Academic literature on the topic 'ESD'

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Journal articles on the topic "ESD"

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Hirasawa, D. "ESD." Nihon Kikan Shokudoka Gakkai Kaiho 72, no. 2 (April 10, 2021): 88–92. http://dx.doi.org/10.2468/jbes.72.88.

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Kim, Yong Lyun, and Eun Young Jang. "ESD reflected in the 2022 revised national curriculum: Focusing on the general introduction and the middle school curriculum." Association of Global Studies Education 15, no. 1 (March 30, 2023): 5–33. http://dx.doi.org/10.19037/agse.15.1.01.

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The purpose of this study is to analyze the ESD reflected in the general introduction and the middle school curriculum of the ‘2022 revised national curriculum’, and to propose a teaching and learning plan applied with ESD. As a result of analyzing the contents of the general introduction, it was confirmed that the focus, educational goals, core competencies, and teaching and learning methods presented in the general introduction were similar to the transitional learning goals and teaching and learning methods proposed in ‘ESD 2030’. In addition, as a result of analyzing the middle school curriculum by subject, it was found that ESD was reflected in the curriculum of all middle school subjects, and this study also conducted to classify and systematize ESD-related contents such as the sustainable development or ecological conversion presented in the curriculum for each subject by 5Ps of SDGs. Finally, this study proposed learner-centered problem-solving approach, local community-based learning, integrated and cross-functional teaching and learning methods, and cooperative group learning methods applied with ESD.
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Lee, Han Yong, and Yeon-A. Son. "A Development of Science-ESD Instructional Model for Integration of Science Education and Education for Sustainable Development (ESD)." Journal of Curriculum Integration 12, no. 4 (November 30, 2018): 197–225. http://dx.doi.org/10.35304/jci.12.4.09.

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Saito, Yutaka, Taku Sakamoto, Takeshi Nakajima, and Takahisa Matsuda. "Colorectal ESD." Gastrointestinal Endoscopy Clinics of North America 24, no. 2 (April 2014): 245–55. http://dx.doi.org/10.1016/j.giec.2013.11.005.

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Yamamoto, Hironori, and Yoshimasa Miura. "Duodenal ESD." Gastrointestinal Endoscopy Clinics of North America 24, no. 2 (April 2014): 235–44. http://dx.doi.org/10.1016/j.giec.2013.11.007.

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Gotoda, Takuji, Khek-Yu Ho, Roy Soetikno, Tonya Kaltenbach, and Peter Draganov. "Gastric ESD." Gastrointestinal Endoscopy Clinics of North America 24, no. 2 (April 2014): 213–33. http://dx.doi.org/10.1016/j.giec.2013.11.009.

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Oyama, Tsuneo. "Esophageal ESD." Gastrointestinal Endoscopy Clinics of North America 24, no. 2 (April 2014): 201–12. http://dx.doi.org/10.1016/j.giec.2013.12.001.

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Toyonaga, Takashi, Mariko Man-I, Yoshinori Morita, and Takeshi Azuma. "Endoscopic Submucosal Dissection (ESD) Versus Simplified/Hybrid ESD." Gastrointestinal Endoscopy Clinics of North America 24, no. 2 (April 2014): 191–99. http://dx.doi.org/10.1016/j.giec.2013.11.004.

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Alvarez, D., M. J. Abou-Khalil, C. Russ, K. Chatty, R. Gauthier, D. Kontos, J. Li, C. Seguin, and R. Halbach. "Analysis of ESD failure mechanism in 65nm bulk CMOS ESD NMOSFETs with ESD implant." Microelectronics Reliability 46, no. 9-11 (September 2006): 1597–602. http://dx.doi.org/10.1016/j.microrel.2006.07.041.

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binti Abd Ghani, Nabilah Fathiah, Mohammad Zakariya bin Bakhri, Ismail bin Mohamadiah, Khairol Amali bin Ahmad, and Anis Shahida Niza binti Mokhtar. "Ionizers as Major ESD Countermeasure in 12nm Gate Oxide Semiconductor Manufacturing." Key Engineering Materials 908 (January 28, 2022): 308–15. http://dx.doi.org/10.4028/p-i68anb.

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The sensitive Electrostatic Discharge (ESD) has been found to be the major causes in semiconductor manufacturing that contributed in the event when the samples did not function properly and failed during testing. Various techniques had been studied and implemented as the ESD countermeasures. Based on the EDS event model, control measures on people, grounding and ionizations have been practiced as the main preventive measures against ESD. However, many aspects of the measures need to be customized to the specific fabrication areas. This paper conducted several experiments in the use of ionizers to tackle the ESD issue in a 12nm Gate Oxide semiconductor fabrication facility. Based on several hypotheses on the areas and operations that are prone to ESD during the back-end processes, experiments were conducted to evaluate them. The results affirm the need to individually and specifically check the effectiveness of the usage of ionizers to combat ESD as some ionizer were found to be not effective at the location or area where they are installed.
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Dissertations / Theses on the topic "ESD"

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Soldner, Wolfgang Wilhelm. "HF-ESD-Codesign." Aachen Shaker, 2009. http://d-nb.info/996579168/04.

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Drüen, Stephan [Verfasser]. "Virtual ESD Test – : An ESD Analysis Methodology at Chip Level / Stephan Drüen." Aachen : Shaker, 2007. http://d-nb.info/1166508595/34.

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Soldner, Wolfgang W. [Verfasser]. "HF ESD CODESIGN / Wolfgang W Soldner." Aachen : Shaker, 2009. http://d-nb.info/1159834857/34.

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Chung, Youngeun. "Education for Sustainable Development (ESD) in Sweden: A study of ESD within a transition affected by PISA reports." Thesis, Uppsala universitet, Institutionen för geovetenskaper, 2013. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-210157.

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Education for Sustainable Development (ESD) has been called for playing a crucial role in integrating principles,values, and practices accorded with sustainable development. Holistic approach, ethical values, norm transitionand behavior changes are required to achieve the aim of ESD. However, while both external and internal impactsof the Swedish education system have affected its fundamental values and aims, core elements of ESD inSwedish curriculum were also influenced. This paper analyzes, in particular, the changes that PISA reportsbrought in the Swedish curriculum at the discourse level, and its potential effects on ESD. Discourse analysiswas mainly used for comparing two curricula and two syllabi. With the help of situational contexts of PISA andthe curriculum of 2011, a transition observed from text analysis was interpreted and the final discussion wasanchored with social contexts from educational discourses. The result indicated that influences from PISA in thenew curriculum and syllabus were observed in corresponded aims and goals. Situational and social contexts alsopointed to the same direction of transition due to the previous goals-oriented curriculum that made a wide rangeof teaching. Thus, fundamental values, aims and goals were changed into providing clearer guidelines forteaching scope and gradings as well as into focusing literacy skills and knowledge of concepts. In the process ofthe transition, holistic approach, ethical and democratical values, as well as focus on cultural aspects and pupils’ attributes were removed or shrunken, which implied negative impacts on ESD. On the other hand, emphasis onliteracy skills of students in the new curriculum was expected to bring positive achievement for ESD.Furthermore, in order to achieve the norm transition toward sustainable development, those lost immeasurable values are suggested to be addressed in future Swedish education.
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Dukhan, Al-Hytham, and Dastan Hassan. "Undersökning av alternativa ESD-skydd inom produktion." Thesis, Högskolan i Skövde, Institutionen för ingenjörsvetenskap, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:his:diva-19657.

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Tillverkning av elektroniska produkter ökar och utvecklas vilket medför till att flera skyddsåtgärder behöver vidtas under tillverkningsprocessen. Elektroniska komponenter kan skadas av elektrostatisk urladdning (ESD). Elektroniktillverkande industrier vill minimera ESD-risken inom produktionsmiljön för att minimera skaderisken i samband med produkterna. Företag använder sig av skyddsåtgärd i form av olika ESD-skyddssystem vilket bidrar till en ESD-kontrollerad produktionsmiljö. Ett projekt har utförts på företaget Veoneer, projektet bygger på en undersökning av det nuvarande ESD-systemet samt en undersökning av två alternativa ESD-skyddssystem. Vetenskapliga artiklar baserat på tre olika ESD-skyddssystem har undersökts för att evaluera kostnaderna och implementationsmöjligheten i produktionen. Undersökningen användes för att utvärdera neutraliseringseffektiviteten av den statiska uppladdningen. De undersökta ESD-skyddssystemen är följande ESD-emballagen som används i nuläget, ersättning av ESD-plast till enbart plast i samband med jonisatorer och slutligen justering av luftfuktigheten. Det nuvarande ESD-systemet skyddar produktionen från elektrostatiska urladdningar. Problemet med systemet är det höga priset för ESD-emballagen. Projektstyrningen baseras på tillvägagångsättet projekt base, projektstyrningsmetoden består av följande fyra stadier förstudier, planering, genomförande och avslut. Den nuvarande ESD-systemet och jonisator systemet undersöktes genom forskningsstudier och experiment. Justering av luftfuktigheten undersöktes enbart via litteraturstudier samt via företagsrapporter. För att möjliggöra experimenten anordnades mätverktyg för att uppmäta den elektrostatiska uppladdningen av ESD-emballagen samt plastemballagen. Jonisatorer implementerades inför slutexperimentet för att uppmätta den elektrostatiska neutraliseringsförmågan. Ekonomiska kalkyler av ESD-plastemballagen har utformats i samband med jonisatorer och plastemballage för att fastställa prisskillnaden mellan ESD-skyddssystemen. Experimentet bidrog till säkra och godkända mätvärden vilket medför ur ett experimentperspektiv till att jonisator systemet och det nuvarande system inte utsätter produkterna för någon ESD-risk. Införandet av jonisatorer leder till en stor ekonomisk besparing om lösningen skulle tillämpas som ersättningsalternativ. Jonisatorn bör inte implementeras direkt, fler utförliga studier behöver åstadkommas innan ett nytt ESD-system införskaffas. Företagets luftfuktighetsstudier påvisade negativa resultat vilket medförde till att inga fysiska luftfuktighetsexperiment kunde verkställas på företaget. Flera förbättringsförslag har åstadkommits i samband med nulägets ESD-skyddssystem och jonisator systemet. Förbättringsförslagen innefattar materialbyte ur ett ekonomiskt och ekologiskt hållbarhetsperspektiv samt har förslag på arbetsstandarden åstadkommits.
As time goes on, the manufacturing of electronic products is increasing and evolving, which calls for the introduction of protective measures on electronic components. Electronic components can be problematic as they produce electrostatic discharge (ESD), something that the manufacturing industry aims to reduce. By implementing safety measures in various ESD-protective systems, which leads to a minimized risk of ESD damage. A project has been carried out at the company Veoneer, the project is based on a study regarding the current ESD-system and a study on two other ESD-protection systems. Literature study and experimentation have been accomplished in relation to the three ESD-protective systems to evaluate the costs and implementation possibilities of production and to further evaluate the effectiveness of neutralization of the static charge. The following ESD-protective systems examined are the currently using ESD-packaging, replacement of ESD-plastic to plastic trays only in combination with ionizers and finally adjustment of the relative humidity. The current ESD-system protects production from electrostatic discharges. The problem with the current system is the costly price ratio of the ESD-packaging. Veoneer carried out a project based on a study regarding the current ESD-system and a study on two other ESD-protective systems. Through the study of relevant literature and experimentation, the three ESD-protective systems have been analyzed to evaluate the costs and implementation possibilities of production and further evaluate the static charge's effectiveness of neutralization. The following ESD-protective systems currently use ESD-packaging, replacement of ESD-plastic trays to plastic trays with ionizers, and finally, adjusting the relative humidity. On the one hand, the current ESD-system protects production from electrostatic discharges, but the current system's problem is the costly price ratio of the ESD-packaging. Project management is centered around the project-based approach. The project-management method consists of four stages of feasibility: studies, planning, implementation, and closure. The control methodology has ensured that the project runs smoothly. The current ESD and ionizer systems were investigated through research studies and experiments, whereas adjustment of humidity was investigated solely through literature studies and company reports. To begin the experiments, measuring tools were arranged to calculate the electrostatic charge in regards to the ESD-packaging and the plastic packaging. Ionizers were utilized for the final experiment to measure the electrostatic neutralization capacity with plastic packaging. Economic calculations have been carried out by the ESD-plastic packaging in conjunction with ionizers and discovered that plastic packaging alone can determine the price difference between the ESD-systems. The experiment resulted in safe and approved readings, meaning that from an experimental perspective, the ionizer system and the current system do not expose products to any ESD-risk. The introduction of ionizers could lead to huge savings if they were to be used as a replacement option. The ionizer should not be implemented directly; more detailed studies need to be carried out before a new ESD-system is acquired. The company's humidity studies showed negative results, implying that the company could not carry out physical experiments concerning humidity. Several proposed improvements have been suggested regarding the current ESD-protection and ionizer system. The improvement proposals includes change of material from an economic and ecological sustainability perspective, and several proposals havebeen made regarding the working standards.
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Muthukrishnan, Swaminathan. "ESD Protected SiGe HBT RFIC Power Amplifiers." Thesis, Virginia Tech, 2005. http://hdl.handle.net/10919/31705.

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Over the last few decades, the susceptibility of integrated circuits to electrostatic discharge (ESD) induced damages has justified the use of dedicated on-chip protection circuits. Design of robust protection circuits remains a challenging task because ESD failure mechanisms have become more acute as device dimensions continue to shrink. A lack of understanding of the ESD phenomena coupled with the increased sensitivity of smaller devices and time-to-market demands has led to a trial-and-error approach to ESD-protected circuit design. Improved analysis capabilities and a systematic design approach are essential to accomplish the challenging task of providing adequate protection to core circuit(s). The design of ESD protection circuitry for RFIC's has been relatively slow to evolve, compared to their digital counterparts, and is now emerging as a new design challenge in RF and high-speed mixed-signal IC development. Sub-circuits which are not embedded in a single System-on-Chip (SOC), such as RF Power amplifiers (PAs), are of particular concern as they are more susceptible to the various ESD events. This thesis presents the development of integrated ESD protection circuitry for two RFIC Power Amplifier designs. A prototype PA for 2.4 GHz Wireless Local Area Network (WLAN) applications was redesigned to provide protection to the RF input and the PA Control pins. A relatively new technique known as the L-C tank approach was used to protect the RFinput while a standard diode ring approach was used to protect the control line. The protection techniques studied were subsequently extended to a completely protected three-stage PA targeting 1.9 GHz Digitally Enhanced Cordless Telephone (DECT) applications. An on-chip shunt-L-series-C input matching network was used to provide ESD protection to the input pin of the DECT PA. A much more area efficient (as compared to the diode ring technique) Zener diode approach was used to protect the control and signal lines. The PA's RF performance was virtually unaffected by the addition of the protection circuits. Both PAs were designed in a commercially available 0.5 ìm SiGe-HBT process. The partially protected WLAN PA was fabricated and packaged in a 3mm x 3mm Fine Pitch Quad Flat Package FQFP-N 12 Lead package and had a measured ESD protection rating of ± 1kV standard Human Body Model (HBM) ESD test. The simulated DECT PA demonstrated +1.5kV/-4kV HBM performance.
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Černá, Martina. "Překážky volného pohybu pracovníků v judikatuře ESD." Master's thesis, Vysoká škola ekonomická v Praze, 2009. http://www.nusl.cz/ntk/nusl-18117.

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The aim of my thesis is to acquaint the reader with the problematic of free movement of workers, both from the theoretical point of view and from practical point of view based on the European Court of Justice cases. In the theoretical part of the thesis, I focus on the characteristics of internal market and definition of free movement of persons and workers. I mention individual law regulations that significantly influence the problematic of free movement of persons. Further, I describe different exceptions from free movement of workers, mutual recognition of academic qualifications and social security regarding the movement of workers. And at last in my practical part, I analyze individual cases of ECJ which have had the most significant impact on the development of free movement of workers.
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Zupac, Dragan 1961. "ESD-induced noncatastrophic damage in power MOSFETs." Thesis, The University of Arizona, 1990. http://hdl.handle.net/10150/291470.

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Electrostatic discharge (ESD) may, depending on the energy of the pulse, cause either catastrophic failures or degradation of MOSFETs. Effects of noncatastrophic positive Human-Body Model (HBM) ESD stress at the gate of power MOSFETs are investigated in this work. Noncatastrophic damage is manifested in the form of positive charge trapping in the gate oxide. In p-channel devices used in this study, the charge injection and trapping occur predominantly in the gate oxide areas lying above the p-body region. In p-channel devices used, the charge is injected mainly from the p-drain region. Based on the polarity of the pulse and the regions observed to contribute to charge injection, a model of ESD-induced charge injection from the silicon into the oxide is proposed. Finally, the effects of noncatastrophic ESD events on the radiation response of n-channel power MOSFETs are reported.
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Cao, Yiqun [Verfasser], Stephan [Akademischer Betreuer] Frei, and Bernd [Gutachter] Deutschmann. "High-voltage ESD structures and ESD protection concepts in smart power technologies / Yiqun Cao ; Gutachter: Bernd Deutschmann ; Betreuer: Stephan Frei." Dortmund : Universitätsbibliothek Dortmund, 2019. http://d-nb.info/1200209605/34.

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Escudié, Fabien. "Optimisation de modèles comportementaux de composants pour la prédiction de défaillances fonctionnelles et matérielles liées aux décharges électrostatiques (ESD)." Thesis, Toulouse 3, 2018. http://www.theses.fr/2018TOU30266/document.

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Les événements transitoires de forte puissance (EFT - Electrical Fast Transient) sont l'une des préoccupations des concepteurs de systèmes embarqués. Ils peuvent conduire au dysfonctionnement du système et sont à l'origine d'un grand nombre de défaillances matérielles et fonctionnelles. Notre étude est principalement portée sur l'impact des décharges électrostatique (ESD - Electro Static Discharge) sur l'électronique embarquée dans un véhicule. D'après une étude de Renault, un véhicule peut subir deux décharges par jour durant sa vie. Les ingénieurs systèmes ne disposent pas de moyen pour prédire l'impact de ces décharges dans les systèmes, et les solutions actuelles sont essentiellement basées sur l'expérience. Afin de prédire le chemin d'un ESD dans tout le système électronique et la stratégie de protection à adopter pour protéger les composants les plus sensibles, des recherches dans le monde entier sont en cours. Les travaux de recherche du groupe ESE du LAAS-CNRS ont mené à des méthodologies de modélisation de composant passif, de circuit intégré et de carte électronique en VHDL-AMS. Les circuits intégrés sont dotés d'un réseau de protection ESD interne qui permet de détourner le stress des zones critiques. La méthodologie développée au cours des précédentes années permet de modéliser le comportement de ce réseau de protection. Cependant, ces modèles sont rudimentaires, ils décrivent uniquement le niveau de déclenchement de la protection et son impédance quasi-statique en fonction du niveau de stress ESD. Aucune information sur le comportement transitoire de la protection n'est décrite dans le modèle. Il est donc difficile de prévoir certaines défaillances liées aux phénomènes transitoires de déclenchement des protections faisant apparaitre de très fortes surtensions ou des niveaux de courant mal évalués. Les différents aspects abordés durant cette thèse permettent de résoudre ces problèmes en proposant des modèles dynamiques, et différentes méthodes pour pouvoir extraire les paramètres des modèles.[...]
Electrical Fast Transient (EFT) are one of the concerns of embedded system engineers. They can lead to system malfunction. EFT are the cause of a large number of hardware and software failures. Our study is mainly focused on the impact of Electro Static Discharge (ESD) on embedded electronic systems, focusing on car's applications. According to a Renault's study, a car can suffer two discharges per day during its entire life. System engineers do not have any tools to predict the ESD impact on the systems. In order to predict the ESD path throughout the electronic system and adjust the ESD protection strategy to provide proper protection for all critical components, some researches around the world are in process. The research results from ESE working group from the LAAS-CNRS laboratory, were mainly on passive components, integrated circuits and electronics boards modeling methods, implemented in VHDL-AMS language. Integrated circuits have an internal ESD protection network that helps to deflect the stress from critical areas. The methodology developed in the last few years allows to model the behavior of this protection network. However, these models are basically made, they are made of the triggering level of the protection and the impedance value of the component depending on the ESD stress amplitude. No information on the transient behavior of the protections is included in this model. It is not possible to predict some failures related to the transient phenomenon of the protection like triggering and turning on time that induce very high overvoltage or mismatch on the current levels estimation. The various topics covered during this thesis allows to solve these problems by using a, proposed dynamic model. Different methods are proposed to extract the parameters used into the dynamic model. One important point also aborted into this document is that the model have to be able to predict the soft failure which can appear in the system during an ESD stress.[...]
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Books on the topic "ESD"

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Voldman, Steven H. ESD. Chichester, UK: John Wiley & Sons, Ltd, 2015. http://dx.doi.org/10.1002/9781118954492.

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Voldman, Steven H. ESD. Chichester, UK: John Wiley & Sons, Ltd, 2005. http://dx.doi.org/10.1002/0470033479.

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Voldman, Steven H. ESD. Chichester, UK: John Wiley & Sons, Ltd, 2011. http://dx.doi.org/10.1002/9781119991137.

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Voldman, Steven H. ESD. Chichester, United Kingdom: John Wiley & Sons, Ltd, 2014. http://dx.doi.org/10.1002/9781118701409.

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Voldman, Steven H. ESD. Chichester, UK: John Wiley & Sons, Ltd, 2004. http://dx.doi.org/10.1002/0470013508.

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Voldman, Steven H. ESD. New York: John Wiley & Sons, Ltd., 2006.

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Voldman, Steven H. ESD. New York: John Wiley & Sons, Ltd., 2006.

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Voldman, Steven H. ESD Testing. Chichester, UK: John Wiley & Sons Ltd, 2016. http://dx.doi.org/10.1002/9781118707128.

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Voldman, Steven H. ESD Basics. Chichester, UK: John Wiley & Sons, Ltd, 2012. http://dx.doi.org/10.1002/9781118443323.

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Dangelmayer, G. Theodore. ESD Program Management. Boston, MA: Springer US, 1996. http://dx.doi.org/10.1007/978-1-4613-1179-9.

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Book chapters on the topic "ESD"

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Tooley, Mike. "ESD." In Aircraft Digital Electronic and Computer Systems, 197–206. 3rd ed. London: Routledge, 2022. http://dx.doi.org/10.1201/9781003215516-12.

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Harris, John. "ESD Control." In The Electronics Assembly Handbook, 469–73. Berlin, Heidelberg: Springer Berlin Heidelberg, 1988. http://dx.doi.org/10.1007/978-3-662-13161-9_74.

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Oka, Shiro, and Shinji Tanaka. "Hybrid ESD." In Endoscopic Management of Colorectal T1(SM) Carcinoma, 87–91. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-13-6649-9_11.

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Vashchenko, Vladislav A., and Andrei Shibkov. "ESD Clamps." In ESD Design for Analog Circuits, 155–212. Boston, MA: Springer US, 2010. http://dx.doi.org/10.1007/978-1-4419-6565-3_4.

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Vinson, James E., Joseph C. Bernier, Gregg D. Croft, and Juin J. Liou. "ESD Modeling." In ESD Design and Analysis Handbook, 181–200. Boston, MA: Springer US, 2003. http://dx.doi.org/10.1007/978-1-4615-0321-7_6.

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Barnes, John R. "ESD Testing." In Robust Electronic Design Reference Book, 957–62. New York, NY: Springer US, 2004. http://dx.doi.org/10.1007/1-4020-7830-7_43.

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Hellström, Sten. "Indirect ESD." In ESD — The Scourge of Electronics, 93–107. Berlin, Heidelberg: Springer Berlin Heidelberg, 1998. http://dx.doi.org/10.1007/978-3-642-80302-4_7.

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Mejía Pérez, Lady Katherine, Seiichiro Abe, Raja Siva, John Vargo, and Amit Bhatt. "Esophageal ESD." In Gastrointestinal Interventional Endoscopy, 83–95. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-21695-5_6.

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Gotoda, Takuji. "Gastric ESD." In Gastrointestinal Interventional Endoscopy, 97–106. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-21695-5_7.

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Namasivayam, Vikneswaran, and Yutaka Saito. "Colonic ESD." In Gastrointestinal Interventional Endoscopy, 107–25. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-21695-5_8.

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Conference papers on the topic "ESD"

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"Paper 3B.1 has been withdrawn." In 2019 41st Annual EOS/ESD Symposium (EOS/ESD). IEEE, 2019. http://dx.doi.org/10.23919/eos/esd.2019.8869965.

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Stockinger, Michael. "Low-Leakage NMOS Clamps with Gate-Assisted Bipolar Triggering." In 2019 41st Annual EOS/ESD Symposium (EOS/ESD). IEEE, 2019. http://dx.doi.org/10.23919/eos/esd.2019.8869969.

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3

Malobabic, Slavica, David Marreiro, and Vladislav Vashchenko. "Dual Injection Latchup Phenomenon in HV Rail Based ESD Protection Networks." In 2019 41st Annual EOS/ESD Symposium (EOS/ESD). IEEE, 2019. http://dx.doi.org/10.23919/eos/esd.2019.8869970.

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Marreiro, David, and Vladislav Vashchenko. "HV Latch-up at System Level ESD Current Injection." In 2019 41st Annual EOS/ESD Symposium (EOS/ESD). IEEE, 2019. http://dx.doi.org/10.23919/eos/esd.2019.8869971.

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Matsubara, Ryo, and Katsuo Inokuchi. "Development of EMC analysis technology using large-scale electromagnetic field analysis." In 2019 41st Annual EOS/ESD Symposium (EOS/ESD). IEEE, 2019. http://dx.doi.org/10.23919/eos/esd.2019.8870011.

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6

"EOS/ESD 2019 Future Events Page." In 2019 41st Annual EOS/ESD Symposium (EOS/ESD). IEEE, 2019. http://dx.doi.org/10.23919/eos/esd.2019.8869960.

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Dannenberger, Stefan, Danielle Griffith, and Oddgeir Fikstvedt. "ESD Design Considerations for Ultra-Low Power Crystal Oscillators in Automotive Products." In 2019 41st Annual EOS/ESD Symposium (EOS/ESD). IEEE, 2019. http://dx.doi.org/10.23919/eos/esd.2019.8869961.

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"EOS/ESD 2019 Awards [9 awards]." In 2019 41st Annual EOS/ESD Symposium (EOS/ESD). IEEE, 2019. http://dx.doi.org/10.23919/eos/esd.2019.8869962.

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9

Narita, Koki, and Mototsugu Okushima. "A Variable VH Combined Power Clamp for System Level ESD/Surge Immunity Enhancement with Low Leakage." In 2019 41st Annual EOS/ESD Symposium (EOS/ESD). IEEE, 2019. http://dx.doi.org/10.23919/eos/esd.2019.8869963.

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Viheriakoski, Toni, Rita Fung, Richard Wong, Reinhold Gartner, Friedrich zur Nieden, and Pasi Tamminen. "Characterization of ESD Shielding Bag with Capacitive Probe and IEC 61000-4-2 Generator." In 2019 41st Annual EOS/ESD Symposium (EOS/ESD). IEEE, 2019. http://dx.doi.org/10.23919/eos/esd.2019.8869964.

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Reports on the topic "ESD"

1

Whinnery, LeRoy L.,, April Nissen, Patrick Keifer, and Alexander Tyson. Imaging indicator for ESD safety testing. Office of Scientific and Technical Information (OSTI), May 2013. http://dx.doi.org/10.2172/1088073.

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2

Pfeifer, Kent Bryant. Modeling of ESD events from polymeric surfaces. Office of Scientific and Technical Information (OSTI), March 2014. http://dx.doi.org/10.2172/1200667.

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3

Wilson, Issa, and Jeanette Varela. Everything Safety: Technical Terms to ESD Experiments. Office of Scientific and Technical Information (OSTI), August 2014. http://dx.doi.org/10.2172/1150686.

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4

Sain, Joseph A. ESD/MITRE Software Acquisition Symposium Proceedings; an ESD/Industry Dialogue held in Bedford, Massachusetts on May 6-7, 1986. Fort Belvoir, VA: Defense Technical Information Center, May 1986. http://dx.doi.org/10.21236/ada178785.

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5

Jones, R. D., K. C. Chen, and S. W. Holmes. Vacuum cleaner modifications leading to reduced ESD hazards. Office of Scientific and Technical Information (OSTI), March 1994. http://dx.doi.org/10.2172/10148472.

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6

Snyder, Hans R. Fiber Optic Point Sensors for ESD Data Experiments. Office of Scientific and Technical Information (OSTI), August 2018. http://dx.doi.org/10.2172/1463586.

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7

Jones, R. D., K. C. Chen, and S. W. Holmes. ESD hazards associated with CO{sub 2} refrigeration. Office of Scientific and Technical Information (OSTI), August 1994. http://dx.doi.org/10.2172/10181984.

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8

Collins, Jr., David H. Analysis of Type 17 Actuator Response to ESD insults. Office of Scientific and Technical Information (OSTI), October 2018. http://dx.doi.org/10.2172/1479890.

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9

Wilson, M. J. Projected Response of Typical Detonators to Electrostatic Discharge (ESD) Environments. Office of Scientific and Technical Information (OSTI), December 2002. http://dx.doi.org/10.2172/15003275.

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10

Barnard, Casey. Packaging a liquid metal ESD with micro-scale Mercury droplet. Office of Scientific and Technical Information (OSTI), August 2011. http://dx.doi.org/10.2172/1088095.

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