Relevant bibliographies by topics / Heatsinks Testing

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Academic literature on the topic 'Heatsinks Testing'

Author: Grafiati
Published: 14 March 2023

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Journal articles on the topic "Heatsinks Testing"

1

Masrianto, Zulqifli, Lukas Kano Mangalla, and Yuspian Gunawan. "Pengujian Eksperimen Pembuang Panas dan Aliran Udara Pada Berbagai Bentuk Heatsink." Enthalpy : Jurnal Ilmiah Mahasiswa Teknik Mesin 6, no. 4 (December 22, 2021): 190. http://dx.doi.org/10.55679/enthalpy.v6i4.22575.

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Heatsinks are widely used in heat exchangers to increase the rate of heat transfer between a surface and the working fluid. This study aims to determine the effect of surface shape and area, and air flow velocity on the rate of heat transfer of the three different heatsinks. The research was conducted experimentally by testing three forms of heatsinks with variations in air flow velocity in a small windtunell. The windtunnel is equipped with test equipment such as a handheld wind meter, K-Type thermocouple and a stopwatch. The heating source for the three model heatsinks is an electric heater that can reach a heating temperature of 100oC. Air flow velocity is varied from 0.5 m/s, 1.0 m/s and 1.5 m/s. The results of this experiment show that the heat dissipation rate is directly correlated with the air flow velocity and the heat transfer surface area. At flow velocities of 0.5 m/s, 1.0 m/s and 1.5 m/s, the air temperature behind the heat sink (T2) is 62.8oC, 56.7 oC, and 52.4 oC, respectively. From the heat calculation results show that the shape of the heatsink -model 3- dissipates heat higher than others where the surface area is much larger. For a flow velocity of 0.5 m/s, the rate of heat dissipation generated in model 1, Model 2 and model 3 are 26875 J/s, 34449.01 J/s and 37686.19 J/s, respectively. Keywords: Heat dissipation, surface model, air flow and heatsink.
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2

Piumatti, Davide, Stefano Borlo, Matteo Quitadamo, Matteo Sonza Reorda, Eric Giacomo Armando, and Franco Fiori. "Test Solution for Heatsinks in Power Electronics Applications." Electronics 9, no. 6 (June 19, 2020): 1020. http://dx.doi.org/10.3390/electronics9061020.

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Power electronics technology is widely used in several areas, such as in the railways, automotive, electric vehicles, and renewable energy sectors. Some of these applications are safety critical, e.g., in the automotive domain. The heat produced by power devices must be efficiently dissipated to allow them to work within their operational thermal limits. Moreover, numerous ageing effects are due to thermal stress, which causes mechanical issues. Therefore, the reliability of a circuit depends on its dissipation system, even if it consists of a simple passive heatsink mounted on the power device. During the Printed Circuit Board (PCB) production, an incorrect assembly of the heatsink can cause a worse heat dissipation with a significant increase of the junction temperatures (Tj). In this paper, three possible test strategies are compared for testing the correct assembling of heatsinks. The considered strategies are used at the PCB end-manufacturing. The effectiveness of the different test methods considered is assessed on a case study corresponding to a Power Supply Unit (PSU).
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Merrikh, Ali A., Mike Eyman, David B. Walshak, Tom Dolbear, and Sridhar Sundaram. "Heatsink Mass Optimization Methodology for Desktop Microprocessor Cooling." Journal of Microelectronics and Electronic Packaging 5, no. 2 (April 1, 2008): 87–93. http://dx.doi.org/10.4071/1551-4897-5.2.87.

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We present a novel modeling methodology for optimizing the mass of aluminum-extruded heatsinks for cooling desk-top microprocessors. The two-stage study aims at reducing mass of an aluminum-extrusion heatsink by taking advantage of the existing thermal resistance margin. In Stage 1, we investigated several possible combinations of base shapes to minimize the mass of the base region. Base shape is optimized by dividing the base volume into several blocks of equal width, with the objective of progressively minimizing the mass of the peripheral region while shaping the middle region to minimize spreading resistance. Three base shape profiles—namely, wedge, semielliptical, and flat top—were selected for further study. In Stage 2, a thorough base, fin thickness, and fin count study was carried out by mathematical optimization. The result of this optimization exercise was a 30% reduction in the heatsink mass. The degradation in thermal resistance of the mass-reduced design is within the acceptable margin and meets microprocessor product specifications. Results are experimentally verified by testing four different competing samples having comparable optimized masses.
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Perwira, Wisnu Yoga, Nyenyep Sri Wardani, and Husin Bugis. "EFFECT OF HEATSINK FIN AND THERMAL INSULATORS ON OUTPUT OF THERMOELECTRIC POWER OF HEAT OF MOTORCYCLE EXHAUST GAS." Journal of Mechanical Engineering and Vocational Education (JoMEVE) 1, no. 2 (April 2, 2019): 53. http://dx.doi.org/10.20961/jomeve.v1i2.25064.

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Thermoelectric can be utilized to convert exhaust heat into electricity. This study aims to determine the effect of heatsink height and thermal insulation on electric power generated from thermal powered thermoelectric plants. This research is using an experimental method. The technically of data analysis is descriptive comparative. In this research were used 10 mm, 20 mm, and 30 mm heatsink fin. Thermal insulator materials are glass wool and aluminum foil. Electrical power obtained from multiplication of electrical voltage and electric current. The data analysis was indicated the increasing electrical power with increasing heatsink fin height. The higher power is accomplished by using heatsink fin 30mm at 0.56-watt power output, and the smaller power is obtained by using heatsink fin 10mm at 0.32-watt power output. The results of thermal insulation testing indicate that there is an increase in electrical power when the use of thermal insulator. Data analysis were reported the most significant strength is obtained on the use of 30 mm heatsink with an isolator of 0.76 watts, and the smallest power is obtained on the use of high heatsink 10 mm without thermal insulator is 0.32 watts. The results of this study indicate that the heatsink fins height and thermal insulators affect the power generated by thermoelectric power plants.
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Yang, Tung Sheng, and Yong Nan Chen. "Study on Cylindrical Heatsink Forging Process Considering Friction Condition." Key Engineering Materials 823 (September 2019): 141–44. http://dx.doi.org/10.4028/www.scientific.net/kem.823.141.

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The feasibility of forging of AL-1050 alloy of cylindrical heatsink under warm conditions is demonstrated in the present work. The stress-strain curves and friction factor play an important role in the cylindrical heatsink forging. The purpose of forging lubrication is to reduce friction between blank and die, and to decrease resistance of metal flow to die. The stress-strain curves at different temperatures are obtained by compressing tests. The friction factor between 1050 aluminum alloy and die material are determined at different temperatures by ring compression tests with graphite lubricants. The compressing and ring compressing tests are carried out by using the computerized screw universal testing machine. The finite element method is used to investigate the forming characters of the forging process. To verify the prediction of FEM simulation in the cylindrical heatsink forging process, the experimental parameters such as stress-strain curves and fiction factor, are as the input data during analysis. Maximum forging load and effective stress distribution are determined of the heatsink forging, using the finite element analysis. Finally, the cylindrical heatsink parts are formed by the forging machine under the conditions using finite element analysis.
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Phan Hoang Cuong. "DESIGN OPTIMIZATION OF A POWER MODULE BOX IN 3D RADAR SYSTEM." Journal of Military Science and Technology, no. 73 (June 15, 2021): 167. http://dx.doi.org/10.54939/1859-1043.j.mst.73.2021.167.

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This paper researches a design process of a heatsink in the power module box of the 3D Radar system. Studying the theory of heat transfer across parallel plate-fins of the heatsink to optimize the geometric parameters. The power module boxes are designed based on those optimum geometric parameters. In the next step, the design model is used to simulate temperature under working conditions by using Solidworks simulation software. The design model is then trial manufactured for testing before moving to the mass production.
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Putra, Aby Elsa, Rifky Rifky, and Agus Fikri. "Pemanfaatan Panas Buang Atap Seng dengan Menggunakan Generator Termoelektrik sebagai Sumber Energi Listrik Terbarukan." Prosiding Seminar Nasional Teknoka 3 (January 11, 2019): 38. http://dx.doi.org/10.22236/teknoka.v3i0.2911.

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This research was conducted to utilize waste heat energy zinc roof for a revamped into a source of electrical energy. Waste heat utilization of zinc using thermoelectric generator type of TEC-12706 to convert thermal energy into electrical energy and the fan with speed 5 m/s to hold a low temperature in a cold area of heatsink. This research was conducted using a test simulation tool made by zinc, aluminum and acrilic. Waste heat utilization of testing zinc roof done starting at 09.00 WIB until 15.00 WIB for 3 days, with some measured parameters required as the intensity of solar radiation (Es), airspeed (v), current (I), power (W) and temperature (T) some of which are found in the system tools of simulation testing. From the results of testing performed, the value of the highest efficiency i.e. of 0,00888% and the largest electrical power generated in the amount of 0,0042 W. A high intensity of the solar radiation it will affect the temperature of the environment which will also have an effect on the temperature in the cold area of heatsink, then the value of the temperature difference will also be affected. Heat resistance value on the system also affects the value of the waste heat energy can be changed into electrical energy.
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Wang, Di. "A Analysis on the Importance of Lithium Battery Cooling for Pure Electric Vehicles." Applied Mechanics and Materials 737 (March 2015): 83–87. http://dx.doi.org/10.4028/www.scientific.net/amm.737.83.

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Pure lithium-ion batteries for electric vehicles in the course of the temperature rise, not only directly affect the performance and life of the battery, there is a potential safety hazard. In this paper, a pure electric vehicle with a lithium-ion battery pack with no heatsink, through testing and without thermal simulations with a model feasibility analysis.
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Wang, Frank Fan, William McKeague, and Christina Polwarth. "Comparisons of Soldering Alloys in Large Ceramic Substrate to Metal Heatsink Attachment Application." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000596–601. http://dx.doi.org/10.4071/2380-4505-2018.1.000596.

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Abstract Tin-lead alloys have historically been popular in the electronics industry for use in solder-attach applications. Despite recent restrictions related to lead content, some industries continue to use lead based alloys in solder applications. Tin-lead based alloys, in particular, have proven to have excellent solderability to tin, nickel, copper, gold, and silver metallization surfaces. They have also performed better in reliability than most of the lead free solders. As a result of this, they are still widely used in the aerospace and military electronics industry. Hybrid microelectronics built for space applications use both Tin-Lead-Silver Alloy Sn62 and Lead Free Soldering Alloy Sn96; these solders are used both for wire and component attach as well as substrate to header attach. This article discusses the differences of these two solders, using both literature and experimental study. Experimental testing involving pull tests further supports this conclusion.
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Ramadhan, Faishal. "Rancang Bangun Sistem Pendingin Sekunder Untuk Kabin Mobil Dengan Memanfaatkan Thermoelektrik (TEC)." Jurnal Teknik Mesin ITI 3, no. 1 (February 26, 2019): 18. http://dx.doi.org/10.31543/jtm.v3i1.244.

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The air conditioner (AC) system of the car will stop when the car's engine is turned off, this causes the temperature in the cabin of the car to increase. The increase in temperature is caused by the cabin being closed so that there is no air circulation and also influenced by the temperature of the environment. Designing, assembling and testing the cooling system using peltier, fan, heatsink and pump as the main component. The test was carried out for 1 hour 30 minutes, with variations in the number of peltier working 2, 4 and 6. The results obtained were 2 peltier 28oC, 4 peltier 27.5oC and 6 peltier 27.5oC. The same results at 4 and 6 peltier where at 6 peltier there is a temperature increase then a decrease occurs. This is because the voltage received by peltier is not stable. The best results are obtained by the number of peltier 4 pieces, because the voltage received is stable so the temperature drops constantly.
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Conference papers on the topic "Heatsinks Testing"

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Lu, Jun, Michelle C. Lin, and Bernie Short. "Measuring and Optimizing Thermal Interface Material Performance for VR Heatsink Designs." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48146.

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With increasingly high powers on processors, memories, and chipsets, the voltage regulators (VR) become heavily loaded and a heatsink is often required to prevent overheating the surrounding components on the board. For VR heatsink designs, thermal interface silicone gap filler pads are often used and there is an increasing need to improve VR thermal solutions by reducing thermal resistance of the TIM. A series of TIM2 thickness and performance measurements based on thermal testing was performed in order to understand gap filler characteristics, optimize TIM performance, and utilize best retention design. By utilizing a VR thermal and mechanical test board in wind tunnel testing using the same VR heatsink, thermal performance of TIM2 using gap filler pads over a range of airflow velocities can be measured and compared. The study shows how the optimum TIM performance can be achieved by using the gap filler pads with appropriate thickness for the given designed heatsink standoff heights. The benefit of choosing the right thickness pads over others can be significant and is a valuable learning that can be applied to future VR heatsink designs. Furthermore, the silicone gap filler characteristics and its relationship to board bending and result TIM thickness and thermal performance are investigated and further improved. The learnings help understand the limitations and where the area of improvement can be for future VR heatsink designs.
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Goebel, J. H., W. F. Brooks, and P. Kittel. "Ultra High Responsivity 3He-Cooled Bolometers." In Optical Fabrication and Testing. Washington, D.C.: Optica Publishing Group, 1990. http://dx.doi.org/10.1364/oft.1980.ffc1.

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We have designed and tested an ultra high responsivity liquid helium-3 refrigerated bolometer for use in low-background applications. The bolometer consists of a single germanium crystal 1/4 x 1/4 x 1/4 mm with contacts at diagonally opposite corners. A short length of gold wire (0.7 mil diameter) is bonded to the contact which is soldered to 5 mm lengths of 1/2 mil stainless steel wire. The other end of each of the stainless steel wires is bonded to a metallized diamond heatsink for the 0.3°K bath. Secondary heatsinking of incoming electrical leads is with indium buried copper transformer wire. The result is a high sensitivity yet fast (10 ms time constant) bolometer suitable for use in low background environments with PB < 250 pw.
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Piumatti, Davide, Matteo Vincenzo Quitadamo, Matteo Sonza Reorda, and Franco Fiori. "Testing Heatsink Faults in Power Transistors by means of Thermal Model." In 2020 IEEE Latin American Test Symposium (LATS). IEEE, 2020. http://dx.doi.org/10.1109/lats49555.2020.9093674.

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Mohammed, Rahima K., Ridvan A. Sahan, and Ying-Feng Pang. "System Level Thermal Design Challenges in Validation Platforms." In ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASMEDC, 2009. http://dx.doi.org/10.1115/interpack2009-89412.

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Unprecedented growth in the semiconductor industry has been enabled by decreasing transistor feature size. As silicon technology continues to scale per Moore’s law, multi-core and many-core are the new trends of the semiconductor industry. While bus speeds, features and functionalities are increasing, shrinking system volume, compact component placements on the board and system noise reduction are the trends. These silicon and system trends make the thermal design challenging. Validation platforms are used to validate processors/chipsets to ensure world-class quality and reliable Intel products. These platforms are usually open chassis to allow ease of accessibility. In this paper, we present an innovative methodology of active air cooling coupled with mechanical retention designs at the component level. Component level thermal testing data are correlated with computational fluid dynamics (CFD) simulations to provide guidance for system simulations. Well-validated and correlated active heatsink thermal model can be used in the system level thermal simulations for studying the mutual pre-heating effect among the components around the heatsink and other thermally critical components. System level thermal design incorporating the effects of memory cooling, voltage regulator module cooling, graphics card preheating, air blockages effect due to probing cables are presented. In addition, system level acoustic measurements methodology is shown. Finally, fan control methodologies to control the noise below safety guidelines while enhancing the validation customer’s experience are presented.
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Asghari, Tony A., and Joseph Janas. "Analysis of Thermal Displacements Due to CTE Mismatches Using FEA Simulation and Experimental Validation With a Differential Variable Reluctance Transducer." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33217.

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Deformation induced by thermal loading in a severe automotive environment, between an electronic ceramic substrate — bonded to an aluminum heatsink — and an adjacent nylon material, was investigated by numerical and experimental methods. The goal of this paper is to quantify the relative displacement of certain points of interest, where an aluminum wire bond exists. This displacement is caused by 1) coefficient of thermal expansion (CTE) mismatches of various parts of the assembly when temperature distribution is uniform, and 2) when temperature gradients exist in either steady-state or transient conditions due to thermal cycling (between +150°C and −40°C) as well as power cycling. ANSYS Workbench™ finite element analysis (FEA) software was used to model the system level deformation under various conditions. A unique, quick, and repeatable method of experimentally measuring displacement using a Differential Variable Reluctance Transducer (DVRT®) was utilized. The DVRT® and its signal conditioner provide an analog DC voltage output, which is proportional to linear displacement (resolution as fine as 1.5 micrometer). Error inherent to the DVRT® was adjusted by further testing using a modified sample of Invar. The numerical and experimental results showed good overall correlation.
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Estejab, Bahareh, and John Tobin. "Mineral Oil As an Alternative Cooling Method." In ASME 2021 30th Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2021. http://dx.doi.org/10.1115/isps2021-65201.

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Abstract In an effort to increase the performance ceiling and reduce the size of modern personal computers especially gaming computers and consequently data centers and supercomputers, mineral oil is proposed as the working fluid to cool the system. Mineral oil operates as an avenue for transmission rather than a liquid heatsink for heat storage, which differentiates this project from traditional mineral oil systems. Using non-conductive liquid as cooling fluid brings many advantages due to its higher convective heat transfer coefficient, which leads to more compact computers, higher speed of data transition, more efficient processors, lower noise levels, and less upkeep costs with respect to data centers. Modeling and simulations are done in NX to gauge temperature expectations; which is the most important limitation when designing and testing a computer before construction. The temperature range was found to be 34°C–50°C in the motherboard and 45°C–67°C in the graphic card. Based on the modeling results, a prototype of the proposed computer is built and tested. Ultimately, this project is trying to open up an avenue through which processor design can be reconsidered.
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