Journal articles on the topic 'High-temperature electronics packaging'
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Slater, Conor, Radisav Cojbasic, Thomas Maeder, Yusuf Leblebici, and Peter Ryser. "Packaging technologies for high temperature control electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, HITEN (January 1, 2013): 000184–92. http://dx.doi.org/10.4071/hiten-tp15.
Full textFraley, John R., Edgar Cilio, and Bryon Western. "Advanced Applications of High Temperature Magnetics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, HITEN (January 1, 2013): 000046–55. http://dx.doi.org/10.4071/hiten-ma17.
Full textKumar, Rakesh. "A High Temperature and UV Stable Vapor Phase Polymer for Electronics Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000207–14. http://dx.doi.org/10.4071/hiten-paper3-rkumar.
Full textKumar, Rakesh. "Parylene HT®: A High Temperature Vapor Phase Polymer for Electronics Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (January 1, 2010): 000108–13. http://dx.doi.org/10.4071/hitec-rkumar-tp13.
Full textNasiri, Ardalan, Simon S. Ang, Tom Cannon, Errol V. Porter, Kaoru Uema Porter, Caitlin Chapin, Ruiqi Chen, and Debbie G. Senesky. "High-Temperature Electronics Packaging for Simulated Venus Condition." Journal of Microelectronics and Electronic Packaging 17, no. 2 (April 1, 2020): 59–66. http://dx.doi.org/10.4071/imaps.1115241.
Full textDaves, Glenn G. "Trends in Automotive Packaging." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (January 1, 2014): 001818–50. http://dx.doi.org/10.4071/2014dpc-keynote_th1_daves.
Full textShaddock, David, Cathleen Hoel, Nancy Stoffel, Mark Poliks, and Mohammed Alhendi. "Additively Manufactured Extreme Temperature Electronics Packaging." International Symposium on Microelectronics 2021, no. 1 (October 1, 2021): 000189–94. http://dx.doi.org/10.4071/1085-8024-2021.1.000189.
Full textFang, Kun, Rui Zhang, Tami Isaacs-Smith, R. Wayne Johnson, Emad Andarawis, and Alexey Vert. "Thin Film Multichip Packaging for High Temperature Digital Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000039–45. http://dx.doi.org/10.4071/hiten-paper1-rwjohnson.
Full textMcCluskey, F. P., L. Condra, T. Torri, and J. Fink. "Packaging Reliability for High Temperature Electronics: A Materials Focus." Microelectronics International 13, no. 3 (December 1996): 23–26. http://dx.doi.org/10.1108/13565369610800386.
Full textGuo, Xiaorui, Qian Xun, Zuxin Li, and Shuxin Du. "Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review." Micromachines 10, no. 6 (June 19, 2019): 406. http://dx.doi.org/10.3390/mi10060406.
Full textKumar, Rakesh. "A high temperature nano/micro vapor phase conformal coating for electronics applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (January 1, 2015): 000083–90. http://dx.doi.org/10.4071/hiten-session3a-paper3a_1.
Full textKE, Haotao, and Douglas C. Hopkins. "Development of Printed Power Packaging for a High Voltage SiC Module." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000955–60. http://dx.doi.org/10.4071/isom-2012-wp55.
Full textKhazaka, R., L. Mendizabal, D. Henry, and R. Hanna. "Survey of High-Temperature Reliability of Power Electronics Packaging Components." IEEE Transactions on Power Electronics 30, no. 5 (May 2015): 2456–64. http://dx.doi.org/10.1109/tpel.2014.2357836.
Full textYiying Yao, Guo-Quan Lu, Dushan Boroyevich, and Khai D. T. Ngo. "Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging." IEEE Transactions on Components, Packaging and Manufacturing Technology 5, no. 2 (February 2015): 168–81. http://dx.doi.org/10.1109/tcpmt.2014.2337300.
Full textRiches, S. T., K. Cannon, C. Johnston, M. Sousa, P. Grant, J. Gulliver, M. Langley, et al. "Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing Circuits." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (January 1, 2010): 000089–96. http://dx.doi.org/10.4071/hitec-sriches-tp11.
Full textRiches, S. T., C. Johnston, M. Sousa, and P. Grant. "High Temperature Endurance of Packaged SOI Devices for Signal Conditioning and Processing Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000251–54. http://dx.doi.org/10.4071/hiten-paper8-sriches.
Full textWilliams, Jennifer, and Johnson Matthey. "High Temperature Protection against Unwanted Species within Hermetic Packaging." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (January 1, 2015): 000116–22. http://dx.doi.org/10.4071/hiten-session3b-paper3b_3.
Full textHunter, Gary W., Philip G. Neudeck, Robert S. Okojie, Glenn M. Beheim, J. A. Powell, and Liangyu Chen. "An Overview of High-Temperature Electronics and Sensor Development at NASA Glenn Research Center." Journal of Turbomachinery 125, no. 4 (October 1, 2003): 658–64. http://dx.doi.org/10.1115/1.1579508.
Full textPhua, Eric Jian Rong, Ming Liu, Bokun Cho, Qing Liu, Shahrouz Amini, Xiao Hu, and Chee Lip Gan. "Novel high temperature polymeric encapsulation material for extreme environment electronics packaging." Materials & Design 141 (March 2018): 202–9. http://dx.doi.org/10.1016/j.matdes.2017.12.029.
Full textQuintero, Pedro O., and F. Patrick McCluskey. "Silver-Indium Transient Liquid Phase Sintering for High Temperature Die Attachment." Journal of Microelectronics and Electronic Packaging 6, no. 1 (January 1, 2009): 66–74. http://dx.doi.org/10.4071/1551-4897-6.1.66.
Full textRiches, S. T., C. Johnston, and A. Lui. "Realisation of High Temperature Electronics Packaging Technology for Sensor Conditioning and Processing Applications." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000192–99. http://dx.doi.org/10.4071/isom-2012-ta61.
Full textFang, Kun, Tami Isaacs-Smith, R. Wayne Johnson, Alexey Vert, Tan Zhang, and David Shaddock. "Recent Progress in Thin Film Multichip Packaging for High Temperature Digital Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (January 1, 2012): 000407–12. http://dx.doi.org/10.4071/hitec-thp23.
Full textChiolino, N., A. M. Francis, J. Holmes, M. Barlow, and C. Perkowski. "470 Celsius Packaging System for Silicon Carbide Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2021, HiTEC (April 1, 2021): 000083–88. http://dx.doi.org/10.4071/2380-4491.2021.hitec.000083.
Full textVert, Alexey, Cheng-Po Chen, Amita Patil, Rich Saia, Emad Andarawis, Avinash Kashyap, Tan Zhang, et al. "Silicon Carbide High Temperature Operational Amplifier." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (January 1, 2012): 000378–83. http://dx.doi.org/10.4071/hitec-thp12.
Full textRashid, S. J., C. Mark Johnson, F. Udrea, Andrej Mihaila, G. Amaratunga, and Rajesh Kumar Malhan. "Analysis of Novel Packaging Techniques for High Power Electronics in SiC." Materials Science Forum 556-557 (September 2007): 971–74. http://dx.doi.org/10.4028/www.scientific.net/msf.556-557.971.
Full textFan, Jiajie, Dawei Jiang, Hao Zhang, Dong Hu, Xu Liu, Xuejun Fan, and Guoqi Zhang. "High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging." Results in Physics 33 (February 2022): 105168. http://dx.doi.org/10.1016/j.rinp.2021.105168.
Full textBecker, K. F., T. Thomas, J. Bauer, R. Kahle, T. Braun, R. Aschenbrenner, M. Schneider-Ramelow, and K. D. Lang. "Smart Power Module Molding Advances: Evaluating high temperature suitability of Molding Compounds." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000177–82. http://dx.doi.org/10.4071/isom-2013-ta62.
Full textFraley, John R., Lauren Kegley, Stephen Minden, Jimmy L. Davidson, and David Kerns. "HIGH TEMPERATURE HYBRID NANODIAMOND SENSOR SYSTEMS." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, HITEC (January 1, 2014): 000034–39. http://dx.doi.org/10.4071/hitec-ta23.
Full textSmarra, Devin A., Guru Subramanyam, Vamsy P. Chodavarapu, Sivaram P. Gogineni, Kenneth J. Semega, and Alireza R. Behbahani. "Embedded Passive Circuit Elements in Low Temperature Co-Fired Ceramic Substrates for Aerospace Electronics." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000417–25. http://dx.doi.org/10.4071/isom-2017-wp35_142.
Full textHornberger, J., B. McPherson, J. Bourne, R. Shaw, E. Cilio, W. Cilio, B. Reese, et al. "High Temperature Silicon Carbide Power Modules for High Performance Systems." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000159–66. http://dx.doi.org/10.4071/hiten-paper5-jhornberger.
Full textGuo, Wei, Zhi Zeng, Xiaoying Zhang, Peng Peng, and Shanping Tang. "Low-Temperature Sintering Bonding Using Silver Nanoparticle Paste for Electronics Packaging." Journal of Nanomaterials 2015 (2015): 1–7. http://dx.doi.org/10.1155/2015/897142.
Full textLow, Yee L., Ronald E. Scotti, David A. Ramsey, Cristian A. Bolle, Steven P. O’Neill, and Khanh C. Nguyen. "Packaging of Optical MEMS Devices." Journal of Electronic Packaging 125, no. 3 (September 1, 2003): 325–28. http://dx.doi.org/10.1115/1.1535933.
Full textTatsumi, Hiroaki, and Hiroshi Nishikawa. "Anisotropic highly conductive joints utilizing Cu-solder microcomposite structure for high-temperature electronics packaging." Materials & Design 223 (November 2022): 111204. http://dx.doi.org/10.1016/j.matdes.2022.111204.
Full textKaessner, Stefan, Markus G. Scheibel, Stefan Behrendt, Bianca Boettge, Christoph Berthold, and Klaus G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging." Journal of Microelectronics and Electronic Packaging 15, no. 3 (July 1, 2018): 132–39. http://dx.doi.org/10.4071/imaps.661015.
Full textKaessner, S., M. G. Scheibel, S. Behrendt, B. Boettge, and K. G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000425–33. http://dx.doi.org/10.4071/2380-4505-2018.1.000425.
Full textChen, Liang-Yu. "Electrical Performance of Cofired Alumina Substrates at High Temperatures." Journal of Microelectronics and Electronic Packaging 10, no. 3 (July 1, 2013): 89–94. http://dx.doi.org/10.4071/imaps.375.
Full textSlater, Conor, Fabrizio Vecchio, Thomas Maeder, and Peter Ryser. "Characterisation of test vehicle for in-situ measurement of die attach thermal conductivity." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000030–34. http://dx.doi.org/10.4071/cicmt-2012-ta15.
Full textKaplar, Robert J., Jason C. Neely, Dale L. Huber, and Lee J. Rashkin. "Generation-After-Next Power Electronics: Ultrawide-bandgap devices, high-temperature packaging, and magnetic nanocomposite materials." IEEE Power Electronics Magazine 4, no. 1 (March 2017): 36–42. http://dx.doi.org/10.1109/mpel.2016.2643098.
Full textHirose, Akio, Naoya Takeda, Yosuke Konaka, Hiroaki Tatsumi, Yusuke Akada, Tomo Ogura, Eiichi Ide, and Toshiaki Morita. "Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag2O for Packaging of High-Temperature Electronics." Materials Science Forum 706-709 (January 2012): 2962–67. http://dx.doi.org/10.4028/www.scientific.net/msf.706-709.2962.
Full textChen, Liang-Yu. "Electrical Performance of Co-Fired Alumina Substrates at High Temperatures." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (January 1, 2012): 000173–78. http://dx.doi.org/10.4071/hitec-2012-wa22.
Full textLi, Mingli, Na Gong, Jinhui Wang, and Zhibin Lin. "Phase Change Material for Thermal Management in 3D Integrated Circuits Packaging." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000649–53. http://dx.doi.org/10.4071/isom-2015-tha44.
Full textWang, Baron, Andrea S. Chen, and Randy H. Y. Lo. "Characteristics of Organic-Based Thermal Interface Materials Suitable for High Temperature Operation." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (July 1, 2019): 000041–44. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000041.
Full textRiches, S. T., C. Johnston, A. Crossley, and P. Grant. "End of Life Failure Modes for Packaged SOI Devices for Signal Conditioning and Processing Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (January 1, 2012): 000327–34. http://dx.doi.org/10.4071/hitec-2012-tha21.
Full textSpory, Erick M. "Increased High-Temperature IC Packaging Reliability Using Die Extraction and Additive Manufacturing Assembly." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, HiTEC (January 1, 2016): 000018–22. http://dx.doi.org/10.4071/2016-hitec-18.
Full textLiu, Canyu, Allan Liu, Yutai Su, Zhaoxia Zhou, and Changqing Liu. "Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging." Microelectronics Reliability 126 (November 2021): 114241. http://dx.doi.org/10.1016/j.microrel.2021.114241.
Full textValdez-Nava, Zarel, Sophie Guillemet-Fritsch, Marc Ferrato, Masahiro Kozako, and Thierry Lebey. "Co-fired AlN–TiN assembly as a new substrate technology for high-temperature power electronics packaging." Ceramics International 39, no. 8 (December 2013): 8743–49. http://dx.doi.org/10.1016/j.ceramint.2013.04.060.
Full textPaul, Riya, Amol Deshpande, Fang Luo, and Wei Fan. "Thermal Management in High-Density High-Power Electronics Modules Using Thermal Pyrolytic Graphite." International Symposium on Microelectronics 2020, no. 1 (September 1, 2020): 000259–63. http://dx.doi.org/10.4071/2380-4505-2020.1.000259.
Full textCobley, A. J., J. E. Graves, A. Kassim, B. Mkhlef, and B. Abbas. "Ultrasonically Enabled Low Temperature Electroless Plating for Advanced Electronic Manufacture." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000183–87. http://dx.doi.org/10.4071/isom-2013-ta63.
Full textChen, Liang-Yu. "Improvement of Dielectric Performance of a Prototype AlN High Temperature Chip-level Package." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000052–57. http://dx.doi.org/10.4071/hiten-paper3-lchen.
Full textRoss, R. G. "A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging." Journal of Electronic Packaging 113, no. 2 (June 1, 1991): 121–28. http://dx.doi.org/10.1115/1.2905377.
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