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Journal articles on the topic 'Ferrite and dielectric LTCC materials'

Author: Grafiati

Published: 4 June 2021

Last updated: 3 February 2022

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1

Glitzky, Carsten, Torsten Rabe, Markus Eberstein, Wolfgang A. Schiller, Jörg Töpfer, Stefan Barth, and Annette Kipka. "LTCC-Modules with Integrated Ferrite Layers—Strategies for Material Development and Co-Sintering." Journal of Microelectronics and Electronic Packaging 6, no. 1 (January 1, 2009): 49–53. http://dx.doi.org/10.4071/1551-4897-6.1.49.

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The integration of passive components (resistors, capacitors, inductors) into LTCC modules is a challenging task in multilayer ceramics technology. We report on multilayer assemblies consisting of combined layers of ferrite and dielectric LTCC tapes. Ni-Cu-Zn ferrites with maximum shrinkage at 900°C were processed to green tapes and laminated with dielectric LTCC tapes. Cosintering at 900°C led to multilayers with different defects such as incomplete densification of the ferrite layers, cracks, and warpage. Since ferrite tapes do not really allow compositional changes without deterioration of magnetic properties, the dielectric tape was modified with the following objectives: (i) matching of the shrinkage curves of dielectric and ferrite materials, (ii) adjusting the coefficients of thermal expansion to avoid cracking during cooling, and (iii) controlling of interface reactions. Using this concept we fabricated dense and defect-free multilayers consisting of dielectric and ferrite layers. However, compositional changes of the individual ferrite tapes require the development of a specific dielectric tape material with tailored properties.

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Rabe, Torsten, Hamid Naghib-zadeh, Carsten Glitzky, and Jörg Töpfer. "Integration of Ni-Cu-Zn Ferrite in LTCC-Modules." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (September 1, 2011): 000266–75. http://dx.doi.org/10.4071/cicmt-2011-tha14.

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Integration of magnetic functional components in LTCC circuit boards calls for co-firing of dielectric and ferrite tapes. Ni-Cu-Zn ferrites with permeability of μ =900 were developed which can be fully densified at the standard LTCC sintering temperature of 900 °C. Successful co-firing of this ferrite with dielectric tapes requires the adaptation of the shrinkage behavior of the materials as well as the thermal expansion during the cooling period - especially in the temperature range below the transformation point of the glassy phase of the dielectric tape. To match these preconditions, a new dielectric LTCC material with steep sintering curve and high thermal expansion coefficient was designed. Sintered multilayer composed of Ni-Cu-Zn ferrite and tailored dielectric tapes are free of cracks and possess no open porosity. No significant interdiffusion between the ferrite and dielectric tapes was found by EDX measurements. Compared to pure ferrite laminates the permeability of co-sintered Ni-Cu-Zn ferrite layers is drastically reduced to 400, i.e. a decrease of more than 50 %. To investigate the origin of this permeability reduction, Ni-Cu-Zn ferrite laminates were sintered separately, and in combination with alumina release tapes or dielectric tapes, respectively. SEM and EDX analysis of co-fired laminates reveal differences in the ferrite grain growth behavior. Ferrite laminates with homogeneous microstructure and grain size up to 50 μm exhibit large permeability. However, growth of ferrite grains does not take place near the interface between ferrite and release or dielectric tapes. There is a strong correlation between high permeability and volume fraction of large ferrite grains. Regions of fine and coarse grains inside the ferrite layers show different bismuth concentration; the Bi-content is larger in regions of fine ferrite grains.

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Qassym, Lilia, Gérard Cibien, Richard Lebourgeois, Gilles Martin, and Dorothée Colson. "New Ferrimagnetic Garnets for LTCC-Technology Circulators." Journal of Microelectronics and Electronic Packaging 14, no. 2 (April 1, 2017): 51–55. http://dx.doi.org/10.4071/imaps.358290.

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Abstract Yttrium iron garnet-based ferrites are used in nonreciprocal devices like microwave circulators and isolators. The low dielectric and magnetic losses of those materials provide the required properties. The main drawbacks of circulators are their size and cost, due to complex mechanical assembling of the different materials. To simplify the complex manufacturing process, a possible solution would be to adapt the different materials to a common low temperature cofired ceramic (LTCC) process: the circulators would be produced with an additive multilayer process. We showed that cationic substitutions (bismuth and copper) enable a considerable decrease of the sintering temperature of garnets, from ~1,450°C to down to ~950°C. Furthermore, due to bismuth cations, a high permittivity is achieved, allowing the reduction of the circulator core size. Our most recent results show that it is possible to decrease this temperature down to 880°C, thanks to vanadium substitutions. This significant decrease of the sintering temperature leads to a compatible material for cofiring with gold and particularly with silver (melting points 1,064°C and 962°C, respectively). Different assemblies of tapes were studied: ferrite with silver or gold, ferrite with dielectric and ferrite with dielectric and metallization. Physical analyses (dilatometry, coefficient of thermal expansion, etc.) are exposed and magnetic and dielectric properties (permittivity and saturation magnetization) are discussed. Moreover, the first results of circulators in LTCC technology with gold and silver screen printing are presented (transmission, isolation, and return loss) and the compatibility of the different elements is analyzed.

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Qassym, Lilia, Gérard Cibien, Richard Lebourgeois, Gilles Martin, and Dorothée Colson. "New ferrimagnetic garnets for LTCC-technology circulators." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000586–90. http://dx.doi.org/10.4071/isom-2016-thp24.

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Abstract Yttrium Iron Garnet based ferrites are used in non-reciprocal devices like microwave circulators and isolators. The low dielectric and magnetic losses of those materials provide the required properties. The main drawbacks of circulators are their size and cost, due to complex mechanical assembling of the different materials. In order to simplify this complex manufacturing process, a possible solution would be to adapt the different materials to a common LTCC (Low Temperature Co-fired Ceramics) process: the circulators would be produced with an additive multilayer process. We showed that cationic substitutions (bismuth and copper) enable a considerable decrease of the sintering temperature of garnets, from about 1450°C to down to 950°C. Due to bismuth cations, a high permittivity is achieved allowing the reduction of the circulator size. Our most recent results show that it is possible to decrease this temperature down to 880°C, thanks to vanadium substitutions. This significant decrease of the sintering temperature leads to a compatible material for co-firing with gold and in particular with silver (melting point of 1064°C and 962°C respectively). Different assemblies of tapes were studied: ferrite with silver or gold, ferrite with dielectric and ferrite with dielectric and metallization. Physical analyses are exposed (dilatometry, coefficient of thermal expansion…) and magnetic and dielectric properties are discussed (permittivity and saturation magnetization). Moreover the first results of circulators in LTCC-technology with gold and silver screen printing are presented (transmission, isolation and return loss) and the compatibility of the different elements is analyzed.

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5

Matz, Richard, Dieter Götsch, Thomas Goßner, Roman Karmazin, Ruth Männer, and Bernhard Siessegger. "Power Inductors in Ceramic Multilayer Circuit Boards." Journal of Microelectronics and Electronic Packaging 5, no. 4 (October 1, 2008): 161–68. http://dx.doi.org/10.4071/1551-4897-5.4.161.

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Power electronic inductors, with values of several μH, have been integrated into thermally stable ceramic multilayer circuit boards by the use of NiZnCu and MnZn ferrite tapes in low temperature cofired ceramic (LTCC) technology. These ferrites are particularly attractive for switched mode power supplies in automation, drives, and consumer applications, where the miniaturization of modules is triggered by advances in transistor technology and switching frequencies. The small signal analysis of embedded individual inductors and coupled transformer coils reveals the generic design rules for these components and additional materials properties beyond those accessible by ring core measurements. In the process of adapting the materials to LTCC, the distinct differences between the two materials become blurred, for example, they can be engineered to exhibit similar cutoff frequencies. NiZnCu ferrite, which is sinterable in air, may even achieve higher permeability than MnZn ferrite. The latter, however, shows higher saturation flux density and current capacity of buried inductors for power line filters. The coupled inductor design in a transformer is particularly ruled by the shunt capacitance inside the coils and by the fact that Maxwell equations preclude strong magnetic coupling between ferrite-embedded conductor lines. While parasitic capacitances remain tolerable for standard dielectric layer material up to several MHz, the need for magnetic coupling requires a fabrication process for magnetic vias.

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6

Hagymási, Marcel, Andreas Roosen, Roman Karmazin, Oliver Dernovsek, and Werner Haas. "Constrained sintering of dielectric and ferrite LTCC tape composites." Journal of the European Ceramic Society 25, no. 12 (January 2005): 2061–64. http://dx.doi.org/10.1016/j.jeurceramsoc.2005.03.011.

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7

Bartsch, Heike, Sebastian Thiele, Jens Mueller, Dirk Schabbel, Beate Capraro, Timmy Reimann, Steffen Grund, and Jörg Töpfer. "Multilayer ferrite inductors for the use at high temperatures." Microelectronics International 37, no. 2 (May 9, 2020): 73–78. http://dx.doi.org/10.1108/mi-11-2019-0072.

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Purpose This paper aims to investigate the usability of the nickel copper zinc ferrite with the composition Ni0.4Cu0.2Zn0.4Fe1.98O3.99 for the realization of high-temperature multilayer coils as discrete components and integrated, buried function units in low temperature cofired ceramics (LTCC). Design/methodology/approach LTCC tapes were cast and test components were produced as multilayer coils and as embedded coils in a dielectric tape. Different metallization pastes are compared. The properties of the components were measured at room temperature and higher temperature up to 250°C. The results are compared with simulation data. Findings The silver palladium paste revealed the highest inductance values within the study. The measured characteristics over a frequency range from 1 MHz to 100 MHz agree qualitatively with the measurements obtained from toroidal test samples. The inductance increases with increasing temperature and this influence is lower than 10%. The characteristic of embedded coils is comparable with this of multilayer components. The effective permeability of the ferrite material reaches values around 130. Research limitations/implications The research results based on a limited number of experiments; therefore, the results should be verified considering higher sample sizes. Practical implications The results encourage the further investigation of the material Ni0.4Cu0.2Zn0.4Fe1.98O3.99 for the use as high-temperature ferrite for the design of multilayer coils with an operation frequency in the range of 5-10 MHz and operation temperatures up to 250°C. Originality/value It is demonstrated for the first time, that the material Ni0.4Cu0.2Zn0.4Fe1.98O3.99 is suitable for the realization of high-temperature multilayer coils and embedded coils in LTCC circuit carriers with high performance.

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8

Yang, Yan, Huaiwu Zhang, Jie Li, Yiheng Rao, Gang Wang, and Gongwen Gan. "Bi3+ doping-adjusted microstructure, magnetic, and dielectric properties of nickel zinc ferrite ceramics for high frequency LTCC antennas." Ceramics International 46, no. 16 (November 2020): 25697–704. http://dx.doi.org/10.1016/j.ceramint.2020.07.046.

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9

Marić, Andrea, Goran Radosavljević, Nelu Blaž, Walter Smetana, and Ljiljana Živanov. "Embedded Ferrite LTCC Inductors." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000388–93. http://dx.doi.org/10.4071/cicmt-2012-wa48.

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This paper presents for the first time one realization of simple planar inductor realized inside the stack of ferrite LTCC (Low Temperature Co-fired Ceramic) tapes. Presented inductor is one layer square spiral fabricated in the LTCC technology. In order to point out benefits of implementation of ferrite material on inductor inductance, the same inductor geometry was fabricated between two dielectric LTCC tapes. Commercially available LTCC material (both ferrite and dielectric) were implemented for the realization of proposed inductors. Designed structures were characterized and obtained experimental results show that even implementation of a very thin layer of ferrite material around inductor lines drastically increases its inductance. For the same inductor design that occupies the same chip area the inductance enhancement over 11 times is achieved. In addition this enhancement is followed with maintenance of good performance of the inductor.

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10

Naghib-zadeh, Hamid, and Torsten Rabe. "Pressure-Assisted Sintering of Multilayer Transformer Using LTCC-Compatible NiCuZn-Ferrite and Silver Conductor." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000476–83. http://dx.doi.org/10.4071/cicmt-2012-wp15.

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A low-fired NiCuZn-ferrite and a new LTCC dielectric material with matched sintering shrinkages and coefficients of thermal expansion were used for integration of magnetic function into LTCC. Silver was used as inner conductor material. Silver diffusion during sintering into the surrounding glassy phase modifies the sintering behaviour of LTCC near the silver conductor and generates warping and delamination of the multilayer. Silver diffusion can be prevented by sintering in nitrogen atmosphere. However, sintering in nitrogen atmosphere causes partial decomposition of NiCuZn-ferrite by reduction of divalent copper oxide (CuO) to cuprite (Cu2O). It was found that diffusion of silver and associated deformation can be highly reduced if a higher heating rate during sintering in air is used. A Defect-free multilayer transformer with several silver conductive layers could be manufactured by pressure-assisted sintering only.

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11

Guzdek, P., J. Kulawik, K. Zaraska, and A. Bieńkowski. "NiZnCu ferrite applied for LTCC microinductor." Journal of Magnetism and Magnetic Materials 322, no. 19 (October 2010): 2897–901. http://dx.doi.org/10.1016/j.jmmm.2010.05.001.

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12

Kim, Nam Hyun, Hyun Park, and Kyung Nam Kim. "The Characteristics of Hetero Junction Using NiCuZn Ferrite and Dielectric for LTCC." Journal of the Korean institute of surface engineering 45, no. 5 (October 31, 2012): 188–92. http://dx.doi.org/10.5695/jkise.2012.45.5.188.

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13

Zhang, Wenli, Yipeng Su, and Fred C. Lee. "Multilayer Ferrite Inductor Substrate for Ceramic-Based High Current Point-of-Load (POL) Converter." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (May 1, 2016): 000039–46. http://dx.doi.org/10.4071/2016cicmt-tp2a2.

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Abstract High power-density and high efficiency are the two driving forces for point-of-load (POL) converters used in portable electronics and other applications where system miniaturization is required. Discrete passive components, especially bulky inductors, have become the bottleneck for downsizing POL converters. Low-temperature sintered Ni-Cu-Zn ferrite tapes for multilayer chip inductors have been widely studied and used in high-frequency power electronics applications. In our previous study, a low-profile, planar inductor substrate with lateral flux pattern was fabricated using mixed commercial low-fire Ni-Cu-Zn ferrite tapes and compatible low temperature co-fired ceramic (LTCC) processing. However, thermal interface material was used between active circuit board and passive layer (ferrite substrate), which increases the total volume of the converter and becomes a potential threat for reliability due to the mismatch of coefficient of thermal expansion among different layers. Additionally, this hybrid integration method requires labor-intensive manual steps which are not compatible with cost-sensitive power electronics market. A fully ceramic-based POL module with integrated multilayer ferrite inductor has been proposed. The circuit and other components are designed to be directly built on top of the multilayer ferrite inductor substrate. This presented work focuses on the development of the multilayer ceramic substrate with embedded planar, lateral-flux inductor by co-firing of ferrite and dielectric tapes with conductor paste. Commercial dielectric LTCC and ferrite tapes were chosen for the fabrication of multilayer ferrite inductor substrate. Different silver pastes were co-fired with ceramic tapes to form the inductor winding. The sintering behavior and compatibility of dielectric, magnetic, and conductive components in one co-firing process was studied in order to realize a cohesive multilayer ceramic substrate. The embedded inductors present lower inductance than pure ferrite inductors sintered alone using the same profile when the output current is smaller than 10 A. The inductance of both types of inductors are very similar when output current is above 15 A. The inductor embedded in dielectric tapes exhibits higher core loss density than its counterpart. Future work will focus on the integration of high current POL module using this developed multilayer ferrite inductor substrate.

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Kim, H. J., Y. J. Kim, and J. R. Kim. "An Integrated LTCC Inductor Embedding NiZn Ferrite." IEEE Transactions on Magnetics 42, no. 10 (October 2006): 2840–42. http://dx.doi.org/10.1109/tmag.2006.879741.

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15

Blaž, Nelu, Andrea Marić, Goran Radosavljević, Nebojša Mitrović, Ibrahim Atassi, Walter Smetana, and Ljiljana Živanov. "Determination of Electric and Magnetic Properties of Commercial LTCC Soft Ferrite Material." Journal of Microelectronics and Electronic Packaging 8, no. 1 (January 1, 2011): 1–9. http://dx.doi.org/10.4071/imaps.286.

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This paper offers an effective, accurate, and simple method for permittivity and permeability determination of an LTCC (low temperature cofired ceramic) ferrite sample. The presented research can be of importance in the fields of ferrite component design and application, as well as for RF and microwave engineering. The characterization sample is a stack of LTCC tapes forming a toroid. Commercially available ferrite tape ESL 40012 was used and standard LTCC processing was applied for the sample fabrication. For the first time, the electrical properties of a ferrite toroid sample of ESL 40012 LTCC ferrite tape is presented at various frequencies. The electrical properties of LTCC ferrite materials, permittivity and specific resistivity, are shown in a frequency range from 10 kHz to 1 MHz using the capacitive method. The hysteresis properties of this material are also determined. B-H hysteresis loops were measured applying a maximum excitation of 2 kA/m and frequencies of 50 Hz, 500 Hz, and 1000 Hz. Permeability is determined in the frequency range from 10 kHz to 1 GHz and a characterization procedure is divided in two segments, for low and high frequencies. Low frequency measurements (from 10 kHz to 1 MHz) are performed using LCZ meter and discrete turns of wire, while a short coaxial sample holder and vector network analyzer were used for the higher frequency range (from 300 kHz to 1 GHz). In addition, another important factor required for the practical design of devices is presented, the temperature variation of the permeability dispersion parameters.

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Bian, Jian-jiang, Dong-Wan Kim, and Kug Sun Hong. "Glass-free LTCC microwave dielectric ceramics." Materials Research Bulletin 40, no. 12 (December 2005): 2120–29. http://dx.doi.org/10.1016/j.materresbull.2005.07.003.

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Naghib-zadeh, Hamid, Torsten Rabe, and Roman Karmazin. "Integration of MnZn-ferrite tapes in LTCC multilayer." Journal of Electroceramics 31, no. 1-2 (March 3, 2013): 88–95. http://dx.doi.org/10.1007/s10832-013-9800-5.

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18

Tormey, Ellen, Chao Ma, John Maloney, Bradford Smith, Sid Sridharan, and Yi Yang. "Low Loss LTCC Ag System for 5G Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2021, HiTEC (April 1, 2021): 000105–11. http://dx.doi.org/10.4071/2380-4491.2021.hitec.000105.

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Abstract Low dielectric constant/low loss LTCC materials have drawn much attention with the emergence of 5G wireless telecommunications. LTCC offers unique properties in the millimeter wave frequency range. The low dielectric constant and dielectric loss enable low latency devices with enhanced performance. To meet the market demands of higher performance and lower cost, Ferro has developed a new M7 LTCC/Ag cofireable system suitable for antenna in 5G and other high frequency applications. M7 LTCC ceramic green tape and cofireable Ag conductors have been developed and tested. Properties of the LTCC/Ag system are included herein including high frequency dielectric properties.

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Vincent, Didier, Langis Roy, Farhan Ghaffar, and Joey R. Bray. "Electromagnetic properties of LTCC-ferrite in the microwave range." European Physical Journal Applied Physics 84, no. 1 (October 2018): 10601. http://dx.doi.org/10.1051/epjap/2018180226.

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The electromagnetic properties of a low temperature co-fired ceramic (LTCC) ferrite in the microwave range have been determined by performing S-parameter measurements of a coplanar waveguide (CPW) cell. An optimization procedure is used to minimize an error function that compares the measured S-parameters to those obtained from electromagnetic simulations based on the spectral domain approach (SDA) method in the saturated state. Using this method, the μ and κ parameters of the permeability tensor are extracted. Other results in the demagnetized and partially magnetized states show a special LTCC-ferrite behavior.

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Shamim, Atif, Joey R. Bray, Nasrin Hojjat, and Langis Roy. "Ferrite LTCC-Based Antennas for Tunable SoP Applications." IEEE Transactions on Components, Packaging and Manufacturing Technology 1, no. 7 (July 2011): 999–1006. http://dx.doi.org/10.1109/tcpmt.2011.2143411.

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Barth, St, F. Kastner, M. Rößler, R. Wentorp, J. Töpfer, and Th Bartnitzek. "Low firing functional materials for application in power electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000664–69. http://dx.doi.org/10.4071/cicmt-2012-tha46.

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In the past significant effort has been obtained on the miniaturization of electronic devices, for example in the field of cellular phones or other portables devices. Mainspring of this process is the huge success that has been obtained with giant integration densities on chip level. In contrast passive components are actually the most important bottlenecks in the upcoming miniaturization process, first of all for applications in power electronics. Especially in the field of electric mobility and innovative lighting technologies an increasing demand arises for miniaturized transformers and converters. Miniaturization of power electronic devices concentrates however the dissipation heat in a smaller volume, leading in most cases to higher operation temperatures. LTCC (Low-Temperature-Cofiring-Ceramic) as a ceramic multilayer interconnection technology has been employed for the development of 3D-high integrated electronic modules, marked by an excellent thermal robustness. Actual integration of inductors or capacitors in LTCC-boards is restricted to SMD's, limiting further miniaturization in an important manner. Hence the monolithic integration of inductors and capacitors into ceramic multilayer circuit boards is a straightforward approach to gain higher integration levels in power electronics. We report on the preparation and processing of low sintering materials for the implementation of ferrite cores into LTCC multilayer boards. Different semi-finished products based on ferrite powders have been elaborated. Sintering behavior of these materials has been studied and material compatibility with different standard LTCC materials was tested.

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Pietrikova, Alena, Kornel Ruman, Tibor Rovensky, and Igor Vehec. "Impact analysis of LTCC materials on microstrip filters’ behaviour up to 13 GHz." Microelectronics International 32, no. 3 (August 3, 2015): 122–25. http://dx.doi.org/10.1108/mi-01-2015-0003.

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Purpose – The purpose of this paper is to consider the adequacy of various microstrip filters’ behaviour based on different low-temperature co-fired ceramic (LTCC) dielectrics in the high frequency (HF) area up to 13 GHz. Design/methodology/approach – Low pass, band pass and band stop filters for ultra-wideband radar systems were designed, simulated, fabricated and measured using three various dielectric substrates: Dupont GreenTape 951, Dupont GreenTape 9K7 and Murata LFC. Findings – It is not possible to unambiguously determine the most suitable LTCC dielectric for these filter design because, in general, all designed filters fulfilled requirements (attenuation, cut off frequencies) with minimal divergences, but temperature-stable dielectric and physical properties of Murata LFC make them a promising ceramic for HF application (repeatability of realised experiments). Originality/value – The novelty of this work lies in unconventional usage of LTCC as material with defined dielectric properties proper for HF applications.

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Jean, Jau-Ho, and Chia-Ruey Chang. "Camber development during cofiring Ag-based low-dielectric-constant ceramic package." Journal of Materials Research 12, no. 10 (October 1997): 2743–50. http://dx.doi.org/10.1557/jmr.1997.0365.

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Camber (curvature) development during cofiring a two-layered structure of Ag film/low-dielectric-constant, low-temperature cofired ceramic (LTCC) green tape has been investigated. At a given thickness of Ag film, both the camber and camber rate decrease linearly with increasing the square thickness of LTCC. Densification mismatch between Ag and LTCC is attributed to be the root cause for the camber generation during cofiring. Mathematical analysis is made to theoretically describe the camber development, and the results show a fairly good agreement with experimental observations.

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Marić, Andrea, Nelu Blaž, Ljiljana Živanov, and Goran Radosavljević. "Fine Tuning of 3D LTCC Inductor Properties Using Combination of Different Ferrite and Dielectric Tapes." International Journal of Applied Ceramic Technology 12, no. 5 (September 7, 2014): 1034–44. http://dx.doi.org/10.1111/ijac.12288.

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Sebastian, M. T., and H. Jantunen. "Low loss dielectric materials for LTCC applications: a review." International Materials Reviews 53, no. 2 (March 2008): 57–90. http://dx.doi.org/10.1179/174328008x277524.

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Szwagierczak, Dorota, Beata Synkiewicz-Musialska, Jan Kulawik, and Norbert Pałka. "LTCC and Bulk Zn4B6O13–Zn2SiO4 Composites for Submillimeter Wave Applications." Materials 14, no. 4 (February 21, 2021): 1014. http://dx.doi.org/10.3390/ma14041014.

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New zinc metaborate Zn4B6O13–willemite Zn2SiO4 composites were investigated as promising materials for LTCC (low temperature cofired ceramics) substrates of microelectronic circuits for submillimeter wave applications. Composites were prepared as bulk ceramics and LTCC multilayer structures with cofired conductive thick films. The phase composition, crystal structure, microstructure, sintering behavior, and dielectric properties were studied as a function of willemite content (0, 10, 13, 15, 20, 40, 50, 60, 100 wt %). The dielectric properties characterization performed by THz time domain spectroscopy proved the applicability of the composites at very high frequencies. For the 87% Zn4B6O13–13% Zn2SiO4 composite, the best characteristics were obtained, which are suitable for LTCC submillimeter wave applications. These were a low sintering temperature of 930 °C, compatibility with Ag-based conductors, a low dielectric constant (5.8 at 0.15–1.1 THz), a low dissipation factor (0.006 at 1 THz), and weak frequency and temperature dependences of dielectric constant.

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Nair, Deepukumar M., James Parisi, K. M. Nair, Mark McCombs, Michael Smith, Elizabeth Hughes, Ken Souders, et al. "Introducing DuPont™ GreenTape™ 9K5 Low Dielectric Constant, Low Temperature Co-Fired Ceramic (LTCC) Tape System." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000544–52. http://dx.doi.org/10.4071/isom-2011-wa3-paper4.

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Low Temperature Co-fired Ceramic (LTCC) material systems have been successfully used in microwave and millimeter wave systems for several years. LTCC has very low dielectric loss, high reliability due to inherent hermeticity; high interconnect density, multilayer processing capability leading to true 3D packaging, and better cost-performance balance. While the medium range dielectric constants (7.00 – 8.00) offered by current tape systems have advantages, it is generally difficult to realize high speed systems and efficient antennas on LTCC, especially at millimeter wave frequencies. The difficulty arises from the reduced signal propagation velocity in high-speed applications, and lower radiation efficiency for antennas, both due to higher dielectric constant. To enable and extend applications of LTCC technology to these subsystems, DuPont has developed a new low dielectric constant LTCC system – DuPont™ GreenTape™ 9K5 - which has a dielectric constant of 5.80 (at 10 GHz) that is compatible with the commercial DuPont™ GreenTape™ 9K7 LTCC System. This is achieved without compromising excellent microwave loss properties of the 9KX GreenTape™ platform. These materials systems enable high-speed, high reliability applications while also realizing efficient antennas on LTCC. This paper presents initial characterization of the new DuPont™ GreenTape™ 9K5 LTCC system consisting of low K dielectric tape, gold and silver conductors to evaluate the effects of chemistry, processing conditions, processing latitude, microstructure, and microwave performance. Test coupons with various transmission and resonating structures are designed, fabricated, and tested for the evaluation of transmission losses and dielectric properties. Stability of the material system over multiple re-fire steps is also examined

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Zeng, Qun, Wei Li, Jian-lin Shi, Jing-kun Guo, Ming-wen Zuo, and Wen-jun Wu. "A New Microwave Dielectric Ceramic for LTCC Applications." Journal of the American Ceramic Society 89, no. 5 (May 2006): 1733–35. http://dx.doi.org/10.1111/j.1551-2916.2006.00942.x.

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29

Song, Zhe, Joanna Chu, Kun Huang, Lasse Norén, Zhenxiao Fu, and Yun Liu. "Low Temperature Cofiring and Dielectric Properties of Ca-Doped Al2O3/K2O3–B2O3–SiO2 Composite Ceramics for LTCC Applications." Journal of Microelectronics and Electronic Packaging 15, no. 2 (April 1, 2018): 81–85. http://dx.doi.org/10.4071/imaps.606076.

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Al2O3/K2O3–B2O3–SiO2 low temperature cofired ceramics (LTCC) dielectric materials doped with CaCO3 were prepared by using a solid-state reaction. The microstructure and dielectric properties of Al2O3/K–B–Si borosilicate, together with the effects of Ca doping, were investigated. A new material system candidate of Al2O3/KBSiO borosilicate doped by Ca was achieved after sintering at 880°C, which presents an optimized performance on dielectric properties with a permittivity εr < 8 and dielectric loss tan δ ≤ 0.002 and excellent stabilities across very broad frequency and temperature ranges. Most importantly, the initial results have also indicated that the new dielectric composite material is well compatible with the existing LTCC process, suggesting a considerable potential for practical LTCC applications.

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30

Park, Jihwan, Seung Hee Hong, Yongho Choa, and Jongryoul Kim. "Fabrication and magnetic properties of LTCC NiZnCu ferrite thick films." physica status solidi (a) 201, no. 8 (June 2004): 1790–93. http://dx.doi.org/10.1002/pssa.200304625.

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31

Ling, Wei Wei, Huai Wu Zhang, Yuan Xun Li, and Ying Li Liu. "Low Temperature Fired Ferrite/Ceramic Composite Materials and their Permeability Spectra." Advanced Materials Research 150-151 (October 2010): 293–98. http://dx.doi.org/10.4028/www.scientific.net/amr.150-151.293.

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Ni-Cu-Zn ferrite/CaTiO3 and Ni-Cu-Zn ferrite/BaTiO3 composites which can be applied in low temperature co-fired ceramic (LTCC) technology were synthesized by conventional solid-state reaction lower than 950°C. The complex permeability spectra of the above two composites have been investigated. The contribution of spin rotation and domain wall motion to the permeability spectra was estimated by the numerical fitting of measured data to the relevant formula. Influence of two types of magnetizing processes on the permeability of different composites has been analyzed combining with the variation of microstructures.

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32

Li, Xing Yun, and Ji Zhou. "Characterization of Luminescent LTCC Composite Materials for White LED Package." Advanced Materials Research 873 (December 2013): 761–69. http://dx.doi.org/10.4028/www.scientific.net/amr.873.761.

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Luminescent low temperature co-fired ceramic (LTCC) was prepared by sintering powders selected from BaO-TiO2-B2O3-SiO2system with limited amount of additive (Dy3+). It was found that the optimal sintering temperature was 900°C based on the microstructure and the properties of sintering bodies, and then the major phases of the LTCC were Ba2(TiO)Si2O7and SiO2. The experimental results indicated that the glass-ceramic possesses good yellow emission under 454nm excitation, excellent dielectric properties: εr= 13.09, tanδ<0.001 at 1 MHz. Thus, this material is supposed to be used as the LTCC substrate material for the application in white LED packaging.

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33

Cui, Xue Min, Ji Zhou, Bo Li, Jian Hong Shen, and Yue Hui Wang. "Fabrication of Ba-Ti-B-Si-O Glass-Ceramics for LTCC." Key Engineering Materials 336-338 (April 2007): 1853–55. http://dx.doi.org/10.4028/www.scientific.net/kem.336-338.1853.

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This paper studied the dielectric performances and microstructure of the Ba-Ti-B-Si-O glass-ceramics fabricated with different methods. The experimental results showed that the pre-calcined method was an effective way to decrease the sintering temperature in glass-ceramic fabricating process, and the dielectric properties of the LTCC materials were εr ≈10, tanδ ≤ 2×10-3 (@1MHz). This study provided a composite method to fabricate LTCC for different applications that was composed of pre-calcined powders and molten powders with different ratios; Moreover, the dielectric constant and sintering performance of composite LTCC were adjustable by changing the ratio of pre-calcined powders and molten powders.

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34

Choi, Young-Jin, Jae-Hwan Park, Jeong-Hyun Park, and Jae-Gwan Park. "Middle-permittivity LTCC dielectric compositions with adjustable temperature coefficient." Materials Letters 58, no. 25 (October 2004): 3102–6. http://dx.doi.org/10.1016/j.matlet.2004.05.049.

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35

Ling, Wei Wei, Yuan Xun Li, Hai Nie, and Huai Wu Zhang. "Structural and Magnetic Properties of Low Temperature Fired Ferrite/Ceramic Composite Materials." Advanced Materials Research 466-467 (February 2012): 361–65. http://dx.doi.org/10.4028/www.scientific.net/amr.466-467.361.

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MgCuZn ferrite/CaTiO3and MgCuZn ferrite/BaTiO3composites which can be applied in low temperature co-fired ceramic (LTCC) technology were synthesized by conventional solid-state reaction at 950°C. The sintering behavior and microstructures of the samples have been analyzed. The complex permeability spectra of the above two composites have been investigated. The contribution of spin rotation and domain wall motion to the permeability spectra was estimated by the numerical fitting of measured data to the relevant formula. Influence of two types of magnetizing processes on the permeability of different composites has been analyzed combining with the variation of microstructures.

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36

Shi, Yanfeng, Yongqiang Chai, and Shengbo Hu. "Preparation and Characterization of Printed LTCC Substrates for Microwave Devices." Active and Passive Electronic Components 2019 (April 1, 2019): 1–5. http://dx.doi.org/10.1155/2019/6473587.

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A novel LTCC substrate manufacturing process based on 3D printing was investigated in this paper. Borosilicate glass-alumina substrates with controlled size and thickness were successfully manufactured using a self-developed dual-nozzle hybrid printing system. The printing parameters were carefully analyzed. The mechanical and dielectric properties of the printed substrate were examined. The results show that the printed substrates obtain smooth surface (Ra=0.92 μm), compact microstructure (relative density 93.7%), proper bending strength (156 mPa), and low dielectric constant and loss (Ɛr=6.2, 1/tan⁡δ=0.0055, at 3 GHz). All of those qualify the printed glass–ceramic substrates to be used as potential LTCC substrates in the microwave applications. The proposed method could simplify the traditional LTCC technology.

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37

Pietrikova, Alena, Tibor Rovensky, Juraj Durisin, Igor Vehec, and Ondrej Kovac. "Influence of firing profile on microstructural and dielectric properties of LTCC substrates." Microelectronics International 34, no. 3 (August 7, 2017): 127–30. http://dx.doi.org/10.1108/mi-11-2016-0083.

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Purpose The purpose of this paper is to analyse the influence of various firing profiles on microstructural and dielectric properties of low-temperature, co-fired ceramic (LTCC) substrates in a GHz frequency range. According these analyses, sintering process can be controlled and modified to achieve better performance of devices fabricated from LTCC substrates. Design/methodology/approach Samples from LTCC substrates GreenTape 951 and GreenTape 9K7 were sintered by four firing profiles. Basic firing profile recommended by the manufacturer was modified by increasing the peak temperature or the dwell time at the peak temperature. The influence of firing profile on microstructural properties was analysed according to measurements by X-ray diffractometer (application of the Cu K-alpha radiation and the Bragg-Brentano method), and the influence on dielectric properties (dielectric constant and dielectric losses) was analysed according to measurements by split cylinder resonator method at 9.7 and 12.5 GHz. Findings Rising of the peak temperature or extension of dwell time at this temperature has influence on all analysed properties of LTCC substrates. Size of crystallites can be changed by modification of firing profile as well as microdeformation. In addition, dielectric properties can be changed too by modification of the firing profile. Correlation between microdeformation and dielectric losses was observed. Originality/value The novelty of this work lies in finding the mutual relationship between changes in microstructural (size of grains and microdeformation) and dielectric properties (dielectric constant and dielectric losses) caused by different firing profiles.

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38

Tork, Hossam S., Aicha Elshabini, and Fred Barlow. "Tunable BaSrTiO3, BaZrTiO3 Ferroelectric Capacitors Embedded Inside Low Temperature Cofired Ceramics (LTCC)." Journal of Microelectronics and Electronic Packaging 10, no. 3 (July 1, 2013): 95–101. http://dx.doi.org/10.4071/imaps.380.

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This paper describes the design and processing of ferroelectric parallel plate capacitors embedded within a low temperature cofired ceramics (LTCC) structure. A capacitor is fabricated by filling a via hole with ferroelectric paste. Using ferroelectric materials, low-loss barium strontium titanate (BST) and barium zirconate titanate (BZT), as dielectric materials provide a wide range of tunability, in addition to low loss and low production cost. In addition, embedding tunable capacitors (varactors) inside LTCC reduces loss, size, weight, and cost. The paper also gives a comparison between the use of BST and BZT as tunable dielectric materials embedded inside an LTCC with respect to preparation process, applied voltage, shrinking factors, and quality factors.

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39

Zhang, H. W., H. Zhong, B. Y. Liu, Y. L. Jing, and Y. Y. Liu. "Electromagnetic properties of a new ferrite-ceramic low-temperature cocalcined (LTCC) composite materials." IEEE Transactions on Magnetics 41, no. 10 (October 2005): 3454–56. http://dx.doi.org/10.1109/tmag.2005.854882.

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40

Li, Yuanxun, Yunsong Xie, Ru Chen, Likun Han, Daming Chen, and Hua Su. "A Multilayer Power Inductor Fabricated by Cofirable Ceramic/Ferrite Materials With LTCC Technology." IEEE Transactions on Components, Packaging and Manufacturing Technology 7, no. 9 (September 2017): 1402–9. http://dx.doi.org/10.1109/tcpmt.2017.2712785.

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41

Teixeira, Silvia Soreto, Manuel Pedro Fernandes Graça, and Luís Cadillon Costa. "Microwave dielectric properties of sodium ferrite." International Journal of Materials Engineering Innovation 8, no. 2 (2017): 87. http://dx.doi.org/10.1504/ijmatei.2017.088076.

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42

Barteczka, Beata, Piotr Slobodzian, Arkadiusz Dabrowski, and Leszek Golonka. "Influence of firing process quality on dielectric constant of microwave LTCC substrates." Microelectronics International 31, no. 3 (August 4, 2014): 169–75. http://dx.doi.org/10.1108/mi-11-2013-0067.

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Purpose – The purpose of this paper was to investigate the influence of non-uniform temperature distribution inside a box furnace during the firing process on electrical properties of the low-temperature co-fired ceramic (LTCC) materials used in radio frequency (RF)/microwave applications. Design/methodology/approach – The authors studied the change in dielectric constant of two popular LTCC materials (DP 951 and DP 9K7) depending on the position of their samples inside the box furnace. Before firing of the samples, temperature distribution inside the box furnace was determined. The dielectric constant was measured using the method of two microstrip lines. Findings – The findings showed that non-uniform temperature distribution with spatial difference of 6°C can result in 3-4 per cent change of the dielectric constant. It was also found that dielectric constant of the two tested materials shows disparate behavior under the same temperature distribution inside the box furnace. Practical implications – The dielectric constant of the substrate materials is crucial for RF/microwave applications. Therefore, it was shown that 3-4 per cent deviation in dielectric constant can result in considerable detuning of microwave circuits and antennas. Originality/value – To the best of the authors’ knowledge, the quantitative description of the impact of temperature distribution inside a box furnace on electrical properties of the LTCC materials has never been published in the open literature. The findings should be helpful when optimizing production process for high yield of reliable LTCC components like filters, baluns and chip antennas.

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43

Radosavljevic, Goran, Andrea Maric, Michael Unger, Nelu Blaz, Walter Smetana, and Ljiljana Zivanov. "Electrical, mechanical and temperature characterization of commercialy available LTCC dielectric materials." Chemical Industry 67, no. 4 (2013): 621–28. http://dx.doi.org/10.2298/hemind120713105r.

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Presented paper deals with mechanical, electrical and thermal properties of several commercially available materials that are widely used for fabrication of electronic components, sensor systems etc. In the LTCC (Low Temperature Co-fired Technology). Having complete and accurate information of material chemical composition, its electrical and mechanical properties are essential for successful design of various components and/or systems. In many cases, available technical documentation provided by the manufacturers contains less information than designers require for complete pre-design analysis of system behavior in real time environment. Three offently exploited commercialy available dielectric materials provided by Heraeus company (Heraeus CT700, Heraeus CT707 and Heraeus CT800) are investigated. Electrical, mechanical and thermal properties analyses have been conducted in order to determine some of the important material properties. A full chemical composition analysis was performed resulting in determination of materials' chemical composition, followed with determination of relative permittivity value, elasticity modulus and relative thermal coefficient value.

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44

Huang, Weiter, Kuo-Shung Liu, Li-Wen Chu, Ging-Ho Hsiue, and I.-Nan Lin. "Microwave dielectric properties of LTCC materials consisting of glass–Ba2Ti9O20 composites." Journal of the European Ceramic Society 23, no. 14 (January 2003): 2559–63. http://dx.doi.org/10.1016/s0955-2219(03)00172-9.

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45

Synkiewicz, Beata, Dorota Szwagierczak, and Jan Kulawik. "Multilayer LTCC structures based on glass-cordierite layers with different porosity." Microelectronics International 34, no. 3 (August 7, 2017): 110–15. http://dx.doi.org/10.1108/mi-12-2016-0084.

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Purpose The paper aims to report on fabrication procedure and present microstructure and dielectric behavior of multilayer porous low-temperature cofired ceramic (LTCC) structures based on glass-cordierite and glass-alumina. Design/methodology/approach The LTCC structures were created as multi-layered composites with dense external layers and inner layers with intentionally introduced porosity. Two preparation methods were applied – subsequent casting of both kinds of slurries and conventional isostatic lamination of dried green tapes arranged in the designed order. Optical microscope observations were carried out to analyze the microstructure of green and fired multilayer structures and pore concentration. To evaluate the adhesion strength of the composite layers, pull test was performed. Dielectric behavior of the composites was studied in the frequency range 50 kHz-2 MHz. Findings The fabricated porous LTCC structures showed dielectric constant of 3-5.6. The lowest dielectric constant was attained for glass-cordierite composite made by the conventional tape casting/lamination/firing method from slurry with 50 per cent graphite content. The samples prepared using multiple casting were of worse quality than those fabricated in conventional process, contained irregular porosity, showed tendency for deformation and delamination and exhibited a higher dielectric constant. Originality/value Search for new low dielectric constant materials applicable in LTCC technology and new methods of their fabrication is an important task for development of modern microwave circuits.

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46

Ngah, N. A., Amiza Rasmi, Azmi Ibrahim, Zulkifli Ambak, Mohd Zulfadli Mohamed Yusoff, and Rosidah Alias. "Thermal Management Study of LTCC PIN Photodiode Module." Materials Science Forum 934 (October 2018): 13–17. http://dx.doi.org/10.4028/www.scientific.net/msf.934.13.

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Multilayer low temperature co-fired ceramic (LTCC) is well known in usage as interconnect substrate, especially in high frequency application due to high electrical conductivity of the conductors and low loss of the LTCC dielectric. As substrate and packaging materials, there are many chips or devices placed on the multilayer LTCC board. In this paper, multilayer LTCC is implemented as the packaging at PIN photodiode (PD) module of the Radio over Fiber (RoF) system with the reason to increase thermal dissipation capacity of the PD module.

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47

Bittner, Achim, and Ulrich Schmid. "Modified Organic low-k Dielectric Layers on Fired LTCC Substrates." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000394–99. http://dx.doi.org/10.4071/cicmt-2012-wa49.

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In this study, the reduction of permittivity of LTCC substrates by coating with a polyimide compound containing hollow glass microspheres as filler material is described. By incorporating the filler material, the dielectric constant of the substrate material is locally lowered to improve the high-frequency performance of antennas operated in the GHz range. Furthermore, by adding the filler material to the liquid polyimide precursor the layer thickness is heightened from maximum 10 μm to above 80 μm which is enough to fill cavities in LTCC substrates. Two compound materials with filler to polymer ratios 1:7.5 and 1:10 are mixed. Afterwards they are deposited by spin coating onto LTCC substrates. The film thickness depends on the rotating speed and the filler content. With the higher filler concentration and low rotating speed of 500 rpm 82 μm thick polymer films can be achieved. The high surface roughness can be reduced afterwards by adding additional pure polyimide layers on top to Ra= 3 μm. The dielectric constant of the entire substrate consisting of the LTCC and the resulting compound material is measured using a ring resonator in microstrip configuration. From the resonances occurring in the transmission S-parameter |S21| spectrum between 1 to 10 GHz, the relative dielectric constant can be determined. Using 820 μm thick LTCC substrates a relatively low reduction from εr = 7.8 to 6.6 is achieved. However, due to permittivity can be reduced with higher microsphere amounts, the dielectric constant of pure polyimide of εr= 3.3 can also be reduced. Furthermore due to the sufficiently high film thickness of the modified substrates, the compound layer can be used as single dielectric layer.

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48

Chen, Junqi, Chunchun Li, Huaicheng Xiang, Ying Tang, and Liang Fang. "SrV2O6: An ultralow-firing microwave dielectric ceramic for LTCC applications." Materials Research Bulletin 100 (April 2018): 377–81. http://dx.doi.org/10.1016/j.materresbull.2017.12.053.

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49

Zhang, Jie, Zhenxing Yue, Yu Luo, Xiaohua Zhang, and Longtu Li. "Novel Low-Firing Forsterite-Based Microwave Dielectric for LTCC Applications." Journal of the American Ceramic Society 99, no. 4 (February 8, 2016): 1122–24. http://dx.doi.org/10.1111/jace.14132.

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50

Radosavljević, Goran, Nelu Blaž, Andrea Marić, W. Smetana, and Ljiljana Živanov. "Mechanical, Electrical and Thermal Characterization of Commercially Available LTCC Dielectric Tapes." Key Engineering Materials 543 (March 2013): 212–15. http://dx.doi.org/10.4028/www.scientific.net/kem.543.212.

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Presented paper deals with mechanical and electrical properties of several commercially available LTCC (Low Temperature Co-fired Technology) tapes, as well as their thermal characterization. Three commercially available dielectric tape materials provided by Heraeus (CT700, CT707 and CT800) are investigated. The samples for determination of significant material parameters are prepared using the standard LTCC fabrication process. Results of the material characterization (chemical analysis, surface roughness electrical and mechanical properties) are presented. In addition thermo-electrical and-mechanical characterization of investigated tapes analysis is performed.

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