Relevant bibliographies by topics / Embedding in a microsystem

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  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
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Academic literature on the topic 'Embedding in a microsystem'

Author: Grafiati
Published: 10 March 2023

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Journal articles on the topic "Embedding in a microsystem"

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Belfiore, Nicola Pio, Alvise Bagolini, Andrea Rossi, Gabriele Bocchetta, Federica Vurchio, Rocco Crescenzi, Andrea Scorza, Pierluigi Bellutti, and Salvatore Andrea Sciuto. "Design, Fabrication, Testing and Simulation of a Rotary Double Comb Drives Actuated Microgripper." Micromachines 12, no. 10 (October 17, 2021): 1263. http://dx.doi.org/10.3390/mi12101263.

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This paper presents the development of a new microgripper actuated by means of rotary-comb drives equipped with two cooperating fingers arrays. The microsystem presents eight CSFH flexures (Conjugate Surface Flexure Hinge) that allow the designer to assign a prescribed motion to the gripping tips. In fact, the adoption of multiple CSFHs gives rise to the possibility of embedding quite a complex mechanical structure and, therefore, increasing the number of design parameters. For the case under study, a double four-bar linkage in a mirroring configuration was adopted. The presented microgripper has been fabricated by using a hard metal mask on a Silicon-on-Insulator (SOI) wafer, subject to DRIE (Deep Reactive Ion Etching) process, with a vapor releasing final stage. Some prototypes have been obtained and then tested in a lab. Finally, the experimental results have been used in order to assess simulation tools that can be used to minimize the amount of expensive equipment in operational environments.
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Fries, David, Liesl Hotaling, Geran Barton, Stan Ivanov, Michelle Janowiak, and Matt Smith. "PCBMEMS as a Flexible Path to Devices and Systems across Spatial Scales." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, DPC (January 1, 2011): 000597–634. http://dx.doi.org/10.4071/2011dpc-ta24.

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PCB technology based on both rigid and flexible laminates is desirable for miniaturization of mobile devices and systems. The technology provides substantial flexibility in systems design. The ability to use flexible microsystems allows new sensing systems for mobile applications. Using this design, fabrication and construction approach allows lightweight, complex, and space efficient systems. Flex microsystems based on structurable, non-fiber filled laminates permits miniaturization to occur at two levels: at the micro scale with the embedding of microstructures in the substrate, and at the macro scale with the ability to flex the system across millimeter to centimeter lengths of real everyday objects. The macro scale systems further allows ultra large systems with high resolution features permitting novel sensor systems. Examples will be given where the technology has enabled devices, systems and packaging innovation across several spatial scales. Mobile (environmental, medical, portable, embedded) sensor systems all can be realized using this design and fabrication toolbox.
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Boehme, Christian, Andreas Ostmann, and Martin Schneider-Ramelow. "Modular Microsystems with Embedded Components." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000735–39. http://dx.doi.org/10.4071/isom-2013-wp52.

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Each system is designed to fulfill the desired purpose. It is defined by its inputs, outputs, structure, environment, boundary, and the including elements (subsystems). Due to the ongoing miniaturization and integration the complexity of subsystems increases continuously. This paper is intended to demonstrate the build-up of modular Microsystems. By using the embedding technology, each subsystem (module) is interchangeable and stackable. Therefore, the functionality of the entire system depends solely on the selected modules. Moreover, the enhancement, expansion or redesign can be accomplished by replacing existing or adding new modules. The communication between the individual modules is based on the standardized I2C bus. Additionally, a USB interface has been implemented to manage the data transmission between the embedded camera module and a computer. The whole system recognizes each module and performs accordingly. The user can access sensor values, watch the video stream, and change the parameters of each module via a Graphical User Interface (GUI) on his computer. To achieve the build-up of the modular Microsystems we only used packaged active and passive components. Depending on the complexity of each module a core of up to eight layers is build up. The components are then soldered onto both sides of the core. At this point the components are embedded using a laminating press. The afterwards even surface is then structured again, to enable the stacking of the modules. Each step of the entire assembly process is done via state of the art circuit board processing technologies, including laser drill and laser-direct imaging.
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Tolochko, N. K. "Application of Additive Technologies for Manufactoring Non-Electronic Components of Microsystems." Nano- i Mikrosistemnaya Tehnika 23, no. 4 (August 20, 2021): 193–200. http://dx.doi.org/10.17587/nmst.23.193-200.

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It is problematic to apply traditional microtechnologies for the manufacturing three-dimensional (3D) components of microsystems due to a number of inherent disadvantages. It is much more promising to use additive technologies for these purposes. In present paper various additive technologies used for manufacturing non-electronic components of microsystems as well as various non-electronic components manufactured using these technologies are considered. The peculiarities of the implementation of additive technologies in the manufacture of non-electronic microcomponents are discussed. More than 20 types of additive technologies characterized by different principles for the implementation of 3D printing processes are presented and their brief description is given. Most of these technologies allow manufacturing the components with micrometer feature sizes and some of them — with nanometer feature sizes. Microcomponents produced by additive technologies are intended for use in micromechanics, microoptics and microfluidics. Many examples of such microcomponents are given with indication of their typical feature sizes. Additive technologies make it possible to create both individual parts of microdevices and completely finished micro-devices. Microcomponents are mainly made from photopolymers and thermoplastics, as well as metals. Among additive technologies those that provide the multi-material 3D printing as well as the embedding of discrete components into printed microdevices are especially promising. It is expected that in near future additive technologies will be widely used in the production of various non-electronic components of microsystems.
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Fries, David, Geran Barton, Gary Hendricks, Brian Gregson, and Liesl Hotaling. "Rigid and Flex PCB Based Microsystems for Mobility, Systems Development and Harsh Environments." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 001054–95. http://dx.doi.org/10.4071/2012dpc-tp33.

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The exploration of PCBMEMS as a path towards systems development continues. PCBMEMS technology based on rigid-flexible laminates is desirable for miniaturization and integration of systems for mobility and harsh environment deployments. The technology provides substantial flexibility in systems design and integration of multiple functions into limited spaces. Using this design and construction approach allows lightweight, complex, and space efficient systems. Flex microsystems based on structurable, non-fiber filled laminates permits miniaturization to occur at two levels: at the micro scale with the embedding of microstructures in the substrate, and at the macro scale with the ability to flex the system across millimeter to centimeter lengths of real everyday systems. Examples will be given where the technology is being applied toward several different systems including mobile chemical analyzers, heat and mass transfer devices, portable therapeutics, augmented mobile phone systems, and high density microfluidics-based robotics.
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Selbmann, Franz, Frank Roscher, Frederic Gueth, Maik Wiemer, Harald Kuhn, and Yvonne Joseph. "A Parylene-Based Ultra-Thin Printed Circuit Board As a New Platform for Flexible Sensors and Wearables." ECS Meeting Abstracts MA2022-02, no. 63 (October 9, 2022): 2617. http://dx.doi.org/10.1149/ma2022-02632617mtgabs.

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Flexible electronics and sensors are a key enabling element for the realization of wearables and geometry adaptive devices needed to follow current trends such as the Internet of things or Industry 4.0. Within this paper, we present a new and flexible packaging platform by the fabrication of an ultra-thin and highly flexible printed circuit board (PCB). The thermoplastic polymer Parylene, which combines a variety of unique properties such as optical transparency, biostability and biocompatibility according to ISO 10993, thermal stability as well as low permeability for gases and water, was used as the base for the new PCB. Particularly, its mechanical properties, especially the absence of intrinsic stresses, as well as its low Young’s modulus and good bendability are advantageous when using Parylene films as a free-standing substrate for flexible applications. The chemical inertness of Parylene against all common acids, bases and solvents ensures its compatibility with established standard microsystem technologies. For the realization of ultra-thin flexible PCBs, Parylene was used as a substrate as well as for the encapsulation and protection layer, respectively. Furthermore, Parylene was the dielectric between the metallic conductive layers. These redistribution layers (RDL) were deposited and patterned by standard microsystem technologies, such as sputtering, lithography and wet chemical etching. Hence, structure sizes of down to 10 µm were successfully realized. Different metals, such as gold, copper, and aluminum were tested for the RDL. Alternatively, printing technologies such as screen printing and aerosol jet printing were successfully demonstrated for the if conductive silver layerse. The electrical connection between the various RDL was of special interest throughout the study and was realized by etching vertical vias through the Parylene using oxygen plasma. Due to the low total thickness of the flexible Parylene PCB of 20 µm or even less, the obtained vias through the Parylene feature an advantageous low aspect ratio. For the contact formation through the vias, different methods were investigated, e. g. sputtering, printing and electrochemical deposition. Finally, the fabricated flexible Parylene PCB were characterized with respect to their bendability and electrical properties. Doing so, the resistivity and capacitance were measured as well as the frequency response between 20 kHz and 500 MHz. Particularly, for frequencies below 1 MHz the realized flexible Parylene PCBs show a good electrical performance. A third function of Parylene with respect to the realization of an ultra-thin and flexible PCB is its usage as a barrier or capping layer. Doing so, new approaches such as embedding electronic or sensor components in the flexible PCB can be enabled. Other integration technologies such as wire bonding, printing or gluing were investigated with respect to their usability for the new flexible PCB as well. Besides, also the direct fabrication of sensors on the Parylene flexible PCB was successfully demonstrated by the realization of a flexible potentiometric pH sensor. The presented new type of ultra-thin PCB is a versatile platform for the realization of flexible electronics, sensors and devices. Due to its biocompatible properties, the flexible Parylene PCB can be used for medical applications but also for the integration of MEMS, chemical sensors and optical components, respectively. Doing so, it enables the realization of smart systems for wearable applications and their integration into light weight constructions. Within this paper, the concept of this new approach, the respected fabrication and integration technologies as well as possible applications are presented in detail. Figure 1
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Fries, David P., Stanislav Z. Ivanov, Heather Broadbent, Matthew Smith, George Steimle, and Ross Willoughby. "PCBMEMS as a Flexible Path to Devices and Systems across Spatial Scales." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (January 1, 2010): 000599–642. http://dx.doi.org/10.4071/2010dpc-ta23.

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PCBMEMS, within rigid or flexible laminates is desirable for miniaturization of devices and systems and provide substantial flexibility in systems design. PCBMEMS is the combined insertion of mechanical, fluidic, optical and electronic functions into the PCB landscape, which permits a complex system on a board. This design, fabrication and construction approach allows lightweight, complex, and space efficient systems. PCBMEMS permits miniaturization to occur at two levels: at the micro scale with the embedding of microstructures in the substrate, and at the macro scale with the ability to flex the system across millimeter to centimeter lengths of real everyday objects. Using this path PCBMEMS can approach the creativity and complexity of natural made systems. The use of PCBMEMS can also provide a path toward ultra large systems with high resolution features. With the ability to provide from the very small to the very large, PCBMEMS has a unique place in systems development in that the same processing pathway can enable Microsystems and macro systems. Examples will be given where the technology has enabled devices, systems and packaging innovation across several spatial scales. Environmental, medical, portable, embedded, and sensor systems all can be realized using this design and fabrication toolbox. The approach is affordable and can be used from prototyping to production and even in educational efforts.
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Korvink, Jan G., and Henry Baltes. "Microsystem Modeling." Sensors Update 2, no. 1 (October 1996): 181–209. http://dx.doi.org/10.1002/1616-8984(199610)2:1<181::aid-seup181>3.0.co;2-a.

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Schultze, J. W. "Electrochemical microsystem technologies." Electrochimica Acta 42, no. 20-22 (January 1997): 2981–82. http://dx.doi.org/10.1016/s0013-4686(97)00145-x.

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Habal, Mutaz B. "Commentary on Microsystem." Journal of Craniofacial Surgery 5, no. 2 (May 1994): 104. http://dx.doi.org/10.1097/00001665-199405000-00009.

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Dissertations / Theses on the topic "Embedding in a microsystem"

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Quelin, Aurélien. "Microstockage électrique pour microrobotique à énergie embarquée." Electronic Thesis or Diss., Compiègne, 2022. http://www.theses.fr/2022COMP2705.

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Une analyse des méthodes de conception des microrobots autonomes en énergie menée durant cette thèse met en évidence le fait que ces méthodes peuvent ne pas être optimales, et que les performances de ces microrobots pourraient être améliorées grâce à un dimensionnement conjoint de leur source d’énergie et de leur système de déplacement. Ces travaux de thèse ont donc cherché à répondre à la problématique suivante : « Y a-t-il un avantage à utiliser des modèles fins pour la conception d’un microrobot, et en particulier pour le dimensionnement conjoint de sa batterie et de son système de déplacement ? ». Pour répondre à cette problématique, nous avons étudié un microrobot autonome en énergie dont il est possible de dimensionner la batterie, de chimie lithium-ion et de format pile bouton, et le système de déplacement, basé sur le principe inertiel impact-drive mis en œuvre autour d’un actionneur électromagnétique. L’étude du dimensionnement conjoint de ces deux composants a été réalisée à l’aide de leurs modèles fins couplés, qui ont préalablement été validés expérimentalement durant la thèse. Nous avons ainsi montré, en utilisant ces modèles couplés, que le dimensionnement optimal du système dans son ensemble ne correspondait pas à la somme des dimensionnements optimaux des composants individuels, mais à un compromis difficile voire impossible à déterminer sans ces modèles couplés, à cause des interactions croisées des effets des paramètres de conception. Le microrobot étudié durant cette thèse a ainsi permis de démontrer l’intérêt de la méthode utilisée, et celle-ci pourrait être utilisée sur d’autres microsystèmes, en fonction de leurs caractéristiques
An analysis of the design methods of energy autonomous microrobots carried out during this thesis highlights the fact that these methods may not be optimal, and that the performance of these microrobots could be improved through a co-design of their energy source and their motion system. This thesis work therefore addressed the following question : « Is there an advantage to using fine models for the design of a microrobot, and in particular for co-design of its battery and its displacement system? ». To answer this question, we have studied an on-board power supplied microrobot for which it is possible to size the battery, of lithium-ion chemistry and coin cell format, and the displacement system, based on the impact-drive inertial principle implemented around an electromagnetic actuator. The study of the co-design of these two components has been carried out using their coupled fine models, which have been validated experimentally during the thesis. We have shown, using these coupled models, that the optimal sizing of the whole system does not correspond to the sum of the optimal sizings of the individual components, but to a compromise difficult or impossible to determine without these coupled models, because of the cross-interactions of the effects of the design parameters. The microrobot studied during thisthesis has thus demonstrated the interest of the method used, which could be used on other microsystems, depending on their characteristics
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Nguyen, Hugo. "Microsystem Interfaces for Space." Doctoral thesis, Uppsala : Acta Universitatis Upsaliensis : Universitetsbiblioteket [distributör], 2006. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-6954.

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Kratz, Henrik. "Integrated Communications and Thermal Management Systems for Microsystem-based Spacecraft : A Multifunctional Microsystem Approach." Doctoral thesis, Uppsala : Acta Universitatis Upsaliensis : Universitetsbiblioteket [distributör], 2006. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-6316.

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Rezaei, Masoud. "Multimodal implantable neural interfacing microsystem." Doctoral thesis, Université Laval, 2019. http://hdl.handle.net/20.500.11794/36437.

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Afin d’étudier le cerveau humain dans le but d’aider les patients souffrant de maladies neurologiques, on a besoin d’une interface cérébrale entièrement implantable pour permettre l’accès direct aux neurones et enregistrer et analyser l’activité neuronale. Dans cette thèse, des interfaces cerveau-machine implantables (IMC) à très faible puissance basées sur plusieurs circuits et innovations de systèmes ont été étudiées pour être utilisées comme analyseur neuronal. Un tel système est destiné à recueillir l’activité neuronale émise par centaines de neurones tout en les activant à la demande en utilisant des moyens d’actionnement tels que l’électro- et / ou la photo-stimulation. Un tel système doit fournir plusieurs canaux d’enregistrement, tout en consommant très peu d’énergie, et présente une taille extrêmement réduite pour la sécurité et la biocompatibilité. Typiquement, un microsystème d’interfaçage avec le cerveau comprend plusieurs blocs, tels qu’un bloc analogique d’acquisition (AFE), un convertisseur analogique-numérique (ADC), des modules de traitement de signal numérique et un émetteur-récepteur de données sans fil. Un IMC extrait les signaux neuronaux du bruit, les numérise et les transmet à une station de base sans interférer avec le comportement naturel du sujet. Cette thèse se concentre sur les blocs analogiques d’acquisition à très faible consommation à utiliser dans l’IMC. Cette thèse présente des frontaux avec plusieurs stratégies innovantes pour consommer moins d’énergie tout en permettant des données de haute résolution et de haute qualité. Premièrement, nous présentons une nouvelle structure frontale utilisant un schéma de réutilisation du courant. Cette structure est extensible à un très grand nombre de canaux d’enregistrement, grâce à sa petite taille de silicium et à sa faible consommation d’énergie. L’AFE à réutilisation de courant proposée, qui comprend un amplificateur à faible bruit (LNA) et un amplificateur à gain programmable (PGA), utilise une nouvelle topologie de miroir de courant entièrement différentielle utilisant moins de transistors et améliorant plusieurs paramètres de conception, tels que la consommation d’énergie et du bruit, par rapport aux mises en oeuvre de circuit d’amplificateur de réutilisation de courant précédentes. Ensuite, dans la deuxième partie de cette thèse, nous proposons un nouveau convertisseur sigmadelta multicanal qui convertit plusieurs canaux indépendamment en utilisant un seul amplificateur et plusieurs condensateurs de stockage de charge. Par rapport aux techniques conventionnelles, cette méthode applique un nouveau schéma de multiplexage entrelacé, qui ne nécessite aucune phase de réinitialisation pour l’intégrateur lors du passage à un nouveau canal, ce qui améliore sa résolution. Lorsque la taille des puces n’est pas une priorité, d’autres approches peuvent être plus attrayantes, et nous proposons une nouvelle stratégie d’économie d’énergie basée sur un nouveau convertisseur sigma-delta à très basse consommation conçu pour réduire la consommation d’énergie. Ce nouveau convertisseur utilise une architecture basse tension basée sur une topologie prédictive innovante qui minimise la non-linéarité associée à l’alimentation basse tension.
Studying brain functionality to help patients suffering from neurological diseases needs fully implantable brain interface to enable access to neural activities as well as read and analyze them. In this thesis, ultra-low power implantable brain-machine-interfaces (BMIs) that are based on several innovations on circuits and systems are studied for use in neural recording applications. Such a system is intended to collect information on neural activity emitted by several hundreds of neurons, while activating them on demand using actuating means like electro- and/or photo-stimulation. Such a system must provide several recording channels, while consuming very low energy, and have an extremely small size for safety and biocompatibility. Typically, a brain interfacing microsystem includes several building blocks, such as an analog front-end (AFE), an analog-to-digital converter (ADC), digital signal processing modules, and a wireless data transceiver. A BMI extracts neural signals from noise, digitizes them, and transmits them to a base station without interfering with the natural behavior of the subject. This thesis focuses on ultra-low power front-ends to be utilized in a BMI, and presents front-ends with several innovative strategies to consume less power, while enabling high-resolution and high-quality of data. First, we present a new front-end structure using a current-reuse scheme. This structure is scalable to huge numbers of recording channels, owing to its small implementation silicon area and its low power consumption. The proposed current-reuse AFE, which includes a low-noise amplifier (LNA) and a programmable gain amplifier (PGA), employs a new fully differential current-mirror topology using fewer transistors. This is an improvement over several design parameters, in terms of power consumption and noise, over previous current-reuse amplifier circuit implementations. In the second part of this thesis, we propose a new multi-channel sigma-delta converter that converts several channels independently using a single op-amp and several charge storage capacitors. Compared to conventional techniques, this method applies a new interleaved multiplexing scheme, which does not need any reset phase for the integrator while it switches to a new channel; this enhances its resolution. When the chip area is not a priority, other approaches can be more attractive, and we propose a new power-efficient strategy based on a new in-channel ultra-low power sigma-delta converter designed to decrease further power consumption. This new converter uses a low-voltage architecture based on an innovative feed-forward topology that minimizes the nonlinearity associated with low-voltage supply.
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Farnsworth, Bradley David. "Wireless Implantable EMG Sensing Microsystem." Case Western Reserve University School of Graduate Studies / OhioLINK, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=case1276263665.

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Pauchard, Alexandre. "Silicon sensor microsystem for ultraviolet detection /." Lausanne, 2000. http://library.epfl.ch/theses/?nr=2152.

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Marselli, Catherine. "Data processing of a navigation microsystem." Université de Franche-Comté. UFR des sciences et techniques, 1998. http://www.theses.fr/1998BESA2078.

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Ce travail de recherche s'inscrit dans un projet académique franco-suisse visant à déterminer les limites des microtechnologies et des microsystèmes à travers l'exemple d'un système de navigation inertiel basé sur des microaccéléromètres et des microcapteurs de vitesse angulaire (gyros). Il comprend quatre volets allant de la conception des composants au développement du système de traitement. La présente thèse réalisée à l'Institut de Microtechnique (Université de Neuchâtel, Suisse) concerne le traitement de l'information du microsystème de navigation. Les microcapteurs actuels sont moins chers mais moins précis que les capteurs mécaniques ou optiques classiques. Dans un système de navigation, le signal de sortie des accéléromètres et des gyroscopes est intégré conduisant à l'accumulation des erreurs dans le temps. Ainsi, en l'absence de correction, la trajectoire mesurée devient rapidement fausse. Le rôle du système de traitement est donc de calculer les paramètres de navigation (position, vitesse et orientation) et de limiter l'erreur de trajectoire suivant deux moyens : réduire les imperfections des capteurs et recaler régulièrement la trajectoire en utilisant un autre moyen de navigation. Ces différents objectifs sont réalisés par des filtres de Kalman. Le filtre de Kalman est un estimateur optimal de l'état d'un système. Il se présente sous la forme d'un ensemble d'équations récurrentes et nécessite une description d'état du système et des mesures
This research is part of a Swiss French academic project whose goal was the determination of some limits in the design and use of microtechnologies and microsystems, using as a common thread example a navigation system based on microaccelerometers and angular rate microsensors (gyros). The entire project was divided into four parts, including design at the component level as well as at the system level. This PhD report describes the data processing of the navigation microsystem realised at the Electronics and Signal Processing Laboratory of the Institute of Microtechnology, University of Neuchâtel. Current low-cost microsensors are less expensive but less accurate that mechanical or optical sensors. In a navigation system, the accelerometer and gyro outputs are integrated, leading to the accumulation of the errors. Thus, the measured trajectory becomes quickly wrong and a corrective system has to be designed. Hence, the goals of the data processing system is to compute the navigation parameters (position, velocity, orientation) while preventing the trajectory from diverging, following two approaches: reducing the sensor errors,updating regularly the trajectory using an aiding navigation system
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James, Matthew. "Relativistic embedding." Thesis, University of Bath, 2010. https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.538128.

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The growing fields of spintronics and nanotechnology have created increased interest in developing the means to manipulate the spin of electrons. One such method arises from the combination of the spin-orbit interaction and the broken inversion symmetry that arises at surfaces and interfaces, and has prompted many recent investigations on metallic surfaces. A method by which surface states, in the absence of spin orbit effects, have been successfully investigated is the Green function embedding scheme of Inglesfield. This has been integrated into a self consistent FLAPW density functional framework based on the scalar relativistic K¨olling Harmon equation. Since the spin of the electron is a direct effect of special relativity, calculations involving the spin orbit interaction are best performed using solutions of the Dirac equation. This work describes the extension of Green’s function embedding to include the Dirac equation and how fully relativistic FLAPW surface electronic structure calculations are implemented. The general procedure used in performing a surface calculation in the scalar relativistic case is closely followed. A bulk transfer matrix is defined and used to generate the complex band structure and an embedding potential. This embedding potential is then used to produce a self consistent surface potential, leading to a Green’s function from which surface state dispersions and splittings are calculated. The bulk embedding potential can also be employed in defining channel functions and these provide a natural framework in which to explore transport properties. A relativistic version of a well known expression for the ballistic conductance across a device is derived in this context. Differences between the relativistic and nonrelativistic methods are discussed in detail. To test the validity of the scheme, a fully relativistic calculation of the extensively studied spin orbit split L-gap surface state on Au(111) is performed, which agrees well with experiment and previous calculations. Contributions to the splitting from different angular momentum channels are also provided. The main advantages of the relativistic embedding method are the full inclusion of the spin orbit interaction to all orders, the true semi infinite nature of the technique, allowing the full complex bands of the bulk crystal to be represented and the fact that a only small number of surface layers is needed in comparison to other existing methods.
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Wang, H. (Hongbo). "Silicon X-ray smart sensor micromodule and microsystem." Doctoral thesis, University of Oulu, 2002. http://urn.fi/urn:isbn:951426746X.

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Abstract Research on X-ray imaging sensors and systems have been carried out for several decades. To make these X-ray scanners smaller with better performance and higher operating speed is an important subject for scientific research and industrial applications. This thesis covers a whole X-ray line-scan camera system. Special attention is given to the smart sensor micromodule design and processing technology. The smart sensor micromodule is an integrated sensor card that includes both silicon X-ray sensor array and signal-processing integrated circuits, which can perform the functions of both an optical sensor and an analog signal processor. Digital signal processing (DSP) made by application specific integrated circuits (ASICs) is also covered in this thesis. Processing technology of the photodiode array, design of the integrated circuit, design and packaging of the micromodules are presented in this thesis. The mechanism of photodiode leakage current is studied in detail. Measured results show that the leakage current level of the photodiode array achieves 80 pA/cm2 under zero bias condition, which outperforms the best photodiode reported so far. The algorithm of the digital signal processing is also studied. The X-ray scanning system can achieve 2 m/s scanning speed with a spatial resolution of 400 mm.
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Saha, Debashis Massachusetts Institute of Technology. "A framework for distributed Web-based microsystem design." Thesis, Massachusetts Institute of Technology, 1998. http://hdl.handle.net/1721.1/46119.

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Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1998.
Includes bibliographical references (p. 109-111).
The increasing complexity of microsystem design mandates a distributed and collaborative design environment. The high integration levels call for tools and generators that allow exploration of the design space irrespective of the geographical or physical availability of the design tools. The World Wide Web serves as a desirable platform for distributed access to libraries, models and design tools. The rapid growth and acceptance of the World Wide Web has happened over the same time period in which distributed object systems have stabilized and matured. The Web can become an important platform for VLSI CAD, when the distributed object technologies (e.g, CORBA) are combined with the Web technologies (e.g., HTTP, CGI) and Web-aware object oriented languages (e.g., Java). In this thesis, a framework using the Object-Web technologies is presented, which enables distributed Web based CAD. The Object-Web architecture provides an open, interoperable and scalable distributed computing environment for microsystem design, in which Web based design tools can efficiently utilize the capabilities of existing design tools on the Web to build hierarchical Web tools. The framework includes the infrastructure to store and manipulate design objects, protocols for tool communication and WebTop, a Java hierarchical schematic/block editor with interfaces to distributed Web tools and cell libraries.
by Debashis Saha.
M.S.
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Books on the topic "Embedding in a microsystem"

1

Bratko, Aleksandr. Artificial intelligence, legal system and state functions. ru: INFRA-M Academic Publishing LLC., 2020. http://dx.doi.org/10.12737/1064996.

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The monograph deals with methodological problems of embedding artificial intelligence in the legal system taking into account the laws of society. Describes the properties of the rule of law as a Microsystem in subsystems of law and methods of its fixation in the system of law and logic of legal norms. Is proposed and substantiated the idea of creating specifically for artificial intelligence, separate and distinct, unambiguous normative system, parallel to the principal branches of law is built on the logic of the four-membered structure of legal norms. Briefly discusses some of the theory of law as an instrument of methodology of modelling of the legal system and its semantic codes in order to function properly an artificial intelligence. The ways of application of artificial intelligence in the functioning of the state. For students and teachers and all those interested in issues of artificial intelligence from the point of view of law.
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Microsystem design. Boston: Kluwer Academic Publishers, 2001.

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W, Schultze J., Ōsaka Tetsuya 1945-, and Datta Madhav, eds. Electrochemical microsystem technologies. London: Taylor & Francis, 2002.

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Corporation, Intel. Microsystem components handbook. Santa Clara, CA: Intel, 1986.

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Yang, Cheng, Chuan Shi, Zhiyuan Liu, Cunchao Tu, and Maosong Sun. Network Embedding. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-031-01590-8.

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Maurice, Marc, and Arndt Sorge, eds. Embedding Organizations. Amsterdam: John Benjamins Publishing Company, 2000. http://dx.doi.org/10.1075/aios.4.

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Lynn, Meskell, and Pels Peter, eds. Embedding ethics. Oxford, UK: Berg, 2005.

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Ulrich, Rembold, ed. Microsystem Technology and Microrobotics. Berlin, Heidelberg: Springer Berlin Heidelberg, 1997.

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Schomburg, Werner Karl. Introduction to Microsystem Design. Berlin, Heidelberg: Springer Berlin Heidelberg, 2015. http://dx.doi.org/10.1007/978-3-662-47023-7.

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Schomburg, Werner Karl. Introduction to Microsystem Design. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-19489-4.

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Book chapters on the topic "Embedding in a microsystem"

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Armengaud, Eric, Georg Macher, Riccardo Groppo, Marco Novaro, Alexander Otto, Ralf Döring, Holger Schmidt, Bartek Kras, and Slawomir Stankiewicz. "Embedding Electrochemical Impedance Spectroscopy in Smart Battery Management Systems Using Multicore Technology." In Advanced Microsystems for Automotive Applications 2016, 225–37. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-44766-7_19.

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Shelton, Lawrence G. "Microsystem." In The Bronfenbrenner Primer, 58–62. New York, NY : Routledge, 2018.: Routledge, 2018. http://dx.doi.org/10.4324/9781315136066-12.

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Nathan, Arokia, and Henry Baltes. "Microsystem Simulation." In Computational Microelectronics, 376–419. Vienna: Springer Vienna, 1999. http://dx.doi.org/10.1007/978-3-7091-6428-0_9.

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Di Paolo Emilio, Maurizio. "Powering Microsystem." In Microelectronic Circuit Design for Energy Harvesting Systems, 75–104. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-47587-5_8.

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Fatikow, Sergej, and Ulrich Rembold. "Microsystem Technology Applications." In Microsystem Technology and Microrobotics, 24–45. Berlin, Heidelberg: Springer Berlin Heidelberg, 1997. http://dx.doi.org/10.1007/978-3-662-03450-7_2.

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Li, Suny. "SiP and MicroSystem." In MicroSystem Based on SiP Technology, 67–87. Singapore: Springer Nature Singapore, 2022. http://dx.doi.org/10.1007/978-981-19-0083-9_3.

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Husak, M. "Microsystem Project-Oriented Education." In Microelectronics Education, 269–72. Dordrecht: Springer Netherlands, 2000. http://dx.doi.org/10.1007/978-94-015-9506-3_62.

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Schumacher, Axel, T. Goettsche, S. Haeberle, T. Velten, O. Scholz, A. Wolff, B. Beiski, S. Messner, and R. Zengerle. "Intraoral Drug Delivery Microsystem." In IFMBE Proceedings, 2352–55. Berlin, Heidelberg: Springer Berlin Heidelberg, 2009. http://dx.doi.org/10.1007/978-3-540-89208-3_564.

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Terry, Stephen C., Diederik W. de Bruin, and Henry V. Allen. "Self-testable Accelerometer Microsystem." In Micro System Technologies 90, 611–16. Berlin, Heidelberg: Springer Berlin Heidelberg, 1990. http://dx.doi.org/10.1007/978-3-642-45678-7_87.

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Tvarozek, V. "Microsystem Technology in Biosensors." In Biosensors for Direct Monitoring of Environmental Pollutants in Field, 351–71. Dordrecht: Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-015-8973-4_31.

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Conference papers on the topic "Embedding in a microsystem"

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Ostmann, A., D. Manessis, T. Loeher, A. Neumann, and H. Reichl. "Strategies for Embedding of Active Components." In 2006 International Microsystems, Package, Assembly Conference Taiwan. IEEE, 2006. http://dx.doi.org/10.1109/impact.2006.312182.

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Jung, Erik, Dirk Wojakowski, Alexander Neumann, Andreas Ostmann, Rolf Aschenbrenner, and Herbert Reichl. "Chip in Polymer: 3D Integration of Active Circuitry in Polymeric Substrate." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35025.

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The demand to miniaturize products especially for mobile applications and autonomous systems is continuing to drive the evolution of electronic products and manufacturing methods. One key to miniaturization developed in the past was the use of unpackaged, bare dice. Saving the volume and weight of the package, significant reduction in footprint was achieved. A next step conceived to further the miniaturization is the integration of functions on miniaturized subsystems, i.e. System-in-Package (SiP), in contrast to a full silicon integration (System-on-Chip, SoC). Here, use of recent manufacturing methods allows to merge the SiP approach with a volumetric integration. Up to now, most of the systems make use of single- or double-sided populated system carriers. Embedding of passive components was a first step forward. A new challenge is to incorporate not only passive components, but as well active circuitry (IC’s) and the necessary thermal management. Ultra thin chips (i.e. silicon dies thinned down to &lt;50μm total thickness) lend themselves to reach these goals. Chips with that thickness can be embedded in the dielectric layers of modern laminate PCB’s. Micro via technology allows to contact the embedded chip to the outer faces of the system circuitry. As a ultimate goal for microsystem integration, the embedding of optical and fluidical system components can be envisioned. This paper presents the first attempts to embed thin silicon dies in to polymeric system carriers. The aspects of embedding and making the electrical contact as well as the thermal management are highlighted. To reach the goal of a vertically stackable “box-of-bricks” type of ultra thin (UT) package, thin silicon chips are embedded and interconnected on a peripheral UT-CSP.
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Ostmann, Andreas, Lars Boettcher, Stefan Karaszkiewicz, David Schuetze, and Dionysios Manessis. "Chip embedding technology for power applications." In 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2010. http://dx.doi.org/10.1109/impact.2010.5699484.

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Pletz, Martin, Raul Bermejo, Peter Supancic, Johannes Stahr, and Mike Morianz. "Numerical investigation of the process of embedding components into Printed Circuit Boards." In Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2011. http://dx.doi.org/10.1109/esime.2011.5765814.

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Macurova, K., A. Kharicha, M. Pletz, M. Mataln, R. Bermejo, R. Schongrundner, T. Krivec, et al. "Multi-physics simulation of the component attachment within embedding process." In 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2013. http://dx.doi.org/10.1109/eurosime.2013.6529914.

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Takeshita, Toshihiro, Manabu Yoshida, Yusuke Takei, Atsushi Ouchi, and Takeshi Kobayashi. "Cubic Flocked Electrode Embedding Amplifier Circuit for Smart ECG Textile Application." In 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII). IEEE, 2019. http://dx.doi.org/10.1109/transducers.2019.8808816.

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Ban, Yu, Jie Liu, Wei Li, and Zhiqiang Wang. "A Miniaturized Bandpass Filter Design and Verification with De-embedding Technology in SiP Solutions." In 2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM). IEEE, 2018. http://dx.doi.org/10.1109/icam.2018.8596527.

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Dionysios Manessis, Lars Boettcher, Andreas Ostmann, Stefan Karaszkiewicz, and Herbert Reichl. "Breakthroughs in chip embedding technologies leading to the emergence of further miniaturised system-in-packages." In 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2009. http://dx.doi.org/10.1109/impact.2009.5382147.

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Cao, Yang, Wei Zhang, Jun Fu, Nianhong Liu, Quan Wang, and Linlin Liu. "De-embedding and electromagnetic simulation calibration of on-wafer passive devices for millimeter wave integrated circuit design support." In 2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM). IEEE, 2017. http://dx.doi.org/10.1109/icam.2017.8242137.

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Yapici, M. K., J. M. Hong, J. Zou, and K. Balareddy. "Post-CMOS on-chip integration of 3D MEMS inductors using a novel chip embedding technique." In 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII). IEEE, 2013. http://dx.doi.org/10.1109/transducers.2013.6626718.

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Reports on the topic "Embedding in a microsystem"

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Ryan, Cillian, and Mike Walsh. Embedding WinEcon. Bristol, UK: The Economics Network, June 2007. http://dx.doi.org/10.53593/n2495a.

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James, Conrad D., Paul C. Galambos, Dawn Jonita Bennett, Monica Manginell, Murat Okandan, Andreas Acrivos, Susan Marie Brozik, and Boris Khusid. Microsystem strategies for sample preparation in biological detection. Office of Scientific and Technical Information (OSTI), March 2005. http://dx.doi.org/10.2172/920445.

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Lemons, Nathan Wishard. The cost of embedding. Office of Scientific and Technical Information (OSTI), June 2017. http://dx.doi.org/10.2172/1364582.

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Sandford, M. T. II, J. N. Bradley, and T. G. Handel. The data embedding method. Office of Scientific and Technical Information (OSTI), June 1996. http://dx.doi.org/10.2172/249252.

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Janek, Richard P., Paul Gabriel Kotula, Thomas Edward Buchheit, R. P. Michael, and Steven Howard Goods. Oxide dispersion strengthening of nickel electrodeposits for microsystem applications. Office of Scientific and Technical Information (OSTI), November 2003. http://dx.doi.org/10.2172/918246.

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Sbriglia, Lexey Raylene. Embedding Sensors During Additive Manufacturing. Office of Scientific and Technical Information (OSTI), August 2015. http://dx.doi.org/10.2172/1209455.

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Chowdhury, Rosen. Embedding employability in Monetary Economics. Bristol, UK: The Economics Network, October 2020. http://dx.doi.org/10.53593/n3355a.

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Sainudeen, Zuhail, and Navid Yazdi. Analog CMOS Interface Circuits for UMSI Chip of Environmental Monitoring Microsystem. Fort Belvoir, VA: Defense Technical Information Center, July 2001. http://dx.doi.org/10.21236/ada402437.

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Zifer, Thomas, LeRoy L. ,. Jr Whinnery, Jeromy Todd Hollenshead, George M. Buffleben, James Ross McElhanon, and Robert H. Nilson. Assuring ultra-clean environments in microsystem packages : irreversible and reversible getters. Office of Scientific and Technical Information (OSTI), November 2003. http://dx.doi.org/10.2172/918394.

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Morris, Kristen Deanne. Adaptive Active � Embedding Inclusion into Activewear. Ames (Iowa): Iowa State University. Library, January 2019. http://dx.doi.org/10.31274/itaa.9544.

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