Relevant bibliographies by topics / High-speed packaging machinery

Academic literature on the topic 'High-speed packaging machinery'

Author: Grafiati
Published: 10 December 2022
Last updated: 28 January 2023

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Journal articles on the topic "High-speed packaging machinery"

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Shao, Wei, and Li Juan Sun. "Electronic Anti-Cut for Automatic High Speed Horizontal Flow Wrapper with ECAM." Advanced Materials Research 472-475 (February 2012): 1592–97. http://dx.doi.org/10.4028/www.scientific.net/amr.472-475.1592.

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In this paper, a DSP-based servo motion controller is developed for the horizontal flow wrapper, where the multi-axis servo drives and electronic anti-cut are designed to improve automatization and safety for the packaging system. This paper relates generally to high speed packaging machinery with electronic cam and more particularly to the process of electronic anti-cut, where product-out-of-registration conditions can be sensed and automatically passed without damage to the seal heads and without manual intervention.
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Sirkett, D. M., B. J. Hicks, C. Berry, G. Mullineux, and A. J. Medland. "Finite element simulation of folding carton erection failure." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 221, no. 7 (July 1, 2007): 753–67. http://dx.doi.org/10.1243/0954406jmes502.

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In response to recent European Union (EU) regulations on packaging waste, the packaging industry requires greater fundamental understanding of the machine-material interactions that take place during packaging operations. Such an understanding is necessary to handle thinner lighter-weight materials, specify the material properties required for successful processing and design right-first-time machinery. The folding carton industry, in particular, has been affected by the new legislation and needs to realize the potential of computational tools for simulating the behaviour of packaging materials and generating the necessary understanding. This paper describes the creation and validation of a detailed finite element model of a carton during a common packaging operation. The model is applied here to address the problem of carton buckling. The carton was modelled using a linear elastic material definition with non-linear crease behaviour. Air inrush suction, which is believed to cause buckling, was quantified experimentally and incorporated using contact damping interactions. The results of the simulation are validated against high-speed video of carton production. The model successfully predicts the pattern of deformation of the carton during buckling and its increasing magnitude with production rate. The model can be applied to study the effects of variation in material properties, pack properties and machine settings. Such studies will improve responsiveness to change and will ultimately allow end-users to use thinner, lighter-weight materials in accordance with the EU regulations.
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Wang, Hui Mi, Ji Rong Ye, Ming Liu, Fan Wei Lin, Wei Chen, and Feng Chen. "Monitoring System Design of High-Speed Carton Packaging Machine Based on PCC and Servo Control." Advanced Materials Research 542-543 (June 2012): 609–15. http://dx.doi.org/10.4028/www.scientific.net/amr.542-543.609.

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A high-speed carton packaging machine is developed in view of the current of low-degree automation and low-speed in the packaging industry. Monitoring system of this high-speed carton packaging machine is designed on basis of B&R programmable computer control (PCC) system according to the structure of the packaging machine and process control requirements, and has automatically achieved to feed pad, feed bottles, group bottles, spray glue, package with Servo synchronization technology. The high-speed carton packaging machine has reached world advanced level in performance and packaging speed at the speed of 80 packages per minute.
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Tang, Wan You, Zhen Rong Wang, and Rui Xue Jiang. "Research of Picture Adaptive Processing for Packaging Printing Online Detection." Applied Mechanics and Materials 469 (November 2013): 368–71. http://dx.doi.org/10.4028/www.scientific.net/amm.469.368.

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In the process of printing machines increasing and reduction of speed, the image collected from online detection system for different speed of printing needs picture adaptive processing. In this paper, there are two methods put forward to realize above goal. One method is sequential similarity detection algorithms and the other is ratio value. Apply with VC++ programming to realize image matching on the premise of the unique CCD detection equipment. The experiment results show that: sequential similarity algorithm on the premise of printing machine running in low speed, by comparing with threshold to realize variable-speed imaging. The ratio value method can be used for a variety of printing speed and it has high speed, high detection efficiency and wide range of application.
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Reiner, Philip, Arthur Jenkins, Sharon Sanchez, Tracy D. Hudson, and Michael Kranz. "MEMS Based Transducer Designs for Monitoring High Speed Impacts." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 000616–32. http://dx.doi.org/10.4071/2012dpc-ta33.

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MEMS based technologies provide a unique opportunity to develop micro-machined mechanical transducers for a variety of sensing applications. The micro-machining techniques that have been widely used for MEMS sensors provide a viable path for developing miniature sensors required for monitoring stress and strain for high speed impacts. Moreover, this technology allows sensors to be tailored to respond to specific vibrational modes and mode types. In particular, the electro-mechnical properties must be able to support very short response times without compromising signal strength. In this paper, we present the design and fabrication of micro-miniature PNZT based transducers for short duration mechanical impacts. Comparisons of their performance with conventional PZT transducers are presented. A discussion is also given of key performance parameters and the effects of post-fabrication processing and packaging on transducer performance.
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Qian, Jie, Li Ming Zhu, Zhen Xun Jin, and Huan Le. "Research and Application of WCF Technology in Data Acquisition of Ultra-high Speed Packaging Machine." MATEC Web of Conferences 63 (2016): 04039. http://dx.doi.org/10.1051/matecconf/20166304039.

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Honma, Katsumi, and Shin-ichi Nakajima. "Development of a Liquid Packaging Machine Positioning Control on Moving Film." International Journal of Automation Technology 5, no. 1 (January 5, 2011): 61–65. http://dx.doi.org/10.20965/ijat.2011.p0061.

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A liquid packaging machine produces liquid packaging bags from roll film by cooperatively controlling the vertical seal roller, horizontal seal roller, and cut roller. These rollers are driven separately by servomotors as a multi-axis servo mechanism. Positioning control on the moving film is essential to make bags of accurate size. To achieve accurate positioning without lowering productivity, we propose two control methods. One is a two-step velocity control of the horizontal seal roller. This method enables continuous and high speed production of bags of arbitrary size. The second is phase control, which determines the accuracy of the cutting position on the film according to the sealing position. Phase control changes the rotary phase difference of the horizontal seal roller and the cut roller by adjusting the high feeding velocity of the cut roller, or by adjusting the low feeding velocity of the cut roller. The control system developed was applied to a DANGANV liquid packaging machine.
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Sun, Hong Jun. "Research on Empty Bottle Image Inspecting System Based on Machine Vision." Advanced Materials Research 756-759 (September 2013): 686–89. http://dx.doi.org/10.4028/www.scientific.net/amr.756-759.686.

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Characterized with auto inspecting ability, high-speed and accuracy, machine vision technology is one of the most important means in medicine packaging and food processing industries. A structural system based on PC, DSP and visual sensor is presented in this paper. A sub pixel edge detection algorithm in image processing for high precision automatic alignment system which was an urgent problem on the actual machine vision field. The algorithm uses the spatial moments to detect the location of the edge in sub-pixel which improved the analysis speed and optimized the application of the whole system.
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Do, Minh, Lawrence Lee, Rong Zhou, Lara Crawford, and Serdar Uckun. "Online Planning to Control a Packaging Infeed System." Proceedings of the AAAI Conference on Artificial Intelligence 25, no. 2 (August 11, 2011): 1636–41. http://dx.doi.org/10.1609/aaai.v25i2.18852.

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In this paper, we investigate a novel application of online planning and scheduling: controlling an automated infeeder for a packaging line of food and consumer packaged goods. In this system, products arrive continuously at high-speed from the end of the production line and need to be arranged into a specific configuration for downstream primary and secondary packaging machines. In collaboration with a domain expert from the packaging industry, we developed an innovative design for a reconfigurable parallel infeed system using a matrix of interchangeable smart belts. We also adapted our online model-based Plantrol planner to this domain. Our planner can control various configurations of the new in-feed system through simulation both in nominal planning and when runtime failures occur. We are also building a small physical prototype to validate the new design and our sofeware framework.
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Yang, Kai, Zhong Shen Li, and Lei Zhang. "Research and Development of Automatic Control System on Material Split Packing and Packaging Integrated Machine." Applied Mechanics and Materials 533 (February 2014): 294–97. http://dx.doi.org/10.4028/www.scientific.net/amm.533.294.

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In order to meet the high speed, high precision, high reliability of the packaging machine, a novel control system is provided. In the hardware, the main circuits consisted of main processor module, memory module, temperature measurement and control module, input signal detection module, material split packing module, output driver module, human-machine interface module, system monitor module, power module and JTAG debug module, etc. In the software, the multi-tasking operating system μC/OS-Ⅱ and the graphical user interface μC/GUI were successfully transplanted into LPC2478. Then an experimental platform was established. And many control tasks, including automatic measurement, making bags, loading, transferring, pumping vacuum, sealing and data display, were automatically and continuously executed on the platform. Finally the results show: the machine can package 30 packets (5 g per packet) in a minute; the packaging errors ≤ 0.2 g; the packaging qualified rates ≥ 93%. In conclusion, the system performance is good.
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Dissertations / Theses on the topic "High-speed packaging machinery"

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Rushforth, E. J. "Mechatronic design of high-speed packaging machinery." Thesis, Loughborough University, 1997. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.285913.

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Grimes, Ryan T. "Design Of An Adjustable Sensing And Control Network For High Speed Product Packaging Machines." University of Cincinnati / OhioLINK, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1236086640.

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Grimes, Ryan T. "Design of an ajustable sensing and control network for high speed product packaging machines." Cincinnati, Ohio : University of Cincinnati, 2009. http://www.ohiolink.edu/etd/view.cgi?acc_num=ucin1236086640.

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Thesis (M.S.)--University of Cincinnati, 2009.
Advisors: Emmanuel Fernandez PhD (Committee Chair), Arthur Helmicki PhD (Committee Member), Ali Minai PhD (Committee Member). Title from electronic thesis title page (viewed April 26, 2009). Includes abstract. Includes bibliographical references.
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Books on the topic "High-speed packaging machinery"

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El-Toudmeri, M. J. Automated manipulation techniques for high speed packaging machinery. Birmingham: University of Birmingham, 1989.

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Rushforth, Emma J. Mechatronic design of high-speed packaging machinery. 1997.

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Conference papers on the topic "High-speed packaging machinery"

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Jungklaus, H. "Thermal Spray Coatings in Printing and Papermaking." In ITSC2008, edited by B. R. Marple, M. M. Hyland, Y. C. Lau, C. J. Li, R. S. Lima, and G. Montavon. Verlag für Schweißen und verwandte Verfahren DVS-Verlag GmbH, 2008. http://dx.doi.org/10.31399/asm.cp.itsc2008p0195.

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Abstract The effects of globalization, technology improvement, capacity consolidation, and rising customer demands drive the printing and papermaking business worldwide. Consumption of paper, paperboard, and tissue exceeded 500 million tons in 2007, and it is estimated that one-third to one-half of this production is printed. Paper production in total is not experiencing drastic growth rates due to the increasing market share of digital media; however, market segments such as paperboard and packaging are showing growing demand. In printing, new technologies focus on production speed and quality improvement. For both printing and papermaking, the cost of energy and raw materials requires ongoing improvements in production efficiency. For equipment and machinery manufacturers serving these industries, high-end technology that lowers cost and improves quality drives the market leaders. In both industries, functional roll surfaces generated by thermal spraying help to achieve design and development objectives. The paper gives examples for the role of thermal spray coatings in both industrial areas.
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Clark, J. Y. "Detection of faults in a high speed packaging machine using a multilayer perceptron (MLP)." In IEE Colloquium on `Innovations in Manufacturing Control Through Mechatronics. IEE, 1995. http://dx.doi.org/10.1049/ic:19951360.

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Han, Xu, and Liying Su. "TRIZ-Based Design and Simulation of High Speed End Sealing Device of Packaging Machine." In 2019 2nd World Conference on Mechanical Engineering and Intelligent Manufacturing (WCMEIM). IEEE, 2019. http://dx.doi.org/10.1109/wcmeim48965.2019.00068.

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Ma, Hanzhi, Er-Ping Li, Andreas C. Cangellaris, and Xu Chen. "High-Speed Link Design Optimization Using Machine Learning SVR-AS Method." In 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). IEEE, 2020. http://dx.doi.org/10.1109/epeps48591.2020.9231368.

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Liu, Yachao, Jian Gao, Lanyu Zhang, Yun Chen, Hui Tang, Xin Chen, and Chengqiang Cui. "Smith-ADRC Based Z Axis Impact Force Control for High Speed Wire Bonding Machine." In 2018 19th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2018. http://dx.doi.org/10.1109/icept.2018.8480687.

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Ma, Hanzhi, Er-Ping Li, Andreas C. Cangellaris, and Xu Chen. "Comparison of Machine Learning Techniques for Predictive Modeling of High-Speed Links." In 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). IEEE, 2019. http://dx.doi.org/10.1109/epeps47316.2019.193199.

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Trinchero, R., M. Ahadi Dolatsara, K. Roy, M. Swaminathan, and F. G. Canavero. "Design of High-Speed Links via a Machine Learning Surrogate Model for the Inverse Problem." In 2019 Electrical Design of Advanced Packaging and Systems (EDAPS). IEEE, 2019. http://dx.doi.org/10.1109/edaps47854.2019.9011627.

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Liu, Yachao, Jian Gao, Boyu Zhan, and Lanyu Zhang. "Impact Force Control of High-Speed Wire Bonding Machine Based on Fuzzy Active Disturbance Rejection Controller." In 2021 22nd International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2021. http://dx.doi.org/10.1109/icept52650.2021.9567904.

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Beyene, Wendemagengnehu Tsegaye. "Reduced-order modeling of high-speed channels using machine learning techniques: Partitional and hierarchical clusterings." In 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). IEEE, 2017. http://dx.doi.org/10.1109/epeps.2017.8329767.

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Goyal, Mohit, Maneesh Pandey, Sharad Kumar, and Rohit Sharma. "Prediction of De-embedded Eye Height/Width Parameters using Machine Learning in High-Speed Serial Link Characterization." In 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). IEEE, 2021. http://dx.doi.org/10.1109/epeps51341.2021.9609118.

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