Dissertations / Theses on the topic 'Dopant diffusion'
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Christensen, Jens S. "Dopant diffusion in Si and SiGe." Doctoral thesis, KTH, Microelectronics and Information Technology, IMIT, 2004. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-3712.
Full textDopant diffusion in semiconductors is an interestingphenomenon from both technological and scientific points ofview. Firstly, dopant diffusion is taking place during most ofthe steps in electronic device fabrication and, secondly,diffusion is related to fundamental properties of thesemiconductor, often controlled by intrinsic point defects:self-interstitials and vacancies. This thesis investigates thediffusion of P, B and Sb in Si as well as in strained andrelaxed SiGe. Most of the measurements have been performedusing secondary ion mass spectrometry on high purityepitaxially grown samples, having in-situ incorporated dopantprofiles, fabricated by reduced pressure chemical vapordeposition or molecular beam epitaxy. The samples have beenheat treated both under close-to-equilibrium conditions (i. e.,long time annealings in an inert ambient) and conditions whichresulted in non-equilibrium diffusion (i. e., vacuum annealing,oxidation, short annealing duration, and protonirradiation).
Equilibrium P and B diffusion coefficients in Si asdetermined in this thesis differ from a substantial part ofpreviously reported values. This deviation may be attributed toslow transients before equilibrium concentrations of pointdefects are established, which have normally not been takeninto account previously. Also an influence of extrinsic dopingconditions may account for the scattering of the diffusivityvalues reported in literature. B and Sb diffusion in Si underproton irradiation at elevated temperatures was found to obeythe so-called intermittent model. Parameters describing themicroscopic diffusion process were derived in terms of theintermittent diffusion mechanism, and it was found also thatthe presence of Sb strongly affected the B diffusion and viceversa.
In relaxed Si1-xGex-alloys, which has the same lattice structure as Sibut a larger lattice constant, P diffusion is found to increasewith increasing Ge content (x≤ 0.2). In Si/SiGe/Si heterostructures, wherethe SiGe layer is biaxially strained in order to comply withthe smaller lattice parameter of Si, P diffusion in thestrained layer is retarded as compared with relaxed materialhaving the same Ge content. In addition, P is found tosegregate into the Si layer via the Si/SiGe interface and thesegregation coefficient increases with increasing Ge content inthe SiGe layer.
Liao, Sheng Zhou. "Long-range lateral dopant diffusion in tungsten silicide layers." Thesis, Queen's University Belfast, 2011. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.534690.
Full textChang, Ruey-dar. "Physics and modeling of dopant diffusion for advanced device applications /." Digital version accessible at:, 1998. http://wwwlib.umi.com/cr/utexas/main.
Full textDe, Souza Maria Merlyne. "Atomic level diffusion mechanisms in silicon." Thesis, University of Cambridge, 1993. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.319817.
Full textNdoye, Coumba. "Characterization of Dopant Diffusion in Bulk and lower dimensional Silicon Structures." Thesis, Virginia Tech, 2010. http://hdl.handle.net/10919/46321.
Full textMaster of Science
Hearne, M. T. "Diffusion models for the doping of semiconductor crystals." Thesis, University of Nottingham, 1988. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.384711.
Full textJanke, Colin. "Density functional theory modelling of intrinsic and dopant-related defects in Ge and Si." Thesis, University of Exeter, 2008. http://hdl.handle.net/10036/46913.
Full textIsmail, Razali. "Simulation of dopant diffusion in silicon using finite element method : an adaptive meshing approach." Thesis, University of Cambridge, 1988. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.291751.
Full textVelayudhan, Nirmalkumar. "Analysis of Thermally Diffused Single Mode Optical Fiber Couplers." Thesis, Virginia Tech, 1994. http://hdl.handle.net/10919/36771.
Full textMaster of Science
Moreau, Patrick. "Diffusion moléculaire d'un dopant hydrosoluble dans une phase lamellaire lyotropeTransition smectique - cholestérique dans un mélange de molécules amphiphiles." Bordeaux 1, 2004. http://www.theses.fr/2004BOR12896.
Full textMOREAU, Patrick. "Diffusion Moléculaire d'un dopant hydrosoluble dans une phase lamellaire lyotrope ---- transition smectique - cholestérique dans un mélange de molécules amphiphiles." Phd thesis, Université Sciences et Technologies - Bordeaux I, 2004. http://tel.archives-ouvertes.fr/tel-00009676.
Full textLyytik�inen, Katja Johanna. "Control of complex structural geometry in optical fibre drawing." University of Sydney. School of Physics and the Optical Fibre Technology Centre, 2004. http://hdl.handle.net/2123/597.
Full textLyytikäinen, Katja Johanna. "Control of complex structural geometry in optical fibre drawing." Thesis, The University of Sydney, 2004. http://hdl.handle.net/2123/597.
Full textPhilippe, Thomas. "Précipitation du bore dans le silicium : expérience, méthodologie et modélisation." Phd thesis, Université de Rouen, 2011. http://tel.archives-ouvertes.fr/tel-00648694.
Full textChen, Wanghua. "Modélisation de la croissance des nanofils de Si et métrologie à l'échelle atomique de la composition des nanofils." Phd thesis, Université de Rouen, 2011. http://tel.archives-ouvertes.fr/tel-00651352.
Full textPerrin, Toinin Jacques. "Étude du dopage et de la formation des contacts pour les technologies germanium." Thesis, Aix-Marseille, 2016. http://www.theses.fr/2016AIXM4372.
Full textThe recent progress concerning the fabrication of large Ge mono- and poly-crystalline substrates, as well as the fabrication of Ge-On-Insulator (GOI) substrates, combined with the successful transfer from the Si technology to the Ge technology of the high-k dielectric and of the ohmic contact fabrication technologies support the development of a future high-performance Ge-based microelectronic technology. However, in order to meet the restrictions for the fabrication of the next generation of miniaturized microelectronic devices (short-channel MOSFETs), it is necessary to improve our knowledge concerning Ge doping and contact fabrication, in particular for n-type Ge. The main goal of this PhD was to investigate the atomic redistribution occurring during some of the fabrication processes involved in the fabrication of the structure [first-level metal / ohmic contact / doped-Ge] found on each active zone (gate, source, and drain) of transistors. Our work focused on selenium and tellurium for n-type doping, as well as on gallium and aluminum for p-type doping. Palladium was the metal chosen for the fabrication of ohmic contacts.This work includes the study of extended defect interactions with dopants, dopant clustering, and dopant diffusion in Ge(001) during post-implantation annealing. The formation and stability of Pd germanide thin films are also investigated, in order to evaluate and optimize the use of the PdGe compound as ohmic contact on Ge. Finally, dopant redistribution in PdGe thin films and in the Ge substrate during ohmic contact fabrication is also investigated
Wolf, Herbert, Florian Wagner, Jörg Kronenberg, Thomas Wichert, Roman Grill, and Eduard Belas. "Drift-diffusion of highly mobile dopants in CdTe." Universitätsbibliothek Leipzig, 2016. http://nbn-resolving.de/urn:nbn:de:bsz:15-qucosa-192877.
Full textSung, Talun. "Doping diamond by forced diffusion /." free to MU campus, to others for purchase, 1996. http://wwwlib.umi.com/cr/mo/fullcit?p9720551.
Full textWolf, Herbert, Florian Wagner, Jörg Kronenberg, Thomas Wichert, Roman Grill, and Eduard Belas. "Drift-diffusion of highly mobile dopants in CdTe." Diffusion fundamentals 8 (2008) 3, S. 1-8, 2008. https://ul.qucosa.de/id/qucosa%3A14149.
Full textLobre, Clément. "Compréhension des mécanismes de dopage arsenic de CdHgTe par implantation ionique." Thesis, Grenoble, 2014. http://www.theses.fr/2014GRENI021/document.
Full textThis thesis addresses the incorporation of arsenic in HgCdTe but also its activation and the related diffusion duringhigh temperature annealing. For each item, a large panel of characterization tools was used in order to obtain abetter understanding of p-type doping of HgCdTe by arsenic implantation.Irradiation induced annealing during ion implantation has been demonstrated with a saturation fluence of about2.1014 at.cm-2. A simple model enabled us to evaluate the diffusion coefficient of arsenic and to evidence the majorrole of mercury in the diffusion process. The solubility limit of arsenic in the HgCdTe alloy was determined forthe three most common compositions used for infrared applications. For arsenic concentration over this limit, theformation of arsenic-rich nanocrystals was demonstrated by transmission electron microscopy coupled with nanoscalechemical mapping. This first experimental evidence of arsenic clustering explains why some of the arsenicdoes not participate in the diffusion process. However, the exact chemical and crystallographic nature of thesenanocrystals remains unknown. The measurement of the depth profile of carrier density allows us to demonstratethe electrical inactivity of arsenic-rich nanocrystals. On the other hand, almost 100 % of the mobile arsenic is foundto be activated as an acceptor. The formation of AsHg8 complexes was proposed to explain the activation and thediffusivity of arsenic in HgCdTe.Ion implantation of nitrogen, phosphorus and antimony was studied and its behavior compared to that of arsenic.For nitrogen and phosphorus, a trapping effect that blocks the dopant diffusion was observed. Therefore, a goodquality doping cannot be achieved under these conditions. Antimony exhibits a faster diffusion than arsenic and theactivation as an acceptor of more than 21 % of mobile antimony was demonstrated. Even if the antimony behaviorseems interesting, arsenic exhibits the most promising properties for HgCdTe doping among all studied elements.As well as restoring a good crystal quality, our annealing conditions allow the activation of most of arsenic as anacceptor
Koffel, Stéphane. "Implantation, diffusion et activation des dopants dans le germanium." Grenoble INPG, 2008. http://www.theses.fr/2008INPG0094.
Full textGermanium is a candidate for the realization of MOS transistors, because of its higher carrier mobility compared to silicon. As it was replaced by silicon fourty years ago it must be rediscovered. The aim of this work is to understand the mecanisms of germanium doping. We show that the critical da mage energy density model allows to predict the formation and thickness of amorphous layers in germanium, Then the solid phase epitaxy velocity is mesured and end-of-range defects are observed in germanium for the first time. They are made 01 interstitials. Eventually we determine that phosphorus allows to achive shallower junctions and better activation levels than arsenic Phosphorus diffusion is simulated with a model taking into account the excess of interstitials generated during implantation. This allows to describe an enhanced diffusion phenomenon
Canneaux, Thomas. "Étude de la diffusion des dopants usuels dans le germanium." Strasbourg, 2009. http://www.theses.fr/2009STRA6191.
Full textPresently, silicon planar technology is facing physical limits. To overcome these limits, we can replace silicon by another semiconductor material with higher carriers’ mobility, in this case germanium is a good candidate. To perform efficient electronic devices, knowledge about diffusion coefficient of dopants in the semiconductor material is needed. In this work, we studied diffusion of gallium, indium, phosphorus, arsenic and antimony in germanium and worked out a new model using the triply negatively charged vacancy to describe their diffusion in germanium and their diffusion coefficients. We also investigated influence of rapid anneals, ion-implantation defects and SiO2 or Si3N4 capped layer. Techniques used to introduce dopants in germanium are quite different than for silicon and diffusion mechanisms differ too. In germanium, diffusion of dopants occurs via neutral, doubly and triply negatively charged vacancies. Capped layers and rapid anneals do not influence diffusion but a capped layer allows to protect the sample and partially avoid out diffusion
Malzbender, Jürgen. "A study of the diffusion of the halogens into cadmium telluride." Thesis, Coventry University, 1994. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.386545.
Full textFrantík, Ondřej. "Vysokoteplotní procesy ve výrobě křemíkových fotovoltaických článků." Doctoral thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2014. http://www.nusl.cz/ntk/nusl-233622.
Full textBiswas, Ranjan. "Parallel computational methods for simulating the diffusion of dopants in silicon." Thesis, University of Cambridge, 1991. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.385902.
Full textGolshani, Fariborz. "Boron doping of diamond powder by enhanced diffusion and forced diffusion : diffusion concentrations, mechanical, chemical and optical properties /." free to MU campus, to others for purchase, 1997. http://wwwlib.umi.com/cr/mo/fullcit?p9842530.
Full textNédélec, Sophie. "Diffusion et activation des dopants usuels dans les couches supérieures du MOS." Toulouse, INSA, 1996. http://www.theses.fr/1996ISAT0038.
Full textPakfar, Ardechir. "Modélisation de la diffusion des dopants dans les alliages SiGe et SiGeC." Lyon, INSA, 2003. http://www.theses.fr/2003ISAL0002.
Full textThis work proposes a unified model of dopant diffusion in SiGe and SiGeC alloys, based on the hypothesis that the different effects introduced by Germanium and Carbon incorporation modify the equilibrium concentrations of interstitials and vacancies from their standard value in pure Silicon. Indeed, the primordial role of these point defects on dopant diffusion is well admitted. The critical analysis of bibliographic studies allows the description of these physical phenomena: the chemical effect, the effect of strain and the Fermi effect act on point defects and thus on impurity diffusion. This formulation is completed by the equations expressing the B-Ge coupling and the influence of Carbon supersaturation, to form a unified model valid to describe the diffusivity evolution of usual dopants in these alloys. Then, ali reliable and previously published experimental data are analyzed for the calibration of this phenomenological model parameters. Finally, we measured the equilibrium diffusion of Boron and, for the first time, of Arsenic in shallow layers of SiGe and SiGeC. We successfully confronted these experimental results to the model predictions
Vandenbossche, Eric. "Contribution à la modélisation de la diffusion des dopants en fortes concentrations dans le silicium." Lille 1, 1994. http://www.theses.fr/1994LIL10158.
Full textBoucard, Frédéric. "Modélisation de la diffusion des dopants dans le silicium pour la réalisation de jonctions fines." Université Louis Pasteur (Strasbourg) (1971-2008), 2003. http://www.theses.fr/2003STR13067.
Full textThe research topic of this dissertation deals with the modelling of a particular step of process in microelectronics: the dopant diffusion. The first part of this work is dedicated to the understanding and the readjustment of the classical model for dopant diffusion and its activation. However, those models reach their limits for simulations at very low thermal budget because of the bad description of the defect evolution created by the implant step during the annealing. The second part of this work is devoted to the understanding of the existing link between the extended defects (small clusters, {311} defects, dislocation loops) and the boron transient enhanced diffusion. This work consists in modeling the competitive growth of those clusters during the annealing step by using the Ostwald ripening concept in order to couple it with the dopant diffusion model. Moreover, in the case of high dose boron implantation, a new type of defects involving boron and interstitial induces an immobilization and an inactivation of the boron. In order to model the formation of those clusters, we have considered some BnIm type of clusters. Using recent ab-initio calculations from literature, we have extracted their formation energy and various charge states. This last model, coupled with the two others, has been validated using various experimental results
Normand, Pascal. "Contribution à l'étude de la diffusion des impuretés dopantes dans le silicium : diffusion des impuretés dopantes dans des structures silicium sur isolant obtenues par implantation d'oxygène." Grenoble INPG, 1992. http://www.theses.fr/1992INPG0164.
Full textCastro, Susana Patricia. "CHARACTERIZATION OF THE BORON DOPING PROCESSUSING BORON NITRIDE SOLID SOURCE DIFFUSION." NCSU, 1999. http://www.lib.ncsu.edu/theses/available/etd-19990523-142337.
Full textCASTRO, SUSANA PATRICIA. Characterization of the Boron Doping Process UsingBoron Nitride Solid Source DiffusionThe purpose of this research has been to develop an optimum process for the borondoping of implants and polysilicon gates of metal-oxide-semiconductor (MOS) devices.An experimental design was constructed to determine the effects of diffusiontemperature, time, and ambient on characteristics of the doping process. A temperaturerange of 800 to 1000 degrees Celsius was studied with a diffusion time between 10 and60 minutes. Two diffusion ambients were used for doping processes, a pure nitrogenambient and a nitrogen-oxygen gaseous mixture. Device wafers were fabricated, and thetesting of MOS capacitors and van der Pauw test structures was performed to determinethe effect of diffusion conditions on flatband voltage and poly gate doping. Materialscharacterization techniques were used on monitor wafers for each diffusion process todetermine the wafer structure formed for each process and evaluate the effectiveness ofthe deglaze etch. The processes that resulted in the best device characteristics withoutsuffering from significant poly depletion effects and flatband voltage shifts were wafersdoped at 800 degrees Celsius in a pure nitrogen atmosphere for 20 minutes and 45minutes. The presence of oxygen in the atmosphere caused the depletion of boron fromthe Si wafer surface. The formation of the Si-B phase only occurred on devices processedat 1000 degrees Celsius. The deglaze process used in this experiment did not fullyremove this layer, and thus all devices doped at this temperature were seriously degraded.
BOUCARD, Frédéric. "Modélisation de la diffusion des dopants dans le silicium pour la réalisation de jonctions fines." Phd thesis, Université Louis Pasteur - Strasbourg I, 2003. http://tel.archives-ouvertes.fr/tel-00003671.
Full textIhaddadene, Lenglet Mékioussa. "Simulation de la diffusion de dopants de type P dans les structures à base d'INP." Rouen, 2002. http://www.theses.fr/2002ROUES045.
Full textModelling of beryllium (Be) diffusion in III-V materials is carried out in order to resolve the problems caused by undesirable diffusion of p-type dopants during different steps of fabrication of active components, particularly in heterojunction bipolar transistors. This work concerns the modelling and numerical simulation of Be diffusion, firstly in ternary homojunction (GaInAs), quaternary homojunction (GaInAsP) and in heterojunction (GaInAs/InP) epitaxial structures, then finally in implanted InGaAs homojunction, taking into account the Be trapping by the extended defects generated by ion implantation. Several models based on kick-out mechanism have been proposed. The resolution of differential equation systems using both the finite difference method and the line method permits the simulation of Be diffusion in the studied structures
Blum, Ivan. "Diffusion et redistribution des dopants et du platine dans les siliciures de nickel sur silicium." Aix-Marseille 3, 2010. http://www.theses.fr/2010AIX30061.
Full textThe objective of this study is to quantify the diffusion and solubility of As, B and Pt in Ni silicides in order to gain a better understanding of their redistribution during silicidation. Therefore, these elements were implanted in o-Ni2Si and NiSi thin films and their diffusion and solubility were studied using secondary ion mass spectroscopy (SIMS) and atom probe tomography (APT). Diffusion coefficients could be measured by comparing SIMS measurements and two dimensional diffusion simulations. APT analyses allowed to observe the precipitation of B above its solubility limit in NiSi. Then, B and Pt redistribution during silicidation were characterized by SIMS and APT. The previous data concerning their diffusion and solubility in the two silicides were used together to interpret these results. In addition, B redistribution was compared to redistribution simulations using a simple model
Castro, Susana Patricia. "Characterization of the boron doping process using boron nitride solid source diffusion." Raleigh, NC : North Carolina State University, 1999. http://www.lib.ncsu.edu/etd/public/etd-2923142349901421/etd.pdf.
Full textKovac, Urban. "3D drift diffusion and 3D Monte Carlo simulation of on-current variability due to random dopants." Thesis, University of Glasgow, 2010. http://theses.gla.ac.uk/2309/.
Full textMarcon, Jérôme. "Simulation numérique de la diffusion de dopants dans les matériaux III-V pour les composants microoptoélectroniques." Rouen, 1996. http://www.theses.fr/1996ROUES061.
Full textMoreno, Dickerson C. "The diffusion of phosphorus into diamond from phosphorus-doped silicon through field enhanced diffusion by optical activation /." free to MU campus, to others for purchase, 2003. http://wwwlib.umi.com/cr/mo/fullcit?p3091948.
Full textRodriguez, Nicolas. "Diffusion des dopants dans les dispositifs de la microélectronique : codiffusion de l’arsenic et du phosphore dans le silicium, étude unidimensionnelle et bidimensionnelle." Aix-Marseille 3, 2008. http://www.theses.fr/2008AIX30029.
Full textSi dopant diffusion in microelectronics devices has been studied in 1 and 2 dimensions. The codiffusion effects of As and P have been characterized for “drains” and “sources" fabrication of the latest transistor technology (90 nm). If these 2 dopants are concurrently located in Si, we observe a transient acceleration of As and P diffusion. This effect mainly depends on the As dose, and seems to be due to the modification of AsnV cluster characteristics, in the presence of P. Furthermore, we show that dopant diffusion can be studied in microelectronics devices in 2 dimensions using near field electrical (SCM, SSRM) and topographical (AFM) techniques. These techniques are complementary because of their different principles. They find applications in metrology and failure analysis
Rasul, Faiz. "Theoretical investigation of diffusion in bulk material and superlattice structures." Thesis, University of Hull, 1999. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.310279.
Full textReiser, Patrick [Verfasser], Wolfram [Akademischer Betreuer] Jaegermann, and Annemarie [Akademischer Betreuer] Pucci. "Modifying and Controlling Diffusion Properties of Molecular Dopants in Organic Semiconductors / Patrick Reiser ; Wolfram Jaegermann, Annemarie Pucci." Darmstadt : Universitäts- und Landesbibliothek Darmstadt, 2019. http://d-nb.info/1203221398/34.
Full textWest, Matthew K. "Diffusion of sulfur into natural diamond : characterization and applications in radiation detection /." free to MU campus, to others for purchase, 1999. http://wwwlib.umi.com/cr/mo/fullcit?p9964011.
Full textColombeau, Benjamin. "Interactions entre défauts étendus et anomalies de diffusion des dopants dans le silicium : modèle physique et simulations prédictives." Toulouse 3, 2001. http://www.theses.fr/2001TOU30128.
Full textCATUNDA, CARLOS EDUARDO GUEDES. "INFLUENCE OF TEMPERATURE AND CHROME DOPANTS IN CONFIGURATIONAL TRANSIENT DIFFUSION OF IRON OXIDE IN HIGH ALUMINA POROUS REFRACTORY MATRIX." PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO, 2017. http://www.maxwell.vrac.puc-rio.br/Busca_etds.php?strSecao=resultado&nrSeq=29929@1.
Full textCOORDENAÇÃO DE APERFEIÇOAMENTO DO PESSOAL DE ENSINO SUPERIOR
PROGRAMA DE SUPORTE À PÓS-GRADUAÇÃO DE INSTS. DE ENSINO
Meios heterogêneos porosos submetidos a ataque químico em condições de alta temperatura representam um segmento de destacada importância no campo científico e industrial. O perfil de penetração efetiva de difundentes em meios porosos é um tópico de ampla significância e complexidade em fenômenos de transporte de momento, calor e massa; pois descreve o conceito do fenômeno de difusão configuracional transiente nas zonas não saturadas e, por conseguinte, sua abordagem matemática na formulação que o caracteriza. A proposta deste estudo é o desenvolvimento de um modelo matemático numérico de previsão do processo difusional transiente dos difundentes óxidos nos meios heterogêneos porosos. Assim, buscou-se realizar ensaios experimentais de difusão transiente do difundente sólido composto de óxidos de ferro (II), (II,III) e (III) para meios porosos de refratários sílico-aluminosos de alta alumina (Al2O3 SiO2), com e sem dopantes de óxido de cromo (III). Utilizou-se uma técnica não destrutiva microtomográfica com reconstrução computacional 3D e processamento digital de imagens para monitoramento espacial de cada partícula sólida difundente no meio. Foi analisada a influência, da temperatura variando de 1100 graus Celsius a 1300 graus Celsius, do tempo de exposição de 100h, bem como a presença de dopantes na estrutura dos meios porosos para mitigação da penetração. Dados da concentração adimensional dos difundentes em função da profundidade de penetração foram preditos por modelos transientes de transferência de massa fundamentados na formulação de placas semi-infinitas considerando condições de contorno saturadas. O quantitativo de transporte de massa obtido pelo processamento das imagens microtomográficas foram comparados e correlacionados com o método de mapeamento químico de superfície por varredura EDS em microanálise elementar. A partir dos dados experimentais e simulados, quantificou-se a difusividade dos meios porosos. Constatou-se uma variação inferior a 3,52 por cento entre os métodos destrutivo e não-destrutivo analisados para a quantificação da concentração adimensional dos difundentes ao longo da profundidade do meio, reforçando que o método proposto possa ser estendido para inúmeros outros difundentes e meios porosos congêneres.
Porous heterogeneous media subjected to chemical etching in high temperature conditions represent a segment of outstanding importance in the scientific and industrial field. The diffusants effective penetration profile in porous media is a topic of broad significance and complexity in transport phenomena of momentum, heat and mass; once it describes the concept of transient configurational diffusion phenomena in unsaturated zones and therefore, a mathematical approach to its formulation. The purpose of this study is the development of a numerical mathematical model for predicting the transient diffusion process of oxides diffusants in porous heterogeneous media. Thus, experimental transient diffusion tests were performed with solids diffusants composed of iron oxides (II), (II,III) and (III) in porous silico-aluminous refractory media of high alumina (SiO2 Al2O3) with and without dopants of oxide chromium (III). A non-destructive computerized microtomography technique with digital 3D reconstruction and post-processing images was used for spatial monitoring each solid diffusant particle in the media. The influence of temperature was examined ranging from 1100 Celsius degrees to 1300 Celsius degrees, at exposure time of 100h, as well as the presence of dopants in the structure of porous media to mitigate penetration. Data of the normalized diffusants concentration field as function of the penetration depth were predicted by mass transfer transient models based on semi-infinite slabs formulation considering saturated boundary conditions. The numerical results of mass transfer obtained by microtomography images processing were compared and correlated with the chemical surface mapping method with EDS scan for elementary microanalysis. From the experimental and simulated data was quantified the porous media diffusivity. It was observed a variation less than 3.52 percent between destructive and non-destructive methods analyzed to quantify the normalized diffusants concentration along the media depth, enhancing the proposed method to be extended to other porous media and solids diffusants.
Calvo, Pascal. "Evolution cinétique des défauts {113} en cours de recuit thermique de silicium implanté : influence sur la diffusion des dopants." Toulouse 3, 2004. http://www.theses.fr/2004TOU30281.
Full textThe fabrication of p+/n ultra-shallow junctions by ion implantation of boron remains the most promising way to realise MOS source/drain extensions at depths typically less than 20 nm. Nevertheless, during activation annealing, this process is accompanied by the formation of different types of extended defects (interstitial clusters, {113} defects and dislocation loops) which are responsible for major problems such as transient enhanced diffusion (TED) of dopants or degradation of electrical junction properties. In order to define strategies to limit these effects, it is necessary to understand the physical mechanisms governing the thermal evolution of extended defects, especially in the case of {113} defects which is still a matter of controversy. The aim of this work has therefore been to build-up a reliable data base from the accurate and statistical analysis of defects by Transmission Electron Microscopy (TEM). This work has also been mandatory for the optimisation of the new predictive models for TED of dopants. To characterize the {113} 048904570, we have developed a new set of imaging conditions by TEM allowing an improvement of statistical analysis. Our experimental results clearly show that these defects always undergo a non conservative Ostwald ripening process during annealing. Depending on the initial conditions, we found that {113} defects can either dissolve rapidly or progressively transform into dislocation loops. All our results have been discussed and can be well explained in the framework of physical concepts which have been developed by our team during the last decade. The physical model for defect evolution that we have improved is now tested using our results and has been implemented into a commercial process simulator
Kociniewski, Thierry. "HOMOEPITAXIE ET DOPAGE DE TYPE n DU DIAMANT." Phd thesis, Université de Versailles-Saint Quentin en Yvelines, 2006. http://tel.archives-ouvertes.fr/tel-00349978.
Full textNous avons montré qu'un recuit sous vide à des températures autour de 900-1000°C de couches dopées phosphore fortement compensées entraîne une augmentation de la concentration d'électrons libres. Notre modèle propose la migration de défauts compensateurs X- suivie de la création de complexes inactifs (P,X). En supposant que la cinétique de formation des complexes (P,X) suit une loi du 1er ordre, nous avons conclu que l'énergie de migration de cette espèce compensatrice est de 3.1 eV. Nous avons émis l'hypothèse que ce défaut est l'hydrogène incorporé pendant la croissance.
Enfin, nous avons prolongé notre étude sur la conversion en type n de couches dopées bore suite à une deutération. Ce procédé permet d'obtenir des couches de conductivité électrique largement supérieure (facteur 1000 à 100000) à celle des meilleures couches de diamant de type n dopées au phosphore. Nous avons montré que l'effet de conversion est très probablement un effet de volume et que le mécanisme d'apparition de la conversion se fait en deux étapes : passivation des bore sur toute l'épaisseur de la couche puis création d'un excès de deutérium qui déclenche la conductivité de type n. La conversion n'est pas réalisée de façon homogène. Il sera donc nécessaire dans le futur d'établir quelles sont les caractéristiques des zones qui sont converties.
Li, Kaile. "Defects at surface and interface of crystals : theoretical and x-ray scattering analysis /." free to MU campus, to others for purchase, 2002. http://wwwlib.umi.com/cr/mo/fullcit?p3074422.
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