Journal articles on the topic 'In-Mold Electronics'
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Beltrão, Mariana, Fernando M. Duarte, Júlio C. Viana, and Vitor Paulo. "A review on in‐mold electronics technology." Polymer Engineering & Science 62, no. 4 (February 11, 2022): 967–90. http://dx.doi.org/10.1002/pen.25918.
Full textMadadnia, Behnam, Jan Vanfleteren, and Frederick Bossuyt. "Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics." Micromachines 14, no. 12 (December 16, 2023): 2248. http://dx.doi.org/10.3390/mi14122248.
Full textSrinivasan, KP, and T. Muthuramalingam. "In-depth scrutinization of In- Mold Electronics for Automotive applications." Journal of Physics: Conference Series 1969, no. 1 (July 1, 2021): 012064. http://dx.doi.org/10.1088/1742-6596/1969/1/012064.
Full textHoldford, Becky, and Roger Stierman. "What “Green” Means: Challenges for Failure Analysis." EDFA Technical Articles 8, no. 4 (November 1, 2006): 12–14. http://dx.doi.org/10.31399/asm.edfa.2006-4.p012.
Full textMorishige, Koichi. "Special Issue on Dies and Molds." International Journal of Automation Technology 2, no. 6 (November 5, 2008): 417. http://dx.doi.org/10.20965/ijat.2008.p0417.
Full textRusyana, Mohammad Purwa, and Rizky Maulana. "PENGARUH REKONDISI MOLD TYPE-2186 TERHADAP PENINGKATAN PRODUKTIVITAS DAN KUALITAS HASIL PRODUKSI." Jurnal Permadi: Perancangan, Manufaktur, Material dan Energi 3, no. 1 (January 29, 2021): 54–62. http://dx.doi.org/10.52005/permadi.v3i1.47.
Full textAnzai, Masahiro. "Special Issue on Die and Mold Technology." International Journal of Automation Technology 4, no. 5 (September 5, 2010): 414. http://dx.doi.org/10.20965/ijat.2010.p0414.
Full textChen, Feng Jun, Shao Hui Yin, Jian Wu Yu, Ke Jun Zhu, and Yu Wang. "Ultra-Precision Fabrication of Small-Size Aspherical Glass Lens Mold." Key Engineering Materials 487 (July 2011): 29–33. http://dx.doi.org/10.4028/www.scientific.net/kem.487.29.
Full textZhang, Sam, Xianting Zeng, Zhenggui Tang, and Ming Jen Tan. "EXPLORING THE ANTISTICKING PROPERTIES OF SOLID LUBRICANT THIN FILMS IN TRANSFER MOLDING." International Journal of Modern Physics B 16, no. 06n07 (March 20, 2002): 1080–85. http://dx.doi.org/10.1142/s0217979202010890.
Full textHwang, Chul Jin, Y. B. Ko, Hyung Pil Park, S. T. Chung, and Byung Ohk Rhee. "Development of Dental Scaler Tip Mold with Powder Injection Molding Process." Materials Science Forum 534-536 (January 2007): 345–48. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.345.
Full textZhao, Zhong Li, Hai Peng Yu, Da Ming Wu, Ying Liu, Xiu Ting Zheng, Jian Zhuang, and Peng Sheng Jing. "Research on the Key Technology in Ultra-Precision Machining of Optical Micro V-Groove Mold Roller." Advanced Materials Research 712-715 (June 2013): 1563–67. http://dx.doi.org/10.4028/www.scientific.net/amr.712-715.1563.
Full textSulong, Abu Bakar, Gan Tek Keong, and Jaafar Sahari. "Effects of Molding Parameters and Addition of Fillers on Gate Chip Off Formation during the Degating Process in Transfer Molding." Key Engineering Materials 447-448 (September 2010): 790–94. http://dx.doi.org/10.4028/www.scientific.net/kem.447-448.790.
Full textShearer, Catherine. "Transient Liquid Phase Sintering Pastes in Heterogeneous Integration." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (January 1, 2017): 1–26. http://dx.doi.org/10.4071/2017dpc-wp1_presentation5.
Full textLiu, Xiangyang, Derek Li, Hiroshi Fukutani, Paul Trudeau, LoleÏ Khoun, Olga Mozenson, Kathleen L. Sampson, et al. "UV‐Sinterable Silver Oxalate‐Based Molecular Inks and Their Application for In‐Mold Electronics." Advanced Electronic Materials 7, no. 9 (July 18, 2021): 2100194. http://dx.doi.org/10.1002/aelm.202100194.
Full textAnzai, Masahiro. "Special Issue on Die and Mold Technology." International Journal of Automation Technology 6, no. 4 (July 5, 2012): 521. http://dx.doi.org/10.20965/ijat.2012.p0521.
Full textHubmann, Martin, Behnam Madadnia, Jonas Groten, Martin Pletz, Jan Vanfleteren, Barbara Stadlober, Frederick Bossuyt, Jatinder Kaur, and Thomas Lucyshyn. "Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion." Polymers 14, no. 23 (November 22, 2022): 5060. http://dx.doi.org/10.3390/polym14235060.
Full textUllah, Misbah, Nicolò Maria Ippolito, Loredana Spera, and Francesco Vegliò. "Treatment of wastewater produced during the hydrometallurgical extraction of silver from in-mold structural electronics." Case Studies in Chemical and Environmental Engineering 10 (December 2024): 100916. http://dx.doi.org/10.1016/j.cscee.2024.100916.
Full textHopmann, Christian, Kirsten Bobzin, Tobias Brögelmann, Christian Schäfer, Maximilian Schöngart, Malte Röbig, and Mona Naderi. "Improved molding of micro structures using PVD-coated mold inserts." Journal of Polymer Engineering 36, no. 6 (August 1, 2016): 575–82. http://dx.doi.org/10.1515/polyeng-2015-0270.
Full textGong, Yao, Kyoung Je Cha, and Jang Min Park. "Deformation characteristics and resistance distribution in thermoforming of printed electrical circuits for in-mold electronics application." International Journal of Advanced Manufacturing Technology 108, no. 3 (May 2020): 749–58. http://dx.doi.org/10.1007/s00170-020-05377-9.
Full textGoto, Hiroshi. "Overview on Nanoimprint Technology - Process, Tools, Applications and Technical Issues for Industrialization." Key Engineering Materials 345-346 (August 2007): 1073–77. http://dx.doi.org/10.4028/www.scientific.net/kem.345-346.1073.
Full textPark, Keon Joo, Chae Won Kim, Min Jae Sung, Jiyoul Lee, and Young Tea Chun. "Semiconducting Polymer Nanowires with Highly Aligned Molecules for Polymer Field Effect Transistors." Electronics 11, no. 4 (February 18, 2022): 648. http://dx.doi.org/10.3390/electronics11040648.
Full textKhaliq, Amin, Muhammad Ahmad Kamran, and Myung Yung Jeong. "Nanoimprint Mold Consisting of an Adhesive Lap Joint between a Nanopatterned Metal Sleeve and a Carbon Composite Roll." Nanomaterials 13, no. 10 (May 20, 2023): 1685. http://dx.doi.org/10.3390/nano13101685.
Full textSyed-Khaja, Aarief, and Jörg Franke. "Design and Solder Process Optimization in MID Technology for High Power Applications." Advanced Materials Research 1038 (September 2014): 107–12. http://dx.doi.org/10.4028/www.scientific.net/amr.1038.107.
Full textLiu, Hang, Yan Xu, Kai Leung Yung, and Chun Lei Kang. "The Interface Behavior of Micro Overmolding." Advanced Materials Research 591-593 (November 2012): 896–99. http://dx.doi.org/10.4028/www.scientific.net/amr.591-593.896.
Full textLee, Sang Yoon, Seong Hyun Jang, Hyun Kyung Lee, Jong Sun Kim, SangKug Lee, Ho Jun Song, Jae Woong Jung, Eui Sang Yoo, and Jun Choi. "The development and investigation of highly stretchable conductive inks for 3-dimensional printed in-mold electronics." Organic Electronics 85 (October 2020): 105881. http://dx.doi.org/10.1016/j.orgel.2020.105881.
Full textZhan, Yujie, Liangui Deng, Wei Dai, Yongxue Qiu, Shicheng Sun, Dizhi Sun, Bowen Hu, and Jianguo Guan. "Fabrication of Large-Area Nanostructures Using Cross-Nanoimprint Strategy." Nanomaterials 14, no. 12 (June 8, 2024): 998. http://dx.doi.org/10.3390/nano14120998.
Full textChen, Yanyan, Shengfei Zhang, Shunchang Hu, Yangjing Zhao, Guojun Zhang, Yang Cao, and Wuyi Ming. "Study of Heat Transfer Strategy of Metal Heating/Conduction Plates for Energy Efficiency of Large-Sized Automotive Glass Molding Process." Metals 13, no. 7 (June 30, 2023): 1218. http://dx.doi.org/10.3390/met13071218.
Full textArafat Bagoes Setyawan, Muhammad Khaerudin, and Siti Setiawati. "Perancangan Aplikasi Enkripsi dan Dekripsi Gambar Cetak Biru Pada PT. Patco Elektronik Teknologi Menggunakan Algoritma RSA Berbasis Android." NUANSA INFORMATIKA 18, no. 2 (July 20, 2024): 19–25. http://dx.doi.org/10.25134/ilkom.v18i2.145.
Full textNodin, Muhamad Nor, and Mohd Sallehuddin Yusof. "A Preliminary Study of PDMS Stamp towards Flexography Printing Technique: An Overview." Advanced Materials Research 844 (November 2013): 201–4. http://dx.doi.org/10.4028/www.scientific.net/amr.844.201.
Full textPanneerselvam, Vivekanandan, and Faiz Mohd Turan. "Optimization of Process Parameters of Injection Moldings for Plastic Pallets Manufacturing Industry." Journal of Modern Manufacturing Systems and Technology 2 (March 26, 2019): 75–83. http://dx.doi.org/10.15282/jmmst.v2i1.1802.
Full textLombard, Ph, T. Gerges, J. Y. Charmeau, B. Allard, and M. Cabrera. "Procédé plastronique Electronique Structurelle Surmoulée (ESS, IME – In Mold Electronics) dans un projet de mise en œuvre pratique." J3eA 21 (2022): 1012. http://dx.doi.org/10.1051/j3ea/20221012.
Full textPham, Tuan Nghia. "Cooling channel design for improving quality of injection plastic product." TẠP CHÍ KHOA HỌC TRƯỜNG ĐẠI HỌC QUỐC TẾ HỒNG BÀNG 4 (June 24, 2023): 101–8. http://dx.doi.org/10.59294/hiujs.vol.4.2023.392.
Full textFurusawa, Takeshi, Naomi Kawamura, Toshiki Furutani, and Takashi Kariya. "Control of Package Warpage by Package Substrate Design for Low Profile Package-on-Package Structure." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000491–96. http://dx.doi.org/10.4071/isom-2012-tp65.
Full textUnno, Noriyuki, and Tapio Mäkelä. "Thermal Nanoimprint Lithography—A Review of the Process, Mold Fabrication, and Material." Nanomaterials 13, no. 14 (July 8, 2023): 2031. http://dx.doi.org/10.3390/nano13142031.
Full textHuda, Miftakul. "ANALISIS PERBAIKAN KUALITAS INJECTION PART DENGAN PENDEKATAN LEAN SIX SIGMA." EKOMABIS: Jurnal Ekonomi Manajemen Bisnis 1, no. 01 (January 21, 2020): 79–90. http://dx.doi.org/10.37366/ekomabis.v1i01.7.
Full textBasir, Al, Norhamidi Muhamad, Mohammad Fadhli Izuddin Mohd Nor, Muhammad Mohamed, and Nashrah Hani Jamadon. "Moldability and Solvent Debinding of Hydroxyapatite Micro-Part Processed through Micro-Powder Injection Molding." Jurnal Kejuruteraan 36, no. 2 (March 30, 2024): 399–405. http://dx.doi.org/10.17576/jkukm-2024-36(2)-01.
Full textLombard, Ph, H. Cauchy-Clerc, B. Allard, and M. Cabrera. "Etude de cas en plastronique IME – Alliance de la plasturgie et de l’électronique pour le packaging de systèmes 3D." J3eA 23 (2024): 1003. http://dx.doi.org/10.1051/j3ea/20241003.
Full textJin, Weikan, Zhiheng Yu, Guohong Hu, Hui Zhang, Fengli Huang, and Jinmei Gu. "Effects of Three-Dimensional Circular Truncated Cone Microstructures on the Performance of Flexible Pressure Sensors." Materials 15, no. 13 (July 5, 2022): 4708. http://dx.doi.org/10.3390/ma15134708.
Full textTSAI, HUNG-YIN, and CHIA-JEN TING. "LOW COST FABRICATION OF SUB-WAVELENGTH STRUCTURES ON LARGE-AREA POLYMER SHEET BY UV CURING AND NANO-IMPRINTING PROCESSES." Surface Review and Letters 17, no. 03 (June 2010): 345–51. http://dx.doi.org/10.1142/s0218625x10013977.
Full textRen, Dayang, Changzhong Wu, Qiuqi Sun, Shengqiang Wang, Jiaxin Tian, and Chengyu Wang. "Principle, application and development trend of dry ice cleaning hub fixture." E3S Web of Conferences 385 (2023): 04023. http://dx.doi.org/10.1051/e3sconf/202338504023.
Full textYan, Honghao, Jun Zhou, Chengyun Wang, Huaqiang Gong, Wu Liu, Weihong Cen, Guixin Yuan, and Yu Long. "3D printing of dual cross-linked hydrogel for fingerprint-like iontronic pressure sensor." Smart Materials and Structures 31, no. 1 (November 25, 2021): 015019. http://dx.doi.org/10.1088/1361-665x/ac383c.
Full textWang, Xuelin, Yi Ren, and Jing Liu. "Liquid Metal Enabled Electrobiology: A New Frontier to Tackle Disease Challenges." Micromachines 9, no. 7 (July 21, 2018): 360. http://dx.doi.org/10.3390/mi9070360.
Full textNagato, Keisuke, Yuki Yajima, and Masayuki Nakao. "Laser-Assisted Thermal Imprinting of Microlens Arrays—Effects of Pressing Pressure and Pattern Size." Materials 12, no. 4 (February 25, 2019): 675. http://dx.doi.org/10.3390/ma12040675.
Full textOta, Hiroki. "(Invited) Fabriations and Applications Using Liquid Metal Towards Stretchable Electronics." ECS Meeting Abstracts MA2023-02, no. 34 (December 22, 2023): 1672. http://dx.doi.org/10.1149/ma2023-02341672mtgabs.
Full textChang, Hanjui, Yue Sun, Shuzhou Lu, and Yuntao Lan. "Enhancing Brain–Computer Interfaces through Kriging-Based Fusion of Sparse Regression Partial Differential Equations to Counter Injection Molding View of Node Displacement Effects." Polymers 16, no. 17 (September 3, 2024): 2507. http://dx.doi.org/10.3390/polym16172507.
Full textDelplanque, Emilie, Antoine Aymard, Davy Dalmas, and Julien Scheibert. "Solving curing-protocol-dependent shape errors in PDMS replication." Journal of Micromechanics and Microengineering 32, no. 4 (March 9, 2022): 045006. http://dx.doi.org/10.1088/1361-6439/ac56ea.
Full textMadhavan, R. "High Performance Conductive Composites and E-skins with Large-scale Manufacturing for Wearable Electronic Sensor Systems." Journal of Modern Nanotechnology 4 (November 21, 2024): 5. http://dx.doi.org/10.53964/jmn.2024005.
Full textTokita, Masao. "Progress of Spark Plasma Sintering (SPS) Method, Systems, Ceramics Applications and Industrialization." Ceramics 4, no. 2 (April 25, 2021): 160–98. http://dx.doi.org/10.3390/ceramics4020014.
Full textChen, Chang Cheng, and Bo Heng Wu. "Numerical Investigation on Mini Internal Gear Forging Process." Key Engineering Materials 725 (December 2016): 560–65. http://dx.doi.org/10.4028/www.scientific.net/kem.725.560.
Full textSun, Chang Fu, Na Jun Wang, and Jian Guang Li. "Research on CNC Grinding Program of Overall End Milling Cutter." Key Engineering Materials 579-580 (September 2013): 122–27. http://dx.doi.org/10.4028/www.scientific.net/kem.579-580.122.
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