Journal articles on the topic 'High density interconnection PCBs'
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Cauwe, Maarten, Bart Vandevelde, Chinmay Nawghane, Marnix Van De Slyeke, Erwin Bosman, Joachim Verhegge, Alexia Coulon, and Stan Heltzel. "High-Density Interconnect Technology Assessment of Printed Circuit Boards for Space Applications." Journal of Microelectronics and Electronic Packaging 17, no. 3 (July 1, 2020): 79–88. http://dx.doi.org/10.4071/imaps.1212898.
Full textBernhard, T., L. Gregoriades, S. Branagan, L. Stamp, E. Steinhäuser, R. Schulz, and F. Brüning. "Nanovoid Formation at Cu/Cu/Cu Interconnections of Blind Microvias: A Field Study." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000492–502. http://dx.doi.org/10.4071/2380-4505-2019.1.000492.
Full textPetrosyants, Konstantin O., and Anton A. Popov. "Experimental Investigation of Temperature-Current Rise in Fine PCB Copper Traces on Polyimide, Aluminium and Ceramic (Al2O3) Substrates." Advanced Materials Research 739 (August 2013): 155–60. http://dx.doi.org/10.4028/www.scientific.net/amr.739.155.
Full textJi, Linxian, Chong Wang, Shouxu Wang, Wei He, Dingjun Xiao, and Ze Tan. "Multiphysics coupling simulation of RDE for PCB manufacturing." Circuit World 41, no. 1 (February 2, 2015): 20–28. http://dx.doi.org/10.1108/cw-09-2014-0037.
Full textAvitabile, Gianfranco, Antonello Florio, Vito Leonardo Gallo, Alessandro Pali, and Lorenzo Forni. "An Optimization Framework for the Design of High-Speed PCB VIAs." Electronics 11, no. 3 (February 6, 2022): 475. http://dx.doi.org/10.3390/electronics11030475.
Full textBernhard, T., S. Branagan, R. Schulz, F. Brüning, L. Stamp, K. Wurdinger, and S. Kempa. "The Formation of Nano-voids in electroless Cu Layers." MRS Advances 4, no. 41-42 (2019): 2231–40. http://dx.doi.org/10.1557/adv.2019.336.
Full textHe, Huirong, Jida Chen, Shengtao Zhang, Minhui Liao, Lingxing Li, Wei He, Yuanming Chen, and Shijin Chen. "Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method." Circuit World 43, no. 3 (August 7, 2017): 131–38. http://dx.doi.org/10.1108/cw-02-2017-0004.
Full textShearer, Catherine, Ken Holcomb, and Jim Haley. "Shrinking Package Footprint by Embedding Top-Side Real Estate Using Core-to-Core Joining." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (January 1, 2015): 001982–2014. http://dx.doi.org/10.4071/2015dpc-tha22.
Full textHübner, Henning, Christian Ohde, and Dirk Ruess. "Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000037–42. http://dx.doi.org/10.4071/2380-4505-2018.1.000037.
Full textKatahira, Takayoshi, Ilkka Kartio, Hiroshi Segawa, Michimasa Takahashi, and Katsumi Sagisaka. "Vertically high-density interconnection for mobile application." Microelectronics Reliability 46, no. 5-6 (May 2006): 756–62. http://dx.doi.org/10.1016/j.microrel.2005.07.001.
Full textUmarji, G. G., S. A. Ketkar, G. J. Phatak, T. Seth, U. P. Mulik, and D. P. Amalnerkar. "Photoimageable silver paste for high density interconnection technology." Materials Letters 59, no. 4 (February 2005): 503–9. http://dx.doi.org/10.1016/j.matlet.2004.10.034.
Full textVrana, M., A. Van Calster, R. Vanden Berghe**, and K. Allaert. "Interconnection Technology for Advanced High Density Thick Films." Microelectronics International 13, no. 3 (December 1996): 5–8. http://dx.doi.org/10.1108/13565369610800322.
Full textSelvakumar, Kandaswamy, Senthamilselvan Bavithra, Sekaran Suganya, Firdous Ahmad Bhat, Gunasekaran Krishnamoorthy, and Jagadeesan Arunakaran. "Effect of Quercetin on Haematobiochemical and Histological Changes in the Liver of Polychlorined Biphenyls-Induced Adult Male Wistar Rats." Journal of Biomarkers 2013 (October 1, 2013): 1–12. http://dx.doi.org/10.1155/2013/960125.
Full textHONDA, Susumu. "Importance of Environmental-Friendly High Density Packaging and Interconnection." Journal of Japan Institute of Electronics Packaging 1, no. 4 (1998): 257–58. http://dx.doi.org/10.5104/jiep.1.257.
Full textJahns, Jürgen, and Bruno Acklin. "Integrated planar optical imaging system with high interconnection density." Optics Letters 18, no. 19 (October 1, 1993): 1594. http://dx.doi.org/10.1364/ol.18.001594.
Full textFjelstad, Joseph. "Interconnection strategies for high‐density printed circuits – an overview." Circuit World 28, no. 1 (March 2002): 6–9. http://dx.doi.org/10.1108/03056120210407685.
Full textYu, Changyuan, Michael R. Wang, Alberto J. Varela, and Bing Chen. "High-density non-diffracting beam array for optical interconnection." Optics Communications 177, no. 1-6 (April 2000): 369–76. http://dx.doi.org/10.1016/s0030-4018(00)00583-6.
Full textTakahashi, Kenji, Mitsuo Umemoto, Naotaka Tanaka, Kazumasa Tanida, Yoshihiko Nemoto, Yoshihiro Tomita, Masamoto Tago, and Manabu Bonkohara. "Ultra-high-density interconnection technology of three-dimensional packaging." Microelectronics Reliability 43, no. 8 (August 2003): 1267–79. http://dx.doi.org/10.1016/s0026-2714(03)00167-7.
Full textSang-Pil Han, In-Kui Cho, Sung-Hwan Hwang, Woo-Jin Lee, and Seung-Ho Ahn. "A high-density two-dimensional parallel optical interconnection module." IEEE Photonics Technology Letters 17, no. 11 (November 2005): 2448–50. http://dx.doi.org/10.1109/lpt.2005.857250.
Full textBroadbent, E. K., J. M. Flanner, and W. G. M. Van den Hoek. "High-density high-reliability tungsten interconnection by filled interconnect groove metallization." IEEE Transactions on Electron Devices 35, no. 7 (July 1988): 952–56. http://dx.doi.org/10.1109/16.3350.
Full textGong, Hua, Adam T. Woolley, and Gregory P. Nordin. "3D printed high density, reversible, chip-to-chip microfluidic interconnects." Lab on a Chip 18, no. 4 (2018): 639–47. http://dx.doi.org/10.1039/c7lc01113j.
Full textNechay, Bettina, Megan Snook, Harold Hearne, Ty McNutt, Victor Veliadis, Sharon Woodruff, R. S. Howell, David Giorgi, Joseph White, and Stuart Davis. "High-Yield 4H-SiC Thyristors for Wafer-Scale Interconnection." Materials Science Forum 717-720 (May 2012): 1171–74. http://dx.doi.org/10.4028/www.scientific.net/msf.717-720.1171.
Full textMlynarczuk, J., R. Amarowicz, and J. Kotwica. "Effect of polychlorinated biphenyls (Aroclor-1248) on the secretory function of bovine luteal cells affected by LH, noradrenaline and high density lipoproteins." Veterinární Medicína 48, No. 10 (March 30, 2012): 267–74. http://dx.doi.org/10.17221/5779-vetmed.
Full textBao, Wen-Tao, Bin-Zhang Fu, Ming-Yu Chen, and Li-Xin Zhang. "A High-Performance and Cost-Efficient Interconnection Network for High-Density Servers." Journal of Computer Science and Technology 29, no. 2 (March 2014): 281–92. http://dx.doi.org/10.1007/s11390-014-1430-0.
Full textKondo, Kazuo, Kunio Shinohara, and Keisuke Fukui. "Shape Evolution of High density Interconnection Bumps Used For Microprocessor." KAGAKU KOGAKU RONBUNSHU 22, no. 3 (1996): 534–41. http://dx.doi.org/10.1252/kakoronbunshu.22.534.
Full textWang, Hongjie, Weidong Huang, Fei Geng, Yuan Lu, Bo Zhang, Wen Yin, and Haidong Wang. "A cost effective PoP structure with high I/O density." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (January 1, 2014): 000768–85. http://dx.doi.org/10.4071/2014dpc-tp15.
Full textFjelstad, Joseph, Konstantine Karavakis, and Belgacem Haba. "Manufacture of high density interconnection substrates by co‐lamination of inner layers and programmed interconnection joining layers." Circuit World 25, no. 3 (September 1999): 9–12. http://dx.doi.org/10.1108/03056129910268927.
Full textOhta, Koushi, Kiyokazu Yasuda, Michiya Matsushima, and Kozo Fujimoto. "Numerical Analysis of Self-Organizing Interconnection Process by 3 Dimensional Flow Dynamics." Solid State Phenomena 124-126 (June 2007): 543–46. http://dx.doi.org/10.4028/www.scientific.net/ssp.124-126.543.
Full textODAIRA, Hiroshi, Kenji SASAOKA, Eiji IMAMURA, and Kazuyasu TANAKA. "Development of High Density PWB by a New Layer Interconnection Method." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 11, no. 2 (1996): 106–12. http://dx.doi.org/10.5104/jiep1995.11.106.
Full textPfistner, P., T. Blank, M. Caselle, P. F. v. Wintzingerode, M. Weber, J. M. Heuser, and C. J. Schmidt. "Novel high-density interconnection technology for the CBM Silicon Tracking System." Journal of Instrumentation 14, no. 09 (September 30, 2019): P09027. http://dx.doi.org/10.1088/1748-0221/14/09/p09027.
Full textChakravorty, K. K., C. P. Chien, J. M. Cech, M. H. Tanielian, and P. L. Young. "High-density interconnection using photosensitive polyimide and electroplated copper conductor lines." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 13, no. 1 (March 1990): 200–206. http://dx.doi.org/10.1109/33.52871.
Full textChoi, Choon-Gi, Sang-Pil Han, and Myung-Yung Jeong. "Two-dimensional polymeric optical waveguides for high-density parallel optical interconnection." Optics Communications 235, no. 1-3 (May 2004): 69–73. http://dx.doi.org/10.1016/j.optcom.2004.02.078.
Full textSong, In-Hyouk, and Taehyun Park. "Connector-Free World-to-Chip Interconnection for Microfluidic Devices." Micromachines 10, no. 3 (February 27, 2019): 166. http://dx.doi.org/10.3390/mi10030166.
Full textDISHON, G. J., S. M. BOBBIO, M. A. PENNINGTON, R. F. LIPSCOMB, N. KOOPMAN, and S. NANGALIA. "Micro-Interconnection Technology. Fluxless Flip Chip Solder Joining for High Density Interconnect." Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10, no. 6 (1995): 390–93. http://dx.doi.org/10.5104/jiep1995.10.390.
Full textBuck, T. J. "Advanced Discrete Wiring Technology: A Solution for High Density Sub‐nanosecond Interconnection." Circuit World 14, no. 2 (January 1988): 4–10. http://dx.doi.org/10.1108/eb043946.
Full textBlumbergs, Ervins, Vera Serga, Andrei Shishkin, Dmitri Goljandin, Andrej Shishko, Vjaceslavs Zemcenkovs, Karlis Markus, Janis Baronins, and Vladimir Pankratov. "Selective Disintegration–Milling to Obtain Metal-Rich Particle Fractions from E-Waste." Metals 12, no. 9 (September 1, 2022): 1468. http://dx.doi.org/10.3390/met12091468.
Full textChen, Chi-Han, Kuan-Chung Lu, Chang-Ying Hung, Pao-Nan Lee, Meng-Jen Wang, Chih-Pin Hung, Ho-Ming Tong, and Tzyy-Sheng Horng. "GHz High Frequency TSV for 2.5D IC Packaging." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 001215–20. http://dx.doi.org/10.4071/isom-2012-thp62.
Full textDas, Rabindra, J. M. Lauffer, and F. D. Egitto. "Versatile Z-Axis Interconnection for High Performance Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (January 1, 2013): 001033–50. http://dx.doi.org/10.4071/2013dpc-wa13.
Full textCho, James S. H., Ho-Kyu Kang, S. Simon Wong, and Yosi Shacham-Diamand. "Electroless Cu for VLSI." MRS Bulletin 18, no. 6 (June 1993): 31–38. http://dx.doi.org/10.1557/s0883769400047308.
Full textXiong, Zhijiang. "A Design of Bare Printed Circuit Board Defect Detection System Based on YOLOv8." Highlights in Science, Engineering and Technology 57 (July 11, 2023): 203–9. http://dx.doi.org/10.54097/hset.v57i.10002.
Full textLan, Kuibo, Zhihui Pei, Yibo Zhang, Kailiang Zhang, Xuejiao Chen, and Guoxuan Qin. "Investigation on growth and electronic characteristics of vertical carbon nanotubes." Modern Physics Letters B 33, no. 04 (February 10, 2019): 1950042. http://dx.doi.org/10.1142/s0217984919500428.
Full textCai, Jiawei, Long Zhang, Yingzhuo Huang, Pengrong Lin, and Quanbin Yao. "Simulation analysis of a specification package for high density and high voltage power module." Journal of Physics: Conference Series 2383, no. 1 (December 1, 2022): 012093. http://dx.doi.org/10.1088/1742-6596/2383/1/012093.
Full textBerglund, Olof, Per Nyström, and Per Larsson. "Persistent organic pollutants in river food webs: influence of trophic position and degree of heterotrophy." Canadian Journal of Fisheries and Aquatic Sciences 62, no. 9 (September 1, 2005): 2021–32. http://dx.doi.org/10.1139/f05-115.
Full textHuang, Guoping, Hao Zhuang, Honglie Shen, Yashuai Jiang, Guan Sun, Xueliang Bai, and Jingnan Li. "Study of novel high-density solar panels based on small space interconnection technology." E3S Web of Conferences 260 (2021): 03007. http://dx.doi.org/10.1051/e3sconf/202126003007.
Full textMorikawa, Yasuhiro. "Plasma Dry Process Technology for High-Density Interconnection on 2D Panel Substrate Packaging." Journal of Japan Institute of Electronics Packaging 20, no. 4 (2017): 185–91. http://dx.doi.org/10.5104/jiep.20.185.
Full textKondo, Kazuo, Mitsunori Yokoyama, and Keisuke Fukui. "Computation Transport Phenomena in Chemical Engineering. Shape Evolution of High Density Interconnection Bumps." KAGAKU KOGAKU RONBUNSHU 23, no. 6 (1997): 780–88. http://dx.doi.org/10.1252/kakoronbunshu.23.780.
Full textStrazzella, Arianna, Alice Ossoli, and Laura Calabresi. "High-Density Lipoproteins and the Kidney." Cells 10, no. 4 (March 31, 2021): 764. http://dx.doi.org/10.3390/cells10040764.
Full textPark, Ji-Su, Won-Je Oh, Jang-Hun Joo, Jun-Sin Yi, Byung-You Hong, and Jae-Hyeong Lee. "Design of High-Power and High-Density Photovoltaic Modules Based on a Shingled Cell String." Journal of Nanoscience and Nanotechnology 20, no. 11 (November 1, 2020): 6996–7001. http://dx.doi.org/10.1166/jnn.2020.18837.
Full textPartsinevelou, Aikaterini-Sofia. "Using the SWAT model in analyzing hard rock hydrogeological environments. Application in Naxos Island, Greece." Bulletin of the Geological Society of Greece 51 (October 4, 2017): 18. http://dx.doi.org/10.12681/bgsg.11960.
Full textZhang, Fang-Li, Xing-Jian Yang, Xiu-Ling Xue, Xue-Qin Tao, Gui-Ning Lu, and Zhi Dang. "Estimation ofn-Octanol/Water Partition Coefficients (log KOW) of Polychlorinated Biphenyls by Using Quantum Chemical Descriptors and Partial Least Squares." Journal of Chemistry 2013 (2013): 1–8. http://dx.doi.org/10.1155/2013/740548.
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