Journal articles: 'Electronics Printing'

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DONG, WENTAO, XIAO CHENG, and XIAOMING WANG. "THEORETICAL AND EXPERIMENTAL STUDY OF TAPE TRANSFER PRINTING FOR STRETCHABLE ELECTRONIC FABRICATION." Journal of Mechanics in Medicine and Biology 18, no. 04 (June 2018): 1850045. http://dx.doi.org/10.1142/s0219519418500458.

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Transfer printing is an effective way to assemble a soft stamp to transfer solid components from one substrate to a soft target substrate. The critical parameter in transfer printing is the adhesion force at the electronic devices/silicon interface. This paper proposes an improved transfer printing method based on polyvinyl alcohol (PVA) water-soluble tape for reducing the interfacial energy at stretchable electronics/glass interface. Whether the stretchable electronics are peeled off successfully or not, depends on the peeling energy release rate, which is obtained by the home-made peeling experiment platform for stretchable electronics delaminated from the rigid glass. Compared with polydimethylsiloxane (PDMS) substrate, the critical energy release rate is reduced by 60% via PVA tape transfer printing which is helpful to delaminate the stretchable electronics from the glass surface. The improved transfer printing method provides an effective way for the stretchable electronics to be directly printed to the soft target tissues.

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Jung, Hyunsuk, Wonbeom Lee, and Jiheong Kang. "Recent Progress in Printing Conductive Materials for Stretchable Electronics." Journal of Flexible and Printed Electronics 1, no. 2 (December 2022): 137–53. http://dx.doi.org/10.56767/jfpe.2022.1.2.137.

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Printed electronics received a great attention in both research and commercialization since it allows fabrication of low-cost, large area electronic devices on various substrates. Printed electronics plays a critical role in facilitating stretchable electronics since it allows patterning newly developed stretchable conductors which is difficult to be achieved with conventional silicon-based microfabrication technologies, such as photolithography and vacuum-based techniques. To realize printed electronics which is necessary for the development of stretchable electronics, printing technologies, formulation of conductive inks, and integration of functional devices have been widely investigated in the recent years. This review summarizes principles and recent development of printing techniques, materials for stretchable conductors and their applications in stretchable electronics using various printing techniques. The challenge is that only a few researches satisfying both excellent materials properties and good printability were reported. Future efforts will greatly expand the possibilities of using printed electronics for stretchable electronics.

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Li, Lu Hai, Yi Fang, Zhi Qing Xin, Xiao Jun Tang, Peng Du, and Wen Zhao. "Features of Printing and Display." Key Engineering Materials 428-429 (January 2010): 372–78. http://dx.doi.org/10.4028/www.scientific.net/kem.428-429.372.

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The manufacture of display device is a complex technology. To reach the flexible display like E-paper, many manufacture process such as driving electrode circuit and transistor must be combined with printing technology. From the information reported, the application of gravure prints technology in organic electronics; off-set printing in EMI film and screen technology in circuit are summarized. The study was more about ink jet print technology. It was described that ink jet was used in OLED (Organic light-emitting diode), OTFT (organic thin film transistor), polymer solar cell/ Flexible organic photovoltaic cell and so on. An OE-A (organic electronics application) roadmap for the charge carrier mobility of semiconductors for organic electronics applications was given. To achieve the printed circuit, the nano silver conductive ink was applied and the ink jet circuit surface was tested by microscopy, the conductive and flexible silver film was with many advantages than screen circuit. It was concluded that the printing electronic will play important roll in the display development.

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Al-Amri, Amal M. "Recent Progress in Printed Photonic Devices: A Brief Review of Materials, Devices, and Applications." Polymers 15, no. 15 (July 29, 2023): 3234. http://dx.doi.org/10.3390/polym15153234.

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Printing electronics incorporates several significant technologies, such as semiconductor devices produced by various printing techniques on flexible substrates. With the growing interest in printed electronic devices, new technologies have been developed to make novel devices with inexpensive and large-area printing techniques. This review article focuses on the most recent developments in printed photonic devices. Photonics and optoelectronic systems may now be built utilizing materials with specific optical properties and 3D designs achieved through additive printing. Optical and architected materials that can be printed in their entirety are among the most promising future research topics, as are platforms for multi-material processing and printing technologies that can print enormous volumes at a high resolution while also maintaining a high throughput. Significant advances in innovative printable materials create new opportunities for functional devices to act efficiently, such as wearable sensors, integrated optoelectronics, and consumer electronics. This article provides an overview of printable materials, printing methods, and the uses of printed electronic devices.

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Beedasy, Vimanyu, and Patrick J. Smith. "Printed Electronics as Prepared by Inkjet Printing." Materials 13, no. 3 (February 4, 2020): 704. http://dx.doi.org/10.3390/ma13030704.

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Inkjet printing has been used to produce a range of printed electronic devices, such as solar panels, sensors, and transistors. This article discusses inkjet printing and its employment in the field of printed electronics. First, printing as a field is introduced before focusing on inkjet printing. The materials that can be employed as inks are then introduced, leading to an overview of wetting, which explains the influences that determine print morphology. The article considers how the printing parameters can affect device performance and how one can account for these influences. The article concludes with a discussion on adhesion. The aim is to illustrate that the factors chosen in the fabrication process, such as dot spacing and sintering conditions, will influence the performance of the device.

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Sawamura, Fumiya, Chen Yi Ngu, Raiki Hanazaki, Kaito Kozuki, Sayaka Kado, Masatoshi Sakai, and Kazuhiro Kudo. "Dry Printing of Ag–Ni Conductive Particles Using Toner-Type Printed Electronics." Applied Sciences 12, no. 19 (September 25, 2022): 9616. http://dx.doi.org/10.3390/app12199616.

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Printed electronics are a set of additive manufacturing methods for creating future flexible electronics on thin polymeric sheets. We proposed the toner-type, dry, page-printing of Ag–Ni composite conductive particles on flexible plastic sheets without pre-treatment. No chemical solvents are necessary to compose the inks of the electronic materials used for the toner-type printing, and no chemical treatment is required for the plastic film substrate surface. In addition, multilayer printing is simple when using toner printing because previously printed materials do not need to be resolved; furthermore, composing the thick films of the electronic materials is relatively simple. In this study, we fabricated an Ag–Ni composite toner to improve the fluidity of the toner particles compared to bare Ag particles. We successfully printed IC peripheral circuits at a resolution of 0.20 mm and demonstrated that the actual electrical circuit pattern can be formed using our method.

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Rodes-Carbonell, Ana María, Josué Ferri, Eduardo Garcia-Breijo, Ignacio Montava, and Eva Bou-Belda. "Influence of Structure and Composition of Woven Fabrics on the Conductivity of Flexography Printed Electronics." Polymers 13, no. 18 (September 18, 2021): 3165. http://dx.doi.org/10.3390/polym13183165.

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The work is framed within Printed Electronics, an emerging technology for the manufacture of electronic products. Among the different printing methods, the roll-to-roll flexography technique is used because it allows continuous manufacturing and high productivity at low cost. Nevertheless, the incorporation of the flexography printing technique in the textile field is still very recent due to technical barriers such as the porosity of the surface, the durability and the ability to withstand washing. By using the flexography printing technique and conductive inks, different printings were performed onto woven fabrics. Specifically, the study is focused on investigating the influence of the structure of the woven fabric with different weave construction, interlacing coefficient, yarn number and fabric density on the conductivity of the printing. In the same way, the influence of the weft composition was studied by a comparison of different materials (cotton, polyester, and wool). Optical, SEM, color fastness to wash, color measurement using reflection spectrophotometer and multi-meter analyses concluded that woven fabrics have a lower conductivity due to the ink expansion through the inner part of the textile. Regarding weft composition, cotton performs worse due to the moisture absorption capacity of cellulosic fiber. A solution for improving conductivity on printed electronic textiles would be pre-treatment of the surface substrates by applying different chemical compounds that increase the adhesion of the ink, avoiding its absorption.

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MATSUOKA, Riki. "Printing Inks for Electronics Industry." Journal of Japan Oil Chemists' Society 35, no. 10 (1986): 835–42. http://dx.doi.org/10.5650/jos1956.35.835.

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Sheats, Jayna R., David Biesty, Julien Noel, and Gary N. Taylor. "Printing technology for ubiquitous electronics." Circuit World 36, no. 2 (May 18, 2010): 40–47. http://dx.doi.org/10.1108/03056121011041690.

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Qu, Shaoxing. "3D printing of hydrogel electronics." Nature Electronics 5, no. 12 (December 19, 2022): 838–39. http://dx.doi.org/10.1038/s41928-022-00900-0.

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Blanchet, Graciela, and John Rogers. "Printing Techniques for Plastic Electronics." Journal of Imaging Science and Technology 47, no. 4 (July 1, 2003): 296–303. http://dx.doi.org/10.2352/j.imagingsci.technol.2003.47.4.art00003.

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Kahn, Bruce E. "Printing Methods for Printed Electronics." NIP & Digital Fabrication Conference 24, no. 1 (January 1, 2008): 15–20. http://dx.doi.org/10.2352/issn.2169-4451.2008.24.1.art00005_1.

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Nodin, Muhamad Nor, and Mohd Sallehuddin Yusof. "A Preliminary Study of PDMS Stamp towards Flexography Printing Technique: An Overview." Advanced Materials Research 844 (November 2013): 201–4. http://dx.doi.org/10.4028/www.scientific.net/amr.844.201.

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Polydimethylsiloxane (PDMS) commonly used for microcontact printing is essential towards the successful introduction of high speed printing of reel-to-reel or reel-to-plate manufacturing processes. Here, it is proposed that extending flexography printing method into the multiple micro-scale printing solid line onto subtract by using PDMS stamp as a plate. Flexography is a high-speed technique commonly used for printing onto substrates in a lot of paper printing industry. It was introduces a decade ago where it is very useful for large production. In this area of printing, the expanding demand on printing electronics leads to a lot of study needed for high speed and large production of electronic industries. This work elaborates the feasibility of PDMS stamp (12in x 4in) use in flexography printing for multiple micro solid lines. It will undergo by using simple and inexpensive fabrication PDMS mold process. This paper illustrates the use of PDMS in microcontact printing fusing with flexography printing to produce multiple micro-solid line printing capability by using conductive ink as application of printing electronic industry applications.

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Zhou, Ying Mei, and Zhong Min Jiang. "Study of Hybrid Printing Based on Printed Electronics." Applied Mechanics and Materials 731 (January 2015): 316–20. http://dx.doi.org/10.4028/www.scientific.net/amm.731.316.

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With the development of technologies in printed electronics, they are perfect for low performance applications, such as displays, labels, clothing, and batteries. Flexible, electrical circuits can be printed using functional inks and printing methods, such as screen printing, gravure and inkjet. Uniform ink surface, smoothness, fine lines, and registration are keys in determining the capability of printed electronics. Screen mesh count, printing methods and emulsion thickness are all variables that are involved in screen printing and need to be quantified in order to determine optimal operational conditions. Inkjet printing is used to conductive traces based on its tiny drop. This study attempted to control human errors during operation that might influence electrical conductivity with inkjet and screen printing.

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Sanchez-Duenas, Leire, Estibaliz Gomez, Mikel Larrañaga, Miren Blanco, Amaia M. Goitandia, Estibaliz Aranzabe, and José Luis Vilas-Vilela. "A Review on Sustainable Inks for Printed Electronics: Materials for Conductive, Dielectric and Piezoelectric Sustainable Inks." Materials 16, no. 11 (May 24, 2023): 3940. http://dx.doi.org/10.3390/ma16113940.

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In the last decades, the demand for electronics and, therefore, electronic waste, has increased. To reduce this electronic waste and the impact of this sector on the environment, it is necessary to develop biodegradable systems using naturally produced materials with low impact on the environment or systems that can degrade in a certain period. One way to manufacture these types of systems is by using printed electronics because the inks and the substrates used are sustainable. Printed electronics involve different methods of deposition, such as screen printing or inkjet printing. Depending on the method of deposition selected, the developed inks should have different properties, such as viscosity or solid content. To produce sustainable inks, it is necessary to ensure that most of the materials used in the formulation are biobased, biodegradable, or not considered critical raw materials. In this review, different inks for inkjet printing or screen printing that are considered sustainable, and the materials that can be used to formulate them, are collected. Printed electronics need inks with different functionalities, which can be mainly classified into three groups: conductive, dielectric, or piezoelectric inks. Materials need to be selected depending on the ink’s final purpose. For example, functional materials such as carbon or biobased silver should be used to secure the conductivity of an ink, a material with dielectric properties could be used to develop a dielectric ink, or materials that present piezoelectric properties could be mixed with different binders to develop a piezoelectric ink. A good combination of all the components selected must be achieved to ensure the proper features of each ink.

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Lu, Bing-Heng, Hong-Bo Lan, and Hong-Zhong Liu. "Additive manufacturing frontier: 3D printing electronics." Opto-Electronic Advances 1, no. 1 (2018): 17000401–10. http://dx.doi.org/10.29026/oea.2018.170004.

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Park, Young‐Geun, Insik Yun, Won Gi Chung, Wonjung Park, Dong Ha Lee, and Jang‐Ung Park. "High‐Resolution 3D Printing for Electronics." Advanced Science 9, no. 8 (January 17, 2022): 2104623. http://dx.doi.org/10.1002/advs.202104623.

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Jones, Jason, Dustin Büttner, Rupesh Chudasama, David Wimpenny, and Klaus Krüger. "Laser Printing Circuit Boards and Electronics." Journal of Imaging Science and Technology 56, no. 4 (December 6, 2012): 1–11. http://dx.doi.org/10.2352/j.imagingsci.technol.2012.56.4.040503.

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Parashkov, R., E. Becker, T. Riedl, H. H. Johannes, and W. Kowalsky. "Large Area Electronics Using Printing Methods." Proceedings of the IEEE 93, no. 7 (July 2005): 1321–29. http://dx.doi.org/10.1109/jproc.2005.850304.

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Li, Yin, Manjusri Misra, and Stefano Gregori. "Printing Green Nanomaterials for Organic Electronics." IEEE Transactions on Components, Packaging and Manufacturing Technology 8, no. 7 (July 2018): 1307–15. http://dx.doi.org/10.1109/tcpmt.2018.2845847.

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Donaldson, Laurie. "More efficient printing for organic electronics." Materials Today 16, no. 6 (June 2013): 212. http://dx.doi.org/10.1016/j.mattod.2013.06.018.

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Espalin, David, Danny W. Muse, Eric MacDonald, and Ryan B. Wicker. "3D Printing multifunctionality: structures with electronics." International Journal of Advanced Manufacturing Technology 72, no. 5-8 (March 4, 2014): 963–78. http://dx.doi.org/10.1007/s00170-014-5717-7.

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Yalcintas, Ezgi Pinar, Kadri Bugra Ozutemiz, Toygun Cetinkaya, Livio Dalloro, Carmel Majidi, and O. Burak Ozdoganlar. "Soft Electronics Manufacturing Using Microcontact Printing." Advanced Functional Materials 29, no. 51 (October 10, 2019): 1906551. http://dx.doi.org/10.1002/adfm.201906551.

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Valentine, Alexander D., Travis A. Busbee, John William Boley, Jordan R. Raney, Alex Chortos, Arda Kotikian, John Daniel Berrigan, Michael F. Durstock, and Jennifer A. Lewis. "Hybrid 3D Printing of Soft Electronics." Advanced Materials 29, no. 40 (September 6, 2017): 1703817. http://dx.doi.org/10.1002/adma.201703817.

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Ready, Steven, William Wong, Kateri Paul, and Bob Street. "Jet Printing for Large Area Electronics." NIP & Digital Fabrication Conference 18, no. 1 (January 1, 2002): 429–32. http://dx.doi.org/10.2352/issn.2169-4451.2002.18.1.art00002_2.

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Blanchet, G., C. Nuckolls, H. H. Lee, M. Strano, and J. Rogers. "Large Area Printing of Organic Electronics." NIP & Digital Fabrication Conference 22, no. 2 (January 1, 2006): 12. http://dx.doi.org/10.2352/issn.2169-4451.2006.22.2.art00006_3.

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Chason, Marc, Daniel R. Gamota, Paul W. Brazis, Krishna Kalyanasundaram, Jie Zhang, Keryn K. Lian, and Robert Croswell. "Toward Manufacturing Low-Cost, Large-Area Electronics." MRS Bulletin 31, no. 6 (June 2006): 471–75. http://dx.doi.org/10.1557/mrs2006.121.

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AbstractDevelopments originally targeted toward economical manufacturing of telecommunications products have planted the seeds for new opportunities such as low-cost, large-area electronics based on printing technologies. Organic-based materials systems for printed wiring board (PWB) construction have opened up unique opportunities for materials research in the fabrication of modular electronic systems.The realization of successful consumer products has been driven by materials developments that expand PWB functionality through embedded passive components, novel MEMS structures (e.g., meso-MEMS, in which the PWB-based structures are at the milliscale instead of the microscale), and microfluidics within the PWB. Furthermore, materials research is opening up a new world of printed electronics technology, where active devices are being realized through the convergence of printing technologies and microelectronics.

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Zhou, Honglei, Weiyang Qin, Qingmin Yu, Huanyu Cheng, Xudong Yu, and Huaping Wu. "Transfer Printing and its Applications in Flexible Electronic Devices." Nanomaterials 9, no. 2 (February 18, 2019): 283. http://dx.doi.org/10.3390/nano9020283.

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Flexible electronic systems have received increasing attention in the past few decades because of their wide-ranging applications that include the flexible display, eyelike digital camera, skin electronics, and intelligent surgical gloves, among many other health monitoring devices. As one of the most widely used technologies to integrate rigid functional devices with elastomeric substrates for the manufacturing of flexible electronic devices, transfer printing technology has been extensively studied. Though primarily relying on reversible interfacial adhesion, a variety of advanced transfer printing methods have been proposed and demonstrated. In this review, we first summarize the characteristics of a few representative methods of transfer printing. Next, we will introduce successful demonstrations of each method in flexible electronic devices. Moreover, the potential challenges and future development opportunities for transfer printing will then be briefly discussed.

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Silvestre, Rocío, Raúl Llinares Llopis, Laura Contat Rodrigo, Víctor Serrano Martínez, Josué Ferri, and Eduardo Garcia-Breijo. "Low-Temperature Soldering of Surface Mount Devices on Screen-Printed Silver Tracks on Fabrics for Flexible Textile Hybrid Electronics." Sensors 22, no. 15 (August 2, 2022): 5766. http://dx.doi.org/10.3390/s22155766.

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The combination of flexible-printed substrates and conventional electronics leads to flexible hybrid electronics. When fabrics are used as flexible substrates, two kinds of problems arise. The first type is related to the printing of the tracks of the corresponding circuit. The second one concerns the incorporation of conventional electronic devices, such as integrated circuits, on the textile substrate. Regarding the printing of tracks, this work studies the optimal design parameters of screen-printed silver tracks on textiles focused on printing an electronic circuit on a textile substrate. Several patterns of different widths and gaps between tracks were tested in order to find the best design parameters for some footprint configurations. With respect to the incorporation of devices on textile substrates, the paper analyzes the soldering of surface mount devices on fabric substrates. Due to the substrate’s nature, low soldering temperatures must be used to avoid deformations or damage to the substrate caused by the higher temperatures used in conventional soldering. Several solder pastes used for low-temperature soldering are analyzed in terms of joint resistance and shear force application. The results obtained are satisfactory, demonstrating the viability of using flexible hybrid electronics with fabrics. As a practical result, a simple single-layer circuit was implemented to check the results of the research.

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Chen, Sen, and Jing Liu. "Liquid metal printed electronics towards ubiquitous electrical engineering." Japanese Journal of Applied Physics 61, SE (April 5, 2022): SE0801. http://dx.doi.org/10.35848/1347-4065/ac5761.

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Abstract Conventional electronic manufacturers are generally not easily accessible due to complicated procedures, time, material and energy consuming, and may generate potential pollution to the environment. From an alternative, liquid metal printed electronics to quickly fabricate electronic circuits and functional devices were proposed a decade before. To promote the further development and application of liquid metal printed electronics, this review aims to summarize and analyze the progress of liquid metal printed electronics from three aspects, namely electronic inks, printing technology and applications. Then, we will discuss the challenges and opportunities for further development of liquid metal printed electronics from several aspects including material modification, technological innovation, equipment upgrading and potential applications. It is expected that liquid metal printed electronics allow one to make electronics at anytime, anywhere at low cost which indicates the coming of a new era of ubiquitous electrical engineering.

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Albrecht, Andreas, Mauriz Trautmann, Markus Becherer, Paolo Lugli, and Almudena Rivadeneyra. "Shear-Force Sensors on Flexible Substrates Using Inkjet Printing." Journal of Sensors 2019 (March 3, 2019): 1–11. http://dx.doi.org/10.1155/2019/1864239.

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Printing techniques are a promising way of fabricating low-cost electronics without the need for masking and etching. In recent years, additive printing techniques, such as inkjet and screen printing, have been adopted to fabricate low-cost and large-area electronics on flexible substrates. In this work, a three-axial normal and shear force sensor was designed and printed that consists of four miniaturized, printed capacitors. The partially overlapping electrodes are arranged in a manner, so that force sensitivity in orthogonal directions is achieved. A silicone rubber is used as an elastic dielectric and spacer between the two electrodes. The base unit of this sensor has been fabricated using inkjet printing and characterized for normal and shear forces. The force response was investigated in a force range from 0.1 N to 8 N, the normal-force sensitivity was determined to be Sz=5.2 fF/N, and the shear-force sensitivity was Sy=13.1 fF/N. Due to its sensing range, this sensor could be applicable in tactile sensing systems like wearables and artificial electronic skins.

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Kim, Gye Hyeon, Eun Ae Shin, Je Young Jung, Jun Young Lee, and Chang Kee Lee. "Effect of Spray Parameters on Electrical Characteristics of Printed Layer by Morphological Study." Processes 10, no. 5 (May 18, 2022): 999. http://dx.doi.org/10.3390/pr10050999.

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Products are manufactured as printed electronics through electro-conductive ink having properties suitable for flexible substrates. As printing process conditions affect the quality of the electronic properties of the final devices, it is essential to understand how the parameters of each process affect print quality. Spray printing, one of several printing processes, suits flexible large-area substrates and continuous processes with a uniform layer for electro-conductive aqueous ink. This study adopted the spray printing process for cellulose nanofiber (CNF)/carbon nanotube (CNT) composite conductive printing. Five spray parameters (nozzle diameter, spray speed, amount of sprayed ink, distance of nozzle to substrate, and nozzle pressure) were chosen to investigate the effects between process parameters and electrical properties relating to the morphology of the printing products. This study observed the controlling morphology through parameter adjustment and confirmed how it affects the final electrical conductivity. It means that the quality of the electronic properties can be modified by adjusting several spray process parameters.

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Gao, Meng, Lihong Li, and Yanlin Song. "Inkjet printing wearable electronic devices." Journal of Materials Chemistry C 5, no. 12 (2017): 2971–93. http://dx.doi.org/10.1039/c7tc00038c.

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Azmi, Amirul Hadi, Shaharin Fadzli Abd Rahman, and Mastura Shafinaz Zainal Abidin. "Characterization of drop-casted graphene/cellulose thin film on printing paper substrate." Indonesian Journal of Electrical Engineering and Computer Science 19, no. 2 (August 1, 2020): 680. http://dx.doi.org/10.11591/ijeecs.v19.i2.pp680-685.

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Paper electronics is an emerging technology to implement flexible and wearable electronics devices via ink printing process. This paper evaluates the feasibility of using conventional printing paper for coating process with graphene/cellulose ink. 4 different types of regularly used conventional printing papers were used as substrates in this work. The conductive graphene ink was prepared through exfoliation of graphite in cellulose solution. The paper substrates surface morphology and sheet resistance of the drop-casted conductive ink on each paper were analyzed and discussed. Glossy paper was found to be suitable paper substrate for the printing of the formulated ink due to its low surface roughness of 16 nm. The value of sheet resistance of the graphene/cellulose thin film can be lowered to 4.11 kΩ/sq by applying multiple drops. This work suggests that conventional printing paper may offer solution for highly scalable and low-cost paper electronics.

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Hamad, Aamir, Adam Archacki, and Ahsan Mian. "Characteristics of nanosilver ink (UTDAg) microdroplets and lines on polyimide during inkjet printing at high stage velocity." Materials Advances 1, no. 1 (2020): 99–107. http://dx.doi.org/10.1039/d0ma00048e.

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Jaafar, Ahmad, Spyridon Schoinas, and Philippe Passeraub. "Pad-Printing as a Fabrication Process for Flexible and Compact Multilayer Circuits." Sensors 21, no. 20 (October 13, 2021): 6802. http://dx.doi.org/10.3390/s21206802.

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The purpose of this paper is to present a newly developed process for the fabrication of multilayer circuits based on the pad-printing technique. Even though the maturity level, in terms of accuracy, substrate type and print size of several printing industrial processes is relatively high, the fabrication complexity of multilayer printed electronics remains relatively high. Due to its versatility, the pad-printing technique allows the superposition of printed conductive and insulating layers. Compared to other printing processes, its main advantage is the ability to print on various substrates even on flexible, curved or irregular surfaces. Silver-based inks were used for the formulation of conductive layers while UV inks were employed to fulfil the functionality of the insulating layers. To demonstrate the functionality of the pad-printing results, a multilayer test pattern has been designed and printed on Kapton®. Furthermore, to demonstrate the efficacy of this approach, a multilayer circuit composed of three stacked layers has been designed and printed on various substrates including Kapton®, paper and wood. This electronic circuit controls an array of LEDs through the manipulation of a two-key capacitive touch sensor. This study, allowed us to define recommendations for the different parameters leading to high printing quality. We expect a long-term beneficial impact of this study towards a low-cost, fast, and environmental-friendly production of printed electronics.

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Jaafar, Ahmad, Spyridon Schoinas, and Philippe Passeraub. "Pad-Printing as a Fabrication Process for Flexible and Compact Multilayer Circuits." Sensors 21, no. 20 (October 13, 2021): 6802. http://dx.doi.org/10.3390/s21206802.

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The purpose of this paper is to present a newly developed process for the fabrication of multilayer circuits based on the pad-printing technique. Even though the maturity level, in terms of accuracy, substrate type and print size of several printing industrial processes is relatively high, the fabrication complexity of multilayer printed electronics remains relatively high. Due to its versatility, the pad-printing technique allows the superposition of printed conductive and insulating layers. Compared to other printing processes, its main advantage is the ability to print on various substrates even on flexible, curved or irregular surfaces. Silver-based inks were used for the formulation of conductive layers while UV inks were employed to fulfil the functionality of the insulating layers. To demonstrate the functionality of the pad-printing results, a multilayer test pattern has been designed and printed on Kapton®. Furthermore, to demonstrate the efficacy of this approach, a multilayer circuit composed of three stacked layers has been designed and printed on various substrates including Kapton®, paper and wood. This electronic circuit controls an array of LEDs through the manipulation of a two-key capacitive touch sensor. This study, allowed us to define recommendations for the different parameters leading to high printing quality. We expect a long-term beneficial impact of this study towards a low-cost, fast, and environmental-friendly production of printed electronics.

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Zazoum, Bouchaib, Abdel Bachri, and Jamal Nayfeh. "Functional 2D MXene Inks for Wearable Electronics." Materials 14, no. 21 (November 2, 2021): 6603. http://dx.doi.org/10.3390/ma14216603.

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Inks printing is an innovative and practicable technology capable of fabricating the next generation of flexible functional systems with various designs and desired architectures. As a result, inks printing is extremely attractive in the development of printed wearables, including wearable sensors, micro supercapacitor (MSC) electrodes, electromagnetic shielding, and thin-film batteries. The discovery of Ti3C2Tx in 2011, a 2D material known as a MXene, which is a compound composed of layered nitrides, carbides, or carbonitrides of transition metals, has attracted significant interest within the research community because of its exceptional physical and chemical properties. MXene has high metallic conductivity of transition metal carbides combined with hydrophilic behavior due to its surface terminated functional groups, all of which make it an excellent candidate for promising inks printing applications. This paper reviews recent progress in the development of 2D MXene inks, including synthesis procedures, inks formulation and performance, and printing methods. Further, the review briefly provides an overview of future guidelines for the study of this new generation of 2D materials.

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Krzemiński, Jakub, Dominik Baraniecki, Jan Dominiczak, Izabela Wojciechowska, Tomasz Raczyński, Daniel Janczak, and Małgorzata Jakubowska. "Hybrid Printing of Silver-Based Inks for Application in Flexible Printed Sensors." Crystals 13, no. 5 (April 24, 2023): 720. http://dx.doi.org/10.3390/cryst13050720.

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This study explores the potential benefits of combining different printing techniques to improve the production of flexible printed sensors, which is a relevant application for modern coating and surface design. The demand for cheap, flexible, precise, and scalable sensors for wearable electronics is increasing, and printed electronics techniques have shown great potential in meeting these requirements. To achieve higher performance and synergy, the paper introduces the concept of hybrid printing of electronics by combining aerosol jet printing and screen printing. This multi-process approach allows for large-scale production with high printing precision. The study prepares hybrid connections on a flexible substrate foil for use in flexible printed sensor manufacturing. The research team tests different combinations of printed layers and annealing processes and finds that all prepared samples exhibit high durability during mechanical fatigue tests. Surface morphology, SEM images, and cross-section profiles demonstrate the high quality of printed layers. The lowest resistance among the tested hybrid connections obtained was 1.47 Ω. The study’s findings show that the hybrid printing approach offers a novel and promising solution for the future production of flexible sensors. Overall, this research represents an interdisciplinary approach to modern coating and surface design that addresses the need for improved production of wearable electronics. By combining different printing techniques, the study demonstrates the potential for achieving high-volume production, miniaturization, and high precision, which are essential for the ever-growing market of wearable sensors.

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Välimäki, Marja K., Elina Jansson, Valentijn J. J. Von Morgen, Mari Ylikunnari, Kaisa-Leena Väisänen, Pekka Ontero, Minna Kehusmaa, Pentti Korhonen, and Thomas M. Kraft. "Accuracy control for roll and sheet processed printed electronics on flexible plastic substrates." International Journal of Advanced Manufacturing Technology 119, no. 9-10 (January 20, 2022): 6255–73. http://dx.doi.org/10.1007/s00170-022-08717-z.

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AbstractFor the first time, the necessity to thermally pre-treat ubiquitously used PET substrates for printed electronics, to improve dimensional stability during manufacturing, is clearly defined. The experimental results have proven this phenomenon for both roll-to-roll (R2R) and sheet-to-sheet (S2S) processing of printed electronics. The next generation of electronics manufacturing has pushed the boundaries for low-cost, flexible, printed, and mass produced electronic components and systems. A driving force, and enabling production method, are the R2R printing presses. However, to produce electronics with increasing complexity and high yield in volume production, one must have a highly accurate process. In this article, R2R processing accuracy of printed electronics is evaluated from the point of dimensional accuracy of the flexible polyester substrate (DuPont Teijin Films’ PET Melinex ST504 with and without indium tin oxide, Melinex ST506, and Melinex PCS), precision of printing, and accuracy of layer-to-layer registration with stages that involve tension and elevated temperatures. This study has confirmed that dimensional changes during R2R processing will occur only in the first processing stage and that if a thermal pre-treatment run for the substrate is made—at identical temperature and tension of the processing stage—there is improved stability originating from a new-level strain in the crystalline PET film structure and freezing it in at the tensions and temperatures it is exposed to (i.e. 1400 μm machine direction stretching reduced to 8 μm). Furthermore, it is explained how the dimensional accuracy can be improved and reproducibly maintained in multilayer printing of electronics devices such as organic photovoltaics (OPV). These devices provide a valuable baseline of how the layer-to-layer alignment accuracy plays a crucial role in fully printed electronics devices, which lessons can be applied in all aspects of this field including hybrid systems and system fabrication involving multiple processing methods.

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Muldoon, Kirsty, Yanhua Song, Zeeshan Ahmad, Xing Chen, and Ming-Wei Chang. "High Precision 3D Printing for Micro to Nano Scale Biomedical and Electronic Devices." Micromachines 13, no. 4 (April 18, 2022): 642. http://dx.doi.org/10.3390/mi13040642.

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Three dimensional printing (3DP), or additive manufacturing, is an exponentially growing process in the fabrication of various technologies with applications in sectors such as electronics, biomedical, pharmaceutical and tissue engineering. Micro and nano scale printing is encouraging the innovation of the aforementioned sectors, due to the ability to control design, material and chemical properties at a highly precise level, which is advantageous in creating a high surface area to volume ratio and altering the overall products’ mechanical and physical properties. In this review, micro/-nano printing technology, mainly related to lithography, inkjet and electrohydrodynamic (EHD) printing and their biomedical and electronic applications will be discussed. The current limitations to micro/-nano printing methods will be examined, covering the difficulty in achieving controlled structures at the miniscule micro and nano scale required for specific applications.

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Schirmer, Julian, Jewgeni Roudenko, and Marcus Reichenberger. "Electrical Functionalization of Interconnect Devices by Digital Printing - Evaluation of Properties and Long-Term Behaviour." Applied Mechanics and Materials 882 (July 2018): 190–98. http://dx.doi.org/10.4028/www.scientific.net/amm.882.190.

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Digital printing technologies are becoming increasingly important for modern electronics production. Besides inkjet printing for low viscosity inks, jetting of pasty materials such as PTF can be a viable alternative to traditional subtractive or additive metallization methods in the future. Hybrid printed electronics, a combination of printed circuitry with classical electronic components, offers many advantages such as low cost, environmental sustainability and others. Until now, the mechanical and electrical properties of printed pastes on molded substrates have not been investigated in detail, just as little as the long-term characteristics of interconnection technologies necessary to mount traditional electronic components onto printed substrates. In different test series, electrical resistance and adhesion of a special PTF material have been investigated. The long-term behavior of the material itself and three alternative interconnection technologies for mounting of SMT components has been evaluated. Results are encouraging, although still a lot of improvements are necessary.

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Zhang, Li, Chong Zhang, Zheng Tan, Jingrong Tang, Chi Yao, and Bo Hao. "Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing." Micromachines 12, no. 11 (November 3, 2021): 1358. http://dx.doi.org/10.3390/mi12111358.

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In recent years, with the rapid development of the flexible electronics industry, there is an urgent need for a large-area, multilayer, and high-production integrated manufacturing technology for scalable and flexible electronic products. To solve this technical demand, researchers have proposed and developed microtransfer printing technology, which picks up and prints inks in various material forms from the donor substrate to the target substrate, successfully realizing the integrated manufacturing of flexible electronic products. This review retrospects the representative research progress of microtransfer printing technology for the production of flexible electronic products and emphasizes the summary of seal materials, the basic principles of various transfer technology and fracture mechanics models, and the influence of different factors on the transfer effect. In the end, the unique functions, technical features, and related printing examples of each technology are concluded and compared, and the prospects of further research work on microtransfer printing technology is finally presented.

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Park, Sehyun, Hojoong Kim, Jong-Hoon Kim, and Woon-Hong Yeo. "Advanced Nanomaterials, Printing Processes, and Applications for Flexible Hybrid Electronics." Materials 13, no. 16 (August 13, 2020): 3587. http://dx.doi.org/10.3390/ma13163587.

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Recent advances in nanomaterial preparation and printing technologies provide unique opportunities to develop flexible hybrid electronics (FHE) for various healthcare applications. Unlike the costly, multi-step, and error-prone cleanroom-based nano-microfabrication, the printing of nanomaterials offers advantages, including cost-effectiveness, high-throughput, reliability, and scalability. Here, this review summarizes the most up-to-date nanomaterials, methods of nanomaterial printing, and system integrations to fabricate advanced FHE in wearable and implantable applications. Detailed strategies to enhance the resolution, uniformity, flexibility, and durability of nanomaterial printing are summarized. We discuss the sensitivity, functionality, and performance of recently reported printed electronics with application areas in wearable sensors, prosthetics, and health monitoring implantable systems. Collectively, the main contribution of this paper is in the summary of the essential requirements of material properties, mechanisms for printed sensors, and electronics.

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Janeczek, Kamil, Małgorzata Jakubowska, Grażyna Kozioł, Anna Młożniak, and Janusz Sitek. "Screen printed RFID antennas on low cost flexible substrates." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000161–68. http://dx.doi.org/10.4071/isom-2011-ta5-paper3.

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Recently, more and more studies are carried out in the field of printed RFID tags. It is connected with rapid development of new electronic technology, i.e. printed electronics which utilizes printing techniques, like screen printing, inkjet, flexography or gravure, for production of electronic components. This method is on one hand environmentally friendly because it allows eliminating wastes emerging during etching process used commonly in electronics. On the other hand, components can be printed on low cost flexible substrates, like foil or paper. These two factors cause that such products are cheap and can be competitive with their equivalents used currently. In this study, investigations of RFID tag antennas working in UHF frequency range made with screen printing technique are described. Conductive polymer pastes containing silver nanopowder, silver flakes or carbon nanotubes were used for antenna fabrication. Each of them was deposited on foil and paper. Properties of printed antennas were investigated by return loss measurements performed in the frequency range 0.5 ÷ 1.5 GHz. Achieved results were compared with simulation carried out in CST Microwave Studio. Antenna surface profile was checked using optical profilometer or metallographic microscope. Its mechanical tests were also conducted. The obtained results showed that the best candidate for antenna printing on flexible substrate was the paste with silver nanopowder because it combined high conductivity and high mechanical durability.

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Eastman, Tim, and Adam Cook. "Direct Write Electronics – Thick Films on LTCC." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000893–97. http://dx.doi.org/10.4071/isom-thp53.

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For low volume, high value microelectronic applications reducing cost and time to initial production parts in Low Temperature Cofired Ceramics (LTCC) play a big part in customer satisfaction. Using Direct Write Electronics (DWE) for conductor printing and other structures has the potential to reduce time to production through elimination of intermediate tooling and to reduce waste by applying expensive materials only where they are needed. Additional benefits may be realized by using DWE: wire bonds may be replaced by dispensed conductors; individual layers and parts may be uniquely labeled at the time of printing to improve traceability of product throughout the line and reducing manufacturing errors. This paper investigates using engineered fluid dispensing to print interior and exterior conductors on a demonstration Multi-Chip Module (MCM). Industry standard materials and processes are used to form individual layers of unfired LTCC tape, as well as the forming and filling of interlayer connecting vias with conductive thick film paste. Conductor patterns on each layer are created by dispensing modified Au conductor paste with a commercial three-axis machine with a fine-tipped dispensing pump. Standard processes for collation, lamination, and sintering were followed by aerosol jet printing of Ag ink with a commercial print head mounted on a custom, 6-axis positioning gantry to form wire bond replacements, part identification and individualized markings. Resultant parts are tested for electrical functionality and cross sections are compared to in-progress build photos and line measurements to study the effect of the new printing method vs. structures produced with standard conductor printing processes.

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Zergioti, Ioanna. "Laser Printing of Organic Electronics and Sensors." Journal of Laser Micro/Nanoengineering 8, no. 1 (February 2013): 30–34. http://dx.doi.org/10.2961/jlmn.2013.01.0007.

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Yan, Ke, Jiean Li, Lijia Pan, and Yi Shi. "Inkjet printing for flexible and wearable electronics." APL Materials 8, no. 12 (December 1, 2020): 120705. http://dx.doi.org/10.1063/5.0031669.

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Hobby, A. "Fundamentals of Screens for Electronics Screen Printing." Circuit World 16, no. 4 (March 1990): 16–28. http://dx.doi.org/10.1108/eb046094.

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Jeong, Seung Hee, Anton Hagman, Klas Hjort, Magnus Jobs, Johan Sundqvist, and Zhigang Wu. "Liquid alloy printing of microfluidic stretchable electronics." Lab on a Chip 12, no. 22 (2012): 4657. http://dx.doi.org/10.1039/c2lc40628d.

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Journal articles on the topic 'Electronics Printing'

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