Journal articles on the topic 'Electronic device testing'
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Deaves, M. "On test [electronic device testing]." Manufacturing Engineer 82, no. 5 (October 1, 2003): 40–41. http://dx.doi.org/10.1049/me:20030508.
Full textPan, Feng, Ruimin Chen, Yong Xiao, and Weiming Sun. "Electronic Voltage and Current Transformers Testing Device." Sensors 12, no. 1 (January 18, 2012): 1042–51. http://dx.doi.org/10.3390/s120101042.
Full textFiala, Thomas G. S., David M. Wrightson, and Michael J. Yaremchuk. "An Electronic Device for Surgical Glove Testing." Plastic and Reconstructive Surgery 92, no. 6 (November 1993): 1192–94. http://dx.doi.org/10.1097/00006534-199311000-00033.
Full textTada, Tetsuo, and Keiichi Sawada. "4720671 Semiconductor device testing device." Microelectronics Reliability 28, no. 4 (January 1988): 669. http://dx.doi.org/10.1016/0026-2714(88)90273-9.
Full textSimakov, A. V., V. V. Kharlamov, and V. I. Skorokhodov. "The overcurrent protection characteristics testing digital substation intelligent electric devices." Omsk Scientific Bulletin, no. 176 (2021): 46–51. http://dx.doi.org/10.25206/1813-8225-2021-176-46-51.
Full textPaunovic, Nemanja, Jelena Kovacevic, and Ivan Resetar. "A methodology for testing complex professional electronic systems." Serbian Journal of Electrical Engineering 9, no. 1 (2012): 71–80. http://dx.doi.org/10.2298/sjee1201071p.
Full textGary, Sarah T., Antonio V. Otero, Kenneth G. Faulkner, and Nadeeka R. Dias. "Validation and equivalency of electronic clinical outcomes assessment systems." International Journal of Clinical Trials 7, no. 4 (October 20, 2020): 271. http://dx.doi.org/10.18203/2349-3259.ijct20204485.
Full textSherf, Z., A. Katz, P. Hopstone, A. Edelstein, I. Yogev, and D. Peleg. "Aspects of the Acoustic Testing of an Electronic System: Acoustic Versus Vibration Testing." Journal of the IEST 47, no. 1 (September 14, 2004): 57–66. http://dx.doi.org/10.17764/jiet.47.1.b81113pn56114774.
Full textCheng, Ze, Zhao Long Xuan, Wei Wang, and Mao Sen Hao. "Test Method for Electronic Device on Condition of Small Sampling." Applied Mechanics and Materials 347-350 (August 2013): 525–28. http://dx.doi.org/10.4028/www.scientific.net/amm.347-350.525.
Full textBurnell, P. K. P., A. Malton, K. Reavill, and M. H. E. Ball. "Design, validation and initial testing of the Electronic LungTM device." Journal of Aerosol Science 29, no. 8 (September 1998): 1011–25. http://dx.doi.org/10.1016/s0021-8502(97)10039-8.
Full textStensrud, Linda, Bendik Ohrn, Rannveig S. J. Loken, Nargis Hurzuk, and Alex Apostolov. "Testing of Intelligent Electronic Device (IED) in a digital substation." Journal of Engineering 2018, no. 15 (October 1, 2018): 900–903. http://dx.doi.org/10.1049/joe.2018.0172.
Full textSoelkner, G. "Optical beam testing and its potential for electronic device characterization." Microelectronic Engineering 24, no. 1-4 (March 1994): 341–53. http://dx.doi.org/10.1016/0167-9317(94)90086-8.
Full textBolufawi, Omonayo, Annadanesh Shellikeri, and Jim P. Zheng. "Lithium-Ion Capacitor Safety Testing for Commercial Application." Batteries 5, no. 4 (December 7, 2019): 74. http://dx.doi.org/10.3390/batteries5040074.
Full textDeffenbaugh, Paul I., Danielle M. Stramel, and Kenneth H. Church. "Increasing the Reliability of 3D Printing a Wi-Fi Sensor Device." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000240–44. http://dx.doi.org/10.4071/isom-2016-wp11.
Full textIlzhöfer, A., H. Schneider, and C. Tsakmakis. "Tensile testing device for microstructured specimens." Microsystem Technologies 4, no. 1 (December 1997): 46–50. http://dx.doi.org/10.1007/s005420050091.
Full textHoriuchi, Akinor, Toshio Binnaka, and Shigeyuki Maruyama. "4604572 Device for testing semiconductor devices at a high temperature." Microelectronics Reliability 27, no. 2 (January 1987): 395. http://dx.doi.org/10.1016/0026-2714(87)90310-6.
Full textKharitonov, Anton S., and Gennadiy L. Shtrapenin. "Hardware and software complex for development and testing of electronic devices for transport industry." Innotrans, no. 3 (2020): 33–36. http://dx.doi.org/10.20291/2311-164x-2020-3-33-36.
Full textNicoletto, G., A. Pirondi, and P. Cova. "Accelerated life testing and thermomechanical simulation in power electronic device development." Journal of Strain Analysis for Engineering Design 34, no. 6 (August 1999): 455–62. http://dx.doi.org/10.1243/0309324991513885.
Full textFeng, Ke, Ben Sheng Lu, Huan Liang Li, and Jun Han. "Portable Fault Testing Device of Electronic Instrument Based on PC 104 Bus." Applied Mechanics and Materials 128-129 (October 2011): 661–64. http://dx.doi.org/10.4028/www.scientific.net/amm.128-129.661.
Full textBannatyne, R., D. Gifford, K. Klein, K. McCarville, C. Merritt, and S. Neddermeyer. "Creation of an ARM® Cortex®-M0 microcontroller for high temperature embedded systems." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, HiTEN (July 1, 2017): 000031–35. http://dx.doi.org/10.4071/2380-4491.2017.hiten.31.
Full textBibbo, Daniele, Tomas Klinkovsky, Marek Penhaker, Petr Kudrna, Lukas Peter, Martin Augustynek, Vladimír Kašík, et al. "A New Approach for Testing Fetal Heart Rate Monitors." Sensors 20, no. 15 (July 25, 2020): 4139. http://dx.doi.org/10.3390/s20154139.
Full textHardy, Dorothy Anne, Zahra Rahemtulla, Achala Satharasinghe, Arash Shahidi, Carlos Oliveira, Ioannis Anastasopoulos, Mohamad Nour Nashed, et al. "Wash Testing of Electronic Yarn." Materials 13, no. 5 (March 9, 2020): 1228. http://dx.doi.org/10.3390/ma13051228.
Full textKasukabe, Susumu, Masasi Ookubo, Yutaka Akiba, Minoru Tanaka, and Hitoshi Yokono. "4931726 Apparatus for testing semiconductor device." Microelectronics Reliability 31, no. 2-3 (January 1991): vii. http://dx.doi.org/10.1016/0026-2714(91)90266-a.
Full textVanichkin, D. O., I. Ya Gantman, and A. V. Levko. "ANALYSIS OF THE LARGE ARRAY OF RESULTS OBTAINED DURING THE PULSED MODE DIELECTRIC BREAKDOWN TESTING OF ELECTRONIC DEVICES." Electronic engineering Series 2 Semiconductor devices 257, no. 2 (2020): 47–69. http://dx.doi.org/10.36845/2073-8250-2020-257-2-47-69.
Full textKumrey, G. R., and S. K. Mahobia. "STUDY AND PERFORMANCE TESTING OF TRANSISTOR WITH COMMON EMITTER AMPLIFIER CIRCUIT." International Journal of Research -GRANTHAALAYAH 4, no. 8 (August 31, 2016): 100–103. http://dx.doi.org/10.29121/granthaalayah.v4.i8.2016.2567.
Full textPodoleanu, Cristian, and Jean-Claude Deharo. "Management of Cardiac Implantable Electronic Device Infection." Arrhythmia & Electrophysiology Review 3, no. 3 (2014): 184. http://dx.doi.org/10.15420/aer.2014.3.3.184.
Full textKoryahin, V. M., O. S. Blavt, and S. V. Ponomaryov. "Innovative Intestification of Testing of Strength Endurance in Physical Education of Students With Chronic Diseases." Teorìâ ta Metodika Fìzičnogo Vihovannâ 19, no. 3 (September 25, 2019): 116–22. http://dx.doi.org/10.17309/tmfv.2019.3.02.
Full textSoman, Varun, Mark D. Poliks, James N. Turner, Mark Schadt, Michael Shay, and Frank Egitto. "Reliability Analysis of a Wearable Sensor Patch (WSP) to Monitor ECG Signals." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000194–200. http://dx.doi.org/10.4071/isom-2017-wa23_137.
Full textShoaib, Muhammad, Nor Hisham Hamid, Aamir Farooq Malik, Noohul Basheer Zain Ali, and Mohammad Tariq Jan. "A Review on Key Issues and Challenges in Devices Level MEMS Testing." Journal of Sensors 2016 (2016): 1–14. http://dx.doi.org/10.1155/2016/1639805.
Full textAfiyat, Nur, Mohamad Hariyadi, and Muhammad Dimas Al Hakim. "PROTOTYPE SISTEM PENGENDALIAN PERANGKAT ELEKTRONIK BERBASIS IOT (INTERNET OF THINGS) MENGGUNAKAN VOICE CONTROL DAN BLYNK." Jurnal RESISTOR (Rekayasa Sistem Komputer) 4, no. 1 (April 21, 2021): 93–104. http://dx.doi.org/10.31598/jurnalresistor.v4i1.750.
Full textDruzhinina, Polina O., and Aelita V. Shaburova. "ECONOMIC EFFICIENCY OF USING AN OPTICAL-ELECTRONIC INSTRUMENT FOR TESTING A SET OF TRIAL EYE GLASSES." Interexpo GEO-Siberia 6, no. 1 (July 8, 2020): 131–37. http://dx.doi.org/10.33764/2618-981x-2020-6-1-131-137.
Full textLiu, Lu Ning, Yang Guang Zhang, Zhen Yu Shi, and Zhan Qiang Liu. "Development of Electronic Impact Hammer and its Application to Face Milling Cutter Modal Analysis." Advanced Materials Research 797 (September 2013): 585–91. http://dx.doi.org/10.4028/www.scientific.net/amr.797.585.
Full textSmith, Lilla Safford, Gordon D. Hoople, Jim C. Cheng, and Albert P. Pisano. "A Resealable, Gas-Tight Packaging Technique for Silicon Microfluidic Devices." Journal of Microelectronics and Electronic Packaging 12, no. 1 (January 1, 2015): 49–54. http://dx.doi.org/10.4071/imaps.444.
Full textPlusquellic, J. F., S. P. Levitan, and D. M. Chiarulli. "Digital IC device testing by transient signal analysis (TSA)." Electronics Letters 31, no. 18 (August 31, 1995): 1568–70. http://dx.doi.org/10.1049/el:19951065.
Full textWillberg, HansH, and Ekkehar Ueberreiter. "4889242 Device for testing and sorting electronic components, more particularly integrated circuit chips." Microelectronics Reliability 31, no. 1 (January 1991): i—ii. http://dx.doi.org/10.1016/0026-2714(91)90470-r.
Full textShen, Zhenzhen, James Storey, Otto Fanini, and Michael Osterman. "Modeling Vibration Induced Fatigue Failure of Free Standing Wire Bonds." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000635–40. http://dx.doi.org/10.4071/isom-2017-tha55_087.
Full textTenelsen, Florian, Dennis Brueckner, Thomas Muehlbauer, and Marco Hagen. "Validity and Reliability of an Electronic Contact Mat for Drop Jump Assessment in Physically Active Adults." Sports 7, no. 5 (May 16, 2019): 114. http://dx.doi.org/10.3390/sports7050114.
Full textMbaruku, A. L., U. P. Trociewitz, and J. Schwartz. "Development of a Low-Temperature Electro-Mechanical Testing Device." IEEE Transactions on Appiled Superconductivity 15, no. 2 (June 2005): 3620–23. http://dx.doi.org/10.1109/tasc.2005.849374.
Full textLiu, Huajun, Qingyun Qu, Qinyan Pan, Yu Wu, Chuanjun Huang, Laifeng Li, Min Yu, and Liang Guo. "Testing of the Ceramic Insulation Break for Fusion Device." IEEE Transactions on Applied Superconductivity 24, no. 3 (June 2014): 1–4. http://dx.doi.org/10.1109/tasc.2013.2287278.
Full textWang, Zhan Sheng, Xin Zhao, Jian Jun Gao, Pan Yang, Wei Xu, and Hong Xin Pan. "Study on Testing System for Real-Time of Communication of the Digital Substation's Secondary Equipments." Applied Mechanics and Materials 420 (September 2013): 401–6. http://dx.doi.org/10.4028/www.scientific.net/amm.420.401.
Full textZhelev, Georgi, Koycho Koev, Viktor Stoyanov, and Vladimir Petrov. "Electronic rat-control devices – solution or scam? Results of field trials and a summary of the literary data." Archives of Veterinary Medicine 11, no. 1 (September 16, 2018): 27–36. http://dx.doi.org/10.46784/e-avm.v11i1.14.
Full textHobkirk, Andréa L., Zachary Bitzer, Reema Goel, Christopher T. Sica, Craig Livelsberger, Jessica Yingst, Kenneth R. Houser, et al. "An Electronic Aerosol Delivery System for Functional Magnetic Resonance Imaging." Substance Abuse: Research and Treatment 14 (January 2020): 117822182090414. http://dx.doi.org/10.1177/1178221820904140.
Full textKurbanismailov, Z. M., A. T. Tarlanov, and E. M. Akimov. "The technique of point visualization of the electric field in space and time." Russian Technological Journal 9, no. 3 (June 28, 2021): 58–65. http://dx.doi.org/10.32362/2500-316x-2021-9-3-58-65.
Full textLiu, De Wang. "Research of Steady Acquisition Method of Large-Scale Electronic Circuit Shorted Signal." Applied Mechanics and Materials 602-605 (August 2014): 2765–68. http://dx.doi.org/10.4028/www.scientific.net/amm.602-605.2765.
Full textDesai, Chandrakant S., Zhichao Wang, Russell Whitenack, and Tribikram Kundu. "Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing." Journal of Electronic Packaging 126, no. 2 (June 1, 2004): 225–31. http://dx.doi.org/10.1115/1.1756146.
Full textPirc, Eva, Bertrand Balosetti, Damijan Miklavčič, and Matej Reberšek. "Electronic Emulator of Biological Tissue as an Electrical Load during Electroporation." Applied Sciences 10, no. 9 (April 29, 2020): 3103. http://dx.doi.org/10.3390/app10093103.
Full textOguchi, T., F. Hanawa, N. Takato, N. Tomita, and N. Atobe. "Arrayed hybrid filter/coupler device for inservice fibre line testing." Electronics Letters 29, no. 20 (1993): 1786. http://dx.doi.org/10.1049/el:19931189.
Full textIsmailov, T. A., A. R. Shakhmaeva, and A. M. Ibragimova. "THERMOELECTRIC SEMICONDUCTOR DEVICES FOR THERMAL STABILISATION OF REA POWERFUL TRANSISTORS." Herald of Dagestan State Technical University. Technical Sciences 47, no. 1 (April 21, 2020): 30–38. http://dx.doi.org/10.21822/2073-6185-2020-47-1-30-38.
Full textAl Kalaa, Mohamad Omar, Seth J. Seidman, Donald Witters, and Hazem H. Refai. "Practical aspects of wireless medical device coexistence testing." IEEE Electromagnetic Compatibility Magazine 6, no. 4 (2017): 47–52. http://dx.doi.org/10.1109/memc.0.8272281.
Full textJia, Xiaofei, Wenhao Chen, Bing Ding, and Liang He. "Noise test method for dual-gate MOSFET device." Modern Physics Letters B 33, no. 31 (November 10, 2019): 1950387. http://dx.doi.org/10.1142/s0217984919503871.
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