Relevant bibliographies by topics / Electronic circuits development

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Electronic circuits development'

Author: Grafiati
Published: 10 March 2023

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Journal articles on the topic "Electronic circuits development"

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Lei, Chi Un, K. L. Man, Eng Gee Lim, Nan Zhang, and Kai Yu Wan. "Development of a Reliability Course for Emerging Circuits and Systems." Advanced Materials Research 622-623 (December 2012): 1922–24. http://dx.doi.org/10.4028/www.scientific.net/amr.622-623.1922.

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This paper presents a curriculum design of a course about reliability of circuits and systems. Contents in the learning modules include failure mechanisms of electronics, reliability for electronic components and circuit systems and simulation for circuit reliability. Through learning modules, students can learn concepts about reliability in circuits and systems, as well as develop awareness to design a reliable circuit system.
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Pandiev, Ivailo Milanov. "Development of Two-Stage Quartz-Crystal Oscillators Using Monolithic Four-Terminal CFOAs." Electronics 11, no. 19 (September 23, 2022): 3027. http://dx.doi.org/10.3390/electronics11193027.

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In this article, based on the well-known circuits of two-stage quartz-crystal oscillators, three electronic circuits with a small number of external components are presented. For the proposed circuit configurations, the active elements are composed of monolithic current-feedback operational amplifiers (CFOAs) with access to terminal z, between the first stage (positive second-generation current conveyor (CCII)) and the second stage (output buffer). In this way, the output signal for the developed circuits is obtained after the output buffer of the second CFOA, thereby providing a minimal effect on the resonant circuit of the oscillators. Based on a theoretical analysis of the operational principle for the proposed circuits, the linear characteristic equations and the related self-oscillation conditions are obtained. Moreover, the frequency stability coefficients are determined, which can be obtained with larger values compared to the coefficients of the known discrete transistor circuits. To verify the operability and efficiency of the proposed oscillator circuits, experimental results obtained from sample electronic circuits are presented, which confirm the analyses performed in the frequency range up to about 10 MHz.
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Kim, TaeWoong, and SoYoung Kim. "Electronic design automation requirements for R2R printing foundry." Flexible and Printed Electronics 7, no. 1 (February 4, 2022): 013001. http://dx.doi.org/10.1088/2058-8585/ac4d3d.

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Abstract Roll-to-roll (R2R) printed electronic devices have been in the spotlight over the decades as a potential replacement for Si-based semiconductors, research into this technology is still being actively conducted over the world. These printed electronic devices can be used in a variety of applications, so the demand for them is expected to reach over USD 20.7 billion in 2025 given a compound annual growth rate (CAGR) of 21.5%. As the new ink materials and printing technologies being researched are commercialized, foundry companies that produce printed electronics need to provide appropriate work flow that will allow engineers to design these kind of circuits using commercial electronic design automation (EDA) tools. This review paper describes the key parameters that should be found process design kit (PDK), including the contained design rules and the simulation program with integrated circuit emphasis model. We cover the factors that need to be considered when a fabless company develops circuits for the R2R process, including the design methodology from the beginning of the design to the final graphic data stream (GDS) completion stage, we also discuss other essential technological hurdles that must be overcome in this process. The overall process of design and analysis for printed electronic technique is based on the silicon design flow. We describe the full custom design flow for analog integrated circuits (ICs) and explain how the automatic placement and routing based design of digital integrated circuits can be carried out. In addition, the necessity of sign-off verification using post-simulation, electromagnetic (EM) simulation and bias check simulation required for commercial product development will be explained. The development of PDKs and EDA tools for circuit design in the R2R printed electronics foundry industry will have a potentially tremendous impact on the semiconductor ecosystem by lowering the barriers to producing these devices.
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Chong, Peng Lean, Silvia Ganesan, Poh Kiat Ng, and Feng Yuan Kong. "A TRIZ-Adopted Development of a Compact Experimental Board for the Teaching and Learning of Operational Amplifier with Multiple Circuit Configurations." Sustainability 14, no. 21 (October 29, 2022): 14115. http://dx.doi.org/10.3390/su142114115.

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Operational amplifiers (op-amps) are generally used for actualizing simple and complex electronic circuits in the subject of analogue electronics. In an effort to improve the teaching of op-amps in electronics engineering curricula, op-amp circuits in various configurations are often used for experiments in laboratory sessions so that students can acquire certain psychomotor and cognitive skills by constructing circuit connections and analyzing input–output waveforms. As a result, multiple configurations of operational amplifier circuits are often needed, requiring multiple sets of experimental boards or circuits for each experiment. This is usually not cost effective, requires more consumable electronic components, requires more maintenance and storage space in facilities, and is less user friendly for the students. Therefore, the aim of this research is to design a single, compact, and easy-to-replicate experimental board that can be converted into multiple configurations of the LM741 operational amplifier, comprising an inverting amplifier, a noninverting amplifier, a voltage follower, a summing amplifier, a differential amplifier, a differentiator, and an integrator, with minimal electronic components at a cost lower than EUR 10. The experimental board was tested with a constant input voltage of 1.0 V AC and a switching frequency of 1.0 kHz. It is capable of producing an output voltage corresponding to the individual operational amplifier configurations and can thus be used as a facilitating module for teaching and learning activities in the field of analogue electronics.
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Kostić, Miloš, Vladimir Kojić, Savo Ičagić, Peter Andersson Ersman, Mohammad Yusuf Mulla, Jan Strandberg, Lars Herlogsson, Thierry Keller, and Matija Štrbac. "Design and Development of OECT Logic Circuits for Electrical Stimulation Applications." Applied Sciences 12, no. 8 (April 14, 2022): 3985. http://dx.doi.org/10.3390/app12083985.

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This paper presents the first successful implementation of fully printed electronics for flexible and wearable smart multi-pad stimulation electrodes intended for use in medical, sports and lifestyle applications. The smart multi-pad electrodes with the electronic circuits based on organic electrochemical transistor (OECT)-based electronic circuits comprising the 3–8 decoder for active pad selection and high current throughput transistors for switching were produced by multi-layer screen printing. Devices with different architectures of switching transistors were tested in relevant conditions for electrical stimulation applications. An automated testbed with a configurable stimulation source and an adjustable human model equivalent circuit was developed for this purpose. Three of the proposed architectures successfully routed electrical currents of up to 15 mA at an output voltage of 30 V, while one was reliably performing even at 40 V. The presented results demonstrate feasibility of the concept in a range of conditions relevant to several applications of electrical stimulation.
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Fan, JiSheng, and Wei Yuan. "Review of parametric fault prediction methods for power electronic circuits." Engineering Research Express 3, no. 4 (November 11, 2021): 042002. http://dx.doi.org/10.1088/2631-8695/ac340b.

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Abstract Power electronic circuits are widely used in rail transit, new energy power generation, aerospace and other fields. Therefore, stable and safe operation of power electronic circuits have a great impact on the reliability of the entire electrical system. Failures of majority of the power electronic circuits are not caused by sudden breakdown, but gradually degenerate in the process of operation until their functions are completely lost. It is necessary to carry out accurate health assessment and fault prediction for power electronic circuits. According to different research objects, fault prediction methods of power electronic circuits are divided into two categories: component-level fault prediction methods and circuit-level fault prediction methods. For each type of method, the specific principle and workflow are described in detail, and its advantages and disadvantages are analyzed. Finally, the research difficulties and the future development directions of fault prediction methods for power electronic circuits are pointed out.
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Sun, Junwei, Qinfei Yang, and Yanfeng Wang. "Memristive Circuit Design of Five-Person Voter Based on Memristor Ratioed Logic." Journal of Nanoelectronics and Optoelectronics 15, no. 12 (December 1, 2020): 1482–93. http://dx.doi.org/10.1166/jno.2020.2895.

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Conventional CMOS-based logic circuits are approaching their limits when it comes to speed and energy consumption, so the development of new electronic components becomes critical. Memristor is a nano-structured special electronic device with the advantages of simple structure, low power consumption and easy integration. This invention supplys a new method for developing complex logic circuits. This article mainly presents the design of a five-person voter circuit. The OR/AND logic can be accomplished by varying the polarity of two parallel memristors. On the basis of the two logic circuits, adder and comparator are constructed. Further, based on the adder and comparator, a five-person voter is implemented. The correctness and rationality of the five-person voter based on MRL are confirmed via logistical analysis and simulation. Compared with the traditional logic circuits, the logic circuit designed in this paper has advantages in area cost. The realization of the five-person voter circuit further proves that the logic circuit based on memristor can be cascaded. The research results are expected to build more complex circuits, which may provide a reference for the design of other practical circuits.
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Yagodkin, A., V. Zolnikov, Tatyana Skvortsova, A. Achkasov, Sergey Kuznecov, and F. Makarenko. "Development of algorithms and programs for the analysis of electrical characteristics BIS." Modeling of systems and processes 15, no. 4 (December 13, 2022): 136–48. http://dx.doi.org/10.12737/2219-0767-2022-15-4-136-148.

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Modern mathematical models for automatic analysis of electrical characteristics of integrated circuits are considered. The requirements for the analysis programs are formulated. A comparative analysis of machine methods for calculating integrated circuits is carried out in terms of their accuracy, RAM volumes and calculation time. The features of the development of modern automation tools for designing integrated circuits are considered. One of the main tasks of designing an integrated circuit is a schematic analysis, which must be carried out both at the preliminary stage and after the development of the integrated circuit topology. However, it is possible to identify the main re-quirements that a modern analysis program must meet: reliability - stable calculation of a wide class of electronic circuits, obtaining solutions even for poorly conditioned tasks; high performance - this requirement is especially important when calculating BIS, in tasks of multivariate analysis, such as statistical analysis, and optimization; low costs of machine memory and expansion of the maximum permissible complexity of the analyzed circuits; flexibility, the possibility of making changes to the program, in particular, the replacement of mathematical models of circuit components, the introduction of new models, the improvement of the computational algorithm, the inclusion of the pro-gram in more complex programs, etc.; the availability of convenient input and output of initial information.
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Sekitani, Tsuyoshi. "(Invited, Digital Presentation) Ultra-Thin Organic Integrated Circuits Enabling Bio-Signal Monitoring." ECS Meeting Abstracts MA2022-01, no. 10 (July 7, 2022): 799. http://dx.doi.org/10.1149/ma2022-0110799mtgabs.

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Digital technology has permeated our society, and a wide variety of electronic devices are now in use. In particular, the development of electronic devices for biometric measurements, such as wearable electronics, has been remarkable, and coupled with research and development of high-speed communication and artificial intelligence (AI), many social implementations are being presented. Our group has been conducting research and development on flexible and stretchable electronic systems, which are flexible, soft like rubber, and lightweight, by integrating functional organic nano-materials. In this research activity, our flexible and stretchable electronics have obtained certification for medical devices and are promoting the development of new electronics for use in medical institutions. In this presentation, I would like to introduce our recent activities on the flexible and stretchable electronics utilizing the nanoscience and technology, and developed low-noise and ultra-flexible systems for measuring biological action potentials (electroencephalogram; EEG and electrocardiogram ; ECG).
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Hanini, Wasma, Sami Mahfoudhi, and Moez Ayadi. "Development of Electrothermal Models for Electrical Traction." World Electric Vehicle Journal 13, no. 2 (February 15, 2022): 39. http://dx.doi.org/10.3390/wevj13020039.

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In this paper, improved electrothermal models of the power diode and IGBT have been developed. The main local physical effects have been considered. The proposed models are able to deal with electrical and thermal effects. The models were confirmed by comparison with other models having similar characteristics for different circuits and different temperatures. The developed models are implemented in a traction unit to study the electrothermal performance in an electric vehicle system. The models were implemented in the Pspice circuit simulation platform using standard Pspice components and analog behavior modeling (ABM) blocks. The switching performance of the diode and the IGBT have been studied under the influence of different circuit elements in order to study and estimate the on-state and switching losses pre-required for the design of various topologies of converters and inverters. The comparison shows that these models are simple, configurable with the electrical circuit simulator software. They are better able to predict the main circuit parameters needed for power electronics design. Transient thermal responses have been demonstrated for single pulse and repetition modes. The obtained results show that our model is suitable for a fully electrothermal use of power electronic circuit simulations.
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Dissertations / Theses on the topic "Electronic circuits development"

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Bergman, Joshua. "Development of Indium Arsenide Quantum Well Electronic Circuits." Diss., Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/5033.

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This dissertation focuses on the development of integrated circuits that employ InAs quantum well electronic devices. There are two InAs quantum well electronic devices studied in this work, the first being the pseudomorphic InAs/In₀.₅₃Ga₀.₄₇As/AlAs resonant tunneling diode (RTD) grown on an InP substrate, and the second being the InAs/AlSb HEMT. Because of there is no semi-insulating substrate near the InAs lattice constant of 6.06 Å this work develops monolithic and hybrid integration methods to realize integrated circuits. For the case of hybrid RTD circuits, a thin-film integration method was developed to integrate InAs/In₀.₅₃Ga₀.₄₇As/AlAs RTDs to prefabricated CMOS circuits, and this technique was employed to demonstrate a novel RTD-CMOS comparator. To achieve higher speed circuit operation, a next-generation RTD fabrication process was developed to minimize the parasitic capacitance associated with the thin-film hybridization process. This improved fabrication process is detailed and yield and uniformity analysis is included. Similar InP-based tunnel diodes can be integrated with InP-based HEMTs in monolithic RTD-HEMT integrated circuits, and in this work elementary microwave circuit components were characterized that co-integrate InP-based tunnel diodes with HEMTs. In the case of the InAs/AlSb HEMT, the monolithic approach grows the HEMT on a metamorphic buffer on a GaAs substrate. The semiconductor material and process development of the InAs/AlSb HEMT MMIC technology is described. The remarkable microwave and RF noise properties of the InAs/AlSb HEMT were characterized and analyzed, with special attention given to the strong effects of impact ionization in the narrow bandgap InAs channel. Results showed the extent to which impact ionization affects the small-signal gain and noise figure of the HEMT, and that these effects become less prevalent as the frequency of operation increases.
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Li, Shaohua. "Development and validation of a microcontroller emissions model." Diss., Rolla, Mo. : Missouri University of Science and Technology, 2008. http://scholarsmine.mst.edu/thesis/pdf/Li_09007dcc804e2d0e.pdf.

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Thesis (M.S.)--Missouri University of Science and Technology, 2008.
Vita. The entire thesis text is included in file. Title from title screen of thesis/dissertation PDF file (viewed May 5, 2008) Includes bibliographical references (p. 21-22).
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Besnard, Stéphane Claude Louis. "Optimising fault modelling and test development for VLSI analogue circuits." Thesis, University of Huddersfield, 2001. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.288503.

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Liu, Chun Kit. "Process development and characterization of inductors for organic substrates /." View Abstract or Full-Text, 2003. http://library.ust.hk/cgi/db/thesis.pl?MECH%202003%20LIU.

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Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2003.
Includes bibliographical references (leaves 70-72). Also available in electronic version. Access restricted to campus users.
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Dai, Hong. "Development of a decomposition approach for testing large analog circuits." Ohio : Ohio University, 1989. http://www.ohiolink.edu/etd/view.cgi?ohiou1172006982.

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Sykes, Robert Philip. "Definition study, design and development of a firing unit to initiate two pyrotechnic chains." Thesis, Cape Technikon, 1988. http://hdl.handle.net/20.500.11838/1086.

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Thesis (Masters Diploma (Electrical Engineering)--Cape Technikon, Cape Town, 1988
The subject of this thesis is the development of ahighly ruggedised, reliable electronic circuit. The circuit is to be used for the initiation of fuze heads and to charge a capacitor for later use in apyrotechnic chain. This circuit and its associated packaging will be called the firing unit. The thesis can be broadly divided into the following facets. I. The definition study, which defines what is needed and proposed means of achieving the customer requirements. 11. The design of the electronic circuitry in the system. Ii!. The design of the packaging containing the electronics. Iv. Adaptation of environmental testing, to verify system design. V. Implementation of environmental testing. Vi. Reliability analysis. Vii. Failure analysis and the determination of the effect of the supposed failure. Actions vto vii were used as inputs to improve 11 and ill, so achieving optimum performance and safety. The whole system was designed with the overriding objective of reliability and safety of personnel and equipment.
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Moon, Seung Jae. "Development of inkjet printing technology for fully solution process dedicated to organic electronic circuits." Thesis, Rennes 1, 2020. http://www.theses.fr/2020REN1S009.

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L’objectif de cette thèse était de démontrer les potentialités du procédé technologique d’impression jet d’encre pour la fabrication de circuits numériques à base de matériaux organiques. Une première étape sur le développement d’une structure de transistor couches minces organiques (OTFTs) fabriquée par impression jet d’encre a permis d’appréhender les mécanismes d’intéraction entre les différents matériaux déposés en solution. A partir de cette étude, la structure a pu être optimisée afin d’obtenir des performances électriques uniformes et reproductibles. Les transistors en couches minces organiques ont ensuite été modélisés électriquement à l’aide d’un modèle simple (Aim-Extract, Aim-Spice). La comparaison entre caractérisations et simulations électriques ont démontré la possibilité de prédire le comportement électrique de la structure OTFT imprimée.A partir de ce modèle, des portes logiques élémentaires ont été simulées puis fabriquées par la technologie d’impression jet d’encre. Les limitations en termes de temps de réponse des circuits et de tensions d’alimentation ont ainsi pu être déterminés. Finalement, des circuits électroniques combinatoires et séquentiels plus complexes, tel que des multiplexeurs et des bascules de type D, ont été fabriqués et caractérisés. La démarche employée au cours de cette étude, à savoir, l’optimisation de la structure OTFT, la modélisation électrique et la fabrication d’un circuit électronique complet a démontré les potentialités de l’impression jet d’encre pour la réalisation d’électronique bas-coût, grande surface, entièrement additive et potentiellement flexible
The main objective of this study was to demonstrate the capability of inkjet printing technology to fabricate organic based digital circuits. At first, development of an Organic Thin Film Transistor structure (OTFTs) fabricated with inkjet printing technology has highlighted interaction mechanisms between materials deposited with a fully solution process. From this study, the structure has been optimized to obtain uniform and reproducible electrical performance. The organic Thin Film Transistors were then electrically modeled using a simple model (Aim-Extract, Aim-Spice). The comparison between electrical characterizations and simulations has demonstrated the possibility to predict electrical behavior of printed OTFT. From this model, elementary logic gates were simulated and then fabricated by inkjet printing technology. Time response and supply voltage of such circuit has been determined. Finally, more complex combinational and sequential electronic circuits, such as multiplexers and D-latch, were fabricated and characterized. The Experimental protocol used in this study dealing with: i) OTFT electrical optimization, ii) electrical modeling and iii) electronic circuit fabrication has demonstrated the ability of inkjet printing to reach low-cost, large area, fully additive and potentially flexible electronics
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Troutman, Tia Shawana. "Development of low viscosity, high dielectric constant polymers for integral passive applications." Thesis, Georgia Institute of Technology, 1999. http://hdl.handle.net/1853/8683.

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Minichiello, Angela. "The development of a Heat Transfer Module (HTM) for the thermal management of sealed electronic enclosures." Thesis, Georgia Institute of Technology, 1997. http://hdl.handle.net/1853/16358.

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Cosgrove, S. J. "Expert system technology applied to the testing of complex digital electronic architectures : TEXAS; a synergistic test strategy planning and functional test pattern generation methodology applicable to the design, development and testing of complex digit." Thesis, Brunel University, 1989. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.234077.

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Books on the topic "Electronic circuits development"

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Gorby, Andrew. Development of a schematic capture graphical user interface for SPICE. Dublin: University College Dublin, 1995.

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Management of electronics assembly: Design, development, production, test. Oxford: Newnes, 1992.

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Tinder, Richard F. Asynchronous sequential machine design and analysis: A comprehensive development of the design and analysis of clock-independent state machines and systems. San Rafael, Calif. (1537 Fourth Street, San Rafael, CA 94901 USA): Morgan & Claypool Publishers, 2009.

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Bobyr', Maksim, Vitaliy Titov, and Vladimir Ivanov. Design of analog and digital devices. ru: INFRA-M Academic Publishing LLC., 2020. http://dx.doi.org/10.12737/1070341.

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The textbook contains the material necessary for the formation of students ' knowledge of the basics of analog and digital circuitry and the principles of building digital nodes, instilling skills in the development and design of digital devices, as well as performing practical work and a course project in the discipline "electrical Engineering, electronics and circuit engineering". Methods of calculation of analog circuits and synthesis of discrete devices of combinational type and automata with memory are considered. Examples of calculation of analog circuits and implementation of digital devices for various purposes on integrated circuits are given. Meets the requirements of Federal state educational standards of higher education of the latest generation. For students of higher education institutions studying in the field of training 09.03.01 "computer Science and engineering". It can be useful for students of the areas of training "Design and technology of electronic means", "Biotechnical systems and technologies"and" Information security".
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Harald, Gossner, and Stadler Wolfgang, eds. Advanced simulation methods for ESD protection development. Amsterdam: Elsevier, 2003.

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Man, Cham Kit, ed. Computer-aided design and VLSI device development. Boston: Kluwer Academic Publishers, 1986.

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David, Goulet, ed. Bare board drilling: Trends and development in printed circuit board drilling. San Francisco: Miller Freeman, 1992.

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IEEE/CPMT International Electronics Manufacturing Technology Symposium (22nd 1998 Berlin, Germany). Twenty second IEEE/CPMT International Electronics Manufacturing Technology Symposium: IEMT-Europe 1998 : electronics manufacturing and development for automotives, April 27th-29th, 1998, Berlin, Germany. [New York, N.Y.]: IEEE, 1998.

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Cosgrove, Steven John. Expert system technology applied to the testing of complex digital electronic architectures: TEXAS : a synergistic test strategy planning and functional test pattern generation methodology applicable to the design, development and testing of complex digital electronic circuits. Uxbridge: Brunel University, 1989.

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1955-, Paterson Peter, and Singh Leena 1971-, eds. System-On-A-Chip verification: Methodology and techniques. Boston, MA: Kluwer Academic Publishers, 2001.

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Book chapters on the topic "Electronic circuits development"

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Dummer, G. W. A. "The Development of Components, Tubes, Transistors and Integrated Circuits." In Electronic Inventions and Discoveries, 7–16. Boca Raton: Routledge, 2021. http://dx.doi.org/10.1201/9780203758649-3.

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Kour, Harleen, Deepti Sharma, and Sachin Gupta. "Design and development of electronic precipitator for particulate matter air purification processes." In Intelligent Circuits and Systems, 108–12. London: CRC Press, 2021. http://dx.doi.org/10.1201/9781003129103-19.

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Kumar, Arun, and Sharad Sharma. "Internet of Things (IoT) with Energy Sector-Challenges and Development." In Electrical and Electronic Devices, Circuits and Materials, 183–96. First edition. | Boca Raton, FL : CRC Press/Taylor & Francis: CRC Press, 2021. http://dx.doi.org/10.1201/9781003097723-11.

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De Ponti, Jacopo Maria. "Autonomous Wireless Sensors via Graded Elastic Metamaterials." In Civil and Environmental Engineering for the Sustainable Development Goals, 55–66. Cham: Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-030-99593-5_5.

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AbstractAmongst the 17th Sustainable and Development Goals (SDGs), it’s crucial to ensure access to sustainable and modern energy, as emphasized by the Goal 7. This is not only relevant for large utilities, but also for tiny devices such as wireless sensors that can ubiquitously found in our information driven society. Recent advances in low-power consumption circuitry have enabled ultrasmall power integrated circuits, which can run with extremely low amount of power. For these reasons, energy harvesting can be used to self-power small electronic devices, using ambient waste energy from vibrations. Recent metamaterial technologies allow to dramatically increase the energy available for harvesting, and the operational bandwidth. A large-scale application of metamaterial-based energy harvesting could increase the sustainability in the global energy mix as well as provide improvement in energy efficiency. Graphical Abstract
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Willner, Itamar, Bilha Willner, and Eugenii Katz. "Bioelectronics: Development of Biosensors, Biofuel-Cells and Circuitry." In Molecular Electronics: Bio-sensors and Bio-computers, 311–39. Dordrecht: Springer Netherlands, 2003. http://dx.doi.org/10.1007/978-94-010-0141-0_12.

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Freund, Roland W. "Electronic Circuit Simulation and the Development of New Krylov-Subspace Methods." In Mathematics in Industry, 29–55. Cham: Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-030-96173-2_2.

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Valori, Marcello, Vito Basile, Simone Pio Negri, Paolo Scalmati, Chiara Renghini, and Irene Fassi. "Towards the Automated Coverlay Assembly in FPCB Manufacturing: Concept and Preliminary Tests." In IFIP Advances in Information and Communication Technology, 36–50. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-72632-4_3.

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AbstractIn modern electronics, flexible and rigid-flex PCBs are largely used due to their intrinsic versatility and performance, allowing to increase the available volume, or enabling connection between unconstrained components. Rigid-flex PCBs consists of rigid board portions with flexible interconnections and are commonly used in a wide variety of industrial applications. However, the assembly process of these devices still has some bottlenecks. Specifically, they require the application of cover layers (namely, coverlays), to provide insulation and protection of the flexible circuits. Due to the variability in planar shape and dimensions, the coverlay application is still performed manually, requiring troublesome manipulation steps and resulting in undetermined time-cycle and precision.This paper aims at the improvement of the industrial process currently performed, by proposing an approach for the automation of Kapton coverlay manipulation and application. Since these products are commercially provided as a film with a protective layer to be removed, the peeling issue is addressed, representing a challenging step of the automated process; the results of a systematic series of tests, performed in order to validate the peeling strategy, are reported in the paper. The overall assembly strategy relies on the development of a customized multi-hole vacuum gripper, whose concept is presented and contextualized in the proposed assembly process by outlining a suitable workcell architecture.
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Khan, Baseem, Samuel Degarege, Fsaha Mebrahtu, and Hassan Alhelou. "Energy Storage System and Its Power Electronic Interface." In Research Anthology on Smart Grid and Microgrid Development, 183–95. IGI Global, 2022. http://dx.doi.org/10.4018/978-1-6684-3666-0.ch009.

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This chapter examines the modeling and simulation of energy storage (battery, flywheel, etc.) systems interfaced to the power grid by using power electronic device, like chopper module, Rectifier module, and filter circuits, which are essential to the load balance between supply and demand, and to eliminate harmonics and to ensure efficient, cost effective, and reliable operations. Energy storage system in power grid is the same as memory in computer system. Energy efficiency is a key performance indicator for energy storage system. The energy storage system is the most promising component to enhance the system reliability and flexibility.
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Labiedh, Walid, Bessem Zitouna, Mohamed Tlig, and Jaleleddine Ben Hadj Slama. "Development of Generic Radiating Model for Rectangular Capacitors: Magnetic Near Fields Analysis and Modeling." In Recent Topics in Electromagnetic Compatibility. IntechOpen, 2022. http://dx.doi.org/10.5772/intechopen.98894.

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This chapter deals with modeling the radiation from rectangular film capacitors as a power electronics component. The rectangular film capacitors are sources of electromagnetic radiation, where its characterization is crucial for electronic circuits EMC. Our study presents the analyses and modeling of the magnetic near field radiated by the plastic and the polyester capacitors. An electromagnetic inverse method is combined with an optimization method based on genetic algorithms to create a radiating equivalent model. A very good agreement is observed between the magnetic near field cartography measured above the studied structure and calculated using the developed model parameters. Finally, a generic radiating model is proposed for various types of rectangular film capacitors. The generic model is validated using the measurements on a rectangular capacitor. The obtained equivalent model can calculate the magnetic field at any near field zone and far field around the capacitors. Circuit designers can use the field distribution to optimize the placement of the capacitors on the printed circuit board to reduce their coupling and potential interaction with other equipment in the vicinity of the system.
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Mohanbabu, A., M. Saravanan, J. Ajayan, and S. Baskaran. "Design and development of AlGaN/GaN HEMT for biosensing applications for detection of cancers, tumors, and kidney malfunctioning." In Electronic Devices, Circuits, and Systems for Biomedical Applications, 95–114. Elsevier, 2021. http://dx.doi.org/10.1016/b978-0-323-85172-5.00001-0.

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Conference papers on the topic "Electronic circuits development"

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Sarges Guerra, Acacio, Gustavo Massaccesi, and Daniel Del Greco. "TEACHING ELECTRICAL AND ELECTRONIC CIRCUITS WITH VISIR SUPPORT." In 13th International Technology, Education and Development Conference. IATED, 2019. http://dx.doi.org/10.21125/inted.2019.2075.

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Okumura, Kenichi, Iwao Hosako, Yukari Yamashita-Yui, Makoto Akiba, and Norihisa Hiromoto. "Development of GaAs JFETs for cryogenic electronic circuits." In Astronomical Telescopes & Instrumentation, edited by Albert M. Fowler. SPIE, 1998. http://dx.doi.org/10.1117/12.317307.

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Subramanian, Vivek, Josephine B. Chang, Alejandro de la Fuente Vornbrock, Daniel C. Huang, Lakshmi Jagannathan, Frank Liao, Brian Mattis, et al. "Printed electronics for low-cost electronic systems: Technology status and application development." In ESSCIRC 2008 - 34th European Solid-State Circuits Conference. IEEE, 2008. http://dx.doi.org/10.1109/esscirc.2008.4681785.

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Lall, Pradeep, Jinesh Narangaparambil, and Scott Miller. "Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment." In ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2021. http://dx.doi.org/10.1115/ipack2021-74086.

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Abstract The increased versatility in the design and manufacturing of components in low volumes, as well as the shorter time between design and prototype, has increased interest in the field of additively printed electronics. The ability to directly print on a variety of substrates, whether rigid, flexible, or conformable, provides several benefits over conventional electronics fabrication methods. Furthermore, the growing complexity of flexible electronics necessitates the development of multilayered circuits similar to traditional PCBs to decrease the volumetric and gravimetric effect of the underlying electronics. Using z-axis interconnections with dielectric materials, which may allow or prevent the connection between two layers, is one method of reaching several layers of circuits. In this paper, a working multilayer circuitry test vehicle is designed and additively printed using the direct-write method. The circuit model involves conductive and dielectric ink printing, as well as passive and active component attachments using an electrically conductive adhesive (ECA) and low-temperature solder (LTS). The study also shows details about the process of developing dielectric printing parameters for microvias for multilayer z-axis interconnections.
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Abu-Dawas, Motasem. "Research and development of integrated data model of circuit components for CAD of electronic circuits." In ICGDA '18: 2018 the International Conference on Geoinformatics and Data Analysis, ICGDA '18. New York, NY, USA: ACM, 2018. http://dx.doi.org/10.1145/3220228.3220256.

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Maiti, C. K., S. Mahata, and Ananda Maiti. "Design and Development of a Cost-Effective Online Electronic Circuits Laboratory." In 2011 Third International Conference on Technology for Education (T4E). IEEE, 2011. http://dx.doi.org/10.1109/t4e.2011.43.

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Zheng, Yi, Zhi-Zhu He, Jun Yang, and Jing Liu. "Liquid Metal Printing for Manufacturing Large-Scale Flexible Electronic Circuits." In ASME 2014 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/imece2014-37763.

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The advancement of printed electronics technology has significantly facilitated the development of electronic engineering. However, so far there still remain big barriers to impede the currently available printing technologies from being extensively used. Many of the difficulties came from the factors like: complicated ink-configurations, high post-treatment temperature, poor conductivity in room temperature and extremely high cost and time consuming fabrication process. From an alternative strategy, our recently invented desktop liquid metal printer offered a flexible way to better address the above deficiencies. Through modifying the system developed in the authors’ lab, here we demonstrated the feasibility of the method in quickly and reliably printing out various large area electronic circuits. Particularly, the liquid metal ink made of GaIn24.5 alloy, with a high electrical resistivity of 2.98×10−7 Ω·m, can be rapidly printed on polyvinyl chloride (PVC) substrate with maximum sizes spanning from centimeter size to meter large. Most important of all, all these manufactures were achieved at an extremely low cost level which clearly shows the ubiquitous value of the liquid metal printer. To evaluate the working performance of the present electronics fabrication method, the electrical resistance and wire width of the printed circuits were investigated under multiple overprinting cycles. For practical illustration purpose, LED lighting conductive patterns which can serve as a functional electronic decoration art were fabricated on the flexible plastic substrate. The present work sets up an example for directly making large-scale ending consumer electronics via a high-efficiency and low-cost way.
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Bana, F., A. Garnier, N. Bresson, F. Ponthenier, P. Loiodice, F. Casset, A. Jouve, D. Lattard, and S. Cheramy. "Development of fine pitch interconnections for 3D integrated circuits." In 2016 6th Electronic System-Integration Technology Conference (ESTC). IEEE, 2016. http://dx.doi.org/10.1109/estc.2016.7764468.

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Klyamerov, Konstantin, Andrey Lysenkov, and Sergey Amelin. "DEVELOPMENT OF SPICE MODULE OF HV9931 CHIP FOR SIMULATION OF ELECTRONIC CIRCUITS." In CAD/EDA/SIMULATION IN MODERN ELECTRONICS 2021. Bryansk State Technical University, 2021. http://dx.doi.org/10.30987/conferencearticle_61c997f0431748.26288605.

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DeLaney, Scott C., Mary B. Burbules, Mayank Garg, Adam S. Hollinger, and Christopher D. Rahn. "Design and Development of a Battery Internal Short Circuit Test Machine." In ASME 2017 11th International Conference on Energy Sustainability collocated with the ASME 2017 Power Conference Joint With ICOPE-17, the ASME 2017 15th International Conference on Fuel Cell Science, Engineering and Technology, and the ASME 2017 Nuclear Forum. American Society of Mechanical Engineers, 2017. http://dx.doi.org/10.1115/es2017-3407.

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The use of lithium-based batteries, due to their high energy density, has become popular for power sources in portable electronic devices. Safety concerns over lithium cell applications have arisen due to their lower abuse tolerance compared to standard battery designs. Internal short circuits present one of the more dangerous abuse situations since there is a great potential of thermal runaway leading to fire and explosion. Field failures and recalls associated with internal short circuits demonstrate the risks of lithium batteries. Understanding the response of lithium cells under internal short circuit conditions is of great importance to ensure the safe development of lithium battery application. In this work, an internal short circuit test machine was designed to conduct nail penetration tests of lithium chemistry cells. The test machine successfully provides the required force to allow for multi-cell penetration. The test machine also provides accurate control of the penetrating nail’s position and velocity. This testing will support the development of models to simulate the mechanism of internal short circuits of lithium cells.
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Reports on the topic "Electronic circuits development"

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Kiv, Arnold E., Vladyslav V. Bilous, Dmytro M. Bodnenko, Dmytro V. Horbatovskyi, Oksana S. Lytvyn, and Volodymyr V. Proshkin. The development and use of mobile app AR Physics in physics teaching at the university. [б. в.], July 2021. http://dx.doi.org/10.31812/123456789/4629.

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This paper outlines the importance of using Augmented Reality (AR) in physics education at the university as a valuable tool for visualization and increasing the attention and motivation of students to study, solving educational problems related to future professional activities, improving the interaction of teachers and students. Provided an analysis of the types of AR technology and software for developing AR apps. The sequences of actions for developing the mobile application AR Physics in the study of topics: “Direct electronic current”, “Fundamentals of the theory of electronic circuits”. The software tools for mobile application development (Android Studio, SDK, NDK, Google Sceneform, 3Ds MAX, Core Animation, Asset Media Recorder, Ashampoo Music Studio, Google Translate Plugin) are described. The bank of 3D models of elements of electrical circuits (sources of current, consumers, measuring devices, conductors) is created. Because of the students’ and teachers’ surveys, the advantages and disadvantages of using AR in the teaching process are discussed. Mann-Whitney U-test proved the effectiveness of the use of AR for laboratory works in physics by students majoring in “Mathematics”, “Computer Science”, and “Cybersecurity”.
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Philpott, Rick A. Development of High Performance Electronics and Optical-to-Electrical Advanced Circuitry for Photonic Analog-to-Digital Converters. Fort Belvoir, VA: Defense Technical Information Center, February 2006. http://dx.doi.org/10.21236/ada444702.

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