Relevant bibliographies by topics / Flash Interface

Academic literature on the topic 'Flash Interface'

Author: Grafiati
Published: 11 September 2023

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Journal articles on the topic "Flash Interface"

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Myramuru, Shanmukha Sai Nikhil, Dr S. Chandra Mohan Reddy, and Dr Gannera Mamatha. "Design and Integration of NAND Flash Memory Controller for Open Power-based Fabless SoC." International Journal of Engineering and Advanced Technology 12, no. 2 (December 30, 2022): 137–44. http://dx.doi.org/10.35940/ijeat.d3470.1212222.

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NAND Flash Memory has replaced EEPROM and hard drives as Non-volatile. Data is stored in sequential order in NAND Flash Memory. NAND Memory is a type of flash memory widely used in mobile phones and System on Chips (SoC). The Memory controller supports an 8-bit NAND Flash interface and streaming interface towards АXI4. The data transfer between АXI4 and NAND Flash Memory is carried оut by using NAND Flash commands sequences. The AXI4 Interface enables the usage of various рrоtосоls. To improve the flash memory controller's data access speed. This project intends to design, develop, and integrate a NAND Flash memory controller using an AXI4 interface for an open POWER Processor A20 fabless SOC. The Flash Memory Controller includes Finite State Machines (FSM) and AXI4 bridge logic. Using Mentor Graphics® and Xilinx's Vivado design suite, the test results were based on behavioral simulation and synthesis
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Liu, Hai Ke, Shun Wang, Xin Gna Kang, and Jin Liang Wang. "Realization of NAND FLASH Control Glueless Interface Circuit." Advanced Materials Research 1008-1009 (August 2014): 659–62. http://dx.doi.org/10.4028/www.scientific.net/amr.1008-1009.659.

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The article realization of NAND FLASH control glueless interface circuit based on FPGA,comparing the advantages and disadvantages of the NAND Flash and analysising the function of control interface circuit. The control interface circuit can correct carry out the SRAM timing-input block erase, page reads, page programming, state read instructions into the required operation sequence of NAND Flash, greatly simplifies the NAND FLASH read and write timing control. According to the ECC algorithm,the realization method of ECC check code generation,error search,error correction is described.The function of operate instructions of the NAND Flash control interface circuit designed in this paper is verified on Xillinx Spartan-3 board, and the frequency can reach 100MHz.
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VonBergen, Wade, and Madhu Basude. "A High Temp standalone 4MByte Flash memory with SPI Interface for 210C applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (January 1, 2012): 000066–71. http://dx.doi.org/10.4071/hitec-2012-tp11.

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This paper covers the internal architecture, testability & performance characterization of Texas Instruments ™ High-Temp 210C 4MByte standalone Flash storage device. It will be available in a 14-pin ceramic dual Flat pack package as well as a Known Good Die (KGD) option. The device is manufactured in TI's 180nm 1.8V flash process with 3.3V IOs. The design implements 8 banks of flash organized into 2M × 16 bits surrounded by a SPI controller. The SPI controller interfaces asynchronously with an internal flash controller. The flash controller is clocked by FCLK, and controls the flash charge pump to access & operate the flash to program, read, erase, validate etc. The SPI controller is responsible for translating and executing the high level SPI protocol commands to the internal flash controller & its registers. A simple and flexible protocol was developed to access the flash array via the SPI supporting various commands and configuration capabilities. Testability of critical parameters for reliable 210C flash operation is ensured with the implementation of an internal test port accessible through a parallel interface (for TI Internal use only). The test port, and a SPI initiated BIST controller are used to provide full & comprehensive characterization of the flash bit cell array, as well as the flash-pump across temperature & frequencies. The form factor, size, and pin out of this flash device is primarily focused on data logging for narrow & space limited extreme harsh environments such as the down-hole drilling industry.
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Qiu, Yan Zhang, Liang Guo, and Sheng Hui Liu. "The Design of Embedded Multi-Channel Data Acquisition System." Applied Mechanics and Materials 182-183 (June 2012): 660–64. http://dx.doi.org/10.4028/www.scientific.net/amm.182-183.660.

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This paper analyzes the Flash Memory interface, SDRAM interface, Ethernet interface and Serial-port expansion circuit. The Embedded Multi-channel Data Acquisition System is designed by MCF5272 microprocessor. The main control system of MCF5272 includes SDRAM, Flash and BDM interface and so on. At the software design, we main introduce the compile and develop of bootload and the compiler and debugging environment of μClinux build. On this base, the general methods and points of the embedded system hardware design were summarized.
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Liu, Gen Xian, and Dong Sheng Wang. "Low Cost Wear Leveling for High-Density SPI NAND Flash in Memory Constrained Embedded System." Applied Mechanics and Materials 427-429 (September 2013): 1277–80. http://dx.doi.org/10.4028/www.scientific.net/amm.427-429.1277.

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SPI NOR Flash is widely used in embedded system for its compact package and simple interface. It is suitable to medium scale data storage. Now, industry provides higher density NAND Flash with the same interface and package as SPI NOR Flash. But the erase/program circles of NAND Flash is less than that of NOR Flash. The lifetime of NAND Flash is becoming the critical issue. Wear leveling algorithms prevent NAND Flash from prematurely retiring by mapping the logical block to different physical blocks. To our knowledge, most wear leveling algorithms need several kilobytes of RAM for keeping the mapping data structures, which is costly for the resource constrained micro controller. This study first proposes a no RAM required design with presetting lifetime, and then presents an adaptive design which requires only 2 kilobytes RAM with elasticity lifetime. The proposed design can be adapted in most of embedded systems based on low cost micro controller.
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Zhao, Yixuan, Tongshun Liu, Qingjie Ji, Haifeng Yang, and Hongyun Zhao. "Study on the Microstructure and Properties of Flash-Butt Welding Joints of High Nitrogen Steel." Metals 13, no. 7 (June 28, 2023): 1200. http://dx.doi.org/10.3390/met13071200.

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A thermomechanical coupling model for the solid-state flashing process of high nitrogen steel was established, based on finite element simulations and experiments. The effect of flash current on the microstructure and mechanical properties of the welded joint was investigated, and the temperature field of the flash-butt welding (FBW) process was simulated. The phase composition of the joint was determined according to the phase diagram and cooling curve. In addition, the joint with optimal parameters was subjected to full immersion corrosion tests. The results demonstrated that the interface structure was composed of austenite and δ-ferrite with a thyristor angle (flash current) of 45°. The microstructure of the overheated zone (OZ) was composed of austenite, ferrite and a small amount of the M2 phase, in which the heat-affected zone exhibited a single-phase austenite microstructure. The joint hardness displayed a “V” shaped distribution with the lowest interface hardness. As the flash current increased, the hardness and tensile strength of the interface area of the joint first increased and then decreased, with a maximum tensile strength of 902 MPa at 45°. During the full immersion corrosion tests, the joint exhibited the most serious corrosion in the interface center and gradually reduced corrosion on both sides.
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Shen, Lin, Gang Du, Ya Hui Hou, and Na Na Zhang. "Study on the Storage of Chinese Character Font Library and Graphics Library on SPI Flash Chip." Applied Mechanics and Materials 423-426 (September 2013): 2763–66. http://dx.doi.org/10.4028/www.scientific.net/amm.423-426.2763.

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Two kinds of method writing Chinese character font library and graphics library to external SPI interface flash chip via USART and SD card are designed and realized. By using the SPI Flash chip to store Chinese character font library and graphics library, it can achieve the human-machine interface which uses a variety of user-defined Chinese font and pictures and effectively reduce the microcontrollers internal memory consumption. It can be widely used in small embedded systems.
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Park, Jong-Hyeok, Soyee Choi, Gihwan Oh, and Sang-Won Lee. "Gather Interface for Freezing Pages in Flash Storage." IEEE Access 9 (2021): 102542–48. http://dx.doi.org/10.1109/access.2021.3097386.

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Park, Jonghyeok, Soyee Choi, Gihwan Oh, Soojun Im, Moon-Wook Oh, and Sang-Won Lee. "FlashAlloc: Dedicating Flash Blocks by Objects." Proceedings of the VLDB Endowment 16, no. 11 (July 2023): 3266–78. http://dx.doi.org/10.14778/3611479.3611524.

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For a write request, today's flash storage cannot distinguish the logical object it comes from ( e.g. , SSTables in RocksDB). In such object-oblivious flash devices, concurrent writes from different objects are simply packed in their arrival order to flash memory blocks; hence data pages from multiple objects with different lifetimes are multiplexed onto the same flash blocks. This multiplexing incurs write amplification, worsening the performance. Tackling the multiplexing problem, we propose a novel interface for flash storage, FlashAlloc. It is used to pass the logical address ranges of objects to the underlying flash device and thus to enlighten the device to stream writes by objects. The object-aware flash storage can now de-multiplex concurrent writes from multiple objects with distinct deathtimes into per-object dedicated flash blocks. In essence, the interface enables the per-object fine-grained write streaming. Given that popular data stores tend to separate writes by logical objects, we can achieve, compared to the existing solutions, transparent streaming just by calling FlashAlloc upon object creation. Also, FlashAlloc is adaptive to workload changes, and liberates the stream conflicts in the multi-tenant environment. Our experimental results using an open-source SSD prototype demonstrate that FlashAlloc can reduce the device-level write amplification factor (WAF) under RocksDB, F2FS, and MySQL by 1.5, 2.5, and 0.3, respectively and improve their throughput by 2.7x, 1.8x, and 1.2x, respectively. Also, FlashAlloc can mitigate the WAF interference among tenants: when running RocksDB and MySQL together on the same SSD, FlashAlloc reduced WAF from 2.5 to 1.6 and doubled their throughputs.
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Hung, Ji Jun, Kai Bu, Zhao Lin Sun, Jie Tao Diao, and Jian Bin Liu. "PCI Express-Based NVMe Solid State Disk." Applied Mechanics and Materials 464 (November 2013): 365–68. http://dx.doi.org/10.4028/www.scientific.net/amm.464.365.

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This paper presents a new architecture SSD based on NVMe (Non-Volatile Memory express) protocol. The NVMe SSD promises to solve the conventional SATA and SAS interface bottleneck. Its aimed to present a PCIe NAND Flash memory card that uses NAND Flash memory chip as the storage media. The paper analyzes the PCIe protocol and the characteristics of SSD controller, and then gives the detailed design of the PCIe SSD. It mainly contains the PCIe port and Flash Translation Layer.
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Dissertations / Theses on the topic "Flash Interface"

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Khuu, Vinh P. "Evaluation of thermal interface materials and the laser flash method." College Park, Md. : University of Maryland, 2009. http://hdl.handle.net/1903/9873.

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Thesis (Ph.D.) -- University of Maryland, College Park, 2009.
Thesis research directed by: Dept. of Mechanical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
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Chhasatia, Viralsinh. "Characterization of thermal interface materials using flash diffusivity and infrared microscopy methods." Diss., Online access via UMI:, 2009.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2009.
Includes bibliographical references.
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Ekman, Linda. "Interaktivt Säljstöd-Flash presentation av Stöt Puls Metoden." Thesis, Linköping University, Department of Science and Technology, 2002. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-1189.

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Denna rapport är en beskrivning av ett examensarbete utfört vid SPM Instrument AB i Strängnäs. SPM Instrument utvecklar och tillverkar produkter för konditionsmätning av maskiner.

Målet var att skapa en cd-presentation i redigeringsprogrammet Macromedia Flash 5.0, som på ett enkelt sätt med rörliga bilder förklarar en konditionsmätningsmetod som kallas för Stöt Puls Metoden.

Uppgiften löstes genom att först inhämta information om Stöt Puls Metoden, sedan utformades Flash-filmen och slutligen testades och utvecklades filmen tills dess att jag och SPM Instrument var nöjda.


This report describes a final-year project performed at SPM Instrument AB in Strängnäs. The company develop and manufacture products for condition monitoring of machinery equipment.

The goal was to create a cd-presentation in the computer software Macromedia Flash 5.0, with moving pictures which explains a condition monitoring method that is called the Shoke Pulse Method.

The task was solved by first finding out information about the Shoke Pulse Method, then the Flash-movie was created and finally the movie was tested and developed until both I and SPM Instrument was satisfied.

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Ricknäs, Daniel, and Frida Stam. "Visual User Interface for PDAs." Thesis, Linköping University, Department of Science and Technology, 2003. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-1994.

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This report is a part of a diploma work, conducted as a part of a Master of Science degree. The diploma work consists of a preliminary study, two case studies, a user study, a paper and this report. It was created at the Linköping University for the department of Science and Technology, in cooperation with Unilever Research in the UK, and partly with the EC founded project, Smartdoc IST-2000-28137.

Hand-held, mobile devices like Personal Digital Assistances (PDAs) are becoming increasingly popular in today’s wireless world. While trying to pack all the possible information into a small window, a nightmarish scenario is created for the interface designer to deal with. The goal for this project was to investigate different Visual User Interfaces (VUIs)on PDAs, and how to apply desktop interaction techniques to PDAs.

A VUI model based on Zooming User Interface (ZUI) techniques, to adapt two complete different visualisation application areas; on-line brand-based shopping and flood warning system for PDAs, is presented. The on-line brand- based shopping was evaluated in a benchmark usability study comparing it to traditional PC based on-line shopping.

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Lin, Wei. "Carbon nanotubes for thermal interface materials in microelectronic packaging." Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/45929.

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As the integration scale of transistors/devices in a chip/system keeps increasing, effective cooling has become more and more important in microelectronics. To address the thermal dissipation issue, one important solution is to develop thermal interface materials with higher performance. Carbon nanotubes, given their high intrinsic thermal and mechanical properties, and their high thermal and chemical stabilities, have received extensive attention from both academia and industry as a candidate for high-performance thermal interface materials. The thesis is devoted to addressing some challenges related to the potential application of carbon nanotubes as thermal interface materials in microelectronics. These challenges include: 1) controlled synthesis of vertically aligned carbon nanotubes on various bulk substrates via chemical vapor deposition and the fundamental understanding involved; 2) development of a scalable annealing process to improve the intrinsic properties of synthesized carbon nanotubes; 3) development of a state-of-art assembling process to effectively implement high-quality vertically aligned carbon nanotubes into a flip-chip assembly; 4) a reliable thermal measurement of intrinsic thermal transport property of vertically aligned carbon nanotube films; 5) improvement of interfacial thermal transport between carbon nanotubes and other materials. The major achievements are summarized. 1. Based on the fundamental understanding of catalytic chemical vapor deposition processes and the growth mechanism of carbon nanotube, fast synthesis of high-quality vertically aligned carbon nanotubes on various bulk substrates (e.g., copper, quartz, silicon, aluminum oxide, etc.) has been successfully achieved. The synthesis of vertically aligned carbon nanotubes on the bulk copper substrate by the thermal chemical vapor deposition process has set a world record. In order to functionalize the synthesized carbon nanotubes while maintaining their good vertical alignment, an in situ functionalization process has for the first time been demonstrated. The in situ functionalization renders the vertically aligned carbon nanotubes a proper chemical reactivity for forming chemical bonding with other substrate materials such as gold and silicon. 2. An ultrafast microwave annealing process has been developed to reduce the defect density in vertically aligned carbon nanotubes. Raman and thermogravimetric analyses have shown a distinct defect reduction in the CNTs annealed in microwave for 3 min. Fibers spun from the as-annealed CNTs, in comparison with those from the pristine CNTs, show increases of ~35% and ~65%, respectively, in tensile strength (~0.8 GPa) and modulus (~90 GPa) during tensile testing; an ~20% improvement in electrical conductivity (~80000 S m⁻¹) was also reported. The mechanism of the microwave response of CNTs was discussed. Such an microwave annealing process has been extended to the preparation of reduced graphene oxide. 3. Based on the fundamental understanding of interfacial thermal transport and surface chemistry of metals and carbon nanotubes, two major transfer/assembling processes have been developed: molecular bonding and metal bonding. Effective improvement of the interfacial thermal transport has been achieved by the interfacial bonding. 4. The thermal diffusivity of vertically aligned carbon nanotube (VACNT, multi-walled) films was measured by a laser flash technique, and shown to be ~30 mm² s⁻¹ along the tube-alignment direction. The calculated thermal conductivities of the VACNT film and the individual CNTs are ~27 and ~540 W m⁻¹ K⁻¹, respectively. The technique was verified to be reliable although a proper sampling procedure is critical. A systematic parametric study of the effects of defects, buckling, tip-to-tip contacts, packing density, and tube-tube interaction on the thermal diffusivity was carried out. Defects and buckling decreased the thermal diffusivity dramatically. An increased packing density was beneficial in increasing the collective thermal conductivity of the VACNT film; however, the increased tube-tube interaction in dense VACNT films decreased the thermal conductivity of the individual CNTs. The tip-to-tip contact resistance was shown to be ~1×10⁻⁷ m² K W⁻¹. The study will shed light on the potential application of VACNTs as thermal interface materials in microelectronic packaging. 5. A combined process of in situ functionalization and microwave curing has been developed to effective enhance the interface between carbon nanotubes and the epoxy matrix. Effective medium theory has been used to analyze the interfacial thermal resistance between carbon nanotubes and polymer matrix, and that between graphite nanoplatlets and polymer matrix.
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Kulin, Hanna. "Att visualisera en utställning på Internet i Flash : - ett arbete för Norrköpings Visualiseringscenter C." Thesis, Linköpings universitet, Institutionen för datavetenskap, 2010. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-57560.

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Sammanfattning Syftet med detta examensarbete har varit att, genom att kombinera kunskaperna inom interaktionsdesign med kunskaperna inom visuell kommunikation, ta fram en designlösning åt Norrköpings Visualiseringscenter C som presenterar innehållet i deras utställning “Att visa det man inte kan se“ på deras hemsida. För att nå detta syfte har utvalda teorier och metoder använts och i uppsatsen beskrivs designprocessen steg för steg - hela vägen från uppdragsbeskrivning, genom teorier och metoder till den färdiga designlösningen. Teorierna i denna uppsats handlar om interaktionsdesign, gränssnittsdesign, användbarhet, visuell kommunikation och teknik. Metoderna för att få reda på användarnas åsikter behandlar användartester, Card sorting, LoFi- och HiFi-prototyper. Resultatet av rapporten beskriver hur Adobe Flash kan användas för att skapa en interaktiv design för en webbsideapplikation med kontroll över interaktion, visuell kommunikation och användbarhet. Resultatet visar också hur användarnas återkoppling under användartesten påverkade slutresultatet. Resultatet visar även att en designprocess är olik från gång till gång men att det finns vissa riktlinjer som kan hjälpa en designer genom processen på ett kontrollerat sätt.
Abstract The goal of this thesis is to combine knowledge from interaction design with knowledge from visual communication in order to create a design solution for Norrköping Visualization Center C and their exhibition “To show what can’t be seen“ for their website. To reach this goal, theories and methods have been used and in this thesis the design process is described - step by step - all the way from the clients brief to the final design solution. The theories in this thesis are concerned with interaction design, interface design, usability, visual communication and technology. The methods employed are usability tests, card sorting, and LoFi- and HiFi-prototypes. This thesis report describes how Adobe Flash can be used to create an interactive design for a website application that establishes control over the interaction, visual communication and usability. It also shows how the users feedback on the user tests affected the end result. This thesis also shows that a design process can vary from time to time but there are some guidelines that can help a designer through the process in a controlled way.
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Rebuffat, Benjamin. "Etude de la fiabilité des mémoires non-volatiles à grille flottante." Thesis, Aix-Marseille, 2015. http://www.theses.fr/2015AIXM4383.

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De nombreuses applications industrielles spécifiques dans les secteurs tels que l’automobile, le médical et le spatial, requièrent un très haut niveau de fiabilité. Dans ce contexte, cette thèse traite de l’étude de la fiabilité des mémoires non-volatiles à grille flottante de type NOR Flash. Après une introduction mêlant l’état de l’art des mémoires non volatiles et la caractérisation électrique des mémoires Flash, une étude sur l’effet des signaux de polarisation a été menée. Un modèle a été développé afin de modéliser la cinétique de la tension de seuil durant un effacement. L’effet de la rampe d’effacement a été montré sur les cinétiques mais aussi sur l’endurance. Une étude sur la durée de vie de l’oxyde tunnel a ensuite montré l’importance de l’utilisation d’un stress dynamique. Nous avons caractérisé cette dépendance en fonction du rapport cyclique et du champ électrique appliqué. Enfin l’endurance de la cellule mémoire Flash a été étudiée et les effets de la relaxation durant le cyclage ont été analysés
Many specific applications used in automotive, medical and spatial activity domains, require a high reliability level. In this context, this thesis focuses on the study of floating gate non-volatiles memories reliability more precisely in NOR Flash architecture. After an introduction mixing the state of art of non-volatiles memories and the electrical characterization of Flash memories, a study on the polarization signals effect has been led. A model has been developed in order to model the threshold voltage kinetic during an erase operation. The erasing ramp effect has been shown on kinetics and also on cycling. Then, a study on the tunnel oxide lifetime has shown the importance of relaxation during stress. This dependence has been characterized as a function of duty cycle and the electric field applied. Finally, Flash memory cell endurance has been explored and the relaxation effects during the cycling has been analyzed
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Vymazal, Michal. "Softwarová podpora návrhu elektronického zabezpečovacího systému." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2009. http://www.nusl.cz/ntk/nusl-218143.

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This thesis deals with implementation of software support of alarm system design for security levels 1 and 2 based on web technologies. It was created intuitive and interactive graphical interface that allows to create high-quality alarm system design even for laymen. First of all the paper deals with standards and jurisdictions in the Czech Republic, according to which the alarm system design must be followed. In theoretical part there are described in detail characteristics of alarm systems and its components, proper functioning principles, installation principle, advantages and disadvantages of use, individual steps of alarm system design and proposed methodology of alarm system design for security level 1 and 2. In practical part there are described the technologies used for the implementation of this paper, structure of created webpage and detailed steps of alarm system design, as seen by user during creating. The result of this paper is a webpage, which is divided into two parts: theoretical and practical. The theoretical part provides information about the alarm system architecture, alarm system design and established methodology for the alarm system design for security level 1 and 2. In the practical part the user, on the basis of gained information and interactive help, can create high-quality alarm system design that meets all the conditions for reliable function in real traffic.
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Freitas, Arthur. "Hardware/Software Co-Verification Using the SystemVerilog DPI." Universitätsbibliothek Chemnitz, 2007. http://nbn-resolving.de/urn:nbn:de:swb:ch1-200700941.

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During the design and verification of the Hyperstone S5 flash memory controller, we developed a highly effective way to use the SystemVerilog direct programming interface (DPI) to integrate an instruction set simulator (ISS) and a software debugger in logic simulation. The processor simulation was performed by the ISS, while all other hardware components were simulated in the logic simulator. The ISS integration allowed us to filter many of the bus accesses out of the logic simulation, accelerating runtime drastically. The software debugger integration freed both hardware and software engineers to work in their chosen development environments. Other benefits of this approach include testing and integrating code earlier in the design cycle and more easily reproducing, in simulation, problems found in FPGA prototypes.
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DU, BOYANG. "Fault Tolerant Electronic System Design." Doctoral thesis, Politecnico di Torino, 2016. http://hdl.handle.net/11583/2644047.

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Due to technology scaling, which means reduced transistor size, higher density, lower voltage and more aggressive clock frequency, VLSI devices may become more sensitive against soft errors. Especially for those devices used in safety- and mission-critical applications, dependability and reliability are becoming increasingly important constraints during the development of system on/around them. Other phenomena (e.g., aging and wear-out effects) also have negative impacts on reliability of modern circuits. Recent researches show that even at sea level, radiation particles can still induce soft errors in electronic systems. On one hand, processor-based system are commonly used in a wide variety of applications, including safety-critical and high availability missions, e.g., in the automotive, biomedical and aerospace domains. In these fields, an error may produce catastrophic consequences. Thus, dependability is a primary target that must be achieved taking into account tight constraints in terms of cost, performance, power and time to market. With standards and regulations (e.g., ISO-26262, DO-254, IEC-61508) clearly specify the targets to be achieved and the methods to prove their achievement, techniques working at system level are particularly attracting. On the other hand, Field Programmable Gate Array (FPGA) devices are becoming more and more attractive, also in safety- and mission-critical applications due to the high performance, low power consumption and the flexibility for reconfiguration they provide. Two types of FPGAs are commonly used, based on their configuration memory cell technology, i.e., SRAM-based and Flash-based FPGA. For SRAM-based FPGAs, the SRAM cells of the configuration memory highly susceptible to radiation induced effects which can leads to system failure; and for Flash-based FPGAs, even though their non-volatile configuration memory cells are almost immune to Single Event Upsets induced by energetic particles, the floating gate switches and the logic cells in the configuration tiles can still suffer from Single Event Effects when hit by an highly charged particle. So analysis and mitigation techniques for Single Event Effects on FPGAs are becoming increasingly important in the design flow especially when reliability is one of the main requirements.
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Books on the topic "Flash Interface"

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Aylward, Pete, Ken Jokol, Jamie Macdonald, Paul Prudence, Glen Rhodes, Robbie Shepherd, and Todd Yard. Flash MX Application & Interface Design. Berkeley, CA: Apress, 2002. http://dx.doi.org/10.1007/978-1-4302-5217-7.

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DiNucci, Darcy. Macromedia flash interface design: Twelve effective interfaces and why they work. Berkeley, Calif: Peachpit, 2003.

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Pete, Aylward, ed. Flash MX application & interface design: Data delivery, navigation, and fun in Flash MX, XML, and PHP. Birmingham: friends of ED, 2002.

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LordAlex, Leon, and SpringerLink (Online service), eds. Foundation Flash Catalyst. Berkeley, CA: Apress, 2010.

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Quick guide to Flash Catalyst. Sebastopol, CA: O'Reilly, 2011.

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Elmansy, Rafiq. Quick guide to Flash Catalyst. Sebastopol, CA: O'Reilly, 2011.

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service), ScienceDirect (Online, ed. Data visualization with Flash builder: Designing RIA and AIR applications with remote data sources. Burlington, MA: Focal Press, 2011.

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Andy, Beaumont, ed. Usable web menus. Birmingham, UK: Arden House, 2002.

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AdvancED Flash Interface Design. Apress, 2006. http://dx.doi.org/10.1007/978-1-4302-0164-9.

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Kemper, Michael, Brian Monnone, and Guido Rosso. AdvancED Flash Interface Design. Springer London, Limited, 2006.

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Book chapters on the topic "Flash Interface"

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Goralski, Greg, and LordAlex Leon. "Catalyst Interface." In Foundation Flash Catalyst, 1–25. Berkeley, CA: Apress, 2010. http://dx.doi.org/10.1007/978-1-4302-2863-9_1.

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Mebberson, Scott, and Steve Webster. "Interface design." In Foundation Flash MX Applications, 453–533. Berkeley, CA: Apress, 2003. http://dx.doi.org/10.1007/978-1-4302-5211-5_11.

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Silvagni, Andrea. "NAND DDR interface." In Inside NAND Flash Memories, 161–96. Dordrecht: Springer Netherlands, 2010. http://dx.doi.org/10.1007/978-90-481-9431-5_7.

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Mebberson, Scott, and Steve Webster. "User Interface Components." In Foundation Flash MX Applications, 189–222. Berkeley, CA: Apress, 2003. http://dx.doi.org/10.1007/978-1-4302-5211-5_7.

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Aylward, Pete, Ken Jokol, Jamie Macdonald, Paul Prudence, Glen Rhodes, Robbie Shepherd, and Todd Yard. "A Flash Family Tree." In Flash MX Application & Interface Design, 73–102. Berkeley, CA: Apress, 2002. http://dx.doi.org/10.1007/978-1-4302-5217-7_4.

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Novikoff, Tim. "Flash of Genius: SAT Vocab." In iPhone User Interface Design Projects, 111–26. Berkeley, CA: Apress, 2009. http://dx.doi.org/10.1007/978-1-4302-2360-3_6.

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Green, Tom, and Tiago Dias. "Learning the Flash CS5 Professional Interface." In Foundation Flash CS5 for Designers, 1–65. Berkeley, CA: Apress, 2010. http://dx.doi.org/10.1007/978-1-4302-2995-7_1.

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Green, Tom, and David Stiller. "Learning the Flash CS4 Professional Interface." In Foundation Flash CS4 for Designers, 3–53. Berkeley, CA: Apress, 2009. http://dx.doi.org/10.1007/978-1-4302-1094-8_1.

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Aylward, Pete, Ken Jokol, Jamie Macdonald, Paul Prudence, Glen Rhodes, Robbie Shepherd, and Todd Yard. "Real Feel Interfaces." In Flash MX Application & Interface Design, 45–72. Berkeley, CA: Apress, 2002. http://dx.doi.org/10.1007/978-1-4302-5217-7_3.

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Aylward, Pete, Ken Jokol, Jamie Macdonald, Paul Prudence, Glen Rhodes, Robbie Shepherd, and Todd Yard. "Making XML Work for Your Interface." In Flash MX Application & Interface Design, 103–34. Berkeley, CA: Apress, 2002. http://dx.doi.org/10.1007/978-1-4302-5217-7_5.

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Conference papers on the topic "Flash Interface"

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Retelny, Daniela, Sébastien Robaszkiewicz, Alexandra To, Walter S. Lasecki, Jay Patel, Negar Rahmati, Tulsee Doshi, Melissa Valentine, and Michael S. Bernstein. "Expert crowdsourcing with flash teams." In UIST '14: The 27th Annual ACM Symposium on User Interface Software and Technology. New York, NY, USA: ACM, 2014. http://dx.doi.org/10.1145/2642918.2647409.

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Khuu, Vinh, Michael Osterman, Avram Bar-Cohen, and Michael Pecht. "Thermal Performance Measurements of Thermal Interface Materials Using the Laser Flash Method." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33554.

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Thermal interface materials are used to reduce the interfacial thermal resistance between contacting surfaces inside electronic packages, such as at the die-heat sink or heat spreader-heat sink interfaces. In this study, the change in thermal performance was measured for elastomeric gap pads, gap fillers, and an adhesive throughout reliability tests. Three-layer composite structures were used to simulate loading conditions encountered by thermal interface materials in actual applications. The thermal resistance of the thermal interface material, including contact and bulk resistance, was calculated using the Lee algorithm, an iterative method that uses properties of the single layers and the 3-layer composite structures, measured using the laser flash method. Test samples were subjected to thermal cycling tests, which induced thermomechanical stresses due to the mismatch in the coefficients of thermal expansion of the dissimilar coupon materials. The thermal resistance measurements from the laser flash showed little change or slight improvement in the thermal performance over the course of temperature cycling. Scanning acoustic microscope images revealed delamination in one group of gap pad samples and cracking in the putty samples.
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Oh, Gihwan, Chiyoung Seo, Ravi Mayuram, Yang-Suk Kee, and Sang-Won Lee. "SHARE Interface in Flash Storage for Relational and NoSQL Databases." In SIGMOD/PODS'16: International Conference on Management of Data. New York, NY, USA: ACM, 2016. http://dx.doi.org/10.1145/2882903.2882910.

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Chen, Zhe, and Koji Kagawa. "WappenLite and its Flash-based user interface for novice learners." In 2010 International Conference on Information and Automation (ICIA). IEEE, 2010. http://dx.doi.org/10.1109/icinfa.2010.5512458.

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Kim, Aeri, and Seokhyeong Kang. "Data Protection Method for Flash Memory in Serial Peripheral Interface." In 2021 18th International SoC Design Conference (ISOCC). IEEE, 2021. http://dx.doi.org/10.1109/isocc53507.2021.9613871.

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Hwang Huh, ChunWoo Jeon, CheolWoo Yang, JaeSeok Park, TaeHeui Kwon, TaiKyu Kang, ChangWon Yang, et al. "A 64Gb NAND Flash Memory with 800MB/s Synchronous DDR Interface." In 2012 4th IEEE International Memory Workshop (IMW). IEEE, 2012. http://dx.doi.org/10.1109/imw.2012.6213644.

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O’neal, Jared, Klaus Weide, and Anshu Dubey. "Experience report: refactoring the mesh interface in FLASH, a multiphysics software." In 2018 IEEE 14th International Conference on e-Science (e-Science). IEEE, 2018. http://dx.doi.org/10.1109/escience.2018.00141.

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Huawei, Huang, and Lai Xiaohong. "In-System Programming Outer-Chip Flash of DSP with Ethernet Interface." In 2009 WRI World Congress on Computer Science and Information Engineering. IEEE, 2009. http://dx.doi.org/10.1109/csie.2009.518.

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Ban, Heng, and Zilong Hua. "Laser Flash Measurement of Samples With a Transparent Reference Layer." In ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences. ASMEDC, 2009. http://dx.doi.org/10.1115/ht2009-88584.

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The laser flash method is a standard method for thermal diffusivity measurement. This paper reports the development of a method and theory that extends the standard laser flash method to measure thermal conductivity and thermal diffusivity simultaneously. By attaching a transparent reference layer with known thermal properties on the back of a sample, the thermal conductivity and thermal diffusivity of the sample can be extracted from the temperature response of the interface between the sample and the reference layer to a heating pulse on the front surface. The theory can be applied for sample and reference layer with different thermal properties and thickness, and the original analysis of the laser flash method becomes a limiting case of the current theory with an infinitely small thickness of the reference layer. The uncertainty analysis was performed and results indicated that the laser flash method can be used to extract the thermal conductivity and diffusivity of the sample. The results can be applied to, for instance, opaque liquid in a quartz dish with silicon infrared detector measuring the temperature of liquid-quartz interface through the quartz.
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Zhang, Yu, Chongfei Shen, Lang Tan, Zhiyuan Gao, Zhijie Chen, Xu Liu, and Peiyuan Wan. "A QSPI Interface Supporting ‘Bits-Decoding’ for High-Speed Access to Flash." In 2022 IEEE 16th International Conference on Anti-counterfeiting, Security, and Identification (ASID). IEEE, 2022. http://dx.doi.org/10.1109/asid56930.2022.9995778.

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Reports on the topic "Flash Interface"

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Shrestha, A. B., and N. S. Pradhan. Strengthening Flash Flood Risk Management in the Hindu Kush Himalayas; The need for specific policies and better interfaces with local institutions. Kathmandu, Nepal: International Centre for Integrated Mountain Development (ICIMOD), 2015. http://dx.doi.org/10.53055/icimod.612.

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