Relevant bibliographies by topics / High-Resolution Patterning

Academic literature on the topic 'High-Resolution Patterning'

Author: Grafiati
Published: 10 December 2022
Last updated: 28 January 2023

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Journal articles on the topic "High-Resolution Patterning"

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Harriott, L. R., P. A. Polakos, and C. E. Rice. "High‐resolution patterning of highTcsuperconductors." Applied Physics Letters 55, no. 5 (July 31, 1989): 495–97. http://dx.doi.org/10.1063/1.102429.

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Kern, D. P. "High resolution patterning of high Tc superconductors." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 9, no. 6 (November 1991): 2875. http://dx.doi.org/10.1116/1.585616.

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Bertino, M. F., J. F. Hund, J. Sosa, G. Zhang, C. Sotiriou-Leventis, N. Leventis, A. T. Tokuhiro, and J. Terry. "High resolution patterning of silica aerogels." Journal of Non-Crystalline Solids 333, no. 1 (January 2004): 108–10. http://dx.doi.org/10.1016/j.jnoncrysol.2003.09.039.

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Ivanov, Z. G., P. A. Nilsson, E. K. Andersson, and T. Claeson. "High resolution patterning of high Tcsuperconducting thin films." Superconductor Science and Technology 4, no. 1S (January 1, 1991): S112—S114. http://dx.doi.org/10.1088/0953-2048/4/1s/023.

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Hang, Qingling, Yuliang Wang, Marya Lieberman, and Gary H. Bernstein. "Molecular patterning through high-resolution polymethylmethacrylate masks." Applied Physics Letters 80, no. 22 (June 3, 2002): 4220–22. http://dx.doi.org/10.1063/1.1481784.

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Shea-Rohwer, Lauren E., and James E. Martin. "Patterning Surfaces for High Resolution Self Alignment." Journal of The Electrochemical Society 159, no. 3 (2012): H317—H322. http://dx.doi.org/10.1149/2.091203jes.

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Dai, Junyan, Seung Wook Chang, Alyssandrea Hamad, Da Yang, Nelson Felix, and Christopher K. Ober. "Molecular Glass Resists for High-Resolution Patterning." Chemistry of Materials 18, no. 15 (July 2006): 3404–11. http://dx.doi.org/10.1021/cm052452m.

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Lo, Yi-Chen, Dawen Li, Zhenzhong Sun, Shoieb Shaik, and Xing Cheng. "High-resolution nondestructive patterning of isolated organic semiconductors." Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena 30, no. 6 (November 2012): 06FB04. http://dx.doi.org/10.1116/1.4757956.

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Wang, D. Z., S. N. Jayasinghe, and M. J. Edirisinghe. "High resolution print-patterning of a nano-suspension." Journal of Nanoparticle Research 7, no. 2-3 (June 2005): 301–6. http://dx.doi.org/10.1007/s11051-004-7772-8.

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De Silva, Anuja, Nelson M. Felix, and Christopher K. Ober. "Molecular Glass Resists as High-Resolution Patterning Materials." Advanced Materials 20, no. 17 (September 3, 2008): 3355–61. http://dx.doi.org/10.1002/adma.200800763.

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Dissertations / Theses on the topic "High-Resolution Patterning"

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Cheshmehkani, Ameneh. "Design and synthesis of molecular resists for high resolution patterning performance." Thesis, Georgia Institute of Technology, 2013. http://hdl.handle.net/1853/50286.

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In this thesis, different approaches in synthesizing molecular resist are examined, and structure-property relations for the molecular resist properties are studied. This allows for design of resists that could be studied further as either negative or positive tone resists in photolithography. A series of compounds having different number of acrylate moiety, and different backbones were investigated for photoresist application. Thermal curing of acrylate compounds in organic solvent was also examined. Film shrinkage, as well as auto-polymerization was observed for these compounds that make them unsuitable as photoresist material. Furthermore, calix[4]resorcinarenes (C4MR) was chosen as backbone, and the functional groups was selected as oxetane and epoxy. Full functionalized C4MR compounds with oxetane, epoxy and allyl were synthesized. Variable-temperature NMR of C4MR-8Allyl was studied in order to get a better understanding of the structure’s conformers. Energy barrier of exchange (ΔG#) was determined from coalescence temperatures, and was 57.4 KJ/mol for aromatic and vinyl hydrogens and 62.1 KJ/mol for allylic hydrogens.
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Collister, Elizabeth Ann. "Studies of nontraditional high resolution thin film patterning techniques." 2009. http://hdl.handle.net/2152/17295.

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This thesis discusses two patterning techniques: Step and Flash Imprint Lithography, a nanoimprint technique, and patterning thin films utilizing electrohydrodynamic instabilities. Step and Flash Imprint Lithography, SFIL, is promising alternative approach to photolithography. SFIL replicates the relief pattern of a template in a photocurable liquid that has been dispensed on a substrate. The pattern is then crosslinked when the photocurable liquid is exposed to UV light through the template. In order to study the volume change in the created features upon exposure, a stochastic mesoscale model was formulated. This model allows the study of the possibility of defects forming, from under cured etch barrier, or particle contamination of the template. The results showed large defects should not occur regularly until the minimum feature size is below 3 nanometers. The mesoscale model proved to computationally intensive to simulate features of engineering interest. A base multiscale model was formulated to simulate the effects of the densification of the photocurable liquid as well as the effects of the polymerization on the feature integrity. The multiscale model combines a continuum model (compressible Mooney-Rivlin) coupled to the mesoscale code using the Arlequin method. The multiscale model lays the framework that may be adapted to the study of other SFIL processes like template release. Patterning thin films utilizing electrohydrodynamic instabilities allows for the creation of periodic arrays of pillar like features. These pillars form due to the electric field destabilizing the thin film. Prior work has focused on utilizing polymeric films heated above their glass transition temperatures. In order to decrease the process time in the pillar formation process, work was done to study photocurable systems. The systems which proved favorable to the pillar creation process were the thiol-ene system as well as the maleimide systems. Further work was done on controlling the packing and ordering of the formed pillar arrays by using patterned templates. The result of these studies is that control was only able to be achieved to the third generation of pillars formed due to the inability to fully control the gap over the entire active area.
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Marques, Carlos Daniel Gonçalves. "Development of high-resolution shadow masks using thin membranes of parylene-C for patterning microelectronic devices." Master's thesis, 2019. http://hdl.handle.net/10362/92227.

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In order to fabricate microelectronic devices, patterning techniques such as photolithography or shadow mask patterning must be performed. This last technique uses a physical mask to block regions on the substrate during film deposition and its resolution is determined by the thickness of the mask and the fabrication procedures. This thesis reports the fabrication of Parylene-C thin shadow masks, 3 and 5 m, and their application in single-step and multi-step patterning and, on curved surfaces. The results for single-step patterning showed the possibility of defining features with a resolution of 10 m. When multi-step patterning the maximum resolution obtained in the produced masks was 20 m for separation between features and 40 m for lines where this resolution was limited by the photolithographic masks used. For the alignment, several strategies were tested but the one that presented the best results was the use of SU-8 pillars to align different shadow masks in order to pattern microelectronic devices with 10 m of tolerance. The produced shadow masks sets for TFT patterning were only one used one time and maintained the same yield from before patterning. For fiber patterning, the obtained results are promising since it showed the possibility of patterning in a curved surface using a simpler and low-cost technique. It was possible to deposit three material layers to fabricate a capacitor. It was possible to pattern a circle of 1 mm in diameter on a fiber with 750 m of diameter. This work allowed to fabricate ultra-thin masks in Parylene producing features of high resolution and features on curved surfaces showing how this material can be used as a complement in microelectronic device fabrication.
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Book chapters on the topic "High-Resolution Patterning"

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Marrian, C. R. K., E. A. Dobisz, and J. M. Calvert. "High Resolution Patterning with the STM." In Atomic and Nanometer-Scale Modification of Materials: Fundamentals and Applications, 139–48. Dordrecht: Springer Netherlands, 1993. http://dx.doi.org/10.1007/978-94-011-2024-1_13.

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Coppola, Sara. "High Resolution Patterning of Biomaterials for Tissue Engineering." In Springer Theses, 73–84. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-31059-6_5.

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Allee, David R., Xiao Dan Pan, Alec N. Broers, and Corwin P. Umbach. "Ultra-High Resolution Electron Beam Patterning of SiO2: A Review." In Science and Technology of Mesoscopic Structures, 362–72. Tokyo: Springer Japan, 1992. http://dx.doi.org/10.1007/978-4-431-66922-7_38.

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Zehbe, Rolf, and Kerstin Zehbe. "Nervous Tissue and Neuronal Cells: Patterning by Electrophoresis for Highly Resolved 3D Images in Tissue Engineering." In Advanced High-Resolution Tomography in Regenerative Medicine, 205–15. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-030-00368-5_14.

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Costello, Cait, Jan-Ulrich Kreft, Christopher M. Thomas, and Paula M. Mendes. "Protein Nanoarrays for High-Resolution Patterning of Bacteria on Gold Surfaces." In Methods in Molecular Biology, 191–200. Totowa, NJ: Humana Press, 2011. http://dx.doi.org/10.1007/978-1-61779-319-6_15.

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Rogers, J., and G. Blanchet. "High-resolution, printing techniques for plastic electronics." In Nanolithography and patterning techniques in microelectronics. CRC Press, 2005. http://dx.doi.org/10.1201/9781439823651.ch13.

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Blanchet, G., and J. Rogers. "High-resolution printing techniques for plastic electronics." In Nanolithography and Patterning Techniques in Microelectronics, 373–98. Elsevier, 2005. http://dx.doi.org/10.1533/9781845690908.373.

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Jiang, Lin, and Lifeng Chi. "Strategies for High Resolution Patterning of Conducting Polymers." In Lithography. InTech, 2010. http://dx.doi.org/10.5772/8198.

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Muñoz-Rojas, David, Matthieu Weber, Christophe Vallée, Chiara Crivello, Abderrahime Sekkat, Fidel Toldra-Reig, and Mikhael Bechelany. "Nanometric 3D Printing of Functional Materials by Atomic Layer Deposition." In Advanced Additive Manufacturing [Working Title]. IntechOpen, 2022. http://dx.doi.org/10.5772/intechopen.101859.

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Atomic layer deposition (ALD) is a chemical vapour deposition (CVD) method that allows the layer-by-layer growth of functional materials by exposing a surface to different precursors in an alternative fashion. Thus, thanks to gas-solid reactions that are substrate-limited and self-terminating, precise control over thickness below the nanometer level can be achieved. While ALD was originally developed to deposit uniform coatings over large areas and on high-aspect-ratio features, in recent years the possibility to perform ALD in a selective fashion has gained much attention, in what is known as area-selective deposition (ASD). ASD is indeed a novel 3D printing approach allowing the deposition of functional materials (for example metals to oxides, nitrides or sulfides) with nanometric resolution in Z. The chapter will present an introduction to ALD, which will be followed by the description of the different approaches currently being developed for the ASD of functional materials (including initial approaches such as surface pre-patterning or activation, and newer concepts based on spatial CVD/ALD). The chapter will also include a brief overview of recent works involving the use of ALD to tune the properties of 3D printed parts.
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Niazi, Sana, and Farideh Doroodgar. "Fundamentals of Femtosecond Laser and Its Application in Ophthalmology." In Fundamentals and Application of Femtosecond Optics [Working Title]. IntechOpen, 2022. http://dx.doi.org/10.5772/intechopen.106701.

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Modern advancement in lithographic technology, injection molding, and nano-imprinting has improved the patterning of small structures, resolution, productivity, and materials. Ultrafast laser micro/nano-manufacturing technologies, including nano- and femtosecond lasers, have the advantage of high precision as a result of suppressed heat diffusion to the surroundings. This precision imposes strict requirements on the temporal characteristics of laser pulses. Ultrafast lasers also have advantages in terms of technique, application, and processing. Femtosecond laser (FSL) uses photo disruption to form micro-cavitation bubbles within the cutting plane. The controllable spatiotemporal properties of FSL make it applicable for the three-dimensional fabrication of transparent materials. Using smart materials to create 3D microactuators and microrobots is a newfound application of FSL processing, which enables the integration of optical devices with other components and is practiced in new applications, such as 3D microfluidic, optofluidic, and electro-optic devices. We discuss mechanisms and methods of FSL (including digital micromirror devices, different processes, and interferences). Microlens arrays, micro/nanocrystals, photonic crystals, and optical fibers all have applications in the production of optical devices. Using FSLs, one may create scalable metamaterials with multiscale diameters from tens of nanometers to centimeters. The huge potential of FSL processing in various fields, such as machinery, electronics, biosensors and biomotors, physics, and chemistry, requires more research.
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Conference papers on the topic "High-Resolution Patterning"

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Liaros, Nikolaos, Adam Pranda, Hannah M. Ogden, Steven Wolf, John S. Petersen, Samuel R. Cohen, Daniel E. Falvey, et al. "Thin films for high-resolution, 3-color lithography." In Novel Patterning Technologies 2018, edited by Eric M. Panning and Martha I. Sanchez. SPIE, 2018. http://dx.doi.org/10.1117/12.2299681.

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De Silva, Anuja, Nelson Felix, Drew Forman, Jing Sha, and Christopher K. Ober. "New architectures for high resolution patterning." In SPIE Advanced Lithography, edited by Clifford L. Henderson. SPIE, 2008. http://dx.doi.org/10.1117/12.772667.

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Kueenburg, Bernhard, and Peter Gruber. "UpNano: a new horizon in high-resolution 2PP 3D-printing." In Novel Patterning Technologies 2021, edited by Eric M. Panning and J. Alexander Liddle. SPIE, 2021. http://dx.doi.org/10.1117/12.2585298.

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Mori, Ken-Ichiro, Douglas Shelton, Yoshio Goto, Hiromi Suda, Hiroyuki Wada, Hideo Tanaka, and Seiya Miura. "High-resolution patterning for panel level packaging." In Optical Lithography XXXIV, edited by Soichi Owa and Mark C. Phillips. SPIE, 2021. http://dx.doi.org/10.1117/12.2583689.

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Smith, Melissa A., Steven A. Vitale, Theodore H. Fedynyshyn, Matthew T. Cook, Joel Maldonado, Dmitri Shapiro, and Mordechai Rothschild. "High-resolution, high-throughput, CMOS-compatible electron-beam patterning." In SPIE Advanced Lithography, edited by Christoph K. Hohle and Roel Gronheid. SPIE, 2017. http://dx.doi.org/10.1117/12.2256649.

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Li, Linjie, Rafael R. Gattass, Michael Stocker, Erez Gershgoren, Hana Hwang, and John T. Fourkas. "High Resolution 3-D Laser Direct-Write Patterning." In Conference on Lasers and Electro-Optics. Washington, D.C.: OSA, 2010. http://dx.doi.org/10.1364/cleo.2010.jtua1.

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O'Callaghan, Greg, Carmen Popescu, Alex McClelland, Dimitrios Kazazis, John Roth, Wolfgang Theis, Yasin Ekinci, and Alex P. G. Robinson. "Multi-trigger resist: novel synthesis improvements for high resolution EUV lithography." In Advances in Patterning Materials and Processes XXXVI, edited by Roel Gronheid and Daniel P. Sanders. SPIE, 2019. http://dx.doi.org/10.1117/12.2515084.

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Zhang, Tao, Di Liu, Hee K. Park, Dong X. Yu, and David J. Hwang. "High resolution laser patterning of ITO on PET substrate." In SPIE LASE, edited by Xianfan Xu, Guido Hennig, Yoshiki Nakata, and Stephan W. Roth. SPIE, 2013. http://dx.doi.org/10.1117/12.2004122.

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NOGUCHI, Nobuaki, and Ikuo SUEMUNE. "High Resolution Patterning of Luminescent Porous Silicon with Photoirradiation." In 1993 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 1993. http://dx.doi.org/10.7567/ssdm.1993.c-5-5.

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Garner, Harold R., Amruta Joshi, Sandhya N. Mitnala, Michael L. Huebschman, Surya Shandy, Brandi Wallek, and Season Wong. "Dynamic high-resolution patterning for biomedical, materials, and semiconductor research." In SPIE MOEMS-MEMS: Micro- and Nanofabrication, edited by Larry J. Hornbeck and Michael R. Douglass. SPIE, 2009. http://dx.doi.org/10.1117/12.809122.

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Reports on the topic "High-Resolution Patterning"

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Jain, Kanti, and Greg Lievan. Novel Large Area, High Throughput, High Resolution Patterning System Program. Program Summary. Fort Belvoir, VA: Defense Technical Information Center, August 1995. http://dx.doi.org/10.21236/ada304783.

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Osgood, Richard M., and Jr. Quantum Device Fabricant Based on High Resolution Patterning with Reactive Neutral Beams. Fort Belvoir, VA: Defense Technical Information Center, August 1997. http://dx.doi.org/10.21236/ada329732.

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Jain, K., T. J. Dunn, N. Farmiga, and M. Zemel. Roll-to-Roll, Projection Lithography System for High-Resolution Patterning of Flexible Substrates, Volume 1. Fort Belvoir, VA: Defense Technical Information Center, May 1999. http://dx.doi.org/10.21236/ada375710.

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