Dissertations / Theses: 'Electronic manufacturing processes'

1

George, Gikku J. "A simulation model to analyze post reflow processes at an electronics manufacturing facility." Diss., Online access via UMI:, 2006.

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2

Ma, Hongtao Johnson R. Wayne Suhling J. C. "Characterization of lead-free solders for electronic packaging." Auburn, Ala., 2007. http://repo.lib.auburn.edu/2006%20Fall/Dissertations/MA_HONGTAO_31.pdf.

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3

Krauss, Alan. "Control of run-by-run processes with applications to large-area material deposition." Diss., Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/14685.

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4

Li, Jing. "Evaluation and improvement of the robustness of a PCB pad in a lead-free environment." Diss., Online access via UMI:, 2007.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007.
Includes bibliographical references.

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5

Hinshaw, Robert Bruce Lall Pradeep. "Reliability of lead-free and advanced interconnects in fine pitch and high I/O electronics subjected to harsh thermo-mechanical environments." Auburn, Ala, 2009. http://hdl.handle.net/10415/1907.

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6

Wang, Qing Johnson R. Wayne Gale W. F. "Mechanical properties and microstructure invesitigation of SN-AG-CU lead free solder for electronic package applications." Auburn, Ala., 2005. http://repo.lib.auburn.edu/2005%20Summer/doctoral/WANG_QING_29.pdf.

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7

Woo, Belemy Hok Chung. "Solderability & microstructure of lead-free solder in leadframe packaging." access abstract and table of contents access full-text, 2005. http://libweb.cityu.edu.hk/cgi-bin/ezdb/dissert.pl?msc-ap-b21175214a.pdf.

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Thesis (M.Sc.)--City University of Hong Kong, 2005.
At head of title: City University of Hong Kong, Department of Physics and Materials Science, Master of Science in materials engineering & nanotechnology dissertation. Title from title screen (viewed on Sept. 4, 2006) Includes bibliographical references.

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8

Shantaram, Sandeep Lall Pradeep. "Explicit finite element modeling in conjunction with digital image correlation based life prediction of lead-free electronics under shock-impact." Auburn, Ala, 2009. http://hdl.handle.net/10415/1894.

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9

Mee, Christine. "Spectrophotometric studies of individual components of a cupric chloride etchant used in printed wiring board manufacturing processes /." Online version of thesis, 1986. http://hdl.handle.net/1850/8841.

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10

Iyengar, Deepti Raju Lall Pradeep. "Initialization and progression of damage in lead free electronics under drop impact." Auburn, Ala, 2008. http://repo.lib.auburn.edu/EtdRoot/2008/FALL/Mechanical_Engineering/Thesis/Iyengar_Deepti_35.pdf.

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11

Mirza, Fahad. "Investigation of the impact response of Pb-free electronic assemblies and comparison of drop with cyclic 4-point bend test." Diss., Online access via UMI:, 2007.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2007.
Includes bibliographical references.

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12

Marquez, de Tino Ursula. "Reduction of nitrogen consumption of lead-free reflow processes and prediction models for behaviors of lead-free assemblies." Diss., Online access via UMI:, 2009.

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Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009.
Includes bibliographical references.

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13

Bhalerao, Vikram. "Process development and reliability study for 01005 components in a lead-free assembly environment." Diss., Online access via UMI:, 2008.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2008.
Includes bibliographical references.

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14

Raut, Rahul. "Thermal management of heat sensitive components in Pb-free assembly." Diss., Online access via UMI:, 2005.

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15

Tang, Zhenming. "Interfacial reliability of Pb-free flip-chip BGA package." Diss., Online access via UMI:, 2008.

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Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2008.
Includes bibliographical references.

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16

Vishwanathan, Krishnan. "Process development and microstructural analysis of capacitor filter assemblies using lead free solder preforms." Diss., Online access via UMI:, 2007.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007.
Includes bibliographical references.

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17

Shah, Vatsal. "Pb-free process development and microstructural analysis of capacitor filter assemblies using solder preforms." Diss., Online access via UMI:, 2005.

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18

Srinivasan, Guruprasad. "Evaluation of secondary wire bond integrity on silver plated and nickel/palladium based lead frame plating finishes." Diss., Online access via UMI:, 2008.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2008.
Includes bibliographical references.

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19

Tumne, Pushkraj Satish. "Investigation of bulk solder and intermetallic failures in PB free BGA by joint level testing." Diss., Online access via UMI:, 2009.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department or Systems Science and Industrial Engineering, 2009.
Includes bibliographical references.

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20

Dhakal, Ramji. "Failure mechanism of lead-free Sn-Ag-Cu solder BGA interconnects." Diss., Online access via UMI:, 2005.

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21

Majeed, Sulman. "Rework & reliability of area array components." Diss., Online access via UMI:, 2009.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engfineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009.
Includes bibliographical references.

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22

Brooker, Alan D. "A study by Auger electron and X-ray spectroscopies of vacuum brazing." Thesis, University of Surrey, 1986. http://epubs.surrey.ac.uk/848467/.

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Brazing may be described as more of an art than a science , there is little comprehension of the basic mechanisms governing brazing in air or vacuum. Consequently the behaviour of the Gold 18% Nickel brazing alloy in vacuum was studied using the novel techniques of hot-stage scanning electron microscopy with simultaneous bulk and surface analysis. The work demonstrates that careful control of experimental conditions allows both Auger electron and X-Ray spectroscopies (AES and EDXA) to be carried out at high spatial and energy resolutions , with good signal to noise in a realistic analyical time. Combining post-brazing examination of samples heated in a UHV oven , with real-time studies of braze powder/substrate combinations on a heating stage in an Auger microprobe , revealed several important mechanisms. Vacuum brazing is a two-stage process; oxide penetration followed by wetting and spreading via a suboxide route. AES analysis showed that oxide penetration is achieved by reduction as a result of low oxygen partial pressures and high carbon activities , in the system as a whole , or locally (for example under or around a molten braze droplet) , leaving an oxide-free surface , or a discontinuous , penetrable oxide. After penetration has occurred wetting and spreading continues along the metal/metal-oxide interface. Flow may be impeded by residual oxide resisting the advancing liquid which is trying to disbond it. Alternatively , interdiffusion of the braze metal and substrate allows pick-up of elements which raise the melting temperature of the braze alloy and causes solidification. EDX analysis and digital element mapping during interdiffusion and solidification illustrates that the periphery of the braze pools are most affected , and that further elevating the temperature initially caused remelting , but eventually resulted in second phase formation in accord with the Au/Ni/Fe equilibrium diagram.

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23

Panhalkar, Neeraj. "Hierarchical Data Structures for Optimization of Additive Manufacturing Processes." University of Cincinnati / OhioLINK, 2015. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1439310812.

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24

Sadiq, Muhammad. "Design and fabrication of lanthanum-doped Sn-Ag-Cu lead-free solder for next generation microelectronics applications in severe environment." Diss., Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/44762.

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Sn-Pb solder has long been used in the Electronics industry. But, due to its toxic nature and environmental effects, certain restrictions are made on its use and therefore many researchers are looking to replace it. Sn-3.0Ag-0.5Cu (SAC) solders are suggested as lead-free replacements but their coarse microstructure and formation of hard and brittle Inter-Metallic Compounds (IMCs) like Ag₃Sn and Cu₆Sn₅ have limited their use in high temperature applications. In this research work, RE elements, mostly lanthanum (La), are used as potential additives to SAC alloys. They reduce the surface free energy, refine the grain size and improve the mechanical and wetting properties of SAC alloys. An extensive experimental work has been performed on the microstructure evolution, bulk mechanical properties, individual phase (matrix and IMCs) mechanical properties, creep behavior and wettability performance of the SAC and SAC-La alloys, with different (La) doping. SEM and EDS have been used to follow the continuous growth of the IMCs at 150°C and 200°C and thus provide a quantitative measure in terms of their size, spacing and volume fraction. Grain size is measured at regular intervals starting from 10 hours up to 200 hours of thermal aging using Optical Microscope with cross polarized light. Bulk mechanical properties are evaluated using tensile tests at low strain rates. Individual phase mechanical properties like Young's modulus, hardness, strain rate sensitivity index and bulge effects are characterized with nanoindentation from 100 µN up to 5000 µN loadings at different temperatures of 25°C, 45°C, 65°C and 85°C. Creep experiments are performed at elevated temperatures with good fitting of Dorn creep and back-stress creep models. Activation energy measurements are made at 40°C, 80°C and 120°C. Wettability testing on copper substrates is used for surface tension, wetting force and contact angle measurements of SAC and SAC-La doped alloys at 250°C and 260°C.

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25

Lutwyche, Mark Ian. "The use of electron beam lithography and chemical etching for the fabrication of micromechanical structures." Thesis, University of Cambridge, 1991. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.239063.

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26

Mukherjee, Souvik. "Layout-level Circuit Sizing and Design-for-manufacturability Methods for Embedded RF Passive Circuits." Diss., Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/16131.

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The emergence of multi-band communications standards, and the fast pace of the consumer electronics markets for wireless/cellular applications emphasize the need for fast design closure. In addition, there is a need for electronic product designers to collaborate with manufacturers, gain essential knowledge regarding the manufacturing facilities and the processes, and apply this knowledge during the design process. In this dissertation, efficient layout-level circuit sizing techniques, and methodologies for design-for-manufacturability have been investigated. For cost-effective fabrication of RF modules on emerging technologies, there is a clear need for design cycle time reduction of passive and active RF modules. This is important since new technologies lack extensive design libraries and layout-level electromagnetic (EM) optimization of RF circuits become the major bottleneck for reduced design time. In addition, the design of multi-band RF circuits requires precise control of design specifications that are partially satisfied due to manufacturing variations, resulting in yield loss. In this work, a broadband modeling and a layout-level sizing technique for embedded inductors/capacitors in multilayer substrate has been presented. The methodology employs artificial neural networks to develop a neuro-model for the embedded passives. Secondly, a layout-level sizing technique for RF passive circuits with quasi-lumped embedded inductors and capacitors has been demonstrated. The sizing technique is based on the circuit augmentation technique and a linear optimization framework. In addition, this dissertation presents a layout-level, multi-domain DFM methodology and yield optimization technique for RF circuits for SOP-based wireless applications. The proposed statistical analysis framework is based on layout segmentation, lumped element modeling, sensitivity analysis, and extraction of probability density functions using convolution methods. The statistical analysis takes into account the effect of thermo-mechanical stress and process variations that are incurred in batch fabrication. Yield enhancement and optimization methods based on joint probability functions and constraint-based convex programming has also been presented. The results in this work have been demonstrated to show good correlation with measurement data.

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27

Motaabbed, Asghar B. 1959. "A knowledge acquisition scheme for fault diagnosis in complex manufacturing processes." Thesis, The University of Arizona, 1992. http://hdl.handle.net/10150/278266.

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This thesis introduces the problem of knowledge acquisition in developing a Trouble Shooting Guide (TSG) for equipment used in integrated circuit manufacturing. TSG is considered as a first step in developing an Expert Diagnostic System (EDS). The research is focused on the acquisition and refinement of actual knowledge from the manufacturing domain, and a Hierarchical Data Collection (HDC) system is introduced to solve the problem of bottleneck in developing EDS. An integrated circuit manufacturing environment is introduced, and issues relating to the collection and assessment of knowledge concerning the performance of the machine park are discussed. Raw data about equipment used in manufacturing environment is studied and results are discussed. A systematic classification of symptoms, failures, and repair activities is presented.

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28

de, Silveira Carl. "THE CHALLENGE OF REENGINEERING IN THE FABRICATION OF FLIGHT ELECTRONICS." International Foundation for Telemetering, 1996. http://hdl.handle.net/10150/608389.

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International Telemetering Conference Proceedings / October 28-31, 1996 / Town and Country Hotel and Convention Center, San Diego, California
As we adopt and implement the doctrines of reengineering, we at NASA/Jet Propulsion Laboratory (JPL) are asked to make a giant leap in how we think of and design SpaceCraft. We call what we are doing a revolution, since we are not “evolving” to the next step in our activity, but literally leaping beyond it. This is fully in concert with the concepts of reengineering, in that areas that need to be changed are indeed literally invented anew. To be successful, JPL and its industry partners, must perfect processes, techniques and methods that allow them to work together at all levels of the SpaceCraft development cycle. If all other parts of the discipline have moved on and changed, but a key portion remains locked in a time warp of yesterday, we will not be able to reach our desired goal. At the present time change is occurring all over JPL, and it is our intent to describe how it applies to areas where prototype, or one of a kind hardware are fabricated, and how these areas might look when new approaches to doing business are applied. Since all activities in an organization must attain similar levels of expertise or be in danger of hampering the entire process, the issues of Packaging Engineering, Manufactureability, and fabrication become key items.

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29

Francis, Zachary Ryan. "The Effects of Laser and Electron Beam Spot Size in Additive Manufacturing Processes." Research Showcase @ CMU, 2017. http://repository.cmu.edu/dissertations/909.

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In this work, melt pool size in process mapped in power-velocity space for multiple processes and alloys. In the electron beam wire feed and laser powder feed processes, melt pool dimensions are then related to microstructure in the Ti-6Al-4V alloy. In the electron beam wire feed process, work by previous authors that related prior beta grain size to melt pool area is extended and a control scheme is suggested. In the laser powder feed process, in situ thermal imaging is used to monitor melt pool length. Real time melt pool length measurements are used in feedback control to manipulate the resulting microstructure. In laser and electron beam direct metal additive manufacturing, characteristics of the individual melt pool and the resulting final parts are a product of a variety of process parameters. Laser or electron beam spot size is an important input parameter that can affect the size and shape of a melt pool, and has a direct influence on the formation of lack-of-fusion and keyholing porosity. In this work, models are developed to gain a better understanding of the effects of spot size across different alloys and processes. Models are validated through experiments that also span multiple processes and alloys. Methods to expand the usable processing space are demonstrated in the ProX 200 laser powder bed fusion process. In depth knowledge of process parameters can reduce the occurrence of porosity and flaws throughout processing space and allow for the increased use of non-standard parameter sets. Knowledge of the effects of spot size and other process parameters can enable an operator to expand the usable processing space while avoiding the formation of some types of flaws. Based on simulation and experimental results, regions where potential problems may occur are identified and process parameter based solutions are suggested. Methods to expand the usable processing space are demonstrated in the ProX 200 laser powder bed fusion process. In depth knowledge of process parameters can reduce the occurrence of porosity and flaws throughout processing space and allow for the increased use of non-standard parameter sets.

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30

Olsson, John Gerhard, and Yuanjing Xu. "Industry 4.0 Adoption in the Manufacturing Process : Multiple case study of electronic manufacturers and machine manufacturers." Thesis, Linnéuniversitetet, Institutionen för ekonomistyrning och logistik (ELO), 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:lnu:diva-74989.

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Background: Changing market conditions and increasing competition drive companies to increase their collaboration along the supply chain. Technological innovations enable businesses to increase their integration tremendously. The fourth industrial revolution (Industry 4.0) enables the integration of information technology with industrial technology. The adoption of Industry 4.0 includes many complex technologies that come with challenges for many organizations. Previous research suggests that conventional manufacturing might have to be adjusted to Industry 4.0. Purpose: This thesis identifies and analyzes potential challenges of Industry 4.0 adoption for electronics manufacturers and machine manufacturers and analyzes how processes in manufacturing need to be adjusted to successfully implement Industry 4.0. The purpose of this thesis is to contribute to successful Industry 4.0 adoption in the manufacturing process and therefore to contribute to technological advancement. Method: This thesis conducts a multiple case study and gathers qualitative data by conducting semi-structured interviews. Findings & conclusion: Challenges identified for most companies are standardization, management support, skills and costs. Most companies face data and compatibility challenges. Some companies face the challenge of complexity, information security, scalability and network externalities. Companies with higher levels of maturity are less likely to face environmental challenges.Lean Management was identified as a prerequisite for Industry 4.0 adoption. The adoption of Industry 4.0 is likely to lead to a paperless factory. Furthermore, changes concerning the infrastructure are a main finding. Moreover, it was found that Industry 4.0 does not require major changes from conventional manufacturing processes.

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31

Liu, Yueli Johnson R. Wayne. "Lead-free assembly and reliability of chip scale packages and 01005 components." Auburn, Ala., 2006. http://hdl.handle.net/10415/1311.

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32

Narra, Sneha Prabha. "Melt Pool Geometry and Microstructure Control Across Alloys in Metal Based Additive Manufacturing Processes." Research Showcase @ CMU, 2017. http://repository.cmu.edu/dissertations/914.

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There is growing interest in using additive manufacturing for various alloy systems and industrial applications. However, existing process development and part qualification techniques, both involve extensive experimentation-based procedures which are expensive and time-consuming. Recent developments in understanding the process control show promise toward the efforts to address these challenges. The current research uses the process mapping approach to achieve control of melt pool geometry and microstructure in different alloy systems, in addition to location specific control of microstructure in an additively manufactured part. Specifically, results demonstrate three levels of microstructure control, starting with the prior beta grain size control in Ti-6Al-4V, followed by cell (solidification structure) spacing control in AlSi10Mg, and ending with texture control in Inconel 718. Additionally, a prediction framework has been presented, that can be used to enable a preliminary understanding of melt pool geometry for different materials and process conditions with minimal experimentation. Overall, the work presented in this thesis has the potential to reduce the process development and part qualification time, enabling the wider adoption and use of additive manufacturing in industry.

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33

Anson, Scott J. "Analysis of lead free tin-silver-copper and tin-lead solder wetting reactions." Diss., Online access via UMI:, 2007.

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34

Mohan, Karuniya. "Ensemble Modelling of in situ Feature Variables for Printed Electronics Manufacturing with in situ Process Control Potential." Thesis, Virginia Tech, 2017. http://hdl.handle.net/10919/84947.

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Aerosol Jet® Printing (AJP) is a direct-write based additive manufacturing process that is capable of printing electronics with fine features and various materials. It eliminates the complex masking process in traditional semiconductor manufacturing, thus enables flexible electronics design and reduces manufacturing cost. However, the quality control of AJP processes is still a challenging problem, primarily due to the lack of understanding of the potential root causes of the quality issues. There is a complex interaction among process setting variables, in situ feature variables, and quality variables in AJP processes. In this research, an ensemble model strategy is proposed to quantify the effect of the process setting variables on the in situ feature variables, and the effect of the in situ feature variables on quality variables in a two-level hierarchical way. By identifying significant in situ feature variables as responses for the process setting variables, as well as predictors for product quality in a joint estimation problem, the proposed models have a hierarchical variable relationship to enable in situ process control for variation reduction and defect mitigation. A real case study is investigated to demonstrate the advantages of the proposed method.
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35

Santos, José Altair Ribeiro dos. "Proposta de modelo inteligente de definição de produto para atendimento à diretiva RoHS." Universidade Tecnológica Federal do Paraná, 2015. http://repositorio.utfpr.edu.br/jspui/handle/1/1379.

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As empresas de manufatura necessitam integrar seus processos internos digitalmente para se tornarem mais competitivas e entregarem produtos com maior qualidade ao mercado consumidor. Informações definidas nas primeiras etapas de projeto precisam ser recuperadas em todas as fases do ciclo de vida de um produto. Para alcançar este objetivo são necessários modelos de informação que incorporem inteligência e permitam a representação do mundo real. Por outro lado, fabricantes de produtos eletroeletrônicos precisam cumprir requisitos ambientais presentes em marcos regulatórios, como a Diretiva RoHS, para poderem vender seus equipamentos em diversos países. O presente trabalho propõe a aplicação de modelos semânticos para ajudar as empresas a cumprir os requisitos estabelecidos pela Diretiva RoHS. O modelo, criado usando uma ontologia de referência, estabelece relações semânticas entre entidades que representam fases do ciclo de vida do produto, estruturas de produtos e objetos de negócios. Processos de negócio modelados permitem identificar fluxos de informação, bem como atividades que estão ligadas aos requisitos RoHS, percebidas por meio da geração de relatórios disponíveis no framework denominado Projeto Essential. O modelo semântico resultante é, portanto, útil para converter as necessidades relacionadas com o meio ambiente, endereçando requisitos através de um processo de desenvolvimento de produtos que aborda a diretiva RoHS. Um produto eletroeletrônico fabricado por indústrias nacionais foi selecionado para demonstrar a viabilidade da solução proposta.
Manufacturing companies need to integrate their internal processes digitally to become more competitive and deliver higher quality products to the consumer market. Information defined at early design stages needs to be recovered at all stages of the life cycle of a product. To accomplish this, information models that incorporate intelligence and enable the representation of the real world are necessary. On the other hand, electronic products manufacturers need to comply with environmental requirements present in regulatory frameworks as the RoHS Directive in order to offer their products in several countries. The present work proposes the application of semantic models for helping companies meet the requirements established by the RoHS Directive. A model, created using a reference ontology, establishes semantic relationships between entities that represent product lifecycle stages, product structure and business objects. Business processes, modeled in the form of activity and information flows, are linked to RoHS requirements that can be viewed through the reports in the Essential Project open source framework. The resulting semantic model is, therefore, useful for converting environment-related needs to design requirements through a product development process that addresses the RoHS Directive. A consumer electronics product has been selected for demonstrating the feasibility of the proposed solution.

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36

Subbarayan, Guhan. "A systematic approach for selection of best PB-free printed circuit board (PCB) surface finish." Diss., Online access via UMI:, 2007.

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37

Zanotto, Thiago Tavares. "Influência da otimização de trajetórias ociosas do bico extrusor em processo de manufatura aditiva." Universidade Tecnológica Federal do Paraná, 2017. http://repositorio.utfpr.edu.br/jspui/handle/1/2915.

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A manufatura aditiva é um processo de fabricação que se caracteriza por adicionar material camada a camada, apresentando assim pouca limitação geométrica. Esta tecnologia tem revolucionado os processos produtivos, podendo ser inclusive empregados como parte dos produtos finais. Uma das tecnologias existentes é baseada no princípio de extrusão de material, o qual se caracteriza por adicionar um filamento polimérico através de um cabeçote extrusor. Dentro do planejamento do processo deste princípio existe a etapa de planejamento da trajetória, onde é definida a estratégia de deposição de material e qual a sequência de deposição do mesmo. Neste processo observam-se movimentos ociosos (sem deposição de filamento) do cabeçote de extrusão. Vários estudos já foram realizados a fim de minimizar os tempos ociosos, envolvendo algoritmos de otimização de trajetória, porém sem a preocupação da verificação de possíveis efeitos dessa otimização nas peças produzidas. Portanto, esse trabalho tem por objetivo avaliar a influência do planejamento de trajetória sem e com otimização nas propriedades mecânicas, dimensional e no tempo de fabricação no princípio de extrusão de material utilizando o poli (ácido láctico - PLA) como material. Também foi realizado um experimento onde foi possível analisar a influência do tempo ocioso do cabeçote extrusor durante a deposição de filamento em uma mesma camada. Para isso foi programado uma interrupção do bico extrusor durante a deposição do filamento. Corpos de prova foram fabricados utilizando a impressora 3D Cloner em diferentes quantidades. Ensaios de tração, flexão a 3 pontos, comparação do tempo de fabricação e avaliação dimensional foram realizadas. Os resultados mostraram uma variação de 7% e 10% na tensão de ruptura a tração e flexão, respectivamente, entre os diferentes planejamentos de trajetória testados. Já para os experimentos com interrupção do bico extrusor a variação chegou até 46% (decréscimo na resistência a flexão). Em relação ao tempo de fabricação entre os diferentes planejamentos testados houve uma diferença de até 42,7% no tempo de fabricação e na avaliação dimensional observou-se pouca variação entre os métodos testados.
Additive manufacturing is characterized by adding material layer by layer, thus presenting little geometric limitation. This technology has revolutionized the production process and can even be employed as part of the final product. One of the existing technologies is based on the material extrusion principle, which is characterized by adding a polymeric filament through an extruder head. One of the stage of the process planning in this principle is the path planning, where the strategy and the sequence of the material deposition is defined. In this process there are idle movements (without material deposition) of the extrusion head. Several studies have already been carried out to minimize the idle time, involving path optimization algorithms, but without considering the possible side effects caused by this optimization in the manufactured parts. Therefore, the aim of this work is to evaluate the influence of path planning with and without optimization on mechanical properties, dimensional and building time of manufactured parts based in the principle of material extrusion, using polylactic acid (PLA). An experiment also was performed where it was possible to analyze the influence of the idle time of the extruder head during the material deposition in the same layer. For that an interruption of the extruder head during the material deposition was programmed. Different numbers of specimens were fabricated using 3D Cloner printer. Building time and dimensional evaluation were performed, together with tensile and 3-point bending tests. The results of tensile and bending showed a variation of 7% and 10%, on tensile at break, respectively when compared to the different path planning tested. In the experiments with interruption of the nozzle extruder the variation reached up to 46% (decrease in flexural strength). Regarding the building time between the different path planning tested, there was a difference up to 42.7% and in the dimensional evaluation it was observed small variation between the tested methods.

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38

Ramkumar, S. Manian. "Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead-free surface mount electronics assembly." Diss., Online access via UMI:, 2008.

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39

Kirkpatrick, Timothy. "The kinetics of tin solidification in lead-free solder joints." Diss., Online access via UMI:, 2006.

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40

Li, Yuquan Johnson Robert Wayne. "Flip chip and heat spreader attachment development." Auburn, Ala, 2009. http://hdl.handle.net/10415/1624.

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41

Venkatadri, Vikram. "Quantitative assessment of long term aging effects on the mechanical properties of lead free solder joints." Diss., Online access via UMI:, 2009.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009.
Includes bibliographical references.

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Bukhari, Sarfaraz. "Evaluation of the effects of processing conditions on shear strength in Pb-free surface mount assembly." Diss., Online access via UMI:, 2004. http://wwwlib.umi.com/dissertations/fullcit/1422361.

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Pei, Min. "Effects of Lanthanum doping on the microstructure and mechanical behavior of a SnAg alloy." Diss., Available online, Georgia Institute of Technology, 2007, 2007. http://etd.gatech.edu/theses/available/etd-03272007-120709/.

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Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2007.
Neu, Richard W., Committee Member ; Sanders, Thomas H. Jr., Committee Member ; Wong, C.P., Committee Member ; McDowell, David L., Committee Member ; Qu, Jianmin, Committee Chair.

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Tudero, Aitor, and Julen Azkue. "Emulation of a manufacturing process : Focusing on maintenance and operator training." Thesis, Högskolan i Skövde, Institutionen för ingenjörsvetenskap, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:his:diva-14032.

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Having well-trained operators is a crucial need for Volvo Group Truck Operations (GTO). Mistakes from the factory staff may cause the production line to stop, and lead to economic losses. For this reason, Volvo GTO has decided to investigate the possibility of creating an emulation model from the production line and using it to train operators and maintenance personnel. The aim of this thesis is to develop an Operator Training Station (OTS) for the OP035 of the Volvo GTO Production Line 6. In the first part, a literature research was conducted, from which the authors gained insight into related fields such as emulation, virtual environments, and operator training. After that, an emulation model of theOP035 was created using some hardware from the factory. The real PLC program was analyzed and then modified in order to implement it to the emulation model. Then, communications were established between the different parts; emulation model and PLC program. Finally, a research of the common failures and problems of the production line was carried out, with the aim of being able to reproduce them in the Operator Training Station. Once the OTS was implemented, several tests had undergone to validate its behavior. These experiments verified that the emulation model was an accurate representation of the real system and validated its appropriateness for the operator training application

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Milton, Samuel. "Study on the machinability and surface integrity of Ti6Al4V produced by Selective Laser Melting (SLM) and Electron Beam Melting (EBM) processes." Thesis, Tours, 2018. http://www.theses.fr/2018TOUR4011/document.

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Les technologies de fabrication additive(FA) basées sur la technique de fusion laser sur lit de poudres, telles que les procédés de fusion sélective laser (Selective Laser Melting ‘SLM’) et de fusion par faisceau d'électrons (Electron Beam Melting ‘EBM’), ne cessent de se développer afin de produire des pièces fonctionnelles principalement dans les domaines aérospatial et médical. Le procédé de fabrication additive offre de nombreux avantages, tels que la liberté de conception, la réduction des étapes de fabrication, la réduction de la matière utilisée, et la réduction de l'empreinte carbone lors de la fabrication d'un composant. Néanmoins, les pièces obtenues nécessitent une opération d’usinage de finition afin de satisfaire les tolérances dimensionnelles et l’état de surface
Additive Manufacturing (AM) techniques based on powder bed fusion like Selective Laser Melting(SLM) and Electron Beam Melting processes(EBM) are being developed to make fully functional parts mainly in aerospace and medical sectors. There are several advantages of using AM processes like design freedom, reduced process steps, minimal material usage and reduced carbon footprint while producing a component. Nevertheless, the parts are built with near net shape and then finish machined to meet the demands of surface quality and dimensional tolerance

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Li, Yi. "High performance electrically conductive adhesives (ecas) for leadfree interconnects." Diss., Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/26518.

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Electrically conductive adhesives (ECAs) are one of the lead-free interconnect materials with the advantages of environmental friendliness, mild processing conditions, fewer processing steps, low stress on the substrates, and fine pitch interconnect capability. However, some challenging issues still exist for the currently available ECAs, including lower electrical conductivity, conductivity fatigue in reliability tests, limited current-carrying capability, poor impact strength, etc. The interfacial properties is one of the major considerations when resolving these challenges and developing high performance conductive adhesives. Surface functionalization and interface modification are the major approaches used in this thesis. Fundamental understanding and analysis of the interaction between various types of interface modifiers and ECA materials and substrates are the key for the development of high performance ECA for lead-free interconnects. The results of this thesis provide the guideline for the enhancement of interfacial properties of metal-metal and metal-polymer interactions. Systematic investigation of various types of ECAs contributes to a better understanding of materials requirements for different applications, such as surface mount technology (SMT), flip chip applications, flat panel display modules with high resolution, etc. Improvement of the electrical, thermal and reliability of different ECAs make them a potentially ideal candidate for high power and fine pitch microelectronics packaging option.

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Sowade, Enrico, Eloi Ramon, Kalyan Yoti Mitra, Carme Martínez-Domingo, Marta Pedró, Jofre Pallarès, Fausta Loffredo, et al. "All-inkjet-printed thin-film transistors: manufacturing process reliability by root cause analysis." Universitätsbibliothek Chemnitz, 2016. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-211665.

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We report on the detailed electrical investigation of all-inkjet-printed thin-film transistor (TFT) arrays focusing on TFT failures and their origins. The TFT arrays were manufactured on flexible polymer substrates in ambient condition without the need for cleanroom environment or inert atmosphere and at a maximum temperature of 150 °C. Alternative manufacturing processes for electronic devices such as inkjet printing suffer from lower accuracy compared to traditional microelectronic manufacturing methods. Furthermore, usually printing methods do not allow the manufacturing of electronic devices with high yield (high number of functional devices). In general, the manufacturing yield is much lower compared to the established conventional manufacturing methods based on lithography. Thus, the focus of this contribution is set on a comprehensive analysis of defective TFTs printed by inkjet technology. Based on root cause analysis, we present the defects by developing failure categories and discuss the reasons for the defects. This procedure identifies failure origins and allows the optimization of the manufacturing resulting finally to a yield improvement.

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Holmberg, Jonas. "Surface integrity on post processed alloy 718 after nonconventional machining." Licentiate thesis, Högskolan Väst, Avdelningen för avverkande och additativa tillverkningsprocesser (AAT), 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:hv:diva-12191.

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There is a strong industrial driving force to find alternative production technologies in order to make the production of aero engine components of superalloys even more efficient than it is today. Introducing new and nonconventional machining technologies allows taking a giant leap to increase the material removal rate and thereby drastically increase the productivity. However, the end result is to meet the requirements set for today's machined surfaces.The present work has been dedicated to improving the knowledge of how the non-conventional machining methods Abrasive Water Jet Machining, AWJM, Laser Beam Machining, LBM, and Electrical Discharge Machining, EDM, affect the surface integrity. The aim has been to understand how the surface integrity could be altered to an acceptable level. The results of this work have shown that both EDM and AWJM are two possible candidates but EDM is the better alternative; mainly due to the method's ability to machine complex geometries. It has further been shown that both methods require post processing in order to clean the surface and to improve the topography and for the case of EDM ageneration of compressive residual stresses are also needed.Three cold working post processes have been evaluated in order to attain this: shot peening, grit blasting and high pressure water jet cleaning, HPWJC. There sults showed that a combination of two post processes is required in order to reach the specified level of surface integrity in terms of cleaning and generating compressive residual stresses and low surface roughness. The method of high pressure water jet cleaning was the most effective method for removing the EDM wire residuals, and shot peening generated the highest compressive residual stresses as well as improved the surface topography.To summarise: the most promising production flow alternative using nonconventional machining would be EDM followed by post processing using HPWJC and shot peening.

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Jiang, Hongjin. "Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/22636.

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Thesis (Ph. D.)--Chemistry and Biochemistry, Georgia Institute of Technology, 2008.
Committee Chair: Dr. C. P. Wong; Committee Member: Dr. Boris Mizaikoff; Committee Member: Dr. Rigoberto Hernandez; Committee Member: Dr. Z. John Zhang; Committee Member: Dr. Z.L. Wang.

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Birkett, Martin. "Optimisation of the performance characteristics of Cu-Al-Mo thin film resistors." Thesis, Northumbria University, 2009. http://nrl.northumbria.ac.uk/2013/.

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This thesis presents a novel approach to the manufacture of thin film resistors using a new low resistivity material of copper, aluminium and molybdenum, which under industrially achievable optimised process conditions, is shown to be capable of producing excellent temperature coefficient of resistance (TCR) and long term stability properties. Previous developments in the field of thin film resistors have mainly centred around the well established resistive materials such as nickel-chromium, tantalum-nitride and chromium-silicon-monoxide. However recent market demands for lower value resistors have been difficult to satisfy with these materials due to their inherent high resistivity properties. This work focuses on the development and processing of a thin film resistor material system having lower resistivity and equal performance characteristics to that of the well established materials. An in depth review of thin film resistor materials and manufacturing processes was undertaken before the electrical properties of a binary thin film system of copper and aluminium were assessed. These properties were further enhanced through the incorporation of a third doping element, molybdenum, which was used to reduce the TCR and improve the electrical stability of the film. Once the desired chemical composition was established, the performance of the film was then fine tuned through optimisation of critical manufacturing process stages such as sputter deposition, heat treatment and laser adjustment. The results of these investigations were then analysed and used to generate a set of optimum process conditions, suitable for repeatedly producing thin film resistors in the 1 to 10Ω resistance range, to tolerances of less than ±0.25% and TCR values better than ±15ppm/oC.

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Dissertations / Theses on the topic 'Electronic manufacturing processes'

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