Log in

Relevant bibliographies by topics / Encapsulation devices / Journal articles

Journal articles on the topic 'Encapsulation devices'

To see the other types of publications on this topic, follow the link: Encapsulation devices.

Author: Grafiati

Published: 10 December 2022

Last updated: 28 January 2023

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the top 50 journal articles for your research on the topic 'Encapsulation devices.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Browse journal articles on a wide variety of disciplines and organise your bibliography correctly.

1

Ahn, Jeong, and Kim. "Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices." Micromachines 10, no. 8 (July 31, 2019): 508. http://dx.doi.org/10.3390/mi10080508.

Full text

Abstract:

The development of reliable long-term encapsulation technologies for implantable biomedical devices is of paramount importance for the safe and stable operation of implants in the body over a period of several decades. Conventional technologies based on titanium or ceramic packaging, however, are not suitable for encapsulating microfabricated devices due to their limited scalability, incompatibility with microfabrication processes, and difficulties with miniaturization. A variety of emerging materials have been proposed for encapsulation of microfabricated implants, including thin-film inorganic coatings of Al2O3, HfO2, SiO2, SiC, and diamond, as well as organic polymers of polyimide, parylene, liquid crystal polymer, silicone elastomer, SU-8, and cyclic olefin copolymer. While none of these materials have yet been proven to be as hermetic as conventional metal packages nor widely used in regulatory approved devices for chronic implantation, a number of studies have demonstrated promising outcomes on their long-term encapsulation performance through a multitude of fabrication and testing methodologies. The present review article aims to provide a comprehensive, up-to-date overview of the long-term encapsulation performance of these emerging materials with a specific focus on publications that have quantitatively estimated the lifetime of encapsulation technologies in aqueous environments.

APA, Harvard, Vancouver, ISO, and other styles

2

Anye, V. C., W. O. Akande, M. G. Zebaze Kana, and W. O. Soboyejo. "Encapsulation of Organic Light Emitting Diodes by PDMS Stamping ." Advanced Materials Research 1132 (December 2015): 166–84. http://dx.doi.org/10.4028/www.scientific.net/amr.1132.166.

Full text

Abstract:

This paper presents results of the improvement of the lifetime of organic light emitting diodes (OLEDs) by encapsulation with polydimethyl siloxane (PDMS). This polymer is very effective in protecting the device from degradation in oxygen and moisture rich environments. This is captured in the results obtained for full immersion and storage tests of encapsulated single layer devices based on MEH:PPV as the active layer. Mechanical tests were carried out to ascertain the strength (adhesion) of the interface between the encapsulating layer and the device cathode material, aluminum (Al) using both centrally-cracked Brazilian Disk, CCBD and force microscopy techniques. The encapsulated devices provided an average of 90 minutes of illumination while the bare devices provided illumination for about 3 minutes. Such a reproducible stamping technique is more appropriate due to the low processing temperatures, inherent flexibility, device compatibility and mechanical robustness at low costs.

APA, Harvard, Vancouver, ISO, and other styles

3

Hozoji, Hiroshi. "Encapsulation Materials for Power Devices." Journal of Japan Institute of Electronics Packaging 15, no. 5 (2012): 374–78. http://dx.doi.org/10.5104/jiep.15.374.

Full text

APA, Harvard, Vancouver, ISO, and other styles

4

Kinkeldei, Thomas, Niko Munzenrieder, Christoph Zysset, Kunigunde Cherenack, and Gerhard Tröster. "Encapsulation for Flexible Electronic Devices." IEEE Electron Device Letters 32, no. 12 (December 2011): 1743–45. http://dx.doi.org/10.1109/led.2011.2168378.

Full text

APA, Harvard, Vancouver, ISO, and other styles

5

Desmarais, Samantha M., Henk P. Haagsman, and Annelise E. Barron. "Microfabricated devices for biomolecule encapsulation." ELECTROPHORESIS 33, no. 17 (September 2012): 2639–49. http://dx.doi.org/10.1002/elps.201200189.

Full text

APA, Harvard, Vancouver, ISO, and other styles

6

Shahrivar, Keshvad, and Francesco Del Giudice. "Controlled viscoelastic particle encapsulation in microfluidic devices." Soft Matter 17, no. 35 (2021): 8068–77. http://dx.doi.org/10.1039/d1sm00941a.

Full text

APA, Harvard, Vancouver, ISO, and other styles

7

Pope, Emily, Bradley Haltli, Russell G. Kerr, and Ali Ahmadi. "Effects of Matrix Composition and Temperature on Viability and Metabolic Activity of Microencapsulated Marine Bacteria." Microorganisms 10, no. 5 (May 10, 2022): 996. http://dx.doi.org/10.3390/microorganisms10050996.

Full text

Abstract:

To enhance the discovery of novel natural products, various innovations have been developed to aid in the cultivation of previously unculturable microbial species. One approach involving the microencapsulation of bacteria has been gaining popularity as a new cultivation technique, with promising applications. Previous studies demonstrated the success of bacterial encapsulation; however, they highlighted that a key limitation of encapsulating bacteria within agarose is the high temperature required for encapsulation. Encapsulation of bacteria within agarose typically requires a temperature high enough to maintain the flow of agarose through microfluidic devices without premature gelation. Given the sensitivity of many bacterial taxa to temperature, the effect of various agarose-based encapsulating matrices on marine bacterial viability was assessed to further develop this approach to bacterial culture. It was determined that lowering the temperature of encapsulation via the use of low-gelling-temperature agarose, as well as the addition of nutrients to the matrix, significantly improved the viability of representative marine sediment bacteria in terms of abundance and metabolic activity. Based on these findings, the use of low-gelling-temperature agarose with supplemental nutrients is recommended for the encapsulation of marine bacteria obtained from temperate habitats.

APA, Harvard, Vancouver, ISO, and other styles

8

Candler, R. N., Woo-Tae Park, Huimou Li, G. Yama, A. Partridge, M. Lutz, and T. W. Kenny. "Single wafer encapsulation of mems devices." IEEE Transactions on Advanced Packaging 26, no. 3 (August 2003): 227–32. http://dx.doi.org/10.1109/tadvp.2003.818062.

Full text

APA, Harvard, Vancouver, ISO, and other styles

9

Madakasira, Pallavi, Kanzan Inoue, Ross Ulbricht, Sergey B. Lee, M. Zhou, John P. Ferraris, and Anvar A. Zakhidov. "Multilayer encapsulation of plastic photovoltaic devices." Synthetic Metals 155, no. 2 (November 2005): 332–35. http://dx.doi.org/10.1016/j.synthmet.2005.09.035.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Randall, Christina L., Yevgeniy V. Kalinin, Mustapha Jamal, Aakash Shah, and David H. Gracias. "Self-folding immunoprotective cell encapsulation devices." Nanomedicine: Nanotechnology, Biology and Medicine 7, no. 6 (December 2011): 686–89. http://dx.doi.org/10.1016/j.nano.2011.08.020.

Full text

APA, Harvard, Vancouver, ISO, and other styles

11

Chen, Zehua, Ulrich Gengenbach, Liane Koker, and Maher Mansour. "Approaches for Solution-Processed Encapsulation of Printed Medical Wearable Devices." Current Directions in Biomedical Engineering 6, no. 3 (September 1, 2020): 131–34. http://dx.doi.org/10.1515/cdbme-2020-3034.

Full text

Abstract:

AbstractWearable medical devices offer a great opportunity to monitor human vital signs to improve healthcare. The use of printing technologies is a promising approach to fabricate the wearables. An encapsulation must be applied to achieve longterm stability and reliability of the printed wearables. In this paper, we discuss the encapsulation requirements of printed wearable medical devices. Different encapsulation approaches are illustrated by means of various examples. Thereby, the focus lies upon solution-processed encapsulation, including the compatible materials and printing technologies.

APA, Harvard, Vancouver, ISO, and other styles

12

Choi, Jin-Myung, Hiroki Suko, Kyusun Kim, Jiye Han, Sangsu Lee, Yutaka Matsuo, Shigeo Maruyama, Il Jeon, and Hirofumi Daiguji. "Multi-Walled Carbon Nanotube-Assisted Encapsulation Approach for Stable Perovskite Solar Cells." Molecules 26, no. 16 (August 20, 2021): 5060. http://dx.doi.org/10.3390/molecules26165060.

Full text

Abstract:

Perovskite solar cells (PSCs) are regarded as the next-generation thin-film energy harvester, owing to their high performance. However, there is a lack of studies on their encapsulation technology, which is critical for resolving their shortcomings, such as their degradation by oxygen and moisture. It is determined that the moisture intrusion and the heat trapped within the encapsulating cover glass of PSCs influenced the operating stability of the devices. Therefore, we improved the moisture and oxygen barrier ability and heat releasing capability in the passivation of PSCs by adding multi-walled carbon nanotubes to the epoxy resin used for encapsulation. The 0.5 wt% of carbon nanotube-added resin-based encapsulated PSCs exhibited a more stable operation with a ca. 30% efficiency decrease compared to the ca. 63% decrease in the reference devices over one week under continuous operation. Specifically, the short-circuit current density and the fill factor, which are affected by moisture and oxygen-driven degradation, as well as the open-circuit voltage, which is affected by thermal damage, were higher for the multi-walled carbon nanotube-added encapsulated devices than the control devices, after the stability test.

APA, Harvard, Vancouver, ISO, and other styles

13

Bar-Kohany, T., and A. Stern. "Lifetime Estimation of Moems Devices." Journal of Electronic Packaging 129, no. 2 (June 13, 2006): 144–48. http://dx.doi.org/10.1115/1.2721085.

Full text

Abstract:

Generally, microelectro mechanical systems (MOEMS) devices require encapsulation for protecting their fragile and tiny inner components in a hermetically sealed cavity. Cavity hermeticity can be critical to the device performance and plays a vital role with respect to reliability and long-term drift characteristics of the MOEMS products. The paper presents a theoretical approach for estimation of lifetime of MOEMS devices in terms of cavity’s hermeticity to gases and water. The results are summarized as working maps for MOEMS packaging engineers, in terms of device cavity (internal package volume), equivalent leak rates, and equivalent size of interconnected defects in the bonding zone.

APA, Harvard, Vancouver, ISO, and other styles

14

Seok, Seonho. "Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation." Micromachines 12, no. 9 (August 27, 2021): 1020. http://dx.doi.org/10.3390/mi12091020.

Full text

Abstract:

Polymer materials attract more and more interests for a biocompatible package of novel implantable medical devices. Medical implants need to be packaged in a biocompatible way to minimize FBR (Foreign Body Reaction) of the implant. One of the most advanced implantable devices is neural prosthesis device, which consists of polymeric neural electrode and silicon neural signal processing integrated circuit (IC). The overall neural interface system should be packaged in a biocompatible way to be implanted in a patient. The biocompatible packaging is being mainly achieved in two approaches; (1) polymer encapsulation of conventional package based on die attach, wire bond, solder bump, etc. (2) chip-level integrated interconnect, which integrates Si chip with metal thin film deposition through sacrificial release technique. The polymer encapsulation must cover different materials, creating a multitude of interface, which is of much importance in long-term reliability of the implanted biocompatible package. Another failure mode is bio-fluid penetration through the polymer encapsulation layer. To prevent bio-fluid leakage, a diffusion barrier is frequently added to the polymer packaging layer. Such a diffusion barrier is also used in polymer-based neural electrodes. This review paper presents the summary of biocompatible packaging techniques, packaging materials focusing on encapsulation polymer materials and diffusion barrier, and a FEM-based modeling and simulation to study the biocompatible package reliability.

APA, Harvard, Vancouver, ISO, and other styles

15

Elshabini, Aicha, Fred Barlow, Sharmin Islam, and Pin-Jen Wang. "Advanced Devices and Electronic Packaging for Harsh Environment." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000937–50. http://dx.doi.org/10.4071/isom-2013-thp61.

Full text

Abstract:

The paper addresses the challenges in electronic packaging for extreme environment based on experimental work of the researchers and conducted reliability testing to evaluate high speed devices suitable for these applications, substrates, die attach, wire bonding, and encapsulation and housing. In particular, the researcher's work has focused on SiC power devices with low loss high voltage Schottky diodes with significant applications, high temperature JFETs and SiC MOSFETs (double trench), and GaN microwave devices. The paper provides recommendations for selection of devices, substrates, die attach, and encapsulation and housing for these applications.

APA, Harvard, Vancouver, ISO, and other styles

16

Mosallaei, Mahmoud, Jarno Jokinen, Mikko Kanerva, and Matti Mäntysalo. "The Effect of Encapsulation Geometry on the Performance of Stretchable Interconnects." Micromachines 9, no. 12 (December 5, 2018): 645. http://dx.doi.org/10.3390/mi9120645.

Full text

Abstract:

The stretchability of electronic devices is typically obtained by tailoring the stretchable interconnects that link the functional units together. The durability of the interconnects against environmental conditions, such as deformation and chemicals, is therefore important to take into account. Different approaches, including encapsulation, are commonly used to improve the endurance of stretchable interconnects. In this paper, the geometry of encapsulation layer is initially investigated using finite element analysis. Then, the stretchable interconnects with a narrow-to-wide layout are screen-printed using silver flake ink as a conductor on a thermoplastic polyurethane (TPU) substrate. Printed ultraviolet (UV)-curable screen-printed dielectric ink and heat-laminated TPU film are used for the encapsulation of the samples. The electromechanical tests reveal a noticeable improvement in performance of encapsulated samples compared to non-protected counterparts in the case of TPU encapsulation. The improvement is even greater with partial coverage of the encapsulation layer. A device with a modified encapsulation layer can survive for 10,000 repetitive cycles at 20% strain, while maintaining the electrical and mechanical performance.

APA, Harvard, Vancouver, ISO, and other styles

17

Park, Chan, Hyunsuk Jung, Hyunwoo Lee, Sunguk Hong, Hyonguk Kim, and Seong Cho. "One-Step Laser Encapsulation of Nano-Cracking Strain Sensors." Sensors 18, no. 8 (August 14, 2018): 2673. http://dx.doi.org/10.3390/s18082673.

Full text

Abstract:

Development of flexible strain sensors that can be attached directly onto the skin, such as skin-mountable or wearable electronic devices, has recently attracted attention. However, such flexible sensors are generally exposed to various harsh environments, such as sweat, humidity, or dust, which cause noise and shorten the sensor lifetimes. This study reports the development of a nano-crack-based flexible sensor with mechanically, thermally, and chemically stable electrical characteristics in external environments using a novel one-step laser encapsulation (OLE) method optimized for thin films. The OLE process allows simultaneous patterning, cutting, and encapsulating of a device using laser cutting and thermoplastic polymers. The processes are simplified for economical and rapid production (one sensor in 8 s). Unlike other encapsulation methods, OLE does not degrade the performance of the sensor because the sensing layers remain unaffected. Sensors protected with OLE exhibit mechanical, thermal, and chemical stability under water-, heat-, dust-, and detergent-exposed conditions. Finally, a waterproof, flexible strain sensor is developed to detect motions around the eye, where oil and sweat are generated. OLE-based sensors can be used in several applications that are exposed to a large amount of foreign matter, such as humid or sweaty environments.

APA, Harvard, Vancouver, ISO, and other styles

18

SAKAI, Tadamoto, Shinji YAMAMOTO, Tsukasa SHIROGANEYA, and Akira KOSAKI. "Development of encapsulation moulding equipment for electronic devices." Journal of the Japan Society for Precision Engineering 54, no. 12 (1988): 2277–82. http://dx.doi.org/10.2493/jjspe.54.2277.

Full text

APA, Harvard, Vancouver, ISO, and other styles

19

LI Yongtao, 黎永涛, 宋小锋 SONG Xiaofeng, 陈建龙 CHEN Jianlong, 姚日晖 YAO Rihui, and 文尚胜 WEN Shangsheng. "Encapsulation′s Thermal Characteristics for Organic Electroluminescent Devices." ACTA PHOTONICA SINICA 40, no. 11 (2011): 1630–35. http://dx.doi.org/10.3788/gzxb20114011.1630.

Full text

APA, Harvard, Vancouver, ISO, and other styles

20

Sun, Qian-Qian, Qiao-Shi An, and Fu-Jun Zhang. "A simple encapsulation method for organic optoelectronic devices." Chinese Physics B 23, no. 8 (July 31, 2014): 083302. http://dx.doi.org/10.1088/1674-1056/23/8/083302.

Full text

APA, Harvard, Vancouver, ISO, and other styles

21

Ghosh, A. P., L. J. Gerenser, C. M. Jarman, and J. E. Fornalik. "Thin-film encapsulation of organic light-emitting devices." Applied Physics Letters 86, no. 22 (May 30, 2005): 223503. http://dx.doi.org/10.1063/1.1929867.

Full text

APA, Harvard, Vancouver, ISO, and other styles

22

Aridor, Yariv, David Carmel, Yoelle S. Maarek, Aya Soffer, and Ronny Lempel. "Knowledge encapsulation for focused search from pervasive devices." ACM Transactions on Information Systems 20, no. 1 (January 2002): 25–46. http://dx.doi.org/10.1145/503104.503106.

Full text

APA, Harvard, Vancouver, ISO, and other styles

23

Yao, Y. F., B. Njoman, K. H. Chua, and T. Y. Lin. "New encapsulation development for fine pitch IC devices." Microelectronics Reliability 45, no. 7-8 (July 2005): 1222–29. http://dx.doi.org/10.1016/j.microrel.2004.10.008.

Full text

APA, Harvard, Vancouver, ISO, and other styles

24

Wu, Zhaoxin, Liduo Wang, Chun Chang, and Yong Qiu. "A hybrid encapsulation of organic light-emitting devices." Journal of Physics D: Applied Physics 38, no. 7 (March 18, 2005): 981–84. http://dx.doi.org/10.1088/0022-3727/38/7/003.

Full text

APA, Harvard, Vancouver, ISO, and other styles

25

Mazzitelli, Stefania, Lorenzo Capretto, Federico Quinci, Roberta Piva, and Claudio Nastruzzi. "Preparation of cell-encapsulation devices in confined microenvironment." Advanced Drug Delivery Reviews 65, no. 11-12 (November 2013): 1533–55. http://dx.doi.org/10.1016/j.addr.2013.07.021.

Full text

APA, Harvard, Vancouver, ISO, and other styles

26

Pereira, Miriam Salles, Liana Monteiro da Fonseca Cardoso, Tatiane Barreto da Silva, Ayla Josma Teixeira, Saul Eliahú Mizrahi, Gabriel Schonwandt Mendes Ferreira, Fabio Moyses Lins Dantas, Vinicius Cotta-de-Almeida, and Luiz Anastacio Alves. "A Low-Cost Open Source Device for Cell Microencapsulation." Materials 13, no. 22 (November 11, 2020): 5090. http://dx.doi.org/10.3390/ma13225090.

Full text

Abstract:

Microencapsulation is a widely studied cell therapy and tissue bioengineering technique, since it is capable of creating an immune-privileged site, protecting encapsulated cells from the host immune system. Several polymers have been tested, but sodium alginate is in widespread use for cell encapsulation applications, due to its low toxicity and easy manipulation. Different cell encapsulation methods have been described in the literature using pressure differences or electrostatic changes with high cost commercial devices (about 30,000 US dollars). Herein, a low-cost device (about 100 US dollars) that can be created by commercial syringes or 3D printer devices has been developed. The capsules, whose diameter is around 500 µm and can decrease or increase according to the pressure applied to the system, is able to maintain cells viable and functional. The hydrogel porosity of the capsule indicates that the immune system is not capable of destroying host cells, demonstrating that new studies can be developed for cell therapy at low cost with microencapsulation production. This device may aid pre-clinical and clinical projects in low- and middle-income countries and is lined up with open source equipment devices.

APA, Harvard, Vancouver, ISO, and other styles

27

Rudkevich, Dmitry M., and Alexander V. Leontiev. "Molecular Encapsulation of Gases." Australian Journal of Chemistry 57, no. 8 (2004): 713. http://dx.doi.org/10.1071/ch04102.

Full text

Abstract:

The principles and techniques of molecular encapsulation, as applied to environmentally, biologically, and commercially important gases, are reviewed. The gases may be trapped within natural (clathrates, cyclodextrins) or synthetic (cryptophanes, carcerands, calixarenes) cavities. The physical and chemical features of the cavities are key to understanding which gases may be trapped and to what extent. These trapping materials possess a host of applications, from gas sensing and separation to acting as storage devices and microreaction vessels.

APA, Harvard, Vancouver, ISO, and other styles

28

Ballacchino, Giulia, Edward Weaver, Essyrose Mathew, Rossella Dorati, Ida Genta, Bice Conti, and Dimitrios A. Lamprou. "Manufacturing of 3D-Printed Microfluidic Devices for the Synthesis of Drug-Loaded Liposomal Formulations." International Journal of Molecular Sciences 22, no. 15 (July 28, 2021): 8064. http://dx.doi.org/10.3390/ijms22158064.

Full text

Abstract:

Microfluidic technique has emerged as a promising tool for the production of stable and monodispersed nanoparticles (NPs). In particular, this work focuses on liposome production by microfluidics and on factors involved in determining liposome characteristics. Traditional fabrication techniques for microfluidic devices suffer from several disadvantages, such as multistep processing and expensive facilities. Three-dimensional printing (3DP) has been revolutionary for microfluidic device production, boasting facile and low-cost fabrication. In this study, microfluidic devices with innovative micromixing patterns were developed using fused deposition modelling (FDM) and liquid crystal display (LCD) printers. To date, this work is the first to study liposome production using LCD-printed microfluidic devices. The current study deals with 1,2-dimyristoyl-sn-glycero-3-phosphocholine (DMPC) liposomes with cholesterol (2:1) prepared using commercial and 3D-printed microfluidic devices. We evaluated the effect of microfluidic parameters, chip manufacturing, material, and channel design on liposomal formulation by analysing the size, PDI, and ζ-potential. Curcumin exhibits potent anticancer activity and it has been reported that curcumin-loaded liposomes formulated by microfluidics show enhanced encapsulation efficiency when compared with other reported systems. In this work, curcumal liposomes were produced using the developed microfluidic devices and particle sizing, ζ-potential, encapsulation efficiency, and in vitro release studies were performed at 37 °C.

APA, Harvard, Vancouver, ISO, and other styles

29

Sili, E., M. L. Locatelli, M. Bechara, S. Diaham, and S. Dinculescu. "Study of the electrical and thermal properties of a silicone elastomer filled with silica for high temperature power device encapsulation." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (January 1, 2015): 1–9. http://dx.doi.org/10.4071/hiten-session6-paper6_6.

Full text

Abstract:

In order to take the full advantage of the high-temperature SiC and GaN operating power devices, package materials able to withstand high-temperature storage and large thermal cycles are required. However, a survey of the commercially available silicone gels mostly used for power module encapsulation, highlights that this type of materials exhibits a maximum temperature limit for continuous operation of about 260 °C. A slight extension of this temperature range might be obtained by using silicone elastomers with hardness still remaining measurable on the Shore A scale. The aim of this paper is to study a silicone elastomer poly(dimethyl)siloxane (PDMS) with silica fillers, with a specified maximum operating temperature of 275 °C, in order to evaluate its ability for high temperature power device encapsulation. First, the nature and size of the filler microparticles were determined using scanning electron microscopy (SEM) observations coupled with energy dispersive X-ray spectroscopy (EDX) analysis. Second, the results of the thermal and electrical properties of this elastomer over a wide temperature range show that this type of insulating materials presents promising initial properties for the encapsulation of high temperature power devices.

APA, Harvard, Vancouver, ISO, and other styles

30

Wu, Jun Hui, Quan Zhou, Qiang Zhou, Jie Chen, Hui Ping Si, Kai Yan Lin, and Chi Bin Zhang. "Thermal Design, Analysis and Verification of Chip-Level MCM with Properties of Semiconductor Materials." Advanced Materials Research 625 (December 2012): 280–86. http://dx.doi.org/10.4028/www.scientific.net/amr.625.280.

Full text

Abstract:

A lot of practice had proved that the failure rate can be used as the reliability indicators of MCM (Multi-Chip Module). The lower the junction temperature of the semiconductor integrated circuit device in MCM, the lower the failure rate of components was, thus the higher the reliability of MCM. Therefore, in order to measure the junction temperature of the semiconductor components of MCM, computer simulation is needed in the stage of design，which was essential for improving the reliability of MCM’s encapsulation and even the whole electronic machine system. In this paper, we tried to thermal design the high-power heating devices-MCM of the multi-functional electronic devices. First, the cooling principles of MCM encapsulation were introduced. And then based on the design principles and precautions of MCM, we designed an MCM encapsulation for cooling analyses of ANSYS. The results of finite element analyses showed the reasonableness of the design of MCM, and combined with the different substrate materials and circuit board materials, further discusses about improved cooling capability of MCM were expressed in this paper. At last, we got the desired effect.

APA, Harvard, Vancouver, ISO, and other styles

31

Uddin, Ashraf, Mushfika Upama, Haimang Yi, and Leiping Duan. "Encapsulation of Organic and Perovskite Solar Cells: A Review." Coatings 9, no. 2 (January 23, 2019): 65. http://dx.doi.org/10.3390/coatings9020065.

Full text

Abstract:

Photovoltaic is one of the promising renewable sources of power to meet the future challenge of energy need. Organic and perovskite thin film solar cells are an emerging cost-effective photovoltaic technology because of low-cost manufacturing processing and their light weight. The main barrier of commercial use of organic and perovskite solar cells is the poor stability of devices. Encapsulation of these photovoltaic devices is one of the best ways to address this stability issue and enhance the device lifetime by employing materials and structures that possess high barrier performance for oxygen and moisture. The aim of this review paper is to find different encapsulation materials and techniques for perovskite and organic solar cells according to the present understanding of reliability issues. It discusses the available encapsulate materials and their utility in limiting chemicals, such as water vapour and oxygen penetration. It also covers the mechanisms of mechanical degradation within the individual layers and solar cell as a whole, and possible obstacles to their application in both organic and perovskite solar cells. The contemporary understanding of these degradation mechanisms, their interplay, and their initiating factors (both internal and external) are also discussed.

APA, Harvard, Vancouver, ISO, and other styles

32

Kasoju, Naresh, Julian George, Hua Ye, and Zhanfeng Cui. "Sacrificial Core-Based Electrospinning: A Facile and Versatile Approach to Fabricate Devices for Potential Cell and Tissue Encapsulation Applications." Nanomaterials 8, no. 10 (October 21, 2018): 863. http://dx.doi.org/10.3390/nano8100863.

Full text

Abstract:

Electrospinning uses an electric field to produce fine fibers of nano and micron scale diameters from polymer solutions. Despite innovation in jet initiation, jet path control and fiber collection, it is common to only fabricate planar and tubular-shaped electrospun products. For applications that encapsulate cells and tissues inside a porous container, it is useful to develop biocompatible hollow core-containing devices. To this end, by introducing a 3D-printed framework containing a sodium chloride pellet (sacrificial core) as the collector and through post-electrospinning dissolution of the sacrificial core, we demonstrate that hollow core containing polyamide 66 (nylon 66) devices can be easily fabricated for use as cell encapsulation systems. ATR-FTIR and TG/DTA studies were used to verify that the bulk properties of the electrospun device were not altered by contact with the salt pellet during fiber collection. Protein diffusion investigations demonstrated that the capsule allowed free diffusion of model biomolecules (insulin, albumin and Ig G). Cell encapsulation studies with model cell types (fibroblasts and lymphocytes) revealed that the capsule supports the viability of encapsulated cells inside the capsule whilst compartmentalizing immune cells outside of the capsule. Taken together, the use of a salt pellet as a sacrificial core within a 3D printed framework to support fiber collection, as well as the ability to easily remove this core using aqueous dissolution, results in a biocompatible device that can be tailored for use in cell and tissue encapsulation applications.

APA, Harvard, Vancouver, ISO, and other styles

33

Li, Changzheng, Maarten Cauwe, Lothar Mader, David Schaubroeck, and Maaike Op de Beeck. "Accelerated Hermeticity Testing of Biocompatible Moisture Barriers Used for the Encapsulation of Implantable Medical Devices." Coatings 10, no. 1 (December 26, 2019): 19. http://dx.doi.org/10.3390/coatings10010019.

Full text

Abstract:

Barrier layers for the long-term encapsulation of implantable medical devices play a crucial role in the devices’ performance and reliability. Typically, to understand the stability and predict the lifetime of barriers (therefore, the implantable devices), the device is subjected to accelerated testing at higher temperatures compared to its service parameters. Nevertheless, at high temperatures, reaction and degradation mechanisms might be different, resulting in false accelerated test results. In this study, the maximum valid temperatures for the accelerated testing of two barrier layers were investigated: atomic layer deposited (ALD) Al2O3 and stacked ALD HfO2/Al2O3/HfO2, hereinafter referred to as ALD-3. The in-house developed standard barrier performance test is based on continuous electrical resistance monitoring and microscopic inspection of Cu patterns covered with the barrier and immersed in phosphate buffered saline (PBS) at temperatures up to 95 °C. The results demonstrate the valid temperature window to perform temperature acceleration tests. In addition, the optimized ALD layer in combination with polyimide (polyimide/ALD-3/polyimide) works as effective barrier at 60 °C for 1215 days, suggesting the potential applicability to the encapsulation of long-term implants.

APA, Harvard, Vancouver, ISO, and other styles

34

de Beeck, Maaike Op, John O'Callaghan, Karen Qian, Bishoy M. Morcos, Aleksandar Radisic, Karl Malachowski, M. F. Amira, and Chris Van Hoof. "Biocompatible encapsulation and interconnection technology for implantable electronic devices." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000215–24. http://dx.doi.org/10.4071/isom-2012-ta65.

Full text

Abstract:

A biocompatible packaging process for implantable electronic systems is under development at imec, combining biocompatibility, hermeticity, extreme miniaturization and cost aspects. In a first phase of this packaging sequence, hermetic chip sealing is performed by encapsulating all chips to realize a bi-directional diffusion barrier preventing body fluids to leach into the package causing corrosion, and preventing IC materials such as Cu to diffuse into the body, causing various adverse effects. For cost effectiveness, this chip sealing is performed as post-processing at wafer level, using modifications of standard clean room (CR) fabrication techniques. Well known conductive and insulating CR materials are investigated with respect to their biocompatibility, biostability, diffusion barrier properties and sensitivity to corrosion. Material selection and integration aspects are modified until good properties are obtained. In a second phase of the packaging process, all chips of the final device should be electrically connected, applying a biocompatible metallization scheme. We selected the use of Pt due to its excellent biocompatibility and corrosion resistance. Since Pt is very expensive, a cost effective Pt-selective plating process is developed. During the third packaging step, all system components such as electronics, passives, a battery,… will be interconnected. To provide sufficient mechanical support, all components are finally embedded using a medical grade elastomer such as PDMS or Poly-urethane.

APA, Harvard, Vancouver, ISO, and other styles

35

Morita, Toshiaki, Kazuji Yamada, Shin Kimura, Makoto Kitano, Kouki Yamamoto, and Kihachiro Tanaka. "Vibration Analysis of Encapsulation for High Power Semiconductor Devices." IEEJ Transactions on Industry Applications 120, no. 4 (2000): 600–606. http://dx.doi.org/10.1541/ieejias.120.600.

Full text

APA, Harvard, Vancouver, ISO, and other styles

36

Souriau, J.-C., J. M. Herrera Morales, L. Castagné, G. Simon, K. Amara, and B. Boutaud. "Miniaturization and Biocompatible Encapsulation for Implantable Biomedical Silicon Devices." ECS Journal of Solid State Science and Technology 4, no. 12 (2015): P445—P450. http://dx.doi.org/10.1149/2.0221512jss.

Full text

APA, Harvard, Vancouver, ISO, and other styles

37

Souriau, J. C., J. M. Herrera Morales, L. Castagne, G. Simon, K. Amara, and B. Boutaud. "Miniaturization and Biocompatible Encapsulation for Implantable Biomedical Silicon Devices." ECS Transactions 69, no. 6 (October 2, 2015): 15–24. http://dx.doi.org/10.1149/06906.0015ecst.

Full text

APA, Harvard, Vancouver, ISO, and other styles

38

Lee, Joohee, Duhyeong Kim, Hyungkyu Lee, Younho Lee, and Jung Hee Cheon. "RLizard: Post-Quantum Key Encapsulation Mechanism for IoT Devices." IEEE Access 7 (2019): 2080–91. http://dx.doi.org/10.1109/access.2018.2884084.

Full text

APA, Harvard, Vancouver, ISO, and other styles

39

Nyitray, Crystal E., Ryan Chang, Gaetano Faleo, Kevin D. Lance, Daniel A. Bernards, Qizhi Tang, and Tejal A. Desai. "Polycaprolactone Thin-Film Micro- and Nanoporous Cell-Encapsulation Devices." ACS Nano 9, no. 6 (May 14, 2015): 5675–82. http://dx.doi.org/10.1021/acsnano.5b00679.

Full text

APA, Harvard, Vancouver, ISO, and other styles

40

Winkler, Anja, Adrian Ehrenhofer, Thomas Wallmersperger, Maik Gude, and Niels Modler. "Soft robotic structures by smart encapsulation of electronic devices." Procedia Manufacturing 52 (2020): 277–82. http://dx.doi.org/10.1016/j.promfg.2020.11.046.

Full text

APA, Harvard, Vancouver, ISO, and other styles

41

Köster, Sarah, Francesco E. Angilè, Honey Duan, Jeremy J. Agresti, Anton Wintner, Christian Schmitz, Amy C. Rowat, et al. "Drop-based microfluidic devices for encapsulation of single cells." Lab on a Chip 8, no. 7 (2008): 1110. http://dx.doi.org/10.1039/b802941e.

Full text

APA, Harvard, Vancouver, ISO, and other styles

42

Sakai, Tadamoto. "Encapsulation process for electronic devices using injection molding method." Advances in Polymer Technology 12, no. 1 (1993): 61–71. http://dx.doi.org/10.1002/adv.1993.060120106.

Full text

APA, Harvard, Vancouver, ISO, and other styles

43

Lacík, Igor. "Polymer Chemistry in Diabetes Treatment by Encapsulated Islets of Langerhans: Review to 2006." Australian Journal of Chemistry 59, no. 8 (2006): 508. http://dx.doi.org/10.1071/ch06197.

Full text

Abstract:

Polymeric materials have been successfully used in numerous medical applications because of their diverse properties. For example, development of a bioartificial pancreas remains a challenge for polymer chemistry. Polymers, as a form of various encapsulation device, have been proposed for designing the semipermeable membrane capable of long-term immunoprotection of transplanted islets of Langerhans, which regulate the blood glucose level in a diabetic patient. This review describes the current situation in the field, discussing aspects of material selection, encapsulation devices, and encapsulation protocols. Problems and unanswered questions are emphasized to illustrate why clinical therapies with encapsulated islets have not been realized, despite intense activity over the past 15 years. The review was prepared with the goal to address professionals in the field as well as the broad polymer community to help in overcoming final barriers to the clinical phase for transplantation of islets of Langerhans encapsulated in a polymeric membrane.

APA, Harvard, Vancouver, ISO, and other styles

44

Wong, Man Kwong, Qi Dong, Fangzhou Liu, Aleksandra B. Djurišić, Wai Kin Chan, Hangkong Li, Kaimin Shih, Annie Ng, and Charles Surya. "Encapsulated perovskite based photovoltaics devices with high stability." MRS Advances 1, no. 47 (2016): 3191–98. http://dx.doi.org/10.1557/adv.2016.285.

Full text

Abstract:

ABSTRACTPerovskite based photovoltaics have recently emerged as the forerunner in the next generation photovoltaic technology because of the rapid increase of power conversion efficiency (PCE). However, it is well recognized that the exposure to moisture, heat and light causes the degradation of perovskite [1] (especially for methylammonium lead iodide (CH3NH3PbI3) which is the most commonly used perovskite material). It makes stability a main issue for the commercialization of perovskite based photovoltaics. Hence, an advanced encapsulation method is one of the keys to improve the stability. Here we present a comparison study between different encapsulation methods. Perovskite based photovoltaics devices were encapsulated using UV epoxy resin, with or without the addition of desiccant and the deposition of SiO2 layer. By minimizing the ingress of moisture and oxygen, devices with storage in ambient air under one sun continuous illumination could retain 94 % of the initial performance (PCE around 13%) after two days.

APA, Harvard, Vancouver, ISO, and other styles

45

Kim, Shin Young, Bong Jun Kim, Do Heung Kim, and Sung Gap Im. "A monolithic integration of robust, water-/oil-repellent layer onto multilayer encapsulation films for organic electronic devices." RSC Advances 5, no. 84 (2015): 68485–92. http://dx.doi.org/10.1039/c5ra10425d.

Full text

APA, Harvard, Vancouver, ISO, and other styles

46

Persano, Anna, Fabio Quaranta, Antonietta Taurino, Pietro Aleardo Siciliano, and Jacopo Iannacci. "Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems." Sensors 20, no. 7 (April 10, 2020): 2133. http://dx.doi.org/10.3390/s20072133.

Full text

Abstract:

In this work, SiNx/a-Si/SiNx caps on conductive coplanar waveguides (CPWs) are proposed for thin film encapsulation of radio-frequency microelectromechanical systems (RF MEMS), in view of the application of these devices in fifth generation (5G) and modern telecommunication systems. Simplification and cost reduction of the fabrication process were obtained, using two etching processes in the same barrel chamber to create a matrix of holes through the capping layer and to remove the sacrificial layer under the cap. Encapsulating layers with etch holes of different size and density were fabricated to evaluate the removal of the sacrificial layer as a function of the percentage of the cap perforated area. Barrel etching process parameters also varied. Finally, a full three-dimensional finite element method-based simulation model was developed to predict the impact of fabricated thin film encapsulating caps on RF performance of CPWs.

APA, Harvard, Vancouver, ISO, and other styles

47

Lee, Harrison Ka Hin, Andrew M. Telford, Jason A. Röhr, Mark F. Wyatt, Beth Rice, Jiaying Wu, Alexandre de Castro Maciel, et al. "The role of fullerenes in the environmental stability of polymer:fullerene solar cells." Energy & Environmental Science 11, no. 2 (2018): 417–28. http://dx.doi.org/10.1039/c7ee02983g.

Full text

APA, Harvard, Vancouver, ISO, and other styles

48

Skrzypek, Katarzyna, Yazmin Brito Barrera, Thomas Groth, and Dimitrios Stamatialis. "Endothelial and beta cell composite aggregates for improved function of a bioartificial pancreas encapsulation device." International Journal of Artificial Organs 41, no. 3 (February 20, 2018): 152–59. http://dx.doi.org/10.1177/0391398817752295.

Full text

Abstract:

Introduction: Encapsulation of pancreatic islets or beta cells is a promising strategy for treatment of type 1 diabetes by providing an immune isolated environment and allowing for transplantation in a different location than the liver. However, islets used for encapsulation often show lower functionality due to the damaging of islet endothelial cells during the isolation procedure. Factors produced by endothelial cells have great impact on beta cell insulin secretion. Therefore, mutual signaling between endothelial cells and beta cells should be considered for the development of encapsulation systems to achieve high insulin secretion and maintain beta cell viability. Here, we investigate whether co-culture of beta cells with endothelial cells could improve beta cell function within encapsulation devices. Materials and methods: Mouse insulinoma MIN6 cells and human umbilical vein endothelial cells were used for creating composite aggregates on agarose microwell platform. The composite aggregates were encapsulated within flat poly(ether sulfone)/polyvinylpyrrolidone device. Their functionality was assessed by glucose-induced insulin secretion test and compared to non-encapsulated free-floating aggregates. Results: We created composite aggregates of 80–100 µm in diameter, closely mimicking pancreatic islets. Upon glucose stimulation, their insulin secretion is improved in comparison to aggregates consisting of only MIN6 cells. Moreover, the composite aggregates encapsulated within a device secrete more insulin than aggregates consisting of only MIN6 cells. Conclusion: Composite aggregates of MIN6 cells with human umbilical vein endothelial cells have improved insulin secretion in comparison to MIN6 aggregates showing that the interaction of beta cell and endothelial cell is crucial for a functional encapsulation system.

APA, Harvard, Vancouver, ISO, and other styles

49

Wu, Fang, Xiao-Jie Ju, Xiao-Heng He, Ming-Yue Jiang, Wei Wang, Zhuang Liu, Rui Xie, Bin He, and Liang-Yin Chu. "A novel synthetic microfiber with controllable size for cell encapsulation and culture." Journal of Materials Chemistry B 4, no. 14 (2016): 2455–65. http://dx.doi.org/10.1039/c6tb00209a.

Full text

APA, Harvard, Vancouver, ISO, and other styles

50

Saint-Patrice, D., J. L. Pornin, B. Savornin, G. Rodriguez, S. Danthon, P. L. Charvet, P. Nicolas, S. Nicolas, and S. Fanget. "Thin Film Packaging for Vacuum MEMS Encapsulation: A Study on Outgassing Phenomenon." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 002428–82. http://dx.doi.org/10.4071/2012dpc-tha31.

Full text

Abstract:

Most of the time, MEMS devices require hermetic encapsulation for protection against atmosphere, moisture, particles and standard back-end manufacturing technologies. In the last few years, Wafer Level Packaging (WLP) is moving toward developments on Thin Film Packaging (TFP) in order to save footprint, to reduce chip thickness and packaging costs. In the specific case of high-vacuum MEMS encapsulation (gyro, compass), long term pressure stability is required. As the final performances of these kinds of devices are strongly dependent on the working pressure, using TFP for MEMS encapsulation with controlled vacuum becomes more challenging due to very small cavity volumes. It is then necessary to understand the outgassing phenomenon that take place during TFP encapsulation in order to reduce it. In this paper, our latest developments on thin film packaging technology are presented. Outgassing from materials used in TFP and MEMS devices become key parameters to decrease the pressure inside the package and to improve the reliability. In a first part, pressure and Residual Gas Analysis (RGA) of typical TFP and typical MEMS materials are measured under different time / temperature baking processes. Measurements show that material outgassing mainly comes from H2 and maximum pick appears in the beginning of the thermal process. Thanks to these characterizations, an optimized outgassing baking process in term of time and thermal budget is presented. By minimizing the internal outgassing, materials deposited by PVD sputtering can now be implemented as sealing materials for low pressure MEMS devices. In a second part, specific low temperature Al based materials which has been developed on equipment fully compatible with front-end fab is presented. Multi-layer materials like Ti / Al based materials are compared to our single Al based material to decrease the microstructure size and to improve the sealing performances. Scanning Electronic Microscopy (SEM) and Focused Ion Beam (FIB) cross section characterizations confirm that the grain sizes are highly impacted by sputtering process parameters and a compromise has to be done with MEMS outgassing. Finally, the most suitable outgassing baking process for the inside cavity materials and various Al-based sealing materials and stacks are performed for a MEMS compass device on 200 mm wafers. Pressure inside the cavity less than 10 mbar is obtained and the TFP yield is presented on each process conditions. These results are very promising and showed the capabilities of TFP for vacuum MEMS encapsulation applications despite very small volume cavity. Development of such technology is still under way in order to reach high vacuum level in the range of 10-1 to 10-3 mbar.

APA, Harvard, Vancouver, ISO, and other styles

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!