Journal articles on the topic 'Digital electronics – Testing'
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Newton, C. Mike, Paul I. Deffenbaugh, Kenneth H. Church, Nathan B. Crane, and Clayton Neff. "Digital Manufacturing and Performance Testing for Military Grade Application Specific Electronic Packaging (ASEP)." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000250–66. http://dx.doi.org/10.4071/isom-2016-wp13.
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I. Abstract This paper will discuss the development of additive manufacturing as a process integration methodology for printed electronics and 3D printed structures. This integration enables the ability to move from printed circuit boards (PCBs) to printed circuit structures (PCS). Historically packaging has been identified as a hierarchical (or levels) approach to interconnect electronic products or systems. Level one packaging addresses the interconnection between bare die and the module while level four moves up in the packaging chain to connections between subassemblies. With the advent of digital manufacturing and emergence of more robust materials, the enabling technology provides a manufacturing tool for building electronic packages with integrated passives (some printed) and actives. This further enables the capability to adjust the form factor to the mission or product requirements - also known as personalization. This ability to become form factor agnostic has produced the ability for printing or digitally manufacturing application specific electronic packages, ASEPs. With this emerging capability it begs the question of reliability and in particular to qualification for harsh environment applications. This paper will discuss the application of current standards, Mil-Std-883 or JESD93 for example and how these might be applied to ASEPs and to also explore the development of new or hybridization of current standards.
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Shalumov, Alexander Slavovich, Natalya Alexandrovna Shalumova, and Maxim Alexandrovich Shalumov. "ALGORITHM FOR MODELING MECHANICAL PROCESSES IN AVIATION ELECTRONICS, TAKING INTO ACCOUNT THE NONLINEARITY OF THE DAMPING PROPERTIES OF MATERIALS." Globus: technical sciences 7, no. 3(39) (August 19, 2021): 29–36. http://dx.doi.org/10.52013/2713-3079-39-3-4.
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The object of research is aviation electronics. The purpose of the work is to develop algorithms for modeling mechanical processes in aviation electronics for the subsequent implementation of a prototype of a software and methodological complex for creating digital twins of aviation electronics. The work was carried out under contract № 91GS1CTS10-D5/61789 dated September 23, 2020 on the provision of a grant for conducting research and development work on the topic «Development of a prototype of a software and methodological complex for creating digital twins of aviation electronics and its testing» with the Federal State budgetary institution «Fund for Assistance to the Development of Small Enterprises in the Scientific and Technical Sphere».
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Fang, Kun, Rui Zhang, Tami Isaacs-Smith, R. Wayne Johnson, Emad Andarawis, and Alexey Vert. "Thin Film Multichip Packaging for High Temperature Digital Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000039–45. http://dx.doi.org/10.4071/hiten-paper1-rwjohnson.
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Digital silicon carbide integrated circuits provide enhanced functionality for electronics in geothermal, aircraft and other high temperature applications. A multilayer thin film substrate technology has been developed to interconnect multiple SiC devices along with passive components. The conductor is vacuum deposited Ti/Ti:W/Au followed by an electroplated Au. A PECVD silicon nitride is used for the interlayer dielectric. Adhesion testing of the conductor and the dielectric was performed as deposited and after aging at 320°C. The electrical characteristics of the dielectric as a function of temperature were measured. Thermocompression flip chip bonding of Au stud bumped SiC die was used for electrical connection of the digital die to the thin film substrate metallization. Since polymer underfills are not compatible with 300°C operation, AlN was used as the base ceramic substrate to minimize the coefficient of thermal expansion mismatch between the SiC die and the substrate. Initial die shear results are presented.
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Syryamkin, V. I. "Digital X-ray 3D-microtomograph for testing materials and components used in electronics." Russian Journal of Nondestructive Testing 52, no. 9 (September 2016): 504–11. http://dx.doi.org/10.1134/s1061830916090060.
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Rea, Richard. "Configurable Digital Logic for Extreme Environments." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2018, HiTEC (May 1, 2018): 000098–102. http://dx.doi.org/10.4071/2380-4491-2018-hiten-000098.
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Abstract This paper presents a multiple-configuration IC that implements a number of sequential or combinatorial logic functions for extreme environment electronics. Operating temperature is −55°C to +300°C. Combinatorial functions include AND, OR, XOR, muxes, bi-directional transceiver, priority-encoder, magnitude comparator, etc. Sequential functions include 8-bit DFF, counter, latch, programmable clock-divider, etc. The majority of 7400 logic parts are covered by this part. Special test circuitry is included for in-situ monitoring of the part during production. Endurance testing and monitoring of part lifetime at elevated stress temperature (+350°C) is also built-in.
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Gavrilenkov, Sergey I., Elizaveta O. Petrenko, and Evgeny V. Arbuzov. "A Digital Device for Automatic Checking of Homework Assignments in the Digital Circuits Course." ITM Web of Conferences 35 (2020): 04009. http://dx.doi.org/10.1051/itmconf/20203504009.
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This paper considers a digital device for automatic checking of homework assignments in the digital circuits course. The assignment is to make a digital circuit corresponding to a given logical expression; the circuit is comprised of elementary logic gates. The process of manual testing the built circuit is very labor-intensive because checking a circuit with N inputs variables requires checking the correctness of the output variable for 2N cases. We propose automating this pro-cess with a special digital device. The device is comprised of a microcontroller connected to the circuit tested. The microcontroller is connected to a personal computer with an application written in C# for executing the main operations of the testing process. During testing, the student chooses from a database or enters the logical expression corresponding to the circuit tested. For the expression, the software generates truth tables where actual and required responses of the circuit are given. Actual circuit responses are acquired by probing the circuit via the microcontroller, and the expected values are calculated from the logical expression. The truth tables are then presented to the student with a message of whether the circuit works correctly or not. The device was integrated into the process of checking homework assignments in the digital electronics course, and it significantly sped up the process of checking homework assignment circuits, resulting in better education quality.
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Liu, Wei, Zhuo Lin Miao, Huan Xin Cheng, and Li Cheng. "The Hardware Design of Ultrasonic Flaw Detector Based on Single-Chip Microcomputer AT89C52." Applied Mechanics and Materials 423-426 (September 2013): 2427–30. http://dx.doi.org/10.4028/www.scientific.net/amm.423-426.2427.
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Ultrasonic nondestructive testing is an important detection method in nondestructive testing field. It is widely used in steel manufacturing, machinery manufacturing, electronics manufacturing, aerospace and defense and other fields and departments to ensure production quality and safety. In this paper, the main research work and research results are as follows: analyze the principle of electromagnetic ultrasonic nondestructive testing and characteristic and the hardware design of ultrasonic flaw detector system based on single-chip microcomputer AT89C52. This paper laid a good foundation for more in-depth studies in the research of ultrasonic digital signal processing in future.
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Leng, Feng, Chengxiong Mao, Dan Wang, Ranran An, Yuan Zhang, Yanjun Zhao, Linglong Cai, and Jie Tian. "Applications of Digital-Physical Hybrid Real-Time Simulation Platform in Power Systems." Energies 11, no. 10 (October 9, 2018): 2682. http://dx.doi.org/10.3390/en11102682.
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Digital-physical hybrid real-time simulation (hybrid simulation) platform integrates the advantages of both digital simulation and physical simulation by combining the physical simulation laboratory and the real-time digital simulator. Based on a 400 V/50 kVA hybrid simulation platform with 500 kVA short-circuit capacity, the hybrid simulation methodology and a Hausdorff distance based accuracy evaluation method are proposed. The case validation of power system fault recurrence is performed through this platform, and the stability and accuracy are further validated by comparing the hybrid simulation waveform and field-recorded waveform and by evaluating the accuracy with the proposed error index. Two typical application scenarios in power systems are studied subsequently. The static var generator testing shows the hybrid simulation platform can provide system-level testing conditions for power electronics equipment conveniently. The low-voltage ride through standard testing of a photovoltaic inverter indicates that the hybrid simulation platform can be also used for voltage standard testing for various power system apparatus with low cost. With this hybrid simulation platform, the power system simulation and equipment testing can be implemented with many advantages, such as short period of modelling, flexible modification of parameter and network, low cost, and low risk. Based on this powerful tool platform, there will be more application scenarios in future power systems.
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Wileman, Andrew, Suresh Perinpanayagam, and Sohaib Aslam. "Physics of Failure (PoF) Based Lifetime Prediction of Power Electronics at the Printed Circuit Board Level." Applied Sciences 11, no. 6 (March 17, 2021): 2679. http://dx.doi.org/10.3390/app11062679.
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This paper presents the use of physics of failure (PoF) methodology to infer fast and accurate lifetime predictions for power electronics at the printed circuit board (PCB) level in early design stages. It is shown that the ability to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs), and assemblies allows, for instance, the prediction of solder fatigue failure due to thermal, mechanical, and manufacturing conditions. The technique allows a life-cycle prognosis of the PCB, taking into account the environmental stresses it will encounter during the period of operation. Primarily, it involves converting an electronic computer aided design (eCAD) circuit layout into computational fluid dynamic (CFD) and finite element analysis (FEA) models with accurate geometries. From this, stressors, such as thermal cycling, mechanical shock, natural frequency, and harmonic and random vibrations, are applied to understand PCB degradation, and semiconductor and capacitor wear, and accordingly provide a method for high-fidelity power PCB modelling, which can be subsequently used to facilitate virtual testing and digital twinning for aircraft systems and sub-systems.
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Tao, Quang Bang, Lahouari Benabou, Thien An Nguyen Van, and Ngoc Anh Nguyen Thi. "Using Digital Image Correlation Method to Evaluate Fracture Parameters of Lead-Free Solder." Applied Mechanics and Materials 902 (September 2020): 86–90. http://dx.doi.org/10.4028/www.scientific.net/amm.902.86.
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Newly developed lead-free solder alloys, which contain doping some elements such as Ni, Bi, Sb, Al,..., have improved properties with respect to the conventional solder alloys, particularly in terms of resistance to creep. Their high performances are specifically desired in applications of power electronics where they are used for the electrical interconnections between the components. Studies on their resistance to rupture remain relatively limited. Yet the comprehension of fracture behavior is essential for the correct design of the electronic packages which must be robust against fatigue and vibrations loads. In this study, rupture of notched specimens fabricated from the InnoLot lead-free solder alloy is investigated. The tests are performed with the help of a micro-tensile testing machine equipped with an optical system for full-field measurements with Digital Image Correlation. The images are taken at successive steps of deformation and the displacement field is measured in a region of interest which is the singularity dominated zone surrounding the plastic zone at the crack tip. The procedure consists then in comparing the measured field with the theoretical field given by the Williams’ solution. The stress intensity factor is calculated by fitting the analytical fields to the experimental data. The effects of the size and shape of the zone of data collection, as well as that of the number of terms considered in the Williams’s expansion series, are examined in the study. A method is also proposed for the automatic crack tip detection.
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MacGugan, Douglas C., Eric C. Abbott, and J. Chris Milne. "230°C Accelerometer with Digitized Output for Directional Drilling." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, HITEC (January 1, 2014): 000298–304. http://dx.doi.org/10.4071/hitec-tha14.
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Measurement-While-Drilling (MWD) technology for oil and gas, and geothermal directional drilling exploration is pushing into ever higher temperature environments - beyond 200°C. Orientation sensors supporting these high temperature environments need to provide highly accurate elevation and tool face measurements on the order of 0.1°. Honeywell has developed a new digital high temperature down-hole accelerometer, DHTA230, capable of providing the required accuracy at the elevated temperatures of 230°C, in the rugged MWD shock and vibration environment, with expected excellent reliability and life. The DHTA230 is designed for use in the downhole environment, but is based upon a mature Honeywell accelerometer using dual vibrating beam sensing elements. These sensing elements are configured as double-ended-tuning-forks in a push-pull orientation attached onto a pendulous proof mass. This push-pull configuration provides an acceleration signal proportional to the frequency difference of the vibrating beams, an easily captured digital signal through measurement of the two vibrating beam phases. The digitized accelerometer eliminates the need for A/D electronics in the high temperature drilling environment. The DHTA230 is 0.79” in diameter with a depth of .393” at the mount flange. The ruggedized configuration of the DHTA230 is expected to provide reliable orientation measurement in high temperature direction drilling applications up to 1000h. The DHTA230 electronics incorporate ceramic hybrids with chip and wire construction. Active die are based upon proven 300°C chips developed previously for the Enhanced Geothermal Systems OM300, fabricated using Honeywell HTSOI4 process. The electronics include power conditioning providing reliable operation using a single power supply between 7V and 15V. Dual oscillator electronic circuits provide the necessary function to drive and sense the dual vibrating beams, while providing a CMOS logic level signal of the frequency pulse train. The accelerometer provides precision output up to 15g acceleration inputs, and allows sensing of higher-g vibration levels. This paper contains information on the target application, electrical and mechanical component requirements, design, fabrication approach, and initial prototype testing. The DHTA230 is expected to enter production transition in 2015.
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Valliant, H. D., J. Halpenny, and R. V. Cooper. "A microprocessor‐based controller and data acquisition system for LaCoste and Romberg air‐sea gravity meters." GEOPHYSICS 50, no. 5 (May 1985): 840–45. http://dx.doi.org/10.1190/1.1441959.
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A microprocessor‐based controller and data acquisition system for LaCoste and Romberg dynamic gravity meters has been designed, tested, and is now operationally functional. The system controls the motion about the three axes of the stable platform and the gravity meter, as well as acquiring gravity data and storing it on magnetic tape. Output format is compatible with LaCoste and Romberg format. Extensive testing has assured that the digital system functions correctly. Recent deep‐ocean surveys using the new straight‐line meter (SL-1) in conjunction with the new electronics, have resulted in unadjusted cross‐over differences of 1.35 mGal.
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Taylor, David, Victor Orphan, Eric Ackermann, Rhett Barnes, Ryan Shyffer, George Mansfield, James Winso, et al. "Recent developments in high-resolution-gamma-ray cargo-inspection technology." International Journal of Modern Physics: Conference Series 48 (January 2018): 1860109. http://dx.doi.org/10.1142/s2010194518601096.
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Under US Department of Homeland Security sponsorship, Spectral Labs Incorporated has developed a prototype high-resolution retrofit for an existing mobile VACIS, named the High-Resolution Imaging System (HiRIS). The legacy 256 NaI detectors in the VACIS detector column were replaced with 576 CsI detectors, more than doubling the pixel count. Using SiPMs to replace conventional PMTs allowed the packing of more detectors in the same VACIS detector enclosure. Legacy analog signal-processing electronics were replaced with advanced digital signal-processing electronics. Replacing gross counting in the legacy system with multichannel analysis of the counts from each detector will allow better control of detector crosstalk. The HiRIS detector modules were installed on a VACIS truck refurbished to as-new condition. Initial testing of the HiRIS prototype demonstrates enhanced spatial resolution by a factor of two as compared to the legacy system, without any degradation in throughput capability (20 containers per hour).
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Liu, Huifang, and Jin-Sup Jung. "The Effect of CSR Attributes on CSR Authenticity: Focusing on Mediating Effects of Digital Transformation." Sustainability 13, no. 13 (June 28, 2021): 7206. http://dx.doi.org/10.3390/su13137206.
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What corporate social responsibility (CSR) attributes determine the CSR authenticity of a company? In the face of the Fourth Industrial Revolution, what direction should the CSR strategy pursue? In the electronics industries in Korea and China, are there any differences in CSR attributes? In this study, we start with some of these basic questions. Considering the promotional and actual costs incurred from CSR activities, CSR strategy are not an issue that can be easily determined from the corporate perspective. However, now it is essential for companies to carry out CSR and sustainable development goals (SDGs) activities, and businesses cannot overlook social issues either. Companies cannot pursue only growth through corporate interests without social value. In this study, we derive three attributes of CSR fit, CSR sustainability, and CSR impact to verify the authenticity of CSR activities. Moreover, we demonstrated the impact of these three attributes on CSR authenticity for the electronics industries in Korea and China. As a result of empirical testing, most of three attributes above mentioned (i.e., CSR fit, CSR sustainability, and CSR impact) produce meaningful results for CSR authenticity. However, CSR sustainability was rejected for the Korea sample, and CSR fit was rejected for the Chinese sample, showing some differences between the two countries. Meanwhile, the digital transformation of the Fourth Industrial Revolution had strong partial mediating effects between CSR attributes and CSR authenticity. This means that digital transformation can be an important pathway to achieve CSR authenticity and suggests that important mediating effects can eventually lead to a firm’s competitiveness.
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Alamgir, Arbab, Abu Khari A’ain, Norlina Paraman, and Usman Ullah Sheikh. "Adaptive random testing with total cartesian distance for black box circuit under test." Indonesian Journal of Electrical Engineering and Computer Science 20, no. 2 (November 1, 2020): 720. http://dx.doi.org/10.11591/ijeecs.v20.i2.pp720-726.
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<p>Testing and verification of digital circuits is of vital importance in electronics industry. Moreover, key designs require preservation of their intellectual property that might restrict access to the internal structure of circuit under test. Random testing is a classical solution to black box testing as it generates test patterns without using the structural implementation of the circuit under test. However, random testing ignores the importance of previously applied test patterns while generating subsequent test patterns. An improvement to random testing is Antirandom that diversifies every subsequent test pattern in the test sequence. Whereas, computational intensive process of distance calculation restricts its scalability for large input circuit under test. Fixed sized candidate set adaptive random testing uses predetermined number of patterns for distance calculations to avoid computational complexity. A combination of max-min distance with previously executed patterns is carried out for each test pattern candidate. However, the reduction in computational complexity reduces the effectiveness of test set in terms of fault coverage. This paper uses a total cartesian distance based approach on fixed sized candidate set to enhance diversity in test sequence. The proposed approach has a two way effect on the test pattern generation as it lowers the computational intensity along with enhancement in the fault coverage. Fault simulation results on ISCAS’85 and ISCAS’89 benchmark circuits show that fault coverage of the proposed method increases up to 20.22% compared to previous method.</p>
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Ahmad, A., and D. Al-Abri. "Design of a Realistic Test Simulator For a Built-In Self Test Environment." Journal of Engineering Research [TJER] 7, no. 2 (December 1, 2010): 69. http://dx.doi.org/10.24200/tjer.vol7iss2pp69-79.
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This paper presents a realistic test approach suitable to Design For Testability (DFT) and Built- In Self Test (BIST) environments. The approach is culminated in the form of a test simulator which is capable of providing a required goal of test for the System Under Test (SUT). The simulator uses the approach of fault diagnostics with fault grading procedure to provide the tests. The tool is developed on a common PC platform and hence no special software is required. Thereby, it is a low cost tool and hence economical. The tool is very much suitable for determining realistic test sequences for a targeted goal of testing for any SUT. The developed tool incorporates a flexible Graphical User Interface (GUI) procedure and can be operated without any special programming skill. The tool is debugged and tested with the results of many bench mark circuits. Further, this developed tool can be utilized for educational purposes for many courses such as fault-tolerant computing, fault diagnosis, digital electronics, and safe - reliable - testable digital logic designs.
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Yudachev, S. S., P. A. Monakhov, and N. A. Gordienko. "Industry 4.0 Digital Technologies for data collection and control." Glavnyj mekhanik (Chief Mechanic), no. 6 (May 25, 2021): 43–58. http://dx.doi.org/10.33920/pro-2-2106-04.
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This article describes an attempt to create open source LabVIEW software, equivalent to data collection and control software. The proposed solution uses GNU Radio, OpenCV, Scilab, Xcos, and Comedi in Linux. GNU Radio provides a user-friendly graphical interface. Also, GNU Radio is a software-defined radio that conducts experiments in practice using software rather than the usual hardware implementation. Blocks for data propagation, code deletion with and without code tracking are created using the zero correlation zone code (ZCZ, a combination of ternary codes equal to 1, 0, and –1, which is specified in the program). Unlike MATLAB Simulink, GNU Radio is open source, i. e. free, and the concepts can be easily accessed by ordinary people without much programming experience using pre-written blocks. Calculations can be performed using OpenCV or Scilab and Xcos. Xcos is an application that is part of the Scilab mathematical modeling system, and it provides developers with the ability to design systems in the field of mechanics, hydraulics and electronics, as well as queuing systems. Xcos is a graphical interactive environment based on block modeling. The application is designed to solve problems of dynamic and situational modeling of systems, processes, devices, as well as testing and analyzing these systems. In this case, the modeled object (a system, device or process) is represented graphically by its functional parametric block diagram, which includes blocks of system elements and connections between them. The device drivers listed in Comedi are used for real-time data access. We also present an improved PyGTK-based graphical user interface for GNU Radio. English version of the article is available at URL: https://panor.ru/articles/industry-40-digital-technology-for-data-collection-and-management/65216.html
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Pan, Cheng-Tang, Mark D. Francisco, Chung-Kun Yen, Shao-Yu Wang, and Yow-Ling Shiue. "Vein Pattern Locating Technology for Cannulation: A Review of the Low-Cost Vein Finder Prototypes Utilizing near Infrared (NIR) Light to Improve Peripheral Subcutaneous Vein Selection for Phlebotomy." Sensors 19, no. 16 (August 16, 2019): 3573. http://dx.doi.org/10.3390/s19163573.
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One of the most common means for diagnosis is through medical laboratory testing, which primarily uses venous blood as a sample. This requires an invasive method by cannulation that needs proper vein selection. The use of a vein finder would help the phlebotomist to easily locate the vein, preventing possible pre-analytical error in the specimen collection and even more discomfort and pain to the patient. This paper is a review of the scientific publications on the different developed low-cost vein finder prototypes utilizing camera assisted near infrared (NIR) light technology. Methods: Electronic databases were searched online, these included PubMed (PMC), MEDLINE, Science Direct, ResearchGate, and Institute of Electrical and Electronics Engineers (IEEE) Xplore digital library. Specifically, publications with the terms vein finder prototype, NIR technology, vein detection, and infrared imaging were screened. In addition, reference lists were used to further review related publications. Results: Cannulation challenges medical practitioners because of the different factors that can be reduced by the utilization of a vein finder. A limited number of publications regarding the assessment of personnel performing cannulation were observed. Moreover, variations in methodology, number of patients, type of patients according to their demographics and materials used in the assessment of the developed prototypes were noted. Some studies were limited with regard to the actual human testing of the prototype. Conclusions: The development of a low-cost effective near infrared (NIR) vein finder remains in the phase of improvement. Since, it is being challenged by different human factors, increasing the number of parameters and participants/human for actual testing of the prototypes must also be taken into consideration for possible commercialization. Finally, it was noted that publications regarding the assessment of the performance of phlebotomists using vein finders were limited.
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Sharma, Mohit, Avery Gardner, Hunter Strathman, David Warren, Jason Silver, and Ross Walker. "Acquisition of Neural Action Potentials Using Rapid Multiplexing Directly at the Electrodes." Micromachines 9, no. 10 (September 20, 2018): 477. http://dx.doi.org/10.3390/mi9100477.
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Neural recording systems that interface with implanted microelectrodes are used extensively in experimental neuroscience and neural engineering research. Interface electronics that are needed to amplify, filter, and digitize signals from multichannel electrode arrays are a critical bottleneck to scaling such systems. This paper presents the design and testing of an electronic architecture for intracortical neural recording that drastically reduces the size per channel by rapidly multiplexing many electrodes to a single circuit. The architecture utilizes mixed-signal feedback to cancel electrode offsets, windowed integration sampling to reduce aliased high-frequency noise, and a successive approximation analog-to-digital converter with small capacitance and asynchronous control. Results are presented from a 180 nm CMOS integrated circuit prototype verified using in vivo experiments with a tungsten microwire array implanted in rodent cortex. The integrated circuit prototype achieves <0.004 mm2 area per channel, 7 µW power dissipation per channel, 5.6 µVrms input referred noise, 50 dB common mode rejection ratio, and generates 9-bit samples at 30 kHz per channel by multiplexing at 600 kHz. General considerations are discussed for rapid time domain multiplexing of high-impedance microelectrodes. Overall, this work describes a promising path forward for scaling neural recording systems to numbers of electrodes that are orders of magnitude larger.
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Ohme, Bruce W., Mark R. Larson, Bhal Tulpule, and Alireza Behbahani. "Characterization of Circuit Blocks for Configurable Analog-Front-End." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, HITEC (January 1, 2014): 000146–53. http://dx.doi.org/10.4071/hitec-wa13.
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Analog functions have been implemented in a Silicon-on-Insulator (SOI) process optimized for high-temperature (>225°C) operation. These include a linear regulator/reference block that supports input voltages up to 50V and provides multiple independent voltage outputs. Additional blocks provide configurable sensor excitation levels of up to 10V DC and/or 20V AC-differential, with current limiting and monitoring. A dual-channel Programmable-Gain-Instrumentation Amplifier (PGIA) and a high-level AC input block with programmable gain and offset serve signal conditioning, gain, and scaling needs. A multiplexer and analog buffer provide an output that is scaled and centered for down-stream A-to-D conversion. Limited component availability and high component counts deter development of sensing and control electronics for extreme temperature (>200°) applications. Systems require front-end power conditioning, sensor excitation and monitoring, response amplification, scaling, and multiplexing. Back-end Analog-to-Digital conversion and digital processing/control can be implemented using one or two integrated circuit chips, whereas the front-end functions require component counts in the dozens. The low level of integration in the available portfolio of SOI devices results in high component count when constructing signal conditioning interfaces for aerospace sensors. These include quasi-DC sensors such as thermo-couples, strain-gauges, bridge transducers as well as AC-coupled sensors and position transducers, such as Linear Variable Differential Transducers (LVDT's). Furthermore, a majority of sensor applications are best served by excitation/response voltage ranges that typically exceed the voltage range of digital electronics (either 5V or 3.3V in currently available digital IC's for use above 200°C). These constraints led Embedded Systems LLC to design a generic device which was implemented by Honeywell as an analog ASIC (Application Specific Integrated Circuit). This paper will describe the ASIC block-level capabilities in the context of the typical applications and present characterization data from wafer-level testing at the target temperature range (225C). This material is based upon work performed by Honeywell International under a subcontract from Embedded Systems LLC, funding for which was provided by the U.S. Air Force Small Business Innovative Research program.
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Wibawa, Handreas Okta, and Agus Harjoko. "Purwarupa Pengoperasian TV Dengan Mendeteksi Isyarat Jari Berbasis Pengolahan Citra Digital." IJEIS (Indonesian Journal of Electronics and Instrumentation Systems) 5, no. 1 (May 1, 2015): 31. http://dx.doi.org/10.22146/ijeis.7151.
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Abstrak Perkembangan teknologi komputer dan elektronika yang sangat pesat saat ini membuat manusia mulai mencari solusi lain untuk melakukan kegiatan menjadi lebih mudah dan praktis. Teknologi-teknologi yang berkembang dan dapat dimanfaatkan saat ini sangat memungkinkan manusia untuk memudahkan aktifitas dalam mengoperasikan TV dengan isyarat jari. Dalam penelitian ini, pengolahan citra digital merupakan teknologi yang digunakan untuk mengoperasikan TV dengan memanfaatkan webcam dan komputer sebagai pengolah citra. Input dari penelitian ini berupa citra tangan hasil tangkapan webcam pada komputer. Kemudian citra tangan diolah melalui sistem pengolah citra untuk mendapatkan hasil berupa nilai pada jari tangan. Nilai tersebut menunjukkan angka yang sama dengan jumlah jari tangan yang terdeteksi oleh webcam pada layar monitor. Mikrokontroler berfungsi menerima data serial dari hasil pemrosesan citra tangan dan berfungsi sebagai konversi nilai data serial menjadi instruksi yang dapat mengoperasikan TV. Model warna yang dipakai adalah model HSV. Langkah awal pengujian pada penelitian ini dilakukan dengan setting ruangan agar pengambilan citra mendapatkan hasil yang terbaik pada setiap ruangan. Hasil dari pengujian ini didapatkan nilai yang terbaik untuk pengoperasian TV dengan isyarat jari yaitu : untuk nilai intensitas cahaya sebesar 12 lux, nilai jarak terbaik sebesar 70 cm dan background terbaik berupa warna biru. Kata kunci— TV, pengolahan citra, model warna HSV Abstract The development computer technology and electronics very rapidly at this time makes people start looking for other solutions to perform activities easier and more practical. Technologies are developed and can be used at this time it is possible to facilitate the activities human beings to operate TV with finger gesture. In this research, digital image processing of technology can be used to operate TV using webcam and computer as image processing. Input this research is hand image that catched by webcam on computer. Then hand image processed through image processing system to obtain results form value fingers. This value indicates the number equal to number fingers detected by webcam camera on monitor screen. Microcontroller function is receives serial data from results image processing and serves serial data conversion value into instructions can operate TV. Color model used in research is HSV. First step testing this research is setting room in order to capture image for get best results in any room. Results of the research found best value for testing operation TV with finger gesture is : for value light intensity is 12 lux, best distance is 70 cm and best baskground is blue. Keywords— TV, image processing, HSV color model
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Klaus, L. "Static and dynamic bridge amplifier calibration according to ISO 4965-2." ACTA IMEKO 9, no. 5 (December 31, 2020): 200. http://dx.doi.org/10.21014/acta_imeko.v9i5.969.
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Dynamic measurements to correctly adjust the magnitude in fatigue testing require a dynamic calibration of force transducers and conditioning electronics if the dynamic loads are to be measured correctly. International standard ISO 4965 describes a calibration method for these components. At PTB, such a calibration of bridge amplifiers has now been performed for the first time. The calibration includes tests with static and dynamic signals. The reference for the calibration is the dynamic bridge standard of PTB. It is particularly suitable for this application as it can generate static and dynamic signals, and thus all investigations can be performed with one reference and in a reasonably short time. The signal creation and the data analysis were carried out using the open source program GNU Octave. For the data analysis, a semi-automatic procedure was developed to simplify the process. Calibrations of two digital bridge amplifiers were carried out.
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Irmansyah, Muhammad. "PENGIMPLEMENTASIAN TEKNOLOGI PROGRAMMABLE LOGIC DEVICE (PLD) SEBAGAI BINER CODE DECIMAL (BCD) UNTUK SCANNING KEYPAD." Elektron : Jurnal Ilmiah 5, no. 1 (August 22, 2018): 9–18. http://dx.doi.org/10.30630/eji.5.1.38.
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Industrial of electronics developed in many fields in the middle of 1990s. Base on this situation, the manufacturer produce the product by increased the function, display, low cost, low power consumption and small size. This kind of product must be supported by complex system, small number of integrated circuit and tiny printed circuit board (PCB). Many integrated technologies such as submicron semiconductor, PCB technology, and the using of PCB surface maximal. The market situation push the producer used modern technology in design and testing for example Programmable Logic Device (PLD). It is the integrated circuit using digital logic which can be changed this function by programming and can be used to industrial application. Programmable Logic Device (PLD) technology can be used to many logical programming by using only one IC. The application of this technology can be found in IC 22V10 with 24 pins. This IC can be applied to replace the function of IC 74299 as encoder decimal to biner to scanning keypad.
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Álvarez, José Luis, Juan Daniel Mozo, and Eladio Durán. "Analysis of Single Board Architectures Integrating Sensors Technologies." Sensors 21, no. 18 (September 21, 2021): 6303. http://dx.doi.org/10.3390/s21186303.
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Development boards, Single-Board Computers (SBCs) and Single-Board Microcontrollers (SBMs) integrating sensors and communication technologies have become a very popular and interesting solution in the last decade. They are of interest for their simplicity, versatility, adaptability, ease of use and prototyping, which allow them to serve as a starting point for projects and as reference for all kinds of designs. In this sense, there are innumerable applications integrating sensors and communication technologies where they are increasingly used, including robotics, domotics, testing and measurement, Do-It-Yourself (DIY) projects, Internet of Things (IoT) devices in the home or workplace and science, technology, engineering, educational and also academic world for STEAM (Science, Technology, Engineering and Mathematics) skills. The interest in single-board architectures and their applications have caused that all electronics manufacturers currently develop low-cost single board platform solutions. In this paper we realized an analysis of the most important topics related with single-board architectures integrating sensors. We analyze the most popular platforms based on characteristics as: cost, processing capacity, integrated processing technology and open-source license, as well as power consumption (mA@V), reliability (%), programming flexibility, support availability and electronics utilities. For evaluation, an experimental framework has been designed and implemented with six sensors (temperature, humidity, CO2/TVOC, pressure, ambient light and CO) and different data storage and monitoring options: locally on a μSD (Micro Secure Digital), on a Cloud Server, on a Web Server or on a Mobile Application.
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D'Errico, Fabrizio, Marco Boniardi, Guido Perricone, and Dragutin Vujanovic. "Influence of Microstructure on Mechanical Properties of an AZ91D Thixomolded® Magnesium Alloy." Key Engineering Materials 348-349 (September 2007): 873–76. http://dx.doi.org/10.4028/www.scientific.net/kem.348-349.873.
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The Thixomolding® process has a 20-year track record of research with commercial applications beginning in 1992. The apparatus machine is similar to those used for an injection plastic molding: it transforms in a single step magnesium chips heated to a semisolid slurry (inside a barrel and screw) into precision molded parts. Originally employed by Asian manufacturers for consumer electronics and consumer hardware applications (such as notebook computer cases, digital camera bodies and chain saw housings, etc.), the industrial uses of Thixomolding® has been widely extending from last years to other parts suppliers in the Americas, Europe and Asia. Nowadays thixomolded parts there are in automotive and sport equipment as automotive shift cams, bike saddle, fishing reels, snowboard bindings, etc. Thanks to the semisolid and thixotropic state of magnesium, the slurry moves in laminar flow inside the mould. The absence (or very low) of turbulence allows to reduce drastically (and often to eliminate) residual porosity which is typical of die-casting. In this work a thixomolded AZ91D has been characterized by tensile and axial fatigue testing (fatigue ratio R=0.1) both in the as-supplied condition and after a Tx heat treatment.
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Lin, Han-Nien, Ya-Ying Chen, Hung-Yun Tsai, and Min-Shan Lin. "Characteristic Analysis and Applications of Electromagnetic Shielding Materials for Wireless Communications Device." Open Materials Science Journal 10, no. 1 (July 15, 2016): 44–53. http://dx.doi.org/10.2174/1874088x01610010044.
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As the trend of consumer electronics and mobile communications devices is obviously developing toward to miniature and high-speed processing, the problem involving with electromagnetic compatibility (EMC) or radio frequency interference (RFI) is becoming more critical for the system integration of high-speed digital and RF mixed signal platforms. This paper is mainly focusing on the characteristics analysis of various electromagnetic shielding materials by utilizing the various shielding effectiveness (SE) measuring methods developed by TDK and ASTM (ASTM D4935). We also adopt the electromagnetic interference (EMI) testing methods developed by IEC for chip level (IEC 61967-3 and IEC 61967-6) to investigate the characteristics and distribution of EMI noise sources. To effectively shield the electric, magnetic, or electromagnetic field originated from noise source, we thus analyze the shielding capability for various materials with different measuring methods. Finally, we will show the EMI reduction and RF performance improvement with implementation of shielding material on module under investigated. With the systematic measurement and analysis described in this paper, we can further identify the related EMI problem and resolve the severe chip or module level EMC problem more effectively.
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Bradshaw, GeorgeM, PeterL L. Desyllas, and Keit McLaren. "4566104 Testing digital electronic circuits." Microelectronics Reliability 26, no. 5 (January 1986): 998. http://dx.doi.org/10.1016/0026-2714(86)90248-9.
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Li, Jacob, Richard L. Patterson, and Ahmad Hammoud. "Characterization of the Vectron PX-570 Crystal Oscillator for Use in Harsh Environments." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (January 1, 2012): 000072–81. http://dx.doi.org/10.4071/hitec-2012-tp12.
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Computing hardware, data-acquisition systems, communications systems, and many electronic control systems require well-controlled timing signals for proper and accurate operation. These signals are, in most cases, provided by circuits that employ crystal oscillators due to availability, cost, ease of operation, and accuracy. In some cases, the electronic systems are expected to survive and operate under harsh conditions that include exposure to extreme temperatures. These applications exist in terrestrial systems as well as in aerospace products. Well-logging, geothermal systems, and industrial process control are examples of ground-based applications, while distributed jet engine control in aircraft, space-based observatories (such as the James Webb Space Telescope), satellites, and lunar and planetary landers are typical environments where electronics are exposed to harsh operating conditions. To ensure these devices produce reliable results, the digital heartbeat from the oscillator must deliver a stable signal that is not affected by external temperature or other conditions. One such solution is a recently introduced commercial-off-the-shelf (COTS) oscillator, the PX-570 series from Vectron International. The oscillator was designed for high-temperature applications and as proof, the crystal oscillator was subjected to a wide suite of tests to determine its ruggedness for operation in harsh environments. The tests performed by Vectron included electrical characterization under wide range of temperature, accelerated life test/aging, shock and vibration, internal moisture analysis, ESD threshold, and latch-up testing. The parametric evaluation was performed on the oscillator's frequency, output signal rise and fall times, duty cycle, and supply current over the temperature range of −125 °C to +230 °C. The evaluations also determined the effects of thermal cycling and the oscillator's re-start capability at extreme hot and cold temperatures. These thermal cycling and restart tests were performed at the NASA Glenn Research Center. Overall, the crystal oscillator performed well and demonstrated very good frequency stability. This paper will discuss the test procedures and present details of the performance results.
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Izadnegahdar, Alain, Stephanie L. Booth, David J. Spry, and Philip G. Neudeck. "Alternative Setup for Long-Duration Low-Duty-Cycle 600°C Ambient Testing of SiC Integrated Circuits." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2021, HiTEC (April 1, 2021): 000076–82. http://dx.doi.org/10.4071/2380-4491.2021.hitec.000076.
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Abstract A scalable, compact oven testbed system for simultaneously evaluating a multitude of high temperature integrated circuits (ICs) for prolonged operating times of up to 600 °C has been prototyped. The new testbed system enables long-duration high temperature testing in sufficient statistical quantities consistent with standard aerospace electronics engineering standards. This setup is comprised of multiple compact ovens housing chips or packages mounted to ceramic circuit boards. Each oven is a compact 15.2 cm length by 15.2 cm width by 12.7 cm depth with a maximum 400 Watts of heating power. The custom-made silicon oxide ceramic heating block inside each oven is based on a 3D printed design adapted for the easy insertion of the IC device under test (DUT). This innovative design provides the quick insertion of ICs with or without a ceramic package into a 600 °C environment by utilizing a movable 11.43 cm long ceramic substrate with electrical traces extending from the oven hot zone to external standard plastic-based board connectors. Another key oven design feature is the minimization of the DUT exposure to electromagnetic interference (EMI) by utilizing a filtered DC power source to reduce heating element noise. Additionally, the ovens can be configured in a parallel arrangement allowing global data monitoring over a single industrial RS422 serial port. This feature is important for scaling up to test multiple ICs semi-simultaneously. A USB serial port is provided to independently control the operating parameters of each oven such as the oven target temperature and oven ramp rate. The oven temperature can reach up to 600 °C with a confirmed +/− 4 °C maximum deviation across the test zone region. The ramp rate can be programmed from 1 °C/minute up to 10 °C/minute. Furthermore, a programmable switchboard is used to interface with the DUT. This switchboard comprises a National Instruments Peripheral Component Interconnect eXtension for Instrumentation (NI PXI) system and a breakout board to send and receive power, analog or digital test signals. By using this unique oven testbed system, a variety of ICs can now be tested in parallel using the same test components configured for a diverse set of requirements.
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Cashion, Avery, and Grzegorz Cieslewki. "High Temperature Quadrature Amplitude Modulation over Orthogonal Frequency Division Multiplexing." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, HiTEN (July 1, 2017): 000020–30. http://dx.doi.org/10.4071/2380-4491.2017.hiten.20.
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As downhole tools advance, they require increasingly higher data rates in communication with the surface. Current data rates over HT single-conductor wireline are limited to approximately 200 kbps. Long cables and harsh environments create a limiting challenge to standard serial bit rates due to high cable impedance and component availability. Keying techniques are often used to improve the robustness and speed of data links over long cables. Frequency shift keying (FSK) is a common implementation where data is encoded by specific frequencies on the data line. Amplitude shift keying (ASK) and phase shift keying (PSK) work on similar principles. In this project we apply quadrature amplitude modulation (QAM), a combination of PSK and ASK, and carry it over multiple frequency channels simultaneously using orthogonal frequency division multiplexing (OFDM). QAM over OFDM is a digital communications technique similar to those used in the telecommunications industry for digital subscriber line (DSL) connections and cellular networks. Using our data link, laboratory tests have demonstrated data rates of up to 3.8 Mbps over a 5000 ft (1524 m) single conductor wireline cable with less than 1e-8 bit error rate. Higher data rates are possible if error mitigation and correction coding is used. Gray encoding is an error mitigation technique where nearby points on the QAM constellation are similar in value so the errors are off only by least significant bits. A prototype point to point link protocol was developed in which the cable bandwidth is assessed empirically to optimize the OFDM by allowing for correction of cable distortion at each frequency independently. The protocol can enable use of the developed data link for a variety of tools with little to no changes by hiding all the complexity from the tool. Future versions of the protocol will automatically detect and correct transmission errors, allow for data buffering/retransmission and provide feedback as to the quality of the link. However, this new approach to the problem requires more complex computation to encode the data and signal generation electronics to produce the required waveform. One of the key challenges to full implementation of this concept on high temperature electronics is that a downhole fast Fourier transform (FFT) is required to decode the QAM information for downlink and an inverse FFT (IFFT) is required to efficiently encode data for uplink. The IFFT allows combination of multiple QAM data streams into a time series which can be converted to analog waveforms. High temperature testing of FFT and IFFT performance on the RelChip RC10001 microcontroller is included here. Also included here are the details of development of a high temperature digital to analog converter (DAC) to create composite signals and a high temperature line driver to boost analog signal transmission. This paper describes the communication architecture, the systems developed for high temperature implementation, and evaluations/implementations on high temperature computation devices.
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Skwarek, Agata, Jan Kulawik, Andrzej Czerwinski, Mariusz Pluska, and Krzysztof Witek. "A method for the tin pest presence testing in SnCu solder alloys." Soldering & Surface Mount Technology 26, no. 3 (May 27, 2014): 110–16. http://dx.doi.org/10.1108/ssmt-10-2013-0027.
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Purpose – The purpose of this study is to develop a testing method for tin pest in tin – copper (SnCu) alloys. Tin pest is the allotropic transformation of white β-tin (body-centered tetragonal structure) into gray α-tin (diamond cubic structure) at temperatures < 13.2°C. Design/methodology/approach – Bulk samples of Sn99Cu1 weight per cent (purity, 99.9 weight per cent) were cast in the form of roller-shaped ingots with a diameter of 1.0 cm and a height of 0.7 cm. The samples were then divided into four groups. The first group included samples artificially inoculated with α-tin powder. The second group was inoculated in the same way as the samples from the first group but additionally subjected to mechanical pressing. The third group of ingots was only subjected to mechanical pressing. The fourth group of samples consisted of as-received roller-shaped ingots.All samples were divided into two groups and kept either at −18°C or at −30°C for the low-temperature storage test. For tin pest identification, a visual inspection was made, using a Hirox digital microscope over 156 days at intervals not longer than 14 days. The plot of the transformation rate, presented as the average increase in the area of α-tin warts in time, was also determined. To demonstrate the differences between regions of β- and α-tin, scanning ion microscopy observations using the focused ion beam technique was performed. Findings – The first symptoms of tin pest were observed for the inoculated, mechanically pressed samples stored at −18°C, as well as those at −30°C, after less than 14 days. In the first stage of transformation, the rate was higher at −30°C for some time but, after about 75 days of storage at sub-zero temperatures, the rate at −30°C became lower compared to the rate at −18°C. Inoculation via the application of substances which are structurally similar to α-tin was efficient for the proposed new approach of rapid testing only when applied with simultaneous mechanical pressing. Infection from pressed-in seeds, leading to conventional seeded growth, was more rapid than infection in contact with seeds (without mechanical pressing), where the transition mechanism was induced by the epitaxial growth of metastable ice. Originality/value – The new rapid method for the diagnostic testing of the susceptibility of different SnCu alloys to tin pest in a period much shorter than 14 days (within single days for storage at −30°C) is proposed and described. The test procedure described in this paper produced results several times quicker than conventional procedures, which may take years. In effect, the behavior of tin alloys in the face of tin pest may be predicted much more easily and much earlier. The same procedure can be applied to other SnCu alloys used in electronics (and in other areas), if the test samples are prepared in a similar manner.
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Amri, Hikmatul, and Stephan Stephan. "Pelatihan Reparasi Peralatan Elektronik Rumah Tangga (Lampu Penerangan LED)." Kumawula: Jurnal Pengabdian Kepada Masyarakat 2, no. 3 (January 2, 2020): 192. http://dx.doi.org/10.24198/kumawula.v2i3.24514.
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Salah satu peralatan elektronika yang paling banyak digunakan oleh masyarakat adalah lampu penerangan. Lampu penerangan rumah dan bangunan memngalami perkembangan yang cukup mulai dari lampu bohlam atau pijar, lampu fluorescent/TL, lampu halogen, lampu LED. Lampu LED sampai saat ini telah mengalami perkembangan LED dual inline package (DIP), LED surface mount device (SMD), HPL (high power LED), dan COB (chip on board). Rangkaian elektronika pada lampu jenis LED hanya terdiri dari 2 bagian yaitu: rangkaian driver dan rangkaian LED yang disusun secara seri. Kerusakan lampu LED paling banyak terjadi pada rangkaian driver dimana ada kerusakan paling ringan yaitu ada komponen yang terbakar sampai kerusakan terparah yaitu seluruh rangkaian yang terbakar. Metoda yang dilaksanakan adalah dengan memberikan pelatihan perbaikan/reparasi lampu jenis LED bagi usaha perbaikan/service peralatan elektronika yang dikelola oleh pemuda RT.05/RW.03 Desa Buruk Bakul. Tahapan yang dilaksanakan adalah memberikan materi komponen yang ada pada lampu LED, memberikan materi tentang komponen yang paling sering terjadi kerusakan pada lampu LED, memberikan praktik cara penggunaan alat ukur analog dan digital, memberikan praktik cara mengecek bagian yang rusak, praktik cara mengganti komponen yang rusa dan tahap melakukan finishing dengan menguji coba terhadap lampu LED yang sudah diperbaiki. Target service ini adalah lampu LED yang ada di sekitar Desa Buruk Bakul dan desa lain yang ingin memperbaiki lampu LED terutama dengan daya yang besar (15-45 watt) karena harga belinya cukup mahal. Dengan mengimplementasikan usaha ini langsung kepada masyarakat maka akan membutuhkan 7-7 orang tenaga kerja, sehingga mampu menambah penghasilan khususnya pada masyarakat kelas bawah di RT.05/RW. 03 Desa Buruk Bakul. One of the main electronics used by the public are light bulbs used for lighting. Household and building lighting has undergone an evolution through the times, starting from light bulbs, fluorescent lamps, halogen lamps, and finally LED lights. The development of LED lights created LED with dual inline package (DIP), LED surface mount device (SMD), HPL (high power LED), and COB (chip on board). The electronical network of LED lights consists of 2 parts, namely the driver network and the LED network that are arranged in a series. LED lights usually breakdown due to damage in the driver network. The lightest damage usually involves fire damage to its components and the heaviest damage usually involves fire damage to the whole network. The methods used involve giving LED lights reparations training to electronics repair stores that are run by youths in RT.05/RW.03 Buruk Bakul Village. The training consists of giving materials regarding components in an LED light, the most vurnurable components in an LED light, practice in the use of analog and digital gauges, practice in the process of checking for damages, practice in substituting damaged parts, and the finishing step of testing the repaired LED unit. The main target of these repairs are the LEDs that are in Buruk Bakul Village and other surounding villages that need LED repairs, especially LEDs with large wattage (15-45 watt) due to their fairly high prices. With the direct implementation of our program, we need 7 workers, in order to increase the income, especially for the lower class of RT.05/RW.03 Buruk Bakul Village.
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Lince Markis, Vera Veronica, and Uzma Septima. "Implementasi Sistem Pengukuran Redaman Serat Optik Pada Lekukan." Jurnal Ilmiah Poli Rekayasa 14, no. 2 (April 15, 2019): 31. http://dx.doi.org/10.30630/jipr.14.2.126.
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Dutch electronics company, Philips, is testing LiFi technology. LiFi or Light Fidelity is able to deliver broadband internet connections through light intermediaries. According to Philips Lightning Olivia Qiu's Chief Innovation Officer, LiFi technology has great potential for today's digital era. Indeed, if you look at the current world trend, internet connection has now become one of the daily needs of humans just like the lighting needs produced by Philips massively. When radio frequency becomes increasingly dense, the light spectrum is a large untapped resource [kompas, 2018]. Based on the facts stated that communication using optical fiber becomes very important so that to optimize the fiber optic system an implementation of optical fiber attenuation measurements is made. In this study, the method of implementing the measurement of optical fiber attenuation at a wavelength of 875 nm was introduced. This optical fiber attenuation measurement utilizes transmitter and receiver optical fiber systems that are connected to optical fibers with different lengths and curves. Attenuation for the length of 1, 3, 4, 5 and 6 meter optical fibers is 0.034, 0.558, 0.625, 1.156 and 2.170 dB respectively in straight optical fiber conditions. The power values for each optical fiber with lengths 1, 3,4,5 and 6m respectively are 52.21, 51.58, 50.81, 45.08 and 30.05 dB when there are curves. The attenuation values of each 1, 3, 4, 5 and 6 m optical fiber lengths are - 0.746, - 0.8, - 0.864, - 1,384 and - 3,145 dB respectively when there is a curve.
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Qingfen Tong, Qingfen Tong, Haisong Xu Haisong Xu, and Rui Gong Rui Gong. "Testing color dif ference evaluation methods for color digital images." Chinese Optics Letters 11, no. 7 (2013): 073301–73304. http://dx.doi.org/10.3788/col201311.073301.
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Wang, Zhan Sheng, Xin Zhao, Jian Jun Gao, Pan Yang, Wei Xu, and Hong Xin Pan. "Study on Testing System for Real-Time of Communication of the Digital Substation's Secondary Equipments." Applied Mechanics and Materials 420 (September 2013): 401–6. http://dx.doi.org/10.4028/www.scientific.net/amm.420.401.
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Digital substations primary equipments make use of many intelligent primary equipment, for example, Electronic Transformers (including Electronic Voltage Transformers EVT and Electronic Current Transformers ECT,which meet the standards IEC 60044-7/8),intelligent switch and so on,digital substations secondary equipments include many IED(Intelligent Electronic Device). This thesis studys on the function,design,hardware and testing method of the testing system for real-time of communication of the digital substations secondary equipments.
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Jaskova, Jana. "Digital Testing During the Pandemic Crisis." International Journal for Innovation Education and Research 9, no. 1 (January 11, 2021): 36–53. http://dx.doi.org/10.31686/ijier.vol9.iss1.2833.
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In 2020, the pandemic crisis caused by covid-19 led to some changes in global education. Consequently, primary and secondary schools as well as universities introduced distance learning in many countries all over the world. This situation mostly required, among other things, a new way of testing learners’ knowledge and skills. The objectives of this paper are to reveal university students’ opinions on computer-based tests in comparison with paper-and-pencil tests and to map their requirements concerning digital testing of English as a foreign language. The research sample includes 284 students of the Faculty of Business and Management, Brno University of Technology, Czech Republic. These students experienced online testing at home during the summer semester of 2019/20 as well as paper tests at school in the previous winter semester of the same academic year. Thereafter, they were asked to complete an anonymous online questionnaire. The results have shown that the learners were mostly satisfied with the introduction of online testing at home. However, if the electronic tests took place at school, not all of them would prefer this way of testing. Regarding tasks in digital tests, the learners gave priority to assignments based on multiple choice. Moreover, the respondents expressed their views on electronic devices and testing speaking skills on online platforms.
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Borja Borja, Mario. "PLATAFORMA DE BRAZOS ROBÓTICOS DE TECNOLOGÍA ABIERTA PARA REALIZAR EXPERIENCIAS DE LABORATORIO DE CONTROL DE POSICIÓN, PLANIFICACIÓN DE TRAYECTORIA Y CONTROL DE VISIÓN ARTIFICIAL." Revista Cientifica TECNIA 26, no. 1 (November 28, 2016): 101. http://dx.doi.org/10.21754/tecnia-26012016.10.
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RESUMEN El principal problema en el desarrollo de carreras de especialización en robótica en nuestro país es que no existen laboratorios con brazos robóticos que permitan hacer pruebas de control de posicionamiento, planificación de trayectoria y control con visión artificial y generalmente en entornos académicos se hace experimentos utilizando software de simulación.En el presente trabajo se propone una alternativa para mejorar el aprendizaje en el estudio de control de brazos robóticos utilizando brazos robóticos reales con una plataforma de tecnología abierta de software y hardware que permita a los estudiantes modificar los programas para implementar algoritmos de control de posición de articulaciones, planificación de trayectoria y control con visión artificial.La propuesta es desarrollar la tecnología total del sistema de control del brazos robóticos en la base al análisis de los requerimientos de electrónica y sistema de computo realizar la selección de electrónica de potencia, computadoras industriales basadas en Controlador Digital de señales (DSC), una computadora personal para interface de usuario.Desarrollar el software base para la computadora industrial y el software base para la computadora personal que permita cargar programas en línea a través del puerto serial desde una computadora personal y además una interface de usuario en la computadora que puede ser modificada de acuerdo a la necesidad y utilizar como sistema de control de nivel superior que realiza los cálculos de planificación de trayectoria, problema inverso y otros sistemas de alto nivel de control con visión artificial.Como resultado se obtuvo la plataforma de tecnología abierta que incluye hardware y software para brazos robóticos de hasta seis grados de libertad con motores de corriente continua en las articulaciones de hasta 100 vatios, encoders y sensores de fin de carrera.La plataforma se probó con la mecánica del brazo robótico serial Mitsubishi RV-M1 que cumple con los parámetros electrónicos y constructivos requeridos por el prototipo.Palabras claves: brazos robóticos; control de posición; plataforma abiertaABSTRACT The main problem in the development of specialization courses in robotics in our country is that there are no laboratories with robotic arms that allow testing positioning control, path planning and control with artificial vision and generally in academic settings is done experiments using software simulation.In this paper an alternative to enhance learning in the study control robotic arms using real robotic arms with an open technology platform software and hardware that allows students to modify programs to implement control algorithms position it is proposed joints, path planning and control with artificial vision.The proposal is to develop the full technology control system of the robotic arms on the basis of the analysis of the requirements of electronic and computer system the selection of power electronics, industrial computers based on digital signal controller (DSC), a computer personnel to user interface.Develop the core software for industrial computer and basic software for the PC that allows load programs online through the serial port from a personal computer and also a user interface on the computer that can be modified according to the need and used as control system upper level that performs calculations path planning, inverse problem and other high-level systems with artificial vision control.As a result the open technology platform that includes hardware and software for robotic arms up to six degrees of freedom with DC motors in the joints of up to 100 watts, encoders and sensors to run was obtained. The platform was tested with the mechanics of serial robotic arm Mitsubishi RV-M1 compliant electronic and construction parameters required by the prototype.Keywords: robotic arms; position control; open platform
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Borja Borja, Mario, Javier Rojas Tintaya, Rodney Rodas Regalado, Carlos Díaz Ramirez, and Cesar Paz Chavez Cesar Paz Chavez. "PLATAFORMA DE BRAZOS ROBÓTICOS DE TECNOLOGÍA ABIERTA PARA REALIZAR EXPERIENCIAS DE LABORATORIO DE CONTROL DE POSICIÓN, PLANIFICACIÓN DE TRAYECTORIA Y CONTROL DE VISIÓN ARTIFICIAL." Revista Cientifica TECNIA 26, no. 1 (November 28, 2016): 101. http://dx.doi.org/10.21754/tecnia.v26i1.11.
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RESUMEN El principal problema en el desarrollo de carreras de especialización en robótica en nuestro país es que no existen laboratorios con brazos robóticos que permitan hacer pruebas de control de posicionamiento, planificación de trayectoria y control con visión artificial y generalmente en entornos académicos se hace experimentos utilizando software de simulación.En el presente trabajo se propone una alternativa para mejorar el aprendizaje en el estudio de control de brazos robóticos utilizando brazos robóticos reales con una plataforma de tecnología abierta de software y hardware que permita a los estudiantes modificar los programas para implementar algoritmos de control de posición de articulaciones, planificación de trayectoria y control con visión artificial.La propuesta es desarrollar la tecnología total del sistema de control del brazos robóticos en la base al análisis de los requerimientos de electrónica y sistema de computo realizar la selección de electrónica de potencia, computadoras industriales basadas en Controlador Digital de señales (DSC), una computadora personal para interface de usuario.Desarrollar el software base para la computadora industrial y el software base para la computadora personal que permita cargar programas en línea a través del puerto serial desde una computadora personal y además una interface de usuario en la computadora que puede ser modificada de acuerdo a la necesidad y utilizar como sistema de control de nivel superior que realiza los cálculos de planificación de trayectoria, problema inverso y otros sistemas de alto nivel de control con visión artificial.Como resultado se obtuvo la plataforma de tecnología abierta que incluye hardware y software para brazos robóticos de hasta seis grados de libertad con motores de corriente continua en las articulaciones de hasta 100 vatios, encoders y sensores de fin de carrera.La plataforma se probó con la mecánica del brazo robótico serial Mitsubishi RV-M1 que cumple con los parámetros electrónicos y constructivos requeridos por el prototipo.Palabras claves: brazos robóticos; control de posición; plataforma abierta.ABSTRACT The main problem in the development of specialization courses in robotics in our country is that there are no laboratories with robotic arms that allow testing positioning control, path planning and control with artificial vision and generally in academic settings is done experiments using software simulation.In this paper an alternative to enhance learning in the study control robotic arms using real robotic arms with an open technology platform software and hardware that allows students to modify programs to implement control algorithms position it is proposed joints, path planning and control with artificial vision.The proposal is to develop the full technology control system of the robotic arms on the basis of the analysis of the requirements of electronic and computer system the selection of power electronics, industrial computers based on digital signal controller (DSC), a computer personnel to user interface.Develop the core software for industrial computer and basic software for the PC that allows load programs online through the serial port from a personal computer and also a user interface on the computer that can be modified according to the need and used as control system upper level that performs calculations path planning, inverse problem and other high-level systems with artificial vision control.As a result the open technology platform that includes hardware and software for robotic arms up to six degrees of freedom with DC motors in the joints of up to 100 watts, encoders and sensors to run was obtained. The platform was tested with the mechanics of serial robotic arm Mitsubishi RV-M1 compliant electronic and construction parameters required by the prototype.Keywords: robotic arms; position control; open platform.
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Azis, Huzain, and Farniawati Fattah. "ANALISIS LAYANAN KEAMANAN SISTEM KARTU TRANSAKSI ELEKTRONIK MENGGUNAKAN METODE PENETRATION TESTING." ILKOM Jurnal Ilmiah 11, no. 2 (August 31, 2019): 167–74. http://dx.doi.org/10.33096/ilkom.v11i2.447.167-174.
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Payment transactions developed along with technological developments, now days technology supports digital payment, each type of digital transaction has its own security services, this study focus on the analysis of security services (confidentiality, integrity and availability) using the Penetration Testing method on magnetic stripe cards as a payment transaction playground facility, then comparing security services to the Radio Frequency Identification (RFID) electronic transaction tool. The results of this study are RFID electronic transaction cards that provide a more complete security service as an electronic payment transaction.
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Davies, W. J., and R. W. Vizzini. "Engine Control Reliability and Durability Improvement Through Accelerated Mission Environmental Testing." Journal of Engineering for Gas Turbines and Power 109, no. 2 (April 1, 1987): 142–45. http://dx.doi.org/10.1115/1.3240016.
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The integration of aircraft control systems for future weapon systems will require the engine control system to meet the mission reliability of the flight control system. This will be accomplished through system redundancy and verified by accelerated environmental testing. Combined environment reliability testing (CERT) will assure control system structural integrity and reliability growth of engine-mounted digital electronic controls. Pratt & Whitney, under contract to the U.S. Navy, has recently completed a 10,000-hr CERT program. Dual full authority digital electronic controls (FADEC), connected by a fiber optic data link, were subjected to environmental tests simulating a composite F-14 mission profile. The FADEC units were also exposed to periodic high vibration levels which would be experienced after foreign object damage and salt spray testing to simulate aircraft carrier environment. The test results are reported herein providing insight not only into the reliability and durability of digital electronic controls but also into the equipment and procedures required for testing of future military and commercial engine control systems.
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Klestov, S. A., D. N. Kuznetsov, and S. B. Suntsov. "Digital 3d x-ray microtomographic scanners for electronic equipment testing." IOP Conference Series: Materials Science and Engineering 516 (April 26, 2019): 012026. http://dx.doi.org/10.1088/1757-899x/516/1/012026.
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Klestov, S. A., V. I. Syryamkin, and S. B. Suntsov. "Digital 3d x-ray microtomographic scanners for electronic equipment testing." Journal of Physics: Conference Series 1499 (March 2020): 012045. http://dx.doi.org/10.1088/1742-6596/1499/1/012045.
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Stensrud, Linda, Bendik Ohrn, Rannveig S. J. Loken, Nargis Hurzuk, and Alex Apostolov. "Testing of Intelligent Electronic Device (IED) in a digital substation." Journal of Engineering 2018, no. 15 (October 1, 2018): 900–903. http://dx.doi.org/10.1049/joe.2018.0172.
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Simakov, A. V., V. V. Kharlamov, and V. I. Skorokhodov. "The overcurrent protection characteristics testing digital substation intelligent electric devices." Omsk Scientific Bulletin, no. 176 (2021): 46–51. http://dx.doi.org/10.25206/1813-8225-2021-176-46-51.
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The electric power industry digital transformation features and the intelligent electronic devices (IEDs) introduction in the low-voltage circuits of power stations and substations are considered. The analysis of normative documents and standards is carried out. The features of scheduled maintenance of relay protection and automation devices are determined, the possibilities and prospects of organizing condition-based maintenance are considered. The mandatory steps required for any type of maintenance are defined. A method for checking the electrical and time characteristics of the overcurrent protection of an intelligent electronic device is proposed. The device is designed in accordance with the IEC-61850 standard and operates in the local area network of a digital substation of architecture III
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Horstman, R. E., and F. J. A. Lier. "Digital E-beam testing." Microelectronic Engineering 7, no. 2-4 (January 1987): 209–13. http://dx.doi.org/10.1016/s0167-9317(87)80013-8.
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Shumenkov, D. G., I. N. Razumov, and V. L. Zdeh. "USE OF SCRIPTING LANGUAGES TO SOLVE PROBLEMS OF AUTOMATED TESTING FOR TESTING ELECTRONIC DIGITAL DEVICES." Issues of radio electronics, no. 2 (March 24, 2020): 12–15. http://dx.doi.org/10.21778/2218-5453-2020-2-12-15.
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Litikov, I. P. "Ring-like testing of digital circuits." Journal of Electronic Testing 1, no. 4 (January 1991): 301–4. http://dx.doi.org/10.1007/bf00136318.
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Di Cataldo, G. "Testing of Digital Systems [Book Review]." IEEE Circuits and Devices Magazine 21, no. 3 (May 2005): 52–53. http://dx.doi.org/10.1109/mcd.2005.1438814.
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Ye, Dun Fan, Xin Liu, Ya Min Li, and Meng Yan Zhang. "Design and Implementation of Intelligent Tester for LED Backlight LCD Display Driving Power." Advanced Materials Research 898 (February 2014): 863–66. http://dx.doi.org/10.4028/www.scientific.net/amr.898.863.
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In accordance with the requirement of LED LCD driving power test and the basic principle of digital DC electronic load and combined with the trend of intelligentization, miniaturization, communication of electronic load, a new scheme of intelligent tester for LED LCD driver power based on PIC is proposed. It implements working modes of setting current, testing voltage, testing current, testing frequency, multi-channel transmission etc. Intelligent testing for ten states of LED LCD's four outputs under two power mode is supported. It can also send test data to upper computer for analysis with RS485 bus.
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Karim, Nozad, Rong Zhou, and Jun Fan. "An Innovative Package EMC Solution Using a Highly Cost-Effective Sputtered Conformal Shield." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, DPC (January 1, 2016): 002152–81. http://dx.doi.org/10.4071/2016dpc-tha42.
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High-speed digital and wireless devices radiate undesired electromagnetic noises that affect the normal operation of other devices causing electromagnetic interference (EMI) problems. Printed circuit board (PCB) and system-level shielding may alleviate inter-system EMI between the PCB board and the outside environment, but does not prevent intra-system EMI within the shielding enclosure. Package and System in Package (SiP) level shielding is often used to minimize intra-system EMI issues. An external metal lid is traditionally employed to prevent noise emission from a device, but the cost and size of this technique makes it unattractive for modern electronics. Conformal shielding is gaining momentum due to its size and height advantages. However, high cost and complexity of the sprayed coating shield prevents it from being used for a wide range of low cost commercial applications. In this paper, an innovative shielding technology with sputtered metal conformal shield is investigated using a specially designed test vehicle. By sputtering a conductive material onto a package, a very thin (typically a few μm) metal layer is constructed on the top and around four sides of the package. This thin sputtered metal layer adds virtually zero penalty to the package size. The cost and complexity of the sputtering process is significantly lower compared to a spraying process. Several types of shielded and unshielded modules were built and extensively tested for both far-field and near-field shielding effectiveness (SE) in a semi-anechoic chamber. The performance of the sputtered conformal shield is compared to that of an unshielded module and the sprayed shield. The measured results show that the sputtered shield performs equally well to a sprayed shield, in far field test, with most measurements better than 40 dB of SE. In near field testing, sputtered shields mostly outperform the sprayed shield, especially when compared in the entire scanned region. A well-designed sputtered conformal shield can, therefore, be a very cost-effective EMI solution for a wide range of packages, such as SiP. Also in the paper, a full wave 3D HFSS model is presented and simulated results for both far and near field are compared with measured data.