Journal articles on the topic 'Heatsinks Testing'
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Masrianto, Zulqifli, Lukas Kano Mangalla, and Yuspian Gunawan. "Pengujian Eksperimen Pembuang Panas dan Aliran Udara Pada Berbagai Bentuk Heatsink." Enthalpy : Jurnal Ilmiah Mahasiswa Teknik Mesin 6, no. 4 (December 22, 2021): 190. http://dx.doi.org/10.55679/enthalpy.v6i4.22575.
Full textPiumatti, Davide, Stefano Borlo, Matteo Quitadamo, Matteo Sonza Reorda, Eric Giacomo Armando, and Franco Fiori. "Test Solution for Heatsinks in Power Electronics Applications." Electronics 9, no. 6 (June 19, 2020): 1020. http://dx.doi.org/10.3390/electronics9061020.
Full textMerrikh, Ali A., Mike Eyman, David B. Walshak, Tom Dolbear, and Sridhar Sundaram. "Heatsink Mass Optimization Methodology for Desktop Microprocessor Cooling." Journal of Microelectronics and Electronic Packaging 5, no. 2 (April 1, 2008): 87–93. http://dx.doi.org/10.4071/1551-4897-5.2.87.
Full textPerwira, Wisnu Yoga, Nyenyep Sri Wardani, and Husin Bugis. "EFFECT OF HEATSINK FIN AND THERMAL INSULATORS ON OUTPUT OF THERMOELECTRIC POWER OF HEAT OF MOTORCYCLE EXHAUST GAS." Journal of Mechanical Engineering and Vocational Education (JoMEVE) 1, no. 2 (April 2, 2019): 53. http://dx.doi.org/10.20961/jomeve.v1i2.25064.
Full textYang, Tung Sheng, and Yong Nan Chen. "Study on Cylindrical Heatsink Forging Process Considering Friction Condition." Key Engineering Materials 823 (September 2019): 141–44. http://dx.doi.org/10.4028/www.scientific.net/kem.823.141.
Full textPhan Hoang Cuong. "DESIGN OPTIMIZATION OF A POWER MODULE BOX IN 3D RADAR SYSTEM." Journal of Military Science and Technology, no. 73 (June 15, 2021): 167. http://dx.doi.org/10.54939/1859-1043.j.mst.73.2021.167.
Full textPutra, Aby Elsa, Rifky Rifky, and Agus Fikri. "Pemanfaatan Panas Buang Atap Seng dengan Menggunakan Generator Termoelektrik sebagai Sumber Energi Listrik Terbarukan." Prosiding Seminar Nasional Teknoka 3 (January 11, 2019): 38. http://dx.doi.org/10.22236/teknoka.v3i0.2911.
Full textWang, Di. "A Analysis on the Importance of Lithium Battery Cooling for Pure Electric Vehicles." Applied Mechanics and Materials 737 (March 2015): 83–87. http://dx.doi.org/10.4028/www.scientific.net/amm.737.83.
Full textWang, Frank Fan, William McKeague, and Christina Polwarth. "Comparisons of Soldering Alloys in Large Ceramic Substrate to Metal Heatsink Attachment Application." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000596–601. http://dx.doi.org/10.4071/2380-4505-2018.1.000596.
Full textRamadhan, Faishal. "Rancang Bangun Sistem Pendingin Sekunder Untuk Kabin Mobil Dengan Memanfaatkan Thermoelektrik (TEC)." Jurnal Teknik Mesin ITI 3, no. 1 (February 26, 2019): 18. http://dx.doi.org/10.31543/jtm.v3i1.244.
Full textSantoso, Budi, and Zainal Abidin. "KARAKTERISTIK AMPLIFIER CLASS D MENGGUNAKAN FIELD EFFECT TRANSISTOR (FET) TYPE IRF9530 DAN IRF630." Jurnal Teknika 12, no. 2 (September 20, 2020): 71. http://dx.doi.org/10.30736/jt.v13i2.470.
Full textSuryadharma, Bertung, Andrew Setiawan Rusdianto, and Zahra Zuhriasa. "Design and Construction of Broccoli (Brassica Oleracea, L.) Storage Box Using Thermoelectric Technology." Journal La Lifesci 2, no. 4 (September 28, 2021): 25–31. http://dx.doi.org/10.37899/journallalifesci.v2i4.413.
Full textSamake, Adama, Piotr Kocanda, and Andrzej Kos. "Effective approach of microprocessor throughput enhancement." Microelectronics International 36, no. 1 (January 7, 2019): 14–21. http://dx.doi.org/10.1108/mi-04-2018-0025.
Full textSubramani, Shanmugan, and Mutharasu Devarajan. "Influence of extended surface area of heatsink on heat transfer: design and analysis." Microelectronics International, February 16, 2023. http://dx.doi.org/10.1108/mi-09-2022-0171.
Full textAzizi, Arad, Fatemeh Hejripour, Jacob A. Goodman, Piyush A. Kulkarni, Xiaobo Chen, Guangwen Zhou, and Scott N. Schiffres. "Process-dependent anisotropic thermal conductivity of laser powder bed fusion AlSi10Mg: impact of microstructure and aluminum-silicon interfaces." Rapid Prototyping Journal, February 3, 2023. http://dx.doi.org/10.1108/rpj-09-2022-0290.
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