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Journal articles on the topic 'Focused Ion Beam machining'

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Author: Grafiati

Published: 6 September 2023

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1

Allen, D. M., P. Shore, R. W. Evans, C. Fanara, W. O’Brien, S. Marson, and W. O’Neill. "Ion beam, focused ion beam, and plasma discharge machining." CIRP Annals 58, no. 2 (2009): 647–62. http://dx.doi.org/10.1016/j.cirp.2009.09.007.

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2

Hung, N. P., Y. Q. Fu, and M. Y. Ali. "Focused ion beam machining of silicon." Journal of Materials Processing Technology 127, no. 2 (September 2002): 256–60. http://dx.doi.org/10.1016/s0924-0136(02)00153-x.

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3

Young, Richard J. "Micro-machining using a focused ion beam." Vacuum 44, no. 3-4 (March 1993): 353–56. http://dx.doi.org/10.1016/0042-207x(93)90182-a.

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4

Chen, Yan, Li Bao An, and Xiao Xia Yang. "Recent Development of Focused Ion Beam System and Application." Advanced Materials Research 753-755 (August 2013): 2578–81. http://dx.doi.org/10.4028/www.scientific.net/amr.753-755.2578.

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Ultra-precision machining is used for many engineering applications where the traditional processes fail to work. Focused ion beam (FIB) technology is a very important part of the ultra-precision machining. It can realize the precise positioning, microscopic observation and micro machining. This paper introduces the FIB system and its application. FIB system contains ion source, focusing and scanning equipment and sample station. FIB technique has many unique and important functions. It is widely used in semiconductor device fabrication and circuit failure analysis. It can realize sample etching, imaging, thin film deposited, ion implantation and micromachining.

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5

Sun, Ji Ning, Xi Chun Luo, Wen Long Chang, and James M. Ritchie. "Fabrication of Freeform Micro Optics by Focused Ion Beam." Key Engineering Materials 516 (June 2012): 414–19. http://dx.doi.org/10.4028/www.scientific.net/kem.516.414.

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In this work, two kinds of freeform micro optics were successfully fabricated by using focused ion beam machining. A divergence compensation method was applied to optimize the machining process. Both dynamic variation of the sputter yield and the extra ion flux contributed by the beam tail were taken into consideration. Measurement results on the surface topography indicated that 3-fold improvement of the relative divergence was achieved for both optics when compared with conventional focused ion beam milling without any corrections. Furthermore, investigations on the influences of scanning strategies, including raster scan, serpentine scan and contour scan, were carried out. The serpentine scan is recommended for the fabrication of freeform optics by focused ion beam technology owing to the minimal beam travelling distance over the pattern area.

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6

Atiqah, N., I. H. Jaafar, Mohammad Yeakub Ali, and B. Asfana. "Application of Focused Ion Beam Micromachining: A Review." Advanced Materials Research 576 (October 2012): 507–10. http://dx.doi.org/10.4028/www.scientific.net/amr.576.507.

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Fabrication of micro and nanoscale components are in high demand for various applications in diversified fields that include automotive, electronics, communication and medicine. Focused ion beam (FIB) machining is one of the techniques for microfabrication of micro devices. This paper presents a review of FIB machining technology that include its parameter, responses, its important component systems, as well as the fundamentals of imaging, milling (etching) and deposition techniques. The application of FIB in micromachining is also presented.

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7

Taniguchi, Jun, Shin-ichi Satake, Takaki Oosumi, Akihisa Fukushige, and Yasuo Kogo. "Dwell time adjustment for focused ion beam machining." Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms 307 (July 2013): 248–52. http://dx.doi.org/10.1016/j.nimb.2013.02.039.

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8

Kitamura, Masaru, Eijiro Koike, Noboru Takasu, and Tetsuro Nishimura. "Focused Ion Beam Machining for Optical Microlens Fabrication." Japanese Journal of Applied Physics 41, Part 1, No. 6A (June 15, 2002): 4019–21. http://dx.doi.org/10.1143/jjap.41.4019.

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9

Davies, ST, and B. Khamsehpour. "Focused ion beam machining and deposition for nanofabrication." Vacuum 47, no. 5 (May 1996): 455–62. http://dx.doi.org/10.1016/0042-207x(95)00235-9.

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10

Jiang, Xiao Xiao, Feng Wen Wang, Zhen He Ma, Qiong Chan Gu, Jiang Tao Lv, and Guang Yuan Si. "Arbitrary Structures Fabricated by Focused Ion Beam Milling." Advanced Materials Research 661 (February 2013): 66–69. http://dx.doi.org/10.4028/www.scientific.net/amr.661.66.

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Optical components at the nanoscale are crucial for developing photonics and integrated optics. Device with ultrasmall dimensions is of particular importance for nanoscience and electronic technology. Among all the manufacturing tools, the focused ion beam is a critical candidate for machining and processing optical devices at the nanoscale. Here, we experimentally demonstrate the fabrication of nanodevices with arbitrary shapes and different potential applications using focused ion beam techniques.

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11

HUNG, WEN-CHANG, A. ADAWI, A. TAHRAOUI, and A. G. CULLIS. "ORGANIC SEMICONDUCTOR MICRO-PILLAR PROCESSED BY FOCUSED ION BEAM MILLING." International Journal of Quantum Information 03, supp01 (November 2005): 223–28. http://dx.doi.org/10.1142/s0219749905001407.

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In order to control light, different strategies have been applied by placing an optically active medium into a semiconductor resonator and certain applications such as LEDs and laser diodes have been commercialized for many years. The possibility of nanoscale optical applications has created great interesting for quantum nanostructure research. Recently, single photon emission has been an active area of quantum dot research. A quantum dot is place between distributed Bragg reflectors (DBRs) within a micro-pillar structure. In this study, we shall report on an active layer composed of an organic material instead of a semiconductor. The micro-pillar structure is fabricated by a focused ion beam (FIB) micro-machining technique. The ultimate target is to achieve a single molecule within the micro-pillar and therefore to enable single photon emission. Here, we demonstrate some results of the fabrication procedure of a 5 micron organic micro-pillar via the focused ion beam and some measurement results from this study. The JEOL 6500 dual column system equipped with both electron and ion beams enables us to observe the fabrication procedure during the milling process. Furthermore, the strategy of the FIB micro-machining method is reported as well.

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12

Pellerin, J. G. "Focused ion beam machining of Si, GaAs, and InP." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 8, no. 6 (November 1990): 1945. http://dx.doi.org/10.1116/1.584880.

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13

Dravid, Vinayak P., Steven Kim, and Luke N. Brewer. "Focused Ion Beam (FIB): More than Just a Fancy Ion Beam Thinner." Microscopy and Microanalysis 6, S2 (August 2000): 504–5. http://dx.doi.org/10.1017/s1431927600035017.

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The potential utility of FIB for routine (and novel) applications has come to forefront recently due to advances in ion optics which now allow formation of focused ion probe of better than ∼10-20 nm containing current density exceeding several A/cm2, with a liquid metal source (typically Gallium). The small ion probe size, coupled with shallow sputtering depth - yet high sputtering yield of ions, has opened several opportunities in machining, lithography and ion-assisted deposition[ 1-3] These developments, including automation, multi-specimen stages, cross-compatible specimen holders for FIB/TEM/SEM, use of in-situ electron beam (so-called dual beam), coupled with innovations such as the “lift-off process[4], have provided an invaluable set of tools for microelectronic defect characterization. However, re-deposition (contamination), ion implantation/damage especially for desirable thinner sections (<∼50 nm) remain major concerns for further applications.While much of the excitement in TEM community for FIB is due to thin foil specimen preparation (especially in microelectronics),

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14

Hosokawa, Hiroyuki, Takeshi Nakajima, and Koji Shimojima. "Focused Ion Beam Micro-Machining Properties on WC-Co Alloys." Journal of the Japan Society of Powder and Powder Metallurgy 53, no. 2 (2006): 187–91. http://dx.doi.org/10.2497/jjspm.53.187.

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15

Yoshida, Y., W. Okazaki, and T. Uchida. "Laser and focused ion beam combined machining for micro dies." Review of Scientific Instruments 83, no. 2 (February 2012): 02B901. http://dx.doi.org/10.1063/1.3662018.

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16

Thaus, D. M. "Development of focused ion-beam machining techniques for Permalloy structures." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 14, no. 6 (November 1996): 3928. http://dx.doi.org/10.1116/1.588697.

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17

Lee, Hiwon, Jin Han, Byung-Kwon Min, and Sang Jo Lee. "Geometric Compensation of Focused Ion Beam Machining Using Image Processing." Applied Physics Express 1 (December 5, 2008): 127002. http://dx.doi.org/10.1143/apex.1.127002.

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18

Guénolé, J., A. Prakash, and E. Bitzek. "Atomistic simulations of focused ion beam machining of strained silicon." Applied Surface Science 416 (September 2017): 86–95. http://dx.doi.org/10.1016/j.apsusc.2017.04.027.

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19

Dravid, Vinayak P. "Focused Ion Beam (FIB): More than Just a Fancy Ion Beam Thinner." Microscopy and Microanalysis 7, S2 (August 2001): 926–27. http://dx.doi.org/10.1017/s1431927600030701.

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The potential utility of FIB for routine (and novel) applications has come to forefront recently due to advances in ion optics which now allow formation of focused ion probe of better than ∼10-20 nm containing current density exceeding several A/cm2, with a liquid metal source (typically Gallium). The small ion probe size, coupled with shallow sputtering depth - yet high sputtering yield of ions, has opened several opportunities in machining, lithography and ion-assisted deposition.[1-3] These developments, including automation, multi-specimen stages, cross-compatible specimen holders for FIB/TEM/SEM, use of in-situ electron beam (so-called dual beam), coupled with innovations such as the “lift-off” process[4], have provided an invaluable set of tools for microelectronic defect characterization. However, re-deposition (contamination), ion implantation/damage especially for desirable thinner sections (<∼50 nm) remain major concerns for further applications.While much of the excitement in TEM community for FIB is due to thin foil specimen preparation (especially in microelectronics), we have been exploiting the site-specific micromachining aspect of FIB beyond specimen preparation for TEM, which is the focus of this contribution. Two broad themes will be presented: One exploits the site-specificity of FIB in making thin sections (including lift-off) at and across localized deformation as in indentation response of micro/nanocomposites. The other involves FIB as a fabrication tool for sputtering/drilling arbitrary shapes and sizes down to 20-50 nm, to enhance functional aspects.

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20

OKUMOTO, Takashi, Kousuke SAWAI, Jun TANIGUCHI, Takaki OOSUMI, Shin-ichi SATAKE, Shun YAMASHINA, and Yasuo KOGO. "A31 Focused ion beam machining of silicon carbide(M4 processes and micro-manufacturing for science)." Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2009.5 (2009): 623–26. http://dx.doi.org/10.1299/jsmelem.2009.5.623.

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21

YOSHIDA, Yoshikazu. "102 Laser and focused ion beam combined machining for micro dies." Proceedings of Yamanashi District Conference 2012 (2012): 4–5. http://dx.doi.org/10.1299/jsmeyamanashi.2012.4.

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22

Masuzawa, Tsuneaki, Yoshikazu Yoshida, Hiromichi Ikeda, Keigo Oguchi, Hikaru Yamagishi, and Yuji Wakabayashi. "Development of a local vacuum system for focused ion beam machining." Review of Scientific Instruments 80, no. 7 (July 2009): 073708. http://dx.doi.org/10.1063/1.3186060.

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23

Di Maio, D., and S. G. Roberts. "Measuring fracture toughness of coatings using focused-ion-beam-machined microbeams." Journal of Materials Research 20, no. 2 (February 1, 2005): 299–302. http://dx.doi.org/10.1557/jmr.2005.0048.

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Measuring the toughness of brittle coatings has always been a difficult task. Coatings are often too thin to easily prepare a freestanding sample of a defined geometry to use standard toughness measuring techniques. Using standard indentation techniques gives results influenced by the effect of the substrate. A new technique for measuring the toughness of coatings is described here. A precracked micro-beam was produced using focused ion beam (FIB) machining, then imaged and loaded to fracture using a nanoindenter.

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24

Kim, Y., A. Y. Abuelfilat, S. P. Hoo, A. Al-Abboodi, B. Liu, Tuck Ng, P. Chan, and J. Fu. "Tuning the surface properties of hydrogel at the nanoscale with focused ion irradiation." Soft Matter 10, no. 42 (2014): 8448–56. http://dx.doi.org/10.1039/c4sm01061b.

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With the site-specific machining capability of Focused Ion Beam (FIB) irradiation, we aim to tailor the surface morphology and physical attributes of biocompatible hydrogel at the nano/micro scale particularly for tissue engineering and other biomedical studies.

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25

Wang, Houxiao, Wei Zhou, and Er Ping Li. "Focused Ion Beam Assisted Interface Detection for Fabricating Functional Plasmonic Nanostructures." Journal of Nanomaterials 2015 (2015): 1–9. http://dx.doi.org/10.1155/2015/468069.

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Plasmonic nanoscale devices/structures have gained more attention from researchers due to their promising functions and/or applications. One important technical focus on this rapidly growing optical device technology is how to precisely control and fabricate nanostructures for different functions or applications (i.e., patterning end points should locate at/near the interface while fabricating these plasmonic nanostructures), which needs a systematic methodology for nanoscale machining, patterning, and fabrication when using the versatile nanoprecision tool focused ion beam (FIB), that is, the FIB-assisted interface detection for fabricating functional plasmonic nanostructures. Accordingly, in this work, the FIB-assisted interface detection was proposed and then successfully carried out using the sample-absorbed current as the detection signal, and the real-time patterning depth control for plasmonic structure fabrication was achieved via controlling machining time. Besides, quantitative models for the sample-absorbed currents and the ion beam current were also established. In addition, some nanostructures for localized surface plasmon resonance biosensing applications were developed based on the proposed interface detection methodology for FIB nanofabrication of functional plasmonic nanostructures. It was shown that the achieved methodology can be conveniently used for real-time control and precise fabrication of different functional plasmonic nanostructures with different geometries and dimensions.

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26

Miura, Kohichi, Syou Satoh, Takazo Yamada, and Hwa Soo Lee. "Effect of Machining of Small Tools by Means of Focused Ion Beam." Advanced Materials Research 565 (September 2012): 588–93. http://dx.doi.org/10.4028/www.scientific.net/amr.565.588.

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Micro holes which diameters are more than 0.1 mm are mechanically machined. However since the ideal sharp cutting edges are difficult to be made in micro drills, fine geometrical shape of micro holes is difficult to be obtained. In this study, the influence of the geometrical shape of cutting edge is experimentally discussed. In order to carry out experimental evaluation, focused ion beam is used to make the geometrical shapes of micro drills.

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27

Wang, Hou Xiao, Wei Zhou, and Er Ping Li. "Focused Ion Beam Nano-Precision Machining for Analyzing Photonic Structures in Butterfly." Key Engineering Materials 447-448 (September 2010): 174–77. http://dx.doi.org/10.4028/www.scientific.net/kem.447-448.174.

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Nano-precision machining using focused ion beam (FIB) is widely applied in many fields. So far, FIB-based nanofabrication for specific nanoscale applications has become an interesting topic to realize more diversities for nano-construction. Through FIB machining, we can easily achieve the required nano- and micro-scale patterning, device fabrication, and preparation of experimental samples. Nowadays, there is an increasing trend to learn from nature to design novel multi-functional materials and devices. Thus, more interestingly, another advantage of FIB is that it can be conveniently used to analyze the natural photonic structures, e.g., those in the butterfly which exhibits amazing optical phenomena due to sub-wavelength structural color. Accordingly, in the present study, structural analyses for butterfly wings were carried out using FIB. It is found that the photonic structures for the backside and frontside of the butterfly wing studied differ considerably. The difference accounts for the different colors on the dorsal and ventral sides of butterfly wings.

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28

ITO, Hiroaki, Kohshi ITO, Masahiro ARAI, Kohichi SUGIMOTO, Toshiaki MATSUKURA, and Ryutaro MAEDA. "Focused Ion Beam Machining of Precision Die for Micro Optical Lens Molding." Journal of the Japan Society for Precision Engineering, Contributed Papers 70, no. 12 (2004): 1549–53. http://dx.doi.org/10.2493/jspe.70.1549.

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29

Lalev, G., S. Dimov, J. Kettle, F. van Delft, and R. Minev. "Data preparation for focused ion beam machining of complex three-dimensional structures." Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 222, no. 1 (January 2008): 67–76. http://dx.doi.org/10.1243/09544054jem864.

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30

Sabouri, Aydin, Carl J. Anthony, Philip D. Prewett, James Bowen, and Haider Butt. "Effects of current on early stages of focused ion beam nano-machining." Materials Research Express 2, no. 5 (May 11, 2015): 055005. http://dx.doi.org/10.1088/2053-1591/2/5/055005.

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31

Picard, Y. N., D. P. Adams, M. J. Vasile, and M. B. Ritchey. "Focused ion beam-shaped microtools for ultra-precision machining of cylindrical components." Precision Engineering 27, no. 1 (January 2003): 59–69. http://dx.doi.org/10.1016/s0141-6359(02)00188-5.

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32

Kim, Sang-Jae, and Koji Iwasaki. "Development of Focused Ion Beam Machining Systems for Fabricating Three-Dimensional Structures." Japanese Journal of Applied Physics 47, no. 6 (June 20, 2008): 5120–22. http://dx.doi.org/10.1143/jjap.47.5120.

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33

Sabouri, A., C. J. Anthony, J. Bowen, V. Vishnyakov, and P. D. Prewett. "The effects of dwell time on focused ion beam machining of silicon." Microelectronic Engineering 121 (June 2014): 24–26. http://dx.doi.org/10.1016/j.mee.2014.02.025.

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34

Wollschläger, Nicole, Werner Österle, Ines Häusler, and Mark Stewart. "Ga+implantation in a PZT film during focused ion beam micro-machining." physica status solidi (c) 12, no. 3 (February 9, 2015): 314–17. http://dx.doi.org/10.1002/pssc.201400096.

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35

Srinivasan, Dheepa, and GE Power. "Cold Spray: Advanced Characterization Methods—Focused Ion Beam Machining and Electron Probe Microanalysis." AM&P Technical Articles 175, no. 4 (May 1, 2017): 42–43. http://dx.doi.org/10.31399/asm.amp.2017-04.p042.

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Abstract Focused ion beam (FIB) systems are selectively used in cold spray coating characterization to gather information on the nature of splat formation, single splats, multiple splats, or the coating-substrate interface. Electron probe microanalysis has been used in cold-sprayed coating characterization primarily to understand the bonding mechanism at the coating-substrate interface.

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36

Deinhart, Victor, Lisa-Marie Kern, Jan N. Kirchhof, Sabrina Juergensen, Joris Sturm, Enno Krauss, Thorsten Feichtner, et al. "The patterning toolbox FIB-o-mat: Exploiting the full potential of focused helium ions for nanofabrication." Beilstein Journal of Nanotechnology 12 (April 6, 2021): 304–18. http://dx.doi.org/10.3762/bjnano.12.25.

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Focused beams of helium ions are a powerful tool for high-fidelity machining with spatial precision below 5 nm. Achieving such a high patterning precision over large areas and for different materials in a reproducible manner, however, is not trivial. Here, we introduce the Python toolbox FIB-o-mat for automated pattern creation and optimization, providing full flexibility to accomplish demanding patterning tasks. FIB-o-mat offers high-level pattern creation, enabling high-fidelity large-area patterning and systematic variations in geometry and raster settings. It also offers low-level beam path creation, providing full control over the beam movement and including sophisticated optimization tools. Three applications showcasing the potential of He ion beam nanofabrication for two-dimensional material systems and devices using FIB-o-mat are presented.

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37

Russell, P. E., T. J. Stark, D. P. Griffis, and J. C. Gonzales. "Chemically Assisted Focused ION Beam Micromachining: Overview, Recent Developments and Current Needs." Microscopy and Microanalysis 7, S2 (August 2001): 928–29. http://dx.doi.org/10.1017/s1431927600030713.

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Recent developments in FIB have included optics and automation improvements as well as technique development. in the past decade, ion beam optics have improved rapidly to the point where the beam size and profile does not dramatically limit its use in many applications ranging from failure analysis to manufacturing. Developments in FIB can therefore focus on techniques to increase removal rates, enhance selectivity and improve surface finish. in this work we present various efforts to improve FIB micromachining using chemical enhancement, where the incident ions initiate chemical reactions with surface adsorbates; and using geometrical optimization of milling patterns. Chemical enhanced FIB micromachining (CE-FIBM) techniques include the use of water vapor to improve FIB micromachining of various materials including polymers, integrated circuits and diamond as well as the use of various halogen based (F, Cl and I) precursors for machining of materials ranging from Si to Fe-Ni alloys. The machining of a free edge provides a geometrical yield enhancement of more than 5 and, when combined with simultaneous chemical enhancement, can increase total yield by as much as 30 times. The major applications of FIB for preparing cross sectional analysis samples for FIB or SEM imaging, or for TEM analysis benefit in may ways from the specialized gas chemistry assistance methods developed over the past 10 years. Integrated circuit and MEMS device editing techniques have also been enhanced through the use of unique materials specific gas assisted FIB solutions.

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38

Bauer, Jens, Melanie Ulitschka, Frank Frost, and Thomas Arnold. "Figuring of optical aluminium devices by reactive ion beam etching." EPJ Web of Conferences 215 (2019): 06002. http://dx.doi.org/10.1051/epjconf/201921506002.

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Ion beam figuring (IBF) is an established method in high-end surface manufacturing. However, the direct processing of desired materials as standard Al alloys (e.g. Al6061)fails, since the surface roughness increases drastically as a result of inhomogeneous etching due to structural, crystallographic and chemical irregularities inside the material matrix. As an alternative figuring technology reactive ion-beam etching (RIBE) is a promising route. RIBE provides the direct machining of Al alloys while preserving the surface roughness almostin its initial state. The RIBE process with nitrogengasis focused more detailedin this study.

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39

Joe, Hang-Eun, Won-Sup Lee, Martin B. G. Jun, No-Cheol Park, and Byung-Kwon Min. "Material interface detection based on secondary electron images for focused ion beam machining." Ultramicroscopy 184 (January 2018): 37–43. http://dx.doi.org/10.1016/j.ultramic.2017.10.012.

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40

TAKAHASHI, Nobuhiko, Hayato YOSHIOKA, and Hidenori SHINNO. "Study on Nano-Machining of Hard and Brittle Material with Focused Ion Beam." Journal of the Japan Society for Precision Engineering 74, no. 5 (2008): 491–97. http://dx.doi.org/10.2493/jjspe.74.491.

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41

Sun, J., J. Li, R. R. J. Maier, D. P. Hand, W. N. MacPherson, M. K. Miller, J. M. Ritchie, and X. Luo. "Fabrication of a side aligned optical fibre interferometer by focused ion beam machining." Journal of Micromechanics and Microengineering 23, no. 10 (September 5, 2013): 105005. http://dx.doi.org/10.1088/0960-1317/23/10/105005.

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42

Jakubéczyová, Dagmar, and Beáta Ballóková. "The Analyse of Nanocomposite Thin Coatings Using Specimens Prepared by Focused Ion Beam Milling." Materials Science Forum 891 (March 2017): 579–85. http://dx.doi.org/10.4028/www.scientific.net/msf.891.579.

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The microstructure of physical vapour deposition (PVD) coatings deposited by duplex technology was investigated by Dual Beam FIB/SEM system (focused ion beam / scanning electron microscope), which allows one to examine cross sections of specimens from their surface down to the substrate. Examined were PVD coatings of nanocomposite type: duplex AlXN3 (X=Cr) and duplex nACRo3, deposited by LARC and CERC technologies. Duplex coating is a modern technology, which combines plasma nitriding and PVD coating in one cycle. The FIB analysis can be widely used in the field of study of basic materials and technological applications as it is based on highly focused ion beam which enables accurate machining of the investigated specimens and flexible processing at a micro/nanometric level. Cross sections of specimens obtained by FIB-SEMs document the arrangement of individual deposited nanomultilayers within the nanocomposite coatings and their EDS analysis in specific locations.

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43

Ahn, Sung-Hoon, Hae-Sung Yoon, Ki-Hwan Jang, Eun-Seob Kim, Hyun-Taek Lee, Gil-Yong Lee, Chung-Soo Kim, and Suk-Won Cha. "Nanoscale 3D printing process using aerodynamically focused nanoparticle (AFN) printing, micro-machining, and focused ion beam (FIB)." CIRP Annals 64, no. 1 (2015): 523–26. http://dx.doi.org/10.1016/j.cirp.2015.03.007.

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44

Scott, Simon, and Zulfiqur Ali. "Fabrication Methods for Microfluidic Devices: An Overview." Micromachines 12, no. 3 (March 18, 2021): 319. http://dx.doi.org/10.3390/mi12030319.

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Microfluidic devices offer the potential to automate a wide variety of chemical and biological operations that are applicable for diagnostic and therapeutic operations with higher efficiency as well as higher repeatability and reproducibility. Polymer based microfluidic devices offer particular advantages including those of cost and biocompatibility. Here, we describe direct and replication approaches for manufacturing of polymer microfluidic devices. Replications approaches require fabrication of mould or master and we describe different methods of mould manufacture, including mechanical (micro-cutting; ultrasonic machining), energy-assisted methods (electrodischarge machining, micro-electrochemical machining, laser ablation, electron beam machining, focused ion beam (FIB) machining), traditional micro-electromechanical systems (MEMS) processes, as well as mould fabrication approaches for curved surfaces. The approaches for microfluidic device fabrications are described in terms of low volume production (casting, lamination, laser ablation, 3D printing) and high-volume production (hot embossing, injection moulding, and film or sheet operations).

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45

Xia, Xinyi, Nahid Al-Mamun, Warywoba Daudi, Fan Ren, Aman Haque, and Stephen J. Pearton. "Ga+ Focused Ion Beam Damage in n-type Ga₂O₃and Its Recovery after Annealing Treatment." ECS Meeting Abstracts MA2022-02, no. 34 (October 9, 2022): 1245. http://dx.doi.org/10.1149/ma2022-02341245mtgabs.

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In this study, the focused ion beam (FIB) Ga+ irradiation damage on β-Ga2O3 Schottky diode structure under different ion energies were tested, and the effective recovery of diode characteristics after rapid thermal annealing (RTA) post-annealing were also studied. β-Ga2O3 based Schottky diodes have attracted increasing attention because of the prospects for use in next-generation high-power electronics. Focused ion beam (FIB) machining is one of the newest processing techniques, which is mainly used in semiconductor and chip manufacture and transmission electron microscopy (TEM) sample preparation. During FIB sample preparation, the energetic Ga ions are incident onto the sample to induce physical sputtering of the material, which in turn, modifies its chemical composition, crystallinity and electrical properties. It has been found in many studies that 20-30 nm amorphous layer can form on silicon after irradiation with 30 keV Ga ions. From our previous study, the FIB ion beam induced damages could cause significant degradation on diode on-resistance and turn-on voltage. Milling at lower energy has been used to reduce the electrical damage. However low energy milling is more time consuming and less precise. Short-time, high-temperature post-annealing treatments, such as RTA has been proved could remove the crystal damage. Thus, there is a great need to determine the maximal ion beam energy and post-annealing temperature for FIB without degrading diode characteristics. In this work, energies ranging from 2 keV to 30 keV were employed to mill off a part of Ga2O3 epi-layer and Schottky diodes were fabricated on milled surface. Forward IV characteristic shows less degradations with lower ion beam energies. For the diodes exposed to 2, 5, and 10 keV Ga+ ion beams exhibited significant recovery of diode on resistance and turn-on voltage after 300°C RTA annealing. For the diodes exposed to 30 keV Ga+ ion beams recovered significantly after 400 °C annealing. In conclusion, decreasing the FIB energy shows effective alleviations on the FIB damage, and post annealing treatment effectively recovered the damage from Ga+ implantation. This is the first time the thermal annealing treatment was performed for Ga2O3 Schottky diode recovering from FIB cutting, it is an effective and simple way to mitigate the degradation, especially for higher ion beam energies. This work could broaden the FIB’s usability and release tremendous potential as a specimen preparation and imaging tool in materials science applications. Figure 1

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Kawasegi, Noritaka, Tomoyuki Niwata, Noboru Morita, Kazuhito Nishimura, and Hideki Sasaoka. "Improving machining performance of single-crystal diamond tools irradiated by a focused ion beam." Precision Engineering 38, no. 1 (January 2014): 174–82. http://dx.doi.org/10.1016/j.precisioneng.2013.09.001.

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Ding, X., D. L. Butler, G. C. Lim, C. K. Cheng, K. C. Shaw, K. Liu, W. S. Fong, and H. Y. Zheng. "Machining with micro-size single crystalline diamond tools fabricated by a focused ion beam." Journal of Micromechanics and Microengineering 19, no. 2 (January 14, 2009): 025005. http://dx.doi.org/10.1088/0960-1317/19/2/025005.

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Kawasegi, Noritaka, Kazuma Ozaki, Noboru Morita, Kazuhito Nishimura, Makoto Yamaguchi, and Noboru Takano. "Nanopatterning on Nano-Polycrystalline Diamond and Cubic Boron Nitride Using Focused Ion Beam and Heat Treatment to Fabricate Textured Cutting Tools." Materials Science Forum 874 (October 2016): 543–48. http://dx.doi.org/10.4028/www.scientific.net/msf.874.543.

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Texturing on the surface of cutting tools is an effective method to improve the friction and resultant machining performances of the tool. In this study, to fabricate nanotextures on various tools used for precision cutting, a patterning method on nanopolycrystalline diamond and cubic boron nitride tools was investigated using focused ion beam (FIB) irradiation and heat treatment. Patterning was possible using this method, and the patterning characteristics were different from those of single-crystal diamond. This method was more suitable for cutting tools compared with direct FIB machining because of its high efficiency and significantly low affected layer.

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Yang, Liangliang, Jiangtao Wei, Zhe Ma, Peishuai Song, Jing Ma, Yongqiang Zhao, Zhen Huang, Mingliang Zhang, Fuhua Yang, and Xiaodong Wang. "The Fabrication of Micro/Nano Structures by Laser Machining." Nanomaterials 9, no. 12 (December 16, 2019): 1789. http://dx.doi.org/10.3390/nano9121789.

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Micro/nano structures have unique optical, electrical, magnetic, and thermal properties. Studies on the preparation of micro/nano structures are of considerable research value and broad development prospects. Several micro/nano structure preparation techniques have already been developed, such as photolithography, electron beam lithography, focused ion beam techniques, nanoimprint techniques. However, the available geometries directly implemented by those means are limited to the 2D mode. Laser machining, a new technology for micro/nano structural preparation, has received great attention in recent years for its wide application to almost all types of materials through a scalable, one-step method, and its unique 3D processing capabilities, high manufacturing resolution and high designability. In addition, micro/nano structures prepared by laser machining have a wide range of applications in photonics, Surface plasma resonance, optoelectronics, biochemical sensing, micro/nanofluidics, photofluidics, biomedical, and associated fields. In this paper, updated achievements of laser-assisted fabrication of micro/nano structures are reviewed and summarized. It focuses on the researchers’ findings, and analyzes materials, morphology, possible applications and laser machining of micro/nano structures in detail. Seven kinds of materials are generalized, including metal, organics or polymers, semiconductors, glass, oxides, carbon materials, and piezoelectric materials. In the end, further prospects to the future of laser machining are proposed.

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Joe, Hang-Eun, Jae-Hyeong Park, Seong Hyeon Kim, Gyuho Kim, Martin B. G. Jun, and Byung-Kwon Min. "Effects of coating material on the fabrication accuracy of focused ion beam machining of insulators." Japanese Journal of Applied Physics 54, no. 9 (August 28, 2015): 096602. http://dx.doi.org/10.7567/jjap.54.096602.

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