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Journal articles on the topic 'Fraunhofer IZM'

Author: Grafiati

Published: 4 June 2021

Last updated: 19 February 2022

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1

Capecchi, Simone, Tanya Atanasova, Reiner Willeke, Michael Parthenopoulos, Christian Pizzetti, and Jerome Daviot. "Low Undercut Ti Etch Chemistry for Cu Bump Pillar under Bump Metallization Wet Etch Process." Solid State Phenomena 255 (September 2016): 291–96. http://dx.doi.org/10.4028/www.scientific.net/ssp.255.291.

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This paper demonstrates how a low undercut Ti etchant developed by Technic France can be successfully introduced in a high volume manufacturing Fab for etching the under bump metallization (UBM). The Ti etchant has been tested on 300mm wafer production equipment in GLOBALFOUNDRIES. The Ti etchant evaluation has been carried out in collaboration with the Fraunhofer IZM-ASSID institute.

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2

Ramm, Peter, Armin Klumpp, Josef Weber, Thomas Fritzsch, Maaike Taklo, Nicolas Lietaer, Walter De Raedt, et al. "The European 3D Technology Platform (e-CUBES)." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (January 1, 2010): 000446–501. http://dx.doi.org/10.4071/2010dpc-ta12.

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The European 3D technology platform that has been established represents the ensemble of 3D integration technologies which were developed within the e-CUBES project [http://www.ecubes.org]. It became evident that the fabrication of e-CUBES with their need for high-level miniaturization can only be realized by system integration technologies which use the third dimension. The main objective is to provide 3D integration technologies which on the one hand increase the performance sufficiently and at the same time allow for low cost fabrication in order to achieve products with a large market potential. The work was focussed on the requirements coming from application demonstrators. However, other requirements set by taking the visionary approach of developing strongly miniaturized micro/nano-systems were also a major task of the work. Research and technological development was necessary in the following fields in order to achieve the objectives. Seven corresponding technologies were successfully developed building a European platform on 3D Integration. This is considered to be essential output of the e-CUBES project. These are in the 3D integration categoriesVertical System Integration (3D-SOC): Fraunhofer IZM-M's Through-Si Via (TSV) Technology (ICV-SLID) and SINTEF's Hollow Via & Gold Stud Bump Bonding (HoViGo),Chip Stacking (3D-WLP): IMEC / Fraunhofer IZM's Thin-Chip-Integration Technology (TCI/UTCS) and CEA-LETI's Via Belt Technology, and3D Assembly (3D-SIP): 3D-PLUS' High Performance Package-in-Package (HiPPiP) and Wireless Die-on-Die (WDoD) Technologies, as well as Tyndall's Submicron Wire Anisotropic Conductive Film Technology (SW-ACF). Four optimized 3D integration technologies were successfully used in the development of three e-CUBES application demonstrators: Thin-Chip-Integration technology (TCI/UTCS) for Philips' Health & Fitness demonstrator, TSV technology ICV-SLID and HoViGo for Infineon's Automotive demonstrator (TPMS) and Package-in-Package technology HiPPiP for Thales' Aeronautic demonstrator. The 3D integration technologies which form part of the established e-CUBES platform will be presented including key characteristics, critical dimensions, electrical parameters and adaptability to new applications.

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Becker, Karl-F., T. Braun, J. Bauer, L. Böttcher, A. Ostmann, B. Pahl, J. Haberland, et al. "Heterogeneous integration – packaging on and in organic substrates." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000142–51. http://dx.doi.org/10.4071/isom-2011-ta5-paper1.

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Decreasing the bill of materials for an electronic device saves development time, money and space. The integration of more and more functions not only on the chip (SoC; system on chip) but also in the package (SiP; system in package) is therefore a natural and very important step in the devolvement of micro electronics. Realizing the goal of Ambient Intelligence requires low cost system solutions where all necessary components are integrated. The future will be a combination of “System on Chip”- and “System in Package” solution called as “Heterogeneous Integration”. As far as technical and economical feasible “System on Chip” solutions will be chosen, the adoption to various applications and the integration of highly complex systems containing non-electronic functions will be carried out more cost efficiently, with a high degree of miniaturization and flexibility in “Heterogeneous Integration”. “Heterogeneous Integration” integrates several chips or components in one package (system in package or SiP) and carries out the interface to the application environment. This paper will summarize a variety of heterogeneous integration technologies researched at Fraunhofer IZM with a strong focus on embedding in printed circuit boards and embedding in molded reconfigured wafers – looking also on the requirements of sensor packaging. Not only the technological principles but also specific material demands and necessary processes as 3D routing and also 3D interconnection will be discussed in detail. Application examples and technology demonstrators from will be shown to demonstrate technological potential and challenges of miniaturized heterogeneous integration by embedding from a European perspective.

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Boettcher, Mathias, Frank Windrich, and M.-J. Wolf. "High Density Interposer – Challenges and Opportunities." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000046–49. http://dx.doi.org/10.4071/isom-2015-tp23.

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Within “More than Moore” concepts interposer based packaging technologies, known as 2.5D/3D wafer level system integration, open up a wide range of miniaturized multi-functional system solutions. Pending of the final application dedicated interposer concepts have been developed for grabbing multiple active components, fabricated by different suppliers, using different technologies and materials, e.g. sensors, logic, radio frequency (RF) and memory-ICs, as well as passive devices, including antennas. In many cases the application of high density wiring, micro pillar (μ-pillar) interconnects as well as through silicon vias (TSVs) are required. Finally the interposer needs to provide the mechanical basement for system packages. In order to support system miniaturization and extension of system performance on one hand and to meet costs and time to market challenges on the other hand the development of modular interposer concepts as well as the application of dedicated basic interposer technologies is of high interest for R&D, prototyping and small volume applications. A short outline of high density interposer technologies developed and available at Fraunhofer IZM on 300mm substrates will be presented. Starting with a brief discussion of basic elements of interposers, several technology concepts developed and validated for high density interposer applications will be described. Challenges related to μ-pillar applications and high density wiring will be addressed and generic results will be presented. A high level comparison of challenges and opportunities will be shown and discussed. A brief outlook of future development work for system applications will be given.

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5

Becker, K. F., L. Georgi, R. Kahle, S. Voges, F. Brandenburger, J. Höfer, C. Ehrhardt, et al. "Heterogeneous integration of a miniaturized W-band radar module." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000766–70. http://dx.doi.org/10.4071/isom-2015-thp11.

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For radar applications, the W-band frequency range (75 – 110 GHz) is a good candidate for high-resolution distance measurement and remote detection of small or hidden objects in distances of 10 cm to ≫ 20 m. As electromagnetic waves in this frequency range can easily penetrate rough atmosphere like fog, smoke or dust, W-band radars are perfectly suited for automotive, aviation, industrial and security applications. Additional benefit is that atmosphere has an absorption minimum at 94 GHz, so relative small output power is sufficient to achieve long range coverage. By combining and enhancing knowledge from the disciplines of heterogeneous integration technology and compound semiconductor-technology, the Fraunhofer Institutes IAF, IPA and IZM developed a miniaturized and low cost 94 GHz radar module. Result of this approach is a highly miniaturized radar module built using a modular approach. The radar components are mounted on a dedicated RF-NF-hybrid PCB while the signal processing is done on a separate board stacked below. This hybrid RF-module is combined with highly integrated digital processing PCB via micro connectors in a way that the radar system and an adapted conical HDPE-lens fit into an aluminum housing of 42×80×27 mm3 with a weight of only 160 grams for the whole module. The paper will describe the technological basis for such a frequency modulated continuous wave [FMCW] W-band radar module and describe in detail the technological features that enabled the assembly of such a miniaturized but high-performance system. The module yields an evaluated distance measurement accuracy of 5 ppm (5 μm deviation per meter target distance) while its low weight and small dimensions pave the way for a variety of new applications, including mobile operation.

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6

Becker, Karl-Friedrich, Mathias Minkus, Jeremias Pauls, Volker Bader, Steve Voges, Tanja Braun, Gerd Jungmann, Hubert Wieser, M. Schneider-Ramelow, and K. D. Lang. "Non-Destructive Testing for System-in-Package Integrity Analysis." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000182–87. http://dx.doi.org/10.4071/isom-2017-wa15_077.

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Abstract The constant drive of microelectronics towards ever higher degrees of integration leads to a wide variety of concepts to yield smallest packages with maximized functionality – while side by side packaging leads to thinnest packages a small footprint can typically only be achieved by using component stacking approaches. This leads to truly heterogeneous packages where a variety of materials are forming a complex potpourri of building blocks with different thermo-mechanical properties. While building such an integrated package needs high precision material dosing, component placement and fine pitch wire bonding and is already challenging – the non-destructive analysis of such packages for process and reliability characterization is even trickier. Additionally this NDT approach can not only be applied to determine the initial device quality but also during accelerated ageing tests as a tool for intermediate testing to determine the effects of chip-package interaction. At Fraunhofer IZM a methodology has been applied to analyze a molded package using state of the art NDT equipment. A high resolution x-ray CT system by GE and a Gen6 CSAM system have been used as complimentary means to gain insight into a reference package that contains a four die stack assembled on PCB and is overmolded by a standard transfer molding process. To facilitate setting up the analysis procedure a variety of artefacts have been introduced to the package allowing the exact localization of layers and can be used to optimize the parameters for ultrasonic analysis for the variety of transducers used for package analysis. Additionally a simulation software is used to calculate the resulting ultrasound echoes for the different intra-package layers and the applicability of this tool for setting up an analysis procedure is provided. As a result the paper describes an analysis methodology for highly integrated packages that uses CSAM analysis and x-ray CT for device analysis, while cross sectioning is used to confirm these results. Ultrasound simulation is applied to explain the findings of analysis process setup and will be evaluated on its potential to transfer the analysis method to SiP packages with varying geometry.

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Jacquot, A., M. Rull, A. Moure, J. F. Fernandez-Lozano, M. Martin-Gonzalez, M. Saleemi, M. S. Toprak, M. Muhammed, and M. Jaegle. "Anisotropy and inhomogeneity measurement of the transport properties of spark plasma sintered thermoelectric materials." MRS Proceedings 1490 (2012): 89–95. http://dx.doi.org/10.1557/opl.2012.1670.

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ABSTRACTWe report on the development and capabilities of two new measurement systems developed at Fraunhofer-IPM. The first measurement system is based on an extension of the Van der Pauw method and is suitable for cube-shaped samples. A mapping of the electrical conductivity tensor of a Skutterudite-SPS samples produced at the Instituto de Microelectrónica de Madrid is presented. The second measurement system is a ZTmeter also developed at the Fraunhofer-IPM. It enables the simultaneous measurement of the electrical conductivity, Seebeck coefficient and thermal conductivity up to 900 K of cubes at least 5x5x5 mm3 in size. The capacity of this measurement system for measuring the anisotropy of the transport properties of a (Bi,Sb)2Te3SPS sample produced by KTH is demonstrated by simply rotating the samples.

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Zapara, Maksim, Eva Augenstein, and Dirk Helm. "Schädigungsarmes virtuelles Prozessdesign." Konstruktion 69, no. 07-08 (2017): IW14—IW16. http://dx.doi.org/10.37544/0720-5953-2017-07-08-58.

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Die Herstellung komplexer Bauteilformen für die Automobil- und Maschinenbaubranche erfordert mehrstufige Massivumformprozesse, bei denen die Werkstoffe häufig an die Grenze ihrer Verformbarkeit gebracht werden. Ein anwendungsorientiertes, schädigungsarmes Prozess- und Bauteildesign wird darum immer wichtiger. Dem steht entgegen, dass die üblichen Versagenskriterien meist nicht in der Lage sind, die Schädigungsentwicklung präzise genug vorherzusagen. Das Fraunhofer-Institut für Werkstoffmechanik IWM hat darum in einem Forschungsprojekt ein Modell entwickelt, das die tatsächlichen Schädigungs- und Versagensmechanismen im metallischen Werkstoff abbildet und so eine bessere Vorhersage von Schadensort und Versagenszeitpunkt bei Kaltmassivumformprozessen ermöglicht (Bild 1). Damit ist das Fraunhofer IWM-Team Massivumformung seinem Ziel einen großen Schritt näher, den Umformprozess bereits im Vorfeld so auszulegen, dass die angestrebte Bauteilqualität kosteneffizient und ressourcenschonend erreicht wird und dass der Anlauf der Produktion bei Herstellern von massivumgeformten Bauteilen ohne zusätzlichen Zeit- und Kostenaufwand realisierbar ist. Die erzielten Projektergebnisse können branchenübergreifend für verwandte Problemstellungen wie der Blechumformung oder im Bereich der Bauteilsicherheit eingesetzt werden.

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9

Weber, M., and D. Helm. "Bessere Werkstoffsimulation für Steckverbinder." wt Werkstattstechnik online 108, no. 01-02 (2018): 81–83. http://dx.doi.org/10.37544/1436-4980-2018-01-02-81.

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Die elektrisch leitenden Kupfer-Komponenten in Fahrzeugen sind zunehmend höheren elektrischen und thermomechanischen Beanspruchungen ausgesetzt. Damit sie weiterhin kostengünstig für eine zuverlässige Funktion ausgelegt werden können, hat das Fraunhofer-Institut für Werkstoffmechanik IWM ein neues Simulationsmaterialmodell entwickelt: Es bildet zeit- und temperaturabhängige Materialeffekte viel präziser als bisher ab und kann in gängigen Simulationsprogrammen eingesetzt werden.

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10

Beckmann, N., and M. Moseler. "Verschleiß im Reibkontakt durch Auffaltung der Metalloberfläche." wt Werkstattstechnik online 106, no. 01-02 (2016): 51–52. http://dx.doi.org/10.37544/1436-4980-2016-01-02-53.

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Produktions- und Betriebskosten vieler Branchen könnten sich drastisch verringern, würde der Verschleiß in metallischen Reibverbindungen reduziert. Um das zu erreichen, geht das Tribologie-Team des Fraunhofer-Instituts für Werkstoffmechanik IWM den Verschleiß-Entstehungsmechanismen auf den Grund. Ihre überraschenden Erkenntnisse liefern neue Hinweise, um die Metalloberflächen gemäß der mechanischen Erfordernisse mit gezielter Bearbeitung präzise gegen Verschleiß einzustellen.

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Farajian, M., J. Schubnell, and M. Luke. "Surface Engineering." wt Werkstattstechnik online 107, no. 01-02 (2017): 94–95. http://dx.doi.org/10.37544/1436-4980-2017-01-02-96.

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Für das neue Oberflächenbehandlungsverfahren von metallischen Bauteilen „Hochfrequenzhämmern“ haben Wissenschaftlerinnen und Wissenschaftler des Fraunhofer-Instituts für Werkstoffmechanik IWM eine Simulationsprozedur zur Vorhersage der Bauteillebensdauer entwickelt. Bisher war dieser Nachweis nur experimentell möglich. Mit dem neuen Werkstoffmodell können Bauteilentwickler beispielsweise im Automobil-, Flugzeug- und Turbinenbau die voraussichtliche Lebensdauer ihrer Bauteile exakter vorhersagen und so Leichtbaupotentiale besser ausschöpfen.

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Beckmann, Carla, Johannes Preußner, Tobias Kennerknecht, Majid Farajian, Michael Luke, and Jörg Hohe. "Mikrostrukturbasierte Beschreibung: Rissentstehung in Schweißverbindungen/Novel Microstructural Based Description: Crack Formation in Welded Joints." Konstruktion 70, no. 03 (2018): 64–69. http://dx.doi.org/10.37544/0720-5953-2018-03-64.

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Inhalt: Für die Auslegung von Bauteilen ist die Bewertung der Schädigungsinitiierung von ausschlaggebender Bedeutung. Insbesondere bei zyklischen Betriebsbeanspruchungen ist zu prognostizieren, ob die vorliegende Mikrostruktur weiteres Risswachstum eher begünstigt oder mindert. In Schweißverbindungen ist eine Bewertung aufgrund der prozessbedingt unterschiedlichen Gefügestrukturen besonders schwierig. An Mikroproben hat das Fraunhofer-Institut für Werkstoffmechanik IWM die Rissentstehungsphase in Schweißverbindungen untersucht und ein probabilistisches Bewertungskonzept entwickelt. Das neue Verfahren vermeidet unnötige Konservativitäten und liefert damit eine Verbesserung der Materialausnutzung.

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Seyler, T. "HoloPort – 3D-Inline-Messtechnik für die Werkzeugmaschine." wt Werkstattstechnik online 109, no. 05 (2019): 319–20. http://dx.doi.org/10.37544/1436-4980-2019-05-21.

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Präzisionsbauteile müssen häufig auf wenige Mikrometer genau produziert werden. Moderne Bearbeitungsmaschinen kommen dabei an ihre Grenzen. Ein neuartiger optischer Sensor des Fraunhofer-Instituts für Physikalische Messtechnik IPM sorgt für die notwendige Bauteilqualität: Der „HoloPort“-Sensor erfasst 3D-Strukturen flächig und mikrometergenau – direkt in der Werkzeugmaschine. Der Sensor ist so konzipiert, dass er zwischen zwei Bearbeitungsschritten wie ein Werkzeug von der Spindel gegriffen werden kann, um Oberflächendaten ohne neues Spannen berührungs- und kabellos zu erfassen. Seine interferometrische Genauigkeit ermöglicht erstmals sogar die direkte Regelung der Werkzeugmaschine.

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Butz, A., M. Zapara, and D. Helm. "Modellierung von hochfesten und hochduktilen Blechwerkstoffen aus TWIP-Stahl." wt Werkstattstechnik online 105, no. 01-02 (2015): 47–48. http://dx.doi.org/10.37544/1436-4980-2015-01-02-49.

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In den vergangenen Jahren wächst das Interesse an Stahlblechwerkstoffen mit hohen und höchsten Festigkeitsniveaus in der Automobilindustrie. Um den hohen Anforderungen gerecht zu werden, gleichzeitig aber auch eine ausreichende Formgebung zu ermöglichen, hat die Stahlindustrie eine neue Klasse von hoch- und höchstfesten Stählen entwickelt: die auf einem Fe-Mn-Legierungssystem basierenden TWIP-Stähle (Twinning Induced Plasticity). Das Fraunhofer-Institut für Werkstoffmechanik IWM entwickelt in einem laufenden Projekt mit fünf weiteren Partnern ein Werkstoffmodell, das die speziellen Eigenschaften dieser Werkstoffklasse berücksichtigt. Es soll eine genauere Auslegung von Blechumformprozessen und Bauteilbewertungen als bisher ermöglichen.

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Nüchter, A., D. Borrmann, P. Koch, M. Kühn, and S. May. "A MAN-PORTABLE, IMU-FREE MOBILE MAPPING SYSTEM." ISPRS Annals of Photogrammetry, Remote Sensing and Spatial Information Sciences II-3/W5 (August 19, 2015): 17–23. http://dx.doi.org/10.5194/isprsannals-ii-3-w5-17-2015.

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Mobile mapping systems are commonly mounted on cars, ships and robots. The data is directly geo-referenced using GPS data and expensive IMU (inertial measurement systems). Driven by the need for flexible, indoor mapping systems we present an inexpensive mobile mapping solution that can be mounted on a backpack. It combines a horizontally mounted 2D profiler with a constantly spinning 3D laser scanner. The initial system featuring a low-cost MEMS IMU was revealed and demonstrated at <i>MoLaS: Technology Workshop Mobile Laser Scanning at Fraunhofer IPM</i> in Freiburg in November 2014. In this paper, we present an IMU-free solution.

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Haufe, André, Andrea Erhart, and Alexander Butz. "A Constitutive Model for the Simulation of the Deformation Behavior of TWIP Steels." Key Engineering Materials 639 (March 2015): 411–18. http://dx.doi.org/10.4028/www.scientific.net/kem.639.411.

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Due to their high strength (tensile strength > 1GPa) in combination with an extreme ductility (failure strain 30-50%) TWinning Induced Plasticity–steels (TWIP-steels) can be considered as promising materials for the production of lightweight automotive components. The industrial application of TWIP-steels requires a fundamental experimental validation of the mechanical behavior as basis for an user-friendly but at the same time accurate constitutive framework and its implementation into commercial Finite Element codes. Related investigations and implementations in order to allow for the simulation of TWIP-steel forming processes are currently conducted within the research project “TWIP4EU”, executed as a cooperation of Fraunhofer - Institut für Werkstoffmechanik IWM in Freiburg (Germany), Salzgitter Mannesmann Forschung GmbH (Germany), Swerea KIMAB (Sweden), Faurecia Autositze GmbH (Germany / France), DYNAmore GmbH (Germany) and ESI GmbH Engineering System (Germany / France).The monotonic one-dimensional hardening behavior of TWIP-steels as a function of the twin volume fraction and dislocation density has been described by Bouaziz et al. (2008), Bouaziz et al. (2011). This model has been proven to be adequate for the description of the flow behavior of TWIP-steels and serves as basis for the constitutive model, presented here. This Bouaziz-model has been extended to a three-dimensional elasto-plastic formulation, including the influence of different loading conditions, anisotropy and kinematic hardening. The present paper deals with the implementation for solids and shells in the commercial Finite Element Code LS-DYNA®and appropriate validation simulations will be presented.

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"Planar micro fuel cells at Fraunhofer IZM." Fuel Cells Bulletin 2005, no. 11 (November 2005): 2. http://dx.doi.org/10.1016/s1464-2859(05)70797-5.

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"Sensoren erkennen Vereisung." BWK ENERGIE. 72, no. 03 (2020): 52. http://dx.doi.org/10.37544/1618-193x-2020-03-52.

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Die Augsburger LEW Verteilnetz GmbH (LVN), Betreiber des Stromverteilnetzes in Bayerisch-Schwaben und Teilen Oberbayerns, testet gemeinsam mit dem Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM und dem Fraunhofer-Institut für Elektronische Nanosysteme (Enas) das „sensorgestützte Autarke Stromsensorsystem“ (Astrose) deutschlandweit erstmalig zur Früherkennung von Vereisungen.

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"Fraunhofer IZM unveils economical production of micro fuel cells." Fuel Cells Bulletin 2007, no. 10 (October 2007): 5–6. http://dx.doi.org/10.1016/s1464-2859(07)70382-6.

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"Du Pont Semiconductor Packaging & Circuit Materials appoints Fraunhofer IZM as key partner." Microelectronics International 23, no. 3 (September 2006). http://dx.doi.org/10.1108/mi.2006.21823cab.005.

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21

Zangl, Stéphanie, and Carl-Otto Gensch. "Challenges for eco-design, energy efficiency and waste treatment of electrical and electronic products against the background of requests for exemptions following requirements of Article 5 (1) (b) RoHS Directive." elni Review, 2006, 36–41. http://dx.doi.org/10.46850/elni.2006.007.

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The EU Directive 2002/96/EC on restriction of use of certain hazardous substances in electrical and electronic equipment (RoHS Directive) stipulates that from 1st July 2006 onwards new electrical and electronic equipment put on the market will not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE). This restriction shall not apply to applications listed in the Directive’s Annex. Article 5 (1) (b) contains criteria for exempting materials and components from the abovementioned restriction in order to adapt the Annex to scientific and technical progress. Stakeholders have been invited to apply for exemptions from restriction of use according to the criteria in Article 5 (1) (b) against the background of adaptation of the Annex to scientific and technical progress. Prior to an amendment of the Annex, a public stakeholder consultation has to take place. Öko-Institut e.V. (the Institute for Applied Ecology) and Fraunhofer IZM (the Institute for Reliability and Microintegration) have been appointed by the European Commission to review the requests. This paper introduces the experience gained during this work, i.e. it outlines how the requirements of the RoHS Directive affect ecodesign, energy efficiency and waste treatment of domestic appliances and lighting (DAL) and what opportunities and drawbacks could arise as a consequence thereof.

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Rudolph, Catharina, Holger Wachsmuth, Irene Bartusseck, Michael Parthenopoulos, Loana Goerner, Mathias Boettcher, Juergen Grafe, and Juergen M. Wolf. "3D TSV - Influence of electrolyte composites and anneal temperatures to copper protrusion and planarization." MRS Proceedings 1560 (2013). http://dx.doi.org/10.1557/opl.2013.904.

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ABSTRACTThe motivation of this study is to provide answers to questions rising with 3D stacking of semiconductor chips. This includes the development and validation of concepts for 1) Through Silicon Via (TSV) formation, 2) metal layer build-up, 3) various types of assembly and packaging concepts and methods, as well as 4) process characterization.The investigations discussed here have been conducted on test wafer (ATEC2) developed by Fraunhofer IZM-ASSID. This design contains dedicated test structures which have been implemented to enable different unit processes and allows easy physical analysis. One of those test structures has been used to study the impact of the TSV density on the stress generation after TSV fill, anneal and CMP (chemical mechanical planarization) including copper protrusion and planarization behaviour. First results of the interaction between different TSV plating bath chemicals, anneal procedures and wafer bow obtained using test wafer ATEC1 were already presented during ICPT 2011.The process flow applied in this investigation was (1) TSV filling by electro-plating, (2) anneal, and (3) CMP. Physical analysis including inline metrology has been conducted between all process steps.The test wafers processed were divided into two groups according to the utilized copper plating bath chemistries. The copper TSV metallization was carried out by electro-chemical deposition in plating bath chemicals from two different suppliers. 3D microscope inspection was conducted for surface analysis. After TSV filling the copper surface shows protrusion on top of the TSVs and ring-shaped non-uniformities around the filled TSV. These structures were analysed after each step of the process flow.An anneal process was conducted after TSV plating. The annealing temperature was varied to investigate its influence on the material properties (protrusion caused by copper recrystallization) and the dip behaviour. The experiments were accomplished at 250 degree Celsius and above.Afterwards all test samples were processed by CMP with different selective slurries and analysed by AFM (atomic force microscopy) and optical methods. Bow and warpage measurements of the test wafers taken after each process step have been analysed.Our investigation has demonstrated the influence of the additives on the behaviour of different plating bath chemistries during temperature treatment (copper recrystallization) and therefore also the planarization behaviour after CMP.

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"Fraunhofer IMM develops CHP system with reformer/fuel cell." Fuel Cells Bulletin 2019, no. 12 (December 2019): 6. http://dx.doi.org/10.1016/s1464-2859(19)30508-5.

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"Feststoff-Elektrolyte." BWK ENERGIE. 72, no. 03 (2020): 25. http://dx.doi.org/10.37544/1618-193x-2020-03-25.

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Leistungsfähige, langlebige Energiespeicher sind für viele Zukunftstechnologien von zentraler Bedeutung. Am Fraunhofer-Institut für Werkstoffmechanik IWM konnte nun geklärt werden, wie Feststoff-Elektrolyte aus Keramik chemisch zusammengesetzt sein müssen, um gute Leistung in Lithium-Ionen-Batterien zu erbringen.

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"Hochoptimierte, fälschungssichere Stahlbauteile." Konstruktion 72, no. 05-06 (2020): IW10—IW11. http://dx.doi.org/10.37544/0720-5953-2020-05-06-68.

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Die Universität Paderborn, die Technische Universität Dortmund und das Fraunhofer IEM arbeiten seit Februar daran, durch Umformprozesse nicht nur die äußere Form von Stahl zu verändern, sondern auch gezielt die Eigenschaften anzupassen. Dieses Verfahren ermöglicht künftig eine effizientere, ressourcenschonende Herstellung optimierter, fälschungssicherer Stahlbauteile.

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"Fraunhofer IMM to install PowerCell S2 stacks for CHP supply." Fuel Cells Bulletin 2018, no. 10 (October 2018): 7–8. http://dx.doi.org/10.1016/s1464-2859(18)30367-5.

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"Raumportal für kollaborierende Roboter." Konstruktion 71, no. 10 (2019): 18–19. http://dx.doi.org/10.37544/0720-5953-2019-10-18.

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Die Firma RK Rose+Krieger und das Fraunhofer IEM sind seit vielen Jahren Partner bei der Umsetzung maßgeschneiderter Automatisierungslösungen. Das jüngste gemeinsame Projekt – ein dreiachsiges Raumportal für ein System zur roboterbasierten Bearbeitung – präsentieren die Partner auf der Motek. Ebenfalls erstmals in Stuttgart gezeigt wird eine Hubsäulenanbindung für Cobots.

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"Holographische Messtechnik im Produktionstakt." Konstruktion 69, no. 09 (2017): 48–49. http://dx.doi.org/10.37544/0720-5953-2017-09-48.

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Die Fehlertoleranz in der Automobilproduktion wird zusehends kleiner. Zulieferer stellte das bislang vor ein Problem: Es mangelt an Methoden, Mikrodefekte in der laufenden Fertigung zu erkennen. Bisher ist Sichtkontrolle das Mittel der Wahl, das jedoch für die linienintegrierte Messungen während der Herstellung ungeeignet ist. Mit der Entwicklung der produktionstauglichen digitalen Holographie beenden Forscher des Fraunhofer-Instituts für Physikalische Messtechnik IPM in Freiburg dieses Dilemma. Die digitale Holographie ermöglicht die vollflächige Prüfung aller Teile – und das im Sekundentakt.

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Bruenger, Wilhelm H., Rainer Kaesmaier, Hans Loeschner, and Reinhard Springer. "Status of Ion Projection Lithography." MRS Proceedings 636 (2000). http://dx.doi.org/10.1557/proc-636-d5.5.1.

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AbstractAs part of the European MEDEA project on Ion Projection Lithography (IPL), headed by Infineon Techologies, a process development tool (PDT) has been assembled at IMS, Vienna, with the final target of 50 nm resolution in a 12.5 mm exposure field at 4× demagnification. The ion-optical system (PDT-IOS) has been integrated, including the LEICA mask changer and a sophisticated metrology stage with in-situ diagnostics. In parallel, the LEICA wafer stage and the vacuum compatible off-axis ASML wafer alignment system have been realized. At the moment (Nov00) the He+ ion beam is aligned until the mask level. Ion beam proximity wafer exposures directly behind the mask show a performance of the illumination optics as predicted. 150 mm stencil masks with 125mm diameter, 3μm Si membranes, 50mm × 50mm design field, have been produced by IMS-Chips, Stuttgart. There is expectation to start the PDT-IOS test phase in Q1/01. Using the experimental ion projector at the Fraunhofer-Institute ISiT in Berlin recent resolution tests have demonstrated 50 nm lines and spaces without proximity effect in standard Shipley DUV resist UVIIHS at an exposure dose of 0.5 μC/cm2 for 75 keV He+ions. This was accomplished by 8.5 × demagnification of a new generation of stencil test masks from IMSChips. One further promising application of IPL is the resistless structuring of thin magnetic films to produce magnetic nano dots for future ≥ 100 G bit/in2 storage devices. A consortium of IBM Germany - Speichersysteme Mainz, Fraunhofer-ISiT, LEICA Jena and IMS-Chips in cooperation with IMS-Vienna has been formed to evaluate this technology.

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Dietzel, A., R. Berger, H. Grimm, C. Schug, W. H. Bruenger, C. Dzionk, F. Letzkus, et al. "Resistless Patterning of Magnetic Storage Media Using Ion Projection Structuring." MRS Proceedings 705 (2001). http://dx.doi.org/10.1557/proc-705-y3.4.

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AbstractCo/Pt thin film multilayers with strong perpendicular anisotropy and out-of-plane coercivities of 5-11 kOe were magnetically altered in areas of local ion beam interaction. The ion irradiations were performed by ion projection through silicon stencil masks fabricated by silicon on insulator (SOI) membrane technology. The ion projector at the Fraunhofer Institute for Silicon Technology (ISiT) was operated at 73 keV ion energy and with a 8.7- fold demagnification. After exposure to 3 × 1014Ar+/ cm2 magnetic islands smaller than 100 nm in diameter were resolved in the Co/Pt multilayersby means of magnetic force microscopy. The impact of different ion species (He+, Ar+ and Xe+) and ion energies (10 – 200 keV) on the multilayer structure was evaluated using Monte Carlo simulations. The ballistic interface intermixing was used to predict magnetic coercivity changes for various irradiation conditions. The simulations revealed that with 73 keV Ar+ and Xe+ ions the irradiation dose could be reduced by a factor of 100 and 400 respectively in comparison to 73 keV He+which was verified in the experiments. X-ray reflectivity measurements confirmed that the Co/Pt superlattice structure is slightly weakened during the irradiation and that the surface smoothness of the media is preserved. Using the Ion Projection Process Development Tool (PDT) at IMS-Vienna concentric data tracks including head positioning servo informations were patterned onto a 1” IBM microdrive™ glass disk which was coated with Co/Pt multilayers. In a single exposure step several tracks within an exposure field of 17 mm in diameter were structured by 2 × 1015He+/ cm2 at 45 keV using a 4- fold demagnification set-up.

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