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Journal articles on the topic 'Fine grinding'

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Published: 4 June 2021
Last updated: 9 February 2022

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1

Dodds, John, Christine Frances, Pierre Guigon, and Alain Thomas. "Investigations into Fine Grinding." KONA Powder and Particle Journal 13 (1995): 113–24. http://dx.doi.org/10.14356/kona.1995016.

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2

Lai, Hsin-Yi, and Chao'-Kuang Chen. "Surface Fine Grinding via a Regenerative Grinding Methodology." Journal of Physics: Conference Series 48 (October 1, 2006): 1210–21. http://dx.doi.org/10.1088/1742-6596/48/1/226.

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3

SAKATA, Naoki, Nobuhide ITOH, Hitoshi OHMORI, Teruko KATOU, Katsuhumi INAZAWA, and Takashi MATSUZAWA. "ELID grinding with fine bubble containing grinding fluid." Proceedings of Yamanashi District Conference 2018 (2018): YC2018–095. http://dx.doi.org/10.1299/jsmeyamanashi.2018.yc2018-095.

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4

TAKAHASHI, Takumi, Nobuhide ITOH, Takeru SAKAMOTO, Tsubasa WATANABE, Katsufumi INAZAWA, Takashi MATSUZAWA, and Hitoshi OOMORI. "ELID grinding using grinding fluid containing fine bubbles." Proceedings of Ibaraki District Conference 2019.27 (2019): 703. http://dx.doi.org/10.1299/jsmeibaraki.2019.27.703.

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5

NAKAJIMA, Toshikatsu, Yoshiyuki UNO, and Takanori FUJIWARA. "Grinding process of fine ceramics." Journal of the Japan Society for Precision Engineering 52, no. 1 (1986): 120–26. http://dx.doi.org/10.2493/jjspe.52.120.

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6

Peukert, Wolfgang. "Material properties in fine grinding." International Journal of Mineral Processing 74 (December 2004): S3—S17. http://dx.doi.org/10.1016/j.minpro.2004.08.006.

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7

Pei, Z. J., and Alan Strasbaugh. "Fine grinding of silicon wafers." International Journal of Machine Tools and Manufacture 41, no. 5 (April 2001): 659–72. http://dx.doi.org/10.1016/s0890-6955(00)00101-2.

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8

Hogg, R., A. J. Dynys, and H. Cho. "Fine grinding of aggregated powders." Powder Technology 122, no. 2-3 (January 2002): 122–28. http://dx.doi.org/10.1016/s0032-5910(01)00407-7.

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9

Yusupov, T. S., and E. A. Kirillova. "Surfactants in fine ore grinding." Journal of Mining Science 46, no. 5 (September 2010): 582–86. http://dx.doi.org/10.1007/s10913-010-0073-y.

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10

Kanda, Y., Y. Abe, and H. Sasaki. "An examination of ultra-fine grinding by preferential grinding." Powder Technology 56, no. 3 (November 1988): 143–48. http://dx.doi.org/10.1016/0032-5910(88)80025-1.

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11

Novák, Martin. "New Ways at the Fine Grinding." Key Engineering Materials 581 (October 2013): 255–60. http://dx.doi.org/10.4028/www.scientific.net/kem.581.255.

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The traditional approach to grinding is to operate within the limits of surface quality. The requirements for surface quality in grinding are higher than those in other common machining operations such as turning and milling. The surface quality of machined parts is very important for precise production and assembly. When we focus on roughness parameters after grinding, we can establish the limits of these parameters for typical grain materials: Al2O3, SiC, CBN, SG and others. Increasing demands on accuracy and quality of production leads to research concerned with the properties of these materials and the surface quality after grinding. This paper shows new possibilities for the ground surface with focus on surface roughness obtained under varying combinations of cutting conditions. The influence of the grinding wheel, cutting parameters and coolant on higher surface quality is assessed by roughness parameters Ra, Rz, Rt and the Material portion of a surface profile. These high-precision ground surfaces are shown to have a Nanometres (10-9) unit topography demonstrating that the process is able to replace other finishing technologies such as superfinishing or honing.
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12

JIMBO, Genji. "Recent development of fine grinding machines toward fine technology." Journal of the Society of Powder Technology, Japan 26, no. 6 (1989): 444–50. http://dx.doi.org/10.4164/sptj.26.444.

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13

Xiao, Qingfei, Bo Li, and Huaibin Kang. "The Effect of Fine Grinding Medium Feature on Grinding Results." AASRI Procedia 7 (2014): 120–25. http://dx.doi.org/10.1016/j.aasri.2014.05.039.

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14

Zhao, Long, Omar Bafakeeh, Hao Liu, and Ioan D. Marinescu. "ELID Fine Grinding of SiC Bearing Rollers." Key Engineering Materials 686 (February 2016): 204–11. http://dx.doi.org/10.4028/www.scientific.net/kem.686.204.

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Electrolytic in-process dressing (ELID) grinding is drawing more and more attention by the researchers for its smart method of in-process dressing of the grinding wheel. Many researches place emphasis on study of in-processing dressing and oxide layer. In this study, the effects of three grinding factors, including wheel speed, load applied on workpiece and eccentricity of three parts in one holder, on surface roughness (Ra) and material removal rate (MRR) were investigated in a single-side ELID grinding experiment. Each factor has three levels. The experimental results show that each factor has different influence: 1. Applied load is the main factor which significantly affects the Ra and MRR; 2. the speed of grinding wheel doesn’t show much influence; 3. eccentricity has a great influence on roughness but not on material removal rate.
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15

KANDA, Yositeru, Yasushi ABE, Mitsuhiro ICHIMURA, Yutaka SEYA, and Torajirou HONMA. "Fine Grinding by Wet Ball Mill." Journal of the Mining Institute of Japan 102, no. 1186 (1986): 865–68. http://dx.doi.org/10.2473/shigentosozai1953.102.1186_865.

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16

Kuwahara, Yoshitaka, Kazuo Suzuki, and Nobuyuki Azuma. "Increase of impurity during fine grinding." Advanced Powder Technology 1, no. 1 (1990): 51–60. http://dx.doi.org/10.1016/s0921-8831(08)60727-x.

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17

Kryuchkov, Yu N. "Fine grinding of ceramic materials (review)." Glass and Ceramics 49, no. 8 (August 1992): 375–78. http://dx.doi.org/10.1007/bf00677865.

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18

Prziwara, Paul, and Arno Kwade. "Grinding aid additives for dry fine grinding processes – Part II: Continuous and industrial grinding." Powder Technology 394 (December 2021): 207–13. http://dx.doi.org/10.1016/j.powtec.2021.08.039.

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19

Choi, Woo Sik. "Grinding rate improvement using composite grinding balls in an ultra-fine grinding mill. Kinetic analysis of grinding." Powder Technology 100, no. 1 (November 1998): 78. http://dx.doi.org/10.1016/s0032-5910(98)00073-4.

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20

Chidambaram, S., Z. J. Pei, and S. Kassir. "Fine grinding of silicon wafers: a mathematical model for grinding marks." International Journal of Machine Tools and Manufacture 43, no. 15 (December 2003): 1595–602. http://dx.doi.org/10.1016/s0890-6955(03)00187-1.

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21

Tanaka, Tatsuo. "Optimum Design for Fine and Ultrafine Grinding Mechanisms Using Grinding Media." KONA Powder and Particle Journal 13 (1995): 19–29. http://dx.doi.org/10.14356/kona.1995007.

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22

Chen, Feng Jun, Shao Hui Yin, Hitoshi Ohmori, and Kazutoshi Katahira. "Surface Roughness Characteristics of Fine ELID Cross Grinding for Silicon Wafers." Advanced Materials Research 97-101 (March 2010): 4106–10. http://dx.doi.org/10.4028/www.scientific.net/amr.97-101.4106.

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Silicon is widely used as the most important substrate material in integrated circuit and micro electronic devices field. Electrolytic in-process dressing (ELID) grinding technique is an effective grinding process especially for machining hard and brittle material. In this paper, using super fine abrasive wheel, sets of ELID cross grinding experiment were conducted for investigating the influences of various grinding conditions including grain sizes, rotation speeds of grinding wheel, rotation speeds of workpiece and ELID conditions on surface roughness during grinding silicon wafers. Surface roughness characteristics of fine ELID cross grinding for silicon wafers were discussed. In an optimized condition, surface roughness of 2.2 nm in Ra can be achieved by using #20000 wheel.
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23

CHOI, Woo Sik. "Grinding Rate Improvement Using a Composite Grinding Ball Size for an Ultra-fine Grinding Mill." Journal of the Society of Powder Technology, Japan 33, no. 9 (1996): 747–52. http://dx.doi.org/10.4164/sptj.33.747.

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24

Lyons, David J., Angus E. McElnea, Niki P. Finch, and Claire Tallis. "Ultra-fine grinding is not essential for acid sulfate soil tests." Soil Research 49, no. 5 (2011): 439. http://dx.doi.org/10.1071/sr10196.

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Australian Standard methods for acid sulfate soils (ASS) require the grinding of soil to <0.075 mm. A ring-mill or similar grinding apparatus is therefore needed. We investigated whether ring-mill grinding is required for accurate and reproducible test results and associated calculations (such as acid–base accounting), or if more conventional fine-grinding (i.e. <0.5 mm) is sufficient to obtain acceptable results. An initial experiment (unreplicated) was conducted on 52 soils comparing ring-mill and fine-grinding treatments, and this information was used to formulate final, more detailed experimental work on five soils from the same dataset. Soils from an ASS survey in coastal central Queensland were chosen to reflect the range of chemical properties found in ASS. Soils were analysed by the Chromium and SPOCAS suite of tests for the two grinding treatments. For those tests that follow a relatively vigorous extraction carried out with heating [such as chromium-reducible S, peroxide-oxidisable S and acid-neutralising capacity by back titration (ANCBT)], results were similar for the two grinding treatments. However, for those tests that follow a relatively mild extraction without heating (such as KCl-extractable S, HCl-extractable S and titratable actual acidity), significantly higher values (P < 0.05) were obtained for ring-mill ground soil. There was no significant difference in calculated net acidity between ring-mill grinding and fine-grinding for soils without excess ANC. For self-neutralising soils, fine-grinding gave significantly lower values of ANC than ring-mill grinding. It is uncertain whether ring-mill grinding gives a true reflection of the ANC available in the natural environment.
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25

Inazawa, Katsufumi, Hitoshi Ohmori, and Nobuhide Itoh. "Effects of O2 Fine Bubbles on ELID Grinding Using Conductive Rubber Bond Grinding Wheel." International Journal of Automation Technology 13, no. 5 (September 5, 2019): 657–64. http://dx.doi.org/10.20965/ijat.2019.p0657.

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This study proposes a new grinding system using grinding fluid containing oxygenic fine bubbles (O2FBs) to realize high-performance electrolytic in-process dressing (ELID) using a conductive rubber bond grinding wheel. It was found that grinding fluid containing O2FBs dramatically increases the dissolved oxygen in the grinding fluid. In addition, the O2FBs in the fluid are drawn to the conductive rubber bond grinding wheel, which is the positive pole, during ELID. These effects are thought to enhance the dressing performance of the conductive rubber bond grinding wheel. Grinding of pure titanium using the proposed grinding system was found to realize mirror surface finishing while increasing the amount of removed workpiece material, compared to when ELID was not applied and to when ELID grinding was conducted using a normal grinding fluid. Effects of ELID grinding on surface modification were also observed, confirming that the proposed grinding system is able to form a thick oxidized film on pure titanium.
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26

Xu, Wei, Jun Kong, and Cai Jun Liu. "Development and Application of Fine Rubber Powder Production Technology." Applied Mechanics and Materials 709 (December 2014): 380–83. http://dx.doi.org/10.4028/www.scientific.net/amm.709.380.

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Introduction of fine rubber powder use, production process and production equipment. In rubber industry for direct forming or rubber and rubber for; modification and applications in non rubber industry rubber powder mainly into the plastic and asphalt materials. Fine rubber powder production process includes dry grinding, wet grinding, cryogenic grinding and the physical and chemical method. The main equipment, rubber powder production is often cold mill or screw extruder.
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27

OKUDA, Satoshi. "Fundamental consieration on ultra fine grinding mechanisms." Journal of the Society of Powder Technology, Japan 22, no. 6 (1985): 409–14. http://dx.doi.org/10.4164/sptj.22.409.

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28

Buyanova, I. V., and J. К. Imangalieva. "Unit for fine grinding of cottage cheese." Journal International Academy of Refrigeration 15, no. 3 (2016): 23–26. http://dx.doi.org/10.21047/1606-4313-2016-15-3-23-26.

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29

FUJIOKA, Kanzo. "Fine grinding of coal by TOWER MILL." Journal of the Fuel Society of Japan 69, no. 9 (1990): 791–95. http://dx.doi.org/10.3775/jie.69.9_791.

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30

Ovchinnikov, P. "Mathematical models for fine grinding of powders." Advanced Powder Technology 4, no. 3 (1993): 179–89. http://dx.doi.org/10.1016/s0921-8831(08)60641-x.

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31

BORZONE, L. A., and R. R. ODER. "Cost Factors in Fine Grinding of Coal." Coal Preparation 10, no. 1-4 (January 1992): 133–44. http://dx.doi.org/10.1080/07349349208905198.

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32

Hennart, S. L. A., W. J. Wildeboer, P. van Hee, and G. M. H. Meesters. "Stability of particle suspensions after fine grinding." Powder Technology 199, no. 3 (May 2010): 226–31. http://dx.doi.org/10.1016/j.powtec.2010.01.010.

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33

Partyka, T., and D. Yan. "Fine grinding in a horizontal ball mill." Minerals Engineering 20, no. 4 (April 2007): 320–26. http://dx.doi.org/10.1016/j.mineng.2006.12.003.

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34

Pei, Z. J., and Alan Strasbaugh. "Fine grinding of silicon wafers: designed experiments." International Journal of Machine Tools and Manufacture 42, no. 3 (February 2002): 395–404. http://dx.doi.org/10.1016/s0890-6955(01)00123-7.

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35

Aman, S., and J. Tomas. "Mechanoluminscence during Wet Grinding of Fine Particles." Chemical Engineering & Technology 27, no. 12 (December 2004): 1258–61. http://dx.doi.org/10.1002/ceat.200407030.

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36

Boldyrev, V. V., S. V. Pavlov, and E. L. Goldberg. "Interrelation between fine grinding and mechanical activation." International Journal of Mineral Processing 44-45 (March 1996): 181–85. http://dx.doi.org/10.1016/0301-7516(95)00028-3.

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37

SAKAMOTO, Takeru, Nobuhide ITOH, Tsubasa WATANABE, Takumi TAKAHASHI, Hitoshi OHMORI, Teruko KATO, and Katsufumi INAZAWA. "Influence of fine bubbles on ELID grinding." Proceedings of Yamanashi District Conference 2019 (2019): C32. http://dx.doi.org/10.1299/jsmeyamanashi.2019.c32.

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38

Buddhachakara, Salakjitt, and Wipawee Tharmmaphornphilas. "Determination of Bore Grinding Machine Parameters to Reduce Cycle Time." Advanced Materials Research 974 (June 2014): 413–17. http://dx.doi.org/10.4028/www.scientific.net/amr.974.413.

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This paper applies a central composite design (CCD) to determine proper machine parameters to reduce the cycle time of a bore grinding process. There are 6 machine parameters, which are rough grinding 2 starting position, fine grinding starting position, speed of rough grinding 1, speed of rough grinding 2, speed of rough grinding 3 and speed of fine grinding and 2 types of responses, which are cycle time and surface roughness considered in this study. A half CCD is used to find the optimal machine setup parameters. The experiment shows that new machine conditions can reduce cycle time from 2.98 second per piece to 2.76 second per piece and control surface roughness within specification of 1.0 um. After implementing the new machine conditions in the real setting, we found that the average actual cycle time is 2.76 second per piece with roughness of 0.841 um.
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39

Gokcen, H. S., S. Cayirli, Y. Ucbas, and K. Kayaci. "The effect of grinding aids on dry micro fine grinding of feldspar." International Journal of Mineral Processing 136 (March 2015): 42–44. http://dx.doi.org/10.1016/j.minpro.2014.10.001.

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40

SAWA, Takekazu, Yasushi IKUSE, Kuniaki UNNO, and Noboru MORITA. "Formulation of Grinding Force of Fine-ceramics in Constant-Cut Surface Grinding." Journal of the Japan Society for Precision Engineering 76, no. 5 (2010): 567–71. http://dx.doi.org/10.2493/jjspe.76.567.

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41

Sun, Wangping, Z. J. Pei, and G. R. Fisher. "Fine grinding of silicon wafers: effects of chuck shape on grinding marks." International Journal of Machine Tools and Manufacture 45, no. 6 (May 2005): 673–86. http://dx.doi.org/10.1016/j.ijmachtools.2004.09.020.

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42

Schrank, Maximilian, Jens Brimmers, and Thomas Bergs. "Potentials of Vitrified and Elastic Bonded Fine Grinding Worms in Continuous Generating Gear Grinding." Journal of Manufacturing and Materials Processing 5, no. 1 (January 5, 2021): 4. http://dx.doi.org/10.3390/jmmp5010004.

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Continuous generating gear grinding with vitrified grinding worms is an established process for the hard finishing of gears for high-performance transmissions. Due to the increasing requirements for gears in terms of power density, the required surface roughness is continuously decreasing. In order to meet the required tooth flank roughness, common manufacturing processes are polish grinding with elastic bonded grinding tools and fine grinding with vitrified grinding tools. The process behavior and potential of the different bonds for producing super fine surfaces in generating gear grinding have not been sufficiently scientifically investigated yet. Therefore, the objective of this report is to evaluate these potentials. Part of the investigations are the generating gear grinding process with elastic bonded, as well as vitrified grinding worms with comparable grit sizes. The potential of the different tool specifications is empirically investigated independent of the grain size, focusing on the influence of the bond. One result of the investigations was that the tooth flank roughness could be reduced to nearly the same values with the polish and the fine grinding tool. Furthermore, a dependence of the roughness on the selected grinding parameters could not be determined. However, it was found out that the profile line after polish grinding is significantly dependent on the process strategy used.
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43

Prziwara, Paul, and Arno Kwade. "Grinding aids for dry fine grinding processes – Part I: Mechanism of action and lab-scale grinding." Powder Technology 375 (September 2020): 146–60. http://dx.doi.org/10.1016/j.powtec.2020.07.038.

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44

Zhou, Zhao Zhong, Kai Ping Feng, Bing Hai Lv, Hong Wei Fan, and Ju Long Yuan. "Analysis on Wear of Self-Sharpening Fine Super-Hard Abrasive Tool." Advanced Materials Research 797 (September 2013): 528–33. http://dx.doi.org/10.4028/www.scientific.net/amr.797.528.

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In order to improve the efficiency of ultra-precision processing, the self-sharpening fine super-hard abrasive tool is presented to reduce or eliminate the surface and subsurface defects and improve the process efficiency. In the study of efficient experimental research of self-sharpening fine super-hard abrasive tool, base on single factor experiments such as additives composition, grinding speed, grinding pressure and processing liquid. The results showed that the wear rate of the self-sharpening fine super-hard abrasive tool can reach appropriate rate when the additive concentration 30wt%, grinding pressure 45N, grinding speed 60rpm and processing liquid 1wt%.
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45

Kasuga, H., Hitoshi Ohmori, Wei Min Lin, Y. Watanabe, T. Mishima, and Toshiro K. Doi. "Efficient Super-Smooth Finishing Characteristics of SiC Materials through the Use of Fine-Grinding." Key Engineering Materials 404 (January 2009): 137–41. http://dx.doi.org/10.4028/www.scientific.net/kem.404.137.

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Silicon carbide (SiC) materials have increasingly been needed in the wide range of industries, such as for structural components, automobile parts, space telescope, X-ray mirror, and next-generation semiconductors. However, SiC materials have difficulties in super-smooth finishing because of their hard and brittle characteristics. The authors have been investigating appropriate conditions on their finishing by fine-grinding with the unique grinding process called ELID (Electrolytic In-process Dressing) grinding method. The ELID grinding method has a stable grinding ability, so very detailed characteristics of their material-remove mechanisms were to be investigated. Surface analysis of each material has been discussed through the ELID, and this study proposes good finishing conditions for SiC. In this paper, the advantages of the applied fine-grinding are shown, and unique features on grinding characteristics of SiC through various grinding experimental parameters are described.
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46

Zhang, Yin Xia, Jian Xiu Su, Wei Gao, and Ren Ke Kang. "Study on Subsurface Damage Model of the Ground Monocrystallinge Silicon Wafers." Key Engineering Materials 416 (September 2009): 66–70. http://dx.doi.org/10.4028/www.scientific.net/kem.416.66.

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In order to better understand the grinding mechanism, the rough, semi-fine and fine ground silicon wafer subsurface damage models are experimentally investigated with the aid of advanced measurement methods. The results show that the rough ground wafer subsurface damage model is composed of large quantity of microcracks with complicated configurations, high density dislocations, stalk faults and elastic deformation layer. Among them microcracks, dislocations and stalk faults are dominant. Apart from the above damage, the amorphous layer and polycrystalline layer (Si-I, Si-III, Si-IV and Si-XII) exist in the semi-fine ground and fine ground wafer subsurface damage models. The amorphous layer depth firstly increases from rough grinding to semi-fine grinding and then decreases from semi-fine grinding to fine grinding. The damage model can be divided in severe damage part and elastic deformation part with high stress. When the material is removed by ductile mode two parts are all small and the ratio of second part is relatively great.
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47

Wu, Yan, Bo Zhao, and Xun Sheng Zhu. "Modeling of Material Removal in Workpiece Lateral Ultrasonic Vibration Grinding of Fine-Crystalline Zirconia Ceramics." Key Engineering Materials 315-316 (July 2006): 304–8. http://dx.doi.org/10.4028/www.scientific.net/kem.315-316.304.

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Based on the grain movement model of ultrasonic grinding, models representing the grinding force of single abrasive and the material removal rate (MRR) are deduced and verified. Mechanism of high efficiency material removal in work lateral ultrasonic vibration grinding (WLUVG) was analyzed. The MRR of fine-crystalline ZrO2 ceramics in WLUVG and conventional grinding (CG) with diamond wheel were researched experimentally in this work. The effects on the MRR, the surface roughness and microstructure of the process parameters and the size of abrasive are measured. It has been concluded that: (1) the MRR in ultrasonic grinding process is two times as large as that of in CG. (2) any increase in the amount of energy imparted to the workpiece in terms of the average diameter of grains, grinding depth both in with and without ultrasonic grinding, will result in an increase in the MRR and the surfaces roughness. (3) the ultrasonic grinding surface had no spur and build-up edge and its surface roughness was smaller than CG significantly. Surface quality of vibration grinding is superior to that of CG, it is easy for ultrasonic vibration grinding that material removal mechanism is ductile mode grinding.
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48

Bi, F. F., Qiu Sheng Yan, and N. Q. Wu. "On Electrorheological Effect Instantaneous Tiny Grinding Wheel for Fine Machining." Key Engineering Materials 304-305 (February 2006): 181–85. http://dx.doi.org/10.4028/www.scientific.net/kem.304-305.181.

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As a special instantaneous bond, particle-dispersed Electrorheological-fluid (ER fluid) is used to cohere abrasive particles in the ER fluid so as to form dynamical tiny grinding wheel in grinding. This technique eliminates the dimension restriction of traditional concretion abrasive grinding wheel and is applicable in optics glass polishing to meet machining demands for micro-apparatus within millimeter or sub-millimeter microstructure. By regulating some parameters such as voltage, ingredient, volume rate of ER fluid, machining time, as well as distance between cone-tool and workpiece etc, the size, rigidity, and abrasive mutual combine-intensity of the micro grinding wheel can be controlled in order to achieve an expected machining effect. Experiments have been carried out by using SEM to analyze the characteristics in applying this technique.
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49

Liang, Bing, Li Bing Zhao, and Jin Rui Zhang. "Xperimental Research on Grinding Medium and Influence Factors of SiJiaYing's Fine Grain Hematite." Advanced Materials Research 641-642 (January 2013): 557–61. http://dx.doi.org/10.4028/www.scientific.net/amr.641-642.557.

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SiJiaYing's iron ore is fine grain hematite and gangue mineral is quartz,chlorite,black mica and parts of clay mineral.Grinding process is tend to argillation,which seriously impact the subsequent strong magnetic and flotation thick operation.This paper mainly conduct ball mill sphere diameter,ball ratio and the grinding effect factor test,which including medium filling ratio,grinding concentration and so on.By compared experiments optimize,grinding process and improve the grinding effect.
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50

SIKONG, Lek, Hitoshi HASHIMOTO, and Saburo YASHIMA. "Effective fine grinding of coal by a ball-race mill with grinding additives." Shigen-to-Sozai 107, no. 1 (1991): 41–46. http://dx.doi.org/10.2473/shigentosozai.107.41.

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