Academic literature on the topic 'Fine grinding'
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Journal articles on the topic "Fine grinding"
Dodds, John, Christine Frances, Pierre Guigon, and Alain Thomas. "Investigations into Fine Grinding." KONA Powder and Particle Journal 13 (1995): 113–24. http://dx.doi.org/10.14356/kona.1995016.
Full textLai, Hsin-Yi, and Chao'-Kuang Chen. "Surface Fine Grinding via a Regenerative Grinding Methodology." Journal of Physics: Conference Series 48 (October 1, 2006): 1210–21. http://dx.doi.org/10.1088/1742-6596/48/1/226.
Full textSAKATA, Naoki, Nobuhide ITOH, Hitoshi OHMORI, Teruko KATOU, Katsuhumi INAZAWA, and Takashi MATSUZAWA. "ELID grinding with fine bubble containing grinding fluid." Proceedings of Yamanashi District Conference 2018 (2018): YC2018–095. http://dx.doi.org/10.1299/jsmeyamanashi.2018.yc2018-095.
Full textTAKAHASHI, Takumi, Nobuhide ITOH, Takeru SAKAMOTO, Tsubasa WATANABE, Katsufumi INAZAWA, Takashi MATSUZAWA, and Hitoshi OOMORI. "ELID grinding using grinding fluid containing fine bubbles." Proceedings of Ibaraki District Conference 2019.27 (2019): 703. http://dx.doi.org/10.1299/jsmeibaraki.2019.27.703.
Full textNAKAJIMA, Toshikatsu, Yoshiyuki UNO, and Takanori FUJIWARA. "Grinding process of fine ceramics." Journal of the Japan Society for Precision Engineering 52, no. 1 (1986): 120–26. http://dx.doi.org/10.2493/jjspe.52.120.
Full textPeukert, Wolfgang. "Material properties in fine grinding." International Journal of Mineral Processing 74 (December 2004): S3—S17. http://dx.doi.org/10.1016/j.minpro.2004.08.006.
Full textPei, Z. J., and Alan Strasbaugh. "Fine grinding of silicon wafers." International Journal of Machine Tools and Manufacture 41, no. 5 (April 2001): 659–72. http://dx.doi.org/10.1016/s0890-6955(00)00101-2.
Full textHogg, R., A. J. Dynys, and H. Cho. "Fine grinding of aggregated powders." Powder Technology 122, no. 2-3 (January 2002): 122–28. http://dx.doi.org/10.1016/s0032-5910(01)00407-7.
Full textYusupov, T. S., and E. A. Kirillova. "Surfactants in fine ore grinding." Journal of Mining Science 46, no. 5 (September 2010): 582–86. http://dx.doi.org/10.1007/s10913-010-0073-y.
Full textKanda, Y., Y. Abe, and H. Sasaki. "An examination of ultra-fine grinding by preferential grinding." Powder Technology 56, no. 3 (November 1988): 143–48. http://dx.doi.org/10.1016/0032-5910(88)80025-1.
Full textDissertations / Theses on the topic "Fine grinding"
Conway-Baker, Jamie. "Measurement and modelling of fine grinding." Thesis, University of Exeter, 2001. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.403075.
Full textKarinkanta, P. (Pasi). "Dry fine grinding of Norway spruce (Picea abies) wood in impact-based fine grinding mills." Doctoral thesis, Oulun yliopisto, 2015. http://urn.fi/urn:isbn:9789526207193.
Full textTiivistelmä Puujauheita käytetään laajalti erilaisissa sovelluksissa, kuten esimerkiksi biokomposiiteissa ja suodattimissa. Tämän lisäksi on olemassa paljon tutkimustietoa siitä, kuinka puujauheita voitaisiin hyödyntää laajemminkin. Puu voidaan mekaanisesti prosessoida alle 100 µm:n kokoluokkaan, mutta yksityiskohtaista tietoa kuivahienojauhatuksen olosuhteiden vaikutuksesta jauheiden morfologiaan ja selluloosan kiteisyyteen ei ole saatavilla. Puujauheen morfologialla ja selluloosan kiteisyydellä on kuitenkin merkittävä vaikutus sovelluksia ja jatkojalostusta ajatellen. Puun kuivahienojauhatuksen tiedon puute hankaloittaa merkittävästi prosessin suunnittelua ja optimointia erilaisia sovelluksia varten. Tämän väitöskirjan tavoitteena on selvittää iskuihin perustuvien hienojauhimien vaikutukset puun ominaisuuksiin ja tutkia mekaanisen prosessoinnin energiatehokkuutta hienojauhatuksessa. Tutkimuksessa selvitettiin kolmen erilaisen iskuun perustuvan hienojauhatusmyllyn pääasiallisten operointiparametrien vaikutusta kuivatun metsäkuusen ominaisuuksiin ja energiankulutukseen. Jokaisella hienojauhimella onnistuttiin tuottamaan puujauhoja, joiden mediaanikoko oli alle 25 µm. Iskuihin perustuvalla jauhinkappalemyllyllä saatiin tuotettua puujauhoa, jonka selluloosan kiteisyys on alhaisempi ja partikkelimuodot pyöreämpiä verrattuna samankokoisiin puujauhoihin, jotka on tuotettu iskuihin perustuvilla jauhinkappaleettomilla hienojauhatusmyllyillä. Työssä saatiin käytännöllinen arvio kuivatun metsäkuusen hienojauhatuksen minimienergiankulutukselle iskuihin perustuville jauhinkappalemyllyille, mitä voidaan käyttää kyseisten myllytyyppien optimoinnin tavoitteena. Työssä havaittiin lisäksi, että kryogeenisiä jauhatusolosuhteita käyttämällä voidaan tuottaa erilaisia puujauhoja verrattuna puujauhoihin, jotka prosessoidaan ilman nestetyppijäädytystä, kun jauhatus suoritetaan iskuihin perustuvalla jauhinkappalemyllyllä. Ilman nestetyppijäädytystä puun kosteuspitoisuudella on merkittävämpi vaikutus puujauhojen ominaisuuksiin kuin kryogeenisissä olosuhteissa jauhetuilla. Kryogeenisillä jauhatusolosuhteilla voidaan parantaa myös jauhatuksen energiatehokkuutta. Torrefioinnilla voidaan vähentää hienojauhatuksen energiankulutusta iskuihin perustuvilla jauhinkappalemyllyillä, kun tavoitekoon mediaani on yli 17,4 µm (± 0,2 µm). Torrefioinnilla ei ole vaikutusta selluloosan kiteisyyteen tai partikkeleiden muotoon energiankulutuksen funktiona
Brown, Michael Duane. "An investigation of fine coal grinding kinetics." Thesis, Virginia Tech, 1986. http://hdl.handle.net/10919/45752.
Full textMaster of Science
Kewes, Eloi. "Silicon grinding and fine particles : generation and behavior of metallurgical-grade silicon fine particles during grinding for the silicones industry." Thesis, Ecully, Ecole centrale de Lyon, 2015. http://www.theses.fr/2015ECDL0030/document.
Full textMetallurgical-grade silicon (MG-Si, 99 %) powders were extensively investigated, particularly focusing on the fine particles (whose size is between 1 and 10 μm) comprised in these powders. This material is a reactant widely used in the silicones industry for the Direct Synthesis and is obtained by size reduction of millimetric silicon lumps. Powder properties are major stakes of the industrial process. Smaller sizes favor high specific surfaces and high rates of production, but can decrease the lowability, thus inducing poor heat evacuation resulting in hot spots and a decrease in selectivity. Such lowability issues are particularly associated with fine particles, hence understand the generation of these particles during grinding is of critical importance. New chemical and crystallographic characterization of MG-Si is presented, showing that fine particles contain on average less alloying elements than larger particles, yet their crystallographic structure is preserved through grinding. On the contrary, superfine particles (smaller than 1 μm) exhibit amorphous zones: this transformation is pressure induced, showing that these particles experience larger stresses during the grinding step. The behavior of MG-Si in grinding mills has been studied for the first time. At the single particle level, it has been confirmed that transgranular fracture is preferred in MG-Si. Moreover, fine particles can be produced from a single fracture event, due to multiple crack propagation and branching. The critical size under which plastic deformation preferentially occurs over fracture has been evaluated to be approximately 1 μm. These two facts are consistent with a lower level of impurities in fines, yet remaining crystalline, and with superfines exhibiting amorphous areas. At the multiple particle level, pilot scale batch milling experiments have been performed. The results are not included in this public version of the manuscript, please refer to the full manuscript. The consequences of the presence of fine particles in ground MG-Si powder on lowability has been assessed by means of angle of repose, compaction tests and fluidization experiments. A new elutriation behavior has been observed and characterized: for naturally ground MS-Si powders (including fine particles), particles smaller than 30 μm are entrained first, then only larger particles. This was not the case in absence of fine particles. The explanation may probably lie within the presence of polydisperse clusters, formed only in presence of fine particles. Parallel to this elutriation behavior, electrostatic measurements with an external electrometer showed that high potential with sign correlated with the type of particle elutriated are attained during elutriation. This may suggest that electrostatics is responsible for cluster formation
He, Mingzhao. "Slurry rheology of limestone and its effects on wet ultra-fine grinding /." Luleå, 2005. http://epubl.luth.se/1402-1757/2005/006.
Full textHe, Mingzhao. "Slurry rheology of industrial minerals and its effects on wet ultra-fine grinding /." Luleå : Division of Mineral Processing, Department of Chemical Engineering and Geosciences, Luleå University of Technology, 2007. http://epubl.ltu.se/1402-1544/2007/44/.
Full textBafakeeh, Omar T. "Micro/Nano Surface Finish Single Side Electrolytic In-Process Dressing (ELID) Grinding with Lapping Kinematics of Sapphire." University of Toledo / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1491948412941004.
Full textKhoshaim, Ahmed Bakr. "Single Side Electrolytic In-Process Dressing (ELID) Grinding with Lapping Kinematics of Silicon Carbide." University of Toledo / OhioLINK, 2014. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1396269180.
Full textInam, Muhammad Asif. "Particle sizing and product quality in production of fine and nano particles by means of wet grinding process." Thesis, Toulouse, INPT, 2010. http://www.theses.fr/2010INPT0028/document.
Full textWet grinding process is an interesting means of producing fine and nano particles. The particle sizing plays an important role in interpretation, control and optimization of various aspects of the wet grinding process. There is a lack of knowledge in understanding different aspects of particle sizing during a wet grinding process. The particle sizing in a wet grinding process is typical in the sense: (i) The dispersions in a wet grinding process, often, involve additives and (or) impurities. It is less known how impurities and additives influence the particle size of the dispersions in the wet grinding process. (ii) In a wet grinding process, dispersions of different concentrations may be used. It is less known how dispersions of different concentration may influence the particle sizing in a wet grinding process. (iii) In a wet grinding process, the change in average particle size of the product is rapid due to relatively fast breakage of the particles. (iv) The degree of poly dispersity in product changes with grinding time. (v) The nature of interaction between particles is non-colloidal before grinding process; this interaction becomes colloidal after a certain grinding time. Similarly, there is a lack of knowledge to understand how quality of final ground product is influenced in a wet grinding process. This study investigates the different aspects of particle sizing and product quality of aqueous dispersions of CaCO3 in a wet grinding process carried out in a stirred media mill. Acoustic attenuation spectroscopy that is known for measuring particle size of dispersions on line, under real process conditions and without diluting the sample has been employed in the study in addition to the technique of dynamic light scattering. The study brings out the conditions in which the effects of impurities and additives etc. on particle size of the dispersions may be determined using acoustic attenuation spectroscopy. Furthermore, the study compares and analyze the particle sizing results obtained though acoustic attenuation spectroscopy and dynamic light scattering. The causes of differences in the results of two techniques have been investigated. We report presence of multiple scattering at high concentration of the dispersions during wet grinding process that result in misleading results of the particles sizes. Quality is an intangible concept. In order to understand how different operating parameters influence product quality, we propose a method based upon the definition of quality as defined in ISO 9000:2005. The method takes into consideration the important operating parameters of wet grinding process (such as the operating condition of the mill, the measurement of particle size and the material) and important product characteristics ( such as average particle size, range of width of particle size distribution, stability of dispersion, degree of impurities, specific energy input and physical appearance). We bring out how a relationship between operating parameters and products of different grades may be established in a wet grinding process
Kaltani, Arian. "Traitement de la fraction fine des résidus du broyage d'automobiles (R. B. A. )." Vandoeuvre-les-Nancy, INPL, 1994. http://docnum.univ-lorraine.fr/public/INPL_T_1994_KALTANI_A.pdf.
Full textBooks on the topic "Fine grinding"
Mines, United States Bureau of. Fine Grinding of Coal by the Turbomilling Process. S.l: s.n, 1987.
Find full textG, Davis E. Fine grinding of coal by a turbomilling process. [Pittsburgh, Pa.]: U.S. Dept. of the Interior, Bureau of Mines, 1987.
Find full textBeke, B. Process of Fine Grinding. Springer, 2011.
Find full textBeke, B. The Process of Fine Grinding. Springer, 2012.
Find full textBook chapters on the topic "Fine grinding"
Gill, Charles Burroughs. "Fine Grinding." In Materials Beneficiation, 48–81. New York, NY: Springer New York, 1991. http://dx.doi.org/10.1007/978-1-4612-3020-5_4.
Full textVarbanov, R. "Grinding and Flotation Characterized with the Parameter Action." In Advances in Fine Particles Processing, 395–99. Boston, MA: Springer US, 1990. http://dx.doi.org/10.1007/978-1-4684-7959-1_33.
Full textFragnière, Greta, Ann-Christin Böttcher, Christoph Thon, Carsten Schilde, and Arno Kwade. "Dynamic Process Models for Fine Grinding and Dispersing." In Dynamic Flowsheet Simulation of Solids Processes, 199–236. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-45168-4_6.
Full textShen, Bin, Wei Zuo, Fang Hong Sun, and Ming Chen. "Study on Tribological Performance of Fine-Grained Diamond Films." In Advances in Grinding and Abrasive Technology XIV, 23–27. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-459-6.23.
Full textEl-Shall, Hassan, and P. Somasundaran. "Correlation of Adsorption of Surfactants with Fracture and Grinding of Quartz." In Advances in Fine Particles Processing, 41–55. Boston, MA: Springer US, 1990. http://dx.doi.org/10.1007/978-1-4684-7959-1_4.
Full textBi, F. F., Qiu Sheng Yan, and N. Q. Wu. "On Electrorheological Effect Instantaneous Tiny Grinding Wheel for Fine Machining." In Advances in Grinding and Abrasive Technology XIII, 181–85. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-986-5.181.
Full textPivnyak, G. G., P. I. Pilov, and N. S. Pryadko. "Decrease of Power Consumption in Fine Grinding of Minerals." In Mine Planning and Equipment Selection, 1069–79. Cham: Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-02678-7_104.
Full textMeloy, T. P., M. C. Williams, and P. C. Kapur. "Problems Inherent in Using the Population Balance Model for Wet Grinding in Ball Mills." In Advances in Fine Particles Processing, 31–39. Boston, MA: Springer US, 1990. http://dx.doi.org/10.1007/978-1-4684-7959-1_3.
Full textGuo, J., Hitoshi Ohmori, Shinya Morita, Y. Watanabe, Yoshihiro Uehara, T. Suzuki, K. Ikeda, and H. M. Shimizu. "Fine ELID Grinding on the Symmetric Paraboloidal Mirror of Quartz." In Progress of Precision Engineering and Nano Technology, 11–15. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-430-8.11.
Full textDai, Y., Hitoshi Ohmori, Wei Min Lin, and D. Jiang. "A Fundamental Study on Optimal Oxide Layer of Fine Diamond Wheels during ELID Grinding Process." In Advances in Grinding and Abrasive Technology XIII, 176–80. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-986-5.176.
Full textConference papers on the topic "Fine grinding"
Frances, C., C. Laguerie, J. Dodds, P. Guigon, and A. Thomas. "MODELING FINE GRINDING." In Proceedings of the Workshop. WORLD SCIENTIFIC, 1995. http://dx.doi.org/10.1142/9789814447089_0001.
Full textPei, Z. J., and Alan Strasbaugh. "Fine Grinding of Silicon Wafers: Grinding Marks." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-33458.
Full textDai, Lei, Yongqiang Gu, and Di Wu. "Fused silica fine grinding with low roughness." In 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT 2014), edited by Li Yang, Eric Ruch, and Shengyi Li. SPIE, 2014. http://dx.doi.org/10.1117/12.2070306.
Full textWAJIMA, NAOSHI, YUKIO MORI, KATSUO SYOJI, TSUNEMOTO KURIYAGAWA, and HIROFUMI SUZUKI. "CYLINDRICAL MIRROR GRINDING WITH EXTREMELY FINE GRIT WHEELS." In Proceedings of the International Symposium. WORLD SCIENTIFIC, 1997. http://dx.doi.org/10.1142/9789814317405_0025.
Full text"Pneumatic supporting of the precise fine oil seed grinding process." In Engineering Mechanics 2018. Institute of Theoretical and Applied Mechanics of the Czech Academy of Sciences, 2018. http://dx.doi.org/10.21495/91-8-877.
Full textMarinescu, Ioan D., and Christian E. Spanu. "A model for ductile fine grinding of ceramics with diamond." In Optical Fabrication and Testing. Washington, D.C.: OSA, 2004. http://dx.doi.org/10.1364/oft.2004.omc6.
Full textBletek, Thomas, Fritz Klocke, Martin Hünten, and Olaf Dambon. "Dressing of fine grained diamond grinding wheels for ultra precision grinding of structured molds in brittle hard materials." In SPIE Optifab, edited by Julie L. Bentley and Matthias Pfaff. SPIE, 2013. http://dx.doi.org/10.1117/12.2026881.
Full textPryadko, N. "Application of information technology for decrease of fine grinding power consumption." In 2016 ANNUAL PROCEEDINGS. Taylor & Francis Group, 6000 Broken Sound Parkway NW, Suite 300, Boca Raton, FL 33487-2742: CRC Press, 2017. http://dx.doi.org/10.1201/9781315197814-23.
Full textChen, Yong, Yong Sheng Song, Wen Juan Li, and Gui Ying Zhou. "The effect of grinding media on the flotation of fine chalcopyrite." In 5th International Conference on Advanced Design and Manufacturing Engineering. Paris, France: Atlantis Press, 2015. http://dx.doi.org/10.2991/icadme-15.2015.110.
Full textFähnle, O., and K. Hauser. "Analysis of fine-grinding techniques in terms of achievable surface qualities." In SPIE Optical Engineering + Applications, edited by James H. Burge, Oliver W. Fähnle, and Ray Williamson. SPIE, 2011. http://dx.doi.org/10.1117/12.894393.
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