Academic literature on the topic 'Epoxy compounds'
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Journal articles on the topic "Epoxy compounds"
Rudawska, Anna. "Experimental Study of Mechanical Properties of Epoxy Compounds Modified with Calcium Carbonate and Carbon after Hygrothermal Exposure." Materials 13, no. 23 (November 29, 2020): 5439. http://dx.doi.org/10.3390/ma13235439.
Full textEgunova, T. N., and N. I. Baurova. "Investigation of operational properties of epoxy-sand compounds used in repair of machines." Technology of Metals, no. 2 (February 2023): 11–18. http://dx.doi.org/10.31044/1684-2499-2023-0-2-11-18.
Full textUschitsky, M., and E. Suhir. "Moisture Diffusion in Epoxy Molding Compounds Filled With Particles." Journal of Electronic Packaging 123, no. 1 (September 2, 1998): 47–51. http://dx.doi.org/10.1115/1.1325009.
Full textNistor, Alexandru, Agneta Maria Pusztai, Mircea Constantin Sora, Bogdan Hoinoiu, Mihai Ionac, and Petru Matusz. "Training in Flap Harvesting using Corrosion Casted Pig Latissimus Dorsi Muscle Flaps Choosing the Optimal Plastic Compound for Corrosion Casting." Materiale Plastice 54, no. 3 (September 30, 2017): 578–80. http://dx.doi.org/10.37358/mp.17.3.4900.
Full textMikroyannidis, John A. "Self-curing epoxy compounds." Journal of Applied Polymer Science 41, no. 1112 (1990): 2613–24. http://dx.doi.org/10.1002/app.1990.070411109.
Full textRudawska, Anna. "The Impact of the Acidic Environment on the Mechanical Properties of Epoxy Compounds in Different Conditions." Polymers 12, no. 12 (December 10, 2020): 2957. http://dx.doi.org/10.3390/polym12122957.
Full textSadeghi, H., and R. Yazdanparast. "Isolation and Structure Elucidation of a New Potent Anti-neoplastic Diterpene from Dendrostellera lessertii." American Journal of Chinese Medicine 33, no. 05 (January 2005): 831–37. http://dx.doi.org/10.1142/s0192415x05003387.
Full textLee, Sang-Hoon, Seung-Won Oh, Young-Hee Lee, Il-Jin Kim, Dong-Jin Lee, Jae-Chun Lim, Cha-Cheol Park, and Han-Do Kim. "Preparation and properties of flame-retardant epoxy resins containing reactive phosphorus flame retardant." Journal of Engineered Fibers and Fabrics 15 (January 2020): 155892502090132. http://dx.doi.org/10.1177/1558925020901323.
Full textKim, Young-Hun, Jeong Ju Baek, Ki Cheol Chang, Baek Soo Park, Won-Gun Koh, and Gyojic Shin. "Effect of Synthetic Low-Odor Thiol-Based Hardeners Containing Hydroxyl and Methyl Groups on the Curing Behavior, Thermal, and Mechanical Properties of Epoxy Resins." Polymers 15, no. 13 (July 4, 2023): 2947. http://dx.doi.org/10.3390/polym15132947.
Full textSaiki, Hiroyuki, Yasuo Marumo, Hiroshi Nishitake, Masahiro Hazama, and Fuminori Sakata. "Deformation Characteristics of Epoxy Compounds for Semiconductor Integrated Circuits." Advanced Materials Research 15-17 (February 2006): 599–603. http://dx.doi.org/10.4028/www.scientific.net/amr.15-17.599.
Full textDissertations / Theses on the topic "Epoxy compounds"
Woo, Shui Cheung. "Degradation of epoxy-clay nanocomposites after UV exposure and moisture attack /." View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20WOO.
Full textHu, Chugang. "Epoxy-clay nanocomposites : morphology, moisture absorption behavior and thermo-mechanical properties /." View abstract or full-text, 2004. http://library.ust.hk/cgi/db/thesis.pl?MECH%202004%20HU.
Full textPunchaipetch, Prakaipetch. "Epoxy + Liquid Crystalline Epoxy Coreacted Networks." Thesis, University of North Texas, 2000. https://digital.library.unt.edu/ark:/67531/metadc2705/.
Full textSgriccia, Nikki. "Microwave and thermally cured natural fiber epoxy composites." Diss., Connect to online resource - MSU authorized users, 2008.
Find full textKelly, Paul Thomas. "Preparation, characterization and properties of montmorillonite/epoxy compounds." Case Western Reserve University School of Graduate Studies / OhioLINK, 1994. http://rave.ohiolink.edu/etdc/view?acc_num=case1057604761.
Full textBilyeu, Bryan. "Characterization of Cure Kinetics and Physical Properties of a High Performance, Glass Fiber-Reinforced Epoxy Prepreg and a Novel Fluorine-Modified, Amine-Cured Commercial Epoxy." Thesis, University of North Texas, 2003. https://digital.library.unt.edu/ark:/67531/metadc4437/.
Full textChen, Rong-Sheng. "Hygrothermal response of graphite/epoxy composites /." The Ohio State University, 1987. http://rave.ohiolink.edu/etdc/view?acc_num=osu1487326511715323.
Full textChonkaew, Wunpen Brostow Witold. "Modifications of epoxy resins for improved mechanical and tribological performances and their effects on curing kinetics." [Denton, Tex.] : University of North Texas, 2008. http://digital.library.unt.edu/permalink/meta-dc-6123.
Full textChan, Edward King-Long. "A study of moisture diffusion at the epoxy/copper interface for plastic IC packages /." View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20CHAN.
Full textCrow, Brian Shelton. "Epoxidation of alkenes by dimethyldioxirane kinetics, activation parameters and solvent studies /." restricted, 2005. http://etd.gsu.edu/theses/available/etd-11282005-140018/.
Full textTitle from title screen. Al Baumstark, committee chair; Paul Franklin, David Boykin, Markus Germann, committee members. Electronic text (136 p. : charts (some col.)) : digital, PDF file. Description based on contents viewed June 7, 2007. Includes bibliographical references (p. 130-136).
Books on the topic "Epoxy compounds"
Työterveyslaitos and Teknillinen Korkeakoulu. Faculty of Process Engineering and Material Science., eds. Occupational skin diseases from epoxy compounds: Epoxy resin compounds, epoxy acrylates, and 2,3-epoxypropyl trimethyl ammonium chloride. Helsinki: Institute of Occupational Health, 1991.
Find full textA, Sokolova I͡U. Modifit͡sirovannye ėpoksidnye klei i pokrytii͡a v stroitelʹstve. Moskva: Stroĭizdat, 1990.
Find full textEpoxy resins, curing agents, compounds, and modifiers: An industrial guide. 2nd ed. Park Ridge, N.J., U.S.A: Noyes Publications, 1993.
Find full textEpoxy resins, curing agents, compounds, and modifiers: An industrial guide. Park Ridge, N.J., U.S.A: Noyes Publications, 1987.
Find full textEpoxy polymers: New materials and innovations. Weinheim: Wiley-VCH, 2010.
Find full textSingh, Jag J. Investigation of the effects of cobalt ions on epoxy properties. Hampton, Va: Langley Research Center, 1986.
Find full textMilchert, Eugeniusz. Epoksydowanie olefin i chloroolefin wodoronadtlenkiem tert-butylu. Szczecin: Wydawn. Uczelniane Politechniki Szczecińskiej, 1991.
Find full textSingh, Jag J. Free-volume characteristics of epoxies. Hampton, Va: Langley Research Center, 1992.
Find full textSingh, Jag J. Free-volume characteristics of epoxies. [Washington, DC]: National Aeronautics and Space Administration, Office of Management, Scientific and Technical Information Program, 1992.
Find full textSingh, Jag J. Free-volume characteristics of epoxies. [Washington, DC]: National Aeronautics and Space Administration, Office of Management, Scientific and Technical Information Program, 1992.
Find full textBook chapters on the topic "Epoxy compounds"
Gooch, Jan W. "Epoxy Compounds." In Encyclopedic Dictionary of Polymers, 271. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_4466.
Full text"Epoxy Compounds." In A Comprehensive Guide to the Hazardous Properties of Chemical Substances, 348–69. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2006. http://dx.doi.org/10.1002/9780470134955.ch16.
Full text"6β-Acetoxy-1,10-epoxy-furanoeremophilane (6β-Acetoxy-1,10-epoxy-euryopsin)." In Natural Compounds, 554–55. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1106.
Full text"6β-Acetoxy-1,10-epoxy-furanoeremophil-9-one (1,10-Epoxy-decompositin)." In Natural Compounds, 555. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1107.
Full text"6β-(2′,3′-Epoxy-angeloyloxy)-1β,10β-epoxy-furanoeremophil-9-one." In Natural Compounds, 579. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1161.
Full text"6-Angeloyloxy-1α,10-epoxy-furanoeremophilane (6-Angeloyloxy-1α,10-epoxy-euryopsin)." In Natural Compounds, 570. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1140.
Full text"6β-Angeloyloxy-1,10-epoxy-furanoeremophil-9-one (6β-Angeloyloxy-1,10α-epoxy-euryopsin)." In Natural Compounds, 571–72. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1142.
Full text"6β-(4′-Hydroxyangeloyloxy)-1,10β-epoxy-furanoeremophilane (1,10β-Epoxy-6β-(γ-hydroxyangeloyloxy)furanoeremophilan)." In Natural Compounds, 581. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1166.
Full text"3β-Angeloyloxy-6,15-epoxy-furanoeremophilane." In Natural Compounds, 562. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1122.
Full text"6β-Isobutyroyloxy-1,10-epoxy-furanoeremophilane." In Natural Compounds, 588. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-0539-9_1180.
Full textConference papers on the topic "Epoxy compounds"
Uschitsky, M., and E. Suhir. "Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles." In ASME 1997 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1997. http://dx.doi.org/10.1115/imece1997-0818.
Full textUschitsky, M., E. Suhir, and G. W. Kammlott. "Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach." In ASME 1997 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1997. http://dx.doi.org/10.1115/imece1997-0819.
Full textWalter, H., O. Holck, H. Dobrinski, J. Stuermann, T. Braun, J. Bauer, O. Wittler, and K. D. Lang. "Moisture induced swelling in epoxy moulding compounds." In 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC). IEEE, 2013. http://dx.doi.org/10.1109/ectc.2013.6575803.
Full textLindahl, R., M. Rhen, and A. Hagenbjörk-Gustavsson. "78. Dermal Exposure Measurement of Epoxy Compounds." In AIHce 2005. AIHA, 2005. http://dx.doi.org/10.3320/1.2758669.
Full textLall, Pradeep, Kalyan Dornala, Jeff Suhling, and John Deep. "Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures." In ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/ipack2017-74322.
Full textLall, Pradeep, Kalyan Dornala, Jeff Suhling, John Deep, and Ryan Lowe. "Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading." In ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/ipack2019-6572.
Full textSousa, M. F., O. Holck, T. Braun, J. Bauer, H. Walter, O. Wittler, and K. D. Lang. "Mechanically relevant chemical shrinkage of epoxy molding compounds." In 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2013. http://dx.doi.org/10.1109/eurosime.2013.6529962.
Full textvan Soestbergen, M., L. J. Ernst, G. Q. Zhang, and R. T. H. Rongen. "Transport of Corrosive Constituents in Epoxy Moulding Compounds." In 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007. IEEE, 2007. http://dx.doi.org/10.1109/esime.2007.360019.
Full textHuiqiang, Shen, Qin Fei, Xia Guofeng, and Bie Xiaorui. "Characterization of thermal and curing behaviors of epoxy molding compounds." In 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM). IEEE, 2014. http://dx.doi.org/10.1109/isaf.2014.6917884.
Full textHuiqiang, Shen, Qin Fei, Xia Guofeng, and Bie Xiaorui. "Characterization of thermal and curing behaviors of epoxy molding compounds." In 2014 15th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2014. http://dx.doi.org/10.1109/icept.2014.6922675.
Full textReports on the topic "Epoxy compounds"
Naim, Michael, Gary R. Takeoka, Haim D. Rabinowitch, and Ron G. Buttery. Identification of Impact Aroma Compounds in Tomato: Implications to New Hybrids with Improved Acceptance through Sensory, Chemical, Breeding and Agrotechnical Techniques. United States Department of Agriculture, October 2002. http://dx.doi.org/10.32747/2002.7585204.bard.
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