Journal articles on the topic 'Implantable chips'
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1
Chiang, C. T., and C. Y. Wu. "Implantable neuromorphic vision chips." Electronics Letters 40, no. 6 (2004): 361. http://dx.doi.org/10.1049/el:20040269.
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Maguire, G. Q., and Ellen M. McGee. "Implantable Brain Chips? Time for Debate." Hastings Center Report 29, no. 1 (January 1999): 7. http://dx.doi.org/10.2307/3528533.
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Nabovati, Ghazal, and Mohammad Maymandi-Nejad. "Ultra-low power BPSK demodulator for bio-implantable chips." IEICE Electronics Express 7, no. 20 (2010): 1592–96. http://dx.doi.org/10.1587/elex.7.1592.
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Lee, Ah-Hyoung, Jihun Lee, Farah Laiwalla, Vincent Leung, Jiannan Huang, Arto Nurmikko, and Yoon-Kyu Song. "A Scalable and Low Stress Post-CMOS Processing Technique for Implantable Microsensors." Micromachines 11, no. 10 (October 5, 2020): 925. http://dx.doi.org/10.3390/mi11100925.
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Implantable active electronic microchips are being developed as multinode in-body sensors and actuators. There is a need to develop high throughput microfabrication techniques applicable to complementary metal–oxide–semiconductor (CMOS)-based silicon electronics in order to process bare dies from a foundry to physiologically compatible implant ensembles. Post-processing of a miniature CMOS chip by usual methods is challenging as the typically sub-mm size small dies are hard to handle and not readily compatible with the standard microfabrication, e.g., photolithography. Here, we present a soft material-based, low chemical and mechanical stress, scalable microchip post-CMOS processing method that enables photolithography and electron-beam deposition on hundreds of micrometers scale dies. The technique builds on the use of a polydimethylsiloxane (PDMS) carrier substrate, in which the CMOS chips were embedded and precisely aligned, thereby enabling batch post-processing without complication from additional micromachining or chip treatments. We have demonstrated our technique with 650 μm × 650 μm and 280 μm × 280 μm chips, designed for electrophysiological neural recording and microstimulation implants by monolithic integration of patterned gold and PEDOT:PSS electrodes on the chips and assessed their electrical properties. The functionality of the post-processed chips was verified in saline, and ex vivo experiments using wireless power and data link, to demonstrate the recording and stimulation performance of the microscale electrode interfaces.
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de Beeck, Maaike Op, John O'Callaghan, Karen Qian, Bishoy M. Morcos, Aleksandar Radisic, Karl Malachowski, M. F. Amira, and Chris Van Hoof. "Biocompatible encapsulation and interconnection technology for implantable electronic devices." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000215–24. http://dx.doi.org/10.4071/isom-2012-ta65.
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A biocompatible packaging process for implantable electronic systems is under development at imec, combining biocompatibility, hermeticity, extreme miniaturization and cost aspects. In a first phase of this packaging sequence, hermetic chip sealing is performed by encapsulating all chips to realize a bi-directional diffusion barrier preventing body fluids to leach into the package causing corrosion, and preventing IC materials such as Cu to diffuse into the body, causing various adverse effects. For cost effectiveness, this chip sealing is performed as post-processing at wafer level, using modifications of standard clean room (CR) fabrication techniques. Well known conductive and insulating CR materials are investigated with respect to their biocompatibility, biostability, diffusion barrier properties and sensitivity to corrosion. Material selection and integration aspects are modified until good properties are obtained. In a second phase of the packaging process, all chips of the final device should be electrically connected, applying a biocompatible metallization scheme. We selected the use of Pt due to its excellent biocompatibility and corrosion resistance. Since Pt is very expensive, a cost effective Pt-selective plating process is developed. During the third packaging step, all system components such as electronics, passives, a battery,… will be interconnected. To provide sufficient mechanical support, all components are finally embedded using a medical grade elastomer such as PDMS or Poly-urethane.
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Hackler, Douglas, and Edward Prack. "Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid Integration." International Symposium on Microelectronics 2020, no. 1 (September 1, 2020): 000146–49. http://dx.doi.org/10.4071/2380-4505-2020.1.000146.
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Abstract Flip-chip packaging of thin-die, in fact any packaging of thin-die, is one of today’s most significant challenges for die handling. Despite the difficulties presented as the thickness of chips continues to decrease, the wide range of applications they have enabled across multiple industries has led to increasing interest, as evidenced by the growth in the cumulative total number of publications on thin silicon based electronics, including Ultra-Thin Chips (UTCs), thinning of Silicon-on-Insulator, and wafer thinning. Smart devices including labels, loggers, wearables, implantable medical, and IoT are in demand. A key area of difficulty in the packaging of thin chips comes from removing the individual chips from dicing tape due to the adhesive nature of the tape and die cracking and edge chipping characteristic of thin die. As the industry continues to embrace the benefits afforded by thin devices, two trends are being witnessed. Devices continue to grow larger in area and thinner in thickness. American Semiconductor’s automated production process for packaging and assembly of chips ≤35um in thickness will be presented. This includes details regarding needleless die eject, pick tip design for ultra-thin devices, ultra-thin flip-chip interconnects, thin-chip overcoat, process controls, and assembly on flexible circuit boards (FCB).
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de Beeck, Maaike Op, Karen Qian, Paolo Fiorini, Karl Malachowski, and Chris Van Hoof. "Design and Characterization of a Biocompatible Packaging Concept for Implantable Electronic Devices." Journal of Microelectronics and Electronic Packaging 9, no. 1 (January 1, 2012): 43–50. http://dx.doi.org/10.4071/imaps.314.
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A biocompatible packaging process for implantable electronic systems is described, combining biocompatibility and hermeticity with extreme miniaturization. In Phase 1 of the total packaging sequence, all chips are encapsulated in order to realize a bidirectional diffusion barrier, preventing body fluids from leaching into the package, which would cause corrosion, and preventing IC materials such as Cu from diffusing into the body, which would cause various adverse effects. For cost-effectiveness, this hermetic chip sealing is performed as a postprocessing step at the wafer level using modifications of standard clean room (CR) fabrication techniques. Well-known conductive and insulating CR materials are investigated with respect to their biocompatibility, diffusion barrier properties, and sensitivity to corrosion. In Phase 2 of the packaging process, all chips of the final device should be electrically connected, applying a biocompatible metallization scheme using, for example, gold or platinum. For electrodes in direct contact with the tissue after implantation, IrOx metallization is proposed. Phase 3 of device assembly is the final packaging step, during which all system components, such as electronics, passives, a battery, among others, will be interconnected. To provide sufficient mechanical support, all these components are embedded using a biocompatible elastomer such as PDMS.
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Op de Beeck, Maaike, Karen Qian, Paolo Fiorini, Karl Malachowski, and Chris Van Hoof. "Design and characterization of a biocompatible packaging concept for implantable electronic devices." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000152–60. http://dx.doi.org/10.4071/isom-2011-ta5-paper2.
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A biocompatible packaging process for implantable electronic systems is described, combining biocompatibility and hermeticity with extreme miniaturization. In a first phase of the total packaging sequence, all chips are encapsulated in order to realize a bi-directional diffusion barrier preventing body fluids to leach into the package causing corrosion, and preventing IC materials such as Cu to diffuse into the body, causing various adverse effects. For cost effectiveness, this hermetic chip sealing is performed as post-processing at wafer level, using modifications of standard clean room (CR) fabrication techniques. Well known conductive and insulating CR materials are investigated with respect to their biocompatibility, diffusion barrier properties and sensitivity to corrosion. In a second phase of the packaging process, all chips of the final device should be electrically connected, applying a biocompatible metallization scheme using eg. gold or platinum. For electrodes being in direct contact with the tissue after implantation, IrOx metallization is proposed. Device assembly is the final packaging step, during which all system components such as electronics, passives, a battery,… will be interconnected. To provide sufficient mechanical support, all these components are embedded using a biocompatible elastomer such as PDMS.
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Nabovati, Ghazal, Abdollah Mirbozorgi, Mohammad Maymandi-Nejad, and Hooman Nabovati. "Ultra-low power self-calibrating process-insensitive BPSK demodulator for bio-implantable chips." IEICE Electronics Express 8, no. 11 (2011): 819–24. http://dx.doi.org/10.1587/elex.8.819.
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Weidenmüller, Jens, Oezgue Dogan, Alexander Stanitzki, Mario Baum, Tim Schröder, Dirk Wünsch, Michael Görtz, and Anton Grabmaier. "Implantable multi-sensor system for hemodynamic controlling." tm - Technisches Messen 85, no. 5 (May 25, 2018): 359–65. http://dx.doi.org/10.1515/teme-2017-0116.
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Abstract A miniaturized implantable multi-sensor system for cardiovascular monitoring of physiological parameters is presented. High accuracy pressure measurements within the vessel can be performed by a capacitive pressure sensor. Additional information about the patient, e. g., sudden movement, inclination or increased temperature can be obtained by additional sensor components such as an acceleration sensor and a temperature sensor unit. This information facilitates compensation of interferences for more accurate pressure measurements. A multi-functional ASIC enables, amongst others, sensor signal processing, power management and telemetric communication with extracorporeal electronics. Sensor chips, the multi-functional ASIC and passive components are assembled on a LTCC circuit board in which an antenna coil is integrated for telemetric energy and data transmission at a frequency of 13.56 MHz. In order to support further miniaturization, the implant shall be encapsulated with a stack of very thin and hermetic ceramics applied by ALD instead of using bulky metal housings. Further encapsulation with polymers, which can be functionalised with appropriate biomolecules, is necessary for a proper shape, a biocompatible interface to the surrounding tissue and, thereby, reduction of thrombogenicity.
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Liu, Zhengwu, Jianshi Tang, Bin Gao, Xinyi Li, Peng Yao, Yudeng Lin, Dingkun Liu, Bo Hong, He Qian, and Huaqiang Wu. "Multichannel parallel processing of neural signals in memristor arrays." Science Advances 6, no. 41 (October 2020): eabc4797. http://dx.doi.org/10.1126/sciadv.abc4797.
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Fully implantable neural interfaces with massive recording channels bring the gospel to patients with motor or speech function loss. As the number of recording channels rapidly increases, conventional complementary metal-oxide semiconductor (CMOS) chips for neural signal processing face severe challenges on parallelism scalability, computational cost, and power consumption. In this work, we propose a previously unexplored approach for parallel processing of multichannel neural signals in memristor arrays, taking advantage of their rich dynamic characteristics. The critical information of neural signal waveform is extracted and encoded in the memristor conductance modulation. A signal segmentation scheme is developed to adapt to device variations. To verify the fidelity of the processed results, seizure prediction is further demonstrated, with high accuracy above 95% and also more than 1000× improvement in power efficiency compared with CMOS counterparts. This work suggests that memristor arrays could be a promising multichannel signal processing module for future implantable neural interfaces.
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Lopa, Silvia, Francesco Piraino, Raymond J. Kemp, Clelia Di Caro, Arianna B. Lovati, Alessia Di Giancamillo, Lorenzo Moroni, Giuseppe M. Peretti, Marco Rasponi, and Matteo Moretti. "Fabrication of multi-well chips for spheroid cultures and implantable constructs through rapid prototyping techniques." Biotechnology and Bioengineering 112, no. 7 (March 10, 2015): 1457–71. http://dx.doi.org/10.1002/bit.25557.
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Rav Acha, Moshe, Elina Soifer, and Tal Hasin. "Cardiac Implantable Electronic Miniaturized and Micro Devices." Micromachines 11, no. 10 (September 29, 2020): 902. http://dx.doi.org/10.3390/mi11100902.
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Advancement in the miniaturization of high-density power sources, electronic circuits, and communication technologies enabled the construction of miniaturized electronic devices, implanted directly in the heart. These include pacing devices to prevent low heart rates or terminate heart rhythm abnormalities (‘arrhythmias’), long-term rhythm monitoring devices for arrhythmia detection in unexplained syncope cases, and heart failure (HF) hemodynamic monitoring devices, enabling the real-time monitoring of cardiac pressures to detect and alert for early fluid overload. These devices were shown to prevent HF hospitalizations and improve HF patients’ life quality. Pacing devices include permanent pacemakers (PPM) that maintain normal heart rates, defibrillators that are capable of fast detection and the termination of life-threatening arrhythmias, and cardiac re-synchronization devices that improve cardiac function and the survival of HF patients. Traditionally, these devices are implanted via the venous system (‘endovascular’) using conductors (‘endovascular leads/electrodes’) that connect the subcutaneous device battery to the appropriate cardiac chamber. These leads are a potential source of multiple problems, including lead-failure and systemic infection resulting from the lifelong exposure of these leads to bacteria within the venous system. One of the important cardiac innovations in the last decade was the development of a leadless PPM functioning without venous leads, thus circumventing most endovascular PPM-related problems. Leadless PPM’s consist of a single device, including a miniaturized power source, electronic chips, and fixating mechanism, directly implanted into the cardiac muscle. Only rare device-related problems and almost no systemic infections occur with these devices. Current leadless PPM’s sense and pace only the ventricle. However, a novel leadless device that is capable of sensing both atrium and ventricle was recently FDA approved and miniaturized devices that are designed to synchronize right and left ventricles, using novel intra-body inner-device communication technologies, are under final experiments. This review will cover these novel implantable miniaturized cardiac devices and the basic algorithms and technologies that underlie their development. Advancement in the miniaturization of high-density power sources, electronic circuits, and communication technologies enabled the construction of miniaturized electronic devices, implanted directly in the heart. These include pacing devices to prevent low heart rates or terminate heart rhythm abnormalities (‘arrhythmias’), long-term rhythm monitoring devices for arrhythmia detection in unexplained syncope cases, and heart failure (HF) hemodynamic monitoring devices, enabling the real-time monitoring of cardiac pressures to detect and alert early fluid overload. These devices were shown to prevent HF hospitalizations and improve HF patients’ life quality. Pacing devices include permanent pacemakers (PPM) that maintain normal heart rates, defibrillators that are capable of fast detection and termination of life-threatening arrhythmias, and cardiac re-synchronization devices that improve cardiac function and survival of HF patients. Traditionally, these devices are implanted via the venous system (‘endovascular’) using conductors (‘endovascular leads/electrodes’) that connect the subcutaneous device battery to the appropriate cardiac chamber. These leads are a potential source of multiple problems, including lead-failure and systemic infection that result from the lifelong exposure of these leads to bacteria within the venous system. The development of a leadless PPM functioning without venous leads was one of the important cardiac innovations in the last decade, thus circumventing most endovascular PPM-related problems. Leadless PPM’s consist of a single device, including a miniaturized power source, electronic chips, and fixating mechanism, implanted directly into the cardiac muscle. Only rare device-related problems and almost no systemic infections occur with these devices. Current leadless PPM’s sense and pace only the ventricle. However, a novel leadless device that is capable of sensing both atrium and ventricle was recently FDA approved and miniaturized devices designed to synchronize right and left ventricles, using novel intra-body inner-device communication technologies, are under final experiments. This review will cover these novel implantable miniaturized cardiac devices and the basic algorithms and technologies that underlie their development.
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Zhou, J. A., S. J. Woo, S. I. Park, E. T. Kim, J. M. Seo, H. Chung, and S. J. Kim. "A Suprachoroidal Electrical Retinal Stimulator Design for Long-Term Animal Experiments and In Vivo Assessment of Its Feasibility and Biocompatibility in Rabbits." Journal of Biomedicine and Biotechnology 2008 (2008): 1–10. http://dx.doi.org/10.1155/2008/547428.
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This article reports on a retinal stimulation system for long-term use in animal electrical stimulation experiments. The presented system consisted of an implantable stimulator which provided continuous electrical stimulation, and an external component which provided preset stimulation patterns and power to the implanted stimulator via a paired radio frequency (RF) coil. A rechargeable internal battery and a parameter memory component were introduced to the implanted retinal stimulator. As a result, the external component was not necessary during the stimulation mode. The inductive coil pair was used to pass the parameter data and to recharge the battery. A switch circuit was used to separate the stimulation mode from the battery recharging mode. The implantable stimulator was implemented with IC chips and the electronics, except for the stimulation electrodes, were hermetically packaged in a biocompatible metal case. A polyimide-based gold electrode array was used. Surgical implantation into rabbits was performed to verify the functionality and safety of this newly designed system. The electrodes were implanted in the suprachoroidal space. Evoked cortical potentials were recorded during electrical stimulation of the retina. Long-term follow-up using OCT showed no chorioretinal abnormality after implantation of the electrodes.
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Lin, Chin-Yu, Wan-Shiun Lou, Jyh-Chern Chen, Kuo-Yao Weng, Ming-Cheng Shih, Ya-Wen Hung, Zhu-Yin Chen, and Mei-Chih Wang. "Bio-Compatibility and Bio-Insulation of Implantable Electrode Prosthesis Ameliorated by A-174 Silane Primed Parylene-C Deposited Embedment." Micromachines 11, no. 12 (November 30, 2020): 1064. http://dx.doi.org/10.3390/mi11121064.
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Microelectrodes for pain management, neural prosthesis or assistances have a huge medical demand, such as the application of pain management chip or retinal prosthesis addressed on age-related macular degeneration (AMD) and the retinitis pigmentosa (RP). Due to lifelong implanted in human body and direct adhesion of neural tissues, the electrodes and associated insulation materials should possess an ideal bio-compatibility, including non-cytotoxicity and no safety concern elicited by immune responses. Our goal intended to develop retinal prosthesis, an electrical circuit chip used for assisting neural electrons transmission on retina and ameliorating the retinal disability. Therefore, based on the ISO 10993 guidance for implantable medical devices, the electrode prosthesis with insulation material has to conduct bio-compatibility assessment including cytotoxicity, hemolysis, (skin) irritation and pathological implantation examinations. In this study, we manufactured inter-digitated electrode (IDE) chips mimic the electrode prosthesis through photolithography. The titanium and platinum composites were deposited onto a silicon wafer to prepare an electric circuit to mimic the electrode used in retinal prosthesis manufacture, which further be encapsulated to examine the bio-compatibility in compliance with ISO 10993 and ASTM guidance specifically for implantable medical devices. Parylene-C, polyimide and silicon carbide were selected as materials for electrode encapsulation in comparison. Our data revealed parylene-C coating showed a significant excellence on bio-insulation and bio-compatibility specifically addressed on implantable neuron stimulatory devices and provided an economic procedure to package the electrode prosthesis. Therefore, parylene C encapsulation should serve as a consideration for future application on retinal prosthesis manufacture and examination.
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Shi, Weiwei, Jinyong Zhang, Zhiguo Zhang, Lizhi Hu, and Yongqian Su. "An introduction and review on innovative silicon implementations of implantable/scalp EEG chips for data acquisition, seizure/behavior detection, and brain stimulation." Brain Science Advances 6, no. 3 (September 2020): 242–54. http://dx.doi.org/10.26599/bsa.2020.9050024.
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Technological advances in the semiconductor industry and the increasing demand and development of wearable medical systems have enabled the development of dedicated chips for complex electroencephalogram (EEG) signal processing with smart functions and artificial intelligence‐based detections/classifications. Around 10 million transistors are integrated into a 1 mm2 silicon wafer surface in the dedicated chip, making wearable EEG systems a powerful dedicated processor instead of a wireless raw data transceiver. The reduction of amplifiers and analog‐digital converters on the silicon surface makes it possible to place the analog front‐end circuits within a tiny packaged chip; therefore, enabling high‐count EEG acquisition channels. This article introduces and reviews the state‐of‐the‐art dedicated chip designs for EEG processing, particularly for wearable systems. Furthermore, the analog circuits and digital platforms are included, and the technical details of circuit topology and logic architecture are presented in detail.
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Schmidt, Ulrike, Carola Jorsch, Margarita Guenther, and Gerald Gerlach. "Biochemical piezoresistive sensors based on hydrogels for biotechnology and medical applications." Journal of Sensors and Sensor Systems 5, no. 2 (November 25, 2016): 409–17. http://dx.doi.org/10.5194/jsss-5-409-2016.
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Abstract. Many conventional analysis techniques achieve a high-detection sensitivity; however, they are equipment or time expensive due to a multi-step procedure. Sensor concepts, introduced in this work, using piezoresistive pressure sensor chips with integrated analyte-sensitive hydrogels enable inexpensive and robust biochemical sensors, which are miniaturized and in-line capable. For these sensor setups, it is important to optimize current established analyte-sensitive, reversible and biocompatible hydrogels for pH and glucose monitoring of chemical and biochemical processes. Therefore, low-viscous monomer mixtures based on hydroxypropyl methacrylate (HPMA), 2-(dimethylamino)ethyl methacrylate (DMAEMA), tetraethylene glycol dimethacrylate (TEGDMA) and ethylene glycol (EG) were prepared in molar ratios of 70∕30∕01∕20, 60∕40∕01∕20 and 60∕40∕02∕20, respectively. Redox-polymerization of these pre-gel solutions were realized with N,N,N′,N′-tetramethylethylenediamine and ammonium persulfate. The reversible pH-sensitive swelling behavior of hydrogels with compositions were compared. By using the photoinitiator 2-hydroxy-4′-(2-hydroxyethoxy)-2-methylpropiophenone, the free radical photopolymerization could be implemented leading to an increase of the swelling degree (SG). Glucose-sensitive hydrogels were prepared via immobilization of glucose oxidase in HPMA–DMAEMA–TEGDMA–EG hydrogel discs. These showed increasing swelling degrees with higher glucose concentrations in aqueous media and a reversible swelling behavior. The synthesized hydrogels were integrated in different piezoresistive sensors of different designs. The pH-depending course of the output voltage of a dip sensor with photopolymerized 60∕40∕02∕20 hydrogel was studied in detail. Besides the usage of a dip sensor, two implantable, parylene C-coated setups are presented. The implantable sensor with long isolated gold bond wires was proved to be functional even after storage in aqueous media for several days.
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Schmidt, Ulrike, Margarita Guenther, and Gerald Gerlach. "Biochemical piezoresistive sensors based on pH- and glucose-sensitive hydrogels for medical applications." Current Directions in Biomedical Engineering 2, no. 1 (September 1, 2016): 117–21. http://dx.doi.org/10.1515/cdbme-2016-0029.
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AbstractMany conventional analysis techniques to detect chemical or biological species are able to achieve a high detection sensitivity, however, they are equipment- or time-expensive due to a multi-step procedure. In this work we describe sensor concepts using piezoresistive pressure sensor chips with integrated analyte-sensitive hydrogels, that enable inexpensive and robust biochemical sensors which are miniaturizable and in-line capable. Biocompatible hydrogels were developed and tested for pH- and glucose-monitoring during the chemical and biochemical processes. For that, monomer mixtures based on hydroxypropyl methacrylate HPMA, 2-(dimethylamino)ethyl methacrylate DMAEMA, tetraethylene glycol dimethacrylate TEGDMA and ethylene glycol EG were photo-polymerized. By means of carbodiimide chemistry, glucose oxidase was bound to the pH-sensitive HPMA/DMAEMA/TEGDMA/EG hydrogel squares causing the glucose-sensitivity. The crosslinked hydrogels were integrated in piezoresistive pressure sensors of different designs. pH- and glucose-depending reversible gel swelling processes were observed by means of the output voltage of dip sensors and of a novel implantable flexible sensor set-up. Due to its biocompatible components, the latter could be used inside the human body monitoring physiological blood values, for example glucose.
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Musk, Elon. "An Integrated Brain-Machine Interface Platform With Thousands of Channels." Journal of Medical Internet Research 21, no. 10 (October 31, 2019): e16194. http://dx.doi.org/10.2196/16194.
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Brain-machine interfaces hold promise for the restoration of sensory and motor function and the treatment of neurological disorders, but clinical brain-machine interfaces have not yet been widely adopted, in part, because modest channel counts have limited their potential. In this white paper, we describe Neuralink’s first steps toward a scalable high-bandwidth brain-machine interface system. We have built arrays of small and flexible electrode “threads,” with as many as 3072 electrodes per array distributed across 96 threads. We have also built a neurosurgical robot capable of inserting six threads (192 electrodes) per minute. Each thread can be individually inserted into the brain with micron precision for avoidance of surface vasculature and targeting specific brain regions. The electrode array is packaged into a small implantable device that contains custom chips for low-power on-board amplification and digitization: The package for 3072 channels occupies less than 23×18.5×2 mm3. A single USB-C cable provides full-bandwidth data streaming from the device, recording from all channels simultaneously. This system has achieved a spiking yield of up to 70% in chronically implanted electrodes. Neuralink’s approach to brain-machine interface has unprecedented packaging density and scalability in a clinically relevant package.
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Clark, Jason. "Self-Calibration and Performance Control of MEMS with Applications for IoT." Sensors 18, no. 12 (December 13, 2018): 4411. http://dx.doi.org/10.3390/s18124411.
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A systemic problem for microelectromechanical systems (MEMS) has been the large gap between their predicted and actual performances. Due to process variations, no two MEMS have been able to perform identically. In-factory calibration is often required, which can represent as much as three-fourths of the manufacturing costs. Such issues are challenges for microsensors that require higher accuracy and lower cost. Towards addressing these issues, this paper describes how microscale attributes may be used to enable MEMS to accurately calibrate themselves without external references, or enable actual devices to match their predicted performances. Previously, we validated how MEMS with comb drives can be used to autonomously self-measure their change in geometry in going from layout to manufactured, and we verified how MEMS can be made to increase or decrease their effective mass, damping, and or stiffness in real-time to match desired specifications. Here, we present how self-calibration and performance control may be used to accurately sense and extend the capabilities of a variety of sensing applications for the Internet of things (IoT). Discussions of IoT applications include: (1) measuring absolute temperature due to thermally-induced vibrations; (2) measuring the stiffness of atomic force microscope or biosensor cantilevers; (3) MEMS weighing scales; (4) MEMS gravimeters and altimeters; (5) inertial measurement units that can measure all four non-inertial forces; (6) self-calibrating implantable pressure sensors; (7) diagnostic chips for quality control; (8) closing the gap from experiment to simulation; (9) control of the value of resonance frequency to counter drift or to match modes; (10) control of the value of the quality factor; and (11) low-amplitude Duffing nonlinearity for wideband high-Q resonance.
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Zetterer, Th, J. Herzberg, J. Baehr, and K. Waxman. "When Failure is not an Option – Packaging Materials and Technologies for the Reliable Protection of Medical Electronics." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000512–16. http://dx.doi.org/10.4071/2380-4505-2018.1.000512.
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Abstract Enabling high-level electrical performance and smooth optical signal transmission is a key requirement for microelectronics packaging materials. This becomes even more relevant for biomedical applications, in which protection requirements must be met alongside standard performance and signal transmission benchmarks. The major challenge: medical packaging must to provide absolute reliability. Microelectronic components face potentially damaging working environment hazards such as high humidity, extreme temperatures, corrosive chemicals, and bodily fluid – especially in the application cases of implantable, ingestible, and wearable devices. Hermeticity is an important factor in the performance of medical packaging. Non-hermetic packaging, sometimes known as “quasi-hermetic” uses organic materials, such as silicone or plastic over-moldings, that are not designed to withstand extreme conditions and break down over time. Material break down in these types of packages can lead to limited protection by allowing permeation of water and other gases through the polymer structure. Non-hermetic packages typically reach critical permeation levels after a very short period of time. For microelectronic components, even the smallest, hardly detectable traces of hydrogen and water vapor inside a package can compromise the performance and reliability of the encapsulated chips and circuits and potentially lead to interconnect failure, one of the most common reliability failure modes in microelectronic applications. The only way to overcome the challenge of achieving absolute reliability is by using hermetic packaging technologies with inorganic materials, such as glass, ceramics and metal. Unique manufacturing processes of these hermetic components create vacuum-tight seals that prevent moisture and harmful gases from penetrating into the package. Hermetically sealed packages deliver uncompromised reliability, offering long-term protection of sensitive electronics in medical devices – even after thousands of surgical procedures and steam sterilization cycles. This technical presentation will introduce the different reliability levels of packaging materials and provide an in-depth comparison of the respective advantages, disadvantages, and typical application areas of various hermetic packaging technologies. The latest insights into materials and technologies available for high-reliability packaging of medical electronics will be presented.
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Maloney, John M., Sara A. Lipka, and Samuel P. Baldwin. "In Vivo Biostability of CVD Silicon Oxide and Silicon Nitride Films." MRS Proceedings 872 (2005). http://dx.doi.org/10.1557/proc-872-j14.3.
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AbstractLow pressure chemical vapor deposition (LPCVD) and plasma enhanced chemical vapor deposition (PECVD) silicon oxide and silicon nitride films were implanted subcutaneously in a rat model to study in vivo behavior of the films. Silicon chips coated with the films of interest were implanted for up to one year, and film thickness was evaluated by spectrophotometry and sectioning. Dissolution rates were estimated to be 0.33 nm/day for LPCVD silicon nitride, 2.0 nm/day for PECVD silicon nitride, and 3.5 nm/day for PECVD silicon oxide. A similar PECVD silicon oxide dissolution rate was observed on a silicon oxide / silicon nitride / silicon oxide stack that was sectioned by focused ion beam etching. These results provide a biostability reference for designing implantable microfabricated devices that feature exposed ceramic films.
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Li, Juzhe, Xu Liu, Wei Mao, Tao Chen, and Hao Yu. "Advances in Neural Recording and Stimulation Integrated Circuits." Frontiers in Neuroscience 15 (August 6, 2021). http://dx.doi.org/10.3389/fnins.2021.663204.
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In the past few decades, driven by the increasing demands in the biomedical field aiming to cure neurological diseases and improve the quality of daily lives of the patients, researchers began to take advantage of the semiconductor technology to develop miniaturized and power-efficient chips for implantable applications. The emergence of the integrated circuits for neural prosthesis improves the treatment process of epilepsy, hearing loss, retinal damage, and other neurological diseases, which brings benefits to many patients. However, considering the safety and accuracy in the neural prosthesis process, there are many research directions. In the process of chip design, designers need to carefully analyze various parameters, and investigate different design techniques. This article presents the advances in neural recording and stimulation integrated circuits, including (1) a brief introduction of the basics of neural prosthesis circuits and the repair process in the bionic neural link, (2) a systematic introduction of the basic architecture and the latest technology of neural recording and stimulation integrated circuits, (3) a summary of the key issues of neural recording and stimulation integrated circuits, and (4) a discussion about the considerations of neural recording and stimulation circuit architecture selection and a discussion of future trends. The overview would help the designers to understand the latest performances in many aspects and to meet the design requirements better.