Academic literature on the topic 'In-Mold Electronics'
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Journal articles on the topic "In-Mold Electronics"
Beltrão, Mariana, Fernando M. Duarte, Júlio C. Viana, and Vitor Paulo. "A review on in‐mold electronics technology." Polymer Engineering & Science 62, no. 4 (February 11, 2022): 967–90. http://dx.doi.org/10.1002/pen.25918.
Full textMadadnia, Behnam, Jan Vanfleteren, and Frederick Bossuyt. "Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics." Micromachines 14, no. 12 (December 16, 2023): 2248. http://dx.doi.org/10.3390/mi14122248.
Full textSrinivasan, KP, and T. Muthuramalingam. "In-depth scrutinization of In- Mold Electronics for Automotive applications." Journal of Physics: Conference Series 1969, no. 1 (July 1, 2021): 012064. http://dx.doi.org/10.1088/1742-6596/1969/1/012064.
Full textHoldford, Becky, and Roger Stierman. "What “Green” Means: Challenges for Failure Analysis." EDFA Technical Articles 8, no. 4 (November 1, 2006): 12–14. http://dx.doi.org/10.31399/asm.edfa.2006-4.p012.
Full textMorishige, Koichi. "Special Issue on Dies and Molds." International Journal of Automation Technology 2, no. 6 (November 5, 2008): 417. http://dx.doi.org/10.20965/ijat.2008.p0417.
Full textRusyana, Mohammad Purwa, and Rizky Maulana. "PENGARUH REKONDISI MOLD TYPE-2186 TERHADAP PENINGKATAN PRODUKTIVITAS DAN KUALITAS HASIL PRODUKSI." Jurnal Permadi: Perancangan, Manufaktur, Material dan Energi 3, no. 1 (January 29, 2021): 54–62. http://dx.doi.org/10.52005/permadi.v3i1.47.
Full textAnzai, Masahiro. "Special Issue on Die and Mold Technology." International Journal of Automation Technology 4, no. 5 (September 5, 2010): 414. http://dx.doi.org/10.20965/ijat.2010.p0414.
Full textChen, Feng Jun, Shao Hui Yin, Jian Wu Yu, Ke Jun Zhu, and Yu Wang. "Ultra-Precision Fabrication of Small-Size Aspherical Glass Lens Mold." Key Engineering Materials 487 (July 2011): 29–33. http://dx.doi.org/10.4028/www.scientific.net/kem.487.29.
Full textZhang, Sam, Xianting Zeng, Zhenggui Tang, and Ming Jen Tan. "EXPLORING THE ANTISTICKING PROPERTIES OF SOLID LUBRICANT THIN FILMS IN TRANSFER MOLDING." International Journal of Modern Physics B 16, no. 06n07 (March 20, 2002): 1080–85. http://dx.doi.org/10.1142/s0217979202010890.
Full textHwang, Chul Jin, Y. B. Ko, Hyung Pil Park, S. T. Chung, and Byung Ohk Rhee. "Development of Dental Scaler Tip Mold with Powder Injection Molding Process." Materials Science Forum 534-536 (January 2007): 345–48. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.345.
Full textDissertations / Theses on the topic "In-Mold Electronics"
Guérin, Thomas. "Développement d'encres fonctionnelles pour l'In-Mold Electronics." Electronic Thesis or Diss., Lyon, INSA, 2024. http://www.theses.fr/2024ISAL0089.
Full textThis thesis explores the emerging field of 3D plastronics, which merges electronics and plastics engineering to integrate electronic circuits on 3D polymer substrates. The work focuses on the development of conductive inks for the In-Mold Electronics (IME) process, a promising technique for the high-volume production of plastronic devices, particularly for human-machine interfaces (HMIs). The IME process involves several steps: printing conductive tracks on a thin polycarbonate film using conductive ink, transferring the electronic components onto the film and connecting them to the circuit by bonding, thermoforming the film in 3D, and 3D overmolding by injection of thermoplastic. After a literature review on plastronics and IME, the thesis proposes the study of different formulations of conductive inks, focusing on those composed of an organic polymer matrix containing micrometric silver fillers. A methodology was set up to characterize the inks at each stage of the process, in terms of electrical resistivity, adhesion, stretching and shear under stress during the printing, thermoforming and overmolding stages. Polycarbonate was used as a reference material for the film and the overmolding material. Several conductive inks were developed from organic materials derived from petrochemicals or bio-based materials. From petro-based materials, we obtained low-resistivity inks (26 µΩ.cm) and with a high deformation capacity by thermoforming. From bio-based materials, new organic matrices were formulated to obtain more responsible inks. The -bio- inks are distinguished by their respect for the environment thanks to a biodegradable binder, a bio-based green solvent and recyclable silver. The performances reach a low resistivity of 20 µΩ.cm and with a high deformation capacity by thermoforming. A -bio- ink was overmolded with polycarbonate, and an IME demonstrator was produced. However, some difficulties persist and limit the application potential of these formulations. Among them, critical cases of delamination and rupture of the conductive tracks during thermoforming. Also, possible washing out of the inks and the detachment of the electronic components during the injection step can occur. These limitations are linked to the geometric constraints generated by 3D and have been studied. However, due to time constraints, not all the inks could be tested until the production of a demonstrator
Wang, Enhai. "Metal-mold reactions in CMSX-4 single crystal superalloy castings." abstract and full text PDF (UNR users only), 2009. http://0-gateway.proquest.com.innopac.library.unr.edu/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:1464425.
Full textBooks on the topic "In-Mold Electronics"
Nihon Bōeki Shinkōkai. Ho Chi Minh Office. The excellent Vietnamese companies in southern Vietnam: Mold, plastic/metal processing, precision parts, mechanical, electronics, plating, textile, etc. = Betonamu yūryō kigyō (minami betonamu hen) : Kanagata, kinzoku purasutikku kakō, seimitsu buhin, kikai, denshi denki buhin, mekki, boseki, hoka. 2nd ed. Ho Chi Minh]: JETRO Ho Chi Minh Office, 2009.
Find full textNihon Bōeki Shinkōkai. Hanoi Representative Office. The excellent Vietnamese companies in northern and central Vietnam: Mold, plastic/metal processing, precision parts, mechanical, electronics, plating, etc = [Betonamu yūryō kigyō (kita, chubu betonamu hen) : kanagata, purasutikku kakō, kinzoku kakō, seimitsu buhin, kikai, denshi denki buhin, mekki, hoka]. Hanoi]: JETRO Hanoi Representative Office, 2009.
Find full textBook chapters on the topic "In-Mold Electronics"
Yusro, Muhammad. "Emerging Potential on Laser Engraving Method in Fabricating Mold for Microfluidic Technology." In Proceedings of the 2nd International Conference on Electronics, Biomedical Engineering, and Health Informatics, 203–14. Singapore: Springer Nature Singapore, 2022. http://dx.doi.org/10.1007/978-981-19-1804-9_16.
Full textRabhi, F., G. Cheng, and T. Barriere. "Modeling of Viscoelasticity of Thermoplastic Polymers Employed in the Hot Embossing Process." In Lecture Notes in Mechanical Engineering, 251–60. Cham: Springer International Publishing, 2024. http://dx.doi.org/10.1007/978-3-031-58006-2_19.
Full textKeränen, A., T. Wuori, J. Asikkala, E. Garcia Biosca, and A. Benndorf. "Polypropylene films and injection-molding resins for In-Mold Structural Electronics (IMSE®)." In PIAE EUROPE 2021, 213–24. VDI Verlag, 2021. http://dx.doi.org/10.51202/9783181023853-213.
Full textYuki, Kazuhisa. "Heat Transfer Enhancement Using Unidirectional Porous Media under High Heat Flux Conditions." In Porous Fluids - Advances in Fluid Flow and Transport Phenomena in Porous Media. IntechOpen, 2021. http://dx.doi.org/10.5772/intechopen.96594.
Full textZhang, Xiujuan, and Gui Lin. "Poly(trimethylene terephthalate)." In Polymer Data Handbook, 1080–84. Oxford University PressNew York, NY, 2009. http://dx.doi.org/10.1093/oso/9780195181012.003.0188.
Full textEhrenfeld, David. "The Magic of the Internet." In Swimming Lessons. Oxford University Press, 2002. http://dx.doi.org/10.1093/oso/9780195148527.003.0008.
Full textHassan, Dr Md Nurul. "RESEARCH: PLAYEING A GREAT ROLE IN THESIS / RESEARCH PAPER WRITING." In Futuristic Trends in Social Sciences Volume 3 Book 23, 1–4. Iterative International Publishers, Selfypage Developers Pvt Ltd, 2024. http://dx.doi.org/10.58532/v3bjso23ch1.
Full textConference papers on the topic "In-Mold Electronics"
Fazlali, Zahra, David Schaubroeck, Maarten Cauwe, Sibel Ügdüler, Tine Van Laere, Dave Manhaeghe, Steven De Meester, Ludwig Cardon, and Jan Vanfleteren. "Eco-Friendly In-Mold Electronics Using Polylactic Acid." In 2024 Electronics Goes Green 2024+ (EGG), 1–7. IEEE, 2024. http://dx.doi.org/10.23919/egg62010.2024.10631228.
Full textLall, Pradeep, Fatahi Musa, and Scott Miller. "Process Performance Interaction of In-Mold Electronics for Signal-Processing Applications." In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1–10. IEEE, 2024. http://dx.doi.org/10.1109/itherm55375.2024.10709472.
Full textLall, Pradeep, Md Golam Sarwar, and Scott Miller. "Reliability of Additively Printed In-Mold Electronics Using ECA in Sustained High-Temperature Operation." In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1–6. IEEE, 2024. http://dx.doi.org/10.1109/itherm55375.2024.10709441.
Full textLall, Pradeep, Shriram Kulkarni, and Scott Miller. "Screen-Printed Thermoformed Circuits Performance and Reliability under Sustained High Temperatures for In-Mold Electronics." In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1–12. IEEE, 2024. http://dx.doi.org/10.1109/itherm55375.2024.10709621.
Full textHomma, Soichi, Daichi Okada, Akihito Sawanobori, Susumu Yamamoto, and Hiroshi Nishikawa. "Quantification of Adhesion Strength and Mechanism of Adhesion Degradation Between Sputtered SUS304 and Mold Resin in Electromagnetic Wave Shield Packages." In 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 1–7. IEEE, 2024. http://dx.doi.org/10.1109/estc60143.2024.10712082.
Full textLall, Pradeep, Ved Soni, and Scott Miller. "Development and Performance Evaluation of Additively Printed In-Mold-Electronic Sensors." In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1–8. IEEE, 2024. http://dx.doi.org/10.1109/itherm55375.2024.10709447.
Full textZhuang, Dawei, Yijun Wang, Guoqiang Dong, and Zitao Qu. "Optimizing the wireless sensor network coverage algorithm of slime mold." In Ninth International Symposium on Advances in Electrical, Electronics, and Computer Engineering (ISAEECE 2024), edited by Pierluigi Siano and Wenbing Zhao, 26. SPIE, 2024. http://dx.doi.org/10.1117/12.3033409.
Full textLall, Pradeep, Hyesoo Jang, and Scott Miller. "Development of In-Mold Integration of EDA Sensors Via Additive Printing." In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1–9. IEEE, 2024. http://dx.doi.org/10.1109/itherm55375.2024.10709533.
Full textLall, Pradeep, Fatahi Musa, and Scott Miller. "Impact of Thermal Cycling on In-Mold Flexible Substrates Fabricated via Direct-Write Printing." In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1–8. IEEE, 2024. http://dx.doi.org/10.1109/itherm55375.2024.10709453.
Full textLall, Pradeep, Padmanava Choudhury, Ved Soni, and Scott Miller. "Development and Performance Evolution of Thermoformed In-Mold Gravure Offset Band-Pass Filters due to Thermal Cycling." In 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1–7. IEEE, 2024. http://dx.doi.org/10.1109/itherm55375.2024.10709460.
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