Dissertations / Theses on the topic 'Heteroepitaxial Growth'
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Rätsch, Christian. "Effects of strain on heteroepitaxial growth dynamics." Diss., Georgia Institute of Technology, 1994. http://hdl.handle.net/1853/30647.
Full textMeng, Shuang. "Heteroepitaxial growth of gallium selenium compounds on silicon /." Thesis, Connect to this title online; UW restricted, 2000. http://hdl.handle.net/1773/9749.
Full textBERGAMASCHINI, ROBERTO. "Continuum models of heteroepitaxial growth on patterned substrates." Doctoral thesis, Università degli Studi di Milano-Bicocca, 2013. http://hdl.handle.net/10281/40087.
Full textMao, Jun. "Heteroepitaxial growth on silicon surface : a Monte Carlo study." Thesis, University of Leicester, 1997. http://hdl.handle.net/2381/30582.
Full textWallace, Julia M. "Growth and characterisation of heteroepitaxial ZnSe and ZnSxSe1-x." Thesis, Heriot-Watt University, 1992. http://hdl.handle.net/10399/806.
Full textHatfield, Stuart Andrew. "Heteroepitaxial growth of MnSb on III-V semiconductor substrates." Thesis, University of Warwick, 2006. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.444834.
Full text吳誼暉 and Yee-fai Ng. "Heteroepitaxial growth of InN on GaN by molecular beam epitaxy." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2002. http://hub.hku.hk/bib/B29797846.
Full textNg, Yee-fai. "Heteroepitaxial growth of InN on GaN by molecular beam epitaxy /." Hong Kong : University of Hong Kong, 2002. http://sunzi.lib.hku.hk/hkuto/record.jsp?B25212175.
Full textXu, Zhehan. "Direct Heteroepitaxial Growth of III-Vs on Si by HVPE." Thesis, KTH, Tillämpad fysik, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-265624.
Full textMcIntyre, Paul Cameron. "Heteroepitaxial growth of chemically derived Ba₂YCu₃O₇âx thin films." Thesis, Massachusetts Institute of Technology, 1993. http://hdl.handle.net/1721.1/12741.
Full textIncludes bibliographical references (leaves 168-177).
by Paul Cameron McIntyre.
Sc.D.
Reyes-Natal, Meralys. "Modeling and growth of the 3C-SiC heteroepitaxial system via chloride chemistry." [Tampa, Fla] : University of South Florida, 2008. http://purl.fcla.edu/usf/dc/et/SFE0002691.
Full textRöder, Holger. "Microscopic processes in heteroepitaxial growth : nucleation, growth and alloying of silver on the (111) surface of platinium /." [S.l.] : [s.n.], 1994. http://library.epfl.ch/theses/?nr=1288.
Full textGATTI, RICCARDO. "Modeling elastic and plastic relaxation in silicon-germanium heteroepitaxial nanostructures." Doctoral thesis, Università degli Studi di Milano-Bicocca, 2011. http://hdl.handle.net/10281/18965.
Full textALBANI, MARCO GIOCONDO. "Modeling of 3D heteroepitaxial structures by continuum approaches." Doctoral thesis, Università degli Studi di Milano-Bicocca, 2019. http://hdl.handle.net/10281/241273.
Full textSemiconductors are the main building block for a variety of devices in our life. The semiconductor industry, in the last decades, has evolved by following the Moore's law. However, this incredible innovation process is going to reach an end in the next years, as the miniaturization process is getting too close to the atomistic size, which hinders the development of smaller devices. Therefore, alternative ways to evolve the current technologies have to been exploited. In particular, bottom-up approaches are currently being studied for the growth of 3D nanostructures. In this Thesis, to deal with the 3D growth dynamics, we develop a modeling technique that can reproduce the vertical growth of nanostrucutures. A kinetic approach, related to the incorporation dynamics of adatoms on the surface, has to be adopted to model the peculiar growth of 3D nanostructures, which cannot be explained by the standard thermodynamic arguments based on the surface energy densities. The simulation of the vertical growth is not just challenging for the definition of a proper model, but it requires also a dedicated technique for the numerical solution of the evolution dynamics. In particular, in this Thesis, we exploit a phase field model to simulate the growth on GaAs nanomembranes, based on a finite element method for the solution of the evolution equations. For the development of devices, it is often required to build heterostructures which combine different semiconductors, for instance for optoelectronic applications where a p-n junction is required. Furthermore, the heteroepitaxial growth can be exploited also to transfer some structural material properties, such as the hexagonal lattice structure, from a material to another. In this Thesis, we focus on the core/shell nanowire heteroepitaxial system and we provide a detailed characterization of the elastic deformations in the crystal structure. The elastic relaxation is studied in a continuum elasticity framework by finite element method. In particular, we study the bending of GaP/InGaP nanowires and we correlate this phenomenon with the partitioning of the elastic deformation within the nanostructure. Moreover, we investigate the role of the elastic relaxation in Ge/GeSn core/shell nanowires with respect to the incorporation of Sn in the shell. The evolution of nanostructures can be driven also by the combined effect of surface energy and elastic energy contributions. One of the most studied examples of this is the heteroepitaxial growth of islands on planar substrates, following the Stranski-Krastanov growth mode. For technological applications it is fundamental to control the spatial distribution and the size-uniformity of the islands. In this Thesis, we propose a phase-field model which combines the description for the surface diffusion dynamics and the finite element characterization of the strain field to study the ordered growth of islands on pit-patterned substrates. In particular, we choose the prototypical system where Ge islands are grown on a Si substrate. The advantage of the phase-field model based on finite element method is the possibility to exactly solve the evolution equations of the system, without the need of higher order approximations and with the possibility to precisely consider the effect on the elastic relaxation which is provided by the substrate morphology.
Liu, Ying. "Heteroepitaxial growth of InN and InGaN alloys on GaN(0001) by molecular beam epitaxy." Click to view the E-thesis via HKUTO, 2005. http://sunzi.lib.hku.hk/hkuto/record/B36363558.
Full textLiu, Ying, and 劉穎. "Heteroepitaxial growth of InN and InGaN alloys on GaN(0001) by molecular beam epitaxy." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2005. http://hub.hku.hk/bib/B36363558.
Full textPiquette, Eric C. McGill T. C. "Molecular beam heteroepitaxial growth and characterization of wide band gap semiconductor films and devices /." Diss., Pasadena, Calif. : California Institute of Technology, 1999. http://resolver.caltech.edu/CaltechETD:etd-11292006-152956.
Full textJang, Syun-Ming. "Growth, characterization and thermal stability of undoped and in-situ doped silicon-germanium heteroepitaxial layers." Thesis, Massachusetts Institute of Technology, 1993. http://hdl.handle.net/1721.1/12744.
Full textNiu, Xiaobin. "Level-set simulations of self-assembled nano patterns and stacked quantum dots during heteroepitaxial growth." Diss., Restricted to subscribing institutions, 2008. http://proquest.umi.com/pqdweb?did=1610041041&sid=1&Fmt=2&clientId=1564&RQT=309&VName=PQD.
Full textZabaleta, Llorens Jone. "Growth and advanced characterization of solution-derived nanoscale La Sr MnO heteroepitaxial 0.7 0.3 3 systems." Doctoral thesis, Universitat Autònoma de Barcelona, 2012. http://hdl.handle.net/10803/294276.
Full textThis work deals with the growth and the comprehensive characterization of nanoscale ferromagnetic La0.7Sr0.3MnO3 (LSMO) manganite heteroepitaxial systems. LSMO is a complex oxide exhibiting phenomena such as Colossal magnetoresistance and half metallicity, and, thus, an appealing candidate for potential technological applications like magnetic sensors and memories. Many of these applications require the down-scaling of LSMO to the nanometer range, and to do so cost-effectively. Moreover, such miniaturization raises novel and interesting phenomena, consequence of the new relationships that are established between the constituent atoms at the nanoscale. In this thesis we demonstrate that a scalable, bottom-up approach based on ultra-diluted chemical solutions succeeds in generating high quality ferromagnetic epitaxial LSMO ultra-thin films (2D) (below 10 nm in thickness) and self-assembled nanoislands (3D) (diameters below 200 nm, thicknesses below 40 nm). Whether the system arranges into a 2D or a 3D configuration is determined by the choice of the single crystal oxide substrate underneath, which highlights the key role of lattice mismatch and of surface/interface energies in heteroepitaxial growth. We address here the morphology, crystal structure, and strain state of ultra-thin films and self-assembled nanoislands. Macroscopic magnetic characterization reveals that the measured Curie temperatures (Tc~350 K) are comparable to the Tc value reported for bulk LSMO. This is a remarkable fact in LSMO ultra-thin films and sub-200 nm nanoislands, given the experimental tendency, for vapor-deposited LSMO thin films and lithographied nanoislands, to show depressed Tc values. Preliminary transport measurements in the LSMO films also display interesting features, such as the decoupling of the metal-insulator and the ferromagnetic-paramagnetic transitions and an enhanced magnetoresistance. The system of ferromagnetic self-assembled 3D nanoislands is further explored by means of local characterization techniques, in order to unveil their local functional properties. Detailed Magnetic Force Microscopy investigations show the correlation between the magnetic structure and the geometrical characteristics of the LSMO nanoislands, with the vortex-state playing a central role. The challenges of Photoemission electron microscopy (PEEM) and Kelvin Probe Microscopy (KPFM) measurements in these sub-200 nm LSMO nanoislands, grown on insulating substrates, are also addressed. PEEM provides information on the stoichiometric composition and on the magnetic structure of some of the largest nanoislands. KPFM, in turn, shows a local work function anisotropy between the facets of the LSMO nanoislands, and opens the path to the electrostatic characterization of nanoscale complex oxides.
Onojima, Norio. "Heteroepitaxial Growth of High-Quality AIN on SiC by Molecular-Beam Epitaxy toward Electronic Device Application." 京都大学 (Kyoto University), 2004. http://hdl.handle.net/2433/77767.
Full textDa, Conceicao Lorenzzi Jean Carlos. "Growth and doping of heteroepitaxial 3C-SiC layers on α-SiC substrates using Vapour-Liquid-Solid mechanism." Thesis, Lyon 1, 2010. http://www.theses.fr/2010LYO10179.
Full textRecently, the use of an original growth approach based on vapour-liquid-solid (VLS) mechanism with Ge-Si melts has led to significant improvement of the crystalline quality of the 3C-SiC thin layers heteroepitaxially grown on α-SiC(0001) substrate. This work tries to deepen the knowledge of such specific growth method, to improve the process and to determine the properties of the grown material. The first part was dedicated to the understanding and mastering of the various mechanisms involved in 3C-SiC growth by VLS mechanism. This led to the determination of the parameters limiting sample size and the demonstration of the benefits of using 50 at% Ge instead of 75 at% Ge melts. A study of lateral enlargement on patterned substrates gave some interesting hints which can be integrated in the model of twin defect elimination. The incorporation of non intentional and intentional n- and p-type dopants during VLS growth was studied. For n-type doping, a clear link between N impurity and 3C polytype stability was demonstrated. Besides, high purity layers with residual n-type doping below 1x1017 cm-3 were achieved. For p-type doping, the best element was shown to be Al and not Ga, even if it has to be alloyed with Ge-Si melts to avoid homoepitaxial growth. Finally, these layers were characterised by several optical and electrical means like Raman spectroscopy, low temperature photoluminescence, deep leveltransient spectroscopy and MOS capacitors measurements. Very low concentrationsof fixed oxide charges estimated about 7×109 cm-2 and interface states densities Dit equal to 1.2×1010 cm-2eV-1at 0.63 eV below the conduction band have been achieved. These record values are a very good base toward 3C-SiC MOSFET
Nakamura, Kazuhiro. "Heteroepitaxial Growth of InGaP and GaAsP on Si and Their Doping Characteristics for the Application to Tandem Solar Cells." Kyoto University, 2001. http://hdl.handle.net/2433/150652.
Full textHeilmann, Martin Verfasser], and Gerd [Gutachter] [Leuchs. "Heteroepitaxial Growth of GaN Nanostructures via Metalorganic Vapor Phase Epitaxy on Sapphire and Silicon using Graphene as Buffer Layer / Martin Heilmann ; Gutachter: Gerd Leuchs." Erlangen : Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), 2017. http://d-nb.info/1125715472/34.
Full textHeilmann, Martin [Verfasser], and Gerd [Gutachter] Leuchs. "Heteroepitaxial Growth of GaN Nanostructures via Metalorganic Vapor Phase Epitaxy on Sapphire and Silicon using Graphene as Buffer Layer / Martin Heilmann ; Gutachter: Gerd Leuchs." Erlangen : Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), 2017. http://d-nb.info/1125715472/34.
Full textFontaine, Chantal. "Heteroepitaxie par jets moeculaires : systeme (ca,sr)f::(2) - gaas." Toulouse 3, 1987. http://www.theses.fr/1987TOU30135.
Full textPorte, Agnès. "Determination des parametres qui regissent la cinetique et la composition d'un depot de gainas/inp par la methode aux hydrures." Clermont-Ferrand 2, 1988. http://www.theses.fr/1988CLF2D162.
Full textPellissier, Anne. "Etude structurale et microscopique du système Y/Si." Grenoble INPG, 1989. http://www.theses.fr/1989INPG0031.
Full textAllain, Laurent. "Etude des effets de la temperature sur la diffraction des rayons x par des composes semiconducteurs iii-v." Paris 6, 1988. http://www.theses.fr/1988PA066016.
Full textFontaine, Christophe. "Hétéroépitaxie par jets moléculaires de semiconducteurs II-VI." Grenoble 1, 1986. http://www.theses.fr/1986GRE10062.
Full textRobach, Odile. "Étude in situ de la croissance de Ag sur MgO(001) et de Ni/Ag(001), et étude de la nitruration du GaAs par diffusion de rayons X en incidence rasante." Université Joseph Fourier (Grenoble ; 1971-2015), 1997. http://www.theses.fr/1997GRE10226.
Full textYang, Shang-Shian, and 楊尚賢. "Heteroepitaxial growth on Si:TiN、ZrN、ZnO." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/15858197115090731845.
Full textHu, Tzu-Chieh, and 胡子杰. "Heteroepitaxial Growth of GaN Using a Ga2O3 Interlayer." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/95851152673068612071.
Full text國立中興大學
精密工程學系所
99
This thesis has presented a new sacrificial material, gallium oxide (Ga2O3) for the chemical lift off (CLO) process of GaN epilayers from sapphire substrates. The atmosphere of metal organic vapor chemical deposition (MOCVD) used for growing crystalline GaN on Ga2O3 sacrificial layer was N2 since a serious degradation of Ga2O3 would take place in a H2 ambient at high temperature. To improve the quality of GaN grown with N2 as carrier gas, the GaN was subsequently regrown in a H2 ambient. In order to increase the lateral etching rate for CLO process conducted with Ga2O3, the SiO2 stripes with a 3-μm-wide, a 400-nm-height, and 3-μm-spacing were deposited on Ga2O3/sapphire in the direction of <11 ¯00>GaN by a combination of plasma enhanced chemical vapor deposition, photolithograph and inductively coupled plasma dry etching processes. The growth of GaN epilayer on the Ga2O3 layer with SiO2 stripes was achieved by the two-step selective MOCVD where the first-step was carried out in a N2 ambient and the second-step was conducted in a H2 ambient. The full width at half maximum of rocking curve at (002) plane for the GaN grown by this 2-step selective MOCVD was 40% lower than that for the GaN grown by a conventional MOCVD in a N2 ambient. Meanwhile, the lateral etching rate of Ga2O3 was dramatically improved since these SiO2 stripes provided hydrofluoric acid pathways for getting into the central part of Ga2O3.
LIN, JU-SHAN, and 林鉅山. "Heteroepitaxial growth of GaAs on Si(100) substrate." Thesis, 1992. http://ndltd.ncl.edu.tw/handle/51236705278020045127.
Full textChang-Shung, Liang, and 梁家順. "Optimization of heteroepitaxial growth of GaAsP on GaP substrate." Thesis, 1998. http://ndltd.ncl.edu.tw/handle/34063416972911721965.
Full text中原大學
電子工程研究所
86
III-V ternary and quaternary semiconductor alloy crystals are of vital importance in the fabrication of optoeletronic and high-speed devices since the desired bandgap energy and lattice constant can be achieved by controlling their composition. However, the misfit between the alloy layer and the available binary substrates still remains as the main problem. In the design and fabrication of new alloy devices, the availability of alloy substrates with controlled lattice parameters can remove the limitation of In this study, we will optimize the growth condition of GaAsP epilayer on GaP substrate by using a novel LPE technique, called "composition conversion" for preparing a ternary substrate. This composition converting technique is composed of two steps. First, a GaAs layer is grown on a GaP substrate. Second, the GaAs layer converts its composition to GaAsP alloy when contacts with the saturated Ga-As-P solution. A mechanism of the converting behavior can be understood that P atoms rapid diffuse into the uns Both the growth time of GaAs layer, t1, and the contact time of Ga-As-P solution with the grown GaAs, t2, are varied to achieve the optimum growth conditions of this technique. The variations of both growth times, t1 and t2, for GaAs and GaAsP layers, respectively, are given as follows: 1. growth time of the GaAs layer t1 : 12, 18, 30 (minutes)2. growth time of the GaAsP layer t2 : 12, 30, 60, 78, 90 (minutes) According to the measurement results of x-ray and PL, the optimum conditions for growing GaAs and finally obtaining the GaAsP layers with stable solid composition are determined as:1. The growth time of GaAs, t1≧18 minutes. 2. the conversion time of GaAsP, 60≦t2≦90 minutes.
CHEN, MIN-YI, and 陳銘逸. "Heteroepitaxial growth of GaInP lattice matched to GaAs by MOCVD." Thesis, 1993. http://ndltd.ncl.edu.tw/handle/97337731307784286202.
Full textChe-YuLin and 林哲聿. "Investigation of GaAs-based material heteroepitaxial growth and device applications." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/81637226898812179104.
Full text國立成功大學
奈米科技暨微系統工程研究所
100
In this thesis, the main purpose of our research is focused on tuning the epitaxial conditions of nucleation layer to improve the problems of Ge-based solar cells such as APDs and Ge outdiffusion. Therefore, we could tune the epitaxial conditions, and we can apply these parameters to form the high efficiency tandem solar cells in the future. Plenty of material characterization techniques such as atomic force microscopy (AFM), high resolution X-ray diffraction (HR-XRD), and photoluminescence (PL) system have been used to study the quality and characteristics. First, we tried to grow the GaAs nucleation layer on Ge/Si and Ge substrate by MOCVD. Then, we adjusted the V/III ratio, growth temperature, buffer thickness, and misorientation angle to improve the buffer quality. We could observe that when the growth in the low V/III ratio ambience, the lateral growth rate was higher than the vertical growth rate, which would form the flat plane. From the experiments results, if the V/III ratio was too low, it would have the carbon pollution problem and the best V/III ratio was 5. We also observe that when the epitaxial process was in low temperature ambience, the Kinetic energy would be decreased and further cause the atoms diffusion length decreased. But if the growth temperature was too low, the atoms would have not enough energy, so that they could not migrate to find their appropriate sites. And the surface morphology would be worse. We concluded that the appropriate growth temperature was 370℃. From the experiments of varying the buffer thickness, we know the best buffer thickness was 23.5nm through the analysis systems. Finally, we also compared the misorientation angle. From the analysis, we could observe that the 6 degree substrate could let the growth mode become step-flow mode, and the number of APDs would be eliminated. From the results, we could know that the 6 degree substrate was better than the other. We have also studied another nucleation layer material, InGaP. According to the literature, when the layer composition of InGaP got more Ga-rich, the number of arrowhead defects would be increased. So we tuned the layer composition of InGaP to In0.503Ga0.497P. We also have done a series of researches about the InGaP. Through the experiments results, we could observe that when we decreased the growth temperature, the roughness would be increased. It was due to the reduction of PH3 decomposition. Therefore, we adopted the high growth temperature to grow the samples. The material would have the disorder tendency in the high growth temperature ambience. It would also let the solar cell response enhanced by increased minority carrier properties. From the above analysis, we concluded the growth temperature 675℃ was the appropriate growth temperature. Then, we tried to tune the V/III ratio of InGaP material. From the above experiments, we could observe that all the degree of order of InGaP was relatively low. The suitable V/III ratio was 500.4 to achieve the better roughness and crystal quality. In the experiments of varying the buffer thickness, we could observe that the sample with 25 nm buffer layer was the best for both the enhancements of epitaxial and optical characteristics. Finally, because of the phosphorus diffusion length was shorter than arsenic, the InGaP buffer could prevent the Ge diffusion problem. When we used the InGaP buffer, it could eliminate the APDs problem. Therefore, we concluded that the growth of the InGaP nucleation layer on Ge substrate, the optical and crystalline quality were all be enhanced. And we also hope it could enhance the cell performance. In the following, we used the best parameters of GaAs nucleation layer to grow a solar cell, but we could observe that the surface was not mirror-like. The reason of that might be the worse cell performance. Hence, we incorporate 0.5% indium into GaAs base layer and emitter layer to solve the lattice mismatch problem, so that the short circuit current would be increased from 7.19 mA/cm2 to 8.116 mA/cm2, and the efficiency would also be enhanced from 2.02% to 3.02%. We also tried to change the preflow style to improve the diffusion problem, and enhance the cell performance. When we utilized the preflow Ga ML and As ML style, the Ga vacancies of GaAs film would be decreased, and the diffusion length would also be decreased. Because the adoption of this preflow style, the fill-factor would be increased from 53.196% to 68.718%, and the efficiency would also be increased from 3.02% to 3.5%. In the future, we will use the InGaP material instead of GaAs material as the nucleation layer material. Then, the growth of a InGaP buffer solar cell will be continued. And we can further use the 6∘Si substrate to grow a solar cell in order to achieve the purpose of reduce the cost of solar cells. And then we will optimize the InGaP subcell. Finally, we will grow a tandem solar cell.
ZHANG, ZHI-HAO, and 張志浩. "Heteroepitaxial growth of ZnSe by low pressure metalorganic chemical vapor deposition." Thesis, 1988. http://ndltd.ncl.edu.tw/handle/20734399576986599981.
Full textZHANG, ZHONG-QING, and 張仲青. "Heteroepitaxial growth of ZnS on Si by metalorganic chemical vapor deposition." Thesis, 1990. http://ndltd.ncl.edu.tw/handle/96565148404348816092.
Full textChiang, Hsin-Yu, and 江欣諭. "Heteroepitaxial Growth and Annealing of Reactively Sputtered Titanium Nitride on Si (100)." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/z8fv89.
Full text國立交通大學
工學院半導體材料與製程設備學程
107
This thesis mainly studies the epitaxial TiN growth on Si (100) by reactive DC magnetron sputtering and annealing of grown TiN films by using microwave plasma. The TiN film quality and its stoichiometry were also characterized by x-ray diffraction (XRD) and x-ray photoelectron spectroscopy (XPS). The first part of the study focuses on the TiN epitaxial film qualities which are varied with the reactive sputtering processing conditions, particularly on the effects of the growth temperature and nitrogen ratio. In the second part, the results of TiN film qualities significantly improved by high temperature annealing using microwave plasma are presented, and a comparison with sputtered films is aslo made. The morphologies, crystallinities, and chemical bonding of the as-sputtered films and annealed films were characterized by atomic force microscopy (AFM), XRD, XPS, and transmission electron microscopy (TEM). The results showed that the TiN film grown Si at substrate temperature of 860°C and with 7% N2 in Ar is of high quality with the lowest full width at half maximum (FWHM) of 0.75° for (002) x-ray rocking cuve (XRC). After annealing , the XRC FWHM decreased further to 0.45°. The X-ray phi-scan results also show that TiN is in epitay with and Si (100) in the epitaxial relationship of TiN (100) // Si (100) and TiN [011] // Si [011]. XPS depth profiles show the stoichiometric ratio of Ti and N is close to 1:1 and the O concnetration is less than 5%. The surface roughness of the TiN film measured by AFM was be 1.9 nm, and the resistivity is 17 μΩ-cm. Cross-setional TEM in atomic resolution shows the TiN is in epitaxy with Si across the interface.
Chang, Shou-Zen, and 張守仁. "Heteroepitaxial growth of InGaAs epilayers and its appilication to infrared light-emitting diodes." Thesis, 1994. http://ndltd.ncl.edu.tw/handle/32397544634151515703.
Full textLiu, Chie-Sheng, and 劉智生. "Heteroepitaxial Growth of SiC and Ge on Si Wafers by Chemical Vapor Deposition." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/93616201296512982889.
Full text國立臺灣科技大學
化學工程系
97
The subject of this research is focused on: (1) effect of surface graphitization of the SiC buffer layer on the growth mode and crystallinity 3C-SiC(111) films formed through chemical vapor deposition(CVD); (2) surface carbonization of Si(100) by C2H2 and its effects on the subsequent SiC(100) epitaxial film growth; (3) mechanism of growth of the Ge wetting Layer upon exposure of Si(100)-2 × 1 to GeH4; (4) effect of crystallization of a-Si:H passivation layers on surface recombination velocity for n-type Si solar cells. In the first part, we have grown 3C-SiC(111) films epitaxially on Si(111) through low pressure CVD using SiH4, C2H2, and H2 as reactant gases. We used X-ray photoelectron spectroscopy (XPS), Raman spectroscopy, X-ray diffraction, scanning electron microscopy, and transmission electron microscopy to investigate the effects of the surface graphitization of the carbonized Si(111) on the mode and crystallinity of the subsequent SiC film growth. A disordered crystalline graphite layer was formed after annealing the as-carbonized Si(111) substrate under a H2 ambient at 1343 K for 5 min. The 3C-SiC(111) film grew on the graphitized buffer layer via a three-dimensional growth; this growth was two-dimensional on the surface that had not been subjected to annealing. This behavior correlated with the different in surface energies of the two types of buffer layer. In the second part, surface carbonization of Si(100) using C2H2 as the carbon source was performed in a cold-wall-type CVD reactor at a low pressure of 5 Torr. The carbonization process as a function of C2H2 partial pressure and treatment time was investigated using XPS. It was found that in comparison with a complete transformation to SiC surface on Si(111) by 8 min treatment of 5×10-2 Torr C2H2 at 1343 K, the carbonization on Si(100) under the same condition forms excessive carbon, plausibly due to the larger C2H2 adsorption heat on Si(100) surface. Reducing C2H2 partial pressure to 1.8×10-3 Torr and treatment time to 2 min was enough for Si(100) to form a saturated carbide layer of about 2.0 nm in thickness. Subsequent 3C–SiC(100) epitaxial film growth was found successful especially on a 10 s carbonization- treated surface that has the least amount of excessive carbon. In the third part, we report the initial reaction kinetics for Ge deposition after exposing a Si(100)-2 × 1 surface to GeH4 in a ultra high vacuum chemical vapor deposition system. The growth rate of Ge, especially at the wetting layer stage, was investigated using in situ XPS to measure the signals for Ge atoms at the onset of deposition. A kinetic study concerning the growth of the wetting layer revealed an activation energy of 30.7 kcal/mol for a ca. 0.2-monolayer Ge coverage. This governing energy barrier correlates well with the results of density functional theory calculations, which suggested that opening of the Si dimer following a H atom migration would be the rate-controlling step for the initial growth of the Ge wetting layer on Si(100)-2 × 1 from GeH4. In addition, two- and three-dimer cluster models provided us with extra dimer units with which to model the H atom migration from GeH3(a) to an open site; this process assists the system to overcome the energy barrier for the opening of the Si dimer bond. The Ge atom then became incorporated into the lattice after ring closure. In the final part, surface passivations for the amorphous/c-Si heterojunction structure of solar cells were performed by plasma enhanced chemical vapor deposition reactor. The correlation of effective carrier lifetime and surface crystallization of the various passivation layers were investigated by microwave photoconductivity decay (µ-PCD) and RHEED. It is found that a-Si:H layer of 5 nm in thickness grown on c-Si showed a crystalline structure even at a low [H2]/[SiH4] dilution ration of 10 and a low substrate temperature of 373 K. Adding oxide of 10 at. % to form a a-SiOx:H was effective in preventing the passivation layer from crystallization. µ-PCD measurements showed that Si wafers with wide bandgap a-SiCxOyNz:H exhibited a high effective carrier lifetime up to 2255 µs. The surface recombination velocity of a-SiCxOyNz:H passivated wafer was calculated as low as 5.5 cm/s, indicating a good surface passivation effect.
Hu, Tzung-Shin, and 胡宗忻. "A Study on Heteroepitaxial Growth of GaAs Solar Cells on Si Substrates by MOCVD." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/51006951673650842460.
Full text大葉大學
電機工程學系
98
This thesis is mainly present a study on heteroepitaxial growth of GaAs solar cells on Si substrates by MOCVD. Si has attracted attention as an alternative substrate because Si substrate is cheap and light-weight compared with Ge or GaAs substrates. The epitaxial growth of III-V semiconductor multilayer structures on Si is a possibility to reduce the costs for high efficiency III-V solar cell devices. Due to the very large difference in lattice constant (~ 4 %) and thermal expansion (> 100 %) a defect free epitaxy of GaAs on Si is challenging. In order to achieve the same performance for GaAs on Si as for the homoepitaxial growth, two step growth process, thermal cyclic annealing (TCA) and intermediate layer (IL) were investigated to reduce the dislocation density. GaAs solar cells were grown by the optimized conditions and were processed into 5.6 mm × 5.6 mm cells by standard processing techniques and measure under solar simulator. A conversion efficiency of 4.02% was obtained from GaAs solar cells on Si substrate without anti-reflection coating under AM1.5 spectrum. A GaAs solar cell with the same structure was grown on GaAs substrate for comparison and its conversion efficiency was 17.92%. The low efficiency for GaAs cells grown on Si substrates might be attributed to large ohmic contact resistance and high dislocation densities.
Piquette, Eric C. "Molecular beam heteroepitaxial growth and characterization of wide band gap semiconductor films and devices." Thesis, 1999. https://thesis.library.caltech.edu/4687/1/Piquette_ec_1999.pdf.
Full textJIANG, MING-CHIEN, and 江鳴謙. "Heteroepitaxial growth of GaN on (100) and (111)Si substrates by pulsed laser deposition." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/02985481165450241805.
Full text國立中興大學
材料科學與工程學系所
102
In this study, the fabrication of hexagonal GaN on Si(100) and Si(111) templates via pulsed laser deposition (PLD) was employed in the development of GaN-on-Si technology. During the GaN growth process, the deposition conditions were modified to investigate the epilayer characteristics. The optimal GaN quality can be achieved by using the substrate temperature of 1000 ?C, the repetition rate of 5 Hz, and the chamber pressure of 3×10-3 torr. The full-width at half-maximum values for the XRD rocking curves of GaN(002) peak were measured to be 1.07? and 0.79?when the films were grown on Si(100) and Si(111) substrates, respectively. Meanwhile, the surface roughnesses of GaN on these two substrates were 17.7 and 14.3 nm, respectively. Furthermore, the growth mechanism of GaN grown on Si substrate with various growth times was established. With increasing the growth time up to 2 hours, the growth mode of GaN film gradually transformed from island growth to layer growth, resulting from the contributions of PLD growth principle and N2 plasma nitridation. Additionally, the high-temperature (1000?C) PLD process can effectively prevent the melt-back etching between Ga and Si in the GaN growth. Except for the Si(100) and Si(111) substrates, the GaN films were also deposited on the sapphire and GaN template fabricated by metalorganic chemical vapor deposition to compare the qualities of these GaN films. The results indicate that the crystal quality on Si substrate is worse than that on the other two substrates. In the PLD process, the GaN vapor was created as the laser pulse impacted the target, and the formation of GaN grains on substrate was generated via the reaction between the GaN vapor and N2 plasma. Due to the interdiffusion between these GaN grains at a high temperature, the GaN film can be formed. In comparison to the MOCVD technique, the residual stress in the GaN was reduced significantly by using PLD, which can efficiently prevent the crack formation. After the PLD growth for 4 hours, the 4-mm-thick GaN film can be achieved. Furthermore, based on the results, the melt-back etching phenomenon was also avoided via the PLD technique without introducing any interlayer or interruption layer. It reveals that several drawbacks in the GaN-on-Si process can be solved using the PLD technique proposed in this research.
Fu, Chia-Wei, and 傅家威. "Heteroepitaxial Growth and Annealing of DC Reactive Sputtered Titanium Zirconium Nitride on Si (100)." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/6ryt84.
Full text國立交通大學
材料科學與工程學系所
108
Titanium Zirconium Nitride (TiZrN) with cubic NaCl structure has been widely applied because it has high melting temperature、high hardness、good biocompatibility and great wear resistance. This thesis studies the epitaxial growth of titanium zirconium nitride (TiZrN) films on Si (100) by DC reactive magnetron sputtering and the effects of microwave plasma on TiZrN. TiZrN films were deposited at near 860C using Ti0.68Zr0.32 alloy target with purity of 99.9 % at various powers, work pressures, film thicknesses and target-substrate distances by DC reactive magnetron sputtering. The first part of this thesis focuses on the influence of different process parameters on the microstate and properties of single-layer TiZrN. In addition, (TiZrN/TiN) multilayer was deposited on Si (100) substrate in order to improve film quality. In the second part, single-layer TiZrN and multilayer were annealed by microwave plasma with gas mixture of N2 and H2 to improve the epitaxial layer quality. The crystallinity, lattice parameter, elemental composition, morphology of both single-layer TiZrN and multilayer (TiZrN/TiN) were characterized by x-ray diffraction (XRD)、scanning electron microscope、atomic force microscope、X-ray photoelectron spectrometry (XPS) and transmission electron microscopy. The electrical resistivitys were measured by four-point probe and Hall effect measurement systems. For single-layer TiZrN, the XRD analysis showed that the lowest full width at half maximum (FWHM) of (200) x-ray rocking cuve (XRC) is 1.18 degree. In addition, (200) XRC FWHM of (TiZrN/TiN) multilayer was 0.99 degree. The epitaxial relationship of TiZrN on the Si (100) substrate is TiN (100) // Si (100) and TiN [011] // Si [011]. XPS analysis showed that the composition ratio of N to (Ti + Zr) was close to 1:1, and composition ratio between Ti and Zr was about 17 : 8. After annealing, the single-layer TiZrN (200) XRC FWHM decreaseed from 1.99 degree to 0.85 degree, with surface roughness (Root Mean Square roughness, rms) about 2.0 nm. For the (TiZrN/TiN) multilayer, microwave plasma annealing can reduce its (200) XRC FWHM from 0.99 degree to 0.79 degree, with the surface roughness about 12.2 nm.
He, Zun-Wei, and 何尊煒. "Heteroepitaxial growth of β-SiC Films on Si subsrate by SiH4/C2H2 chemical vapor deposition." Thesis, 1998. http://ndltd.ncl.edu.tw/handle/90273739906809227444.
Full textLi, Zhen-Yu, and 李鎮宇. "The study on heteroepitaxial growth of III-V compound semiconductors on Si substrate by AP-MOCVD." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/42217988514913902470.
Full text中原大學
電子工程研究所
95
In this thesis, the heteroepitaxial growth of III-V compound semiconductors on Si substrate by atmospheric-pressure metal-organic chemical vapor deposition (AP-MOCVD) is reported. The investigations are focused on the growth of three typical monocrystalline materials including gallium arsenide (GaAs), gallium nitride (GaN) and indium nitride (InN). Besides, the fabrication of two polycrystalline films of GaN and titanium nitride (TiN) will also be described. First for GaAs/Si, high-quality GaAs epilayers with the etch-pit density (EPD) lower than 106 cm-2 have been grown on Si (100) substrate. The Atomic Force Microscopy (AFM) images exhibited that the root-mean-square (RMS) value of the surface morphology was only 1.331 nm. The full width at half maximum (FWHM) of the double crystal X-ray rocking curve in the (400) reflection was about 102 arcsec. A key technology of the use of a-GaAs/a-Si double buffers accompanied by in-situ thermal cyclic annealing treatment was developed to achieve this result. Besides, a well-controlled molten KOH etching technique was established to evaluate the EPD of GaAs epilayer with good reproducibility. Also, the effect of a-GaAs/a-Si double buffers was examined in detail by transmission electron microscopy (TEM). Next, for GaN/Si high quality single crystalline GaN layers were grown on Si (111) substrates by using a silicon nitride (SiNx) buffer achieved through the nitridation of substrate. A strong photoluminescence (PL) emission at 365 nm (3.4 eV) with the FWHM of 61.1 meV was achieved at room temperature when the substrate was nitrided at 950°C for 10 min. Particularly, it was found that a yellow luminescent band disappeared when nitridation was performed at temperatures higher than 950°C. The masking effect of porous SiNx buffer was recognized by TEM observation, which is considered to block the threading dislocations and resulted in goo-quality GaN epilayers. For InN/Si, InN epilayers with the band-gap energy between 0.7 – 0.8 eV have been successfully grown on Si (111) substrates with low-temperature (450�aC) grown InN and high-temperature (1050ºC) grown AlN (InN/AlN) double-buffer layers. X-ray diffraction (XRD) characterizations indicated that highly (0001)-oriented hexagonal InN was grown on Si (111) substrate. Hall measurements showed the mobility and carrier concentration were 87.2 cm2/V-s and (7-8) × 1019 cm-3, respectively. PL analyses performed at room temperature showed a strong emission at 0.72 eV with a full-width at half-maximum of 121 meV. Excitation intensity dependent measurements demonstrated the PL mechanism to be the band-to-band transition. Time-resolved PL could be fitted by a single exponential exhibiting an ordered film and a recombination lifetime of around 0.85 ns. In particular, TEM characterizations indicated that the use of AlN first buffer is effective to obtain an InN epilayer with hexagonal structure. As an option to use GaN, poly-crystalline GaN films were also grown and their optical properties and ohmic contact characteristics were examined. Scanning electron microscopy analyses display that the shape and size of GaN grains are quite dependent on the growth temperature. XRD characterizations show that the polycrystalline GaN exhibits wurtzite structure with a preferential (0001) orientation. PL spectra show a strong yellow luminescence from the poly-GaN films. Furthermore, a low-resistivity ohmic contact to poly-GaN was achieved using the multilayer metal combination of Ti (50Å)/Au (100Å)/Ni (100Å)/Au (3000Å). An improvement in �歊 of over one order of magnitude was achieved over the as-deposited condition with good reproducibility by RTA treatment for a total duration of 120 s. In particular, by optimizing the annealing temperature to 400°C a relatively low �歊 of 1.6×10-5 Ω-cm2 was yielded for the contact of Ti/Au/Ni/Au to poly-GaN with a carrier concentration of (5-6)×1017 cm-3. Finally, for TiN/Si, the TiN films were obtained by exploiting TiCl4+NH3 gas chemistry with flow ratios from [NH3]/[TiCl4]=0.2 to 1.4, and deposition temperatures (Td) from 600 to 900°C. When Td = 800°C gold-colored films with electrical resistivities of under 100 μΩ cm were formed at almost all of the investigated flow ratios. In particular, a lowest resistivity of about 23.7 μΩ cm, which is quite close to that of bulk TiN, was achieved using an flow ratio of 0.3. AFM characterizations indicated that the root mean square surface roughness of that film was only about 5.1 nm. Under the same [NH3]/[TiCl4] flow ratio as above, XRD analyses revealed the presence of a cubic TiN phase with a preferred orientation of (200) for Td < 800°C, while additional (111) and (220) orientations emerged when the film was deposited at 900�aC. In conclusion, a low resistivity (<100 μΩ cm) TiN film can be formed on Si substrate with very low flow ratios [NH3]/[TiCl4]=0.3 – 1.4.
HSIEH, CHIH-CHIEH, and 謝志傑. "Study of heteroepitaxial growth of In2Se3 on Si substrates by atmospheric-pressure halide chemical vapor deposition." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/33257802894625371301.
Full text中原大學
電子工程研究所
95
Study of heteroepitaxial growth of In2Se3 on Si substrates by atmospheric-pressure halide chemical vapor deposition Abstract Up to now solar cells can be classified into many type according to the materials used, such as silicon, compound semiconductors and organic compounds…etc. (see FigureⅠ). Among these types of solar cells, silicon solar cells can be classed with Crystalline and Amorphous thin film; Crystalline is included single crystalline, poly crystalline and thin film poly. Furthermore, compound also can be classed with single and poly crystalline. Single crystalline compound for example like GaAS, InP…etc. poly crystalline for example like CdS, CIGS (CuInGaSe2) …etc. In the word, there would be developed area whatever any materials of solar cells, and no one could include all. This paper investigated for one of buffer layers In2Se3 which is included of CIGS (CuInGaSe2) thin film Solar cells. All simples were deposited on Si substrates by homemade vertical atmospheric pressure metal-organic Chemical Vapor Deposition (MOCVD) system. The In2Se3 thin films were almost γ-phase. The paper research four parts of experiments: First is In2Se3 films grown with different temperatures. Second is In2Se3 films grown with different Ⅲ-Ⅵ ratio. Third is In2Se3 films grown with different Si substrates. And fourth is In2Se3 films grown with AlN buffer layer. The finally purpose is much understand for In2Se3 to be useful and decreased leakage of electric current of CIGS solar cell.
LI, NIAN-YI, and 李念宜. "GaSb/GaAs heteroepitaxial growth by metal organic chemical vapor deposition and the study of schottky diodes." Thesis, 1990. http://ndltd.ncl.edu.tw/handle/47650524725474541941.
Full text國立成功大學
電機工程研究所
78
GaSb-bascd化合物由於具有長波長光響應的特懷, 波長在1.24μm(AtGaSb) 至4.3μm (InCaAsSb)及8 至12μm(InAsSb/InSb量子井應力結構) 範圍內具有極低的傳輸損失 , 其電子與電洞移動率亦高於Inp 系列, 故極適合應用於光電元件的研究。本文係採 用有機金屬汽相沈積法成長銻化鎵(GaSb)同質, 祑質磊晶怪於銻化鎵及砷化鎵基板上 并建立最佳成長條件以做為InAs/GaSb高速元件、InGaSb/GaSb、GaAsSb/GaSb等超 晶格應力結構發展之基礎。 本實驗室自行建立的新MOCVD系統專以研究銻為主的Ⅲ-V 半導體材料, 并對量子井及 超晶格元件之制造上亦有初步的考量與設計, 以期成長高品質, 低背影濃度之磊晶層 。 首先對銻化鎵、砷化鎵基板之清潔步驟及銻化鎵磊晶膜的制程做了詳細的說明, 而后 探討在改變成長參數狀況下, 銻化鎵表面形成及光與電特性之變化。在所有成長條件 下, 銻化鎵晶膜為正型特性, 其在長速率隨〔TEG 〕莫耳分率線性的增加而與〔TMSb 〕菲耳分率無關, 對成長溫度更是密切地相關。〔TMSb〕/〔TEG〕比例在6∼8之間, 可得到鏡似無缺隱的表面, 但過大的莫耳分率將會嚴重地影響到晶膜之品質。 在金屬/銻化鎵蕭基二極體方面, 吾人由不同金屬測量其電流—電壓特性發現不同方 向的銻化鎵基板, 基位障(barrier height)被不同的表面能態(surface states)所箝 住。由於(111)銻化鎵比(100)銻化鎵基板擁有較多的dangling bonds, 而此懸浮的鍵 結容易造成載子的陷阱, 進而箝住金屬與銻化鎵間的能障, 使得吾人難以得到高位障 的蕭基二極體。在熱穩定特性探討中, 吾人發現把/銻化鎵接觸在高溫時(450℃) 易 形成Ga Pd 復合物而將蕭基二極體能障降低形成歐姆接觸, 故利用有限反應(limit r eaction)的觀念研制雙層金/鈀/銻化鎵蕭基二極體, 發現在450 ℃30分鐘退火下, 依然擁有良好的蕭基特性。