Relevant bibliographies by topics / Désorientation des joints de grains

Academic literature on the topic 'Désorientation des joints de grains'

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Published: 3 June 2022

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Journal articles on the topic "Désorientation des joints de grains"

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Yao, Peng, Xiaoyan Li, Fengyang Jin, and Yang Li. "Morphology transformation on Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging." Soldering & Surface Mount Technology 30, no. 1 (February 5, 2018): 14–25. http://dx.doi.org/10.1108/ssmt-10-2017-0038.

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Purpose This paper aims to analyze the morphology transformation on the Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging. Design/methodology/approach Because of the infeasibility of analyzing the morphology transformation intuitively, a novel equivalent method is used. The morphology transformation on the Cu3Sn grains, during the formation of full Cu3Sn solder joints, is regarded as equivalent to the morphology transformation on the Cu3Sn grains derived from the Cu/Sn structures with different Sn thickness. Findings During soldering, the Cu3Sn grains first grew in the fine equiaxial shape in a ripening process until the critical size. Under the critical size, the Cu3Sn grains were changed from the equiaxial shape to the columnar shape. Moreover, the columnar Cu3Sn grains could be divided into different clusters with different growth directions. With the proceeding of soldering, the columnar Cu3Sn grains continued to grow in a feather of the width growing at a greater extent than the length. With the growth of the columnar Cu3Sn grains, adjacent Cu3Sn grains, within each cluster, merged with each other. Next, the merged columnar Cu3Sn grains, within each cluster, continued to merge with each other. Finally, the columnar Cu3Sn grains, within each cluster, merged into one coarse columnar Cu3Sn grain with the formation of full Cu3Sn solder joints. The detailed mechanism, for the very interesting morphology transformation, has been proposed. Originality/value Few researchers focused on the morphology transformation of interfacial phases during the formation of full intermetallic compounds joints. To bridge the research gap, the morphology transformation on the Cu3Sn grains during the formation of full Cu3Sn solder joints has been studied for the first time.
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Choi, Won Kyoung, Se-Young Jang, Jong Hoon Kim, Kyung-Wook Paik, and Hyuck Mo Lee. "Grain Morphology of Intermetallic Compounds at Solder Joints." Journal of Materials Research 17, no. 3 (March 2002): 597–99. http://dx.doi.org/10.1557/jmr.2002.0084.

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The grain morphology of the intermetallic compound (IMC) that forms at the interface between liquid solders and solid-metal substrates was observed at solder joints. Cu6Sn5 grains on Cu substrates were rough or rounded, and Ni3Sn4 grains on Ni substrates were faceted. Through the energy-based calculations, the relationship between the IMC grain morphology and Jackson's parameter α was explained. The Jackson's parameter of the IMC grain with a rough surface is smaller than 2 while it is larger than 2 for faceted grains.
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Lartigue, S., and L. Priester. "Étude des joints de grains dans l'alumine polycristalline." Matériaux & Techniques 73, no. 4-5 (1985): 163–69. http://dx.doi.org/10.1051/mattech/198573040163.

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Ding, Cheng Gang, Ya Qi Ni, Chuan Jun Guo, and Gao Feng Quan. "Study on Microstructure and Performance of Bonding-FSSW Hybrid Joints of AZ31 Magnesium Alloy." Advanced Materials Research 295-297 (July 2011): 1915–18. http://dx.doi.org/10.4028/www.scientific.net/amr.295-297.1915.

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In this paper a bonding-FSSW hybrid method is proposed and the performance and microstructure of bonding-FSSW joints of AZ31 aluminum alloy is examined . The results show that the bonding agent has little influence on the forming and mechanical property of FSSW nugget, the shear-resisting property of joints resulted from bonding with sealing glue and FSSW is equivalent to FSSW joints, in bonding-FSSW with high-strength bonding agent, the shear-resisting property of joints are apparently superior to that of pure FSSW or bonding joints. Tiny and uniform equiaxial grains are formed in the WN(Welding nugget zone) and coarse grains are formed in TMAZ (Thermomechanically affected zone) and HAZ (Heat affected zone), but with unequal size.
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Ding, Cheng Gang, Ya Qi Ni, Chuan Jun Guo, Gao Feng Quan, and Ji Ping Ge. "Study on Procedure of Bonding-FSSW Hybrid Joints of AZ31 Magnesium Alloy." Advanced Materials Research 314-316 (August 2011): 953–56. http://dx.doi.org/10.4028/www.scientific.net/amr.314-316.953.

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In this paper a bonding-FSSW hybrid method is proposed and the joining procedure as well as the microstructure and performance of bonding-FSSW hybrid joints of AZ31 aluminum alloy is examined . The results show that the bonding agent has little influence on the forming and mechanical property of FSSW nugget, the shear-resisting property of the hybrid joints with sealing glue is equivalent to FSSW joints, in bonding-FSSW hybrid joint with high-strength bonding agent, the shear-resisting property of joints are apparently superior to that of pure FSSW or bonding joints. Tiny and uniform equiaxial grains are formed in the WN(Welding nugget zone) and coarse grains are formed in TMAZ (Thermomechanically affected zone) and HAZ (Heat affected zone), but with unequal size. The good properties of the hybrid joints are obtained by choosing the optimal joining parameter.
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Zhang, Yongqiang, Xiangyi Xue, Jingli Zhang, Huiming Li, Ping Guo, Hao Pan, Hongmiao Hou, and Guoyu Jia. "Microstructure Control of Welded Joints of Dissimilar Titanium Alloys by Isothermal Forging." Materials 13, no. 15 (July 28, 2020): 3347. http://dx.doi.org/10.3390/ma13153347.

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In this study, the welded joints of dissimilar titanium alloys Ti600/Ti-22Al-25Nb were strengthened by isothermal forging. Different deformation parameters, including temperature, deformation speed, and reduction, were chosen. By isothermal forging, the original coarse dendritic grains of the welded joints were broken up effectively to form a large number of equiaxed grains. Meanwhile, many second phases were precipitated in the grain. Additionally, the dynamic globularization kinetics of second phases within the welded joints were quantitatively characterized and investigated. The results showed that the dynamic globularization kinetics and globularization rate were sensitive to the deformation conditions, and were promoted by a reduced strain rate and an elevated deformation temperature.
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Seo, Sun-Kyoung, Moon Gi Cho, and Hyuck Mo Lee. "Crystal orientation of β-Sn grain in Ni(P)/Sn–0.5Cu/Cu and Ni(P)/Sn–1.8Ag/Cu joints." Journal of Materials Research 25, no. 10 (October 2010): 1950–57. http://dx.doi.org/10.1557/jmr.2010.0253.

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Electron backscatter diffraction analysis was used to compare the crystal orientation of β-Sn grains in Ni(P)/Sn–0.5Cu/Cu and Ni(P)/Sn–1.8Ag/Cu joints before and after aging. In Ni(P)/solder/Cu joints, the solder composition (Cu versus Ag) significantly affects β-Sn grain orientation. In Ni(P)/Sn–0.5Cu/Cu, there are two types of small columnar grains grown from Ni(P) and Cu under bump metallurgy with a high-angle grain boundary crossing the joint closer to the Ni side; in contrast, Ni(P)/Sn–1.8Ag/Cu has large grains with low-angle boundaries. During thermal aging at 150 °C for 250 h, the Ni(P)/Sn–0.5Cu/Cu joints undergo a more significant microstructural change than the Ni(P)/Sn–1.8Ag/Cu joint. Additionally, obvious ledges developed along the high-angle grain boundary between the upper and lower areas in the Sn–0.5Cu joint.
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Yu, Si Rong, and Xian Jun Chen. "Microstructures and Properties of FSW Joints of AZ31B Mg Alloy." Advanced Materials Research 291-294 (July 2011): 855–59. http://dx.doi.org/10.4028/www.scientific.net/amr.291-294.855.

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The extruded AZ31B Mg alloy sheet was welded with friction stir welding. The microstructures and mechanical properties of the welded joint were investigated. The results show that the grains in the weld nugget zone were small, uniform and equiaxed. The grains in thermo-mechanical affected zone were stretched and relatively small, but were not as small and uniform as those in the weld nugget zone. The grains in the heat-affected zone were relatively coarse. The fracture of the welded joint occurred mainly in the heat affected zone. The tensile strength of the welded joints was up to 257.4 MPa and was 87.9% of the base material strength. The microhardness in the weld nugget zone was higher. The microhardness in the thermo-mechanical affected zone and heat affected zone were lower than that in the weld nugget zone. The microhardness in the weld nugget zone increased from the upper surface to the bottom.
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Guiraldenq, G. "Historique et évolution des recherches sur les joints de grains." Matériaux & Techniques 80, no. 6-7-8 (1992): 23–28. http://dx.doi.org/10.1051/mattech/199280060023.

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Gourlay, C. M., Zhao Long Ma, Jing Wei Xian, Sergey A. Belyakov, Mohd Arif Anuar Mohd Salleh, Guang Zeng, Hideyuki Yasuda, and Kazuhiro Nogita. "Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni Solders." Materials Science Forum 857 (May 2016): 44–48. http://dx.doi.org/10.4028/www.scientific.net/msf.857.44.

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The solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni are overviewed and compared. In joints on Cu substrates, both solders begin solidification with primary Cu6Sn5 growing in the bulk liquid prior to tin nucleation. In freestanding balls and joints, SAC305 generally solidifies with a single tin nucleation event and exhibits a mutually-twinned tin grain structure. In contrast, SN100C BGA balls and joints exhibit multiple independent tin grains that grow as a columnar array in joints.
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Dissertations / Theses on the topic "Désorientation des joints de grains"

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Vasseur, Jérôme. "Aspects théoriques de la ségrégation d'impuretés aux joints de grains à forte désorientation dans les métaux." Lille 1, 1993. http://www.theses.fr/1993LIL10049.

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Dans cette approche theorique du phenomene de segregation d'impuretes aux joints de grains a forte desorientation dans les metaux, les interactions elastique et electronique entre impurete et joint de grains ainsi que l'effet de l'ordre dans le joint de grains sur la segregation sont etudiees. Les energies elastique et electronique d'interaction entre impurete et joint de grains sont calculees en modelisant le joint de grains par un defaut plan insere entre deux milieux semi-infinis et l'impurete, par un defaut ponctuel. L'energie elastique depend de l'epaisseur du joint de grains et des constantes elastiques des milieux en presence. L'energie electronique est a tres courte portee. A grande distance du defaut plant, l'interaction electronique presente un profil oscillatoire et ne peut induire de segregation. Une correlation theorique entre l'enrichissement du joint de grains et la solubilite des impuretes, dans la limite des faibles solubilites est determinee. D'autre part, un modele discret de joint de grains a forte desorientation sous forme de reseau de forces de compression a permis de reveler que la segregation est tres sensible a l'ordre dans le joint de grains. Un modele periodique de joint de grains ne donne pas lieu a segregation. La tendance a la segregation est d'autant plus importante que le joint est plus desordonne. Ces resultats theoriques sont en bon accord avec les observations experimentales de segregation aux joints de grains a forte desorientation dans les metaux.
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Volovitch, Polina. "Percolation et matériaux pollycristallins : Application au mouillage des interfaces." Paris, ENSAM, 2002. http://www.theses.fr/2002ENAM0019.

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Rouag, Nadjet. "Influence de la texture cristallographique et de la spécialité des joints de grains sur l'anisotropie de migration des joints entourant un grain d'orientation (110)<001> au cours des premiers stades de la recristallisation secondaire dans les toles de Fe-3% SI en présence de précipités AIN et MnS." Paris 11, 1988. http://www.theses.fr/1988PA112364.

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Cette étude, sur la formation de la texture de GOSS par croissance anormale, est une contribution dans la compréhension des mécanismes susceptibles d'Intervenir en recristallisation secondaire. La formation de la texture de GOSS dans les tôles de type HI-B (à haute perméabilité magnétique) ne semble pas obéir aux lots classiques de la recristallisation: les grains qui croissent de façon exagérée ne possèdent pas une taille supérieure à la moyenne dans la matrice, hypothèse généralement admise dans les modèles de croissance. L'avantage "taille" n'étant pas une condition nécessaire au déclenchement de la recristallisation secondaire, il apparaît alors que la croissance exagérée des grains d'orientation {110}<001>, aux dépens des autres orientations présentes, soit due à un comportement particulier des joints qui les entourent. Ce comportement est caractérisé par deux aspects: cristallographique (texture - caractéristiques des joints de grains) et chimique (rôle des inhibiteurs). La présence majoritaire de la composante de texture {111} <112> assure aux grains de GOSS, minoritaires, l'existence d'un pourcentage de joints de type C. S. L. Plus élevé que la moyenne dans la matrice: ceux-ci sont moins freinés que les joints généraux par les inhibiteurs, car ils correspondent à des minima d'énergie. La croissance préférentielle des grains de GOSS, au cours des premières étapes de la recristallisation secondaire, est donc liée à l'existence d'un voisinage favorable. La caractérisation du voisinage cristallographique autour d'une composante {hkl} permet alors d’établir des prévisions sur le comportement des joints de grains en migration, en présence d'une seconde phase dans la matrice. La détermination des régions, dans l'espace des orientations, potentiellement favorables à la croissance des grains d'orientation {110}<001>, permet de définir la matrice la plus adéquate pour la formation de la texture de GOSS. Par ailleurs, après dissolution des précipités, la purification de la matrice, sous l'action de l'atmosphère réductrice H2, permet d'éviter les hétérogénéités de texture,néfastes pour les propriétés magnétiques, dans la matrice finale.
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Agrizzi, Ronqueti Larissa. "Study of grain boundary oxidation of high alloyed carbon steels at coiling temperature." Thesis, Compiègne, 2018. https://bibliotheque.utc.fr/Default/doc/SYRACUSE/2018COMP2405.

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Les aciers à haute résistance (AHSS) ont été largement utilisés dans le cadre d’applications automobiles visant à améliorer la sécurité et l’allègement des structures. Afin d'atteindre les objectifs en termes de propriétés mécaniques, ces nouveaux aciers sont composés de teneurs en éléments d’alliages beaucoup plus élevés (par exemple silicium et manganèse) que les aciers usuels. En conséquence, l'AHSS est susceptible de subir une oxydation interne sélective lors du refroidissement des bobines d’acier. L'oxydation sélective interne, en particulier l'oxydation aux joints de grains (GBO), est actuellement l'un des principaux obstacles à la production de ces aciers. Elle réduit le nombre de cycles avant la rupture de fatigue et rend ainsi difficile l’obtention des spécifications du client. Par conséquent, ce travail de thèse était axé sur l'effet de plusieurs paramètres sur le comportement à l’oxydation interne sélective. Parmi eux, l'impact de la décarburation, l'influence de la température de bobinage et de la couche de calamine, l'effet de différentes teneurs en silicium et / ou en manganèse et leur comportement en diffusion. De plus, l'impact de la désorientation des joints de grains sur l'oxydation interne a également été étudié. Des alliages modèles à base de fer binaires / ternaires ainsi que des aciers industriels ont été étudiés via un large ensemble de techniques expérimentales. Ces analyses ont mis en évidence une décarburation stable pour tous les échantillons étudiés qui n'a pas d'impact sur l'oxydation interne sélective pour une longue exposition aux conditions isothermes. Les profondeurs d’oxydation aux joints de grain ont été examinées selon les différentes configurations de tests et se sont révélées sensibles aux teneurs en silicium ou en manganèse. Pour certaines d'entre elles, différents comportements de diffusion du silicium ont été identifiés vis-à-vis de l'oxydation des joints de grains, en fonction des températures. Considérant quelques hypothèses restrictives, l'application de la théorie de l'oxydation interne sélective de Wagner a permis de déterminer le coefficient de diffusion de l'oxygène aux joints de grain. Pour surmonter certaines limites du modèle de Wagner, un modèle d'oxydation sélective a été appliqué pour comprendre l'effet de différents paramètres sur la pénétration de l'oxygène à l'intérieur du métal et principalement sur la profondeur des joints de grain affectée par l'oxydation sélective. Les connaissances acquises à partir de ce travail de thèse aideront à comprendre et à limiter l'oxydation sélective interne (principalement l’oxydation aux joints de grain) dans les aciers avec des compositions complexes en éléments d’alliage. En outre, les résultats peuvent être utilisés pour évaluer les paramètres d’un modèle d'oxydation sélective
Advanced high-strength steels (AHSS) have been widely used in automotive industry to improve safety and fuel economy. In order to reach the mechanical properties targets, these new steels are composed by much higher alloy contents (e.g. silicon and manganese) than usual steels. As consequence, the AHSS may suffer of selective internal oxidation during the cooling of hot coil. The selective internal oxidation, especially the grain boundary oxidation (GBO), is currently one of the main obstacles to the production of these steels. It reduces the number of cycles before fatigue failure and thus, makes it difficult to reach the specifications of the customer. Therefore, this PhD work was focused on the effect of several parameters on selective internal oxidation behavior. Among them, the impact of decarburization, the influence of coiling temperature and the mill scale, the effect of different silicon and/or manganese contents and their diffusion behavior. Moreover, the impact of grain boundary misorientation on grain boundary oxidation was also investigated. Either binary/ternary iron-based model alloys as well as industrial steels were investigated by a large set of experimental techniques. This analysis showed a stable decarburization for all investigated samples that does not impact the selective internal oxidation for long exposure time in isothermal conditions. The GBO depths were examined according to the different test configurations and were found dependent for some cases on silicon or manganese content. For some of them, different silicon diffusion behaviors were identified with regards to grain boundary oxidation depending on temperatures. Considering some restrictive hypotheses, the application of Wagner’s theory of selective internal oxidation allowed determining the grain boundary diffusion coefficient of oxygen. To overcome some limitations of Wagner’s model, a model of selective oxidation has been applied to understand the effect of different parameters on the penetration of oxygen inside the metal and principally on the grain boundary depth affected by selective oxidation. The knowledge acquired from this PhD work will help to understand and limit the selective internal oxidation (mainly GBO) in new steels with complex alloy compositions. Furthermore, the results may be used to assess a model of selective oxidation
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M'rabat, Benyounes El. "Influence du phosphore sur la texture des joints de grains du fer et sur l'interaction dislocations de matrice-joints de grains." Grenoble 2 : ANRT, 1986. http://catalogue.bnf.fr/ark:/12148/cb375998860.

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Elm'Rabat, Benyounès. "Influence du phosphore sur la texture des joints de grains du fer et sur l'interaction dislocations de matrice-joints de grains." Paris 11, 1986. http://www.theses.fr/1986PA112244.

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Analyse par microscopie électronique en transmission des effets du phosphore sur les joints de grains du fer pour tenter d'interpréter la fragilisation du fer par le phosphore en termes de formation et de relaxation des dislocations intrinsèques. Le phosphore entraine une augmentation du pourcentage des joints. Il semble favoriser la déformation à froid des joints dans lesquels un grand nombre de dislocations s'incorporent aisément. La température de "dispersion" ou "dislocation" des dislocations varie selon le type du joint et selon les caractéristiques de la dislocation. Analyse de l'interaction "dislocations-joints de grains" par étude de la déformation in situ des joints
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Bacia, Maria. "Comportement du carbone aux joints de grains du molybdène." Grenoble INPG, 1994. http://www.theses.fr/1994INPG4210.

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La mise en evidence et l'interpretation du role benefique du carbone et du role nefaste de l'oxygene sur la cohesion intergranulaire du molybdene en l'absence de precipitation visible au meb constituaient le but de cette etude. Une methode efficace de purification du molybdene a ete mise au point. Les mesures de la concentration intergranulaire de carbone en fonction de la temperature de carburation et de la teneur volumique ont ete effectuees a l'aide d'un spectrometre auger. Un modele d'enrichissement des joints de grains au cours du refroidissement a ete propose. Les structures des joints purs et contenant des atomes de solute ont ete determinees par des simulations statiques a l'aide de potentiels a n corps calcules en se fondant sur la methode de l'atome immerge (eam). La comparaison des segregations intergranulaires d'oxygene et de carbone (sites de segregation, sequence d'occupation des sites, enthalpies de melange) a ete effectuee pour le cas du joint symetrique de flexion 37 autour de l'axe 100. Les structures atomiques du joint 37 a l'etat pur et a l'etat carbure ont ete observees au microscope electronique a haute resolution. Apres la carburation ne conduisant pas a la formation de precipites mo#2c visibles au meb, la presence d'une phase bidimensionnelle moc#x (x 0,4) formant un film continu au joint a ete mise en evidence. Elle peut etre rendue responsable du renforcement du joint. Sa faible largeur ( 10 a) et son accommodation parfaite aux reseaux cristallographiques des deux grains rendent son observation impossible par des methodes classiques (meb, met), ce qui explique que son existence etait jusqu'a maintenant ignoree. Il n'est pas exclu qu'il s'agisse de la premiere observation d'un etat intermediaire entre la segregation et un compose tridimensionnel discontinu
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Maurice, Jean-Luc. "Contribution à l'étude des joints de grains dans le silicium." Paris 7, 1992. http://www.theses.fr/1992PA077127.

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Les proprietes electriques des joints de grains, dans le silicium polycristallin, sont tres sensibles a la nature des microprecipites d'impuretes qu'ils contiennent. Ces precipites forment deux classes bien distinctes: i) les precipites metalliques, formes de siliciures de metaux de transition (fe, ni, cu), qui ont une influence determinante sur les proprietes electriques de joints, et ii) les precipites isolants, a base d'oxyde ou d'oxynitrure de silicium, qui ont une influence beaucoup plus faible
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Jin, Yuan. "Formation des macles thermiques pour l'ingénierie de joints de grains." Thesis, Paris, ENMP, 2014. http://www.theses.fr/2014ENMP0030/document.

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Le maclage thermique est un défaut cristallographique largement discuté dans les métaux de type CFC à faible énergie de faute d'empilement. Malgré une importante littérature scientifique dédiée à ce sujet, les mécanismes expliquant précisément la formation de ces macles thermiques ne sont pas totalement élucidés à ce jour. Dans ce travail, nous avons cherché à améliorer notre compréhension de ce phénomène fondamental en métallurgie physique. Différents matériaux de type CFC (acier inoxydable 304L, nickel pur et Inconel 718) ont été considérés. Nous avons confirmé, grâce à des expériences de traitement thermique in situ couplées à des cartographies d'orientation, que la majorité des macles thermiques sont générées durant la recristallisation. De la même manière, par une expérience réalisée sur l'Inconel 718, nous avons mis en évidence que la croissance de grains pure n'était pas source de joints de macle. Par conséquent, il semble évident que les phénomènes de recristallisation et de croissance de grains ont des régimes totalement distincts associés à des mécanismes spécifiques du point de vue de la formation des macles thermiques, et doivent donc absolument être étudiés séparément. Nous avons ainsi proposé un nouveau modèle, dans lequel l'effet du signe de la courbure moyenne du front de recristallisation est pris en compte. Les influences de différents facteurs thermomécaniques, y compris le niveau de déformation, la taille de grains initiale, la température de recuit et la vitesse de montée en température, ont été étudiées à travers deux séries d'expériences. Suite à l'effet du signe de la courbure moyenne du joint de grain, nous avons proposé une méthode pour quantifier la tortuosité du front de recristallisation. Dans cette étude, nous montrons que cette quantité est corrélée à la densité de macles post-recristallisation. En sus des analyses expérimentales, des outils numériques de type champ moyen et champ complet ont également été développés dans cette étude afin de modéliser l'évolution des macles thermiques tout en tenant en compte des mécanismes physiques mis en évidence expérimentalement. Les bases d'un nouveau modèle de type champ moyen ont été proposées afin de modéliser l'évolution de la densité de macles moyenne durant le phénomène de croissance de grains. Ce modèle, dans lequel seulement un paramètre doit être identifié par des donnés expérimentales, semble mieux décrire les résultats expérimentaux obtenus pour l'inconel 718 comparé au modèle de Pande, référence en la matière. Deux méthodes implicites i.e. la méthode level-set et la méthode champ de phase ont été comparées au niveau de leurs formulations et de leurs performances numériques pour des simulations de croissance de grains anisotrope. C'est la première fois que ces deux méthodes sont comparées dans le contexte de l'utilisation de maillages éléments finis non stucturés et hétérogènes en terme de taille de maille. Une nouvelle méthodologie a été ainsi proposée dans le cadre de l'approche level-set pour simuler l'évolution de macles thermiques durant le phénomène de croissance de grains. Dans cette nouvelle méthodologie, les joints de macles peuvent être insérés dans des microstructures synthétiques. De plus, les joints de macles peuvent être distingués selon leur nature cohérente ou incohérente. Nous avons montré à travers les différentes simulations réalisées que les propriétés spéciales des joints de macles peuvent être prises en compte avec ce nouveau formalisme
Annealing twin is a crystallographic defect that is largely reported in F.C.C. metals especially those with low stacking fault energy. Despite the amount of work dedicated to the subject, the understanding of annealing twin formation mechansims is not complete in the literature. In the present work, by applying both experimental and numerical tools, we tried to have a more profound understanding of this phenomenon, which is essential to Physical Metallurgy. For this purpose, different F.C.C. Materials including 304L stainless steel, commercially pure nickel and nickel based superalloy Inconel 718 are investigated. We confirmed that annealing twins are mainly formed in the recrystallization regime, especially driven by the migration of recrystallization front into deformed regions by using in situ EBSD technique. In addition, we found in the in situ observations that there are almost no twins generated in the grain growth regime. This observation is confirmed by another grain growth experiment performed on Inconel 718. Therefore, curvature driven grain boundary migration by itself is not sufficient to generate annealing twins. A new atomistic model to explain annealing twin formation mechanism, in which the effect of migrating boundary curvature is considered, is proposed. The effects of different thermo-mechanical factors, including prior deformation level, initial grain size, annealing temperature and the heating velocity, on annealing twin formation are determined via two experiments performed on commercially pure nickel. Based on the idea of grain boundary curvature, we proposed a method to quantify recrsytallization front tortuosity. In the present study, we show evidence that this quantity is positively correlated with the twin density at the end of the recrystallization regime. In addition to experimental studies, numerical tools including both mean field and full field approaches are applied to model annealing twin evolution during grain growth by taking into account the revealed mechanisms. A basis of a new mean field model is proposed to model annealing twin density evolution during grain growth. This model, which has only one parameter to be identified, provides a better consistency with the experimental data of Inconel 718 compared to the Pande's model. Besides, full field approaches are also applied to simulate the overall microstructure evolution during grain growth. Two implicit methods i.e. the level set and the multi-phase-field methods are compared in terms of their formulations and their numerical performance in anisotropic grain growth simulations. It is the first time that these two methods are compared in the finite element context with non-structural mesh. In the present numerical context, the level set method is more suitable to describe strong anisotropy in grain boundary energy. A new methodology is thus developed in the level set framework to simulate annealing twin evolution during grain growth. This methodology, in which we can insert annealing twin boundaries into synthetic microstructures and distinguish coherent and incoherent twin boundaries, is proven to be able to counting for the strong anisotropy introduced by coherent annealing twin boundaries
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Fayette, Sylvain. "Conduction thermique dans les matériaux hétérogènes, influence des joints de grains." Limoges, 2001. http://www.theses.fr/2001LIMOA001.

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Books on the topic "Désorientation des joints de grains"

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Ecole, d'été de métallurgie physique (1984 Carry-le-Rouet France). Les joints de grains dans les matériaux. Les Ulis, France: Editions de physique, 1985.

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Priester, Louisette. Les joints de grains. EDP Sciences, 2020. http://dx.doi.org/10.1051/978-2-7598-0241-8.

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Les joints de grains dans les materiaux. Editions de physique, 1985.

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Polycrystalline Semiconductors: Physical Properties and Applications. Springer-Verlag Berlin and Heidelberg GmbH & Co. KG, 1985.

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Book chapters on the topic "Désorientation des joints de grains"

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Harashchenko, Olena, Vitaly Dmytryk, Viacheslav Berezutskyi, and Tetiana Syrenko. "Metallographic Determination of the Number and Sizes of Grains Depending on Structural and Phase Changes in the Metal of Welded Steam Pipe Joints." In Lecture Notes in Mechanical Engineering, 384–92. Cham: Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-031-06025-0_38.

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"7 Grains, joints de grains et interfaces." In La microstructure des aciers et des fontes, 157–68. EDP Sciences, 2020. http://dx.doi.org/10.1051/978-2-7598-0833-5-009.

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"7 Grains, joints de grains et interfaces." In La microstructure des aciers et des fontes, 157–68. EDP Sciences, 2020. http://dx.doi.org/10.1051/978-2-7598-0833-5.c009.

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"Références." In Les joints de grains, 469–74. EDP Sciences, 2020. http://dx.doi.org/10.1051/978-2-7598-0241-8-022.

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"Frontmatter." In Les joints de grains, i—ii. EDP Sciences, 2020. http://dx.doi.org/10.1051/978-2-7598-0241-8-fm.

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"Chapitre 5 : Relaxation des contraintes intergranulaires." In Les joints de grains, 283–320. EDP Sciences, 2020. http://dx.doi.org/10.1051/978-2-7598-0241-8-017.

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"Remerciements." In Les joints de grains, vii—viii. EDP Sciences, 2020. http://dx.doi.org/10.1051/978-2-7598-0241-8-002.

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"Chapitre 4 : Ordre ou désordre à haute température ?" In Les joints de grains, 97–102. EDP Sciences, 2020. http://dx.doi.org/10.1051/978-2-7598-0241-8-008.

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"Références." In Les joints de grains, 141–46. EDP Sciences, 2020. http://dx.doi.org/10.1051/978-2-7598-0241-8-011.

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"Chapitre 4 : Interactions entre dislocations et joints de grains." In Les joints de grains, 255–82. EDP Sciences, 2020. http://dx.doi.org/10.1051/978-2-7598-0241-8-016.

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Conference papers on the topic "Désorientation des joints de grains"

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Gong, Jicheng, Changqing Liu, Paul P. Conway, and Vadim V. Silberschmidt. "Mechanical Behaviour of Grains in SnAgCu Solder Joints." In 2006 International Conference on Electronic Materials and Packaging. IEEE, 2006. http://dx.doi.org/10.1109/emap.2006.4430595.

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Priester, L. "Physico-chimie des joints de grains : ségrégation - précipitation." In PlastOx 2007 - Mécanismes et Mécanique des Interactions Plasticité - Environnement. Les Ulis, France: EDP Sciences, 2009. http://dx.doi.org/10.1051/ptox/2009006.

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Mondal, Debabrata, Abdullah Fahim, KM Rafidh Hassan, Jeffrey C. Suhling, and Pradeep Lall. "Deformation Behavior of SAC305 Solder Joints With Multiple Grains." In ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/ipack2020-2694.

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Abstract Lead-free solder joints are the most widely used interconnects in electronic packaging industries. Usually solder joints in most of the electronic devices are exposed to an environment where variation of temperature exists, which indicates cyclic thermal loading to be a very common type of external loading. Moreover, due to difference in the coefficient of thermal expansion (CTE) among dissimilar contact materials, shear stress develops in junctions under thermal loading, which significantly deteriorates the overall reliability. Hence, characterization of lead-free solder materials under thermal loading is essential to predict the performance and deformation behavior of joints in practical applications. A significant portion of the studies in this field are concerned with thermal loading of lead-free solder interconnects, each of which has a very small diameter, in sub-millimeter range. Although the solder balls have very small dimensions, most of the analyses considered them as a bulk material with homogeneous and isotropic properties. However, with the decrease of specimen dimensions, size effects and material directionality play a significant role in deformation mechanisms. Since a very few grains exist in a small specimen, individual grain properties play a vital role on overall material response. Therefore, modeling from the grain structure and orientation point of view could be an effective and more accurate way to predict solder joint deformation behavior under thermal loading. In this study, the effect of grain size and orientation of SAC305 is investigated for predicting anisotropic behavior of solder joints under thermal load. A simplified three-dimensional model of beach-ball configuration solder joint was generated and simulated using ABAQUS finite element (FE) software. Experimentally obtained directional properties such as elastic modulus and CTE were assigned to the computational geometry to create material anisotropy. The effects of material anisotropy were studied for varying grain size specimens, as well as for specimens with varying grain orientation.
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Priester, L. "Structures et défauts de structure des joints de grains." In PlastOx 2007 - Mécanismes et Mécanique des Interactions Plasticité - Environnement. Les Ulis, France: EDP Sciences, 2009. http://dx.doi.org/10.1051/ptox/2009005.

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Tanguy, D., and E. Vamvakopoulos. "Lacunes surabondantes dans les systèmes métal-hydrogène et endommagement des joints de grains : simulations atomiques." In PlastOx 2007 - Mécanismes et Mécanique des Interactions Plasticité - Environnement. Les Ulis, France: EDP Sciences, 2009. http://dx.doi.org/10.1051/ptox/2009007.

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Holdermann, Ken, Gayatri Cuddalorepatta, and Abhijit Dasgupta. "Dynamic Recrystallization of Sn3.0Ag0.5Cu Pb-Free Solder Alloy." In ASME 2008 International Mechanical Engineering Congress and Exposition. ASMEDC, 2008. http://dx.doi.org/10.1115/imece2008-67671.

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This study examines microstructural recrystallization in Sn3.0Ag0.5Cu (SAC305) solder joints due to isothermal, mechanical cycling. It is well known that after reflow SAC solder joints at length scales of 200 μm consist of only a few grains [1–3]. This coarse microstructure makes the joint mechanically inhomogeneous and anisotropic, and non-repeatable. Creep tests conducted on modified lap-shear SAC305 solder joints therefore show significant scatter in their results, because of piece-to-piece variability in the microstructural morphology [1]. However, results of cyclic fatigue tests of the same SAC305 solder joints show less significant scatter [4]. One possible hypothesis is that dynamic recrystallization occurs during the cycling, resulting in a much finer (and hence more isotropic, homogeneous and repeatable) microstructure. Recrystallization of solder has been reported to occur under thermal cycling [5–6]. The objective of this study is to assess the extent of recrystallization of SAC305 solder during isothermal mechanical cycling fatigue. Focused ion beam technology is used to prepare a very clean and even surface to reveal the SAC305 grains in modified lap-shear test specimens, both before and after isothermal mechanical cycling. Polarized light microscopy, scanning electron microscopy and focused ion beam microscopy are used to reveal the microstructure of these SAC305 solder joints. The results show that mechanical cycling produces the same type of recrystallization behavior of SAC solder, as has been reported in the literature for thermally cycled specimens [5–6]. The number of grains in the SAC305 solder joint changes from a few to hundreds, during mechanical cycling. As expected, the recrystallization is observed to be localized around cracks in the solder joint, where the local stresses are the highest. The minimal grain size near the cracked region is approximately 4–6 μm and the average grain size increases significantly with increasing distance from the crack face. The transition of solder from very few (non-homogeneous and anisotropic) to a homogenous recrystallized state may be one possible explanation for differences in the extent of scatter in the data from creep tests and isothermal mechanical fatigue tests.
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Fahim, Abdullah, Sudan Ahmed, Jeffrey C. Suhling, and Pradeep Lall. "Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging." In ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/ipack2018-8408.

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Exposure of lead free solder joints to high temperature isothermal aging conditions leads to microstructure evolution, which mainly includes coarsening of the intermetallic (IMC) phases. In our previous work, it was found that the coarsening of IMCs led to degradation of the overall mechanical properties of the SAC solder composite consisting of β-Sn matrix and IMC particles. However, it is not known whether the isothermal aging changes properties of the individual β-Sn and IMC phases, which could also be affecting to the overall degradation of properties. In this study, the aging induced variations of the mechanical properties of the β-Sn phase, and of Sn-Cu IMC particles in SAC solder joints have been explored using nanoindentation. SAC solder joints extracted from SuperBGA (SBGA) packages were aged for different time intervals (0, 1, 5, 10 days) at T = 125 °C. Nanoindentation test samples were prepared by cross sectioning the solder joints, and then molding them in epoxy and polishing them to prepare the joint surfaces for nanoindentation. Multiple β-Sn grains were identified in joints using optical polarized microscopy and IMCs were also observed. Individual β-Sn grains and IMC particles were then indented at room temperature to measure their mechanical properties (elastic modulus and hardness) and time dependent creep deformations. Properties measured at different aging time were then compared to explore aging induced degradations of the individual phases. The properties of the individual phases did not show significant degradation. Thus, IMC coarsening is the primary reason for the degradation of bulk solder joint properties, and changes of the properties of the individual phases making up the lead free solder material are negligible.
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Hoque, Mohd Aminul, Mohammad Ashraful Haq, Jeffrey C. Suhling, and Pradeep Lall. "Study of Lead Free Solder Joints Subjected to Isothermal Mechanical Shear Cycling." In ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/ipack2020-2692.

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Abstract Electronic packages are usually subjected to varying temperature conditions, thus subjecting the package to thermal cyclic loadings. As the different components of the package are made up of materials of different Coefficients of Thermal Expansion (CTE), the thermal cyclic loading brings about fluctuating shear stress to arise within the package, ultimately leading to its failure. It has been seen in previous literature that the recrystallization assisted cracking is a major factor that leads to the failure of solder joints when subjected to thermomechanical cycles. In this study, the authors have tried to determine whether the mechanical shear cycling of aged and non-aged samples of SAC305 lead free solder joints undergo a recrystallization phase before its ultimate failure. Arrays (3 × 3) of SAC305 solder joints of roughly 750μm in diameter were reflowed in between two FR-4 printed circuit boards to create a sandwiched structural sample. The samples were then polished to expose the solder joints. A polarized light microscope was utilized to capture the images of the joints before and after the mechanical cycling and analyzed to observe any changes in the microstructure in the form of recrystallization of the tin grains.
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Park, Seungbae, Ramji Dhakal, Lawrence Lehman, and Eric Cotts. "Grain Formation and Intergrain Stresses in a Sn-Ag-Cu Solder Ball." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73058.

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The thermo-mechanical behavior of near eutectic lead-free SnAgCu (SAC) solder joints under Deep Thermal Cycling (DTC) and in-situ thermal loading was examined. Crossed polarizer, optical microscopy revealed that in ball grid array (BGA) solder joints, these Sn rich, Pb-free solders exhibit large grained Sn structures. After imaging, these SnAgCu solder joints were subjected to repeated thermal stresses under an inert atmosphere. Subsequent to this thermal loading, the samples were again examined with optical microscopy. Using both data sets, the intergrain strains and deformations were quantified by Digital image correlation, a full field optical measurement technique. The relations between the positions of grains as well as intermetallics compounds, their boundaries and Sn deformation fields were examined.
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Togasaki, Yu, Takashi Honda, Tetsuya Sasaki, Atsushi Yamaguchi, and Hirokazu Tsuji. "Effect of Ultrasonic Impact Treatment on Fatigue Life in Butt Welded Joints of Austenitic Stainless Steel." In ASME 2010 Pressure Vessels and Piping Division/K-PVP Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/pvp2010-25539.

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Ultrasonic impact treatment (UIT), which is a type of peening method, is usually used as a post-weld treatment for mild steel in order to improve the fatigue strength of its welded joints. As there is insufficient fatigue data available on welded joints of austenitic stainless steel treated by UIT, the authors decide to conduct fatigue tests on butt welded joints of austenitic stainless steel treated by UIT. The results were compared with the fatigue lives of as-weld joints to investigate the effect of UIT on the fatigue lives of welded joints of austenitic stainless steel. The fatigue lives of butt welded joints treated by UIT were more than 1.5 times longer than those of as-weld joints. The following were considered as possible reasons for this improvement in fatigue life: change in residual stress near the weld toes, relaxation of stress concentration at the weld toes, and refinement of grains under the weld toes. The residual stress measured near the weld toes by using the X-ray diffraction method was transformed from tension to compression by the application of UIT. The stress concentration factors at the welded toes were reduced about 10% by the application of UIT.
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