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Journal articles on the topic 'Encapsulants'

Author: Grafiati

Published: 28 June 2021

Last updated: 6 February 2022

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1

Liu, Mary, and Wusheng Yin. "A First Individual Solder Joint Encapsulant Adhesive." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000766–70. http://dx.doi.org/10.4071/isom-2010-wp6-posters-mliu.

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In order to meet the demand of fine pitch and 3D package, and eliminate complex underfilling process, a first solder joint encapsulant has been invented. Solder joint encapsulant adhesive is to encapsulate each individual solder joint using polymer to enhance solder joint, and leave empty space in-between solder joints to avoid thermal stress applied onto solder joints. Now two kinds of solder joint encapsulants are SMT256 and SMT266, which have been used in the customer field. Using solder joint encapsulants – SMT256 and SMT266, the pull strength of solder joint has been increased by about five times, resulting in significant increase in the reliability. In this paper more details have been investigated.

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2

Suhir, E., and J. M. Segelken. "Mechanical Behavior of Flip-Chip Encapsulants." Journal of Electronic Packaging 112, no. 4 (December 1, 1990): 327–32. http://dx.doi.org/10.1115/1.2904385.

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Requirements for the mechanical properties of the encapsulation material in a flip-chip design to prevent the solder and the encapsulation material itself from failure are presented on the basis of the developed analytical stress models, enabling one to predict the stresses caused by the expansion (contraction) mismatch of these materials. We evaluate and discuss the mechanical behavior of encapsulants for two encapsulation technologies: 1) encapsulant fills in the entire underchip space (silicone gels, epoxies); 2) encapsulant conformably coats the underchip surfaces (polyxylylene, polyimide). The calculations are carried out for an Advanced VLSI Package Design. The calculated data have indicated that low modulus silicone gel results in the lowest stresses. Polyxylylene should be considered as the second preference. Polyimide is also acceptable. Epoxies, however, could result in significant stresses in solder joints and therefore are less attractive. The final selection of the most feasible encapsulant should be done, of course, with consideration of all the electrical, chemical, and technological requirements.

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3

Winsley, R. J., N. R. Smart, and C. Padovani. "Experimental study to evaluate the effect of polymeric encapsulants on the corrosion resistance of intermediate-level radioactive waste packages." Mineralogical Magazine 76, no. 8 (December 2012): 2957–67. http://dx.doi.org/10.1180/minmag.2012.076.8.11.

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AbstractIntermediate-level radioactive waste is normally encapsulated in cementitious grout. However, for some wastes, grout may not be suitable and polymeric encapsulants are being considered as an alternative. One concern with such encapsulants is their long-term chemical stability and the possibility that release of aggressive degradation products could cause corrosion.This paper evaluates the potential for three polymeric encapsulants: two epoxy resins (the APS polymer system, (APS) and Alchemix 4760 (ALC)) and a vinyl-ester styrene (VES); to cause internal corrosion of stainless steel waste containers. The corrosion behaviour of stainless steel 316L in contact with each encapsulant was studied in saturated Ca(OH)2 solutions and deionized (DI) water, at 80°C, under non-irradiated and γ-irradiated conditions.In aerated, alkaline conditions, 316L was resistant to corrosion in all the conditions tested. However, in DI water, the pH fell to values as low as three due to release of acidic species from the polymers. The two epoxy materials (particularly APS) also released significant levels of chloride; VES did not. Chloride release appeared to be increased by γ-irradiation. As a result of the low pH chloride-containing environment created by the APS encapsulant, 316L experienced localized corrosion, whereas coupons in Alchemix 4760 and VES did not. Weight loss measurements correlated with visual observations. γ-irradiation appeared to increase the degree of corrosion.

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4

Mead, Patricia F., Aravind Ramamoorthy, Shapna Pal, Z. Fathi, and I. Ahmad. "Variable Frequency Microwave Processing of Underfill Encapsulants for Flip-Chip Applications." Journal of Electronic Packaging 125, no. 2 (June 1, 2003): 302–7. http://dx.doi.org/10.1115/1.1571077.

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This paper discusses an innovative technique for rapid cure of polymeric encapsulants such as underfills used in direct chip attach devices using variable frequency microwaves (VFM). VFM processing reduces the cure time for underfill encapsulants to 10 min or less, as compared to 30 or more minutes when using convection oven methods. We report here the results of our investigations measuring key material attributes of VFM and conventionally cured underfill encapsulant samples, and we also have characterized voiding and delamination characteristics of flip-chip with underfill test structures. Finally, particle settling in the flip-chip with underfill test structures has been characterized. Our results show that the VFM technique produces underfill attributes that are comparable to conventionally cured samples.

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5

Pudziuvelyte, Lauryna, Mindaugas Marksa, Katarzyna Sosnowska, Katarzyna Winnicka, Ramune Morkuniene, and Jurga Bernatoniene. "Freeze-Drying Technique for Microencapsulation of Elsholtzia ciliata Ethanolic Extract Using Different Coating Materials." Molecules 25, no. 9 (May 9, 2020): 2237. http://dx.doi.org/10.3390/molecules25092237.

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The present study reports on the encapsulation of Elsholtzia ciliata ethanolic extract by freeze-drying method using skim milk, sodium caseinate, gum Arabic, maltodextrin, beta-maltodextrin, and resistant-maltodextrin alone or in mixtures of two or four encapsulants. The encapsulation ability of the final mixtures was evaluated based on their microencapsulating efficiency (EE) of total phenolic compounds (TPC) and the physicochemical properties of freeze-dried powders. Results showed that the freeze-dried powders produced using two encapsulants have a lower moisture content, but higher solubility, Carr index, and Hausner ratio than freeze-dried powders produced using only one encapsulant in the formulation. The microencapsulating efficiency of TPC also varied depending on encapsulants used. The lowest EE% of TPC was determined with maltodextrin (21.17%), and the highest with sodium caseinate (83.02%). Scanning electron microscopy revealed that freeze-drying resulted in the formation of different size, irregular shape glassy particles. This study demonstrated good mucoadhesive properties of freeze-dried powders, which could be incorporated in buccal or oral delivery dosage forms. In conclusion, the microencapsulation of E. ciliata ethanolic extract by freeze-drying is an effective method to produce new value-added pharmaceutical or food formulations with polyphenols.

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6

Aditya, Samapta Manggala, Luh Putu Wrasiati, and Sri Mulyani. "Karakteristrik Enkapsulat Pewarna dari Ekstrak Daun Pepaya (Carica papaya L.) pada Perlakuan Perbandingan Gelatin dan Maltodekstrin." JURNAL REKAYASA DAN MANAJEMEN AGROINDUSTRI 9, no. 1 (March 26, 2021): 42. http://dx.doi.org/10.24843/jrma.2021.v09.i01.p05.

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Papaya leaves can be used as a green dye because it contains chlorophyll. Chlorophyll compounds as a green coloring are obtained by extraction and stored in the form of encapsulation powder. This study has two purposes, (i) to know the effect of the gelatin and maltodextrin encapsulants ratio on the encapsulates characteristics of papaya leaf coloring extract, and (ii) to determine the encapsulates comparison treatment of the best gelatin and maltodextrin in producing the characteristic encapsulate extract of papaya leaf coloring. Experiments in this study were using a randomized block design with one treatment, namely the ratio of gelatin and maltodextrin consisting of 7 levels, namely, (1:0), (0:1) (1:1), (1:1.5), (1:2), (1:2.5), (1:3). The results showed that the ratio of gelatin-maltodextrin was highly significant (P<0.05) on yield, total chlorophyll content, solubility, brightness level, redness level (a*), yellowish level (b*) and no effect (P>0.05) on water content. The treatment of gelatin and maltodextrin (1:3) ratio was the best treatment to produce encapsulate sea lettuce extract with yield of 35.27 %, water content of 6.13%, total chlorophyll content of 1192.69 ppm, solubility of 79.12%, brightness level (L*) 39.39, redness level (a*) 16.95 and yellowish level (b*) 14.84. Keywords : papaya leaf extract, gelatin, maltodextrin, encapsulation

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7

M., J. M. "Globules rouges encapsulants contre cancers." Revue Francophone des Laboratoires 2013, no. 455 (September 2013): 20. http://dx.doi.org/10.1016/s1773-035x(13)72169-5.

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8

BENG, GOH TEIK. "UV-curable Encapsulants for LED." Oriental Journal Of Chemistry 28, no. 3 (September 18, 2012): 1135–40. http://dx.doi.org/10.13005/ojc/280307.

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9

Rice, Matthew. "Plasticizer loading in acoustic encapsulants." Journal of Thermal Analysis and Calorimetry 117, no. 2 (April 27, 2014): 661–64. http://dx.doi.org/10.1007/s10973-014-3781-8.

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10

Baikerikar, K. K., and A. B. Scranton. "Photopolymerizable liquid encapsulants for microelectronic devices." Polymer 42, no. 2 (January 2001): 431–41. http://dx.doi.org/10.1016/s0032-3861(00)00388-8.

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11

Suryanarayana, D., T. Y. Wu, and J. A. Varcoe. "Encapsulants used in flip-chip packages." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 16, no. 8 (1993): 858–62. http://dx.doi.org/10.1109/33.273685.

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12

Procter, P., and J. Solc. "Improved thermal conductivity in microelectronic encapsulants." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 14, no. 4 (1991): 708–13. http://dx.doi.org/10.1109/33.105121.

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13

Ho, Tzong-Hann, and Chun-Shan Wang. "Low-stress encapsulants by vinylsiloxane modification." Journal of Applied Polymer Science 51, no. 12 (March 21, 1994): 2047–55. http://dx.doi.org/10.1002/app.1994.070511210.

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14

Bao, Yan, Yan Yan, Jianzhong Ma, Wenbo Zhang, and Yan Zong. "ZnO encapsulants: Design and new view." Advances in Colloid and Interface Science 283 (September 2020): 102238. http://dx.doi.org/10.1016/j.cis.2020.102238.

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15

Kim, Wan-Ho, Dai-Hyoung Koo, Ju-Hyun Noh, Kyung-Won Lee, Sie-Wook Jeon, Jae-Pil Kim, and In-Seon Yeo. "Optical Properties of UV LEDs depending on Encapsulate Method using Silicone Encapsulants with Different Refractive Indices." Journal of the Korean Institute of Illuminating and Electrical Installation Engineers 29, no. 3 (March 31, 2015): 39–44. http://dx.doi.org/10.5207/jieie.2015.29.3.039.

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16

Tracy, Jared, Nick Bosco, Chris Delgado, and Reinhold Dauskardt. "Durability of ionomer encapsulants in photovoltaic modules." Solar Energy Materials and Solar Cells 208 (May 2020): 110397. http://dx.doi.org/10.1016/j.solmat.2020.110397.

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17

Wong, C. P. "An Overview of Integrated Circuit Device Encapsulants." Journal of Electronic Packaging 111, no. 2 (June 1, 1989): 97–107. http://dx.doi.org/10.1115/1.3226528.

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The rapid development of integrated circuit technology from small-scale integration (SSI) to very large scale integration (VLSI) has had great technological and economical impact on the electronics industry. The exponential growth of the number of components per IC chip, the exponential decrease of device dimensions, and the steady increase in IC chip size have imposed stringent requirements, not only on the IC physical design and fabrication, but also on IC encapsulants. This report addresses the purpose of encapsulation, encapsulation techniques, and a general overview of the application of inorganic and organic polymer materials as electronic device encapsulants.

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18

Cognard, J. "ASE 85. Adhesives, sealants and encapsulants conference." International Journal of Adhesion and Adhesives 6, no. 1 (January 1986): 45–46. http://dx.doi.org/10.1016/0143-7496(86)90072-2.

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19

Kuwata, K., K. Iko, and H. Tabata. "Low-Stress Resin Encapsulants for Semiconductor Devices." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 8, no. 4 (December 1985): 486–89. http://dx.doi.org/10.1109/tchmt.1985.1136527.

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20

Valavan, Ashwini, Komolafe, Harris, and Beeby. "Encapsulation Process and Materials Evaluation for E-Textile Gas Sensor." Proceedings 32, no. 1 (December 4, 2019): 8. http://dx.doi.org/10.3390/proceedings2019032008.

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The degree of pollution in the environment increases because of the vehicular emissions such as carbon monoxide (CO) and nitrogen dioxide (NO2) gases. To minimize the exposure levels, it is necessary for individuals to be able to determine for themselves the pollution levels of the environments they are in so that they can take the necessary precautions. Textile-based gas sensors are an emerging solution and this paper furthers the concept by investigating a novel method for encapsulating gas sensors in textiles. While encapsulation is required to improve the durability and lifetime of the sensors, it essential for their operation that the encapsulants do not reduce the sensitivity of the gas sensor. This paper investigates the selectivity of two different flexible and breathable thermoplastic encapsulants (Platilon®U and Zitex G-104) for sensing carbon monoxide by observing the sensor response with and without the encapsulants. Results show that while the encapsulants both enable the sensor to still function, Platilon®U reduces the sensor sensitivity, whereas Zitex G-104 has very little effect.

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21

Dawson, J., V. Smith, J. Clifford, and S. J. Williams. "Initial studies on the effects of radiation, thermal ageing and aqueous environments on the stability and structure of candidate polymeric encapsulant materials." Mineralogical Magazine 76, no. 8 (December 2012): 2985–94. http://dx.doi.org/10.1180/minmag.2012.076.8.14.

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AbstractThe current route in the UK for the conditioning and immobilization of most intermediate level waste for interim storage and geological disposal is to encapsulate in a cementitious matrix. However, certain waste materials, such as those containing reactive metals (e.g. uranium and aluminium), can corrode in the presence of the highly alkaline water in a cementitious environment. In their initial, undegraded form, polymeric materials can provide the appropriate, unreactive environment needed for the encapsulation of chemically active metals.This study examines the effects of gamma radiation on the stability of six candidate polymeric encapsulants, including a vinyl ester styrene resin (VES) and five epoxy resin formulations. The polymeric encapsulants were exposed to radiation doses up to 10 MGy using AMEC's cobalt-60 gamma irradiation facility and their radiation and chemical stability characterized by the use of a number of analytical techniques. These included flexural and compressive testing, Fourier transform infrared spectroscopy (FTIR), gel fraction, leach testing and gas evolution. The results show that the most stable resin in terms of radiation resistance and chemical stability was VES. Most of the epoxy resin materials also showed good generic stability, but the FTIR analysis showed the potential for dose-rate effects in one formulation.

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22

Einsla, Melinda L., Cheryl I. Teich, Michael T. Bender, Jill A. Ottinger, Catheryn L. Jackson, Kenneth B. Laughlin, and Edward C. Greer. "Acrylic/urethane hybrid liquid encapsulants for photovoltaic modules." Solar Energy Materials and Solar Cells 165 (June 2017): 103–10. http://dx.doi.org/10.1016/j.solmat.2017.02.034.

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23

Vincent, M. B., and C. P. Wong. "Enhancement of underfill encapsulants for flip‐chip technology." Soldering & Surface Mount Technology 11, no. 3 (December 1999): 33–39. http://dx.doi.org/10.1108/09540919910293856.

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24

Ervin, M. H., K. A. Jones, M. A. Derenge, K. W. Kirchnef, M. C. Wood, P. B. Shah, R. D. Vispute, T. Venkatesan, C. Thomas, and M. G. Spencer. "An SEM Investigation of Annealing Encapsulants for SiC." Microscopy and Microanalysis 6, S2 (August 2000): 1094–95. http://dx.doi.org/10.1017/s143192760003796x.

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Advancing technology continues to place greater and greater demands on semiconductor devices. It is clear that Si technology alone will not be able to meet all of these demands. Silicon Carbide (SiC) is a promising material for highpower and high-temperature applications, such as SiC devices for controlling power in a more electric vehicle in which the SiC device is cooled by the engine oil (200 C.) SiC is well suited for high-power/temperature applications due to its large bandgap of 3.03 eV (for 6H), high breakdown electric field of 2.4 x 106 V/cm (again for 6H), thermal stability, and chemical inertness. These properties hold the promise of reliable and robust performance, but the latter two also present challenges to fabricating such devices. For instance, a key part of making devices involves selected area doping. This is typically accomplished with ion implantation, because the rate of diffusion is so low, followed with an anneal to remove the implant damage and electrically activate the dopant.

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25

Molarius, J. M., E. Kolawa, K. Morishita, M. ‐A Nicolet, J. L. Tandon, J. A. Leavitt, and L. C. McIntyre. "Tantalum‐Based Encapsulants For Thermal Annealing of GaAs." Journal of The Electrochemical Society 138, no. 3 (March 1, 1991): 834–37. http://dx.doi.org/10.1149/1.2085686.

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26

Lantz, L., and M. G. Pecht. "Ion transport in encapsulants used in microcircuit packaging." IEEE Transactions on Components and Packaging Technologies 26, no. 1 (March 2003): 199–205. http://dx.doi.org/10.1109/tcapt.2002.806183.

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27

Fay, Paul A. "The third adhesives, surface coatings and encapsulants conference." International Journal of Adhesion and Adhesives 9, no. 1 (January 1989): 47–49. http://dx.doi.org/10.1016/0143-7496(89)90146-2.

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28

Vifta, Rissa Laila, and Fania Putri Luhurningtyas. "Nanoparticle from Medinilla speciosa with Various of Encapsulating Agent and Their Antioxidant Activities Using Ferric Reducing Assay." Indonesian Journal of Cancer Chemoprevention 11, no. 1 (March 6, 2020): 22. http://dx.doi.org/10.14499/indonesianjcanchemoprev11iss1pp22-29.

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Antioxidants are agents that can reduce free radicals. Parijoto fruit (Medinilla speciosa) contains flavonoids that could act as an antioxidant. However, those flavonoids are water-soluble and show low bioavailability. Nanotechnology is a potential approach to improve the bioavailability of flavonoids from Parijoto fruit. This study was conducted to determine the antioxidant activity of parijoto nanoparticles with variations of the chitosan, alginate, and chitosan/alginate encapsulants. Secondary metabolites of parijoto fruit were using the maceration method. The synthesis of parijoto nanoparticles was conducted using the ionic gelation method with chitosan, alginate, and chitosan/alginate encapsulation. Parijoto nanoparticle size and distribution were characterized using Particle Size Analyzer (PSA). The formation of nanoparticles in colloids was determined as a percent. The antioxidant activity of nanoparticle was evaluated using Ferric Reducing Antioxidant Power (FRAP) method using a UV-Vis spectrophotometer. Chitosan encapsulation produced nanoparticles with a size of 269.3 nm, pdI 0.372 and transmittance 99.379%. Alginate encapsulation produced a particle size of 366.4 nm, pdI 0.589 and transmittance 99.690%. The combination of chitosan/alginate encapsulants produced a particle size of 187.00 nm, pdI 0.239 and transmittance 99.894%. Parijoto nanoparticles obtained from chitosan, alginate, and chitosan/alginate encapsulant showed strong antioxidant powers indicated by IC50 values 2.442±0.047 ppm, 3.175±0.169 ppm and 2.115±0.045 ppm, respectively. Altogether, our study shows that parijoto nanoparticles are potent as antioxidant agents.Keywords: Alginate, antioxidant, chitosan, FRAP, Medinilla speciosa, nanoparticle

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29

Greenlee, Jordan D., Travis J. Anderson, Boris N. Feigelson, Jennifer K. Hite, Konrad M. Bussmann, Charles R. Eddy, Karl D. Hobart, and Francis J. Kub. "Comparison of AlN encapsulants for high-temperature GaN annealing." Applied Physics Express 7, no. 12 (November 28, 2014): 121003. http://dx.doi.org/10.7567/apex.7.121003.

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30

Braun, T., K. F. Becker, M. Koch, V. Bader, R. Aschenbrenner, and H. Reichl. "Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications." Microelectronics Reliability 45, no. 9-11 (September 2005): 1672–75. http://dx.doi.org/10.1016/j.microrel.2005.07.075.

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31

Hillman, C., B. Castillo, and M. Pecht. "Diffusion and absorption of corrosive gases in electronic encapsulants." Microelectronics Reliability 43, no. 4 (April 2003): 635–43. http://dx.doi.org/10.1016/s0026-2714(02)00315-3.

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32

Wang, L., and C. P. Wong. "Novel thermally reworkable underfill encapsulants for flip-chip applications." IEEE Transactions on Advanced Packaging 22, no. 1 (1999): 46–53. http://dx.doi.org/10.1109/6040.746542.

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33

Augustin, Mary Ann, Luz Sanguansri, and Ortwin Bode. "Maillard Reaction Products as Encapsulants for Fish Oil Powders." Journal of Food Science 71, no. 2 (May 31, 2006): E25—E32. http://dx.doi.org/10.1111/j.1365-2621.2006.tb08893.x.

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34

OKUMURA, Koichi, and Hisashi MAESHIMA. "Recent Improvement in the Epoxy Resins for LED Encapsulants." Journal of The Adhesion Society of Japan 46, no. 11 (2010): 401–5. http://dx.doi.org/10.11618/adhesion.46.401.

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35

Anderson, J., V. Markovac, and P. Troyk. "Polymer Encapsulants for Microelectronics: Mechanisms for Protection and Failure." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 11, no. 1 (March 1988): 152–58. http://dx.doi.org/10.1109/tchmt.1988.1134893.

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36

Deutscher, N. F., R. J. Roedel, L. McIntyre, and J. Leavitt. "Ion implantation into (Hg,Cd)Te through dielectric encapsulants." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 8, no. 2 (March 1990): 1143–46. http://dx.doi.org/10.1116/1.576976.

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Anderson, J. E., V. Markovac, and P. R. Troyk. "Polymer encapsulants for microelectronics: mechanisms for protection and failure." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 11, no. 1 (March 1988): 152–58. http://dx.doi.org/10.1109/33.2979.

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38

Kempe, Michael D., David C. Miller, John H. Wohlgemuth, Sarah R. Kurtz, John M. Moseley, Qurat A. Shah, Govindasamy Tamizhmani, et al. "Field testing of thermoplastic encapsulants in high-temperature installations." Energy Science & Engineering 3, no. 6 (November 2015): 565–80. http://dx.doi.org/10.1002/ese3.104.

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39

Park, Juwoon, Sang Seok Lee, Young Hoon Sohn, Shin-Hyun Kim, and Yutaek Seo. "Hydrate formation in water-laden microcapsules for temperature-sensitive release of encapsulants." RSC Advances 6, no. 88 (2016): 85012–18. http://dx.doi.org/10.1039/c6ra19786h.

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40

Li, Heng-Yu, Ricardo Théron, Gregory Röder, Ted Turlings, Yun Luo, Ronald F. M. Lange, Christophe Ballif, and Laure-Emmanuelle Perret-Aebi. "Insights into the Encapsulation Process of Photovoltaic Modules: GC-MS Analysis on the Curing Step of Poly(ethylene-co-vinyl acetate) (EVA) Encapsulant." Polymers and Polymer Composites 20, no. 8 (October 2012): 665–72. http://dx.doi.org/10.1177/096739111202000801.

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Appropriate encapsulation schemes are essential in protecting the active components of the photovoltaic (PV) module against weathering and to ensure long term reliability. For crystalline cells, poly(ethylene- co-vinyl acetate) (EVA) is the most commonly used PV encapsulant. Additives like peroxides and silanes are formulated in EVA encapsulants to obtain the desired properties, e.g. the desired gel content value and sufficient adhesion after the encapsulation process etc. The identification and control of volatile organic compounds (VOCs) released by the polymeric encapsulant during PV module encapsulation is important for understanding and optimizing processes in order to enhance the encapsulation quality of the manufactured modules. The authors demonstrate how gas chromatography and mass spectrometry (GC-MS) techniques can be used to help understand the curing process, mainly by identifying the VOCs emanating from EVA under the effect of temperature and pressure. The results provide chemical insights into the EVA encapsulation process, which are valuable for further optimization of the PV module manufacturing process and evaluation of its environmental impact.

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41

Kopanati, Gayathri N., Sindhu Seethamraju, Praveen C. Ramamurthy, and Giridhar Madras. "A Surlyn/magnesium oxide nanocomposite as an effective water vapor barrier for organic device encapsulation." RSC Advances 5, no. 41 (2015): 32580–87. http://dx.doi.org/10.1039/c5ra03356j.

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42

Wilson, Sophie, Raechel Laing, Eng Wui Tan, and Cheryl Wilson. "Encapsulation of Electrically Conductive Apparel Fabrics: Effects on Performance." Sensors 20, no. 15 (July 30, 2020): 4243. http://dx.doi.org/10.3390/s20154243.

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Electrically conductive fabrics are achieved by functionalizing with treatments such as graphene; however, these change conventional fabric properties and the treatments are typically not durable. Encapsulation may provide a solution for this, and the present work aims to address these challenges. Next-to-skin wool and cotton knit fabrics functionalized using graphene ink were encapsulated with three poly(dimethylsiloxane)-based products. Properties known to be critical in a next-to-skin application were investigated (fabric structure, moisture transfer, electrical conductivity, exposure to transient ambient conditions, wash, abrasion, and storage). Wool and cotton fabrics performed similarly. Electrical conductivity was conferred with the graphene treatment but decreased with encapsulation. Wetting and high humidity/low temperature resulted in an increase in electrical conductivity, while decreases in electrical conductivity were evident with wash, abrasion, and storage. Each encapsulant mitigated effects of exposures but these effects differed slightly. Moisture transfer changed with graphene and encapsulants. As key performance properties of the wool and cotton fabrics following treatment with graphene and an encapsulant differed from their initial state, use as a patch integrated as part of an upper body apparel item would be acceptable.

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43

Roussenova, Mina, Sam Townrow, Mathieu Murith, Job Ubbink, and M. Ashraf Alam. "Molecular Packing of Carbohydrate Oligomer Encapsulants - A Free Volume Perspective." Materials Science Forum 733 (November 2012): 96–99. http://dx.doi.org/10.4028/www.scientific.net/msf.733.96.

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Positron annihilation lifetime spectroscopy (PALS) is used in conjunction with dilatometry to analyse the effects of water and low molecular weight diluents (maltose and glycerol) on the molecular organisation and density of carbohydrate oligomers commonly used in the pharmaceutical and food industries for the formulation of encapsulation matrices. In the glassy state, both maltose and glycerol act as packing enhancers, causing a non-linear decrease in the average molecular hole size of the carbohydrate matrices. Water exists in a highly non-ideal state in these systems and it alters the molecular organisation of the matrices in a complex manner, whereby it can act either as an anti-plasticiser or a plasticiser, depending on the level of hydration.

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44

Hara, Kohjiro, Hiroto Ohwada, Tomoyoshi Furihata, and Atsushi Masuda. "Durable crystalline Si photovoltaic modules based on silicone-sheet encapsulants." Japanese Journal of Applied Physics 57, no. 2 (January 5, 2018): 027101. http://dx.doi.org/10.7567/jjap.57.027101.

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Cai, Can, David C. Miller, Ian A. Tappan, and Reinhold H. Dauskardt. "Framework for predicting the photodegradation of adhesion of silicone encapsulants." Solar Energy Materials and Solar Cells 191 (March 2019): 486–92. http://dx.doi.org/10.1016/j.solmat.2018.11.024.

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Alhashim, Hala H., Mohammed Zahed Mustafa Khan, Mohammed A. Majid, Tien K. Ng, and Boon S. Ooi. "InAs/GaAs quantum-dot intermixing: comparison of various dielectric encapsulants." Optical Engineering 54, no. 10 (October 16, 2015): 107107. http://dx.doi.org/10.1117/1.oe.54.10.107107.

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Lapointe, François, Ashish Sapkota, Jianfu Ding, and Jacques Lefebvre. "Polymer Encapsulants for Threshold Voltage Control in Carbon Nanotube Transistors." ACS Applied Materials & Interfaces 11, no. 39 (September 18, 2019): 36027–34. http://dx.doi.org/10.1021/acsami.9b09857.

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Stack, G. M., J. M. Miller, and E. Y. Chang. "Development of polyurethane encapsulants with improved resistance to seawater exposure." Journal of the Acoustical Society of America 83, S1 (May 1988): S82. http://dx.doi.org/10.1121/1.2025545.

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Yiying Yao, Guo-Quan Lu, Dushan Boroyevich, and Khai D. T. Ngo. "Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging." IEEE Transactions on Components, Packaging and Manufacturing Technology 5, no. 2 (February 2015): 168–81. http://dx.doi.org/10.1109/tcpmt.2014.2337300.

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Oreski, Gernot, Antonia Omazic, Gabriele Christine Eder, Yuliya Voronko, Lukas Neumaier, Wolfgang Mühleisen, Christina Hirschl, Gusztáv Ujvari, Rita Ebner, and Michaell Edler. "Properties and degradation behaviour of polyolefin encapsulants for photovoltaic modules." Progress in Photovoltaics: Research and Applications 28, no. 12 (August 21, 2020): 1277–88. http://dx.doi.org/10.1002/pip.3323.

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