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Journal articles on the topic 'High-Resolution Patterning'

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Author: Grafiati

Published: 10 December 2022

Last updated: 28 January 2023

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1

Harriott, L. R., P. A. Polakos, and C. E. Rice. "High‐resolution patterning of highTcsuperconductors." Applied Physics Letters 55, no. 5 (July 31, 1989): 495–97. http://dx.doi.org/10.1063/1.102429.

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2

Kern, D. P. "High resolution patterning of high Tc superconductors." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 9, no. 6 (November 1991): 2875. http://dx.doi.org/10.1116/1.585616.

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3

Bertino, M. F., J. F. Hund, J. Sosa, G. Zhang, C. Sotiriou-Leventis, N. Leventis, A. T. Tokuhiro, and J. Terry. "High resolution patterning of silica aerogels." Journal of Non-Crystalline Solids 333, no. 1 (January 2004): 108–10. http://dx.doi.org/10.1016/j.jnoncrysol.2003.09.039.

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4

Ivanov, Z. G., P. A. Nilsson, E. K. Andersson, and T. Claeson. "High resolution patterning of high Tcsuperconducting thin films." Superconductor Science and Technology 4, no. 1S (January 1, 1991): S112—S114. http://dx.doi.org/10.1088/0953-2048/4/1s/023.

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5

Hang, Qingling, Yuliang Wang, Marya Lieberman, and Gary H. Bernstein. "Molecular patterning through high-resolution polymethylmethacrylate masks." Applied Physics Letters 80, no. 22 (June 3, 2002): 4220–22. http://dx.doi.org/10.1063/1.1481784.

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6

Shea-Rohwer, Lauren E., and James E. Martin. "Patterning Surfaces for High Resolution Self Alignment." Journal of The Electrochemical Society 159, no. 3 (2012): H317—H322. http://dx.doi.org/10.1149/2.091203jes.

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7

Dai, Junyan, Seung Wook Chang, Alyssandrea Hamad, Da Yang, Nelson Felix, and Christopher K. Ober. "Molecular Glass Resists for High-Resolution Patterning." Chemistry of Materials 18, no. 15 (July 2006): 3404–11. http://dx.doi.org/10.1021/cm052452m.

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8

Lo, Yi-Chen, Dawen Li, Zhenzhong Sun, Shoieb Shaik, and Xing Cheng. "High-resolution nondestructive patterning of isolated organic semiconductors." Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena 30, no. 6 (November 2012): 06FB04. http://dx.doi.org/10.1116/1.4757956.

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9

Wang, D. Z., S. N. Jayasinghe, and M. J. Edirisinghe. "High resolution print-patterning of a nano-suspension." Journal of Nanoparticle Research 7, no. 2-3 (June 2005): 301–6. http://dx.doi.org/10.1007/s11051-004-7772-8.

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10

De Silva, Anuja, Nelson M. Felix, and Christopher K. Ober. "Molecular Glass Resists as High-Resolution Patterning Materials." Advanced Materials 20, no. 17 (September 3, 2008): 3355–61. http://dx.doi.org/10.1002/adma.200800763.

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11

Raman, Ritu, Basanta Bhaduri, Mustafa Mir, Artem Shkumatov, Min Kyung Lee, Gabriel Popescu, Hyunjoon Kong, and Rashid Bashir. "High-Resolution Projection Microstereolithography for Patterning of Neovasculature." Advanced Healthcare Materials 5, no. 5 (December 22, 2015): 610–19. http://dx.doi.org/10.1002/adhm.201500721.

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12

Liu, Xiangyu, Mohit Kumar, Annalisa Calo’, Edoardo Albisetti, Xiaouri Zheng, Kylie B. Manning, Elisabeth Elacqua, Marcus Weck, Rein V. Ulijn, and Elisa Riedo. "High-throughput protein nanopatterning." Faraday Discussions 219 (2019): 33–43. http://dx.doi.org/10.1039/c9fd00025a.

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13

Sirringhaus, H., T. Kawase, and R. H. Friend. "High-Resolution Ink-Jet Printing of All-Polymer Transistor Circuits." MRS Bulletin 26, no. 7 (July 2001): 539–43. http://dx.doi.org/10.1557/mrs2001.127.

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Impressive advances in vapor-phase deposition and photolithographic patterning techniques have been fueling the silicon microelectronics revolution over the last 40 years. However, for many interesting classes of materials, including biological materials or functional synthetic polymers, vacuum deposition and photolithography are not the techniques of choice for producing ordered structures and devices. Many of these materials selfassemble into well-ordered microstructures when deposited from solution, and patterning may be more readily achieved by solution-based selective deposition and direct-printing techniques. It is appealing to consider novel ways of manufacturing functional circuits and devices based on techniques that are similar to printing visual information onto paper.

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14

Woo, Seung A., Ji Young Park, Su Min Kim, and Jin-Baek Kim. "Interface imaging process for high resolution and high aspect ratio patterning." European Polymer Journal 49, no. 6 (June 2013): 1707–13. http://dx.doi.org/10.1016/j.eurpolymj.2013.03.013.

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15

Ocola, Leonidas E., Chad Rue, and Diederik Maas. "High-resolution direct-write patterning using focused ion beams." MRS Bulletin 39, no. 4 (April 2014): 336–41. http://dx.doi.org/10.1557/mrs.2014.56.

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16

Michel, Bruno, André Bernard, Alexander Bietsch, Emmanuel Delamarche, Mattias Geissler, David Juncker, Hannes Kind, et al. "Printing Meets Lithography: Soft Approaches to High-Resolution Patterning." CHIMIA International Journal for Chemistry 56, no. 10 (October 1, 2002): 527–42. http://dx.doi.org/10.2533/000942902777680207.

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17

Farjam, Nazanin, Tae H. Cho, Neil P. Dasgupta, and Kira Barton. "Subtractive patterning: High-resolution electrohydrodynamic jet printing with solvents." Applied Physics Letters 117, no. 13 (September 28, 2020): 133702. http://dx.doi.org/10.1063/5.0021038.

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18

Noguchi, Nobuaki, and Ikuo Suemune. "High-Resolution Patterning of Luminescent Porous Silicon with Photoirradiation." Japanese Journal of Applied Physics 33, Part 1, No. 1B (January 30, 1994): 590–93. http://dx.doi.org/10.1143/jjap.33.590.

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19

Lercel, M. J. "High-resolution silicon patterning with self-assembled monolayer resists." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 14, no. 6 (November 1996): 4085. http://dx.doi.org/10.1116/1.588596.

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20

Michel, B., A. Bernard, A. Bietsch, E. Delamarche, M. Geissler, D. Juncker, H. Kind, et al. "Printing meets lithography: Soft approaches to high-resolution patterning." IBM Journal of Research and Development 45, no. 5 (September 2001): 697–719. http://dx.doi.org/10.1147/rd.455.0697.

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21

Hu, J., J. Shi, F. Zhang, L. Lei, X. Li, L. Wang, L. Liu, and Y. Chen. "High resolution and hybrid patterning for single cell attachment." Microelectronic Engineering 87, no. 5-8 (May 2010): 726–29. http://dx.doi.org/10.1016/j.mee.2009.12.022.

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22

Inglis, William, Martyn C. Davies, Clive J. Roberts, Saul J. B. Tendler, and Philip M. Williams. "Micro-Patterning of Polymers for High Resolution Microscopy Analysis." Microscopy and Microanalysis 7, S2 (August 2001): 128–29. http://dx.doi.org/10.1017/s1431927600026714.

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Micro-patterned surfaces are of interest in biology and chemistry due to the ability to confine functional sample materials to specific areas. If patterns are visible, either through optical microscopy, or topographically, with scanning probe microscopy, investigating samples in a manner that is cheap and accessible to most laboratories is possible. Examples include micropatterning cells in tissue engineering, and protein micro-array analysis. We have created a micro-patterned surface with tailored optical and topographic properties. These were investigated using the microscopy techniques, confocal microscopy (CM), atomic force microscopy (AFM) and near field scanning optical microscopy (NSOM). AFM and CM were used to investigate different aspects of the micro-pattern. to confirm the properties of the micro-pattern, we show the advantages of NSOM in investigating surfaces with both optical and topographic properties simultaneously. Micro-patterns were fabricated using a soft lithography technique, micro-contact printing, where reagents are ‘stamped’ upon substrates using an elastomeric moulding of a micro-template.

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23

Vieu, C., J. Gierak, H. Launois, T. Aign, P. Meyer, J. P. Jamet, J. Ferré, C. Chappert, V. Mathet, and H. Bernas. "High resolution magnetic patterning using Focused Ion Beam irradiation." Microelectronic Engineering 53, no. 1-4 (June 2000): 191–94. http://dx.doi.org/10.1016/s0167-9317(00)00294-x.

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24

Chen, Yiqin, Quan Xiang, Zhiqin Li, Yasi Wang, Yuhan Meng, and Huigao Duan. "“Sketch and Peel” Lithography for High-Resolution Multiscale Patterning." Nano Letters 16, no. 5 (April 18, 2016): 3253–59. http://dx.doi.org/10.1021/acs.nanolett.6b00788.

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25

Fallica, Roberto, Robert Kirchner, Helmut Schift, and Yasin Ekinci. "High-resolution grayscale patterning using extreme ultraviolet interference lithography." Microelectronic Engineering 177 (June 2017): 1–5. http://dx.doi.org/10.1016/j.mee.2017.01.007.

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26

Popovici, D., and M. Meunier. "Focusing method and apparatus for high-resolution projection patterning." Review of Scientific Instruments 72, no. 2 (2001): 1435. http://dx.doi.org/10.1063/1.1340019.

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27

Hofmann, Mario, Ya-Ping Hsieh, Allen L. Hsu, and Jing Kong. "Scalable, flexible and high resolution patterning of CVD graphene." Nanoscale 6, no. 1 (2014): 289–92. http://dx.doi.org/10.1039/c3nr04968j.

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28

van der Drift, E., B. A. C. Rousseeuw, J. Romijn, E. C. M. Pennings, and F. H. Groen. "High resolution patterning of aluminumoxide for intedrated optical devices." Microelectronic Engineering 9, no. 1-4 (May 1989): 499–502. http://dx.doi.org/10.1016/0167-9317(89)90109-3.

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29

Wiesner, Markus, and Jürgen Ihlemann. "High resolution patterning of sapphire by F2-laser ablation." Applied Physics A 103, no. 1 (March 3, 2011): 51–58. http://dx.doi.org/10.1007/s00339-011-6347-7.

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30

Koslovsky, O., S. Yochelis, N. Livneh, M. G. Harats, R. Rapaport, and Y. Paltiel. "Simple Method for Surface Selective Adsorption of Semiconductor Nanocrystals with Nanometric Resolution." Journal of Nanomaterials 2012 (2012): 1–5. http://dx.doi.org/10.1155/2012/938495.

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Self-assembly methods play a major role in many modern fabrication techniques for various nanotechnology applications. In this paper we demonstrate two alternatives for self-assembled patterning within the nanoscale resolution of optically active semiconductor nanocrystals. The first is substrate selective and uses any high resolution surface patterning to achieve localized self-assembly. The second method uses a surface with poly(methyl methacrylate) (PMMA) resist patterning adsorption of the nanocrystal with covalent bonds and liftoff.

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31

Krasnoperova, Azalia A. "A novel technique for high aspect ratio high resolution patterning of membranes." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 13, no. 6 (November 1995): 3061. http://dx.doi.org/10.1116/1.588322.

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32

Shimada, Hisayuki, Shigeki Shimomura, Kouichi Hirose, and Tadahiro Ohmi. "High-Sensitivity and High-Resolution Contact Hole Patterning by Enhanced-Wettability Developer." Japanese Journal of Applied Physics 32, Part 1, No. 1B (January 30, 1993): 347–51. http://dx.doi.org/10.1143/jjap.32.347.

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33

Park, Won-Tae, and Yong-Young Noh. "A self-aligned high resolution patterning process for large area printed electronics." Journal of Materials Chemistry C 5, no. 26 (2017): 6467–70. http://dx.doi.org/10.1039/c7tc01590a.

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34

Ruhmer, Klaus, Philippe Cochet, Roger McCleary, and Nelson Chen. "High Resolution Patterning Technology to enable Panel Based Advanced Packaging." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000129–36. http://dx.doi.org/10.4071/isom-ta53.

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As the semiconductor industry is maturing, the reign of Moore's law has come to an end. New approaches beyond scaling down transistors have taken over the burden of continued and rapid performance growth. These new approaches are essentially related to integration of components. Decrease of form-factors and increase of functionality and performance is accomplished by sophisticated integration schemes. In other words, back-end Advanced Packaging technologies continue to grow ever more important to not only meet performance and size goals but also to drive down cost. Although front-end manufacturing is naturally tied to round semiconductor wafers, some of the most recent back-end technologies are no longer required to be performed on round substrates. Embedded die, fan-out and interposer based packages can be manufactured on larger and more convenient substrates such as square and rectangular glass, molded or organic panels thus enabling economy of scale efficiency gains and cost savings. This work focuses specifically on the challenges surrounding the lithographic patterning of these “non-round” substrates using a high-resolution 2x reduction stepper lithography system. The paper provides an overview of the various panel-based advanced packaging applications including Panel Fan-Out (P-FO), 2.5D glass interposers and high-density organic substrate interposers. The specific lithography requirements and challenges are highlighted and analyzed. These include patterning resolution down to 2μm and beyond, layer to layer overlay accuracy of better than 1μm, depth of focus of 15μm and more, resist sidewall angles of above 80 degrees, ability to deal with topographic variations, ability to handle and process panels with severe warpage, ability to prevent system contamination due to outgassing of photoresists or polyimides, ability to process devices without so-called field stitching only to name a few. Last but not least, cost implications of the lithography process are analyzed and discussed. Ultimately, the work attempts to assess the readiness of the industry for panel based Advanced Packaging specifically from a lithography perspective. The potential cost advantages but also the hurdles and challenges related to panel-based advanced packaging patterning technologies are highlighted.

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35

Chen, Y., F. Carcenac, F. Rousseaux, A. M. Haghiri, and H. Launois. "High Resolution X-ray Lithography: Features of Two-dimensional Patterning." Journal of Photopolymer Science and Technology 10, no. 4 (1997): 619–23. http://dx.doi.org/10.2494/photopolymer.10.619.

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36

Müller, J., R. Perrone, K. H. Drüe, R. Stephan, J. Trabert, M. Hein, D. Schwanke, et al. "Comparison of High-Resolution Patterning Technologies for LTCC Microwave Circuits." Journal of Microelectronics and Electronic Packaging 4, no. 3 (July 1, 2007): 99–104. http://dx.doi.org/10.4071/1551-4897-4.3.99.

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Low-temperature co-fired ceramic (LTCC) are widely acknowledged for wide-band and microwave circuits. Within the project consortium KERAMIS, implementation of higher functionality in LTCC substrates is being investigated. Among the applications considered are a 4 × 4 switch matrix [1], voltage-controlled oscillators [2], and amplifiers for multimedia satellite communications working in Ka-band. In order to add more functionality (e.g., filters, couplers) in LTCC, current patterning limits of line width and line separation need to be extended. Four different technologies were considered for higher resolution: a) fine-line printing technology with special screens, b) photo-imageable pastes, c) etching of thick-film conductors (co- and post-fired), and d) thin films on LTCC. Evaluation of patterning technologies is based on a test coupon that was designed and manufactured by the consortium members. The artwork contains lines, line transitions, ring resonators (microstrip and stripline), edge-coupled filters, DC blocking structures, and various lines for DC resistance testing. The smallest gap definition is 50 μm. Two substrate materials, Du Pont tapes 951 and 943, are included in the study. In addition to the main frequency band of interest in the project (17–22 GHz), these structures have been characterized up to 50 GHz. Electrical results are correlated to physical measurements of the structures (line width, spaces, and tolerances) and are evaluated with respect to performance, manufacturability, and yield. Results show excellent performance for screen-printed structures and demonstrated the importance of mask tuning to achieve optimum resolution (under etching etc.).

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37

Newman, T. H. "High resolution patterning system with a single bore objective lens." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 5, no. 1 (January 1987): 88. http://dx.doi.org/10.1116/1.583934.

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38

Oleksak, Richard P., Rose E. Ruther, Feixiang Luo, Kurtis C. Fairley, Shawn R. Decker, William F. Stickle, Darren W. Johnson, Eric L. Garfunkel, Gregory S. Herman, and Douglas A. Keszler. "Chemical and Structural Investigation of High-Resolution Patterning with HafSOx." ACS Applied Materials & Interfaces 6, no. 4 (February 17, 2014): 2917–21. http://dx.doi.org/10.1021/am405463u.

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39

Calvert, Jeffrey M. "Deep ultraviolet patterning of monolayer films for high resolution lithography." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 9, no. 6 (November 1991): 3447. http://dx.doi.org/10.1116/1.585820.

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40

Liu, Juan, Qi Wei, and Liyuan Wang. "An i-line molecular glass photoresist for high resolution patterning." RSC Advances 3, no. 48 (2013): 25666. http://dx.doi.org/10.1039/c3ra45130e.

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41

Felix, N. M., K. Tsuchiya, and C. K. Ober. "High-Resolution Patterning of Molecular Glasses Using Supercritical Carbon Dioxide." Advanced Materials 18, no. 4 (February 17, 2006): 442–46. http://dx.doi.org/10.1002/adma.200501802.

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42

Liu, Xuying, Masayuki Kanehara, Chuan Liu, Kenji Sakamoto, Takeshi Yasuda, Jun Takeya, and Takeo Minari. "Spontaneous Patterning of High-Resolution Electronics via Parallel Vacuum Ultraviolet." Advanced Materials 28, no. 31 (May 17, 2016): 6568–73. http://dx.doi.org/10.1002/adma.201506151.

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43

Jin, Xiaofan, and Ingmar H. Riedel-Kruse. "Biofilm Lithography enables high-resolution cell patterning via optogenetic adhesin expression." Proceedings of the National Academy of Sciences 115, no. 14 (March 19, 2018): 3698–703. http://dx.doi.org/10.1073/pnas.1720676115.

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Bacterial biofilms represent a promising opportunity for engineering of microbial communities. However, our ability to control spatial structure in biofilms remains limited. Here we engineerEscherichia coliwith a light-activated transcriptional promoter (pDawn) to optically regulate expression of an adhesin gene (Ag43). When illuminated with patterned blue light, long-term viable biofilms with spatial resolution down to 25 μm can be formed on a variety of substrates and inside enclosed culture chambers without the need for surface pretreatment. A biophysical model suggests that the patterning mechanism involves stimulation of transiently surface-adsorbed cells, lending evidence to a previously proposed role of adhesin expression during natural biofilm maturation. Overall, this tool—termed “Biofilm Lithography”—has distinct advantages over existing cell-depositing/patterning methods and provides the ability to grow structured biofilms, with applications toward an improved understanding of natural biofilm communities, as well as the engineering of living biomaterials and bottom–up approaches to microbial consortia design.

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44

Liu, Xuying, Masayuki Kanehara, Chuan Liu, Kenji Sakamoto, Takeshi Yasuda, Jun Takeya, and Takeo Minari. "High-Resolution Electronics: Spontaneous Patterning of High-Resolution Electronics via Parallel Vacuum Ultraviolet (Adv. Mater. 31/2016)." Advanced Materials 28, no. 31 (August 2016): 6768. http://dx.doi.org/10.1002/adma.201670218.

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45

Johnston, Lucy, Jiong Yang, Jialuo Han, Kourosh Kalantar-Zadeh, and Jianbo Tang. "Intermetallic wetting enabled high resolution liquid metal patterning for 3D and flexible electronics." Journal of Materials Chemistry C 10, no. 3 (2022): 921–31. http://dx.doi.org/10.1039/d1tc04877e.

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The intermetallic wetting between metallic liquids and solid surfaces enables a high-resolution liquid metal patterning strategy which is widely applicable for fabricating functional patterns on versatile substrates and planar/3D geometries.

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46

Zhao, Xiang, Jiankang He, Fangyuan Xu, Yaxiong Liu, and Dichen Li. "Electrohydrodynamic printing: a potential tool for high-resolution hydrogel/cell patterning." Virtual and Physical Prototyping 11, no. 1 (January 2, 2016): 57–63. http://dx.doi.org/10.1080/17452759.2016.1139378.

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47

Lin, Li, Yiyu Ou, Martin Aagesen, Flemming Jensen, Berit Herstrøm, and Haiyan Ou. "Time-Efficient High-Resolution Large-Area Nano-Patterning of Silicon Dioxide." Micromachines 8, no. 1 (January 4, 2017): 13. http://dx.doi.org/10.3390/mi8010013.

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48

Jin, Hongzheng, and James C. Sturm. "Super-high-resolution transfer printing for full-color OLED display patterning." Journal of the Society for Information Display 18, no. 2 (2010): 141. http://dx.doi.org/10.1889/jsid18.2.141.

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49

Kusaka, Yasuyuki, Masayoshi Koutake, and Hirobumi Ushijima. "High-resolution patterning of silver conductive lines by adhesion contrast planography." Journal of Micromechanics and Microengineering 25, no. 9 (August 6, 2015): 095002. http://dx.doi.org/10.1088/0960-1317/25/9/095002.

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50

Staver, A. Carla, Gregory P. Asner, Ignacio Rodriguez-Iturbe, Simon A. Levin, and Izak P. J. Smit. "Spatial patterning among savanna trees in high-resolution, spatially extensive data." Proceedings of the National Academy of Sciences 116, no. 22 (May 13, 2019): 10681–85. http://dx.doi.org/10.1073/pnas.1819391116.

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In savannas, predicting how vegetation varies is a longstanding challenge. Spatial patterning in vegetation may structure that variability, mediated by spatial interactions, including competition and facilitation. Here, we use unique high-resolution, spatially extensive data of tree distributions in an African savanna, derived from airborne Light Detection and Ranging (LiDAR), to examine tree-clustering patterns. We show that tree cluster sizes were governed by power laws over two to three orders of magnitude in spatial scale and that the parameters on their distributions were invariant with respect to underlying environment. Concluding that some universal process governs spatial patterns in tree distributions may be premature. However, we can say that, although the tree layer may look unpredictable locally, at scales relevant to prediction in, e.g., global vegetation models, vegetation is instead strongly structured by regular statistical distributions.

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