Journal articles: 'Grinding and polishing'

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Hsieh, Long-Chang, and Tzu-Hsia Chen. "THE SYSTEMATIC DESIGN OF PLANETARY-TYPE GRINDING DEVICES FOR OPTICAL FIBER FERRULES AND WAFERS." Transactions of the Canadian Society for Mechanical Engineering 40, no. 4 (November 2016): 619–30. http://dx.doi.org/10.1139/tcsme-2016-0049.

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The traditional planetary grinding device can only polish one optical fiber ferrule. The other grinding device with donut polishing trace is also proposed for polishing wafer. This grinding device has a problem, that is, “the polishing qualities of different points on the wafer are not the same”. Hence, this paper proposes a new planetary grinding device for polishing more optical fiber ferrules and more wafers. Based on the kinematics of planetary gear train, the equations of polishing trace and velocity are derived. Then, the velocity deviation percentage (Vdp) is calculated, which is an important design parameter. Area ratio (AR) is defined as polishing area divided by grinding pad area. The area ratio (AR) is another important design parameter for designing planetary grinding devices. In this paper, two design examples are used to illustrate the design process. The research results of this paper can provide an experience for the systematic design of planetary grinding devices.

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Dai, Zhe Min, and De Sheng Li. "The Analysis of Grinding and Polishing for the Tile Planetary Disc Griding Machine." Advanced Materials Research 538-541 (June 2012): 1235–39. http://dx.doi.org/10.4028/www.scientific.net/amr.538-541.1235.

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In this study, the polishing machine’s mathematical model of the movement has been established by analysis the several polishing machines’ grinding and polishing process for tile. Then according to the model to simulate the trajectory and compare the grinding grain uniformity and the size of the grinding area. The results show that the disc grinding machine in improving of the efficiency of grinding and grinding grain uniformity is better than the other motions.

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Zhao, Xin, and Xiao Ling Yang. "Effect of Hardness on Polishing Performance of Plastic Mold Steels in Prehardened Condition." Applied Mechanics and Materials 651-653 (September 2014): 16–19. http://dx.doi.org/10.4028/www.scientific.net/amm.651-653.16.

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In this paper, the comparisons of the polishing performance between prehardened P20 and S45C steels under the different hardness were carried out by using surface grinding, manual polishing and PVA grinding wheel polishing tests. The results show that the surface roughness of the two kind steels decrease with the increase of hardness and the roughness of S45C is lower than that of P20 during the surface grinding test. After polishing process, the surface roughness of the two kind steels decrease with the increase of hardness as well. However, the surface roughness of S45C is higher than that of P20 after both manual polishing and PVA grinding wheel polishing tests.

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Bao, Jiahui, Xiaoqiang Peng, Hao Hu, and Tao Lai. "A Method of Restraining the Adverse Effects of Grinding Marks on Small Aperture Aspheric Mirrors." Micromachines 13, no. 9 (August 28, 2022): 1421. http://dx.doi.org/10.3390/mi13091421.

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The grinding method is used as the preliminary processing procedure for small aperture aspheric mirrors. Regular grinding marks produced in the grinding process significantly affect the mid-spatial frequency error; however, because of their small radius of surface curvatures and high steepness, they are difficult to polish using traditional methods. Therefore, in this study, the ultra-precision grinding and polishing process of fused quartz material was investigated, and the influence of grinding marks was analyzed, which achieved the purpose of restraining the grinding marks in the grinding process. The generation mechanisms of horizontal and vertical grinding marks were analyzed by means of simulation and experiment, and the relationship between different grinding process parameters and surface quality was explored. A magnetorheological finishing (MRF) spot method was used to explore the effects of grinding marks on subsurface damage (SSD). The elastic adaptive polishing method was used to polish an aspheric lens with high steepness and small caliber. Based on the principle of an elastic adaptive polishing mathematical model, the grinding marks were suppressed, and the mid-spatial frequency error of the lens was reduced by optimizing the polishing path and composition of the polishing fluid. The final roughness reached 10 nm Ra. In this paper, the source of wear marks and their influence on the mid-spatial frequency error of small aperture aspheric mirrors are analyzed, and the grinding marks were suppressed by elastic adaptive polishing.

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Jin, Zhu Ji, Ze Wei Yuan, Ren Ke Kang, and B. X. Dong. "Study on Two Kinds of Grinding Wheels for Dynamic Friction Polishing of CVD Diamond Film." Key Engineering Materials 389-390 (September 2008): 217–22. http://dx.doi.org/10.4028/www.scientific.net/kem.389-390.217.

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This paper investigates two kinds of grinding wheels prepared by the combination of mechanical alloy and hot-press sintering (MA-HPS). Scanning electro microscopy, Optical microscope, Talysurf surface profiler, X-Ray diffraction and Raman spectroscopy were used to characterize two kinds of grinding wheels and identify the removal mechanism. It was found that FeNiCr matrix-TiC (FMT) grinding wheel yielded higher removal rate than TiAl abrasiveless carbophile (TAC) grinding wheel, which conversely owned good polishing quality; diamond was removed by transformation diamond to non-diamond carbons and then removed by mechanically or diffusion to grinding wheel during polishing process with FMT grinding wheel. While TAC grinding wheel polishing CVD diamond film mainly depended on the reaction between diamond carbon and titanium.

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Kheur, Mohit, Tabrez Lakha, Saleha Shaikh, Supriya Kheur, Batul Qamri, Lee Wan Zhen, Nadin Al-Haj Husain, and Mutlu Özcan. "A Comparative Study on Simulated Chairside Grinding and Polishing of Monolithic Zirconia." Materials 15, no. 6 (March 16, 2022): 2202. http://dx.doi.org/10.3390/ma15062202.

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This study evaluated the effects of different simulated chairside grinding and polishing protocols on the physical and mechanical properties of surface roughness, hardness, and flexural strength of monolithic zirconia. Sintered monolithic zirconia specimens (15 mm × 3 mm × 3 mm) were abraded using three different burs: diamond bur, modified diamond bur (zirconia specified), and tungsten carbide bur, along with a group of unprepared specimens that served as a control group. The study was divided into two phases, Phase 1 and Phase 2. Surface roughness, surface hardness, and flexural strength were assessed before and after the grinding procedure to determine the ‘best test group’ in Phase 1. The best abrasive agent was selected for Phase 2 of the study. The specimens in Phase 2 underwent grinding with the best abrasive agent selected. Following the grinding, the specimens were then polished using commercially available diamond polishing paste, a porcelain polishing kit, and an indigenously developed low-temperature sintered zirconia slurry. The physical and mechanical properties were again assessed. Results were analyzed using one-way ANOVA test. Specimens were observed under scanning electron microscopy (SEM) and X-ray diffraction (XRD) for their microstructure and crystalline phases, respectively. Grinding with diamond burs did not weaken zirconia (p > 0.05) but produced rougher surfaces than the control group (p < 0.05). Tungsten carbide burs did not significantly roughen the zirconia surface. However, specimens ground by tungsten carbide burs had a significantly reduced mean flexural strength (p < 0.05) and SEM revealed fine surface cracks. Phase transformation was not detected by XRD. Polishing with commercially available polishing agents, however, restored the surface roughness levels to the control group. Dental monolithic zirconia ground with tungsten carbide burs had a significantly reduced flexural strength and a smooth but defective surface. However, grinding with diamond burs roughened the zirconia surface. These defects may be reduced by polishing with commercially available polishing agents. The use of tungsten carbide burs for grinding dental zirconia should not be advocated. Grinding with diamond abrasives does not weaken zirconia but requires further polishing with commercially available polishing agents.

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Lin, Jyh-Woei. "Aluminum Tube Polishing Fire Problem: A Case Study." European Journal of Engineering and Technology Research 8, no. 2 (April 7, 2023): 58–59. http://dx.doi.org/10.24018/ejeng.2023.8.2.3022.

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Aluminum was a type of hard and soft material, because of its high toughness, and it was easy to generate grinding heat, so polishing was relatively difficult because of polish fire. Aluminum has been used as a processing material due to its excellent properties such as lightness, corrosion resistance, non-magnetism, alloy strength, electrical conductivity, weight, and heat dissipation. However, some problems arose when grinding aluminum tubes. Thereby, two grinding methods have been performed to reduce polish fire. An elastic polishing wheel with special heat dissipation was used. There were many grinding wheels on the market, which were adjusted according to the material. For example, the finer-grained elastic polishing wheel was used because of the elastic grinding wheel being elastic, but such wheel was afraid of vibration during high-precision polishing. Therefore, these two grinding methods have shown that the polish fire was reduced and lead to the problem of good processing efficiency with the best solution.

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Mizobuchi, Akira, Takeshi Hamada, Atsuyoshi Tashima, Keita Horimoto, and Tohru Ishida. "Polishing Performance of a Recycled Grinding Wheel Using Grinding Wheel Scraps for the Wet Polishing of Stainless-Steel Sheets." International Journal of Automation Technology 16, no. 1 (January 5, 2022): 60–70. http://dx.doi.org/10.20965/ijat.2022.p0060.

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The surfaces of large austenitic stainless-steel sheets, which have side lengths of at least 1 m a sheet thickness of at least 6 mm, used for food tanks and sliding plates in seismic isolation devices, must be finished to a mirror surface. Polishing is performed to improve the surface quality of such sheets and dry machining is typically applied. The problems associated with dry machining are the exhaust heat of machining and treatment of chips. A transition to wet machining is required to solve these problems. In our laboratory, we have developed a wet polishing machine and researched the selection of grinding wheels to develop wet polishing technology for large stainless-steel sheets. In this study, to reduce tool cost and reuse resources, we attempted to manufacture a recycled grinding wheel using snippets of grinding wheel scraps. A polyvinyl alcohol (PVA) aqueous solution was used as the bonding agent for the recycled grinding wheel to reduce environmental load. To overcome the ease of dissolution of PVA in water, we attempted to improve the water resistance of the PVA aqueous solution by incorporating an organic titanium compound. This is one of our efforts to contribute to sustainable development goals. The results are summarized below. (1) A recycled grinding wheel was fabricated by kneading crushed pieces of grinding wheel scrap with a bonding agent. (2) The maintenance of the shape of the recycled grinding wheel was controlled by the concentration of the bonding agent. (3) The recycled grinding wheel with a PVA bonding agent was vulnerable to water. In contrast, the recycled grinding wheel to which the organic titanium compound was added exhibited improved water resistance. (4) The polishing of stainless-steel sheets using the plain PVA recycled wheel was relatively ineffective, but polishing using the recycled wheel with the titanium additive was comparable to polishing with a new grinding wheel.

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Huang, Zhi, Xu Ke, Shi Hang Cheng, and Fen Qing Heng. "Kinematics Analysis of Abrasive Belt Grinding Robot for Aero-Engine Blade and its Simulation." Advanced Materials Research 889-890 (February 2014): 1165–69. http://dx.doi.org/10.4028/www.scientific.net/amr.889-890.1165.

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This paper presents an abrasive belt grinding robotic system solution for traditional aero-engine blade manual grinding situation. In order to overcome the limitation of traditional polishing robot teaching programming way and improve the efficiency of the robot offline programming and simulation of interactive, based on OpenGL robot programming and motion simulation platform with interactive features is constructed with VC++6.0. The result shows that the system is able to realistically simulate the movement of industrial robots grinding and polishing process, and it provides a reference for the other abrasive belt grinding and polishing robot off-programming and kinematics simulation development technology.

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Shi, Shuang Ji, Jia Zhi Lin, Zhu Ji Jin, Xiao Guang Guo, Ping Zhou, and Ren Ke Kang. "Study of Grinding Wheel for Polishing Diamond by Dynamic Friction Polishing." Advanced Materials Research 1017 (September 2014): 304–9. http://dx.doi.org/10.4028/www.scientific.net/amr.1017.304.

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Diamond is widely used in the fields of precise and ultraprecise machining because of its superlative characters. Due to high hardness and great brittleness of diamond, the grinding of diamond needs a kind of high effective and stable polishing method. Dynamic friction polishing (DFP) is deemed to be an innovative method by means of a synergistic reaction of mechanical effect and chemical change. The condition of high pressure and high temperature puts forward a high requirement for mechanical property of the grinding wheel in DFP, other than that, the graphitization of diamond catalyzed by catalytic metal is also a focus of research. In this paper, the transition metals with unpaired d electrons were selected as polishing materials, and powder metallurgy technique was used to prepare alloy grinding wheel for polishing diamond by dynamic friction polishing.

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Guan, Jia Liang, Y. C. Wu, H. W. Lu, X. H. Xiao, and W. C. Wang. "The Mechanical Polishing Research on the Surface of WC-Co Cemented Carbide Based on ELID Grinding." Key Engineering Materials 487 (July 2011): 322–26. http://dx.doi.org/10.4028/www.scientific.net/kem.487.322.

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In the paper, the ELID grinding is, first of all, adopted to pre-process the surface of WC-Co cemented carbide, obtaining the precision machined surface, Ra=18nm.Then the mechanical polishing process is implemented. When conducting mechanical polishing, the polishing liquid with W1 diamond grits is used to process the surface about 100 minutes after ELID grinding, aiming to achieve rapid removal. About 100 minutes again, the ultra-precision surface, Ra=4nm, is obtained, by the mechanical polishing ,using the polishing liquid with W0.5 diamond grits .Meanwhile, on the surface roughness effects of abrasive type, grain size, polishing liquid solvents, polishing pressure, polishing machining time and so on, are researched in-depth for the process of mechanical polishing.

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Yang, Lieh Dai, Kun Ling Wu, Yue Mei Lai, and Yu We Huang. "Study on Precision Polishing of Alumina Ceramics." Materials Science Forum 926 (July 2018): 64–69. http://dx.doi.org/10.4028/www.scientific.net/msf.926.64.

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The research is mainly to investigate the surface roughness by the mechanical polishing for the processing of alumina ceramic materials. In the experiment, the ceramic test piece was placed between the ceramic work ring and the grinding disc and then grinded firstly with an alumina grinding slurry with a particle size of 10 μm to make the original roughness of the test piece reach Ra value of 1.49 μm. Then the silicon carbide slurry polishing was employed to conduct the experiments by changing the concentration of the polishing, particle size, load, rotation and time to observe the polishing effect of ceramic materials under different parameters. The results showed that the silicon carbide particle size of 2μm, with the polishing time of 50 min, the disc speed of 90 rpm, the concentration of 35%, the original surface roughness of alumina ceramic Ra 1.49μm could be downed to 0.22 μm. The improvement rate could reach 94%. And the greater the specimen load with the better grinding efficiency, the smaller the load caused worse cutting force between alumina and the specimen surface. However, the better the surface roughness when the time kept going. Furthermore, alumina ceramic test piece after precision mechanical polishing by 3D surface roughness profiler and scanning electron microscope (SEM) analysis, the observation found that the wave of the original test piece rugged, after grinding and polishing wave front and grinding scratches had been removed, and a smooth surface was obtained.

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Kawana, Yuya, Rei Sekiguchi, Yuta Mizumoto, Yasuhiro Kakinuma, Katsutoshi Tanaka, and Masahiko Fukuta. "Basic Study on Ductile-Mode Grinding of Optical Glass Lenses with Rubber Bonded Diamond Wheels." Materials Science Forum 874 (October 2016): 241–46. http://dx.doi.org/10.4028/www.scientific.net/msf.874.241.

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Large aperture lenses with high surface quality are demanded for professional imaging products such as single-lens reflex cameras and astronomical telescopes. Large aperture optical lenses are shaped by ultra-precision grinding and finished by prolonged polishing. However, the prolonged polishing process leads to deterioration of the form accuracy. In order to reduce the amount of polishing, ductile-mode ultra-precision grinding is demanded. In this study, a rubber bonded wheel, which has a low elastic modulus, is used for grinding of spherical glass BK7, and influence of the hardness of the rubber bonded wheel and abrasive chip thickness on brittle fracture and surface roughness are experimentally investigated.

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Gu, Bin, Hong Chen Liu, Yuan Fu Yi, Long Quan Shao, Rong Jian Lu, Jie Mo Tian, Bing Deng, and Ning Wen. "Effects of Surface Treatment on the Microstructural and Crystallographic Changes of Dental 3Y-TZP Ceramic." Key Engineering Materials 492 (September 2011): 66–70. http://dx.doi.org/10.4028/www.scientific.net/kem.492.66.

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Objective: To investigate the effects of different surface treatments on the microstructural and crystallographic changes of dental 3Y-TZP ceramics. Methods: 21 pieces of zirconia specimens (15 ´ 15 ´ 1.5 mm) were prepared and divided into 7 groups: control group; grinding group; polishing group; sandblasting group; sandblasting + veneer porcelain sintering group; sandblasting + veneer porcelain sintering twice group and sandblasting + annealing group. The crystal structure of specimen was monitored by X-ray diffraction (XRD) before morphological observation with scanning electron microscope. Results: monoclinic phase increased after grinding while decreased little after polishing, bigger phase change presented after sandblasting compared with decreased phase change induced by veneer porcelain sintering; annealing eradicated the surface m phase. Grinding produced coarse scratches on the surface of samples with removal of surface particles; after grinding and polishing to 7 um level, the surface particles were removed massively, and the surface became smooth with remaining scare scratches and substantial micro cracks. Sandblasting removed scratches near completely producing coarse and irregular surface of samples. Conclusions: Grinding, sandblasting and polishing could produce the transition of Zirconia Ceramic surface from t to m phase. It is better to use heat treatment after mechanical treatment to reverse the changed surface phase.

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Wu, Xiao Jun, Shu Dong Sun, and Chao Zheng. "Automatic Polishing Technology on Free Surface by Grinding Center." Advanced Materials Research 139-141 (October 2010): 739–42. http://dx.doi.org/10.4028/www.scientific.net/amr.139-141.739.

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Die and mold are constructed with various free surfaces. In the machining of die and mold, it takes a long time to finish the curved surface. In this study high accurate polishing technique by GC (grinding center) with elastic ball type wheel is developed. In polishing process it is very important to remove cusp height without decreasing machined form accuracy. It is available to use GC in free surface grinding and finishing of die and mold with elastic ball type wheel. In polishing process only cusp height is removed in order to keep form accuracy that is produced in cutting process with ball end mill. In order to know the polishing characteristics of elastic ball type wheel, basic experiments were conducted. The polishing parameters Sp. were obtained experimentally by changing the values of polishing process. Using polishing parameter, removal amount can be obtained and polished surface is possible to estimate.

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Hu, Wei Wen, Jing Hua Fen, and Zhe Min Dai. "Motive Simulation on the Grinding Head of Ceramic Polisher Based on Matlab." Key Engineering Materials 474-476 (April 2011): 247–50. http://dx.doi.org/10.4028/www.scientific.net/kem.474-476.247.

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Taking the polisher as the example，this paper described the process of precision ceramic polisher and built up the mathematical model for polishing process and simulation．First, it contrasted to single–single-grit grinding head in the grinder for the general motion and planetary motion .Second, it contrasted to multi-single-grit grinding head in the grinder for the general motion and planetary motion. The simulated model provides the convenience of adjusting process parameters with Matlab for comparison of polishing effects，thus it is of avail to the determination of polishing parameters and the control of polishing quality．

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Pa, P. S. "Ultrasonic Assistance in Electrofinishing and Grinding on Cylinder Surface." Advanced Materials Research 430-432 (January 2012): 1764–67. http://dx.doi.org/10.4028/www.scientific.net/amr.430-432.1764.

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For the purpose of elevating the efficiency of the surface finish to reach the fast improvement of the roughness of the cylinder surface, a new finish module combination of electrofinishing, grinding, and ultrasonic assistance is investigated. The present study discusses the surface roughness of YCS3 materials after traditional machining (turning, drawing, rolling, extrusion, etc.), of which the cylinder surface used a design finish-tool includes a ring-form electrode and a nonconductive grinding wheel to execute the continuous processes of electrofinishing and grinding. In the experiment, the external cylindrical workpiece is put into the compound circular finishing-tool to execute the polishing processes by automatic continuity production. The ultrasonic energy is used to transmit to the electrolyte. By the compound production of electrofinishing and grinding, the multiple effects not only included polishing processes of electrofinishing and grinding but also included the ultrasonic assistance from the ultrasonic energy is transmitted to the electrolyte to assist the dregs and cuttings discharge during polishing processes.

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Zucuni, Camila Pauleski, Luis Felipe Guilardi, Marilia Pivetta Rippe, Gabriel Kalil Rocha Pereira, and Luiz Felipe Valandro. "Polishing of Ground Y-TZP Ceramic is Mandatory for Improving the Mechanical Behavior." Brazilian Dental Journal 29, no. 5 (September 2018): 483–91. http://dx.doi.org/10.1590/0103-6440201802044.

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Abstract It evaluated the effect of aging by Low Temperature Degradation (LTD), executed after post- processing surface treatments (polishing, heat treatment and glazing), on the surface characteristics (micromorphology and roughness) and on the structural stability (phase transformation and mechanical behavior-flexural strength and structural reliability) of a ground yttrium-stabilized tetragonal zirconia polycrystal (Y-TZP) ceramic. Discs of Y-TZP (VITA In-Ceram YZ) were manufactured (ISO:6872-2015; 15 mm in diameter and 1.2 ± 0.2 mm in thickness) and randomly assigned into 10 groups according two factors: “aging” in 2 levels (with or without) and “surface treatment” in 5 levels (Ctrl: as-sintered; Gr: grinding with coarse diamond bur; Gr + HT: grinding plus heat treatment; Gr + Pol: grinding plus polishing; Gr + Gl: grinding plus glazing). Roughness (n=30), biaxial flexural test (n=30), phase transformation (n=2), and surface topography (n=2) analyses were performed. Aging led to an intense increase in monoclinic (m) phase content for all the tested conditions, being the as-sintered samples (Ctrl= 65.6%) more susceptible to the t-m phase transformation. Despite of increasing the m-phase content, aging was not detrimental for characteristic strength (except to the grinding condition). There was no significant reduction in the Weibull modulus after surface treatments. Additionally, heat treatment and glazing after grinding led to a decrease in characteristic strength, while polishing presented the highest characteristic strength values. Thus, polishing is mandatory after grinding the Y-TZP ceramic, while performing glazing or heat-treatment alone after grinding lead to the worst mechanical performance.

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Wu, Zihe, Jirui Cheng, Yu Zhang, Jiawei Ren, and Shang Gao. "Modeling on the Flatness of Silicon Wafers Ground by the Grind-polishing Wheel." Journal of Physics: Conference Series 2566, no. 1 (August 1, 2023): 012073. http://dx.doi.org/10.1088/1742-6596/2566/1/012073.

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Abstract The grind-polishing wheel is a new non-woven structure grinding tool with low elastic modulus and ultra-fine abrasive grains, which can obtain high surface/sub-surface quality ground silicon wafers. To obtain high-shape flatness during grinding with the grind-polishing wheel, a prediction model of the ground silicon wafers’ flatness considering the elastic modulus of the wheel, processing parameters, and abrasive grain size is developed. The grinding experiments under different speed ratios were conducted to verify the prediction model accuracy. It shows that the model can successfully predict the flatness of ground silicon wafers, and the error of the prediction model is less than 13%. The proposed model has some guiding significance for choosing the appropriate character of the grind-polishing wheel and grinding parameters to achieve desirable flatness for silicon wafers.

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Guan, Jia Liang, H. W. Lu, X. H. Xiao, Y. C. Wu, and Z. D. Chen. "Research on Precision Mirror Machining Technology for W-Mo Alloy." Key Engineering Materials 487 (July 2011): 303–7. http://dx.doi.org/10.4028/www.scientific.net/kem.487.303.

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A new way of precision machining was studied through the experiments of Electrolytic In-Process Dressing (ELID) precision grinding and ultra precision lapping and polishing for W-Mo metal alloy. First a 22nm(Ra) surface was obtained through the ELID grinding, last a 11nm(Ra) surface was obtained after the process of lapping and polishing with 0.1～0.3 N/cm2pressure, 60～100 r/min rotational speed and other optimized parameters. Meanwhile, the formation mechanism of ultra precision mirror surface of the alloy was also analyzed. The experiments prove surface quality of the work piece was guaranteed by ELID grinding, and which was also greatly affected by some parameters in lapping and polishing such as pressure, rotational speed.

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Jin, Zhu Ji, Xing Wei Ma, and Ze Wei Yuan. "The High-Efficient Low-Cost Wheel-Grinding Technology for CVD Diamond Films." Advanced Materials Research 24-25 (September 2007): 295–302. http://dx.doi.org/10.4028/www.scientific.net/amr.24-25.295.

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CVD diamond films have been used in many high-tech fields with the industrial and scientific developments, while the lagging of the polishing technology for the CVD diamond films has limited their widely applications. This paper presents a high-efficient low-cost wheel-grinding technology for CVD diamond polishing, and the two key techniques of this technology are introduced in detail based on thermo-chemical polishing technology. Furthermore, wheel grinding technology exhibits a promising perspective for the widely application in the diamond films.

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Zhou, Hai, Li Gang Bai, and Dai Pin Wang. "Micro-Quality Control on Ultra-Precision Machining of Sapphire Substrates." Advanced Materials Research 102-104 (March 2010): 738–41. http://dx.doi.org/10.4028/www.scientific.net/amr.102-104.738.

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This paper proposed a new approach to control the micro-quality of sapphire substrate, in order to grow GaN on substrate. The main factors that influence macro-quality are the method of slicing, grinding and polishing. Thread speed of slicing is less than 0.5m/s. Ductile mode grinding of substrate is achieved by #3000 diamond wheel and feed of 1μm/r. The suitable polishing conditions are that the SiO2 grain size is less than 10nm, the concentration SiO2 is 3％, pH value of polishing liquid is 10.5 and polishing stress is 190Pa. The undamaged substrates have been obtained steadily. The surface roughness RMS is less than 0.4 nm.

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Duan, Ji Hao, Yao Yao Shi, Xiao Jun Lin, and Ting Dong. "Flexible Polishing Machine with Dual Grinding Heads for Aeroengine Blade and Blisk." Advanced Materials Research 317-319 (August 2011): 2454–60. http://dx.doi.org/10.4028/www.scientific.net/amr.317-319.2454.

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The blade and blisk manufacturing includes polishing process when the surface roughness and size requirement of profile are disqualified after milling process. This polishing process is mainly carried out manually by skilled workers or NC machines. However, the existing polishing technology always leads to surface quality instability and inconsistency because of the complex free-form surface of blade and blisk. Therefore, in this paper, based on the research of polishing requirements and methods of blade and blisk, an automatic 6-axis polishing machine was proposed in order to enhance surface quality. And then, a polishing mechanism was designed using flexible technique to make the polishing tool accommodate surface waviness which was produced in milling process. In addition, the working principle and control method of flexible polishing mechanism were studied. Finally, the polishing test results of blade and blisk showed that the profile error was about 0.06mm and the surface roughness was less than Ra0.4 after automatic polishing. Compared with the manual polishing process, the automatic polishing technology not only increased the polishing efficiency and quality stability, but also reduced labor intensity largely.

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Li, Fusheng, Shilei Li, Huan Tong, Hainan Xu, and Yanli Wang. "The Application of Chemical Polishing in TEM Sample Preparation of Zirconium Alloys." Materials 13, no. 5 (February 25, 2020): 1036. http://dx.doi.org/10.3390/ma13051036.

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Hydride artefacts are commonly induced by the TEM sample preparation process in Zirconium alloys as hydrogen-sensitive metals, including electron polishing and focused ion beam (FIB) technology. In the research, we present the application of chemical polishing with a solution of 10HF:45HNO3:45H2O to prepare the disk samples for TEM observation in zirconium alloys. The thinning efficiency of chemical polishing is 25 μm per minute. XRD patterns indicate that the chemical polishing actually eliminates the macro- and micro-stress induced by mechanical grinding. TEM observation demonstrates that chemical polishing reduces the amount of hydride artefacts, especially hydrides with large size. It is proposed that induced stress provides driving force for hydride artefact formation. Compared with traditional mechanical grinding, the advantages of chemical polishing are high efficiency, free of induced stress, less induced hydride artefacts and bend contours.

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Matoušek, Ondřej, Karolína Sedláčková, and Vladislav Kuryshev. "Optimization of the continuity of the aspherical production processes in asphericon s.r.o based on subsurface damage and microroughness analysis." EPJ Web of Conferences 264 (2022): 01022. http://dx.doi.org/10.1051/epjconf/202226401022.

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In the paper is presented an analysis and optimization of the standardized sub-apertural grinding process used in the serial production in asphericon s.r.o. The monitored parameter was the depth of subsurface damage and surface microroughness. Tested were five grinding processes, which were automatically generated by the internal system, for five different diamond grit sizes (D151, D91, D64, D30, and D15). For evaluation of the depth of the defected layer was used modified wedge polishing method which is suitable for analysis of the rotationally symmetrical sub-apertural grinding processes [1]. For identifying the presence of the subsurface damage two methods were used. Defect detection using an optical microscope, as the broadly used and reliable method, and detection by standard ISO control to get the comparison with the method used in common serial production. The microroughness was measured using a white-light microscope concerning the used grinding tool and the amount of removed material. Within the experiment was found as the most effective two-step process uses D91 for rough grinding and D30 for fine grinding. D91 provides a very good removal characteristic with final subsurface damage of 44 µm which is possible to grind out using the D30 tool in two steps with final subsurface damage 22 µm in a total processing time of 137 minutes. This grinding process is timewise in best balance with 80 minutes long polishing process and therefore minimize the production cost. Result microroughness around 2 nm Sq in the fully polished zone is already limited by the polishing process. Using a finer grinding tool is not bringing improvement in the surface microroughness just shortening polishing time due to lower subsurface damage.

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Kalisz, Janusz. "Tribological properties of aluminium alloy surface layer after finishing treatments." Mechanik 91, no. 7 (July 9, 2018): 492–95. http://dx.doi.org/10.17814/mechanik.2018.7.63.

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Investigation’s results of the surface geometric structure and tribological properties of the aluminum alloy EN AW-AlCu4MgSi(A) processed by various finishing treatments: grinding, polishing and ball burnishing are presented in the paper. The test of abrasive resistance and friction coefficient determination was carried out by usage of the T-01M tester. The tests were carried out under dry friction conditions using the ball-on-disc method. As a counter-sample, a polished Al2O3 ceramic ball with a diameter of 6 mm was used. After burnishing, comparing to grinding and polishing, an approximate twice reduction of the volume wear rate was obtained. Depending on the type of surface treatment mean friction coefficients are 0.45 after grinding, 0.34 after polishing and 0.32 after ball burnishing.

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Zhang, Huali, Minghui Zhang, Jicai Kuai, and Dmitrii V. Ardashev. "ELID Dressing Behaviors of Non-Abrasive Iron-Based Grinding Wheels." Applied Sciences 13, no. 19 (October 7, 2023): 11047. http://dx.doi.org/10.3390/app131911047.

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Non-abrasive iron-based grinding diamond wheels, lacking abrasive particles, negate the concern of detached passivated abrasives scratching the polished surface. During the Electrolytic In-Process Dressing (ELID) polishing process, α-Fe2O3 particles form on the oxide film surface of the iron-based grinding diamond wheel devoid of abrasives. These particles assume the role of the grinding diamond wheel for polishing. Therefore, the ELID electrolytic performance and the oxide film formation performance of the non-abrasive iron-based grinding diamond wheel significantly influence the formation of α-Fe2O3 particles and the subsequent ELID polishing performance. Our studies investigating the ELID dressing behavior of the non-abrasive iron-based grinding diamond wheel have analyzed the influence mechanism of the electric field, flow field, and pulse energy on its ELID dressing. Moreover, the roundness of the ELID dressing grinding diamond wheel, oxide film properties, and α-Fe2O3 particle content were measured, and plate glass was polished using the ELID non-abrasive iron-based grinding diamond wheel. The results illustrate that the non-abrasive iron-based grinding diamond wheel exhibits excellent ELID dressing performance. The diamond wheel’s roundness is less than 0.001 mm, the oxide film uniformly covers the surface, the content of α-Fe2O3 particles is evenly distributed, and the surface accuracy of the polished plate glass is approximately 0.5 nm. These findings provide a compelling case for the continued use and development of grainless iron-based grinding diamond wheels in precision grinding operations.

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Pechoušek, Jiří, Ernö Kuzmann, René Vondrášek, Anna Olina, Vlastimil Vrba, Lukáš Kouřil, Tomáš Ingr, Petr Král, and Miroslav Mashlan. "Successive Grinding and Polishing Effect on the Retained Austenite in the Surface of 42CrMo4 Steel." Metals 12, no. 1 (January 7, 2022): 119. http://dx.doi.org/10.3390/met12010119.

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Low-alloy 42CrMo4 steels were studied by 57Fe Mössbauer spectroscopy (MS), X-ray diffractometry (XRD), and Energy Dispersive X-ray Spectroscopy (EDS) measurements. The investigations were performed on metallographic samples, which were subjected to a series of successive grinding and polishing with a progressively finer grit. Conversion X-ray Mössbauer spectroscopy (CXMS) was used to determine the occurrence of austenite in steel samples. It is a unique method detecting the austenite content very sensitively. Six samples with different surface preparation were investigated, starting with 4.8% of austenite on an as-cut sample, and a large decrease in the retained austenite to 2.6% was observed after the first grinding of a hardened cut sample. Additionally, an unexpectedly large decrease in the austenite content to 2.3% was found due to the final polishing. A second time applied successive grinding and polishing of all samples resulted in identical austenite content determined by CXMS of approx. 5%, which proved the applicability of the CXMS method. Generally, the result calls attention to the importance of preparation of metallurgical samples by grinding and polishing where the results can vary significantly on the level of surface processing.

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Yu, H. X., H. Xu, and Ju Long Yuan. "Research on On-Line Control Strategy for the Wearing Compensation of Polishing Wheel." Advanced Materials Research 69-70 (May 2009): 348–53. http://dx.doi.org/10.4028/www.scientific.net/amr.69-70.348.

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A novel control strategy for on-line polishing wheel wearing compensation in a polyhedral glass grinding machine is proposed, which is mainly consisted of hybrid feed-forward feed-backward control scheme and adaptive wearing prediction algorithm. It has advantage of eliminating the size excursion of polishing roller during long term operation, while the implementation of high accuracy diameter measurement is unnecessary. Hence it greatly reduces the demand for precise sensor and complicated calculation algorithm. Consequently, surface polishing quality and flexibility of the grinding machine was enhanced greatly. Theoretical analysis and experiment result obtained from a laboratory prototype shows good agreement, which indicates that the proposed control strategy has good performance in polishing wheel diameter compensation applications.

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Chen, Jin Shen, Hong Mei Zhi, and Shao Guo Wen. "Study on a New Glass Polishing Plate." Advanced Materials Research 548 (July 2012): 199–202. http://dx.doi.org/10.4028/www.scientific.net/amr.548.199.

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This paper reports a polishing disk which can substitute for rare earth. Using alumina - cerium oxide core-shell composite abrasive as abrasive, unsaturated resin as bonding agent, abrasive tool can be prepared by adding a water soluble pore-forming agent, suitable heat absorbing agent and active stuffing and the suitable addition amounts which are 25.6%, 46.8%, 18.5%, 3.8% and 1.2%, respectively .This abrasive tool can conduct the temperature in the grinding zone rapidly. It also has high grinding efficiency smooth polishing surface and without cracks or scratches, which meet furthermore, it has the merits of low cost and extensive use prospect. The polishing effect of rare earth polishing disk, but the low cost make it suitable for wide promotion.

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31

Quan, Fang, Zhitong Chen, Qiantong Li, and Shimin Gao. "Effects of process combinations of milling, grinding, and polishing on the surface integrity and fatigue life of GH4169 components." Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 234, no. 3 (August 7, 2019): 538–48. http://dx.doi.org/10.1177/0954405419868053.

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The nickel-based superalloy GH4169 is widely applied in the aviation industry due to its outstanding mechanical properties. However, many blades of GH4169 are still produced by milling and manual polishing, which is costly and unreliable. In this article, GH4169 superalloy components manufactured with combination processes of milling, grinding, and polishing were comparatively studied involving surface integrity and fatigue performance. Test results indicate that the final polishing is the most dominant process that influences the high-cycle fatigue life of GH4169 components. Samples produced via cubic boron nitride grinding and numerical control polishing with a diamond-rubber wheel exhibit fatigue limits of 150 MPa higher than the milled and manually polished samples. Cubic boron nitride grinding induces a considerable compressive residual stress profile with a magnitude of -930 MPa and a depth of 200 μm. Milling induces a typical “hook” residual stress profile with 318 MPa at the surface. Polishing affects the machined surface by two ways, the removal effect and the squeezing effect. The squeezing effect induces a shallow compressive residual stress with approximately −1000 MPa, therefore improves the surface condition. However, inevitable omissions, scratches, texture disorders, and knock marks in hand-polishing are the main causes of the unstable high-cycle fatigue life of hand-polished components.

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Han, Guang Chao, Ming Sun, and Jing Dong Li. "Experimental Research on the Robotic Compound Polishing Process with Mixed Magnetic Abrasive." Advanced Materials Research 129-131 (August 2010): 118–23. http://dx.doi.org/10.4028/www.scientific.net/amr.129-131.118.

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The quality and the efficiency of the polishing process are important to the lead time of the rapid tooling. Robotic polishing process with free abrasive is adapted to the finishing of complex mould surface, in which the soft polishing tool is widely used. But the stability and the efficiency of the process should be improved further. According to the moving and grinding characters of the free abrasive, the mixed magnetic abrasive and the minitype electromagnetic field are combined to the robotic polishing process. The mixed magnetic abrasive are made up of magnetic grain and hard abrasive, which can enhance the effective cutting and grinding process of the three-body abrasion under the effect of magnetic field. The robotic compound polishing process with mixed magnetic abrasive is presented in this paper. The experiments are tested to study the distribution of the minitye magnetic field and the polishing efficiency of the complex polishing process. The results show that the polishing efficiency of the process can be improved obviously where the effective working intensity of the electromagnetic field reaches 400Gs.

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Chen, Bing, Bing Guo, and Qing Liang Zhao. "Ductile Regime Grinding Aspheric Surface of Hot-Pressed Zinc Sulfide." Applied Mechanics and Materials 633-634 (September 2014): 624–27. http://dx.doi.org/10.4028/www.scientific.net/amm.633-634.624.

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Aspheric lens of Zinc sulfide is widely used in infrared, but it is always formed by polishing with low efficiency, ductile regime grinding aspheric surface of hot-pressed zinc sulfide is studied to reduce time-consuming of polishing. The results of orthogonal grinding experiments demonstrate that the depth of grinding is the main influencing factor on ductile regime removal mechanisms and surface roughness Ra values which decrease with decreasing depth of grinding, and the optimal value is 7.6nm, the steady ductile regime removal mechanisms appears when depth of grinding is below 0.4μm. With diamond wheel by grain size of D20/30, machining parameters on the basis of orthogonal grinding experiments, the aspheric surface cross grinding experiments show that ductile regime removal is obtained only in little center areas of aspheric surface, most of aspheric surface is in brittle regime. Then, the ductile regime aspheric surface with roughness of 20.1nm is observed by cross grinding of diamond wheel with grain size of D4/8.

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34

Bifano, T. G., T. A. Dow, and R. O. Scattergood. "Ductile-Regime Grinding: A New Technology for Machining Brittle Materials." Journal of Engineering for Industry 113, no. 2 (May 1, 1991): 184–89. http://dx.doi.org/10.1115/1.2899676.

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Because of recent advances in precision engineering that allow controlled grinding infeed rates as small as several nanometers per grinding wheel revolution, it is possible to grind brittle materials so that the predominant material-removal mechanism is plastic-flow and not fracture. This process is known as ductile-regime grinding. When brittle materials are ground through a process of plastic deformation, surface finishes similar to those achieved in polishing or lapping are produced. Unlike polishing or lapping, however, grinding is a deterministic process, permitting finely controlled contour accuracy and complex shapes. In this paper, the development of a research apparatus capable of ductile-regime grinding is described. Furthermore, an analytical and experimental investigation of the infeed rates necessary for ductile-regime grinding of brittle materials is presented. Finally, a model is proposed, relating the grinding infeed rate necessary for ductile material-removal with the properties of the brittle workpiece material.

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35

Rooks, Brian. "Robots score at grinding and polishing." Industrial Robot: An International Journal 25, no. 4 (August 1998): 251–55. http://dx.doi.org/10.1108/01439919810226221.

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36

Liu, C. H., C. C. A. Chen, Po I. Li, and Ta Chieh Hu. "Imposing compliance on grinding and polishing." International Journal of Materials and Product Technology 22, no. 4 (2005): 274. http://dx.doi.org/10.1504/ijmpt.2005.006457.

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37

Puttick, K. "Handbook of Ceramic Grinding and Polishing." Tribology International 33, no. 8 (August 2000): 588–89. http://dx.doi.org/10.1016/s0301-679x(00)00110-9.

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Zhu, Wu-Le, and Anthony Beaucamp. "Compliant grinding and polishing: A review." International Journal of Machine Tools and Manufacture 158 (November 2020): 103634. http://dx.doi.org/10.1016/j.ijmachtools.2020.103634.

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39

OKUYAMA, Shigeki. "Combination Machining for Grinding and Polishing." Journal of the Japan Society for Precision Engineering 74, no. 4 (2008): 346–49. http://dx.doi.org/10.2493/jjspe.74.346.

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40

Pa, P. S. "Compound Finish Processes Using Grinding and Ultrasonic Electropolishing on Hole-Wall Surface." Advanced Materials Research 426 (January 2012): 205–8. http://dx.doi.org/10.4028/www.scientific.net/amr.426.205.

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This study using ultrasonic energy transmitted into the electrolyte to assist in discharging of electrolytic product out of the machining gap in the compound finishing processes of grinding and electropolishing on hole-wall surface beyond traditional process of holes machining instead of conventional hand or machine polishing. The compound processes of grinding and ultrasonic electro polishing just require a short time to make the hole-wall surface smooth and bright in the current study. The design polishing tool includes a grinding-tool and an electrode as a hole-wall surface finish improvement that goes beyond traditional rough boring. In the experiment, the polishing tool travels across the hole-wall surface with continuous or pulsed direct current. The experimental results show that the large supply of current rating is effectively to reach the amount of the material removal and is advantageous to the finishing processes. The average effect of the ultrasonic is better than the pulsed current while the machining time needs not to be prolonged by the off-time. The finish effect is better with a high rotational speed of the polishing tool because the dregs discharge of electrochemical finishing becomes easier and is also advantageous to the finish.

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Chen, Cheng, and Xiaohua Zeng. "Effects of Different Polishing Systems on Surface Roughness and Crystal Structure of Zirconia." Applied Bionics and Biomechanics 2022 (May 9, 2022): 1–7. http://dx.doi.org/10.1155/2022/5360893.

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Objective. Intraoral polishing systems have become an alternative method for reglazing, which is important to prevent or minimize rapid wear of the opposing teeth. To assess the influence of different polishing systems and duration on surface roughness and crystal structure of zirconia was compared, contributing to the preparation and effect improvement of clinical zirconia restorations. Methods. Forty-eight zirconia specimens with equal size were fabricated by cutting and sintering zirconia discs. Then X-ray diffractometer (XRD) was adopted for examination of the specimens. Six specimens were selected as the grinding-polishing group (GL) after polishing, grinding, and glazing. Then six specimens were randomly selected from the remaining specimens as the grinding-unpolished group (GR) after surface conditioning by dental diamond burs. Subsequently, based on different polishing systems and duration, the rest of specimens were divided into following groups ( n = 6 ): Youdent-20s group (Y20), Youdent-40s group (Y40), Youdent-60s group (Y60), Toboom-20s group (T20), Toboom-40s group (T40), and Toboom-60s group (T60). Additionally, a contour graph was applied for assessing the surface roughness of zirconia, scanning electron microscope (SEM) for observing surface topography, and X-ray diffraction analysis (XRD) for determining crystal structure of zirconia. Results. The GR group had the highest roughness, and the roughness of the specimens polished for 20 s with different polishing systems was significantly higher than those polished for 40 s and 60 s with the same polishing systems. There were no significant difference between the Y20 and T20 groups, while the roughness of the specimens in both Y40 and Y60 groups was significantly higher than that of the T40 and T60 groups. And with the increasing polishing duration, the surface morphology of the specimen was gradually smooth and the morphology was gradually regular. Besides, the surface scratches of the T group were shallower than that of the Y group at the same polishing duration. The peak value of XRD profile of the specimen after grinding and polishing process was consistent with the baseline pattern of that the original specimen. Conclusion. Glazing can reduce the surface roughness of the specimens. Besides, the polishing effect of Toboom (TOB) system ( polishing duration = 60 s ) is the best. And different polishing durations of TOB system have no significant effect on the crystal surface structure of the specimen.

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42

Zhu, Minjian, Tao Shang, Zelin Jin, Chunshan Liu, Wenbin Deng, and Yanli Chen. "Research on the Visual Guidance System of Zoning Casting Grinding Based on Feature Points." Applied Sciences 12, no. 17 (August 31, 2022): 8771. http://dx.doi.org/10.3390/app12178771.

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Compared to traditional rough casting grinding (RCG), the individualization of castings is very different, which makes it difficult to realize the automation of casting grinding. At this stage, the primary method is manual grinding. In this study, the regional casting grinding system based on feature points is adopted to achieve the personalized grinding of castings and improve the grinding efficiency and the automation level of the manufacturing process. After preprocessing the point cloud, the fast point feature histogram (FPFH) descriptor is used to describe the features of each region and construct the local template. The position of the local region is obtained by template matching. The random sample consensus (RANSAC) algorithm is used to calculate the plane and fit the point cloud to obtain the contact point trajectory of the grinding head. Then, according to different polishing methods, different polishing poses are generated. The simulation experimental results show that the system has good adaptability, and the consistency of finished products is good.

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Kuai, Ji Cai. "Adhesion Model and Shedding Limit's Identification of the Oxide Film on the Surface of ELID Grinding Wheel." Advanced Materials Research 900 (February 2014): 557–60. http://dx.doi.org/10.4028/www.scientific.net/amr.900.557.

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The adhesion property of oxide film has great effects on the grinding quality and efficiency of ELID grinding. In this paper, adhesion strength model of oxide film is established, ELID grinding is conducted to nanometric cemented carbide and ordinary cemented carbide, ELID grinding force is measured, adhesive stress is calculated and the correctness of adhesion model is verified. The results show that the adhesion strength of oxide film is relatively greater, the transition from γ-Fe2O3to α-Fe2O3in the oxide film is relatively fuller and the polishing performance is relatively better while the grinding depth is smaller; with the deepening of grinding, the adhesion strength of oxide film reduces, the composition of the oxide film that transforms into α-Fe2O3is less and the polishing ability reduces. The adhesion model of oxide film well reflects the adhesion property of oxide film, and the application of this model can represent the distribution, shedding and updating of the oxide film on the surface of grinding wheel.

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Fan, Di. "A Study on the Polishing Mechanism of Silicon Carbide (SiC) Optic Surface." Advanced Materials Research 337 (September 2011): 474–78. http://dx.doi.org/10.4028/www.scientific.net/amr.337.474.

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This paper studies the polishing mechanism of SiC optic surface; it also introduces the grinding mechanism of ceramic material – indentation fracture model. In this paper, the model of SiC polishing in ideal condition is analyzed and the mechanism of SiC polishing in real state is studied.

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Bliedtner, Jens, Oliver Faehnle, Sebastian Henkel, Christian Schulze, and Martin Gerhardt. "Ultra-fine grinding as a prerequisite for producing polishable free-form optics." EPJ Web of Conferences 287 (2023): 09048. http://dx.doi.org/10.1051/epjconf/202328709048.

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In many conventional optical manufacturing processes, lapping is still a standard method to provide polishable surfaces. With the increasing use of CNC technology, efforts are being made to substitute the lapping process in the process chain. The paper presents studies that compare the lapping and fine grinding processes and provide an assessment of the subsequent polishing process. By using fine grinding with resin bond tools, polishing times can be significantly reduced and subsurface damage structures minimized. Ultra-fine grinding is also an important shaping process for the production of complex surface geometries, such as free-form optics.

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Riemer, Oltmann, and Yildirim Mutlugünes. "Thermo-Chemical Dressing of Coarse Grained Diamond Grinding Wheels." Advanced Materials Research 565 (September 2012): 211–16. http://dx.doi.org/10.4028/www.scientific.net/amr.565.211.

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This paper deals with a novel dressing method for coarse grained, single layered metal bonded grinding wheels based on the dynamic friction polishing. The diamond friction polishing technique utilizes the thermo-chemical reaction between a diamond sample and a metal tool rotating at high speed. Here, the tips of the diamond grains of a rapidly rotating grinding wheel are thermo-chemically flattened due to the contact with two slowly rotating steel calottes at predetermined friction pressure pd and grinding wheel velocity vsd. Dressing experiments have been carried out changing the friction pressure pd and the grinding wheel velocity vsd. The generated topography of the grinding wheel has been characterized by a confocal laser scanning microscope. Thus, the flattened grains with an average grain protrusion hk could be measured and the influence of the friction pressure and grinding wheel velocity on the dressing process is shown.

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Tian, Y. B., and H. Xu. "Development of High-Efficiency and Crack-Free Grinding Process for Chamfering of LCD Glass Edge." Advanced Materials Research 797 (September 2013): 240–45. http://dx.doi.org/10.4028/www.scientific.net/amr.797.240.

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Glass panels are one of core components in liquid crystal displays (LCDs). Grinding is an essential edge chamfering process in the preparation of LCD glass panel. With the size of glass panel increasing, both high productivity and high quality are required in the edge chamfering process. However, surface and subsurface defects are usually introduced to the chamfered glass edge under high-efficiency grinding conditions. In this work, we explored to develop crack-free grinding process while maintaining high chamfering efficiency with two designed diamond wheels for the chamfering of LCD glass edges. The grinding performance was compared and analyzed in terms of surface roughness and morphology. Normal and tangential grinding forces were measured to characterize the material removal characteristics. It was found that crack-free grinding/chamfering of LCD glass edge was achieved under high-efficiency grinding conditions i.e. wheel speed of 52.3 m/s, feed rate of 10 m/min, depth of cut of 50 μm. The developed grinding process is potential to reduce subsequent polishing time and cost or even replace subsequent polishing process for the preparation of LCD glass edge.

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Maróti, János Endre, and Péter János Szabó. "Investigation of Composite Behaviour of Lath Martensite." Acta Materialia Transylvanica 3, no. 2 (October 1, 2020): 90–93. http://dx.doi.org/10.33924/amt-2020-02-07.

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Abstract It is very important for our research that we are able to examine the orientation of packets and their relationship to directions of stress that cause plastic deformation. We use electron backscatter diffraction (EBSD) to achieve this. EBSD examination requires very careful sample preparation. In our work we have developed a sample preparation method for electron bakcscatter diffraction examination. In this study we present the method, which consists of multistage mechanical grinding, polishing and ion polishing. Optimal parameters for each steps (eg.: grinding, polishing and sputtering time, milling angle) were determined for lath martensitic steel, however, it could be used for other type of steel with minor adjustments.

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Zhong, Zhao-Wei. "Recent advances and applications of abrasive processes for microelectronics fabrications." Microelectronics International 36, no. 4 (October 7, 2019): 150–59. http://dx.doi.org/10.1108/mi-05-2019-0024.

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Purpose This paper aims to review recent advances and applications of abrasive processes for microelectronics fabrications. Design/methodology/approach More than 80 patents and journal and conference articles published recently are reviewed. The topics covered are chemical mechanical polishing (CMP) for semiconductor devices, key/additional process conditions for CMP, and polishing and grinding for microelectronics fabrications and fan-out wafer level packages (FOWLPs). Findings Many reviewed articles reported advanced CMP for semiconductor device fabrications and innovative research studies on CMP slurry and abrasives. The surface finish, sub-surface damage and the strength of wafers are important issues. The defects on wafer surfaces induced by grinding/polishing would affect the stability of diced ultra-thin chips. Fracture strengths of wafers are dependent on the damage structure induced during dicing or grinding. Different thinning processes can reduce or enhance the fracture strength of wafers. In the FOWLP technology, grinding or CMP is conducted at several key steps. Challenges come from back-grinding and the wafer warpage. As the Si chips of the over-molded FOWLPs are very thin, wafer grinding becomes critical. The strength of the FOWLPs is significantly affected by grinding. Originality/value This paper attempts to provide an introduction to recent developments and the trends in abrasive processes for microelectronics manufacturing. With the references provided, readers may explore more deeply by reading the original articles. Original suggestions for future research work are also provided.

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Yang, Wei, and Hui Ye. "The Study on Subsurface Damage Depth and Morphology of Optical Material." Advanced Materials Research 675 (March 2013): 227–30. http://dx.doi.org/10.4028/www.scientific.net/amr.675.227.

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The paper is mainly to research the subsurface damage depth and morphology on grinding and polishing substrates on optical materials, and analyze different subsurface damage morphologies caused by different processing technologies. The best etching solution is selected by experiments, grinding and polishing substrates are etched for proper time by divided stages. Use 120×optical microscope and scanning electronic microscope to observe subsurface damage morphology and Taylor Hobson PGI1240 to measure the etching depth to obtain the subsurface damage depth.

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Journal articles on the topic 'Grinding and polishing'

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