Relevant bibliographies by topics / Gate resistance thermometry

Academic literature on the topic 'Gate resistance thermometry'

Author: Grafiati
Published: 10 December 2022
Last updated: 28 January 2023

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Journal articles on the topic "Gate resistance thermometry"

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Pavlidis, Georges, Spyridon Pavlidis, Eric R. Heller, Elizabeth A. Moore, Ramakrishna Vetury, and Samuel Graham. "Characterization of AlGaN/GaN HEMTs Using Gate Resistance Thermometry." IEEE Transactions on Electron Devices 64, no. 1 (January 2017): 78–83. http://dx.doi.org/10.1109/ted.2016.2625264.

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Schwitter, Bryan K., Anthony E. Parker, Anthony P. Fattorini, Simon J. Mahon, and Michael C. Heimlich. "Study of Gate Junction Temperature in GaAs pHEMTs Using Gate Metal Resistance Thermometry." IEEE Transactions on Electron Devices 60, no. 10 (October 2013): 3358–64. http://dx.doi.org/10.1109/ted.2013.2278704.

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Pavlidis, Georges, Shamit Som, Jason Barrett, Wayne Struble, and Samuel Graham. "The Impact of Temperature on GaN/Si HEMTs Under RF Operation Using Gate Resistance Thermometry." IEEE Transactions on Electron Devices 66, no. 1 (January 2019): 330–36. http://dx.doi.org/10.1109/ted.2018.2876207.

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4

Cutivet, Adrien, Meriem Bouchilaoun, Bilal Hassan, Christophe Rodriguez, Ali Soltani, François Boone, and Hassan Maher. "Thermal Transient Extraction for GaN HEMTs by Frequency-Resolved Gate Resistance Thermometry with Sub-100 ns Time Resolution." physica status solidi (a), October 10, 2018, 1800503. http://dx.doi.org/10.1002/pssa.201800503.

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Book chapters on the topic "Gate resistance thermometry"

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Pavlidis, Georges, Brian Foley, and Samuel Graham. "Gate resistance thermometry: An electrical thermal characterization technique." In Thermal Management of Gallium Nitride Electronics, 201–21. Elsevier, 2022. http://dx.doi.org/10.1016/b978-0-12-821084-0.00018-4.

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Conference papers on the topic "Gate resistance thermometry"

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Schwitter, Bryan K., Anthony E. Parker, Simon J. Mahon, and Michael C. Heimlich. "Transient gate resistance thermometry demonstrated on GaAs and GaN FET." In 2016 IEEE/MTT-S International Microwave Symposium (IMS). IEEE, 2016. http://dx.doi.org/10.1109/mwsym.2016.7540035.

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2

Woodbury, Keith A., and Jonathan W. Woolley. "Inverse Heat Conduction Errors From Temperature Bias in Thin Film Sensors: Effect of Contact Resistance." In ASME 2011 International Mechanical Engineering Congress and Exposition. ASMEDC, 2011. http://dx.doi.org/10.1115/imece2011-65658.

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Abstract:
Thin platinum resistance thermometers (herein called thin film sensors) are often used in applications where rapid measurements of surface temperature are required. These gages are typically vapor deposited onto a non-conducting substrate surface and electrically connected with small wires through access holes to the surface. The time response of the gage is measured in milliseconds and surface temperature data obtained with this gage is often combined with a pseudo-inverse heat conduction algorithm to provide information about the surface heat flux. However, the thermal mass of the connecting wires, though small in absolute terms, is large compared to that of the thin film, and the capacitive effect of this mass gives rise to distortions in the temperature field in the area of the gage, resulting in a small error in the sensed temperature. This temperature error, when used in the inversion for heat flux, also results in an error. In this report, a detailed model of a particular thin film gage is used to compute the response of the sensor to supposed heating conditions. The effect of contact resistance between the parent material and the lead wire connections is investigated. The response of the sensor, with and without the contact resistance, and the undisturbed surface temperature are compared to estimate the temperature error. Finally, the error in the computed heat flux is determined. A simple approximate technique based on superposition is applied to account for the sensor dynamics and correct the error in the estimated heat flux.
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Bown, Nicholas W., Terrence M. Cain, Terence V. Jones, Philip P. Shipley, and Brian Barry. "In Flight Heat Transfer Measurements on an Aero-Engine Nacelle." In ASME 1994 International Gas Turbine and Aeroengine Congress and Exposition. American Society of Mechanical Engineers, 1994. http://dx.doi.org/10.1115/94-gt-244.

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This paper describes heat transfer measurements on the external surface of a Natural Laminar Flow (NLF) nacelle. The measurement technique employed temperature sensitive liquid crystals and platinum resistance thermometers (PRTs) to measure the surface temperature over an electrically heated pad. This gave an immediate visual indication of the transition location. The heat transfer distribution along the length of the pad has been determined and is compared with a simple theoretical model. Results are presented for the cruise condition of Mach 0.56 at an altitude of 6400m.
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