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Journal articles on the topic "Electron microscopy":
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Schatten, G., J. Pawley, and H. Ris. "Integrated microscopy resource for biomedical research at the university of wisconsin at madison." Proceedings, annual meeting, Electron Microscopy Society of America 45 (August 1987): 594–97. http://dx.doi.org/10.1017/s0424820100127451.
The High Voltage Electron Microscopy Laboratory [HVEM] at the University of Wisconsin-Madison, a National Institutes of Health Biomedical Research Technology Resource, has recently been renamed the Integrated Microscopy Resource for Biomedical Research [IMR]. This change is designed to highlight both our increasing abilities to provide sophisticated microscopes for biomedical investigators, and the expansion of our mission beyond furnishing access to a million-volt transmission electron microscope. This abstract will describe the current status of the IMR, some preliminary results, our upcoming plans, and the current procedures for applying for microscope time.The IMR has five principal facilities: 1.High Voltage Electron Microscopy2.Computer-Based Motion Analysis3.Low Voltage High-Resolution Scanning Electron Microscopy4.Tandem Scanning Reflected Light Microscopy5.Computer-Enhanced Video MicroscopyThe IMR houses an AEI-EM7 one million-volt transmission electron microscope.
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Möller, Lars, Gudrun Holland, and Michael Laue. "Diagnostic Electron Microscopy of Viruses With Low-voltage Electron Microscopes." Journal of Histochemistry & Cytochemistry 68, no. 6 (May 21, 2020): 389–402. http://dx.doi.org/10.1369/0022155420929438.
Diagnostic electron microscopy is a useful technique for the identification of viruses associated with human, animal, or plant diseases. The size of virus structures requires a high optical resolution (i.e., about 1 nm), which, for a long time, was only provided by transmission electron microscopes operated at 60 kV and above. During the last decade, low-voltage electron microscopy has been improved and potentially provides an alternative to the use of high-voltage electron microscopy for diagnostic electron microscopy of viruses. Therefore, we have compared the imaging capabilities of three low-voltage electron microscopes, a scanning electron microscope equipped with a scanning transmission detector and two low-voltage transmission electron microscopes, operated at 25 kV, with the imaging capabilities of a high-voltage transmission electron microscope using different viruses in samples prepared by negative staining and ultrathin sectioning. All of the microscopes provided sufficient optical resolution for a recognition of the viruses tested. In ultrathin sections, ultrastructural details of virus genesis could be revealed. Speed of imaging was fast enough to allow rapid screening of diagnostic samples at a reasonable throughput. In summary, the results suggest that low-voltage microscopes are a suitable alternative to high-voltage transmission electron microscopes for diagnostic electron microscopy of viruses.
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Ross, Frances M. "Materials Science in the Electron Microscope." MRS Bulletin 19, no. 6 (June 1994): 17–21. http://dx.doi.org/10.1557/s0883769400036691.
This issue of the MRS Bulletin aims to highlight the innovative and exciting materials science research now being done using in situ electron microscopy. Techniques which combine real-time image acquisition with high spatial resolution have contributed to our understanding of a remarkably diverse range of physical phenomena. The articles in this issue present recent advances in materials science which have been made using the techniques of transmission electron microscopy (TEM), including holography, scanning electron microscopy (SEM), low-energy electron microscopy (LEEM), and high-voltage electron microscopy (HVEM).The idea of carrying out dynamic experiments involving real-time observation of microscopic phenomena has always had an attraction for materials scientists. Ever since the first static images were obtained in the electron microscope, materials scientists have been interested in observing processes in real time: we feel that we obtain a true understanding of a microscopic phenomenon if we can actually watch it taking place. The idea behind “materials science in the electron microscope” is therefore to use the electron microscope—with its unique ability to image subtle changes in a material at or near the atomic level—as a laboratory in which a remarkable variety of experiments can be carried out. In this issue you will read about dynamic experiments in areas such as phase transformations, thin-film growth, and electromigration, which make use of innovative designs for the specimen, the specimen holder, or the microscope itself. These articles speak for themselves in demonstrating the power of real-time analysis in the quantitative exploration of reaction mechanisms.The first transmission electron microscopes operated at low accelerating voltages, up to about 100 kV. This placed a severe limitation on the thickness of foils that could be examined: Heavy elements, for example, had to be made into foils thinner than 0.1 μm. It was felt that any phenomenon whose “mean free path” was comparable to the foil thickness would be significantly affected by the foil surfaces, and therefore would be unsuitable for study in situ. However, technology quickly generated ever higher accelerating voltages, culminating in the giant 3 MeV electron microscopes. At these voltages, electrons can penetrate materials as thick as 6–9 μm for light elements such as Si and Al, and 1 μm for very heavy ones such as Au and U.
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Tromp, Ruud M. "Low-Energy Electron Microscopy." MRS Bulletin 19, no. 6 (June 1994): 44–46. http://dx.doi.org/10.1557/s0883769400036757.
For surface science, the 1980s were the decade in which the microscopes arrived. The scanning tunneling microscope (STM) was invented in 1982. Ultrahigh vacuum transmission electron microscopy (UHVTEM) played a key role in resolving the structure of the elusive Si(111)-7 × 7 surface. Scanning electron microscopy (SEM) as well as reflection electron microscopy (REM) were applied to the study of growth and islanding. And low-energy electron microscopy (LEEM), invented some 20 years earlier, made its appearance with the work of Telieps and Bauer.LEEM and TEM have many things in common. Unlike STM and SEM, they are direct imaging techniques, using magnifying lenses. Both use an aperture to select a particular diffracted beam, which determines the nature of the contrast. If the direct beam is selected (no parallel momentum transfer), a bright field image is formed, and contrast arises primarily from differences in the scattering factor. A dark field image is formed with any other beam in the diffraction pattern, allowing contrast due to differences in symmetry. In LEEM, phase contrast is the third important mechanism by which surface and interface features such as atomic steps and dislocations may be imaged. One major difference between TEM and LEEM is the electron energy: 100 keV and above in TEM, 100 eV and below in LEEM. In LEEM, the imaging electrons are reflected from the sample surface, unlike TEM where the electrons zip right through the sample, encountering top surface, bulk, and bottom surface. STM and TEM are capable of ~2 Å resolution, while LEEM and SEM can observe surface features (including atomic steps) with -100 Å resolution.
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Martone, Maryann E. "Bridging the Resolution Gap: Correlated 3D Light and Electron Microscopic Analysis of Large Biological Structures." Microscopy and Microanalysis 5, S2 (August 1999): 526–27. http://dx.doi.org/10.1017/s1431927600015956.
One class of biological structures that has always presented special difficulties to scientists interested in quantitative analysis is comprised of extended structures that possess fine structural features. Examples of these structures include neuronal spiny dendrites and organelles such as the Golgi apparatus and endoplasmic reticulum. Such structures may extend 10's or even 100's of microns, a size range best visualized with the light microscope, yet possess fine structural detail on the order of nanometers that require the electron microscope to resolve. Quantitative information, such as surface area, volume and the micro-distribution of cellular constituents, is often required for the development of accurate structural models of cells and organelle systems and for assessing and characterizing changes due to experimental manipulation. Performing estimates of such quantities from light microscopic data can result in gross inaccuracies because the contribution to total morphometries of delicate features such as membrane undulations and excrescences can be quite significant. For example, in a recent study by Shoop et al, electron microscopic analysis of cultured chick ciliary ganglion neurons showed that spiny projections from the plasmalemma that were not well resolved in the light microscope effectively doubled the surface area of these neurons.While the resolution provided by the electron microscope has yet to be matched or replaced by light microscopic methods, one drawback of electron microscopic analysis has always been the relatively small sample size and limited 3D information that can be obtained from samples prepared for conventional transmission electron microscopy. Reconstruction from serial electron micrographs has provided one way to circumvent this latter problem, but remains one of the most technically demanding skills in electron microscopy. Another approach to 3D electron microscopic imaging is high voltage electron microscopy (HVEM). The greater accelerating voltages of HVEM's allows for the use of much thicker specimens than conventional transmission electron microscopes.
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Youngblom, J. H., J. Wilkinson, and J. J. Youngblom. "Telepresence Confocal Microscopy." Microscopy Today 8, no. 10 (December 2000): 20–21. http://dx.doi.org/10.1017/s1551929500054146.
The advent of the Internet has allowed the development of remote access capabilities to a growing variety of microscopy systems. The Materials MicroCharacterization Collaboratory, for example, has developed an impressive facility that provides remote access to a number of highly sophisticated microscopy and microanalysis instruments, While certain types of microscopes, such as scanning electron microscopes, transmission electron microscopes, scanning probe microscopes, and others have already been established for telepresence microscopy, no one has yet reported on the development of similar capabilities for the confocal laser scanning microscope.
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O'Keefe, Michael A., John H. Turner, John A. Musante, Crispin J. D. Hetherington, A. G. Cullis, Bridget Carragher, Ron Jenkins, et al. "Laboratory Design for High-Performance Electron Microscopy." Microscopy Today 12, no. 3 (May 2004): 8–17. http://dx.doi.org/10.1017/s1551929500052093.
Since publication of the classic text on the electron microscope laboratory by Anderson, the proliferation of microscopes with field emission guns, imaging filters and hardware spherical aberration correctors (giving higher spatial and energy resolution) has resulted in the need to construct special laboratories. As resolutions iinprovel transmission electron microscopes (TEMs) and scanning transmission electron microscopes (STEMs) become more sensitive to ambient conditions. State-of-the-art electron microscopes require state-of-the-art environments, and this means careful design and implementation of microscope sites, from the microscope room to the building that surrounds it. Laboratories have been constructed to house high-sensitive instruments with resolutions ranging down to sub-Angstrom levels; we present the various design philosophies used for some of these laboratories and our experiences with them. Four facilities are described: the National Center for Electron Microscopy OAM Laboratory at LBNL; the FEGTEM Facility at the University of Sheffield; the Center for Integrative Molecular Biosciences at TSRI; and the Advanced Microscopy Laboratory at ORNL.
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McMorran, Benjamin J., Peter Ercius, Tyler R. Harvey, Martin Linck, Colin Ophus, and Jordan Pierce. "Electron Microscopy with Structured Electrons." Microscopy and Microanalysis 23, S1 (July 2017): 448–49. http://dx.doi.org/10.1017/s1431927617002926.
Kordesch, Martin E. "Introduction to emission electron microscopy for the in situ study of surfaces." Proceedings, annual meeting, Electron Microscopy Society of America 51 (August 1, 1993): 506–7. http://dx.doi.org/10.1017/s0424820100148368.
The Photoelectron Emission Microscope (PEEM) and Low Energy Electron Microscope (LEEM) are parallel-imaging electron microscopes with highly surface-sensitive image contrast mechanisms. In PEEM, the electron yield at the illumination wavelength determines image contrast, in LEEM, the intensity of low energy (< 100 eV) electrons back-diffracted from the surface, as well as interference effects, are responsible for image contrast. Mirror Electron Microscopy is also possible with the LEEM apparatus. In MEM, no electron penetration into the solid occurs, and an image of surface electronic potentials is obtained.While the emission microscope techniques named above are not high resolution methods, the unique contrast mechanisms, the ability to use thick single crystal samples, their compatibility with uhv surface science methods and new material-growth methods, coupled with real-time imaging capability, make them very useful.These microscopes do not depend on scanning probes, and some are compatible with pressures up to 10-3 Torr and specimen temperatures above 1300K.
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J. H., Youngblom, Wilkinson J., and Youngblom J.J. "Telepresence Confocal Microscopy." Microscopy and Microanalysis 6, S2 (August 2000): 1164–65. http://dx.doi.org/10.1017/s1431927600038319.
The advent of the Internet has allowed the development of remote access capabilities to a growing variety of microscopy systems. The Materials MicroCharacterization Collaboratory, for example, has developed an impressive facility that provides remote access to a number of highly sophisticated microscopy and microanalysis instruments. While certain types of microscopes, such as scanning electron microscopes, transmission electron microscopes, scanning probe microscopes, and others have already been established for telepresence microscopy, no one has yet reported on the development of similar capabilities for the confocal laser scanning microscope.At California State University-Stanislaus, home of the CSUPERB (California State University Program for Education and Research in Biotechnology) Confocal Microscope Core Facility, we have established a remote access confocal laser scanning microscope facility that allows users with virtually any type of computer platform to connect to our system. Our Leica TCS NT confocal system, with an interchangeable upright (DMRXE) and inverted microscope (DMIRBE) set up,
Dissertations / Theses on the topic "Electron microscopy":
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Jin, Liang. "Direct electron detection in transmission electron microscopy." Diss., [La Jolla, Calif.] : University of California, San Diego, 2009. http://wwwlib.umi.com/cr/ucsd/fullcit?p3344737.
Thesis (Ph. D.)--University of California, San Diego, 2009. Title from first page of PDF file (viewed April 3, 2009). Available via ProQuest Digital Dissertations. Vita. Includes bibliographical references (p. 148-151).
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Davies, D. G. "Scanning electron acoustic microscopy." Thesis, University of Cambridge, 1985. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.304042.
Duncan, James Lyon. "Electron microscopy of photosystems." Thesis, Imperial College London, 2004. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.412477.
Harland, C. J. "Detector and electronic developments for scanning electron microscopy." Thesis, University of Sussex, 1985. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.370435.
Morgan, Scott Warwick. "Gaseous secondary electron detection and cascade amplification in the environmental scanning electron microscope /." Electronic version, 2005. http://adt.lib.uts.edu.au/public/adt-NTSM20060511.115302/index.html.
Bruley, John. "Analytical electron microscopy of diamond." Thesis, University of Cambridge, 1987. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.237560.
Briggs, John A. G. "Cryo-electron microscopy of retroviruses." Thesis, University of Oxford, 2004. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.408819.
Sader, Kasim Stefan. "Aspects of biological electron microscopy." Thesis, University of Leeds, 2006. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.434150.
Song, Se Ahn. "Electron microscopy of lanthanide diphthalocyanines." Thesis, University of Essex, 1989. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.328597.
Cullen, Sarah Louise. "Electron microscopy of carbon nanotubes." Thesis, University of Cambridge, 1995. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.387605.
Asia-Pacific Electron Microscopy Conference (5th 1992 Beijing, China). Electron microscopy. Edited by Kuo Kʻo-hsin and Zhai Z. H. Singapore: World Scientific, 1992.
Nölting, Bengt. "Electron microscopy." In Methods in Modern Biophysics, 107–20. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-662-05367-6_6.
Saka, S. "Electron Microscopy." In Methods in Lignin Chemistry, 133–45. Berlin, Heidelberg: Springer Berlin Heidelberg, 1992. http://dx.doi.org/10.1007/978-3-642-74065-7_10.
Janssens, Koen. "Electron Microscopy." In Modern Methods for Analysing Archaeological and Historical Glass, 129–54. Oxford, UK: John Wiley & Sons Ltd, 2013. http://dx.doi.org/10.1002/9781118314234.ch6.
Michler, G. H. "Electron microscopy." In Polymer Science and Technology Series, 186–97. Dordrecht: Springer Netherlands, 1999. http://dx.doi.org/10.1007/978-94-011-4421-6_26.
Bertazzo, Sergio. "Electron Microscopy." In Microscopy of the Heart, 119–32. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-95304-5_6.
Doane, Frances W. "Electron Microscopy." In Laboratory Diagnosis of Infectious Diseases Principles and Practice, 121–31. New York, NY: Springer New York, 1988. http://dx.doi.org/10.1007/978-1-4612-3900-0_7.
Hermansson, Anne-Marie, and Maud Langton. "Electron Microscopy." In Physical Techniques for the Study of Food Biopolymers, 277–341. Boston, MA: Springer US, 1994. http://dx.doi.org/10.1007/978-1-4615-2101-3_6.
Nölting, Bengt. "Electron microscopy." In Methods in Modern Biophysics, 107–20. Berlin, Heidelberg: Springer Berlin Heidelberg, 2009. http://dx.doi.org/10.1007/978-3-642-03022-2_6.
Conference papers on the topic "Electron microscopy":
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Kuo, Kehsin, and Junen Yao. "Electron Microscopy." In International Symposium on Electron Microscopy. WORLD SCIENTIFIC, 1991. http://dx.doi.org/10.1142/9789814539340.
Villarraga-Gómez, Herminso, Kyle Crosby, Masako Terada, and Mansoureh Norouzi Rad. "Assessing Electronics with Advanced 3D X-ray Microscopy Techniques and Electron Microscopy." In ISTFA 2023. ASM International, 2023. http://dx.doi.org/10.31399/asm.cp.istfa2023p0554.
Abstract This paper presents advanced workflows that combine 3D Xray microscopy (XRM), nanoscale tomography, and electron microscopy to generate a detailed visualization of the interior of electronic devices and assemblies to enable the study of internal components for failure analysis (FA). Newly developed techniques such as the integration of deep-learning (DL) based algorithms for 3D image reconstruction are also discussed in this article. In addition, a DL-based tool (called DeepScout) is introduced that uses high-resolution 3D XRM datasets as training data for lower-resolution, larger field-of-view datasets and scales larger-volume data using a neural network model. Ultimately, these workflows can be run independently or complementary to other multiscale correlative microscopy evaluations, e.g., electron microscopy, and will provide valuable insights into the inner workings of electronic packages and integrated circuits at multiple length scales, from macroscopic features on electronic devices (i.e., hundreds of mm) to microscopic details in electronic components (in the tens of nm). Understanding advanced electronic systems through X-ray imaging and electron microscopy, and possibly complemented with some additional correlative microscopy investigations, can speed development time, increase cost efficiency, and simplify FA and quality inspection of printed circuit boards (PCBs) and electronic devices assembled with new emerging technologies.
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Musumeci, Pietro. "Single-shot time-resolved electron microscopy using MeV electrons." In European Microscopy Congress 2020. Royal Microscopical Society, 2021. http://dx.doi.org/10.22443/rms.emc2020.678.
Banhart, Florian. "Nanosecond analytical electron microscopy with single electron pulses." In European Microscopy Congress 2020. Royal Microscopical Society, 2021. http://dx.doi.org/10.22443/rms.emc2020.225.
Nicholls, Daniel. "Distributing the Electron Dose to Minimise Electron Beam Damage in Scanning Transmission Electron Microscopy." In European Microscopy Congress 2020. Royal Microscopical Society, 2021. http://dx.doi.org/10.22443/rms.emc2020.159.
Kuo, K. H., and Z. H. Zhai. "Electron Microscopy I." In 5th Asia-Pacific Electron Microscopy Conference. WORLD SCIENTIFIC, 1992. http://dx.doi.org/10.1142/9789814537544.
Kuo, K. H., and Z. H. Zhai. "Electron Microscopy II." In 5th Asia-Pacific Electron Microscopy Conference. WORLD SCIENTIFIC, 1992. http://dx.doi.org/10.1142/9789814537537.
Nabben, David, Joel Kuttruff, Levin Stolz, Andrey Ryabov, and Peter Baum. "Attosecond Electron Microscopy." In CLEO: Fundamental Science. Washington, D.C.: Optica Publishing Group, 2023. http://dx.doi.org/10.1364/cleo_fs.2023.fth1c.1.
Krajnak, Matus. "Transforming transmission electron microscopy with MerlinEM electron counting detector." In European Microscopy Congress 2020. Royal Microscopical Society, 2021. http://dx.doi.org/10.22443/rms.emc2020.594.
Talebi, Nahid. "Electron-driven photon sources for spectral interferometry with electron microscopes." In European Microscopy Congress 2020. Royal Microscopical Society, 2021. http://dx.doi.org/10.22443/rms.emc2020.635.
Weber, Peter M. Time-Resolved Scanning Electron Microscopy. Fort Belvoir, VA: Defense Technical Information Center, June 2006. http://dx.doi.org/10.21236/ada455461.
Binev, Peter, Wolfgang Dahmen, Ronald DeVore, Philipp Lamby, Daniel Savu, and Robert Sharpley. Compressed Sensing and Electron Microscopy. Fort Belvoir, VA: Defense Technical Information Center, January 2010. http://dx.doi.org/10.21236/ada560915.
Allard, L., and T. Nolan. (Concepts for future developments in electron microscopy). [Concept for Future Development in Electron Microscopy]. Office of Scientific and Technical Information (OSTI), April 1990. http://dx.doi.org/10.2172/6959950.
Durr, Hermann. Ultrafast Science Opportunities with Electron Microscopy. Office of Scientific and Technical Information (OSTI), April 2016. http://dx.doi.org/10.2172/1249382.
Lyman, C. Analytical electron microscopy of catalyst preparations. Office of Scientific and Technical Information (OSTI), January 1990. http://dx.doi.org/10.2172/6990056.
Harris, Christopher. Open Reproducible Electron Microscopy Data Analysis. Office of Scientific and Technical Information (OSTI), March 2022. http://dx.doi.org/10.2172/1847929.
Sickafus, Kurt. History of Scanning Electron Microscopy (SEM). Office of Scientific and Technical Information (OSTI), June 2024. http://dx.doi.org/10.2172/2372668.
Mitchell, T. E., H. H. Kung, K. E. Sickafus, G. T. III Gray, R. D. Field, and J. F. Smith. High-resolution electron microscopy of advanced materials. Office of Scientific and Technical Information (OSTI), November 1997. http://dx.doi.org/10.2172/548622.
Taylor, J. R. Improved methods for high resolution electron microscopy. Office of Scientific and Technical Information (OSTI), April 1987. http://dx.doi.org/10.2172/5644034.
