Multichannel electromyographic (EMG) signal is used in the control loop. Control signal can also be supplemented with electroencephalography (EEG), limb kinematics, or other modalities. The multiple electrode approach takes advantage of the massive resources of the human brain for solving nontrivial tasks, such as movement coordination. Multilayer artificial neural network was used for feature classification and further to provide command and/or proportional control of three robotic devices. The possibility of using biofeedback can compensate for control errors and implement a fundamentally important feature that has previously limited the development of intelligent exoskeletons, prostheses, and other medical devices. The control system can be integrated with wearable electronics. Examples of technical devices under control of the neuromuscular interface (NI) are presented.
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Joseph Michael Jerard, V., M. Thilagaraj, K. Pandiaraj, M. Easwaran, Petchinathan Govindan, and V. Elamaran. "Reconfigurable Architectures with High-Frequency Noise Suppression for Wearable ECG Devices." Journal of Healthcare Engineering 2021 (December 22, 2021): 1–12. http://dx.doi.org/10.1155/2021/1552641.
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Recent advances in electronics and microelectronics have aided the development of low-cost devices that are widely used as well-being or preventive monitoring devices by many people. Remote health monitoring, which includes wearable sensors, actuators, and modern communication and information systems, offers effective programs that allow people to live peacefully in their own homes while also being protected in some way. High-frequency noise, power-line interface, and baseline drift are prevalent during the data-acquisition system of an ECG signal, and they can limit signal understanding. They (noises) must be isolated in order to provide an appropriate diagnostic of the patient. When removing high-frequency components (noise) from an ECG signal with an FIR filter, the critical path delay increases considerably as the filter's duration increases. To reduce high-frequency noise, simple moving average filters with pipelining and look-ahead transformation techniques are extensively used in this study. With the use of pipelining and look-ahead techniques, the only objective is to increase the clock speed of the designs. The moving average filters (conventional and proposed) were created on an Altera Cyclone IV FPGA EP4CE115F29C7 chip using the Quartus II software v13.1 tool. Finally, performance metrics such logic elements, clock speed, and power consumption were compared and studied thoroughly. The recursive pipelined 8-tap MA filter with look-ahead approach outperforms the other designs (685.48 MHz) in this investigation.
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Ahmed, Zayed, Charles Duruaku, Fatemeh Edalatfar, Mehrdad Moallem, and Behraad Bahreyni. "A Low-Noise Micromachined Accelerometer with Reconfigurable Electrodes for Resonance Suppression." Micromachines 14, no. 6 (June 2, 2023): 1188. http://dx.doi.org/10.3390/mi14061188.
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We present a high-performance capacitive accelerometer with a sub-µg noise limit and 1.2 kHz bandwidth for particle acceleration detection applications. The low noise of the accelerometer is achieved through a combination of device design optimization and operation under vacuum to reduce the effects of air damping. Operation under vacuum, however, causes amplification of signals around the resonance region, potentially resulting in incapacitating it through saturation of interface electronics or nonlinearities and even damage. The device has thus been designed with two sets of electrodes for high and low electrostatic coupling efficiency. During normal operation, the open-loop device utilizes its high-sensitivity electrodes to provide the best resolution. When a strong signal near resonance is detected, the electrodes with low sensitivity are used for signal monitoring, while the high-sensitivity electrodes are used to apply feedback signals efficiently. A closed-loop electrostatic feedback control architecture is designed to counteract the large displacements of the proof mass near resonance frequency. Therefore, the ability to reconfigure electrodes lets the device be used in high-sensitivity or high-resiliency modes. Several experiments were conducted with DC and AC excitation at different frequencies to verify the effectiveness of the control strategy. The results showed a ten-fold reduction of displacement at resonance in the closed-loop arrangement compared to the open-loop system with a quality factor of 120.
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Falkner, A. H. "The Measurement of Force and Torque Using Capacitor Devices." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 206, no. 6 (November 1992): 385–90. http://dx.doi.org/10.1243/pime_proc_1992_206_145_02.
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This paper concerns the use of electrical capacity in the measurement of force and torque as an alternative to conventional strain gauges. It has been established that for some requirements mechanical configurations can be designed with integrated capacitor bridges which combine a good performance with low cost and compactness. Simple electronic circuitry incorporating multiplexing has been developed and used to drive multi-axis devices. Examples include a configuration for measuring the three torques at a point. Work on an integrated circuit shows the possibility of positioning the electronics within a device with a serial digital interface to a host computer.
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Granado Cardoso, Luís, Clara Gaspar, João Viana Barbosa, Federico Alessio, Beat Jost, Niko Neufeld, Markus Frank, Rainer Schwemmer, and Paolo Durante. "Integration of custom DAQ Electronics in a SCADA Framework." EPJ Web of Conferences 245 (2020): 01016. http://dx.doi.org/10.1051/epjconf/202024501016.
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LHCb is one of the 4 experiments at the LHC accelerator at CERN. During the upgrade phase of the experiment, several new electronic boards and Front End chips that perform the data acquisition for the experiment will be added by the different sub-detectors. These new devices will be controlled and monitored via a system composed of GigaBit Transceiver (GBT) chips that manage the bi-directional slow control traffic to the Slow Control Adapter(s) (SCA) chips. The SCA chips provide multiple field buses to interface the new electronics devices (I2C, GPIO, etc). These devices will need to be integrated in the Experiment Control System (ECS) that drives LHCb. A set of tools was developed that provide an easy integration of the control and monitoring of the devices in the ECS. A server (GbtServ) provides the low level communication layer with the devices via the several user buses in the GBT-SCA chip and exposes an interface for control to the experiment SCADA (WinCC OA), the fwGbt component provides the interface between the SCADA and the GbtServ and the fwHw component, a tool that allows the abstraction of the devices models into the ECS. Using the graphical User Interfaces or XML files describing the structure and registers of the devices it creates the necessary model of the hardware as a data structure in the SCADA. It allows then the control and monitoring of the defined registers using their name, without the need to know the details of the hardware behind. The fwHw tool also provides the facility of defining and applying recipes named sets of configurations which can be used to easily configure the hardware according to specific needs.
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D, Dr Kavitha, Manoj Kumar J, Suriya Mu, and Dr Anitha D. "Increasing the effectiveness of ‘Power Electronics’ classes using a supplementary web-based virtual laboratory setup to impart CDIO skills." Journal of Engineering Education Transformations 37, IS2 (January 1, 2024): 1–7. http://dx.doi.org/10.16920/jeet/2024/v37is2/24017.
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Abstract: Power electronics is an engineering field dealing with the control and conversion of electrical energy. Many institutions are using CDIO (Conceive/Design/Implement/Operate) framework for their curricular planning and outcome-based assessment which demands huge self-learning. A virtual laboratory is an online platform allowing users to conduct simulations in a digital environment to improve self-learning. In this work, a virtual laboratory which provides an interactive platform for students to learn and experiment with power electronics circuits and devices, without the need for physical equipment is developed. The laboratory consists of a web-based interface that simulates the behaviour of different power electronics circuits. Learners can select different components and parameters to build and test circuits, and observe the results in real-time. The virtual laboratory also provides access to various measurement tools to analyse the behaviour of the circuits. The virtual laboratory has been designed to provide a user-friendly and intuitive interface, with detailed instructions and feedback to support students' learning. The laboratory has been integrated into a power electronics course. Feedback is collected through surveys from a total of 75 students including open ended questions and Likert responses. The learning of two set of students with and without using virtual lab before doing physical experimentation are assessed using a descriptive test. CDIO components analysis is done with the results of Mini projects developed by the students. The results indicate that the virtual laboratory provides a valuable and engaging learning experience and improves learning. Keywords: Virtual laboratory, Online, Simulation, Experimentation, Power Electronics, Analysis, Education
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Ferreira de Lima, Thomas, Bhavin J. Shastri, Alexander N. Tait, Mitchell A. Nahmias, and Paul R. Prucnal. "Progress in neuromorphic photonics." Nanophotonics 6, no. 3 (March 11, 2017): 577–99. http://dx.doi.org/10.1515/nanoph-2016-0139.
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AbstractAs society’s appetite for information continues to grow, so does our need to process this information with increasing speed and versatility. Many believe that the one-size-fits-all solution of digital electronics is becoming a limiting factor in certain areas such as data links, cognitive radio, and ultrafast control. Analog photonic devices have found relatively simple signal processing niches where electronics can no longer provide sufficient speed and reconfigurability. Recently, the landscape for commercially manufacturable photonic chips has been changing rapidly and now promises to achieve economies of scale previously enjoyed solely by microelectronics. By bridging the mathematical prowess of artificial neural networks to the underlying physics of optoelectronic devices, neuromorphic photonics could breach new domains of information processing demanding significant complexity, low cost, and unmatched speed. In this article, we review the progress in neuromorphic photonics, focusing on photonic integrated devices. The challenges and design rules for optoelectronic instantiation of artificial neurons are presented. The proposed photonic architecture revolves around the processing network node composed of two parts: a nonlinear element and a network interface. We then survey excitable lasers in the recent literature as candidates for the nonlinear node and microring-resonator weight banks as the network interface. Finally, we compare metrics between neuromorphic electronics and neuromorphic photonics and discuss potential applications.
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Pérez, Daniel, Ivana Gasulla, and José Capmany. "Programmable multifunctional integrated nanophotonics." Nanophotonics 7, no. 8 (July 28, 2018): 1351–71. http://dx.doi.org/10.1515/nanoph-2018-0051.
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AbstractProgrammable multifunctional integrated nanophotonics (PMIN) is a new paradigm that aims at designing common integrated optical hardware configurations, which by suitable programming can implement a variety of functionalities that can be elaborated for basic or more complex operations in many application fields. The interest in PMIN is driven by the surge of a considerable number of emerging applications in the fields of telecommunications, quantum information processing, sensing and neurophotonics that will be calling for flexible, reconfigurable, low-cost, compact and low-power-consuming devices, much in the same way as how field programmable gate array (FPGA) devices operate in electronics. The success of PMIN relies on the research into suitable interconnection hardware architectures that can offer a very high spatial regularity as well as the possibility of independently setting (with a very low power consumption) the interconnection state of each connecting element. Integrated waveguide meshes provide regular and periodic geometries, formed by replicating a unit cell, which can take the form of a square, hexagon or triangle, among other configurations. Each side of the cell is formed by two integrated waveguides connected by means of a Mach-Zehnder interferometer (MZI) or a tunable directional coupler that can be operated by means of an output control signal as a crossbar switch or as a variable coupler with independent power division ratio and phase shift. In this paper, we review the recent advances reported in the field of PMIN and, especially, in those based on integrated photonic waveguide meshes, both from the theoretical as well as from the experimental point of view. We pay special attention to outlining the design principles, material platforms, synthesis algorithms and practical constraints of these structures and discuss their applicability to different fields.
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Narayanan, S., Heath A. Ruff, Narasimha Rao Edala, Jonathan A. Geist, Kiran Kumar Patchigolla, Mark Draper, and Mike Haass. "Human-Integrated Supervisory Control of Uninhabited Combat Aerial Vehicles." Journal of Robotics and Mechatronics 12, no. 6 (December 20, 2000): 628–39. http://dx.doi.org/10.20965/jrm.2000.p0628.
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Uninhabited aerial vehicles are aircraft without the onboard presence of pilot or aircrew. Even though the human is removed from the direct control of the aircraft, the human is typically involved in the process as a supervisor in a multiple task telerobotics control system. The supervisor must receive the appropriate information for efficient decision making and input the information required to augment the autonomous control of the vehicle as necessary. This article presents an approach that applies human operator modeling methods to perform semiotic analysis and identifies the content and form of the information required for effective supervisory control. This paper also outlines a computational modeling and simulation architecture that supports concurrent multi-user connectivity and reconfigurable user interfaces. The potential utilization of this architecture to systematically evaluate interface concepts and the role of automation in these systems is also described. Finally, an empirical evaluation is described that benchmarks the effectiveness of the architecture.Human-Integrated Supervisory Control of Uninhabited Combat Aerial Vehicles.
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Pander, Adam, Hiroshi Hamada, and Hideyuki Nosaka. "Excitation of resonances in planar metamaterials at a two-layer dielectric interface for substrate integrated electronics." Physics Letters A 409 (September 2021): 127523. http://dx.doi.org/10.1016/j.physleta.2021.127523.
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Dusmez, Serkan, and Alireza Khaligh. "A Charge-Nonlinear-Carrier-Controlled Reduced-Part Single-Stage Integrated Power Electronics Interface for Automotive Applications." IEEE Transactions on Vehicular Technology 63, no. 3 (March 2014): 1091–103. http://dx.doi.org/10.1109/tvt.2013.2284592.
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Bjune, Caroline K., Thomas F. Marinis, Tirunelveli S. Sriram, Jeanne M. Brady, James Moran, Philip D. Parks, Alik S. Widge, Darin D. Dougherty, and Emad N. Eskandar. "Packaging Architecture for an Implanted System that Monitors Brain Activity and Applies Therapeutic Stimulation." Journal of Microelectronics and Electronic Packaging 13, no. 2 (April 1, 2016): 64–70. http://dx.doi.org/10.4071/imaps.499.
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Deep brain stimulation therapies for Parkinson's disease utilize hardware that, from a packaging perspective, resembles those that are used in cardiac pacemakers. A hermetic package that contains stimulation electronics and a primary battery supply is implanted under the scalp into a recess formed in the skull. Stimulation probes, each with up to four electrodes, are inserted into the brain and connected to the electronics package via a plug and cable system. Unlike single-target devices such as cochlear implants and pacemakers, achieving this type of neuropsychiatric therapy requires the ability to record and stimulate in multiple and distributive areas of the brain, both cortical and subcortical. By contrast, the closed-loop neural stimulator being developed under the DARPA SUBNETS program utilizes probes, each of which carries up to 64 electrodes that can be switched between recording and stimulation functions. This capability necessitates locating low-noise amplifiers, switching and communication electronics in close proximity to each probe site. Each of these satellite electronics packages requires 10 electrical connections to the hub package, which significantly increases the complexity of the interconnect system relative to the current practice. The power requirements of this system preclude the use of a primary battery supply, so a large lithium ion battery is used, with a recharging coil and electronics. The hub system is composed of a connector header, electronics package, and battery pack that are fabricated separately and are interconnected by a flex circuit board, to allow it to conform to the skull for implanting. The standardized feedthrough substrate on the satellite, which can interface with multiple types of electrodes, along the system being reconfigurable, enables our architecture to support this new clinical research. It also allows the clinician to select satellite-electrode system based on a patient's needs, thus providing a customized, patient-specific therapeutic system. In this article, we have described the various packaging components of this system and the design considerations that drove our technology choices.
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Croitorescu, V., B. Duran, and L. Giurca. "The design and development of an Integrated Propulsion System – Phase 2: the functional electric behaviour strategy." IOP Conference Series: Materials Science and Engineering 1303, no. 1 (March 1, 2024): 012010. http://dx.doi.org/10.1088/1757-899x/1303/1/012010.
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Abstract The paper presents the integrated propulsion system implementation steps on a L6E road vehicle. The implementation followed several technical levels which are properly described within the paper. The functional behaviour in terms of electric propulsion was defined and developed. All the dedicated components were investigated, set and customized, to equip a L6E vehicle. Currently the electric machine, the battery pack, the user interface, the speedometer, the pedals, the power electronics etc. are implemented on a real existing L6E road vehicle, after they were defined and virtually tested.
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Hafting, Finn K., Daniel Kulas, Etienne Michels, Sarvada Chipkar, Stefan Wisniewski, David Shonnard, and Joshua M. Pearce. "Modular Open-Source Design of Pyrolysis Reactor Monitoring and Control Electronics." Electronics 12, no. 24 (December 5, 2023): 4893. http://dx.doi.org/10.3390/electronics12244893.
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Industrial pilot projects often rely on proprietary and expensive electronic hardware to control and monitor experiments. This raises costs and retards innovation. Open-source hardware tools exist for implementing these processes individually; however, they are not easily integrated with other designs. The Broadly Reconfigurable and Expandable Automation Device (BREAD) is a framework that provides many open-source devices which can be connected to create more complex data acquisition and control systems. This article explores the feasibility of using BREAD plug-and-play open hardware to quickly design and test monitoring and control electronics for an industrial materials processing prototype pyrolysis reactor. Generally, pilot-scale pyrolysis plants are expensive custom designed systems. The plug-and-play prototype approach was first tested by connecting it to the pyrolysis reactor and ensuring that it can measure temperature and actuate heaters and a stirring motor. Next, a single circuit board system was created and tested using the designs from the BREAD prototype to reduce the number of microcontrollers required. Both open-source control systems were capable of reliably running the pyrolysis reactor continuously, achieving equivalent performance to a state-of-the-art commercial controller with a ten-fold reduction in the overall cost of control. Open-source, plug-and-play hardware provides a reliable avenue for researchers to quickly develop data acquisition and control electronics for industrial-scale experiments.
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Herrer, Lucía, Santiago Martín, and Pilar Cea. "Nanofabrication Techniques in Large-Area Molecular Electronic Devices." Applied Sciences 10, no. 17 (September 1, 2020): 6064. http://dx.doi.org/10.3390/app10176064.
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The societal impact of the electronics industry is enormous—not to mention how this industry impinges on the global economy. The foreseen limits of the current technology—technical, economic, and sustainability issues—open the door to the search for successor technologies. In this context, molecular electronics has emerged as a promising candidate that, at least in the short-term, will not likely replace our silicon-based electronics, but improve its performance through a nascent hybrid technology. Such technology will take advantage of both the small dimensions of the molecules and new functionalities resulting from the quantum effects that govern the properties at the molecular scale. An optimization of interface engineering and integration of molecules to form densely integrated individually addressable arrays of molecules are two crucial aspects in the molecular electronics field. These challenges should be met to establish the bridge between organic functional materials and hard electronics required for the incorporation of such hybrid technology in the market. In this review, the most advanced methods for fabricating large-area molecular electronic devices are presented, highlighting their advantages and limitations. Special emphasis is focused on bottom-up methodologies for the fabrication of well-ordered and tightly-packed monolayers onto the bottom electrode, followed by a description of the top-contact deposition methods so far used.
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Wang, Xuan Yang, Huan Liu, Rui Lei, and Wei Guo Liu. "Intermediate Layer Bonding for Silicon and Piezoelectric on UV Adhesive." Key Engineering Materials 645-646 (May 2015): 86–91. http://dx.doi.org/10.4028/www.scientific.net/kem.645-646.86.
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During making the surface acoustic wave devices and integrated circuit hybrid integrated electronics, it needs to put the piezoelectric crystal and silicon wafer bonding together. By selecting a certain wavelengths of UV curing adhesive, then exposing with 300-436nm wavelength of exposure machine, 8mm×8mm bonding chips are got. Bonding LiNbO3, quartz and silicon wafer respectively, measured maximum shear force is 116.2 N and 117.9 N with shear force test machine. The fracture energy is 5.831 J/m2measured by crack-opening method test LiNbO3 bonding chips. The results show that piezoelectric crystal and silicon wafer bonding interface level off and the bonding of the middle layer thickness for about 3 microns observed the bonding section with SEM.
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Ku, Pin-Sung, Kunpeng Huang, Nancy Wang, Boaz Ng, Alicia Chu, and Hsin-Liu Cindy Kao. "SkinLink." Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies 7, no. 2 (June 12, 2023): 1–27. http://dx.doi.org/10.1145/3596241.
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Applying customized epidermal electronics closely onto the human skin offers the potential for biometric sensing and unique, always-available on-skin interactions. However, iterating designs of an on-skin interface from schematics to physical circuit wiring can be time-consuming, even with tiny modifications; it is also challenging to preserve skin wearability after repeated alteration. We present SkinLink, a reconfigurable on-skin fabrication approach that allows users to intuitively explore and experiment with the circuitry adjustment on the body. We demonstrate SkinLink with a customized on-skin prototyping toolkit comprising tiny distributed circuit modules and a variety of streamlined trace modules that adapt to diverse body surfaces. To evaluate SkinLink's performance, we conducted a 14-participant usability study to compare and contrast the workflows with a benchmark on-skin construction toolkit. Four case studies targeting a film makeup artist, two beauty makeup artists, and a wearable computing designer further demonstrate different application scenarios and usages.
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Pradeepkumar, Aiswarya, D. Kurt Gaskill, and Francesca Iacopi. "Electronic and Transport Properties of Epitaxial Graphene on SiC and 3C-SiC/Si: A Review." Applied Sciences 10, no. 12 (June 24, 2020): 4350. http://dx.doi.org/10.3390/app10124350.
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The electronic and transport properties of epitaxial graphene are dominated by the interactions the material makes with its surroundings. Based on the transport properties of epitaxial graphene on SiC and 3C-SiC/Si substrates reported in the literature, we emphasize that the graphene interfaces formed between the active material and its environment are of paramount importance, and how interface modifications enable the fine-tuning of the transport properties of graphene. This review provides a renewed attention on the understanding and engineering of epitaxial graphene interfaces for integrated electronics and photonics applications.
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Shevelev, S. S. "RECONFIGURABLE COMPUTING MODULAR SYSTEM." Radio Electronics, Computer Science, Control 1, no. 1 (March 31, 2021): 194–207. http://dx.doi.org/10.15588/1607-3274-2021-1-19.
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Context. Modern general purpose computers are capable of implementing any algorithm, but when solving certain problems in terms of processing speed they cannot compete with specialized computing modules. Specialized devices have high performance, effectively solve the problems of processing arrays, artificial intelligence tasks, and are used as control devices. The use of specialized microprocessor modules that implement the processing of character strings, logical and numerical values, represented as integers and real numbers, makes it possible to increase the speed of performing arithmetic operations by using parallelism in data processing.
Objective. To develop principles for constructing microprocessor modules for a modular computing system with a reconfigurable structure, an arithmetic-symbolic processor, specialized computing devices, switching systems capable of configuring microprocessors and specialized computing modules into a multi-pipeline structure to increase the speed of performing arithmetic and logical operations, high-speed design algorithms specialized processors-accelerators of symbol processing. To develop algorithms, structural and functional diagrams of specialized mathematical modules that perform arithmetic operations in direct codes on neural-like elements and systems for decentralized control of the operation of blocks.
Method. An information graph of the computational process of a modular system with a reconstructed structure has been built. Structural and functional diagrams, algorithms that implement the construction of specialized modules for performing arithmetic and logical operations, search operations and functions for replacing occurrences in processed words have been developed. Software has been developed for simulating the operation of an arithmetic-symbolic processor, specialized computing modules, and switching systems.
Results. A block diagram of a reconfigurable computing modular system has been developed, which consists of compatible functional modules, it is capable of static and dynamic reconfiguration, has a parallel structure for connecting the processor and computing modules through the use of interface channels. The system consists of an arithmetic-symbolic processor, specialized computing modules and switching systems, performs specific tasks of symbolic information processing, arithmetic and logical operations.
Conclusions. The architecture of reconfigurable computing systems can change dynamically during their operation. It becomes possible to adapt the architecture of a computing system to the structure of the problem being solved, to create problem-oriented computers, the structure of which corresponds to the structure of the problem being solved. As the main computing element in reconfigurable computing systems, not universal microprocessors are used, but programmable logic integrated circuits, which are combined using high-speed interfaces into a single computing field. Reconfigurable multipipeline computing systems based on fields are an effective tool for solving streaming information processing and control problems.
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Bais, Badariah, Liang Wen Loh, Rosminazuin A. Rahim, and Majlis Burhanuddin Yeop. "Optimization of On-Chip Interface Circuit for MEMS Sensor Based on Micro-Cantilever." Advanced Materials Research 254 (May 2011): 13–16. http://dx.doi.org/10.4028/www.scientific.net/amr.254.13.
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Micro-cantilever has been proven as an outstanding platform for extremely sensitive chemical and biological sensors. MEMS cantilever-based sensor is becoming popular due to its high sensitivity, high selectivity, easy to fabricate and can be easily integrated with on-chip electronics circuitry. However, the interface circuit used in this kind of sensors typically has a very low resolution and this limits its capability in sensing the small signal generated by the micro-cantilever. One solution is by incorporating stress concentration regions (SCR) on the micro-cantilever which were found to improve the sensitivity of the sensor. This project will focus on optimizing the sensitivity of the micro-cantilever by modeling the micro-cantilever with the SCR technique. The model is then be verified by numerical simulations.