Academic literature on the topic 'Hot Carriers Injection'
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Journal articles on the topic "Hot Carriers Injection"
Khurgin, Jacob B. "Fundamental limits of hot carrier injection from metal in nanoplasmonics." Nanophotonics 9, no. 2 (February 25, 2020): 453–71. http://dx.doi.org/10.1515/nanoph-2019-0396.
Full textZhu, Lang, Zongpeng Song, Ran Li, and Haiou Zhu. "Hot carrier dynamics in MoS2/WS2 heterostructure." Nanotechnology 33, no. 19 (February 15, 2022): 195701. http://dx.doi.org/10.1088/1361-6528/ac4e41.
Full textMarrakh, R., and A. Bouhdada. "Modeling of the I–V Characteristics for LDD-nMOSFETs in Relation with Defects Induced by Hot-Carrier Injection." Active and Passive Electronic Components 26, no. 4 (2003): 197–204. http://dx.doi.org/10.1080/08827510310001624363.
Full textBHATTACHARYA, PALLAB. "TUNNEL INJECTION LASERS." International Journal of High Speed Electronics and Systems 09, no. 04 (December 1998): 847–66. http://dx.doi.org/10.1142/s0129156498000361.
Full textLiu, Tingting, Cheng Zhang, and Xiaofeng Li. "Strain engineering for enhanced hot-carrier photodetection." Journal of Applied Physics 132, no. 6 (August 14, 2022): 064901. http://dx.doi.org/10.1063/5.0099544.
Full textWang, Yunxiang, Buyun Chen, Deming Meng, Boxiang Song, Zerui Liu, Pan Hu, Hao Yang, et al. "Hot Electron-Driven Photocatalysis Using Sub-5 nm Gap Plasmonic Nanofinger Arrays." Nanomaterials 12, no. 21 (October 24, 2022): 3730. http://dx.doi.org/10.3390/nano12213730.
Full textJang, Taejin, Myung-Hyun Baek, Suhyeon Kim, Sungmin Hwang, Jeesoo Chang, Kyung Kyu Min, Kyungchul Park, and Byung-Gook Park. "Analysis of a Schottky Barrier MOSFET for Synaptic Device Using Hot Carrier Injection." Journal of Nanoscience and Nanotechnology 20, no. 11 (November 1, 2020): 6592–95. http://dx.doi.org/10.1166/jnn.2020.18766.
Full textBelenky, G. L., A. Kastalsky, S. Luryi, P. A. Garbinski, A. Y. Cho, and D. L. Sivco. "Measurement of the effective temperature of majority carriers under injection of hot minority carriers in heterostructures." Applied Physics Letters 64, no. 17 (April 25, 1994): 2247–49. http://dx.doi.org/10.1063/1.111659.
Full textWang, Yimin, Yun Li, Yanbin Yang, and Wenchao Chen. "Hot Carrier Injection Reliability in Nanoscale Field Effect Transistors: Modeling and Simulation Methods." Electronics 11, no. 21 (November 4, 2022): 3601. http://dx.doi.org/10.3390/electronics11213601.
Full textLi, Mengyao, Yating Zhang, Xin Tang, Jitao Li, Silei Wang, Tengteng Li, Hongliang Zhao, Qingyan Li, Qi Wang, and Jianquan Yao. "Improving performance of hybrid perovskite/graphene-based photodetector via hot carriers injection." Journal of Alloys and Compounds 895 (February 2022): 162496. http://dx.doi.org/10.1016/j.jallcom.2021.162496.
Full textDissertations / Theses on the topic "Hot Carriers Injection"
Zaka, Alban. "Carrier injection and degradation mechanisms in advanced NOR Flash memories." Thesis, Grenoble, 2012. http://www.theses.fr/2012GRENT118/document.
Full textTran, Thi-Phuong-Yen. "CMOS 180 nm Compact Modeling Including Ageing Laws for Harsh Environment." Thesis, Bordeaux, 2022. http://www.theses.fr/2022BORD0185.
Full textIn the past decades, the demand for complicated functionality and high-density integration for Integrated Circuits (ICs) has resulted in metal-oxide-silicon (MOS) devices' scaling down. In this scenario, the reliability problems are the considerable concerns due to the device miniaturization, such as Hot Carrier Injection (HCI) and Bias Temperature Instability (BTI) that seriously impact the device performance. In some application fields where the cost of failure is extremely high such as space, oilfield, or healthcare, the device must be able to stably and reliably work, especially at an extensive temperature range. Although device failure mechanisms have been intensively investigated in the past, the investigations of these mechanisms at high temperatures are seldom studied.This thesis aims to develop the aging laws for 0.18µm CMOS technology to optimize circuit design for a targeted lifetime under extreme temperatures. We conducted an intensive aging test campaign for both nMOS and pMOS featuring several gate lengths. The intrinsic HCI and BTI mechanisms were characterized and modeled under typical operating voltage biases to avoid the risk of overaccelerating other wear-out mechanisms that are not supposed to be experienced in practical application. Our experiment is a long-term test with a stress time of up to 2,000 hours. This thesis presents measurement results up to 230°C that have never been studied before in the literature for this technology.The aging laws are finally integrated into an electronic design automation (EDA) environment to predict the evolution of the degraded transistor/circuit electrical parameters and the lifetime estimation due to the aging effects. In addition, the reliability test at the circuit level has been performed to validate and verify the proposed aging models. This approach offers the possibility to assess and simulate the IC specification drift due to the aging effect in the early design phase and optimize the circuit design over lifetime
Li, Binhong. "Etude de l'effet du vieillissement sur la compatibilité électromagnétique des circuits intégrés." Thesis, Toulouse, INSA, 2011. http://www.theses.fr/2011ISAT0033/document.
Full textWith the continuous trend towards nanoscale technology and increased integration of complex electronic functions in embedded systems, ensuring the electromagnetic compatibility (EMC) of electronic systems is a great challenge. EMC has become a major cause of IC redesign. Meanwhile, ICs performance could be affected by the degradation mechanisms such as hot carrier injection (HCI), negative bias temperature instability(NBTI), gate oxide breakdown, which are accelerated by the harsh operation conditions (high/low temperature, electrical overstress, radiation). This natural aging can thus affect EMC performances of ICs. The work developed in our laboratory aims at clarifying the link between ageing induced IC degradations and related EMC drifts, developing prediction models and proposing “time insensitive” EMC protection structures, in order to provide methods and guidelines to IC and equipment designers to ensure EMC during lifetime of their applications. This research topic is still under-explored as research communities on “IC reliability” and “IC electromagnetic compatibility” has often no overlap. The PhD manuscript introduced a methodology to quantify the effect of ageing on EMC of ICs by measurement and simulation. The first chapter gives an overview of the general context and the second chapter states the EMC of ICs state of the art and IC reliability issues. The experimental results of ICs EMC evolution are presented in the third chapter. Then, the fourth chapter is dedicated to the characterization and modeling IC degradation mechanism. An EMR model which includes the ageing element to predict our test chip’s EMC level drift after stress is proposed
Bertolini, Clément. "Estimation à haut-niveau des dégradations temporelles dans les processeurs : méthodologie et mise en oeuvre logicielle." Phd thesis, Université Sciences et Technologies - Bordeaux I, 2013. http://tel.archives-ouvertes.fr/tel-00952867.
Full textChen, Chang-Chih. "System-level modeling and reliability analysis of microprocessor systems." Diss., Georgia Institute of Technology, 2014. http://hdl.handle.net/1853/53033.
Full textLakhdari, Hacène. "Etude par technique spectroscopique de capacite transitoire des defauts a l'interface semiconducteur-isolant." Paris 6, 1988. http://www.theses.fr/1988PA066341.
Full textTseng, Shun-Shing, and 曾順星. "ILFD Using Dual Injection MOSFETs and Hot-Carrier Effects." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/5tk2a9.
Full text國立臺灣科技大學
電子工程系
102
First, A wide operation range parallel resonant divide-by-3 injection-locked frequency divider (ILFD) using a standard 0.18 μm CMOS process is presented. The ÷3 ILFD circuit is realized with a parallel resonant cross-coupled n-core MOS LC-tank oscillator. A tunable MOSFET resistor is used to tune the oscillation frequency and widens the operation range. Two direct-injection MOSFETs in series are used as a frequency doubler and a dynamic linear mixer to widen the locking range. The core power consumption of the ILFD core is 4.896 mW. At the incident power of 0 dBm, and the supply voltage of 0.8V, the maximum locking range is 1.6 GHz, from 10.6 GHz to 12.2 GHz and the operation range percentage of 47.6%, from 5 GHz to 13 GHz Secondly, we A wide locking and operation range parallel resonant divide-by-2/4 injection-locked frequency divider (ILFD) using a standard 0.18 μm CMOS process is presented. The ÷4/2 ILFD circuit is realized with a parallel resonant cross-coupled n-core MOS LC-tank oscillator. The ILFD uses a tunable resonator to have both wide operation and wide locking range. At the supply voltage of 0.92V, the core power consumption of the ILFD core is 7.9 mW. At the incident power of 0 dBm, the divide-by-2 locking range is 6 GHz, from 4.9 GHz to 10.9 GHz and the divide-by-4 locking range is 1.8 GHz, from 10.4 GHz to 12.2 GHz. The ILFD resonator can operates as a dual-resonance resonator or a single-resonance resonator. Finally, we investigates hot carrier (HC) effect on the RF characteristics of a wide-locking range divide-by-4 injection-locked frequency divider (ILFD). The ILFD was implemented in the TSMC 0.18 μm CMOS process. High supply voltage stresses were applied at room temperature on the ILFD. The main observed degradation is a decrease in power consumption due to channel mobility degradation. It was also found that the phase noises in both the free-running and locked state increase with stress time. The locking range of ILFD decreases with stress time and the optimized bias of injection transistor for the largest locking range shifts versus stress time.
Lin, Fa-Bo, and 林法伯. "Design of Injection Locked Frequency Divider and Hot Carrier Effects of Injection Locked Frequency Divider." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/50431791342256963033.
Full text國立臺灣科技大學
電子工程系
102
This thesis presents two Injection Locked Frequency Dividers (ILFDs). First one is a wide-locking range Injection Locked Frequency Divider by 2. Second one is a wide-locking range Injection Locked Frequency Divider by 4. Finally, we present two Injection locked frequency divider’s hot-carrier effects experiment. The above circuits are fabricated in the TSMC 0.18 μm CMOS process and 0.18um SiGe process. Firstly, we present a novel wide locking range divide-by-2 injection-locked frequency divider (ILFD) and the divider is implemented in the TSMC 0.18 μm 1P6M CMOS process. The divide-by-2 ILFD is based on a cross-coupled voltage-controlled oscillator (VCO)consist of a parallel-tuned LC resonator as well as injection MOSFETs with source voltage coupled from VCO output and the injection MOSFET is a linear mixer. At the drain-source bias of 0.9 V, and at the incident power of 0 dBm the locking range of the divide-by-2 ILFD is 6.4 GHz, from the incident frequency 3.7 GHz to 10.1 GHz, the percentage is 92.75%. A novel wide locking range divide-by-4 injection-locked frequency divider (ILFD) is proposed in the thesis and was implemented in the TSMC 0.18 μm 1P6M CMOS process. The divide-by-4 ILFD is based on a cross-coupled voltage-controlled oscillator (VCO) with a parallel-tuned LC resonator and injection MOSFETs with source voltage coupled from VCO output and the injection MOSFET is a linear mixer. At the drain-source bias of 0.9 V, and at the incident power of 0 dBm the locking range of the divide-by-4 is 2.7 GHz, from the incident frequency 14.1 GHz to 16.8 GHz, the percentage is 17.47%. The core power consumption is 16.56 mW. The die area is 0.839 ×0.566 mm2. Secondly, a divide-by-2 injection-locked frequency divider (ILFD) is designed for hot-carrier stress experimental study. The ILFD is made of a parallel-tuned cross-coupled voltage-controlled oscillator and a capacitive direct-injection MOSFET composite, consisted two MIM capacitors in series with an injection MOSFET. The injection MOSFET is first dc-stressed, and degradation in locking range in the post-stress ILFD was found. Then the whole ILFD is overvoltage-stressed, and degradation in locking range in the post-stress ILFD was also found. The latter stress reduces the current consumption and output power, while the former increases the current consumption and output power. Finally, a divide-by-2 injection-locked frequency divider (ILFD) is designed in the 0.18μm CMOS technology for hot-carrier stress experimental study. The ILFD was tested at two bias conditions. At fixed supply voltage, the stress damage is larger when the gate of injection MOSFET is dc-biased below the supply voltage rather than equal to the supply voltage. The stress cause the degradation of locking range, current consumption and shifts the oscillation frequency.
Hsieh, Jen-Hsiang, and 謝仁翔. "Design and Hot Carrier Stress Effect ofNovel Injection-Locked Frequency Divider." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/42871692762723508514.
Full text國立臺灣科技大學
電子工程系
101
In the RF transceiver, PLL characteristics are very important, PLL to including Phase Frequency Detector (PFD),Charge Pump (CP),Loop Filter (LF),Voltage Controlled Oscillator (VCO), and Frequency Divider (FD), In order to pursue low-power, low phase noise, wide operating frequency range, Among them, the most important performance of the VCO and Divider. First, this thesis presents two divider-by-3 injection locked frequency dividers. In the first circuit, we use internal feedback to enhance locking frequency, the ILFD was implemented with the TSMC 0.18 μm SiGe 3P6M BiCMOS process, and the core power consumption is 13.2 mW at the dc drain-source bias of 0.8 V. and tuning range is from 3.079 to 3.163 GHz. At the input power of 0 dBm, the locking range is from 8.9 GHz to 10.8 GHz (19.28 %), the operation range is from 8.9 to 11 GHz(21.1%), and the die area is 0.620 * 0.871 mm2. Secondly, we presents a mixer twice in divider-by-3 injection locked frequency dividers, the ILFD was implemented with the TSMC 0.18 μm 1P6M CMOS process, and the core power consumption is 11.496 mW at the dc drain-source bias of 0.8 V. The tuning range is from 4.32 to 3.78 GHz, At the input power of 0 dBm, the locking range is from 10.5 GHz to 13.5 GHz (25 %), while the operation range is from 9.9 to 13.5 GHz(30.76%), The die area is 0.659 * 0.887 mm2. Then, we measure hot carrier stress effects on the different parameters of these two circuit of circuit architecture, such as phase noise, locking range, current, tuning range, we do analysis and discussion for the measured result. Finally, we presents a Triple-Band Voltage-Controlled Oscillator, the VCO was implemented with the TSMC 0.18 μm 1P6M CMOS process, and the core power consumption is 3.735 mW at the dc drain-source bias of 0.75 V. The VCO can generate differential signals in the frequency range of 6.98-7.41GHz, 5.28-5.31GHz, and 4.27-4.49GHz. The die area is 0.568*1.189 mm2.
Yih, Cherng-Ming, and 易成名. "Investigation of Hot-Carrier Injection Induced Reliability Issues in Flash Memories." Thesis, 1999. http://ndltd.ncl.edu.tw/handle/73427801549497138777.
Full text國立交通大學
電子工程系
87
Hot carrier induced reliability issues have become increasingly important for miniaturized flash memory design. These reliability issues include hot carrier related issues, such as oxide damage, program/erase cycling endurance, disturbance, and data retention. In this dissertation, the hot-carrier injection induced reliability problems in stacked-gate flash memories is investigated. First, a new model based on the charge-balance theory was proposed to accurately calculate the floating gate voltage. Based on the new model, the method to determine the capacitive coupling coefficients and a compact SPICE model was developed. Then, an oxide damage characterization method was developed for simultaneously determining the lateral distributions of interface states (Nit) and oxide charges (Qox) under both channel-hot-electron programming bias and source FN erase bias stress conditions. According to the extracted profiles of Nit and Qox, a new gate current model was successfully developed for the first time by taking the hot-electron stress generated Nit and Qox into account. In this model, we suggest that Nit filled with electrons will serve as a new scattering center and reduce the hot-electron injection probability. The generated Qox is also introduced as an additional factor affecting the potential barrier at the Si-SiO2 interface. Moreover, the oxide-field dependent stress-induced leakage current (SILC) as well as its related disturbance on the source FN erased flash memory has been studied by using a new approach. The salient features of the method are two fold. One is that the individual contributions of SILC and disturbance due to either carrier charging/discharging in the oxide or positive charge-assisted/trap-assisted tunneling (PCAT/TAT) of electrons into the floating gate can be separated. The other one is that it is very sensitive to determine the ultra-low SILC (< 10-20 A). In this study, we first observed that the generated Nit dominates the gate current degradation not only at the IB,max stress condition but also at the IG,max stress condition. The major programming degradation mechanisms of flash memory cells after P/E cycles due to Nit was also identified. In addition, we also observed that the carrier charging/discharging in the oxide is the main disturb mechanism at low oxide field. At high oxide field, PCAT/TAT of electrons into the floating gate is the major cause for the disturb failure.
Book chapters on the topic "Hot Carriers Injection"
Huard, Vincent, Florian Cacho, Xavier Federspiel, and Pascal Mora. "Hot-Carrier Injection Degradation in Advanced CMOS Nodes: A Bottom-Up Approach to Circuit and System Reliability." In Hot Carrier Degradation in Semiconductor Devices, 401–44. Cham: Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-08994-2_14.
Full textBhargava, Mudit, and Ken Mai. "A High Reliability PUF Using Hot Carrier Injection Based Response Reinforcement." In Cryptographic Hardware and Embedded Systems - CHES 2013, 90–106. Berlin, Heidelberg: Springer Berlin Heidelberg, 2013. http://dx.doi.org/10.1007/978-3-642-40349-1_6.
Full textKühn, Johannes Maximilian, Oliver Bringmann, and Wolfgang Rosenstiel. "Increasing Reliability Using Adaptive Cross-Layer Techniques in DRPs: Just-Safe-Enough Responses to Reliability Threats." In Dependable Embedded Systems, 121–38. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-52017-5_5.
Full text"Hot Carrier Injection Instability." In Silicon RF Power MOSFETs, 243–74. WORLD SCIENTIFIC, 2005. http://dx.doi.org/10.1142/9789812569325_0010.
Full textPejovi, Momilo, Predrag Osmokrovi, Milica Pejovi, and Koviljka Stankovi. "Influence of Ionizing Radiation and Hot Carrier Injection on Metal-Oxide-Semiconductor Transistors." In Current Topics in Ionizing Radiation Research. InTech, 2012. http://dx.doi.org/10.5772/39263.
Full textVuillaume, D. "Chapter 4 Hot carrier injections in SIO2 and related instabilities in submicrometer mosfets." In New Insulators, Devices and Radiation Effects, 265–339. Elsevier, 1999. http://dx.doi.org/10.1016/s1874-5903(99)80010-x.
Full textEnoki, Toshiaki, Morinobu Endo, and Masatsugu Suzuki. "Highly Conductive Graphite Fibers." In Graphite Intercalation Compounds and Applications. Oxford University Press, 2003. http://dx.doi.org/10.1093/oso/9780195128277.003.0012.
Full textKennel, Charles F. "Coordination Of The Geosynchronous And Auroral Substorms." In Convection and Substorms. Oxford University Press, 1996. http://dx.doi.org/10.1093/oso/9780195085297.003.0017.
Full textVoren, Robert van, and Robert Keukens. "The abuse of psychiatry." In Psychiatric Ethics, edited by Sidney Bloch and Stephen A. Green, 143–56. Oxford University Press, 2021. http://dx.doi.org/10.1093/med/9780198839262.003.0007.
Full textHaq, Shamsul. "Effect of Materials Content on Dimensional Stability, Nano Roughness and Interfaced Morphology for Virgin or Recycled Polypropylene Based Wood Composites." In Engineered Wood Products for Construction [Working Title]. IntechOpen, 2021. http://dx.doi.org/10.5772/intechopen.99588.
Full textConference papers on the topic "Hot Carriers Injection"
Matsui, Takayuki, Yi Li, Rupert F. Oulton, Lesley F. Cohen, and Stefan A. Maier. "Plasmonic Hot Carrier Detection via SrTiO3 Interfacial Layer." In JSAP-OSA Joint Symposia. Washington, D.C.: Optica Publishing Group, 2018. http://dx.doi.org/10.1364/jsap.2018.19p_211b_12.
Full textBaeg, Sanghyeon, Pierre Chia, ShiJie Wen, and Richard Wong. "DRAM failure cases under hot-carrier injection." In 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011). IEEE, 2011. http://dx.doi.org/10.1109/ipfa.2011.5992747.
Full textCacho, F., W. Arfaoui, P. Mora, X. Federspiel, V. Huard, and E. Dornel. "Modeling of hot carrier injection across technology scaling." In 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW). IEEE, 2014. http://dx.doi.org/10.1109/iirw.2014.7049514.
Full textBolshakov, P., R. A. Rodriguez-Davila, M. Quevedo-Lopez, and C. D. Young. "Deconvolution of Hot Carrier and Cold Carrier Injection in ZnO TFTs." In 2020 IEEE Silicon Nanoelectronics Workshop (SNW). IEEE, 2020. http://dx.doi.org/10.1109/snw50361.2020.9131625.
Full textLahbib, Insaf, Aziz Doukkali, Patrick Martin, Guy Imbert, and Denis Raoulx. "Hot carrier injection effect on threshold voltage of NMOSFETs." In 2015 11th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME). IEEE, 2015. http://dx.doi.org/10.1109/prime.2015.7251360.
Full textMitsuhashi, J., S. Nakao, and T. Matsukawa. "Mechanical stress and hydrogen effects on hot carrier injection." In 1986 International Electron Devices Meeting. IRE, 1986. http://dx.doi.org/10.1109/iedm.1986.191199.
Full textGrupen, Matthew E., and Karl Hess. "Hot carrier effects in conventional injection and tunneling injection quantum well laser diodes." In Photonics West '97, edited by Marek Osinski and Weng W. Chow. SPIE, 1997. http://dx.doi.org/10.1117/12.275598.
Full textLee, Dong Seup, Dhanoop Varghese, Arif Sonnet, Jungwoo Joh, Archana Venugopal, and Srikanth Krishnan. "Impact of self-heating effect in hot carrier injection modeling." In 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD). IEEE, 2018. http://dx.doi.org/10.1109/ispsd.2018.8393666.
Full textSabnis, A. G., and J. T. Nelson. "Characterization of Si/SiO2interface degradation due to hot-carrier injection." In 1985 International Electron Devices Meeting. IRE, 1985. http://dx.doi.org/10.1109/iedm.1985.190889.
Full textRao, R. A., R. F. Steimle, M. Sadd, C. Swift, R. Muralidhar, B. Hradsky, S. Straub, E. Prinz, J. Yater, and B. E. White Jr. "Hot Carrier Injection/Fowler Nordheim Erase Silicon Nanocrystal Memory Cell." In 2003 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2003. http://dx.doi.org/10.7567/ssdm.2003.b-6-1.
Full textReports on the topic "Hot Carriers Injection"
Ficht, Thomas, Gary Splitter, Menachem Banai, and Menachem Davidson. Characterization of B. Melinensis REV 1 Attenuated Mutants. United States Department of Agriculture, December 2000. http://dx.doi.org/10.32747/2000.7580667.bard.
Full textAltstein, Miriam, and Ronald J. Nachman. Rational Design of Insect Control Agent Prototypes Based on Pyrokinin/PBAN Neuropeptide Antagonists. United States Department of Agriculture, August 2013. http://dx.doi.org/10.32747/2013.7593398.bard.
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