Log in

Relevant bibliographies by topics / Electronic manufacturing processes / Journal articles

Journal articles on the topic 'Electronic manufacturing processes'

To see the other types of publications on this topic, follow the link: Electronic manufacturing processes.

Author: Grafiati

Published: 10 December 2022

Last updated: 28 January 2023

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the top 50 journal articles for your research on the topic 'Electronic manufacturing processes.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Browse journal articles on a wide variety of disciplines and organise your bibliography correctly.

1

Michaelides, Roula, Dennis Kehoe, and Matthew Tickle. "Using electronic Customer Relationship Management to improve manufacturing processes." International Journal of Agile Systems and Management 2, no. 3 (2007): 321. http://dx.doi.org/10.1504/ijasm.2007.015796.

Full text

APA, Harvard, Vancouver, ISO, and other styles

2

Seyedin, Shayan, Tian Carey, Adrees Arbab, Ladan Eskandarian, Sivasambu Bohm, Jong Min Kim, and Felice Torrisi. "Fibre electronics: towards scaled-up manufacturing of integrated e-textile systems." Nanoscale 13, no. 30 (2021): 12818–47. http://dx.doi.org/10.1039/d1nr02061g.

Full text

Abstract:

Advances in materials development, fabrication processes, and applications for various fibre electronics are reviewed. Their integration into multifunctional electronic textiles and the key challenges in large-scale manufacturing are discussed.

APA, Harvard, Vancouver, ISO, and other styles

3

Palajova, Silvia, and Milan Gregor. "Simulation Metamodelling of Manufacturing Processes." Communications - Scientific letters of the University of Zilina 13, no. 4 (December 31, 2011): 51–54. http://dx.doi.org/10.26552/com.c.2011.4.51-54.

Full text

APA, Harvard, Vancouver, ISO, and other styles

4

Becker, K. F., S. Voges, P. Fruehauf, M. Heimann, S. Nerreter, R. Blank, M. Erdmann, et al. "Implementation of Trusted Manufacturing & AI-based process optimization into microelectronic manufacturing research environments." International Symposium on Microelectronics 2021, no. 1 (October 1, 2021): 000021–25. http://dx.doi.org/10.4071/1085-8024-2021.1.

Full text

Abstract:

Abstract Digitization is one of the hot topics in all Industry 4.0 efforts that are currently discussed. Often the focus is on digitization of business processes with a financial/organizational perspective on manufacturing, so the tools are adapting to enterprise resource planning [ERP] and manufacturing execution system [MES] rather than on actual manufacturing issues on the shop floor. Within the SiEvEI 4.0 project, a research consortium from the area of electronics manufacturing is working on digitization for a manufacturing scenario where high value electronic goods are built in a distributed manufacturing environment. The key research topics addressed are the implementation of a Chain of Trust [CoT] for such a distributed manufacturing, i.e. and the application of artificial intelligence/machine learning to analyze and eventually optimize manufacturing processes. The paper will introduce the concept of both COT and AI-based process analysis that will later on transferred into a microelectronics production environment. Two reference processes are targeted, SMD assembly using fully automated manufacturing equipment and Solder Ball Application using a high-mix/low volume concept. As a result, the paper presents a concept of how to digitize manufacturing processes and use this digital description of a process combination to make a distributed manufacturing flow safe and increase product/process quality.

APA, Harvard, Vancouver, ISO, and other styles

5

Leckie, F. A., and R. M. McMeeking. "Processing and Manufacturing." Applied Mechanics Reviews 38, no. 10 (October 1, 1985): 1297–300. http://dx.doi.org/10.1115/1.3143697.

Full text

Abstract:

The general problems associated with the mechanics of forming processes are discussed. Particular topics include: (i) processing of electronic devices; (ii) flexible robotic systems; (iii) manufacturing methods for modern materials; (iv) process control for optimal properties.

APA, Harvard, Vancouver, ISO, and other styles

6

Cobley, A. J. "Alternative surface modification processes in metal finishing and electronic manufacturing industries." Transactions of the IMF 85, no. 6 (November 2007): 293–97. http://dx.doi.org/10.1179/174591907x246528.

Full text

APA, Harvard, Vancouver, ISO, and other styles

7

Liang, R. C., Jack Hou, HongMei Zang, Jerry Chung, and Scott Tseng. "Microcup® displays: Electronic paper by roll-to-roll manufacturing processes." Journal of the Society for Information Display 11, no. 4 (2003): 621. http://dx.doi.org/10.1889/1.1825690.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

Li, Ji, Thomas Wasley, Duong Ta, John Shephard, Jonathan Stringer, Patrick J. Smith, Emre Esenturk, Colm Connaughton, Russell Harris, and Robert Kay. "Micro electronic systems via multifunctional additive manufacturing." Rapid Prototyping Journal 24, no. 4 (May 14, 2018): 752–63. http://dx.doi.org/10.1108/rpj-02-2017-0033.

Full text

Abstract:

Purpose This paper aims to demonstrate the improved functionality of additive manufacturing technology provided by combining multiple processes for the fabrication of packaged electronics. Design/methodology/approach This research is focused on the improvement in resolution of conductor deposition methods through experimentation with build parameters. Material dispensing with two different low temperature curing isotropic conductive adhesive materials was characterised for their application in printing each of three different conductor designs, traces, z-axis connections and fine pitch flip chip interconnects. Once optimised, demonstrator size can be minimised within the limitations of the chosen processes and materials. Findings The proposed method of printing z-axis through layer connections was successful with pillars 2 mm in height and 550 µm in width produced. Dispensing characterisation also resulted in tracks 134 µm in width and 38 µm in height allowing surface mount assembly of 0603 components and thin-shrink small outline packaged integrated circuits. Small 149-µm flip chip interconnects deposited at a 457-µm pitch have also been used for packaging silicon bare die. Originality/value This paper presents an improved multifunctional additive manufacturing method to produce fully packaged multilayer electronic systems. It discusses the development of new 3D printed, through layer z-axis connections and the use of a single electrically conductive adhesive material to produce all conductors. This facilitates the surface mount assembly of components directly onto these conductors before stereolithography is used to fully package multiple layers of circuitry in a photopolymer.

APA, Harvard, Vancouver, ISO, and other styles

9

Ushijima, Hirobumi, Ken-ichi Nomura, Yasuyuki Kusaka, Shusuke Kanazawa, Yoshinori Horii, Mariko Fujita, and Noritaka Yamamoto. "Development of Manufacturing Processes for Novel Electronics by Print Technology." Journal of The Japan Institute of Electronics Packaging 21, no. 6 (September 1, 2018): 567–72. http://dx.doi.org/10.5104/jiep.21.567.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

MANDUTIANU, DAN, and SERBAN VOINEA. "Knowledge based processes in flexible manufacturing." International Journal of Computer Integrated Manufacturing 1, no. 3 (July 1988): 197–205. http://dx.doi.org/10.1080/09511928808944361.

Full text

APA, Harvard, Vancouver, ISO, and other styles

11

Schmidt, Michael, Narendra B. Dahotre, David Bourell, and Ehsan Toyserkani. "Laser-based additive manufacturing: Processes and materials." Optics & Laser Technology 139 (July 2021): 106999. http://dx.doi.org/10.1016/j.optlastec.2021.106999.

Full text

APA, Harvard, Vancouver, ISO, and other styles

12

Salaoru, Iulia, Salah Maswoud, and Shashi Paul. "Inkjet Printing of Functional Electronic Memory Cells: A Step Forward to Green Electronics." Micromachines 10, no. 6 (June 22, 2019): 417. http://dx.doi.org/10.3390/mi10060417.

Full text

Abstract:

Nowadays, the environmental issues surrounding the production of electronics, from the perspectives of both the materials used and the manufacturing process, are of major concern. The usage, storage, disposal protocol and volume of waste material continue to increase the environmental footprint of our increasingly “throw away society”. Almost ironically, society is increasingly involved in pollution prevention, resource consumption issues and post-consumer waste management. Clearly, a dichotomy between environmentally aware usage and consumerism exists. The current technology used to manufacture functional materials and electronic devices requires high temperatures for material deposition processes, which results in the generation of harmful chemicals and radiation. With such issues in mind, it is imperative to explore new electronic functional materials and new manufacturing pathways. Here, we explore the potential of additive layer manufacturing, inkjet printing technology which provides an innovative manufacturing pathway for functional materials (metal nanoparticles and polymers), and explore a fully printed two terminal electronic memory cell. In this work, inkjetable materials (silver (Ag) and poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT:PSS)) were first printed by a piezoelectric Epson Stylus P50 inkjet printer as stand-alone layers, and secondly as part of a metal (Ag)/active layer (PEDOT:PSS)/metal (Ag) crossbar architecture. The quality of the individual multi-layers of the printed Ag and PEDOT:PSS was first evaluated via optical microscopy and scanning electron microscopy (SEM). Furthermore, an electrical characterisation of the printed memory elements was performed using an HP4140B picoammeter.

APA, Harvard, Vancouver, ISO, and other styles

13

Peralta, M. Estela, Mariano Marcos, Francisco Aguayo, and Juan Ramón Lama. "Advanced fractal manufacturing: multi-level and multi-scale proposal for sustainable manufacturing processes." International Journal of Mechatronics and Manufacturing Systems 10, no. 1 (2017): 3. http://dx.doi.org/10.1504/ijmms.2017.084375.

Full text

APA, Harvard, Vancouver, ISO, and other styles

14

Lama, Juan Ramón, Francisco Aguayo, Mariano Marcos, and M. Estela Peralta. "Advanced fractal manufacturing: multi-level and multi-scale proposal for sustainable manufacturing processes." International Journal of Mechatronics and Manufacturing Systems 10, no. 1 (2017): 3. http://dx.doi.org/10.1504/ijmms.2017.10005281.

Full text

APA, Harvard, Vancouver, ISO, and other styles

15

Cobley, A. J., J. E. Graves, A. Kassim, B. Mkhlef, and B. Abbas. "Ultrasonically Enabled Low Temperature Electroless Plating for Advanced Electronic Manufacture." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000183–87. http://dx.doi.org/10.4071/isom-2013-ta63.

Full text

Abstract:

Electroless plating is an important process for the metallization of non-conductive substrates and is therefore widely utilized throughout the electronics and packaging industry. Electronic manufacture now requires processes and materials that can meet the demands for miniaturization and reliability since holes and via diameters in both printed circuit boards (PCBs) and microelectronics are being reduced whilst aspect ratios are getting higher. It is critical for the future development of electronics that manufacturing processes become adapted to meet these requirements. In terms of electroless plating, miniaturization means that ensuring full coverage in vias and holes is extremely challenging whilst the electroless deposit structure is important to ensure high reliability, high conductivity etc. In addition the plating process must be able to meet the need for high production volumes (i.e. high deposition rates) whilst enabling more sustainable, low energy manufacturing. Performing electroless plating in an ultrasonic field has great potential to enhance the deposit properties and meet these advanced manufacturing requirements. This paper will discuss the results from the IeMRC funded ULTIEMet (Ultrasonically enabled Low Temperature Immersion and Electroless Metallization) research project which has utilized a methodology incorporating a mixture of electrochemical and laboratory plating tests. It has been found that by optimizing how ultrasound is introduced to the electroless process benefits such as reduced temperature plating, enhanced coverage and a finer grain structure deposit can be realized.

APA, Harvard, Vancouver, ISO, and other styles

16

Stoll, Thomas, Aarief Syed-Khaja, and Joerg Franke. "Prototyping and Production of High-temperature Power Electronic Substrates through Additive Manufacturing Processes." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000761–67. http://dx.doi.org/10.4071/isom-2017-thp51_10.

Full text

Abstract:

Abstract This paper reveals a study on Selective Laser Melting (SLM) as an alternative technology for producing power electronic substrates, and shows the possibility of producing a stable interface between alumina and copper through SLM technique. Additive Manufacturing (AM) has not yet been established in the manufacturing of electronic devices. The prevalent benefits of the generative manufacturing sector such as material efficiency, product customization/–flexibility, elimination of the usage of tools, constructional freedom and less process steps in contrast to the conventional fabrication methods of ceramic substrates for power electronic applications like DBC or AMB, are pointed out. Moreover, AM reduces energy costs due to the elimination of the necessary firing, etching and washing processes. The realized study focuses on the examination of adhesion strengths of copper structures, melted on different Al2O3 ceramics with and without pre-copper and -glass paste coating. The melting process was categorized for different laser parameters (1–3) based on the same energy input. Maximum shear values of the substrate probes reached were at about 30 N/mm2 for copper coated ceramic, and at 20 N/mm2 for conventional and glass paste coated substrates. All results were determined in a full factorial design of experiment (DoE) with 54 combinations and a sample size of six samples per parameter combination. Furthermore, several cross sections of the probes produced were illustrated to better understand the melting and joining behavior of the copper powder applied on the ceramic substrates. For improved mechanical adhesion, the ceramic substrates were roughened by laser radiation, with roughness values measured, and the cracking behavior of the exposed ceramics explained.

APA, Harvard, Vancouver, ISO, and other styles

17

Keatch, Robert P., and Brian Lawrenson. "Practical Microelectronics for Electronic Engineering Students." International Journal of Electrical Engineering & Education 35, no. 2 (April 1998): 117–38. http://dx.doi.org/10.1177/002072099803500203.

Full text

Abstract:

This article describes practical microelectronic projects and the facilities at the University of Dundee, where students learn to optimise the various fabrication processes and manufacture custom silicon chips and discrete devices. This subject is potentially very wide, including theory of devices and manufacturing technology, and some fundamental aspects of circuit design.

APA, Harvard, Vancouver, ISO, and other styles

18

Barzdenas, Vaidotas, Gediminas Grazulevicius, and Aleksandr Vasjanov. "TCAD tools in undergraduate studies: A laboratory work for learning deep submicron CMOS processes." International Journal of Electrical Engineering & Education 57, no. 2 (May 22, 2019): 133–63. http://dx.doi.org/10.1177/0020720919846811.

Full text

Abstract:

This article discusses one exemplary and one original laboratory work from the micro- and nano-electronics manufacturing process laboratory works cycle. These laboratory works have been successfully introduced into the undergraduate programme and have been attended by students for several years at Vilnius Gediminas Technical University, Faculty of Electronics. This laboratory work is unique in that it consistently displays and graphically depicts practically all CMOS transistor manufacturing processes: from the preparation of the silicon wafer to the final passivation. Silvaco TCAD tools are used in order to simulate these technological processes. This type of laboratory works provides students with the necessary knowledge of chip manufacturing processes and TCAD tools without the use of costly manufacturing equipment specific to each technological process in the fabrication chain, long-term experiments and a large amount of human resources. This article also presents and discusses student feedback statistics over several years of studies, the advantages of this laboratory work, recommendations for further improvement and formulates conclusions.

APA, Harvard, Vancouver, ISO, and other styles

19

Manogharan, Guha, Richard A. Wysk, and Ola L. A. Harrysson. "Additive manufacturing–integrated hybrid manufacturing and subtractive processes: economic model and analysis." International Journal of Computer Integrated Manufacturing 29, no. 5 (November 17, 2015): 473–88. http://dx.doi.org/10.1080/0951192x.2015.1067920.

Full text

APA, Harvard, Vancouver, ISO, and other styles

20

Labadie, Iris. "Advanced Manufacturing Methods for Brazing High-Reliability Electronic Packages." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000063–65. http://dx.doi.org/10.4071/isom-2012-ta23.

Full text

Abstract:

Brazing is a critical process for producing reliable adhesion between package metallization and metal components such as heat sinks, seal rings, and connectors. Package performance for signal integrity, mechanical reliability, and thermal management not only relies on improved materials but also on manufacturing methods designed to leverage those improvements. High-reliability packaging for applications in medical, harsh environment or aerospace applications requires a thorough understanding of which fabrication processes to select, as well as fixturing and material preparation to meet increasing demands for low electrical losses at higher frequencies and higher thermal conductivity for high-power GaN and SiC device operation. In the present work, utilization of manufacturing design tools and methods for optimal brazing will be discussed.

APA, Harvard, Vancouver, ISO, and other styles

21

Galliani, Marina, Laura M. Ferrari, Guenaelle Bouet, David Eglin, and Esma Ismailova. "Tailoring inkjet-printed PEDOT:PSS composition toward green, wearable device fabrication." APL Bioengineering 7, no. 1 (March 1, 2023): 016101. http://dx.doi.org/10.1063/5.0117278.

Full text

Abstract:

Inkjet printing remains one of the most cost-efficient techniques for device prototyping and manufacturing, offering considerable freedom of digital design, non-contact, and additive fabrication. When developing novel wearable devices, a balanced approach is required between functional, user-safe materials and scalable manufacturing processes. Here, we propose a tailor-made ink formulation, based on non-hazardous materials, to develop green electronic devices aimed at interfacing with humans. We demonstrate that developed ink exhibits high-resolution inkjet printability, in line with theoretical prediction, on multiple wearable substrates. The ink's chemical composition ensures the pattern's enhanced electrical properties, mechanical flexibility, and stability in water. The cytocompatibility evaluations show no noxious effects from printed films in contact with human mesenchymal stem cells. Finally, we fabricated a printed wearable touch sensor on a non-woven fabric substrate, capable of tracking human steps. This is a step toward the development of green wearable electronics manufacturing, demonstrating a viable combination of materials and processes for biocompatible devices.

APA, Harvard, Vancouver, ISO, and other styles

22

Ibrahim, Abdul Razak, Ali Hussein Zolait, and Veera Pandiyan Sundram. "Supply Chain Management Practices and Firm Performance." International Journal of Technology Diffusion 1, no. 3 (July 2010): 48–55. http://dx.doi.org/10.4018/jtd.2010070103.

Full text

Abstract:

Supply chain management (SCM) is the integration and strategic alliance involving all the value-creating elements in the supply, manufacturing, and distribution processes from raw material extraction, the transformation process, and end user consumption. This paper explores the SCM activities carried out by electronic manufacturing organizations in Malaysia and determines the correlation between SCM practices and firm performance. A self-administrated questionnaire based survey technique was employed to ascertain the status of SCM adoption and the practices in SCM that are significant for Malaysian electronics manufacturers. The findings suggest that the adoption of SCM activities is reasonably moderate.

APA, Harvard, Vancouver, ISO, and other styles

23

Polyanskov, Yu V., A. I. Sidorova, O. V. Zheleznov, and M. N. Yardaeva. "AUTOMATED FORMATION OF A NORMATIVE CARD FOR MANUFACTURING PARTS BASED ON ELECTRONIC TECHNOLOGICAL PROCESSES." Izvestiya of Samara Scientific Center of the Russian Academy of Sciences 22, no. 2 (2020): 142–47. http://dx.doi.org/10.37313/1990-5378-2020-22-2-142-147.

Full text

APA, Harvard, Vancouver, ISO, and other styles

24

Choi, Injun, Chulsoon Park, and Changwoo Lee. "A transactional workflow model for engineering/manufacturing processes." International Journal of Computer Integrated Manufacturing 15, no. 2 (January 2002): 178–92. http://dx.doi.org/10.1080/09511920110059061.

Full text

APA, Harvard, Vancouver, ISO, and other styles

25

Tai, Y. T., and W. L. Pearn. "Measuring the Manufacturing Yield for Skewed Wire Bonding Processes." IEEE Transactions on Semiconductor Manufacturing 28, no. 3 (August 2015): 424–30. http://dx.doi.org/10.1109/tsm.2015.2422839.

Full text

APA, Harvard, Vancouver, ISO, and other styles

26

Syed-Khaja, Aarief, Christopher Kaestle, and Joerg Franke. "Feasibility Studies on Selective Laser Melting of Copper Powders for the Development of High-temperature Circuit Carriers." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000517–22. http://dx.doi.org/10.4071/isom-2016-poster1.

Full text

Abstract:

Abstract Additive manufacturing (AM) has the potential to lead significant changes in the present state-of-the-art production processes. This provides tool-free and direct manufacturing of complex geometries simultaneously integrating various functions into components. Though AM techniques are widely used in various sectors, the application into electronics production has been not yet explored. In electronics production, substrate development has high relevance due to their multi-functionality in giving the mechanical support and electrically connecting electronic components. This contribution introduces an innovative approach in the development of high-temperature substrates through additive layered manufacturing. The technique used in the investigations was selective laser melting (SLM) of copper based powder materials mainly bronze alloy and pure copper, for the generation of conductive patterns on ceramic surfaces. The process parameters for the SLM technique and the influential factors in the generation of conductive structures are discussed in detail.

APA, Harvard, Vancouver, ISO, and other styles

27

Kuznetsov, Evgeny V., Dmitry N. Ermakov, Oleg E. Samusenko, Yuri D. Golyaev, Tatyana I. Solovyeva, and Nikita E. Kuznetsov. "Features of the use of computer modeling tools for improving the manufacturing processes of laser gyroscopes." T-Comm 15, no. 12 (2021): 31–43. http://dx.doi.org/10.36724/2072-8735-2021-15-12-31-43.

Full text

Abstract:

The article discusses ways to improve the quality and economic efficiency of the development and production of complex innovative electronic devices, which include laser gyroscopes (LG). The problems that arise when ensuring reliable operation of the LG in a wide temperature range, associated with the dense layout of the device, are described. The theoretical principles and mathematical apparatus that are used in the construction of thermal models of triaxial LG with electronics are considered in detail. The developed algorithm for constructing a thermal model of the LG is presented, which provides for a step-by-step unbundling (zooming) procedure. The process of modeling LG using the ASONIKA system is described, the constructed thermal model of LG is presented, as well as the thermal field of one of the printed nodes of LG. The detected heat-loaded electronic components are indicated. The results of experimental verification of the simulation accuracy by means of real measurement of temperatures in the model nodes by thermal sensors are presented, which confirmed the reliability of thermal modeling using the ASONIKA system. It is emphasized that the cost of manufacturing and testing of LG is quite high. Therefore, the task of finding ways to reduce the cost at the stages of development and production of LG while ensuring the improvement of the quality and reliability of manufactured devices is extremely relevant. Accurate thermal modeling at the early stages of development is an effective way to solve this problem due to cost savings on testing and redesign, as well as due to the use of an inexpensive domestic computer modeling system ASONIKA.

APA, Harvard, Vancouver, ISO, and other styles

28

Olivas, Richard, Rudy Salas, Dan Muse, Eric MacDonald, Ryan Wicker, Mike Newton, and Ken Church. "Structural Electronics through Additive Manufacturing and Micro-Dispensing." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000940–46. http://dx.doi.org/10.4071/isom-2010-tha5-paper6.

Full text

Abstract:

Implementing electronics systems that are conformal with curved and complex surfaces is difficult if not impossible with traditional fabrication techniques, which require stiff, two dimensional printed circuit boards (PCB). Flexible copper based fabrication is currently available commercially providing conformance, but not simultaneously stiffness. Consequently, these systems are susceptible to reliability problems if bent or stretched repeatedly. The integration of Additive Manufacturing (AM) combined with Direct Print (DP) micro-dispensing can provide shapes of arbitrary and complex form which incorporate 1) miniature cavities for insetting electronic components and 2) conductive traces for electrical interconnect between components. The fabrication freedom introduced by AM techniques such as stereolithography (SL), ultrasonic consolidation (UC), and fused deposition modeling (FDM) have only recently been explored in the context of electronics integration. Advanced dispensing processes have been integrated into these systems allowing for the introduction of conductive inks to serve as electrical interconnect within intricately-detailed dielectric structures. This paper describes a process that provides a novel approach for the fabrication of stiff conformal structures with integrated electronics and describes several prototype demonstrations: a body conformal helmet insert for detection of Traumatic Brain Injury (TBI), a 3D magnetic flux sensor with LED indicators for magnitude and direction and a floating sensor capable of detecting impurities in water while maintaining orientation through density gradients.

APA, Harvard, Vancouver, ISO, and other styles

29

Gutierrez, Cassie, Rudy Salas, Gustavo Hernandez, Dan Muse, Richard Olivas, Eric MacDonald, Michael D. Irwin, et al. "CubeSat Fabrication through Additive Manufacturing and Micro-Dispensing." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 001021–27. http://dx.doi.org/10.4071/isom-2011-tha4-paper3.

Full text

Abstract:

Fabricating entire systems with both electrical and mechanical content through on-demand 3D printing is the future for high value manufacturing. In this new paradigm, conformal and complex shapes with a diversity of materials in spatial gradients can be built layer-by-layer using hybrid Additive Manufacturing (AM). A design can be conceived in Computer Aided Design (CAD) and printed on-demand. This new integrated approach enables the fabrication of sophisticated electronics in mechanical structures by avoiding the restrictions of traditional fabrication techniques, which result in stiff, two dimensional printed circuit boards (PCB) fabricated using many disparate and wasteful processes. The integration of Additive Manufacturing (AM) combined with Direct Print (DP) micro-dispensing and robotic pick-and-place for component placement can 1) provide the capability to print-on-demand fabrication, 2) enable the use of micron-resolution cavities for press fitting electronic components and 3) integrate conductive traces for electrical interconnect between components. The fabrication freedom introduced by AM techniques such as stereolithography (SL), ultrasonic consolidation (UC), and fused deposition modeling (FDM) have only recently been explored in the context of electronics integration and 3D packaging. This paper describes a process that provides a novel approach for the fabrication of stiff conformal structures with integrated electronics and describes a prototype demonstration: a volumetrically-efficient sensor and microcontroller subsystem scheduled to launch in a CubeSat designed with the CubeFlow methodology.

APA, Harvard, Vancouver, ISO, and other styles

30

Hehr, Adam, Mark Norfolk, Dan Kominsky, Andrew Boulanger, Matthew Davis, and Paul Boulware. "Smart Build-Plate for Metal Additive Manufacturing Processes." Sensors 20, no. 2 (January 8, 2020): 360. http://dx.doi.org/10.3390/s20020360.

Full text

Abstract:

This paper discusses the development, processing steps, and evaluation of a smart build-plate or baseplate tool for metal additive manufacturing technologies. This tool uses an embedded high-definition fiber optic sensing fiber to measure strain states from temperature and residual stress within the build-plate for monitoring purposes. Monitoring entails quality tracking for consistency along with identifying defect formation and growth, i.e., delamination or crack events near the build-plate surface. An aluminum alloy 6061 build-plate was manufactured using ultrasonic additive manufacturing due to the process’ low formation temperature and capability of embedding fiber optic sensing fiber without damage. Laser-powder bed fusion (L-PBF) was then used to print problematic geometries onto the build-plate using AlSi10Mg for evaluation purposes. The tool identified heat generation, delamination onset, and delamination growth of the printed L-PBF parts.

APA, Harvard, Vancouver, ISO, and other styles

31

Noamna, Somkeit, Theerapong Thongphun, and Chalermpon Kongjit. "TRANSFORMER PRODUCTION IMPROVEMENT BY LEAN AND MTM-2 TECHNIQUE." ASEAN Engineering Journal 12, no. 2 (June 1, 2022): 29–35. http://dx.doi.org/10.11113/aej.v12.16712.

Full text

Abstract:

The situation of the covid-19 epidemic is a driving force of the global market’s demand increase of electronic devices and parts. Entire electronic component manufacturers, especially the transformer manufacturing industry, which is a device that supplies power to many electronic devices, encounters problems in producing products that are unable to keep up with the quickly increasing demand. This research aims to increase the productivity of small transformers by lean approach. The paper depicts processes relevant to improving production processes, reducing waste, and finding unnecessary processes. The method begins with two actions. First, study the current situation in transformer manufacturing of a case study. Second, study the customer order to delivery process using the Value Stream Mapping (VSM) and analyze entire processes of transformer manufacturing to identify standard time by unit work. The main technique is for measuring working time by timing the forward motion with the time measurement method version 2 (MTM-2). The Cause and Effect diagram was displayed with improving guidelines on two operations. First the concept of lean manufacturing was used in principal role, second the ECRS technique (Eliminate, Combine, Rearrange and Simplify) was applied to reduce "waste" as well as to optimize and reduce the manufacturing process of the transformer. The results lead to an increase in the final product per hour from 45 pieces per hour to 75 pieces per hour which increases up to 30% per hour. In addition, the productivity improvements increased the productivity of 3.46 workers per hour to 6.82 per hour (increase of 97.11%) and production time was reduced from 1,109 seconds to 229 seconds (73.04% of productivity).

APA, Harvard, Vancouver, ISO, and other styles

32

Ruikar, K., C. J. Anumba, and P. M. Carrillo. "Reengineering construction business processes through electronic commerce." TQM Magazine 15, no. 3 (June 2003): 197–212. http://dx.doi.org/10.1108/09544780310469343.

Full text

APA, Harvard, Vancouver, ISO, and other styles

33

Binnard, Mike, and Mark R. Cutkosky. "Design by Composition for Layered Manufacturing*." Journal of Mechanical Design 122, no. 1 (January 1, 1999): 91–101. http://dx.doi.org/10.1115/1.533549.

Full text

Abstract:

Three dimensional rapid prototyping processes, also called layered manufacturing or solid freeform fabrication (SFF), promise designers the ability to automatically fabricate complex shapes. SFF processes were invented with the assumption that designers would submit complete part models for automated planning and manufacturing. This planning process is normally based on some form of “decomposition,” for example, slicing into layers. Especially for newer, more complex SFF processes, there are several disadvantages to this approach, primarily that decomposition is difficult and does not reliably produce good process plans. Furthermore, it is hard for the designer to get feedback on the manufacturability of his design, and today’s decomposition systems are not fully automated. This paper presents an alternative approach, “design by composition,” where users build designs from “primitives” that include high-level manufacturing plans. When the user combines two primitives with a Boolean operation, software will automatically generate a manufacturing plan for the new design from the plans for the source primitives. In contrast to the decomposition method, design by composition offers several benefits to designers, primarily access to manufacturability feedback during design-time, a greater degree of automation, the ability to create designs with embedded components (such as sensors, electronic circuits, bearings, and shafts), and enhanced control over manufacturing plans. These advantages make design by composition a more attractive approach to SFF processing, especially for designers who are new to these processes. [S1050-0472(00)01701-3]

APA, Harvard, Vancouver, ISO, and other styles

34

Kikuchi, Akihisa, Evelitsa Higuerey, and John Coulter. "An Experimental Investigation of Resin Flow Sensing During Molding Processes." Journal of Engineering Materials and Technology 117, no. 1 (January 1, 1995): 86–93. http://dx.doi.org/10.1115/1.2804376.

Full text

Abstract:

The present investigation focused on the need for sensing subsystems for the monitoring of resin flow dynamics during molding processes. Such subsystems, when combined with process parameter control, will produce intelligent manufacturing systems that could significantly improve manufacturing capabilities. A concise review of potential resin flow monitoring methodologies is included, and a detailed analysis of one particular sensing concept originally investigated at the U. S. Army Materials Technology Laboratory is presented. The concept is based on embedded electronic sensors, and during the present study a resin front monitoring system based on a modified version of this concept was developed. Electrically conductive wires were embedded orthogonally in a nonintersecting manner within mold cavities. Subsequent resin flow was sensed by monitoring the electrical characteristics of circuits which resulted during processing. A novel modification of circuitry was included to allow for the monitoring at multiple locations with a single electronic circuit. The net result of this modification was an improved response time of the overall sensing subsystem. The concept was verified experimentally through the performance of both one-dimensional (TD) and two-dimensional (2-D) experiments. The resin system utilized consisted of a mixture of epoxy resin (EPON 826) and a curing agent (MHHPA). The sensed flow front progression information was validated through controlled injection rate experimentation and flow visualization results obtained with transparent molds. It was concluded that the resin flow sensing subsystem could be applied to relatively slow molding processes. Positive and negative aspects related to the applicability of the sensing method to actual manufacturing processes are discussed.

APA, Harvard, Vancouver, ISO, and other styles

35

Park, Won-Tae, and Yong-Young Noh. "A self-aligned high resolution patterning process for large area printed electronics." Journal of Materials Chemistry C 5, no. 26 (2017): 6467–70. http://dx.doi.org/10.1039/c7tc01590a.

Full text

APA, Harvard, Vancouver, ISO, and other styles

36

Chang, Shing I., and Mohammadhossein Amini. "Intelligent data-driven monitoring of high dimensional multistage manufacturing processes." International Journal of Mechatronics and Manufacturing Systems 13, no. 4 (2020): 299. http://dx.doi.org/10.1504/ijmms.2020.10034619.

Full text

APA, Harvard, Vancouver, ISO, and other styles

37

Ishizuka, Yasunari, Tadashi Kurata, Hiroyuki Hashiba, Keisuke Naruse, and Hiroshi Deguchi. "A Study of State Management System in Manufacturing Processes using IoT." IEEJ Transactions on Electronics, Information and Systems 140, no. 6 (June 1, 2020): 573–82. http://dx.doi.org/10.1541/ieejeiss.140.573.

Full text

APA, Harvard, Vancouver, ISO, and other styles

38

KUZNETSOV, EVGENY, DMITRII ERMAKOV, OLEG SAMUSENKO, YURI GOLYAEV, YURI KOLBAS, YURI KOFANOV, TATYANA SOLOVYEVA, NIKITA KUZNETSOV, and YURI VINOKUROV. "TECHNICAL AND ECONOMIC ASPECTS OF IMPROVING THE PROCESSES OF MANUFACTURING LASER GYROSCOPES USING METHODS OF COMPUTER SIMULATION." Computational Nanotechnology 8, no. 3 (September 28, 2021): 36–49. http://dx.doi.org/10.33693/2313-223x-2021-8-3-36-49.

Full text

Abstract:

The article discusses ways to improve the quality and economic efficiency of the development and production of complex innovative electronic devices, which include laser gyroscopes (LGs). The problems arising in ensuring the reliable operation of the LG in a wide temperature range, associated with the dense arrangement of the device, are described. The theoretical principles and mathematical apparatus that are used in the construction of thermal models of triaxial LGs with electronics are considered in detail. A developed algorithm for constructing a thermal model of an LG, which provides for a gradual disaggregation (zooming) procedure, is presented. The process of modeling the LG using the ASONIKA system is described, the constructed thermal model of the LG is presented, as well as the thermal field of one of the printed circuit assemblies of the LG. The detected thermally loaded electronic components are indicated. The results of experimental verification of the accuracy of modeling by means of real measurements by temperature sensors of temperatures in the nodes of the model, which have confirmed the reliability of thermal modeling using the ASONIKA system, are presented. It is emphasized that the cost of manufacturing and testing LG is quite high. Therefore, the task of finding ways to reduce the cost at the stages of development and production of LG while ensuring an increase in the quality and reliability of manufactured devices is extremely urgent. Accurate thermal modeling at early stages of development is an effective way to solve this problem due to savings in testing and redesign costs, as well as due to the use of an inexpensive domestic computer simulation system ASONIKA.

APA, Harvard, Vancouver, ISO, and other styles

39

Dolins, S. B. "Analyzing manufacturing processes to determine the placement of diagnostic systems." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 15, no. 6 (1992): 1146–54. http://dx.doi.org/10.1109/33.206941.

Full text

APA, Harvard, Vancouver, ISO, and other styles

40

Zaera, Francisco. "The surface chemistry of thin film atomic layer deposition (ALD) processes for electronic device manufacturing." Journal of Materials Chemistry 18, no. 30 (2008): 3521. http://dx.doi.org/10.1039/b803832e.

Full text

APA, Harvard, Vancouver, ISO, and other styles

41

Nagapurkar, Prashant, and Sujit Das. "Economic and embodied energy analysis of integrated circuit manufacturing processes." Sustainable Computing: Informatics and Systems 35 (September 2022): 100771. http://dx.doi.org/10.1016/j.suscom.2022.100771.

Full text

APA, Harvard, Vancouver, ISO, and other styles

42

Guo, R. S., and E. Sachs. "Modeling, optimization and control of spatial uniformity in manufacturing processes." IEEE Transactions on Semiconductor Manufacturing 6, no. 1 (1993): 41–57. http://dx.doi.org/10.1109/66.210657.

Full text

APA, Harvard, Vancouver, ISO, and other styles

43

Taehyung Lee and Chang Ouk Kim. "Statistical Comparison of Fault Detection Models for Semiconductor Manufacturing Processes." IEEE Transactions on Semiconductor Manufacturing 28, no. 1 (February 2015): 80–91. http://dx.doi.org/10.1109/tsm.2014.2378796.

Full text

APA, Harvard, Vancouver, ISO, and other styles

44

Kmec, Jan, Monika Karkova, and Jan Majernik. "PLANNING MANUFACTURING PROCESSES OF SURFACE FORMING WITHIN INDUSTRY 4.0." MM Science Journal 12, no. 2018 (December 12, 2018): 2680–85. http://dx.doi.org/10.17973/mmsj.2018_12_201868.

Full text

APA, Harvard, Vancouver, ISO, and other styles

45

Datta, Madhav. "Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview." Journal of Micromanufacturing 3, no. 1 (December 17, 2019): 69–83. http://dx.doi.org/10.1177/2516598419880124.

Full text

Abstract:

Electronic packaging is the methodology for connecting and interfacing the chip technology with a system and the physical world. The objective of packaging is to ensure that the devices and interconnections are packaged efficiently and reliably. Chip–package interconnection technologies currently used in the semiconductor industry include wire bonding, tape automated bonding and flip-chip solder bump connection. Among these interconnection techniques, the flip-chip bumping technology is commonly used in advanced electronic packages since this interconnection is an area array configuration so that the entire surface of the chip can be covered with bumps for the highest possible input/output (I/O) counts. The present article reviews the manufacturing processes for the fabrication of flip-chip bumps for chip–package interconnection. Various solder bumping technologies used in high-volume production include evaporation, solder paste screening and electroplating. Evaporation process produces highly reliable bumps, but it is extremely expensive and is limited to lead or lead-rich solders. Solder paste screening is cost-effective, but issues related to excessive void formation limits the process to low-end products. On the other hand, electrochemical fabrication of flip-chip bumps is an extremely selective and efficient process, which is extendible to finer pitch, larger wafers and a variety of solder compositions, including lead-free alloys. Electrochemically fabricated copper pillar bumps offer fine pitch capabilities with excellent electromigration performance. Due to these virtues, the copper pillar bumping technology is emerging as a lead-free bumping technology option for high-performance electronic packaging.

APA, Harvard, Vancouver, ISO, and other styles

46

Outón, Jose Luis, Iván Villaverde, Héctor Herrero, Urko Esnaola, and Basilio Sierra. "Innovative Mobile Manipulator Solution for Modern Flexible Manufacturing Processes." Sensors 19, no. 24 (December 9, 2019): 5414. http://dx.doi.org/10.3390/s19245414.

Full text

Abstract:

There is a paradigm shift in current manufacturing needs that is causing a change from the current mass-production-based approach to a mass customization approach where production volumes are smaller and more variable. Current processes are very adapted to the previous paradigm and lack the required flexibility to adapt to the new production needs. To solve this problem, an innovative industrial mobile manipulator is presented. The robot is equipped with a variety of sensors that allow it to perceive its surroundings and perform complex tasks in dynamic environments. Following the current needs of the industry, the robot is capable of autonomous navigation, safely avoiding obstacles. It is flexible enough to be able to perform a wide variety of tasks, being the change between tasks done easily thanks to skills-based programming and the ability to change tools autonomously. In addition, its security systems allow it to share the workspace with human operators. This prototype has been developed as part of THOMAS European project, and it has been tested and demonstrated in real-world manufacturing use cases.

APA, Harvard, Vancouver, ISO, and other styles

47

Pearn, Wen-Lea, Yu-Ting Tai, Kai-Bin Huang, and Pin-Lun Ku. "Accessing Manufacturing Yield for Gamma Wafer Sawing Processes in COG Packaging." IEEE Transactions on Components, Packaging and Manufacturing Technology 1, no. 8 (August 2011): 1282–91. http://dx.doi.org/10.1109/tcpmt.2011.2134853.

Full text

APA, Harvard, Vancouver, ISO, and other styles

48

Jansson, E., A. Korhonen, M. Hietala, and T. Kololuoma. "Development of a full roll-to-roll manufacturing process of through-substrate vias with stretchable substrates enabling double-sided wearable electronics." International Journal of Advanced Manufacturing Technology 111, no. 11-12 (November 6, 2020): 3017–27. http://dx.doi.org/10.1007/s00170-020-06324-4.

Full text

Abstract:

AbstractIn the recent years, there has been a growing interest towards printed stretchable electronics used in diagnostics, health-monitoring, and wearable applications. Double-sided electronic circuits with through-substrate vias offer a solution where the amount of printed circuitry and assembled SMDs (surface-mount devices) in direct contact with the human skin can be minimized. This improves not only the wearability and cost-effectiveness of the printed electronic devices but also the product safety and comfort to wear. Another factor decreasing the unit costs in printed electronics is the use of high volume, high speed, and continuous roll-to-roll (R2R) manufacturing processes. In this current paper, a full R2R process for the manufacturing of through-substrate vias on stretchable thermoplastic polyurethane (TPU) substrate was developed and verified. The through-substrate via-holes were manufactured in R2R using either laser-cutting or die-cutting. Rotary screen printing was used to print conductive tracks onto both sides of the stretchable substrate and to fill the via-holes. Eventually, conductive and stretchable through-substrate vias with low sheet resistance and low resistance deviation were reliably achieved with the developed process.

APA, Harvard, Vancouver, ISO, and other styles

49

Torbacki, Witold. "Analytic Method for Decision Support of Blockchain Technology Supplier Selection in Industry 4.0 Era." Multidisciplinary Aspects of Production Engineering 3, no. 1 (September 1, 2020): 296–307. http://dx.doi.org/10.2478/mape-2020-0026.

Full text

Abstract:

AbstractThe article presents the issues covering the modern methods of securing data in both manufacturing processes and companies within the concept of Industry 4.0. In this approach, research problems arose how to implement the right method of secure data sending in sales, manufacturing and distribution processes. It is a very important issue for manufacturing companies as well as how the process of sending electronic data should be safely conducted. While current researches concentrated on the method of blockchain secured electronic documents, there is almost no research concentrating on blockchain integrator selection criteria. The main purpose of this paper is to provide a decision assistance model based on multiple criteria decision analysis technique. Also, mutual relationships between parameters for the assessment of integrators are established. In the article, a Multi-Criteria Decision Analysis (MCDA) was used to assess these characteristics. The Decision Making Trial and Evaluation Laboratory (DEMATEL) technique was chosen for this assessment.

APA, Harvard, Vancouver, ISO, and other styles

50

Liu, Yang, Zhi Sheng Zhang, and Jin Fei Shi. "A Key Parameters Analysis Method of the Quality Control in the Semiconductor Multiple Manufacturing Processes Based on Functional Data Analysis Method." Advanced Materials Research 139-141 (October 2010): 1660–65. http://dx.doi.org/10.4028/www.scientific.net/amr.139-141.1660.

Full text

Abstract:

The quality of the semiconductor products is defined by a series of the key performance parameters which have some certain relations to the electronic test parameters generated among the multiple manufacturing processes. Aimed at the quality control problem of the multiple manufacturing processes, a FDA (functional data analysis) method has been used and got the mapping relationship between the process parameters of the product lines and the product quality characteristic. A simple Change-Point hypothesis has been tested to analyze the data curves generated by the FDA method, and the key process variables have been found. Then, the equalization between the new test result and the old one has been verified by the Kolmogorov-Smirnov 2-sample test method. Some multiple manufacturing processes test data, which was collected from a semiconductor product workshop, has been modeled and analyzed. And the analysis results can illustrate the key factors of the process quality control in the multiple manufacturing processes and approach the reduction of the test times and the improvement of the efficiency and effectiveness of the equipment.

APA, Harvard, Vancouver, ISO, and other styles

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!