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Journal articles on the topic 'HIGH-POWER APPLICATIONS'

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Author: Grafiati
Published: 11 September 2023

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1

Carroll, E. I. "Power electronics for very high power applications." Power Engineering Journal 13, no. 2 (April 1, 1999): 81–87. http://dx.doi.org/10.1049/pe:19990208.

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2

Anlin Yi, Anlin Yi, Lianshan Yan Lianshan Yan, Bin Luo Bin Luo, Wei Pan Wei Pan, and Jia Ye Jia Ye. "Effects of pattern dependence on high-power polarization-division-multiplexing applications." Chinese Optics Letters 10, no. 1 (2012): 010601–10603. http://dx.doi.org/10.3788/col201210.010601.

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3

Pottier, Sebastien B., Franck Hamm, Dominique Jousse, Patrick Sirot, Friedman Tchoffo Talom, and Rene Vezinet. "High Pulsed Power Compact Antenna for High-Power Microwaves Applications." IEEE Transactions on Plasma Science 42, no. 6 (June 2014): 1515–21. http://dx.doi.org/10.1109/tps.2014.2321416.

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4

Sethakul, P., S. Rael, B. Davat, and P. Thounthong. "Fuel cell high-power applications." IEEE Industrial Electronics Magazine 3, no. 1 (March 2009): 32–46. http://dx.doi.org/10.1109/mie.2008.930365.

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5

Pervak, V., O. Pronin, O. Razskazovskaya, J. Brons, I. B. Angelov, M. K. Trubetskov, A. V. Tikhonravov, and F. Krausz. "High-dispersive mirrors for high power applications." Optics Express 20, no. 4 (February 8, 2012): 4503. http://dx.doi.org/10.1364/oe.20.004503.

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6

Aralikatti, Sachin, and Reshma Nadaf. "High Speed Implementation of Floating Point Multiplier for Low Power Design Applications." Bonfring International Journal of Research in Communication Engineering 6, Special Issue (November 30, 2016): 108–12. http://dx.doi.org/10.9756/bijrce.8213.

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7

Kumar, Srisanthosh. "Single Power-Conversion Ac–Dc Converter with High Power Factor Based On ZVZCS for Dc Drive Applications." International Journal of Psychosocial Rehabilitation 23, no. 4 (December 20, 2019): 627–38. http://dx.doi.org/10.37200/ijpr/v23i4/pr190397.

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8

Pokryvailo, Alex, Costel Carp, and Clifford Scapellati. "A High-Power High-Voltage Power Supply for Long-Pulse Applications." IEEE Transactions on Plasma Science 38, no. 10 (October 2010): 2604–10. http://dx.doi.org/10.1109/tps.2010.2044810.

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9

Yeh, Ping-Chun, Hwann-Kaeo Chiou, Chwan-Ying Lee, John Yeh, Yi-Hung Tsai, Denny Tang, and John Chern. "High power density, high efficiency 1W SiGe power HBT for 2.4GHz power amplifier applications." Solid-State Electronics 52, no. 5 (May 2008): 745–48. http://dx.doi.org/10.1016/j.sse.2007.11.003.

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10

Pearton, S. J., F. Ren, A. P. Zhang, G. Dang, X. A. Cao, H. Cho, C. R. Abernathy, et al. "GaN Electronics for High Power, High Temperature Applications." Electrochemical Society Interface 9, no. 2 (June 1, 2000): 34–39. http://dx.doi.org/10.1149/2.f06002if.

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11

Sugawara, Yoshitaka. "SiC Devices for High Voltage High Power Applications." Materials Science Forum 457-460 (June 2004): 963–68. http://dx.doi.org/10.4028/www.scientific.net/msf.457-460.963.

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12

Pearton, S. J., F. Ren, A. P. Zhang, G. Dang, X. A. Cao, K. P. Lee, H. Cho, et al. "GaN electronics for high power, high temperature applications." Materials Science and Engineering: B 82, no. 1-3 (May 2001): 227–31. http://dx.doi.org/10.1016/s0921-5107(00)00767-4.

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13

Zhang, Shujun, Ru Xia, Laurent Lebrun, Dean Anderson, and Thomas R. Shrout. "Piezoelectric materials for high power, high temperature applications." Materials Letters 59, no. 27 (November 2005): 3471–75. http://dx.doi.org/10.1016/j.matlet.2005.06.016.

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14

Megel, Stefan, Mihails Kusnezoff, Nikolai Trofimenko, Viktar Sauchuk, Alexander Michaelis, Andreas Venskutonis, Klaus Rissbacher, et al. "High Efficiency CFY-Stack for High Power Applications." ECS Transactions 35, no. 1 (December 16, 2019): 269–77. http://dx.doi.org/10.1149/1.3570002.

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15

Pisau, Cătălin Dumitru. "High Power Lasers in Military Applications." Journal of Military Technology 2, no. 1 (June 26, 2019): 53–56. http://dx.doi.org/10.32754/jmt.2019.1.10.

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16

BELING, Andreas, Joe C. CAMPBELL, Kejia LI, Qinglong LI, Ye WANG, Madison E. WOODSON, Xiaojun XIE, and Zhanyu YANG. "High-Power Photodiodes for Analog Applications." IEICE Transactions on Electronics E98.C, no. 8 (2015): 764–68. http://dx.doi.org/10.1587/transele.e98.c.764.

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17

Kuk, Seung-Han, Sung-Myun Kim, Won-Gu Kang, Bumsoo Han, Nikolai K. Kuksanov, and Kwang-Young Jeong. "High-power Accelerator for Environmental Applications." Journal of the Korean Physical Society 59, no. 6(1) (December 15, 2011): 3485–88. http://dx.doi.org/10.3938/jkps.59.3485.

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18

YAMANAKA, Chiyoe, and Shuji SAKABE. "Prospects of High Power Laser Applications." Review of Laser Engineering 30, no. 4 (2002): 185–92. http://dx.doi.org/10.2184/lsj.30.185.

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19

MIYANAGA, Noriaki. "Extending Applications of High-Power Lasers." Review of Laser Engineering 36, no. 9 (2008): 530–37. http://dx.doi.org/10.2184/lsj.36.530.

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20

SASOH, Akihiro, and Toshikazu EBISUZAKI. "High Power Laser Applications to Aerospace." Review of Laser Engineering 43, no. 9 (2015): 611. http://dx.doi.org/10.2184/lsj.43.9_611.

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21

DOBREF, VASILE. "HIGH POWER APPLICATIONS OF ELECTROMAGNETIC DEVICES." Scientific Bulletin of Naval Academy 19, no. 1 (June 15, 2016): 206–9. http://dx.doi.org/10.21279/1454-864x-16-i1-036.

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22

Dableh, Joseph H., Raymond D. Findlay, Ian L. Colquhoun, and Morley E. Truemner. "Cable for High Pulse Power Applications." IEEE Power Engineering Review PER-5, no. 8 (August 1985): 23–24. http://dx.doi.org/10.1109/mper.1985.5526367.

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23

Benford, James. "Space Applications of High-Power Microwaves." IEEE Transactions on Plasma Science 36, no. 3 (June 2008): 569–81. http://dx.doi.org/10.1109/tps.2008.923760.

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24

Chen, Makan, Lise Donzel, Martin Lakner, and Willi Paul. "High temperature superconductors for power applications." Journal of the European Ceramic Society 24, no. 6 (January 2004): 1815–22. http://dx.doi.org/10.1016/s0955-2219(03)00443-6.

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25

Janzén, E., and O. Kordina. "SiC material for high-power applications." Materials Science and Engineering: B 46, no. 1-3 (April 1997): 203–9. http://dx.doi.org/10.1016/s0921-5107(96)01984-8.

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26

Berger, T., J. Dreher, M. Krausa, and J. Tübke. "Lithium accumulator for high-power applications." Journal of Power Sources 136, no. 2 (October 2004): 383–85. http://dx.doi.org/10.1016/j.jpowsour.2004.03.039.

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27

Dableh, Joseph, Raymond Findlay, Ian Colquhoun, and Morley Truemner. "Cable for High Pulse Power Applications." IEEE Transactions on Power Apparatus and Systems PAS-104, no. 8 (August 1985): 1963–67. http://dx.doi.org/10.1109/tpas.1985.318768.

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28

Lubkin, Gloria B. "Power Applications of High‐Temperature Superconductors." Physics Today 49, no. 3 (March 1996): 48–51. http://dx.doi.org/10.1063/1.881492.

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29

Capel, A., D. O'Sullivan, and J. C. Marpinard. "High-power conditioning for space applications." Proceedings of the IEEE 76, no. 4 (April 1988): 391–0408. http://dx.doi.org/10.1109/5.4425.

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30

Boni, Arthur A., David I. Rosen, Steven J. Davis, and Leslie A. Popper. "High-power laser applications to medicine." Journal of Quantitative Spectroscopy and Radiative Transfer 40, no. 3 (September 1988): 449–67. http://dx.doi.org/10.1016/0022-4073(88)90133-1.

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31

Boettcher, Lars, Lars Boettcher, S. Karaszkiewicz, D. Manessis, and A. Ostmann. "Embedded Power Modules – A new approach using Power Core and High Power PCB." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (January 1, 2015): 000906–37. http://dx.doi.org/10.4071/2015dpc-tp42.

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Abstract:
Power electronics packaging applications has strong demands regarding reliability and cost. The fields of developments reach from low power converter modules, over single or multichip MOSFET or IGBT packages, up to high power applications, like needed e.g. for solar inverters and automotive applications. This paper will give an overview about these applications and a description of each ones demand. The spectrum of conventional power electronics packaging reaches from SMD packages for power chips to large power modules. In most of these packages the power semiconductors are connected by bond wires, resulting in large resistances and parasitic inductance. Additionally bond wires result in a high stray inductance which limits the switching frequency. The embedding of chips using Printed Circuit Board (PCB) technology offers a solution for many of the problems in power packaging. This paper will show today's available power packages and power modules, realized in industrial production as well as in European research projects. All technologies which are used are based on PCB materials and processes. Chips are mounted to Cu foils, lead frames, high power PCBs or even ceramic substrates, embedded by vacuum lamination of laminate sheets and electrically connected by laser drilling and Cu plating. A new approach for embedded power modules will be presented in detail. In this project, different application fields are covered, ranging from 50 W over 500 W to 50kW power modules for different applications like single chip packages, over power control units for pedelec (Pedal Electric Cycle), to inverter modules for automotive applications. This approach will focus on a power core base structure for the embedded semiconductor, which is then connected to a high power PCB. The connection to the embedded die is realized by direct copper connection only. The technology principle will be described in detail. Frist manufactured demonstrators will be presented. The presented new approach for the realization of a power core structure offers new possibilities for the module manufacturing, avoiding soldering or Ag sintering of the power semiconductors and the handling of thick copper substrates during the embedding process.
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32

Lima, G. B., L. C. Freitas, J. B. Vieira, E. A. A. Coelho, V. J. Farias, L. C. G. Freitas, C. A. Canesin, and A. P. Finazzi. "Single-phase high power factor hybrid rectifier suitable for high-power applications." IET Power Electronics 5, no. 7 (August 1, 2012): 1137–46. http://dx.doi.org/10.1049/iet-pel.2011.0172.

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33

Banaei, M. R., and E. Salary. "Power Exchange by Using Micro-grid Inverter with High-Voltage Gain for Photovoltaic Applications." Journal of Clean Energy Technologies 4, no. 4 (2015): 237–40. http://dx.doi.org/10.7763/jocet.2016.v4.288.

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34

P. Divya Sri, P. Divya Sri, and Dr P. Hari Krishna Prasad. "Single Phase Dual Full Bridge Bi-directional DC-DC Converter for High power applications." Indian Journal of Applied Research 3, no. 5 (October 1, 2011): 259–65. http://dx.doi.org/10.15373/2249555x/may2013/79.

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35

Baranov, G. A., and A. A. Kuchinsky. "High-power, high-pressure pulsed CO2lasers and their applications." Quantum Electronics 35, no. 3 (March 31, 2005): 219–29. http://dx.doi.org/10.1070/qe2005v035n03abeh002856.

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36

Kheraluwala, M. H., D. W. Novotny, and D. M. Divan. "Coaxially wound transformers for high-power high-frequency applications." IEEE Transactions on Power Electronics 7, no. 1 (January 1992): 54–62. http://dx.doi.org/10.1109/63.124577.

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37

Sun, Ruize, Jingxue Lai, Wanjun Chen, and Bo Zhang. "GaN Power Integration for High Frequency and High Efficiency Power Applications: A Review." IEEE Access 8 (2020): 15529–42. http://dx.doi.org/10.1109/access.2020.2967027.

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38

Jiang, H. C., X. Si, W. L. Zhang, C. J. Wang, B. Peng, and Y. R. Li. "Microwave power thin film resistors for high frequency and high power load applications." Applied Physics Letters 97, no. 17 (October 25, 2010): 173504. http://dx.doi.org/10.1063/1.3507883.

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39

Chang, Chao, Zhengfeng Xiong, Letian Guo, Xiaolong Wu, Yansheng Liu, Xiaoyue Xing, and Zhiguo Li. "Compact four-way microwave power combiner for high power applications." Journal of Applied Physics 115, no. 21 (June 7, 2014): 214502. http://dx.doi.org/10.1063/1.4880741.

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40

Yuming, Zhou, Yu Yuehui, Chen Haigang, and Liang Lin. "A High Power Semiconductor Switch RSD for Pulsed Power Applications." Plasma Science and Technology 9, no. 5 (October 2007): 622–25. http://dx.doi.org/10.1088/1009-0630/9/5/23.

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41

Madawala, U. K., and D. J. Thrimawithana. "Modular-based inductive power transfer system for high-power applications." IET Power Electronics 5, no. 7 (August 1, 2012): 1119–26. http://dx.doi.org/10.1049/iet-pel.2011.0182.

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42

Meng, Ru, Yulong Xia, Letian Guo, Yuanyue Guo, and Qi Zhu. "X‐band compact coaxial power combiner for high‐power applications." IET Microwaves, Antennas & Propagation 13, no. 12 (July 12, 2019): 2171–76. http://dx.doi.org/10.1049/iet-map.2019.0055.

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43

Keeling, N. A., G. A. Covic, and J. T. Boys. "A Unity-Power-Factor IPT Pickup for High-Power Applications." IEEE Transactions on Industrial Electronics 57, no. 2 (February 2010): 744–51. http://dx.doi.org/10.1109/tie.2009.2027255.

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44

Elshafey, Ahmed F., and Mahmoud Abdelrahman Abdalla. "LOW LOSS HIGH POWER AIR SUSPENDED STRIPLINE POWER DIVIDER FOR HIGH POWER DIVISION SUB-SYSTEMS APPLICATIONS." Progress In Electromagnetics Research M 73 (2018): 153–62. http://dx.doi.org/10.2528/pierm18070506.

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45

Eroglu, Abdullah. "PLANAR INDUCTOR DESIGN FOR HIGH POWER APPLICATIONS." Progress In Electromagnetics Research B 35 (2011): 53–67. http://dx.doi.org/10.2528/pierb11081601.

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46

MINAMIDA, Katsuhiro. "High Power Laser Applications in Steel Industries." Review of Laser Engineering 24, Supplement (1996): S25—S28. http://dx.doi.org/10.2184/lsj.24.supplement_s25.

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47

MINAMIDA, Katsuhiro. "High Power Laser Applications in Steel Industry." Review of Laser Engineering 28, no. 11 (2000): 760–64. http://dx.doi.org/10.2184/lsj.28.760.

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48

Nisida, Naoto. "High Power Excimer Laser for Industrial Applications." Journal of the Japan Welding Society 61, no. 8 (1992): 683–87. http://dx.doi.org/10.2207/qjjws1943.61.8_683.

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49

Jovcic, Dragan, Lu Zhang, and Masood Hajian. "LCL VSC Converter for High-Power Applications." IEEE Transactions on Power Delivery 28, no. 1 (January 2013): 137–44. http://dx.doi.org/10.1109/tpwrd.2012.2219560.

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50

Jin, H., G. Pan, S. J. Xue, and F. P. Wang. "Novel Lithium Titanate for High Power Applications." ECS Transactions 58, no. 48 (April 25, 2014): 63–69. http://dx.doi.org/10.1149/05848.0063ecst.

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