Relevant bibliographies by topics / Electronic manufacturing processes

Academic literature on the topic 'Electronic manufacturing processes'

Author: Grafiati
Published: 10 December 2022
Last updated: 28 January 2023

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Journal articles on the topic "Electronic manufacturing processes"

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Michaelides, Roula, Dennis Kehoe, and Matthew Tickle. "Using electronic Customer Relationship Management to improve manufacturing processes." International Journal of Agile Systems and Management 2, no. 3 (2007): 321. http://dx.doi.org/10.1504/ijasm.2007.015796.

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Seyedin, Shayan, Tian Carey, Adrees Arbab, Ladan Eskandarian, Sivasambu Bohm, Jong Min Kim, and Felice Torrisi. "Fibre electronics: towards scaled-up manufacturing of integrated e-textile systems." Nanoscale 13, no. 30 (2021): 12818–47. http://dx.doi.org/10.1039/d1nr02061g.

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Advances in materials development, fabrication processes, and applications for various fibre electronics are reviewed. Their integration into multifunctional electronic textiles and the key challenges in large-scale manufacturing are discussed.
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Palajova, Silvia, and Milan Gregor. "Simulation Metamodelling of Manufacturing Processes." Communications - Scientific letters of the University of Zilina 13, no. 4 (December 31, 2011): 51–54. http://dx.doi.org/10.26552/com.c.2011.4.51-54.

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Becker, K. F., S. Voges, P. Fruehauf, M. Heimann, S. Nerreter, R. Blank, M. Erdmann, et al. "Implementation of Trusted Manufacturing & AI-based process optimization into microelectronic manufacturing research environments." International Symposium on Microelectronics 2021, no. 1 (October 1, 2021): 000021–25. http://dx.doi.org/10.4071/1085-8024-2021.1.

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Abstract Digitization is one of the hot topics in all Industry 4.0 efforts that are currently discussed. Often the focus is on digitization of business processes with a financial/organizational perspective on manufacturing, so the tools are adapting to enterprise resource planning [ERP] and manufacturing execution system [MES] rather than on actual manufacturing issues on the shop floor. Within the SiEvEI 4.0 project, a research consortium from the area of electronics manufacturing is working on digitization for a manufacturing scenario where high value electronic goods are built in a distributed manufacturing environment. The key research topics addressed are the implementation of a Chain of Trust [CoT] for such a distributed manufacturing, i.e. and the application of artificial intelligence/machine learning to analyze and eventually optimize manufacturing processes. The paper will introduce the concept of both COT and AI-based process analysis that will later on transferred into a microelectronics production environment. Two reference processes are targeted, SMD assembly using fully automated manufacturing equipment and Solder Ball Application using a high-mix/low volume concept. As a result, the paper presents a concept of how to digitize manufacturing processes and use this digital description of a process combination to make a distributed manufacturing flow safe and increase product/process quality.
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Leckie, F. A., and R. M. McMeeking. "Processing and Manufacturing." Applied Mechanics Reviews 38, no. 10 (October 1, 1985): 1297–300. http://dx.doi.org/10.1115/1.3143697.

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The general problems associated with the mechanics of forming processes are discussed. Particular topics include: (i) processing of electronic devices; (ii) flexible robotic systems; (iii) manufacturing methods for modern materials; (iv) process control for optimal properties.
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Cobley, A. J. "Alternative surface modification processes in metal finishing and electronic manufacturing industries." Transactions of the IMF 85, no. 6 (November 2007): 293–97. http://dx.doi.org/10.1179/174591907x246528.

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Liang, R. C., Jack Hou, HongMei Zang, Jerry Chung, and Scott Tseng. "Microcup® displays: Electronic paper by roll-to-roll manufacturing processes." Journal of the Society for Information Display 11, no. 4 (2003): 621. http://dx.doi.org/10.1889/1.1825690.

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Li, Ji, Thomas Wasley, Duong Ta, John Shephard, Jonathan Stringer, Patrick J. Smith, Emre Esenturk, Colm Connaughton, Russell Harris, and Robert Kay. "Micro electronic systems via multifunctional additive manufacturing." Rapid Prototyping Journal 24, no. 4 (May 14, 2018): 752–63. http://dx.doi.org/10.1108/rpj-02-2017-0033.

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Purpose This paper aims to demonstrate the improved functionality of additive manufacturing technology provided by combining multiple processes for the fabrication of packaged electronics. Design/methodology/approach This research is focused on the improvement in resolution of conductor deposition methods through experimentation with build parameters. Material dispensing with two different low temperature curing isotropic conductive adhesive materials was characterised for their application in printing each of three different conductor designs, traces, z-axis connections and fine pitch flip chip interconnects. Once optimised, demonstrator size can be minimised within the limitations of the chosen processes and materials. Findings The proposed method of printing z-axis through layer connections was successful with pillars 2 mm in height and 550 µm in width produced. Dispensing characterisation also resulted in tracks 134 µm in width and 38 µm in height allowing surface mount assembly of 0603 components and thin-shrink small outline packaged integrated circuits. Small 149-µm flip chip interconnects deposited at a 457-µm pitch have also been used for packaging silicon bare die. Originality/value This paper presents an improved multifunctional additive manufacturing method to produce fully packaged multilayer electronic systems. It discusses the development of new 3D printed, through layer z-axis connections and the use of a single electrically conductive adhesive material to produce all conductors. This facilitates the surface mount assembly of components directly onto these conductors before stereolithography is used to fully package multiple layers of circuitry in a photopolymer.
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Ushijima, Hirobumi, Ken-ichi Nomura, Yasuyuki Kusaka, Shusuke Kanazawa, Yoshinori Horii, Mariko Fujita, and Noritaka Yamamoto. "Development of Manufacturing Processes for Novel Electronics by Print Technology." Journal of The Japan Institute of Electronics Packaging 21, no. 6 (September 1, 2018): 567–72. http://dx.doi.org/10.5104/jiep.21.567.

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MANDUTIANU, DAN, and SERBAN VOINEA. "Knowledge based processes in flexible manufacturing." International Journal of Computer Integrated Manufacturing 1, no. 3 (July 1988): 197–205. http://dx.doi.org/10.1080/09511928808944361.

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Dissertations / Theses on the topic "Electronic manufacturing processes"

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George, Gikku J. "A simulation model to analyze post reflow processes at an electronics manufacturing facility." Diss., Online access via UMI:, 2006.

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Ma, Hongtao Johnson R. Wayne Suhling J. C. "Characterization of lead-free solders for electronic packaging." Auburn, Ala., 2007. http://repo.lib.auburn.edu/2006%20Fall/Dissertations/MA_HONGTAO_31.pdf.

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Krauss, Alan. "Control of run-by-run processes with applications to large-area material deposition." Diss., Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/14685.

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Li, Jing. "Evaluation and improvement of the robustness of a PCB pad in a lead-free environment." Diss., Online access via UMI:, 2007.

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Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2007.
Includes bibliographical references.
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Hinshaw, Robert Bruce Lall Pradeep. "Reliability of lead-free and advanced interconnects in fine pitch and high I/O electronics subjected to harsh thermo-mechanical environments." Auburn, Ala, 2009. http://hdl.handle.net/10415/1907.

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Wang, Qing Johnson R. Wayne Gale W. F. "Mechanical properties and microstructure invesitigation of SN-AG-CU lead free solder for electronic package applications." Auburn, Ala., 2005. http://repo.lib.auburn.edu/2005%20Summer/doctoral/WANG_QING_29.pdf.

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Woo, Belemy Hok Chung. "Solderability & microstructure of lead-free solder in leadframe packaging." access abstract and table of contents access full-text, 2005. http://libweb.cityu.edu.hk/cgi-bin/ezdb/dissert.pl?msc-ap-b21175214a.pdf.

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Thesis (M.Sc.)--City University of Hong Kong, 2005.
At head of title: City University of Hong Kong, Department of Physics and Materials Science, Master of Science in materials engineering & nanotechnology dissertation. Title from title screen (viewed on Sept. 4, 2006) Includes bibliographical references.
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Shantaram, Sandeep Lall Pradeep. "Explicit finite element modeling in conjunction with digital image correlation based life prediction of lead-free electronics under shock-impact." Auburn, Ala, 2009. http://hdl.handle.net/10415/1894.

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Mee, Christine. "Spectrophotometric studies of individual components of a cupric chloride etchant used in printed wiring board manufacturing processes /." Online version of thesis, 1986. http://hdl.handle.net/1850/8841.

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Iyengar, Deepti Raju Lall Pradeep. "Initialization and progression of damage in lead free electronics under drop impact." Auburn, Ala, 2008. http://repo.lib.auburn.edu/EtdRoot/2008/FALL/Mechanical_Engineering/Thesis/Iyengar_Deepti_35.pdf.

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Books on the topic "Electronic manufacturing processes"

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Yung-Cheng, Lee, and Chen William T, eds. Manufacturing challenges in electronic packaging. London: Chapman & Hall, 1998.

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Lee, Y. C. Manufacturing Challenges in Electronic Packaging. Boston, MA: Springer US, 1998.

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IEEE/CHMT International Electronic Manufacturing Technology Symposium. (2nd 1986 San Francisco, Calif.). IEEE International Electronic Manufacturing Technology Symposium. New York: Institute of Electrical and Electronics Engineers, 1986.

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Donald, Brettner, ed. Process improvement in the electronics industry. New York: Wiley, 1992.

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IEEE/CHMT, International Electronic Manufacturing Technology Symposium (2nd 1986 San Francisco Calif ). Proceedings 1986. [New York, NY, U.S.A: IEEE, 1986.

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Lead-free implementation and production: A manufacturing guide. New York: McGraw-Hill, 2005.

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Matisoff, Bernard S. Handbook of electronics manufacturing engineering. 2nd ed. New York: Van Nostrand Reinhold, 1986.

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Matisoff, Bernard S. Handbook of electronics manufacturing engineering. 3rd ed. New York: Chapman & Hall, 1997.

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Matisoff, Bernard S. Handbook of electronics manufacturing engineering. 2nd ed. New York: Van Nostrand Reinhold, 1986.

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Handbook of electronics manufacturing engineering. 2nd ed. New York: Van Nostrand Reinhold, 1986.

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Book chapters on the topic "Electronic manufacturing processes"

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Poudelet, Louison, Anna Castellví, and Laura Calvo. "An Innovative (DIW-Based) Additive Manufacturing Process." In New Business Models for the Reuse of Secondary Resources from WEEEs, 65–80. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-74886-9_6.

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AbstractThis chapter will describe the activity of Fenix project that consisted in developing the hardware, infrastructure and processes to make possible the re-use of the recycled metals through an Additive Manufacturing (AM) method called Direct Ink Writing (DIW). It will first explain what is DIW and why it is an interesting way to give added value to recycled materials specially metals. It will then focus on the working principles and the parts of a DIW machine and end with a conclusion of the adequacy of this technology to new circular business models for the recycling of Waste of Electric and Electronic Equipment (WEEE).
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Matisoff, Bernard. "Standard Manufacturing Processes." In Handbook of Electronics Manufacturing Engineering, 121–254. Boston, MA: Springer US, 1997. http://dx.doi.org/10.1007/978-1-4615-6047-0_6.

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Matisoff, Bernard S. "Standard Manufacturing Processes." In Handbook of Electronics Manufacturing Engineering, 118–252. Dordrecht: Springer Netherlands, 1986. http://dx.doi.org/10.1007/978-94-011-7038-3_6.

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Kumar, Sanjay. "Electron Beam Powder Bed Fusion." In Additive Manufacturing Processes, 65–78. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-45089-2_4.

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Minkoff, Isaac. "Process Selection and Control/Computer Applications/Electronics Manufacturing Processes/Modelling of Processes." In Materials Processes, 109–25. Berlin, Heidelberg: Springer Berlin Heidelberg, 1992. http://dx.doi.org/10.1007/978-3-642-95562-4_7.

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Quezada, Jonnathan, Lorena Siguenza-Guzman, and Juan Llivisaca. "Optimization of Motorcycle Assembly Processes Based on Lean Manufacturing Tools." In Advances and Applications in Computer Science, Electronics and Industrial Engineering, 247–59. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-33614-1_17.

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Solis-Quinteros, Maria Marcela, Luis Alfredo Avila-Lopez, Carolina Zayas-Márquez, Teresa Carrillo-Gutierrez, and Karina Cecilia Arredondo-Soto. "Analysis of the Technological Capability of Linking SMEs in the Electronic Sector to Integrate into the Maquiladora Industry Electronic Sector in Tijuana, Baja California, Mexico." In Advances in Manufacturing, Production Management and Process Control, 376–87. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-20494-5_35.

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Priarone, Paolo C., Matteo Robiglio, Giuseppe Ingarao, and Luca Settineri. "Assessment of Cost and Energy Requirements of Electron Beam Melting (EBM) and Machining Processes." In Sustainable Design and Manufacturing 2017, 723–35. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-57078-5_68.

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Botello-Lara, Berónica, Margarita Gil-Samaniego Ramos, Juan Ceballos-Corral, and Arturo Sinue Ontiveros-Zepeda. "Are Productivity and Quality in Electronics Manufacturing Industry Affected by Human Factors? A Quantitative Analysis Using Statistical Tools." In Trends in Industrial Engineering Applications to Manufacturing Process, 529–59. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-71579-3_22.

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Fischer, Andreas, Malte Vollmer, Philipp Krooß, and Thomas Niendorf. "Microstructural and Mechanical Properties of AISI 4140 Steel Processed by Electron Beam Powder Bed Fusion Analyzed Using Miniature Samples." In Progress in additive manufacturing 2020, 296–311. 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959: ASTM International, 2022. http://dx.doi.org/10.1520/stp163720200125.

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Conference papers on the topic "Electronic manufacturing processes"

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Dishon, G. J., and S. M. Bobbio. "Dry (fluxless) thermal soldering processes." In Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle. IEEE, 1988. http://dx.doi.org/10.1109/emts.1988.16145.

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Horvath, Eszter, Andras Erenyi, Attila Geczy, and Gabor Harsanyi. "Optimization of breaking processes in LTCC manufacturing." In 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME). IEEE, 2011. http://dx.doi.org/10.1109/siitme.2011.6102708.

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Becker, K. F., A. Kurz, H. Reichl, M. Koch, J. Bauer, and T. Braun. "Precision material deposition for SiP manufacturing using jetting processes." In 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC). IEEE, 2010. http://dx.doi.org/10.1109/ectc.2010.5490667.

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Vemal, R., Calvin Lo, Sherrill Ong, B. S. Lee, and C. C. Yong. "MEMS vs. IC manufacturing: Is integration between processes possible." In 2009 1st Asia Symposium on Quality Electronic Design (ASQED 2009). IEEE, 2009. http://dx.doi.org/10.1109/asqed.2009.5206300.

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Fjelstad, Joseph. "Benefits of reversing the circuit manufacturing and assembly processes for electronic products." In 2011 IEEE International Symposium on Electromagnetic Compatibility - EMC 2011. IEEE, 2011. http://dx.doi.org/10.1109/isemc.2011.6038386.

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Jiang, Feng, Qibin Wang, Kai Xue, Xiangmeng Jing, Daquan Yu, and Dongkai Shangguan. "Wafer level warpage characterization for backside manufacturing processes of TSV interposers." In 2014 IEEE 64th Electronic Components and Technology Conference (ECTC). IEEE, 2014. http://dx.doi.org/10.1109/ectc.2014.6897532.

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Panhalkar, Neeraj, Ratnadeep Paul, and Sam Anand. "A Novel Additive Manufacturing File Format for Printed Electronics." In ASME 2013 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/imece2013-64678.

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Additive Manufacturing (AM) based Printed Electronics (PE) is an emerging technique where electronic components and interconnects are printed directly on substrates using a layered technique. The direct printing of the electronic components allows large scale and ultra-thin components to be printed on a wide variety of substrates including glass, silicon and plastic. These attributes make AM based Printed Electronics an invaluable manufacturing technique in the area of electronic sensors and sensor networks where thin, flexible and rugged form factors are very important. However, currently this technology is a labor intensive and manual process with the machine operator using his experience and judgment to slice the CAD file of the part to create 2D layers at different levels. This manual process increases the overall production time as well as the cost of the product and also results in inconsistent quality of parts. A major challenge faced by existing AM based Printed Electronics users for automating this process is the lack of a standard input file format that can be used by different PE machines for producing the components in layers. To leverage the capabilities of both AM and PE processes, a new file format based on the Constructive Solid Geometry (CSG) technique is proposed in this research paper. This file format data will not only include CAD data in the form of CSG primitives and Boolean representation but will also include manufacturing information related to the AM based PE process. The manufacturing information embedded within this new format will include data about the location of the different electronic components such as interconnects, resistors, capacitors, inductors, transistors, memory and substrate, and the materials required for the different components part. Different circuit board components will be represented as primitives or a combination of primitives obtained using CSG technique. In addition to the new file format, a slicing algorithm will also be developed which can be used to create the layers automatically using user inputs. The proposed file format and the slicing algorithm will be explained with the help of a case study.
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Huang, P. S., M. Y. Tsai, C. Y. Huang, P. C. Lin, Lawrence Huang, Michael Chang, Steven Shih, and J. P. Lin. "Warpage, stresses and KOZ of 3D TSV DRAM package during manufacturing processes." In 2012 14th International Conference on Electronic Materials and Packaging (EMAP). IEEE, 2012. http://dx.doi.org/10.1109/emap.2012.6507849.

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Xiaogan Liang, Hongsuk Nam, Sungjin Wi, and Mikai Chen. "Plasma-assisted printing and doping processes for manufacturing few-layer MoS2-based electronic and optoelectronic devices." In 2014 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC). IEEE, 2014. http://dx.doi.org/10.1109/asmc.2014.6846956.

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White, Andrew Scott, David Saltzman, and Stephen Lynch. "Performance Analysis of Heat Sinks Designed for Additive Manufacturing." In ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/ipack2020-2532.

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Abstract Significant levels of heat are generated in contemporary electronics, and next generation devices will continue to demand higher power despite decreasing size; therefore, highly effective cooling schemes are needed. Simultaneously, advances in metal additive manufacturing have enabled production of complex heat transfer devices previously impossible to traditionally manufacture. This paper introduces three novel prototypes, originally designed for a prior ASME Student Heat Sink Design Competition sponsored by the K-16 (Heat Transfer in Electronic Devices) technical committee, to demonstrate the abilities of selective laser melting processes in the fabrication of A357 aluminum, EOS aluminum, and copper heat sinks. The performance of each of these prototypes has been determined experimentally, and the effects of specific material and design choices are analyzed. Comparisons of experimental results show that the copper and EOS aluminum prototypes performed better than the A357 aluminum due to increased thermal conductivity; however, the gains in thermal performance from EOS aluminum to copper were much lower despite the large difference in thermal conductivity.
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Reports on the topic "Electronic manufacturing processes"

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Medina, Enrique A., Kaitlin Schneider, Arthur Temmesfeld, Jill Csavina-Raison, Douglas Hutchens, Robert Drerup, Roberto Acosta, et al. Manufacturing Technology (MATES) II. Task Order 0006: Air Force Technology and Industrial Base Research Sub-Task 07: Future Advances in Electronic Materials and Processes-Flexible Hybrid Electronics. Fort Belvoir, VA: Defense Technical Information Center, February 2016. http://dx.doi.org/10.21236/ad1011193.

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Crepeau, P., P. Glaser, J. Murray, and G. Swiech. Electronic Manufacturing Process Improvement (EMPI) for Printed Wiring Assemblies. Fort Belvoir, VA: Defense Technical Information Center, April 1992. http://dx.doi.org/10.21236/ada259589.

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Wada, Yasutaka. Working Paper PUEAA No. 3. Parallel Processing and Parallelizing Compilation Techniques for "Green Computing". Universidad Nacional Autónoma de México, Programa Universitario de Estudios sobre Asia y África, 2022. http://dx.doi.org/10.22201/pueaa.001r.2022.

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The fourth technological revolution has brought great advances in manufacturing processes and human communications. Although processors have become increasingly efficient, both in speed, capacity and energy consumption, their functionality regarding this last point has yet to improve. The latest innovations represent an opportunity to create "green computing" and not only more environmentally friendly electronics and software, but also to use their new efficiency to improve our daily activities, as well as the designs of our cities themselves to make them more environmentally sustainable. These new computerized systems must also be applied in accordance with the socioeconomic factors that must be taken into account in order to be modified in favor of sustainability and efficiency.
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Read, M. Electronic Manufacturing Process Improvement (EMPI) for Printed Wiring Assemblies; Program Task 1 Baseline Report. Fort Belvoir, VA: Defense Technical Information Center, April 1992. http://dx.doi.org/10.21236/ada256507.

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Jagannathan, Shanti, and Dorothy Geronimo. Reaping the Benefits of Industry 4.0 through Skills Development in the Philippines. Asian Development Bank, January 2021. http://dx.doi.org/10.22617/spr200326.

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This report explores the implications of the Fourth Industrial Revolution (4IR) on the future of the job market in the Philippines. It assesses how jobs, tasks, and skills are being transformed in the information technology-business process outsourcing industry and electronics manufacturing industry. These two industries have high relevance to 4IR technologies and are important to the country’s employment, growth, and international competitiveness. They are likely to benefit from the transformational effect of 4IR, if there is adequate investment on jobs, skills, and training. The report is part of series developed from an Asian Development Bank study on trends in skills demand in Cambodia, Indonesia, the Philippines, and Viet Nam.
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Dryepondt, Sebastien N., Bruce A. Pint, and Daniel Ryan. Comparison of electron beam and laser beam powder bed fusion additive manufacturing process for high temperature turbine component materials. Office of Scientific and Technical Information (OSTI), April 2016. http://dx.doi.org/10.2172/1248786.

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Dryepondt, Sebastien, Michael Kirka, and Daniel Ryan. Comparison of Electron Beam and Laser Beam Powder Bed Fusion Additive Manufacturing Process for High Temperature Turbine Component Materials, Phase II. Office of Scientific and Technical Information (OSTI), June 2019. http://dx.doi.org/10.2172/1658007.

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Rouseff, Russell L., and Michael Naim. Characterization of Unidentified Potent Flavor Changes during Processing and Storage of Orange and Grapefruit Juices. United States Department of Agriculture, September 2002. http://dx.doi.org/10.32747/2002.7585191.bard.

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Citrus juice flavor quality traditionally diminishes after thermal processing and continuously during storage. Our prior studies found that four of the five most potent off-aromas formed during orange juice storage had not been identified. The primary emphasis of this project was to characterize and identify those potent flavor degrading aroma volatiles so that methods to control them could be developed and final flavor quality improved. Our original objectives included: 1 Isolate and characterize the most important unidentified aroma impact compounds formed or lost during pasteurization and storage. 2. Determination of thiamine and carotenoid thermal decomposition and Strecker degradation pathways in model solutions as possible precursors for the unidentified off-flavors. 3. Evaluate the effectiveness of an "electronic nose" to differentiate the headspace aromas of from untreated and heat pasteurized orange and grapefruit juices. 4. Use model systems of citrus juices to investigate the three possible precursor pathways (from 2) for flavor impact compounds formed or lost during pasteurization or storage. RESULTS - The components responsible for citrus storage off flavors and their putative precursors have now been identified. Certain carotenoids (b-carotene) can thermally degrade to produce b-ionone and b-damascenone which are floral and tobacco smelling respectively. Our GC-O and sensory experiments indicated that b-damascenone is a potential storage off-flavor in orange juice. Thiamine (Vitamin B1) degradation produces 2-methyl-3-furan thiol, MFT, and its dimer bis(2- methyl-3-furyl) disulfide which both produce meaty, savory aromas. GC-O and sensory studies indicated that MFT is another storage off-flavor. Methional (potato aroma) is another off flavor produced primarily from the reaction of the native amino acid, methionine, and oxidized ascorbic acid (vitamin C). This is a newly discovered pathway for the production of methional and is more dominant in juices than the classic Maillard reaction. These newly identified off flavors diminish the flavor quality of citrus juices as they distort the flavor balance and introduce non-typical aromas to the juice flavor profile. In addition, we have demonstrated that some of the poor flavor quality citrus juice found in the market place is not only from the production of these and other off flavors but also due to the absence of desirable flavor components including several potent aldehydes and a few esters. The absence of these compounds appears to be due to incomplete flavor volatile restoration after the making of juice concentrates. We are the first to demonstrate that not all flavor volatiles are removed along with water in the production of juice concentrate. In the case of grapefruit juice we have documented which flavor volatiles are completely removed, which are partially removed and which actually increase because of the thermal process. Since more that half of all citrus juices is made into concentrate, this information will allow producers to more accurately restore the original flavor components and produce a juice with a more natural flavor. IMPLICATIONS - We have shown that the aroma of citrus juices is controlled by only 1-2% of the total volatiles. The vast majority of other volatiles have little to no direct aroma activity. The critical volatiles have now been identified. The ability to produce high quality citrus juices requires that manufacturers know which chemical components control aroma and flavor. In addition to identifying the critical flavor components (both positive and negative), we have also identified several precursors. The behavior of these key aroma compounds and their precursors during common manufacturing and storage conditions has been documented so manufacturers in Israel and the US can alter production practices to minimize the negative ones and maximize the positive ones.
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