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Relevant bibliographies by topics / Electronic interface circuits

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Academic literature on the topic 'Electronic interface circuits'

Author: Grafiati

Published: 29 March 2025

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Journal articles on the topic "Electronic interface circuits"

1

Manukyan, Vahram K. "Software applications in modeling of physical processes in radio engineering and electronics in the context of distance learning." Physics of Wave Processes and Radio Systems 24, no. 1 (May 6, 2021): 89–97. http://dx.doi.org/10.18469/1810-3189.2021.24.1.89-97.

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This article examines the existing software applications for electronic circuit prototyping that can help evaluate the operation of the entire circuit based on specified parameters and find the best options. Using the TAC application and the Arduino library components, projects and instructions for creating and testing electronic circuits were developed. The resulting application was tested for capabilities and efficiency. The interface design and settings were also assessed to determine whether they simulate real conditions. The functionality of TAC application made it possible to generate alternate circuits. The results of software testing showed that using the application speeds up the learning process significantly when compared to traditional methods and helps eliminate problems that may emerge when designing and assembling circuits. The application may be useful in designing complex electronic circuits and developing teaching aids for students in technical fields.

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Yun, Eun Jeong, Jong Tae Park, and Chong Gun Yu. "An maximum power point tracking interface circuit for low-voltage DC-type energy harvesting sources." Bulletin of Electrical Engineering and Informatics 11, no. 6 (December 1, 2022): 3108–18. http://dx.doi.org/10.11591/eei.v11i6.4124.

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This paper presents a maximum power point tracking (MPPT) interface circuit for low-voltage DC-type energy harvesting sources such as light and thermal energy. Most energy harvesting systems used in miniature-sized sensor systems require start-up circuits because the output voltages of small-sized energy transducers are very low and not enough to directly power electronic systems. The proposed interface circuit is driven directly by the low output voltages of small size energy transducers, eliminating the need for complex start-up circuitry. A simple MPPT controller with the fractional open-circuit voltage (FOCV) method is designed and fabricated in a 65-nm complementary metal oxide semiconductor (CMOS) process. Measurement results show that the designed circuit can track the MPP voltage even in the presence of the open-circuit voltage fluctuations and can operate properly at operating voltages as low as 0.3 V. The interface circuit achieves a peak power efficiency of 97.1% and an MPPT accuracy of over 98.3%.

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Mohammed, Amani, and Busara Amidu. "Enhanced circuit topologies for maximizing power output in piezoelectric energy harvesters." i-manager's Journal on Circuits and Systems 12, no. 2 (2024): 19. https://doi.org/10.26634/jcir.12.2.21731.

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Piezoelectric energy harvesting has gained significant attention for powering small-scale electronic devices by converting mechanical vibrations into electrical energy. However, the electrical interface plays a crucial role in maximizing power transfer efficiency. This paper explores optimized circuit topologies, particularly the use of inductors to mitigate capacitive impedance effects and enhance power output. A comparative analysis of Simple Resistive Load (SRL), Inductive Load (IL), and AC-DC converter circuits is conducted, both numerically and experimentally. Results indicate that inductive circuits significantly improve power output by reducing the negative reactance of piezoelectric harvesters. The findings contribute to the development of more efficient self-powered systems for wireless sensors and low-energy electronics.

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Liew Hui Fang, Rosemizi Abd Rahim, Muhammad Izuan Fahmi, Junita Mohd Nordin, and Aini Syuhada Md Zain. "Review of Active Circuit and Passive Circuit Techniques to Improve the Performance of Highly Efficient Energy Harvesting Systems." Journal of Advanced Research in Applied Sciences and Engineering Technology 31, no. 1 (June 13, 2023): 271–90. http://dx.doi.org/10.37934/araset.31.1.271290.

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In piezoelectric energy harvesting systems, energy harvesting circuits are the interface between piezoelectric devices and electrical loads. The conventional view of this interface is based on the concept of impedance matching. In fact, in the power supply circuit can also apply as an electrical boundary conditions, such as voltage and charge, to piezoelectric devices for each energy conversion cycle. The major drawback of piezoelectric power harvesting have low-power relationships in systems within (in the range of μW to mW), then system also have significantly reduced any potential losses in circuits that make up the EH system, whereas other condition into careful selection of circuits and components can enhanced the energy harvesting performance and electricity consumption. In the study of energy harvesting systems, it is an energy harvesting system approach that using active and passive electronic circuit to control voltage and or charge on piezoelectric devices as proposed and review to mechanical inputs for optimized energy conversion. Several factors in the practical limitation of active and passive energy consumption, due to device limitations and the power efficiency of electronic circuits, will be introduced and have played an important role into to enhance optimum and increase efficiency of energy harvesting system.

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Goeritno, Arief, and Ika Setyawibawa. "An Electronic Device Reviewed by Diagnosing on the Modules Embodiment." International Journal of Electronics and Communications Systems 1, no. 2 (December 28, 2021): 41–55. http://dx.doi.org/10.24042/ijecs.v1i2.10383.

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An electronic device with various purposes needs in-depth study from the very beginning of the idea, before getting the final product. It relates to an essential role in providing user's infrastructure and service. The research objectives are to obtain the electronic circuits, modules, and devices by integrating the wiring. The research methods are conducted in the form of designing, manufacturing, assembling, and diagnosing. Designing stage is to obtain several electronic circuits as a liaison and the manufacturing stage to obtain the printed circuit board. The assembling stage is to obtain the gateway boards which controlled by the Arduino modules and diagnosing stage to obtain the interface device for communicating (IDC) is formed by integrating the wiring. Integrating several electronic circuits, modules, and devices have resulted in an IDC. Operating the IDC uses two different systems, i.e. from the telephony system to the radio-frequency system or vice versa with a half-duplex mechanism.

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Boni, Andrea, Michele Caselli, Alessandro Magnanini, and Matteo Tonelli. "CMOS Interface Circuits for High-Voltage Automotive Signals." Electronics 11, no. 6 (March 21, 2022): 971. http://dx.doi.org/10.3390/electronics11060971.

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The acquisition of high-voltage signals from sensors and actuators in an internal-combustion engine is often required for diagnostic purposes or in the case of conversion to alternative fuels, such as hydrogen, natural gas, or biogas. The integration of electronic interfaces and acquisition circuits in a single device provides benefits in terms of component-count reduction and performance. Nonetheless, the high voltage level of the involved signals makes on-chip design challenging. Additionally, the circuits should be compatible with the CMOS technology, with limited use of high-voltage options and a minimum number of off-chip components. This paper describes the design and the implementation in 350 nm CMOS technology of electronic interfaces and acquisition circuits for typical high-voltage signals of automotive context. In particular, a novel co-design of dedicated voltage clamps with electro-static discharge (ESD) protections is described. The proposed circuits require only a single off-chip resistor, and they are suitable for the acquisition of signals with peak voltages up to 400 V. The measured performance of the silicon prototypes, in the [−40 °C, +125 °C] temperature range, make the proposed electronic interfaces suitable for the automotive domain.

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Žemva, Andrej, Andrej Trost, and Baldomir Zajc. "Educational Programmable System for Prototyping Digital Circuits." International Journal of Electrical Engineering & Education 35, no. 3 (July 1998): 236–44. http://dx.doi.org/10.1177/002072099803500306.

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In this paper, we present an educational programmable system for prototyping digital circuits. The system is composed of the PC and the prototyping board composed of 3 FPGAs. PC is used for designing a digital circuit, programming the FPGAs, automatic generation of the interface logic and hardware verification of the designed circuit.

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Polachan, Kurian, Baibhab Chatterjee, Scott Weigand, and Shreyas Sen. "Human Body–Electrode Interfaces for Wide-Frequency Sensing and Communication: A Review." Nanomaterials 11, no. 8 (August 23, 2021): 2152. http://dx.doi.org/10.3390/nano11082152.

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Several on-body sensing and communication applications use electrodes in contact with the human body. Body–electrode interfaces in these cases act as a transducer, converting ionic current in the body to electronic current in the sensing and communication circuits and vice versa. An ideal body–electrode interface should have the characteristics of an electrical short, i.e., the transfer of ionic currents and electronic currents across the interface should happen without any hindrance. However, practical body–electrode interfaces often have definite impedances and potentials that hinder the free flow of currents, affecting the application’s performance. Minimizing the impact of body–electrode interfaces on the application’s performance requires one to understand the physics of such interfaces, how it distorts the signals passing through it, and how the interface-induced signal degradations affect the applications. Our work deals with reviewing these elements in the context of biopotential sensing and human body communication.

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Stornelli, Vincenzo, Leonardo Pantoli, Gianluca Barile, Alfiero Leoni, and Emanuele D’Amico. "Silicon Photomultiplier Sensor Interface Based on a Discrete Second Generation Voltage Conveyor." Sensors 20, no. 7 (April 5, 2020): 2042. http://dx.doi.org/10.3390/s20072042.

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This work presents the design of a discrete second-generation voltage conveyor (VCII) and its capability to be used as electronic interface for silicon photomultipliers. The design addressed here exploits directly at the transistor level, with commercial components, the proposed interface; the obtained performance is valuable considering both the discrete elements and the application. The architecture adopted here realizes a transimpedance amplifier that is also able to drive very high input impedance, as usually requested by photons detection. Schematic and circuital design of the discrete second-generation voltage conveyor is presented and discussed. The complete circuit interface requires a bias current of 20 mA with a dual 5V supply voltage; it has a useful bandwidth of about 106 MHz, and considering also the reduced dimensions, it is a good candidate to be used in portable applications without the need of high-cost dedicated integrated circuits.

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Ning, Yongkai, Jiangfei Guo, Yangchen Jia, Duosheng Li, and Guiliang Guo. "A Fast Interface Circuit for the Measurement of 10 Ω to 1 GΩ Resistance." Electronics 12, no. 18 (September 8, 2023): 3796. http://dx.doi.org/10.3390/electronics12183796.

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In this work, an interface circuit applied to resistive gas or chemical sensors is proposed. The interface circuit includes a detection front-end, a single-end to differential circuit, a successive approximation analog-to-digital converter (SAR ADC), and some reference auxiliary circuits. In detection front-end circuits, mirrored currents in a current mirror usually differ by several orders of magnitude. In order to ensure that the current mirror can be copied accurately, this work uses a negative feedback structure consisting of an operational amplifier and an NMOS tube to ensure that the VDS of the current mirroring tube remains consistent. Simulation results show that the replication error of the current mirror is 0.015%. The proposed interface circuit has a detection range of 10 Ω to 1 GΩ with a relative error of 0.55%. The current multiplication or divided technique allows the interface circuit to have a high sampling frequency of up to 10 kHz. The proposed circuit is based on a 180 nm CMOS process with a chip area of 0.308 mm2 (723 μm ∗ 426 μm). The power consumption of the whole interface circuit is 3.66 mW when the power supply voltage is 1.8 V.

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Dissertations / Theses on the topic "Electronic interface circuits"

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So, Biu 1959. "THE METHODOLOGY AND IMPLEMENTATION OF RELAXATION METHOD TO INVESTIGATE ELECTRO-THERMAL INTERACTIONS IN SOLID-STATE INTEGRATED CIRCUITS." Thesis, The University of Arizona, 1987. http://hdl.handle.net/10150/276384.

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Honghao, Tang. "A Study on Interface Circuits for Piezoelectric Energy Harvesting." Thesis, Linköpings universitet, Elektroniska Kretsar och System, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-144497.

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A piezoelectric energy harvesting (PEH) system can harvest electrical energy from ambient vibration energy. In a PEH system, the interface rectifier circuit is critical because it converts AC from the output of piezoelectric harvester to DC that can power the load. Hence, improving the efficiency of the interface circuit can directly increase the efficiency of the entire PEH system; consequently, more power can be harvested. Commonly used interface circuits in PEH systems, such as full-bridge and voltage- doubler rectifiers,lead to relatively simple circuit implementations but they show serious limitations in energy-harvesting efficiency. Several innovative solutions have been reported to improve the efficiency of the interface rectifiers, such as ‘switch-only’ and ‘bias-flip’ techniques [7]. Such solutions utilize additional switches or switched inductors to speed up and even quickly reverse (flip) the voltage on the rectifier input to the desired voltage-level and condition for energy transfer, ultimately improving the overall efficiency of the energy harvesting. However, such techniques rely on accurate timing and synchronization of the pulsed switches every time the current produced by the piezoelectric harvester changes polarity. This thesis studies and investigates the impact of the non-ideal switching effects on the energy efficiency of the switch-only and bias-flip interface rectifiers in a PEH system, by theoretical derivation and experimental simulation.

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Rahim, Md Sayed Kaysar Jaeger Richard C. Suhling J. C. "Die stress characterization and interface delamination study in flip chip on laminate assemblies." Auburn, Ala., 2005. http://repo.lib.auburn.edu/2005%20Summer/doctoral/RAHIM_MD_37.pdf.

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CHáVEZ, YZQUIERDO Jhordan. "Semi-passive conditionning circuits for efficient electrostatic energy harvesting." Electronic Thesis or Diss., université Paris-Saclay, 2024. http://www.theses.fr/2024UPAST185.

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La thèse explore la récupération d'énergie à petite échelle, en se concentrant sur les circuits de récupération d'énergie électrostatique. Elle vise à convertir l'énergie ambiante en électricité pour alimenter de manière durable des dispositifs électroniques et des capteurs, notamment dans des endroits éloignés ou inaccessibles.Cette technologie pourrait remplacer les batteries traditionnelles, qui souffrent de fuites, de capacité limitée et de sensibilité aux fluctuations de température. Elle prolonge la durée de vie des dispositifs et réduit la nécessité de recharges fréquentes, ce qui est crucial pour l'Internet des Objets (IoT). Les technologies de récupération d'énergie soutiennent l'autonomie et la flexibilité des déploiements IoT, réduisant les coûts de maintenance et permettant une surveillance en temps réel et une maintenance prédictive.La thèse analyse l'état de l'art des circuits de récupération d'énergie électrostatique, en se concentrant sur leur efficacité et leur mise en œuvre pratique à travers des diagrammes QV. Les circuits à cycle QV rectangulaire, bien que simples, sont moins efficaces, tandis que les circuits à cycle QV triangulaire offrent de meilleures performances mais sont plus complexes à mettre en œuvre.Une approche innovante combine les avantages des deux types de circuits, proposant une technique semi-passive où la charge et la décharge du transducteur sont synchronisées avec le mouvement structurel, utilisant des commutateurs contrôlables pour maintenir des cycles triangulaires. Cet équilibre entre simplicité et efficacité est une contribution clé de cette recherche.La thèse explore également différents types de transducteurs pour la récupération d'énergie électrostatique. Les transducteurs MEMS offrent une haute précision et une miniaturisation, mais rencontrent des problèmes d'efficacité à haute fréquence. Les condensateurs à base de polymères atteignent une haute capacitance mais ont des pertes d'énergie importantes dans le transducteur lui-même. Les condensateurs battants convertissent efficacement l'énergie vibratoire mais nécessitent une conception mécanique précise. Les Condensateurs Métalliques Accordables, utilisés dans des circuits résonants, sont simples à mettre en œuvre et ont des pertes d'énergie modérées (dans le transducteur lui-même), ce qui en fait une option fiable pour les circuits développés. Ainsi, le Condensateur Métallique Accordable est choisi pour valider les circuits développés.Un aspect particulier de la thèse est l'exploration de l'élément photocapacitif, utilisant des matériaux sensibles à la lumière pour convertir l'énergie lumineuse en électricité. Initialement conçu comme un condensateur variable, les expériences ont montré que cet élément fonctionne principalement comme un générateur de courant lorsqu'il est exposé à la lumière. Des tests avec le circuit doubleur de Bennet ont révélé que le transducteur génère du courant sans tension de polarisation appliquée, suggérant un mode de fonctionnement différent qui pourrait être exploré davantage.La recherche introduit la méthode SCDI (Charge et Décharge Synchronisées sur Inductance), équilibrant simplicité et efficacité dans la conversion d'énergie. Cette méthode synchronise les cycles de charge et de décharge à travers une inductance, améliorant la conversion des vibrations mécaniques en énergie électrique. Les tests ont montré que la méthode SCDI pouvait convertir environ 1 µJ d'énergie par cycle (avec un composant de stockage de 60V), nécessitant des transducteurs à faibles pertes pour un transfert d'énergie efficace.S'appuyant sur la méthode SCDI, la thèse présente la technique SCDIP (Charge et Décharge Synchronisées sur Inductance avec Cycle Positif), utilisant uniquement un cycle QV positif pour améliorer encore l'efficacité. Cette méthode réduit les pertes d'énergie dans le transducteur, améliorant significativement les performances de récupération d'énergie par rapport à la méthode SCDI
The thesis explores small-scale energy harvesting, focusing on electrostatic energy harvesting circuits. It aims to convert ambient energy into electricity to sustainably power electronic devices and sensors, especially in remote or inaccessible locations.This technology could replace traditional batteries, which suffer from leaks, limited capacity, and sensitivity to temperature fluctuations. It extends the lifespan of devices and reduces the need for frequent recharges, which is crucial for the Internet of Things (IoT). Energy harvesting technologies support the autonomy and flexibility of IoT deployments, reducing maintenance costs and enabling real-time monitoring and predictive maintenance.The thesis analyzes the state of the art in electrostatic energy harvesting circuits, focusing on their efficiency and practical implementation through QV (charge-voltage) diagrams. Rectangular QV cycle circuits, although simple, are less efficient, while triangular QV cycle circuits offer better performance but are more complex to implement.An innovative approach combines the advantages of both types of circuits, proposing a semi-passive technique where the transducer's charge and discharge are synchronized with structural movement, using controllable switches to maintain triangular cycles. This balance between simplicity and efficiency is a key contribution of this research.The thesis also explores various types of transducers for electrostatic energy harvesting. MEMS transducers offer high precision and miniaturization but they face efficiency issues at high frequencies. Polymer-based capacitors achieve high capacitance but they have lot of energy loss on the transducer itself. Flapping capacitors efficiently convert vibrational energy but require precise mechanical design. Adjustable Metal Capacitors, used in resonant circuits, are simple to implement and they have moderate energy loss (on the transducer itself), making them a reliable option for the developed circuits. Thus, the Adjustable Metal Capacitor is chosen to validate the developed circuits.A particular aspect of the thesis is the exploration of the photocapacitive element, using light-sensitive materials to convert light energy into electricity. Initially designed as a variable capacitor, experiments showed that this element functions primarily as a current generator when exposed to light. Tests with the Bennet doubler circuit revealed that the transducer generates current without an applied bias voltage, suggesting a different operating mode that could be further explored.The research introduces the SCDI method (Synchronized Charge and Discharge on Inductance), balancing simplicity and efficiency in energy conversion. This method synchronizes charge and discharge cycles through an inductance, improving the conversion of mechanical vibrations into electrical energy. Tests showed that the SCDI method could convert about 1 µJ of energy per cycle (with a 60V storage component), requiring low-loss transducers for efficient energy transfer.Building on the SCDI method, the thesis presents the SCDIP technique (Synchronized Charge and Discharge on Inductance with Positive Cycle), using only a positive QV cycle to further improve efficiency. This method reduces energy losses in the transducer, significantly enhancing energy harvesting performance compared to the SCDI method

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DOMIENIKAN, CLAUDIO. "interface eletronica para aquisicao de 12 espectros de coincidencias gama-gama atrasadas." reponame:Repositório Institucional do IPEN, 2001. http://repositorio.ipen.br:8080/xmlui/handle/123456789/10889.

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Dissertacao (Mestrado)
IPEN/D
Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP

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Yamamoto, Silas Demmy. "Integração de sistema transceptor de 60 GHz para aplicações sem fio de interface multimídia de alta definição." [s.n.], 2011. http://repositorio.unicamp.br/jspui/handle/REPOSIP/259229.

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Orientador: Jacobus Willibrordus Swart
Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Elétrica e de Computação
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Resumo: O trabalho intitulado Integração de Sistema Transceptor de 60 GHz para Aplicações Sem Fio de Interface Multimídia de Alta Definição (Wireless HDMI) foi realizado na empresa STMicroelectronics (França), no departamento de P&D de Tecnologia / CAD Central e Soluções, como requisito para a obtenção do título de mestre. O objetivo deste trabalho foi de pesquisar e propor uma integração de sistema do tipo Sistema no Empacotamento (SiP ou System in Package) a nível industrial, com o desenvolvimento de um Módulo de Múltiplos Chips (MCM ou Multi-Chip Module) de camadas cerâmicas com tecnologia Cerâmica Cossinterizada sob Alta Temperatura (HTCC), integrando componentes de diferentes tecnologias - um circuito integrado CMOS 65 nm, um circuito integrado monolítico de micro-ondas (MMIC) de Arseneto de Gálio (GaAs) comercial e antenas IPD (Dispositivo de Integração Passiva) de vidro. Além disso foram desenvolvidas técnicas de projeto de integração na tecnologia HTCC, atendendo-se às regras para fabricação e montagem industrial. Utilizaram-se no projeto ferramentas software de projeto de simulação elétrica e eletromagnética, resultando no módulo com área de 13 x 8 mm2 e 1,12 mm de espessura incluindo os componentes. Nas linhas de transmissão do sinal a 60 GHz e de banda base foram medidas perdas de inserção de 1,0 dB/mm e 0,6 dB respectivamente. A antena integrada no módulo apresentou um ganho mínimo de 6 dBi (de 53,5 a 59,5 GHz), com perda de retorno maior que 10 dB (de 51 a 63 GHz) e um pequeno deslocamento em relação à banda especificada. Os resultados de medição de algumas amostras demonstraram que a tecnologia HTCC, para integração do sistema, é viável tanto em termos de desempenho, quanto nos aspectos industrial e comercial, mesmo antes da análise da montagem e desempenho do MMIC HPA e do sistema
Abstract: This Master's degree work, entitled System-in-Package (SiP) Integration of 60 GHz Transceiver for Wireless High Definition Multimedia Interface Application, was executed at STMicroelectronics Company (France), Minatec site in the department of Research and Technological Development/Central CAD and Solutions Department, under the guidance of PhD. Andreia Cathelin. The objective was to research and propose a SiP integration for industrial production. The Multi-Chip Module with ceramic materials (MCM-C) of High Temperature Cofired Ceramic technology (HTCC) was developed. Components and devices of different technologies - an RF 65 nm CMOS Integrated Circuit (IC), a commercial Gallium Arsenide (GaAs) monolithic microwave IC (MMIC), and IPD (Integrated Passive Device) antennas with glass substrate - were integrated into the same module. Further design techniques were developed complying with techniques for industrial assembly and the design rules of Kyocera, the company which provides HTCC technology and module manufacturing. The complete system integration was designed with electronic design automation (EDA) software tools with electrical and electromagnetic simulation resulting in a 13 x 8 mm2 area and 1.12 mm thickness module including its components. The 60 GHz and the base band transmission lines presented an insertion loss of 1.0 dB/mm and 0.6 dB respectively. The IPD antenna integrated in the module presented a 6 dBi minimum gain (53.5 to 59.5 GHz band) with return loss above 10 dB (51 to 63 GHz band) and a small shift of the frequency band. The measurement results of some assembled samples showed that HTCC technology is viable in terms of performance and industrial production for the 60 GHz application, even before the analysis of MMIC HPA and the system evaluation
Mestrado
Eletrônica, Microeletrônica e Optoeletrônica
Mestre em Engenharia Elétrica

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7

Masoud, Khalid Hasan. "Circuits and controls for grid-connected inverters." Thesis, Queensland University of Technology, 2002.

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Forbes, Mark Graham. "Electronic design issues in high-bandwidth parallel optical interfaces to VLSI circuits." Thesis, Heriot-Watt University, 1999. http://hdl.handle.net/10399/598.

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Silay, Kanber Mithat. "High Performance Cmos Capacitive Interface Circuits For Mems Gyroscopes." Master's thesis, METU, 2006. http://etd.lib.metu.edu.tr/upload/2/12607518/index.pdf.

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This thesis reports the development and analysis of high performance CMOS readout electronics for increasing the performance of MEMS gyroscopes developed at Middle East Technical University (METU). These readout electronics are based on unity gain buffers implemented with source followers. High impedance node biasing problem present in capacitive interfaces is solved with the implementation of a transistor operating in the subthreshold region. A generalized fully differential gyroscope model with force feedback electrodes has been developed in order to simulate the capacitive interfaces with the model of the gyroscope. This model is simplified for the single ended gyroscopes fabricated at METU, and simulations of resonance characteristics are done. Three gyroscope interfaces are designed by considering the problems faced in previous interface architectures. The first design is implemented using a single ended source follower biased with a subthreshold transistor. From the simulations, it is observed that biasing impedances up to several gigaohms can be achieved. The second design is the fully differential version of the first design with the addition of a self biasing scheme. In another interface, the second design is modified with an instrumentation amplifier which is used for fully differential to single ended conversion. All of these interfaces are fabricated in a standard 0.6 µ
m CMOS process. Fabricated interfaces are characterized by measuring their ac responses, noise response and transient characteristics for a sinusoidal input. It is observed that, biasing impedances up to 60 gigaohms can be obtained with subthreshold transistors. Self biasing architecture eliminates the need for biasing the source of the subthreshold transistor to set the output dc point to 0 V. Single ended SOG gyroscopes are characterized with the single ended capacitive interfaces, and a 45 dB gain improvement is observed with the addition of capacitive interface to the drive mode. Minimum resolvable capacitance change and displacement that can be measured are found to be 58.31 zF and 38.87 Fermi, respectively. The scale factor of the gyroscope is found to be 1.97 mV/(°
/sec) with a nonlinearity of only 0.001% in ±
100 °
/sec measurement range. The bias instability and angle random walk of the gyroscope are determined using Allan variance method as 2.158 °
/&
#8730
hr and 124.7 °
/hr, respectively.

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Finn, Steven Ernest. "Interface circuit designs for extreme environments using SiGe BiCMOS technology." Thesis, Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/22679.

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SiGe BiCMOS technology has many advantageous properties that, when leveraged, enable circuit design for extreme environments. This work will focus on designs targeted for space system avioinics platforms under the NASA ETDP program. The program specifications include operation under temperatures ranging from -180 C to +125 C and with radiation tolerance up to total ionizing dose of 100 krad with built-in single-event latch-up tolerance. To the author's knowledge, this work presents the first design and measurement of a wide temperature range enabled, radiation tolerant as built, RS-485 wireline transceiver in SiGe BiCMOS technology. This work also includes design and testing of a charge amplification channel front-end intended to act as the interface between a piezoelectric sensor and an ADC. An additional feature is the design and testing of a 50 Ohm output buffer utilized for testing of components in a lab setting.

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Books on the topic "Electronic interface circuits"

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Rumsey, Francis. Digital interface handbook. 3rd ed. Oxford: Focal Press, 2004.

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1950-, Watkinson John, ed. Digital interface handbook. Boston: Elsevier Focal Press, 2003.

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1966-, Baumann Konrad, and Thomas Bruce 1954-, eds. User interface design of electronic appliances. London: Taylor & Francis, 2001.

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1950-, Watkinson John, ed. The digital interface handbook. 2nd ed. Oxford: Focal Press, 1995.

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Gorby, Andrew. Development of a schematic capture graphical user interface for SPICE. Dublin: University College Dublin, 1995.

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Roermund, Arthur van. Analog Circuit Design:: Sensor and Actuator Interface Electronics, Integrated High-Voltage Electronics and Power Management, Low-Power and High-Resolution ADC's. U.S.: Springer, 2005.

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Bushby, Richard J. Liquid Crystalline Semiconductors: Materials, properties and applications. Dordrecht: Springer Netherlands, 2013.

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1962-, Cortadella J., ed. Logic synthesis for asynchronous controllers and interfaces. Berlin: Springer, 2002.

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Huijsing, Johan H. Smart Sensor Interfaces. Boston, MA: Springer US, 1997.

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Roger, Taylor, ed. Interfaces, Quantum Wells, and Superlattices. Boston, MA: Springer US, 1988.

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Book chapters on the topic "Electronic interface circuits"

1

Fraden, Jacob. "Interface Electronic Circuits." In Handbook of Modern Sensors, 191–270. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-19303-8_6.

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Fraden, Jacob. "Interface Electronic Circuits." In Handbook of Modern Sensors, 173–246. New York, NY: Springer New York, 2010. http://dx.doi.org/10.1007/978-1-4419-6466-3_5.

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Barnes, John R. "Designing Interface Circuits." In Robust Electronic Design Reference Book, 556–70. New York, NY: Springer US, 2004. http://dx.doi.org/10.1007/1-4020-7830-7_23.

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Grecki, M., G. Jabłoński, and A. Napieralski. "MOPS — parallel environment for simulation of electronic circuits using physical models of semiconductor devices." In Recent Advances in Parallel Virtual Machine and Message Passing Interface, 478–85. Berlin, Heidelberg: Springer Berlin Heidelberg, 1997. http://dx.doi.org/10.1007/3-540-63697-8_120.

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Fiorillo, A. S., S. A. Pullano, R. Tiriolo, and J. D. Vinko. "Iono-Electronic Interface Based on Innovative Low Temperature Zeolite Coated NMOS (Circuits) for Bio-nanosensor Manufacture." In Nanomaterials for Security, 201–14. Dordrecht: Springer Netherlands, 2016. http://dx.doi.org/10.1007/978-94-017-7593-9_16.

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Iyer, Shivkumar V. "User Interface." In Simulating Nonlinear Circuits with Python Power Electronics, 35–61. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-73984-7_3.

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Williams, Ian, Lieuwe Leene, and Timothy G. Constandinou. "Next Generation Neural Interface Electronics." In Circuit Design Considerations for Implantable Devices, 141–78. New York: River Publishers, 2022. http://dx.doi.org/10.1201/9781003337522-7.

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Iyer, Shivkumar V. "Interface for User Control Functions." In Simulating Nonlinear Circuits with Python Power Electronics, 63–84. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-73984-7_4.

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Lopez, Carolina Mora, and Xiaohua Huang. "Circuits and Architectures for Neural Recording Interfaces." In Biomedical Electronics, Noise Shaping ADCs, and Frequency References, 45–57. Cham: Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-28912-5_3.

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Lienig, Jens, and Juergen Scheible. "Bridges to Technology: Interfaces, Design Rules, and Libraries." In Fundamentals of Layout Design for Electronic Circuits, 83–126. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-39284-0_3.

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Conference papers on the topic "Electronic interface circuits"

1

Franzon, Paul D. "Molecular electronic circuits." In 2007 2nd International Workshop on Advances in Sensors and Interface. IEEE, 2007. http://dx.doi.org/10.1109/iwasi.2007.4420001.

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Dallago, E., D. Miatton, G. Venchi, V. Bottarel, G. Frattini, G. Ricotti, and M. Schipani. "Electronic interface for Piezoelectric Energy Scavenging System." In ESSCIRC 2008 - 34th European Solid-State Circuits Conference. IEEE, 2008. http://dx.doi.org/10.1109/esscirc.2008.4681877.

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Naus, Sebastien, Ioulia Tzouvadaki, Pierre-Emmanuel Gaillardon, Armando Biscontini, Giovanni De Micheli, and Sandro Carrara. "An efficient electronic measurement interface for memristive biosensors." In 2017 IEEE International Symposium on Circuits and Systems (ISCAS). IEEE, 2017. http://dx.doi.org/10.1109/iscas.2017.8050685.

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Lall, Pradeep, Jinesh Narangaparambil, Ved Soni, and Scott Miller. "Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications." In ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2023. http://dx.doi.org/10.1115/ipack2023-112069.

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Abstract The process of in-mold electronics (IME) is an innovative technology that integrates printed electronics with film insert molding to produce plastic components that contain electronics. The process involves the combination of printing, thermoforming, and injection molding to create complex and customized electronic devices. This technology has found numerous applications in various industries, including automobile components, household appliances, and consumer electronics, where customized user interfaces are required to manage or monitor the system. A customized user interface is required for a variety of applications in automotive, industrial electronics, and consumer technology to manage or monitor the system. Knobs, pressure and toggle switches, analog instruments, and flat-screen technology with touch sensor capabilities are also options. The key advantage of IME technology is its ability to create flexible and stretchable electronic devices capable of functioning under strain when bent, stretched, and deformed. Despite its potential, the IME process faces several challenges. One of the critical factors affecting the performance of IME products is the electrical resistance of the printed circuit, which changes during thermoforming. This presents a significant design challenge, as over-deformation of printed circuits can lead to poor performance and reliability issues. In this study, we have developed new design strategies and methods to optimize the performance of the IME process. This includes the use of electrically conductive adhesives to attach components in their undeformed state and later subject to thermoforming. This approach helps to maintain the integrity of the printed circuit and improve the performance of the interconnects. To evaluate the performance of the IME process, we have employed the OrCAD software to build and simulate a digital circuit. The performance of the inverting circuit was compared and evaluated against the tolerance limits of the COTs.

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Biccario, G. E., M. De Vittorio, and S. D'Amico. "A 2.4μW input power electronic interface circuit for piezoelectric MEMS harvesters." In ESSCIRC 2017 - 43rd IEEE European Solid-State Circuits Conference. IEEE, 2017. http://dx.doi.org/10.1109/esscirc.2017.8094541.

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Tao, Xiao Ming, and David Dagan Feng. "A wearable, wireless electronic interface for textile sensors lin shu." In 2010 IEEE International Symposium on Circuits and Systems - ISCAS 2010. IEEE, 2010. http://dx.doi.org/10.1109/iscas.2010.5537973.

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Schmitz, Joseph A., Jonathan M. Sherman, Sam Hansen, Samuel J. Murray, Sina Balkir, and Michael W. Hoffman. "A Low-Power, Single-Chip Electronic Skin Interface for Prosthetic Applications." In 2019 IEEE International Symposium on Circuits and Systems (ISCAS). IEEE, 2019. http://dx.doi.org/10.1109/iscas.2019.8702424.

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Robert, Charlotte, Sylvie Pommier, Stephane Lefebvre, Marion Ortali, and Michel Massiot. "Mechanical Behavior and Damage of Tridimensional Multilayered Ceramics-Tungsten Power Electronic Substrates." In ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/esda2012-82305.

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Since few years a 3D electric lines is developed. But new applications will be to expose this circuit to high variation of temperature and use them for electronic power. Circuits lines are made of tungsten and insulation in alumina. These materials have different behavior. That difference implies mechanics stress and stress singularities. Some stress concentration can fracture materials or interface between them. Alumina is a brittle material. We need to know his fracture behavior. A statistic model is already used: Weibull model. The idea is to break about hundred samples and to related the probabilities to break of alumina used in the circuit versus stress.

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Osenbach, John, B. Q. Wang, Sue Emerich, John DeLucca, and Dongmei Meng. "Corrosion of the Cu/Al interface in Cu-Wire-bonded integrated circuits." In 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC). IEEE, 2013. http://dx.doi.org/10.1109/ectc.2013.6575782.

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Mach, Ján, Lukáš Kohútka, and Pavel Čičák. "Interface Protection Against Transient Faults." In 2024 27th International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS). IEEE, 2024. http://dx.doi.org/10.1109/ddecs60919.2024.10508928.

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