Dissertations / Theses on the topic 'Ga-Free'
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Hedlund, Daniel. "Ammonia free CdS buffer layerfor Cu(In,Ga)Se2 solar cells by chemical bath deposition." Thesis, Uppsala universitet, Fasta tillståndets elektronik, 2013. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-206786.
Full textPettersson, Jonas. "Modelling Band Gap Gradients and Cd-free Buffer Layers in Cu(In,Ga)Se2 Solar Cells." Doctoral thesis, Uppsala universitet, Fasta tillståndets elektronik, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-168618.
Full textBouschet, Maxime. "Détecteur quantique à superréseaux 'Ga-free' fonctionnant à haute température dans la totalité de la gamme spectrale du moyen infrarouge." Electronic Thesis or Diss., Université de Montpellier (2022-....), 2023. http://www.theses.fr/2023UMONS006.
Full textAn Increase of the operating temperature of the high performance cooled infrared (IR) detector focal plane arrays (FPAs) would induce a reduction in size, weight and power consumption of the cryocooler and allow a new class of applications where the needs in portability, compactness and energy autonomy of the IR cameras are essential. Currently, the photodetector technologies operating at high temperature (T= 150K), in particular the detector based on InAsSb, only cover a part of the midwave infrared (MWIR) domain, below 4.2µm. The extension of the cutoff wavelength to the full MWIR spectrum until 5µm for an operating temperature equal to 150K or higher, with no tradeoffs in performance, would present evident radiometric advantages. Combining the advantages of superlattice (SL) nanostructures in term of tuning of cut-off wavelength and the ones of XBn barrier structure device, the main objective of the thesis is to fabricate and study the first Ga-free InAs/InAsSb type-II superlattice (T2SL) photodetector. The Ga-free T2SL photodetector on GaSb substrate is used in a XBn configuration with a 5 µm cutoff wavelength and showing state of the art performance in terms of dark current and quantum efficiency
Hultqvist, Adam. "Cadmium Free Buffer Layers and the Influence of their Material Properties on the Performance of Cu(In,Ga)Se2 Solar Cells." Doctoral thesis, Uppsala universitet, Fasta tillståndets elektronik, 2010. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-133112.
Full textFelaktigt tryckt som Digital Comprehensive Summaries of Uppsala Dissertations from the Faculty of Science and Technology 717
Yao, Jianjun. "Structural Investigations of Highly Strictive Materials." Diss., Virginia Tech, 2012. http://hdl.handle.net/10919/37669.
Full textSong, Sha. "Geophysical characterization of gas hydrate systems of the South Shetland margin (Antarctica)." Doctoral thesis, Università degli studi di Padova, 2018. http://hdl.handle.net/11577/3426845.
Full textKlinke, Olaf Karl. "A bitopological point-free approach to compactifications." Thesis, University of Birmingham, 2012. http://etheses.bham.ac.uk//id/eprint/3470/.
Full textShen, Jianyun. "Thermodynamique des systèmes III-V, As-Ga-In et Al-As et analyse de leur épitaxie par jets moléculaires." Grenoble INPG, 1989. http://www.theses.fr/1989INPG0087.
Full textLin, Ger-Pin, and 林哲平. "Electromigration and Thermomigration in Ball Grid ArraySn-Zn-Ag-Al-Ga Lead-Free Solders." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/46125153766103878900.
Full text國立成功大學
材料科學及工程學系碩博士班
94
Eutectic Sn-Pb solder are mainly used to connect the electronic devices and printed circuit board. But, many countries have concerned about lead, which would pollute environment and hurt human health. The development of lead-free solders has become the most important issue, oxidation resistance, wettability, and other properties. This study investigated Sn8.5Zn0.5Ag0.01Al0.1Ga solder balls, which was developed by our lab. This study investigated the micro-structure of solder balls under electromigration and thermomigration effects. After assembly, we would apply different of current density to solder balls at 120℃. Electrons would impact the intermetallic compounds (AuZn3 and AgZn3) seriously in current crowding section. The intermetallic compounds would decompose. The atoms coming from intermetallic compound decomposition would move in the direction of temperature gradient and react to form intermetallic compounds. Without other atom to occupy the site in which intermetallic compounds decomposed, it would be observed voids. If the directions of thermomigration and electromigration were the same, Sn atom would be affected seriously by temperature gradient and electric impaction, and move in the direction. In this lead-free solder, the AgZn3-AuZn3-AgZn3 three layers compound would transfer and consume the Zn-rich phase in solder balls.
Yeh, Tsung-Kai, and 葉宗凱. "Investigations on the Oxidation Behavior of Sn-Zn-xAg-Al-Ga Lead-Free Solders." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/81591464031411708968.
Full text國立成功大學
材料科學及工程學系碩博士班
95
The Sn-Zn based solder exhibits unsatisfactory oxidation resistance. It is very prone to oxidation that decreases the life of products. This study investigated the oxidation behavior of Sn-8.5Zn-xAg-0.01Al-0.1Ga(x= 0~1.0wt%) solders at high temperatures and during heat/humidity exposure. During the experiment, some whiskers formed on the surface of the solder. Therefore, the observation of Sn whisker growth behavior was also investigated in this study. The microstructure of Sn-8.5Zn-xAg-0.01Al-0.1Ga(x=0~1.0wt%) shows that the AgZn3 compound was formed after the addition of Ag to the solder. The results of thermal gravimetric analysis(TGA) showed that the oxidation rate and oxide decreased as the Ag content of Sn-8.5Zn-xAg- 0.01Al-0.1Ga(x=0~0.5wt%) increase. The major composition of the oxide was ZnO. Because the oxidation layer blocked the reaction and diffusion between Zn and O2, the oxidation reaction reaches saturation after 25 minutes. The content of Zn-rich phase decreased in the matrix. After heat/humidity exposure at 85℃/85%RH(relative humidity), the major oxide formed are ZnO and a few SnO2. The thickness of oxidation layer increases with increasing Ag content. Sn whisker growth was driven by the compressive stress in the solder. The compressive stress is introduced due to the volume expansion when ZnO formed at the grain boundary of Sn.
Yeh, Tzu Hsuan, and 葉姿萱. "Ammonia-free ZnS buffer layer for Cu(In,Ga)Se2 solar cells by chemical bath deposition." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/6cze82.
Full text國立清華大學
材料科學工程學系
103
In this study, zinc sulfide thin films are prepared by ammonia-free chemical bath deposition that we can find out the useful parameters applying to CuIn1-xGaxSe2 thin film solar cell. Use the zinc sulfate and thioacetamide (TAA) to be the sources of zinc ions and sulfur ions, respectively. In contrast to conventional process, adding ammonia as a complexing agent. Fabrication of ammonia-free also without any complexing agents CBD-ZnS buffer layer for CIGS was attempted. The total thesis can divide into three parts to optimize the ammonia-free CBD-ZnS buffer layer devices. The first part: A novel chemical approach that applied at room temperature to clean and passivate at the same time surface of CIGSe absorber before buffer layer deposition. By pre-treatment on CIGS surface with TAA acidic solution, oxides can be removed and additional S-containing layer forms, inducing remarkable enhancement in the electrical performances of the CIGS solar cells. The second part: the deposition times are controlled. we can fabricate an ultrathin also less Zn(OH)2 formation ZnS thin film by ammonia-free CBD process to form a rigid p-n heterojunction ; Also, light soaking is not needed in this process to optimize photovoltaic performance.The X-ray photoelectron spectroscopy (XPS) is used and measured that indicating the ZnS thin films formed by ammonia-free process revealed higher sulfur-to-oxygen ratio than ammonia process one. 30 minutes is choose for the ideal reaction time. The efficiency 9.16% was achieved without light soaking treatment. The third part: After ammonia-free CBD-ZnS buffer layer deposition, two different kinds of post-treatment are investigated. By post air-annealing, zinc may diffusion into bulk CIGS that result in the formation of buried p-n homo-junction, significantly improved cell performaces from 1.28% to 9.16%. With extra oxygen plasma treatment, higher sulfur-to-oxygen ratio ZnS thin film obtained by ammonia process may be reduced. Further, combined both oxygen plasma treatment with the post air-annealing, devices using ammonia-free CBD-ZnS buffer layer can reach 10.16%, which is almost the same as that of the cells pepared by ammonia process with 60 minutes light soaking treatment.
Mix, Torsten. "Die L10-Struktur in Mn-Ga- und Mn-Al-Ga-Legierungen: magnetische Eigenschaften und Phasenumwandlungen." Doctoral thesis, 2018. https://tud.qucosa.de/id/qucosa%3A31848.
Full textKanyoka, Phillipa. "Water value and demand for multiple uses in the rural areas of South Africa : the case of Ga-Sekororo." Diss., 2008. http://hdl.handle.net/2263/27970.
Full textDissertation (MSc(Agric))--University of Pretoria, 2009.
Agricultural Economics, Extension and Rural Development
unrestricted
Wei, Shih-Yuan, and 魏士淵. "Study of Co-Sputtered Zn1-XMgXO as Cd-Free Buffer Layer on Cu(In,Ga) Se2 Solar Cell." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/47371453812545664505.
Full textWan-YiLin and 林宛儀. "Development and properties of Zn-Sn based Pb-free solder alloys(Zn-Sn-Ga-Al)for high temperature application." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/35590247550966214167.
Full textChen, Ping-hui, and 陳秉暉. "Effects of Adding Ga and Ge on the Anti-Oxidation and Tensile Behavior of Sn-9Zn Lead-Free Solder Alloy." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/76681403542696196420.
Full text國立成功大學
材料科學及工程學系碩博士班
95
This research used the Sn-9Zn lead-free solder alloy add the third element Ga in different content ( 0.4 , 0.6 , 0.8 wt . % ) and Ge ( 0.3 , 0.4 , 0.5 wt . %) separately to investigate the effects of adding Ga and Ge on the anti-oxidation and tensile behavior of Sn-9Zn lead-free solder alloy. The experimental results revealed that the microstructure of Sn-9Zn-xGa alloys after oil bath heat treatment at 120℃ for 2hr, with increasing the Ga content , the fraction of the irregular region formed with the coarse Zn particles arranged irregularly and β-Sn increased ; the fraction of the regular region formed with the aligned acicular Zn particles and β-Sn decreased. The microstructure of Sn-9Zn-xGe alloys after oil bath heat treatment at 120℃ for 2hr revealed that besides the pre-eutectic Zn and Sn-Zn eutectic region, there were deep gray Ge phase. The amount and the size of the Ge phase increased with increasing the Ge content. On the respect of the solid state surface oxidation, the oxidation occur on the surface of S9ZA, 0.4GaA and 0.4GeA were ZnO and few SnO2. Because the Ga was dissolved in both Sn and Zn phases and the activity decreased , the adding of Ga improved the oxidation of Sn-9Zn without any heat treatment. However, in the situation of the heat treatment at 120℃ in the air for 2hr, the oxide films on the surface were not easy formed to protect the base metal, the thickness of the oxide layer increased greatly. Because Ge segregated in the grain boundary and hindered the diffusion of Zn2+, the oxide layer was reactively thin. In the situation of the heat treatment at 120℃ in the air for 2hr, because the ZnO on the surface to protect the base metal, the thickness of the oxide layer didn’t increase. On the respect of the solidify surface oxidation, the experimental results revealed that S9ZR, 0.4GaR, 0.4GeR which were reflowed at 260℃ for 15min and cooled at RT , 5 times, there were ZnO on the surface and no tin oxides. When solidifying, because the Ga was dissolved in both Sn and Zn phases and hindered the diffusion of ions of metals .It caused the time of forming the zinc oxides on the surface increased and the zinc oxides became thick. About the adding of Ge, because Ge was not dissolved in both Sn and Zn phases, the zinc oxides formed on the surface quickly, and after solidifying the Ge segregated in the grain boundary and hindered the diffusion of Zn2+, the oxide layer was thinner than S9ZR. There was dynamic recrystalization phenomenon in the Sn-9Zn-xGa and Sn-9Zn-xGe tensile test at RT and 120℃. On the respect of tensile deformed resistance, because the solid solution effect, the tensile deformed resistance increased with increasing of Ga content at room temperature and the solid solution effect slight improved the tensile deformed resistance at high temperature (120℃). About the adding of Ge, because the Ge segregated in the grain boundary and the Ge phase improved the tensile deformed resistance but didn’t increase obviously with increasing Ge content. There was no help at all on tensile deformed resistance by adding Ge at high temperature (120℃).
Qiu, Yu-Tang, and 邱郁棠. "Preparation and analysis of Cu(In,Ga)Se2 thin-film made by co-sputtering for CdS-free solar cell device." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/3hj5rb.
Full text國立臺灣科技大學
材料科學與工程系
104
In recent years, confronting with the problem of energy crisis, Cu(InGa)Se2 or CIGSe thin-film solar cells are gradually getting researchers’ attentions. In this field, solar cell device almost uses CdS as a buffer layer and ZnO as a n type one. Because CdS is toxic, GaN and InGaN in this work have been taken to replace CdS/ZnO for designing different solar cell structures. In the study, CIGSe precursor thin films were prepared by sputtering, followed by selenization with different annealing temperatures. The characterizations of thin films were analyzed by field-emission scanning electron microscopy (FE-SEM) epuipped with an energy dispersive X-ray spectrometer (EDS), X-ray diffractometry (XRD), and Hall measurement. Different Indium contents for InxGa1-xN that were used as n type layers for solar cell devices were also prepared by sputtering. The performance of the devices was then evaluated under the standard AM 1.5 illumination. The results showed that CIGSe thin films after made by co-sputtering and a two-step selenization process at 600oC had better surface morphology with the grain size of 1.0 – 1.5 m. FE-SEM, XRD and EDS analyses demonstrated that the films were single phase with the close component of CuIn0.7Ga0.3Se2 even selenization at different temperatures. Then, InxGa1-xN thin films made by RF sputtering replaced CdS as the buffer layer for the solar cell structure. CdS-free CIGSe/In0.15Ga0.85N/ZnO solar cell with the structure I had the best conversion efficiency of 1.04% conversion, while it was 3.07% for the traditional CIGSe/CdS/ZnO solar cell structure.
Li, Kuan-Ting, and 李冠廷. "Inhibiting Intermetallic Compound Growth by Minor Ga or Pd Addition And Electromigration Failure by Introducing PdSn4 Layer in Lead-free Solder Joints." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/js76ca.
Full text國立中正大學
化學工程研究所
103
With the development of miniaturization in electronic products, ENIG has been regarded as a surface treatment in recent years. The black pad problem was usually occur in ENIG technique and Ni will dissolve into the solder under electron current stressing, the electroless Pd can solve the black pad problem and has better wettability. In this research, we thickened Pd layer and investigated inhibition of electromigration failure by introducing PdSn4 layer in lead-free solder joints. Originally the reaction was formed PdSn4 phase, but Ni was dissolved in the reflow process. So PdSn4 phase was transformed into NiSn4 phase. When the reaction time reached to 4 days, the reaction phase is as the same as solid/solid reaction at the interface 1. At the interface 2, the Ni3Sn4 phase was formed. Because of the fast consumption of Ni substrate, voids exist at the irregular interface 2 and a lot of NiSn4 phase was drifted to the Sn solder. This result was similar to the previous electromigration study on the Sn/Ni system. Therefore, using thin Pd layer could not retard Ni diffusion either. As the thickness of Pd layer increased to 3μm, the layered structure NiSn4 phase was maintained when the reaction time reached to 5 days. But when reaction time increased to 10 days, much Ni substrate was consumed. The enough Pd content can be difficult to be affected by the current stressing but was easily affected by the Ni substrate, so this study used Cu layer to protect the Pd layer. When reaction time reached to 10 days, the reaction phase, PdSn4, remained layered structure. However, when it converted to NiSn4 phase, the Ni atoms were migrated into the Sn solder by interstitial diffusion and grain boundary diffusion. In summary, the PdSn4 phase was a good diffusion barrier. The Pd plating has a significant impact on the solder joints. In the second part, we studied the solid/solid and liquid/solid reactions between the trace added Ga solder and Cu or Ni substrate. For solder within low concentration of Ga, the reaction phase did not change. When the Ga concentration increased, its reaction phase was converted to Cu-Ga and Ni-Ga phase which had good inhibitory in the initial reaction period, but when reaction time increased, the phase was converted to Cu-Sn and Ni-Sn phase. At that time, there was no suppression effect on the reaction rate. At the Ag (10μm)/Cu case, the reaction phase was dissolved at the interface quickly during liquid/liquid reaction. During the solid/solid reactions, the Ag3Sn phase which can do a diffusion barrier was formed at the interface. In Co and Pd case, liquid/solid and solid/solid reaction, the CoSn3 phase was formed when the solder has low concentration of Ga. With the concentration of Ga increasing, the CoSn3 phase generation rate decreased. For higher concentrations of Ga, the CoSn3 phase was transformed into the CoGa phase and the reaction rates were extremely slow. When changing into the Pd substrate, the PdSn4 phase was formed in the reactions and the reaction rate of the PdSn4 phase decreased with the concentration of Ga increasing. These results suggested that Ga in solder had bad suppressed IMC effect at the Cu and Ni substrate, but had good suppression effect at the Co and Pd substrate.
Masekela, Mahlodi Esther. "Assessment of the factors that influence firewood use among households in Ga-Malahlela Village, Limpopo Province." Diss., 2019. http://hdl.handle.net/10500/26492.
Full textAccess to firewood and other affordable energy sources is essential to the livelihoods of rural households in developing countries. Studies have been conducted to understand the reasons behind an extensive reliance on firewood in rural areas, especially in developing countries, despite improved electrification rates and a number of government policies introduced to encourage rural households to switch from traditional to modern fuels. This study aimed at assessing and thus understand the factors influencing the use of firewood by households in Ga - Malahlela village in Limpopo Province. Limited research has been conducted on firewood use, subsequent to improved electrification in rural areas in South Africa, hence it was to shed light on this little-explored subject on which the study was carried out. The assessment was based on household demographics and household energy use patterns, with a structured questionnaire being utilised to arrive at a detailed understanding of the factors that drive firewood use. It was established that firewood was still used to a significant degree, to satisfy household energy needs such as cooking, water heating and space heating. This was mainly due to the socioeconomic status of households. Socio-economic factors such as income, education level, household size and preference were found to be the factors exerting the greatest influence on the use of firewood among households in the study area. Psychological variables and the geographical location of the study area were also shown to promote the use of firewood. The study further revealed that, as indicated in the reviewed literature, households in the study area fuel stack and do not ascend the energy ladder. The reviewed literature further indicated that not all factors have equivalent significance in determining the behaviour and pattern of household energy use. This indicates that energy sources such as firewood are not completely discarded but are instead used in conjunction with modern energy sources such as electricity. In conclusion, this study established that despite the availability of electricity, as a result of poverty and the lack of free basic services such as free basic electricity, reliance on firewood in rural areas will continue.
Go hwetša dikgong le methopo ye mengwe ya dibešwa tšeo di rekegago go bohlokwa go mekgwa ya malapa a dinagamagaeng go hwetša dilo tše bohlokwa tša bophelo dinageng tšeo di hlabologago. Dithutelo di phethagaditšwe go kwešiša mabaka ao a thekgago kholofelo go dikgong mafelong a dinagamagaeng a dinaga tšeo di hlabologago le ge go na le ditekanyo tše di kaonafaditšwego tša tlhagišo ya mohlagase le palo ya melaotshepetšo ya mmušo yeo e tsebišitšwego go tutuetša malapa a dinagamagaeng go fetoga go tloga go dibešwa tša sekgale go iša go tša sebjale. Thutelo ye e ikemišeditše go lekola ka gona go kwešiša mabaka ao a huetšago malapa a Motsaneng wa Ga-Malahlela ka Profenseng ya Limpopo go diriša ya dikgong. Dinyakišišo tše lekantšwego di phethagaditšwe ka ga tirišo ya dikgong ka morago ga tlhagišo ya mohlagase yeo e kaonafaditšwego mafelong a dinagamagaeng ka Afrika Borwa, gomme e be e swanetše go fa tshedimošo ka ga hlogotaba yeo e hlohlomišitšwego gannyane gore thutelo ye e phethagatšwe. Tekolo ye e theilwe go dipalopalo ka ga malapa setšhabeng le mekgwa ya malapa ya go dirišwa dibešwa, ka go diriša lenaneopotšišo leo le beakantšwego gore go fihlelelwe kwešišo ye e hlalošago ka botlalo mabaka ao a hlohleletšago tirišo ya dikgong. Go lemogilwe gore dikgong di sa dirišwa ka bontši bjo bo bonagalago go kgotsofatša dinyakwa tša malapa tša enetši tše bjalo ka go apea, go ruthetša meetse le go ruthetša lefelo. Se se be se swanela gagolo ka lebaka la boemo bja ka moo ekonomi e amago tšwelopele ya malapa. Mabaka a ka moo ekonomi e amago tšwelopele ya setšhaba a go swana le ditseno, boemo bja thuto, bogolo bja lelapa le tšeo di ratwago go hweditšwe go ba mabaka ao a hlohleletšago khuetšo ye kgolokgolo go tirišo ya dikgong gare ga malapa thutelong ye. Dielemente tšeo di ka fetolwago le lefelo tikologong ye e itšeng tša thutelo le tšona di bontšhitšwe go godiša tirišo ya dikgong. Thutelo ye gape e utollotše gore, bjalo k age go šupilwe dingwalong tšeo di lekotšwego, malapa a lefelong la thutelo a latela mekgwa ya dibešwa tša mehutahuta gomme ga a latele manamelo a enetši. Dingwalo tšeo di lekotšwego di laeditše go ya pele gore ga se mabaka ka moka ao a nago le bohlokwa bjo bo lekanago go šupeng boitshwaro le mokgwa tša tirišo ya enetši ka malapeng. Se se šupa gore methopo ya enetši ye bjalo ka dikgong ga se ya tlogelwa ka gohlegohle eupša e dirišwa mmogo le methopo ya sebjale ya enetši ye bjalo ka mohlagase. Go ruma, thutelo ye e utollotše gore le ge go na le mohlagase, ka lebaka la bohloki le tlhaelo ya ditirelo tša motheo tša mahala tše bjalo ka mohlagase wa motheo wa mahala, kholofelo go dikgong dinagamagaeng e tlo tšwela pele.
U swikelela khuni na zwiṅwe zwiko zwa fulufulu zwine zwa swikelelea ndi zwa ndeme kha u tsireledza zwo teaho zwa vhutshilo kha miṱa ya vhupo ha mahayani kha mashango o no khou bvelelaho. Ngudo dzo farwa u itela u pfesesa zwiitisi zwa u ḓitika zwihulwane nga khuni kha vhupo ha mahayani kha mashango ane a khou ḓi bvelela zwi si na ndavha na u khwiniswa ha u dzheniswa ha muḓagasi na tshivhalo tsha mbekanyamaitele dza muvhuso dzo ḓivhadzwaho u ṱuṱuwedza miṱa ya vhupo ha mahayani u bva kha u shumisa zwivhaswa zwa kale u ya kha zwa ano maḓuvha. Ngudo iyi yo livhiswa kha u asesa na u pfesesa zwiṱaluli zwine zwa ṱuṱuwedza u shumiswa ha khuni nga miṱa ya Muvhunduni wa Ga-Malahlela Vunduni ḽa Limpopo. Ṱhoḓisiso dzi si nngana dzo itwa nga ha u shumiswa ha khuni hu tshi tevhela u dzheniswa ha muḓagasi vhuponi ha mahayani Afurika Tshipembe, ho vha u bvisela khagala nga ha zwiṱuku zwo wanululwaho kha thero heyi ye ngudo ya i bveledzisa. U linga ho vha ho ḓisendeka nga ngudamirafho ya miṱa na kushumisele kwa fulufulu miṱani, hu na mbudzisombekanywa dzo dzudzanywaho dzo shumiswaho u swikelela kha u pfesesa nga vhuḓalo zwiṱaluli zwine zwa ta u shumiswa ha khuni. Ho dzhielwa nṱha uri khuni dzi kha ḓi shumiswa nga maanḓa u ḓisa ṱhoḓea dza fulufulu miṱani u fana na u bika, u vhilisa maḓi na u dudedza vhudzulo. Hezwi zwo tea nga maanḓa kha vhuimo ha matshilisano a zwa ikonomi miṱani: zwiṱaluli zwa ikonomi ya matshilisano zwi ngaho sa mbuelo, vhuimo ha pfunzo, vhuhulu ha muṱa na zwo no takalelwa ho wanwa uri ndi zwiṱaluli zwine zwa shumisa ṱhuṱhuwedzo khulwane ya u shumiswa ha khuni vhukati ha miṱa ya vhupo ha ngudo. Variabuḽu dza saikhoḽodzhikhaḽa na vhupo ha ḓivhashango zwa vhupo ha ngudo zwo sumbedziswa u ṱuṱuwedza u shumiswa ha khuni. Ngudo yo isa phanḓa na u wanulusa uri, sa zwo sumbedziswaho kha maṅwalwa o sedzuluswaho, miṱa kha vhupo ha ngudo i kuvhanganya fulufulu ngeno hu sina u gonya ha tshanduko ya kushumisele kwa fulufulu. Maṅwalwa o sedzuluswaho o sumbedzisa a tshi i sa phanḓa uri a si zwiṱaluli zwoṱhe zwine zwa vha na ndeme i linganaho kha u ta vhuḓifari na kushumisele kwa fulufulu miṱani. Hezwi zwi sumbedza uri zwiko zwa fulufulu zwi ngaho sa khuni a zwo ngo laṱelwa kule tshoṱhe fhedzi zwi shumiswa zwo ṱanganyiswa na zwiko zwa fulufulu zwa ano maḓuvha zwi ngaho sa muḓagasi. Ri tshi pendela, ngudo iyi i ta uri na musi muḓagasi u hone, nga nṱhani ha vhushayi na ṱhahelelo ya tshumelo dza muḓagasi wa mahala wa mutheo u fana na muḓagasi wa mahala wa mutheo, u ḓitika nga khuni vhuponi ha mahayani hu ḓo ḓi bvela phanḓa.
Department of Environmental Science
M.A. (Environmental Science)