Relevant bibliographies by topics / Grid sample preparation

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  1. Journal articles
  2. Dissertations / Theses
  3. Book chapters
  4. Conference papers

Academic literature on the topic 'Grid sample preparation'

Author: Grafiati
Published: 28 June 2021
Last updated: 10 February 2022

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Journal articles on the topic "Grid sample preparation"

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Hauser, Janosch, Gustaf Kylberg, Mathieu Colomb-Delsuc, Göran Stemme, Ida-Maria Sintorn, and Niclas Roxhed. "A microfluidic device for TEM sample preparation." Lab on a Chip 20, no. 22 (2020): 4186–93. http://dx.doi.org/10.1039/d0lc00724b.

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We present a capillary-driven microfluidic single-use device that prepares a TEM grid with minimal user interaction. The user only initiates the sample preparation process, waits for about one minute and then collects the TEM grid, ready for imaging.
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Klebl, David P., Diana C. F. Monteiro, Dimitrios Kontziampasis, Florian Kopf, Frank Sobott, Howard D. White, Martin Trebbin, and Stephen P. Muench. "Sample deposition onto cryo-EM grids: from sprays to jets and back." Acta Crystallographica Section D Structural Biology 76, no. 4 (March 25, 2020): 340–49. http://dx.doi.org/10.1107/s2059798320002958.

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Despite the great strides made in the field of single-particle cryogenic electron microscopy (cryo-EM) in microscope design, direct electron detectors and new processing suites, the area of sample preparation is still far from ideal. Traditionally, sample preparation involves blotting, which has been used to achieve high resolution, particularly for well behaved samples such as apoferritin. However, this approach is flawed since the blotting process can have adverse effects on some proteins and protein complexes, and the long blot time increases exposure to the damaging air–water interface. To overcome these problems, new blotless approaches have been designed for the direct deposition of the sample on the grid. Here, different methods of producing droplets for sample deposition are compared. Using gas dynamic virtual nozzles, small and high-velocity droplets were deposited on cryo-EM grids, which spread sufficiently for high-resolution cryo-EM imaging. For those wishing to pursue a similar approach, an overview is given of the current use of spray technology for cryo-EM grid preparation and areas for enhancement are pointed out. It is further shown how the broad aspects of sprayer design and operation conditions can be utilized to improve grid quality reproducibly.
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Basham, P. B., and H. L. Tsai. "Advanced TEM sample preparation techniques for submicron Si devices." Proceedings, annual meeting, Electron Microscopy Society of America 53 (August 13, 1995): 516–17. http://dx.doi.org/10.1017/s0424820100138956.

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The use of transmission electron microscopy (TEM) to support process development of advanced microelectronic devices is often challenged by a large amount of samples submitted from wafer fabrication areas and specific-spot analysis. Improving the TEM sample preparation techniques for a fast turnaround time is critical in order to provide a timely support for customers and improve the utilization of TEM. For the specific-area sample preparation, a technique which can be easily prepared with the least amount of effort is preferred. For these reasons, we have developed several techniques which have greatly facilitated the TEM sample preparation.For specific-area analysis, the use of a copper grid with a small hole is found to be very useful. With this small-hole grid technique, TEM sample preparation can be proceeded by well-established conventional methods. The sample is first polished to the area of interest, which is then carefully positioned inside the hole. This polished side is placed against the grid by epoxy Fig. 1 is an optical image of a TEM cross-section after dimpling to light transmission.
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Vinson, Phillip K. "The preparation and study of a holey polymer film." Proceedings, annual meeting, Electron Microscopy Society of America 45 (August 1987): 644–45. http://dx.doi.org/10.1017/s0424820100127657.

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A holey carbon grid (HCG) consists of a TEM grid with a holey polymer film (HPF) attached to its surface and a carbon coating to provide mechanical stability and electrical conductivity. HCGs have found wide use in the preparation of liquid samples for cryo-TEM. These grids increase the number of sample sites by as much as three orders of magnitude and aid in the formation of fairly uniform, thin specimen films (< 250 nm). Several methods have been reported for the production of HPFs for specimen support. Unfortunately, most methods are unreliable, often producing films with pseudo-holes and large continuous film regions. Essential to improving any technique is an understanding of the process mechanisms involved. This paper describes a technique, modified from Refs. 1 and 2, for preparing HPFs and suggests a drying mechanism to explain the results.
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Tan, Yong Zi, and John L. Rubinstein. "Through-grid wicking enables high-speed cryoEM specimen preparation." Acta Crystallographica Section D Structural Biology 76, no. 11 (October 13, 2020): 1092–103. http://dx.doi.org/10.1107/s2059798320012474.

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Blotting times for conventional cryoEM specimen preparation complicate time-resolved studies and lead to some specimens adopting preferred orientations or denaturing at the air–water interface. Here, it is shown that solution sprayed onto one side of a holey cryoEM grid can be wicked through the grid by a glass-fiber filter held against the opposite side, often called the `back', of the grid, producing a film suitable for vitrification. This process can be completed in tens of milliseconds. Ultrasonic specimen application and through-grid wicking were combined in a high-speed specimen-preparation device that was named `Back-it-up' or BIU. The high liquid-absorption capacity of the glass fiber compared with self-wicking grids makes the method relatively insensitive to the amount of sample applied. Consequently, through-grid wicking produces large areas of ice that are suitable for cryoEM for both soluble and detergent-solubilized protein complexes. The speed of the device increases the number of views for a specimen that suffers from preferred orientations.
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Drulyte, Ieva, Rachel M. Johnson, Emma L. Hesketh, Daniel L. Hurdiss, Charlotte A. Scarff, Sebastian A. Porav, Neil A. Ranson, Stephen P. Muench, and Rebecca F. Thompson. "Approaches to altering particle distributions in cryo-electron microscopy sample preparation." Acta Crystallographica Section D Structural Biology 74, no. 6 (May 18, 2018): 560–71. http://dx.doi.org/10.1107/s2059798318006496.

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Cryo-electron microscopy (cryo-EM) can now be used to determine high-resolution structural information on a diverse range of biological specimens. Recent advances have been driven primarily by developments in microscopes and detectors, and through advances in image-processing software. However, for many single-particle cryo-EM projects, major bottlenecks currently remain at the sample-preparation stage; obtaining cryo-EM grids of sufficient quality for high-resolution single-particle analysis can require the careful optimization of many variables. Common hurdles to overcome include problems associated with the sample itself (buffer components, labile complexes), sample distribution (obtaining the correct concentration, affinity for the support film), preferred orientation, and poor reproducibility of the grid-making process within and between batches. This review outlines a number of methodologies used within the electron-microscopy community to address these challenges, providing a range of approaches which may aid in obtaining optimal grids for high-resolution data collection.
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Mulligan, Sėan K., Jeffrey A. Speir, Ivan Razinkov, Anchi Cheng, John Crum, Tilak Jain, Erika Duggan, et al. "Multiplexed TEM Specimen Preparation and Analysis of Plasmonic Nanoparticles." Microscopy and Microanalysis 21, no. 4 (July 30, 2015): 1017–25. http://dx.doi.org/10.1017/s1431927615014324.

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AbstractWe describe a system for rapidly screening hundreds of nanoparticle samples using transmission electron microscopy (TEM). The system uses a liquid handling robot to place up to 96 individual samples onto a single standard TEM grid at separate locations. The grid is then transferred into the TEM and automated software is used to acquire multiscale images of each sample. The images are then analyzed to extract metrics on the size, shape, and morphology of the nanoparticles. The system has been used to characterize plasmonically active nanomaterials.
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Rubinstein, John L., Hui Guo, Zev A. Ripstein, Ali Haydaroglu, Aaron Au, Christopher M. Yip, Justin M. Di Trani, Samir Benlekbir, and Timothy Kwok. "Shake-it-off: a simple ultrasonic cryo-EM specimen-preparation device." Acta Crystallographica Section D Structural Biology 75, no. 12 (November 22, 2019): 1063–70. http://dx.doi.org/10.1107/s2059798319014372.

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Although microscopes and image-analysis software for electron cryomicroscopy (cryo-EM) have improved dramatically in recent years, specimen-preparation methods have lagged behind. Most strategies still rely on blotting microscope grids with paper to produce a thin film of solution suitable for vitrification. This approach loses more than 99.9% of the applied sample and requires several seconds, leading to problematic air–water interface interactions for macromolecules in the resulting thin film of solution and complicating time-resolved studies. Recently developed self-wicking EM grids allow the use of small volumes of sample, with nanowires on the grid bars removing excess solution to produce a thin film within tens of milliseconds from sample application to freezing. Here, a simple cryo-EM specimen-preparation device that uses components from an ultrasonic humidifier to transfer protein solution onto a self-wicking EM grid is presented. The device is controlled by a Raspberry Pi single-board computer and all components are either widely available or can be manufactured by online services, allowing the device to be constructed in laboratories that specialize in cryo-EM rather than instrument design. The simple open-source design permits the straightforward customization of the instrument for specialized experiments.
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Ashtiani, Dariush, Alex de Marco, and Adrian Neild. "Tailoring surface acoustic wave atomisation for cryo-electron microscopy sample preparation." Lab on a Chip 19, no. 8 (2019): 1378–85. http://dx.doi.org/10.1039/c8lc01347k.

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Surface acoustic wave (SAW) atomisation is investigated in the context of cryo electron microscopy grid preparation. Here, the primary requirements are a reproducible and narrow plume of droplets delivering a low fluid flow rate.
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Walker, John F. "TEM Sample Preparation for the Semiconductor Industry — Part 3." Microscopy Today 4, no. 6 (August 1996): 24–25. http://dx.doi.org/10.1017/s1551929500060879.

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Part 1 of this series described how focused ion beam (FIB) microsurgery is used to successfully cross-section and prepare materialspecific samples for SEM and TEM analysis. In Part 2, we detailed how FIB is also the tool of choice to prepare site-specific samples, particularly for transmission electron microscopy (TEM) analysis. In this final article of this series, we describe actual sample preparation, cutting a selected area la size and mounting it on a grid for FIB preparation. Focused ion beams are very useful in preparing TEM specimens that have unique characteristics. In particular, the ability of such systems to image submicron features within a structure has allowed accurate identification of the precise place to make a membrane.
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Dissertations / Theses on the topic "Grid sample preparation"

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Sokol, Norbert. "Segmentace biologických vzorků v obrazech z kryo-elektronového mikroskopu s využitím metod strojového učení." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2021. http://www.nusl.cz/ntk/nusl-442577.

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Zobrazovanie pomocou kryo-elektrónovej mikroskopie má svoje nezastúpiteľné miesto v analýze viacerých biologických štruktúr. Lokalizácia buniek kultivovaných na mriežke a ich segmentácia voči pozadiu alebo kontaminácii je základom. Spolu s vývojom viacerých metód hlbokého učenia sa podstatne zvýšila úspešnosť úloh sémantickej segmentácie. V tejto práci vyvinieme hlbokú konvolučnú neurónovú sieť pre úlohu sémantickej segmentácie buniek kultivovaných na mriežke. Dátový súbor pre túto prácu bol vytvorený pomocou dual-beam kryo-elektónového mikroskopu vyvinutého spoločnosťou Thermo Fisher Scientific Brno.
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Book chapters on the topic "Grid sample preparation"

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Cohen, Robert. "Dancing on the Edge of a Volcano." In When the Old Left Was Young. Oxford University Press, 1993. http://dx.doi.org/10.1093/oso/9780195060997.003.0006.

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Herbert Hoover’s America was a dismal place in 1931. The president had failed to end or even mitigate the economic crisis, which began with the stock market crash of 1929. Unemployment had spiraled out of control; the number of jobless Americans had soared from 429,000 in 1929 to more than nine million in 1931. The Hoover White House had undermined its credibility in 1929 and 1930 by erroneously predicting economic recovery. But by late summer 1931 even some of the president’s closest congressional allies were glumly admitting that the end of the Depression was not in sight. Breadlines and shantytowns—dubbed “Hoovervilles” to mock the impotent president—had spread across the nation, grim testimony to the hunger and homelessness wrought by the Great Depression. Municipalities and private charities could not keep pace with the need of millions of unemployed Americans for economic assistance. Relief workers, local officials, and liberals on Capitol Hill in August 1931 called for a special session of Congress to legislate aid for the unemployed; they warned that without federal relief dollars, the coming winter would bring widespread starvation. That same month, as their elders in Washington fretted over how to ready themselves for another year of Depression, students at the University of California at Berkeley also began to prepare for the coming year. But for Berkeley students that preparation did not include discussions of hunger, poverty, or other Depression-related problems. As the fall 1931 semester began, fraternities arid football, sororities and parties, were the talk of the campus. In its opening editorial of the semester, the Daily Californian, Berkeley’s student newspaper, gave advice to new students, making it sound as if their most serious problems would be chosing the proper Greek house and deciding whether to participate “in sports, in dramatics or publications.” The editor also informed the freshmen that they were “fortunate to have a classmate in [football] coach Bill Ingram . . . [who will] bring back another ‘Golden Era’ for California athletics.”
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Conference papers on the topic "Grid sample preparation"

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Cerchiara, R. R., P. E. Fischione, M. F. Boccabella, and A. C. Robins. "Automated Sample Preparation of Packaged Microelectronics for FESEM." In ISTFA 2008. ASM International, 2008. http://dx.doi.org/10.31399/asm.cp.istfa2008p0280.

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Abstract A packaged device based on a ball grid array or other design presents a challenge to the failure analyst. Accessing one of the metal levels from the topside requires decapsulation by either a wet, predominantly dry (RIE) or a completely dry (mechanical) treatment. To reveal the details of the gate including the gate oxide, new approaches to selective etch delineation by RIE are required. This article presents an automated sample preparation method for packaged microelectronic materials by combining plasma cleaning, ion beam etching, reactive ion etching and ion beam sputter coating. A single etch gas chemistry was effective in phase delineation by RIE. Future work to further delineate the gate oxides could support accurate metrology by means of FESEM rather than field emission transmission electron microscope.
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Yu, Huisheng, Shuqing Duan, and Ming Li. "TEM Sample Preparation Methods for MEMS Floating Structure Analysis." In ISTFA 2014. ASM International, 2014. http://dx.doi.org/10.31399/asm.cp.istfa2014p0515.

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Abstract The MEMS structure has its particular character like hollow areas inside, and “floating” structures. Traditional TEM sample preparation method usually leads to distortion and dissociation defects of the floating structure. This paper introduces two innovative practical methods of TEM sample preparation using focused ion beam (FIB) for MEMS floating structure analysis. Method 1 used glass needle to lift out the separated film onto glue coated blank wafer; method 2 used in situ pick up system to lift out L- or C-shaped cut film onto TEM half-grid. And then the sample can be applied to normal TEM membrane preparation procedure.
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Hrnčíř, Tomáš, Marek Šikula, Pavel Doleže, and Claudio A. G. Savoia. "Variable Angle TEM Grid Holder for Advanced TEM Lamellae Preparation." In ISTFA 2019. ASM International, 2019. http://dx.doi.org/10.31399/asm.cp.istfa2019p0219.

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Abstract Multipurpose sample holder for advanced Transmission Electron Microscopy (TEM) sample preparation which reduces cost of the tool and most importantly simplifies the workflow is introduced. Following the current demand for user-friendly interface, semi-automated approach is aimed to be build up. Abilities to prepare advanced TEM lamellae in various geometries without rotary nanomanipulator and using various end-point detection signals are perceived as biggest advantages of this design.
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Chen, C. R. "Re-Thin a TEM Lamella by Using a Novel TEM Sample Preparation." In ISTFA 2007. ASM International, 2007. http://dx.doi.org/10.31399/asm.cp.istfa2007p0067.

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Abstract Conventional FIB ex-situ lift-out is the most common technique for precise TEM sample preparation. But this method has some limitations and so in-situ lift-out technique was developed to overcome these drawbacks. The in-situ lift-out technique lifts-out the sample and then attaches the sample to a half-cut copper grid inside the FIB chamber by mini-probing system. This paper introduces a novel and simple technique that can overcome the above problems and a wide application of TEM samples preparation. The examples highlighted here demonstrate the novel method of low cost and high image quality TEM sample preparation. The method can reduce the amorphous phenomenon on the sidewall of specimen; no shield effect was found during the reprocess of thinning by ion-miller; and no contamination induced by the ion-miller sputtering was formed.
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Rijpers, Bart, Dick Verkleij, and Eckhard Langer. "Automated TEM Sample Preparation on Wafer Level for Metrology and Process Control." In ISTFA 2007. ASM International, 2007. http://dx.doi.org/10.31399/asm.cp.istfa2007p0107.

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Abstract As the feature size of semiconductor technology shrinks, cross-section metrology becomes more and more challenging. The generation of cross section metrology data is important for the introduction of new advanced integration schemes, rapid yield learning, and continuous process control for stable manufacturing. In this paper an automated way of TEM cross-section preparation by FIB is described to ensure fast cycle time for preparation and analysis. A dual column FIB/SEM system is used to prepare TEM samples from multiple locations of a 300 mm wafer batch. Subsequently, the TEM lamella is transferred to a grid using an ex-situ lift-out station. Two dedicated applications are shown, a Focus Exposure Matrix (FEM) on patterned photo resist and a process control case study on an etched poly-silicon transistor gate.
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Lee, Jon C., and B. H. Lee. "The Versatile Application for In-situ Lift-out TEM Sample Preparation by Micromanipulator and Nanomotor." In ISTFA 2005. ASM International, 2005. http://dx.doi.org/10.31399/asm.cp.istfa2005p0322.

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Abstract The device features have shrunk to sub-micron/nano-meter range, and the process technology has been getting more complicated, so TEM has become a necessary tool for PFA imaging and element analysis. Conventional FIB ex-situ liftout is the most common technique for precise sample preparation. But this method has some limitations: samples cannot be reprocessed for further analysis; the carbon film supported grid affects the EDS analysis for carbon elements. A new installation will be introduced in this article, which is set up in FIB chamber for in-situ lift-out application. It not only overcomes the above problems, but also covers a wide application of TEM sample preparation.
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Ohnishi, T., H. Koike, T. Ishitani, S. Tomimatsu, K. Umemura, and T. Kamino. "A New Focused Ion Beam Microsampling Technique for TEM Observation of Site-Specific Areas." In ISTFA 1999. ASM International, 1999. http://dx.doi.org/10.31399/asm.cp.istfa1999p0449.

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Abstract A new focused-ion-beam (FIB) micro(μ)-sampling technique has recently been developed to facilitate transmission electron microscope (TEM) specimen preparation, while allowing chips or wafer samples to remain intact. A deep trench is FIB-milled to dig out a small, wedge-shaped portion of the sample (or a microwedge) from the samples area of interest, leaving a small, brige-shaped portion (or a microbridge) to support the microwedge. A metal needle is then manipulated into position for lifting the microwedge, i.e., the μ-sample. FIB-assisted deposition (AD) is used to bond the needle to the μ-sample. FIB-milling of the microbridge then separates the μ-sample from the chip or wafer. The separated μ-sample is mounted onto a TEM grid and secured using FIB-AD. The μ-sample is then FIB-thinned further, to a strip of about 0.1 μm thick. All of the above steps are accomplished under vacuum in the FIB system. This design permits a reliable and user-friendly environment for TEM specimen preparation, while keeping chips or wafer samples intact. It also permits operators to repeat TEM inspection and FIB-milling so that precise areas of interest may be made available for TEM inspection. Both cross-sectional and plan view TEM μ-sampling are feasible.
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Alvis, Roger, and Ron Kelley. "Site-Specific, Wide Field-of-View Cross-Sectional Sample Preparation, Imaging and Analysis in a Plasma Ion Source Helios DualBeam™ Microscope." In ISTFA 2014. ASM International, 2014. http://dx.doi.org/10.31399/asm.cp.istfa2014p0255.

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Abstract A Plasma-source focused ion beam (Helios PFIB) DualBeam™ microscope with sub-nanometer 1kV SEM resolution was used to investigate the structure of a state-of-the-art organic light-emitting diode (OLED) display. The capability of the Helios PFIB to produce and manipulate millimeter-scale samples for wide field-of-view crosssectional SEM analyses was demonstrated by lifting out a 570μm long by 40μm wide x 10μm deep and mounting it on a copper half-grid. An angled face was cut into the chunk and high-resolution back-scattered SEM tiles across the entire exposed face were automatically acquired within a modular automated processing system (MAPS).
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Davis, Thomas B., Mike Morrison, Thomas Krawzak, Jeff Reeder, and Tom Jiang. "Measurement Techniques for Thermally Induced Warpage to Predict Ball-Grid Array Package-on-Package Solder Compatibility." In ISTFA 2006. ASM International, 2006. http://dx.doi.org/10.31399/asm.cp.istfa2006p0488.

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Abstract The semiconductor industry is recognizing an increasing need to define the compatibility of various products joined in package-on-package configuration by solder reflow. Within the scope of the application, this paper discusses: sample preparation; warpage data collection methods; extraction of usable images and numerical data from the measurements; creation of visual warpage patterns for the top and bottom components of stacked package sets; mathematical determination of variation or separation of parts at critical locations during reflow; and finite element analysis of parts and processes to understand and predict reactions to design changes.
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Lim, Soon, Jian Hua Bi, Lian Choo Goh, Soh Ping Neo, and Sudhindra Tatti. "Failure Analysis of Sub-Micron Semiconductor Integrated Circuit Using Backside Photon Emission Microscopy." In ISTFA 1999. ASM International, 1999. http://dx.doi.org/10.31399/asm.cp.istfa1999p0109.

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Abstract The progress of modern day integrated circuit fabrication technology and packaging has made fault isolation using conventional emission microscopy via the top of the integrated circuit more difficult, if not impossible. This is primarily due to the use of increased levels and density of metal-interconnect, and the advent of new packaging technology, e.g. flip-chip, ball-grid array and lead-on-chip, etc. Backside photon emission microscopy, i.e. performing photon emission microscopy through the bulk of the silicon via the back of the integrated circuit is a solution to this problem. This paper outlines the failure analysis of sub-micron silicon integrated circuits using backside photon emission microscopy. Sample preparation, practical difficulties encountered and case histories will be discussed.
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