Relevant bibliographies by topics / Cu / Journal articles
To see the other types of publications on this topic, follow the link: Cu.

Journal articles on the topic 'Cu'

Author: Grafiati
Published: 4 June 2021
Last updated: 4 May 2024

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the top 50 journal articles for your research on the topic 'Cu.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Browse journal articles on a wide variety of disciplines and organise your bibliography correctly.

1

Song, Inhyeop, Minjae Lee, Sungdong Kim, and Sarah Eunkyung Kim. "Development of Cu CMP process for Cu-to-Cu wafer stacking." Journal of the Microelectronics and Packaging Society 20, no. 4 (December 30, 2013): 81–85. http://dx.doi.org/10.6117/kmeps.2013.20.4.081.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Nakamura, Keishi, Yasunori Sakagami, and Shiomi Kikuchi. "Resistivity of Cu-Ni/Cu/Cu-Ni Multilayer Materials." Journal of the Japan Institute of Metals 71, no. 2 (2007): 270–74. http://dx.doi.org/10.2320/jinstmet.71.270.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Shuttleworth, I. G. "Investigation of the H–Cu and Cu–Cu bonds in hydrogenated Cu." Journal of Physics and Chemistry of Solids 74, no. 1 (January 2013): 128–34. http://dx.doi.org/10.1016/j.jpcs.2012.08.014.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Grigorenko, G. M., M. A. Poleshchuk, L. I. Adeeva, A. Yu Tunik, E. V. Zelenin, and S. N. Stepanyuk. "Peculiarities of structure of Cu–Cu, Ni–Cu and Steel–Cu joints produced by overlap friction stir welding method." Автоматическая сварка 2016, no. 6 (June 28, 2016): 82–87. http://dx.doi.org/10.15407/as2016.06.13.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Park, Jong-Myeong, Yeong-Rae Kim, Sung-Dong Kim, Jae-Won Kim, and Young-Bae Park. "Wet Etching Characteristics of Cu Surface for Cu-Cu Pattern Direct Bonds." Journal of the Microelectronics and Packaging Society 19, no. 1 (March 31, 2012): 39–45. http://dx.doi.org/10.6117/kmeps.2012.19.1.039.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Sommer, Ferdinand, Joachim Schott, and Bruno Predel. "Thermodynamic investigations of Cu-Dy, Cu-Er, Cu-Gd and Cu-La alloys." Journal of the Less Common Metals 125 (November 1986): 175–81. http://dx.doi.org/10.1016/0022-5088(86)90092-5.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Jhan, Jhih-Jhu, Kazutoshi Wataya, Hiroshi Nishikawa, and Chih-Ming Chen. "Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding." Journal of the Taiwan Institute of Chemical Engineers 132 (March 2022): 104127. http://dx.doi.org/10.1016/j.jtice.2021.10.027.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Gungor, A., K. Barmak, A. D. Rollett, C. Cabral, and J. M. E. Harper. "Texture and resistivity of dilute binary Cu(Al), Cu(In), Cu(Ti), Cu(Nb), Cu(Ir), and Cu(W) alloy thin films." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 20, no. 6 (2002): 2314. http://dx.doi.org/10.1116/1.1520549.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Shih, D. ‐Y, C. ‐A Chang, J. Paraszczak, S. Nunes, and J. Cataldo. "Thin‐film interdiffusions in Cu/Pd, Cu/Pt, Cu/Ni, Cu/NiB, Cu/Co, Cu/Cr, Cu/Ti, and Cu/TiN bilayer films: Correlations of sheet resistance with Rutherford backscattering spectrometries." Journal of Applied Physics 70, no. 6 (September 15, 1991): 3052–60. http://dx.doi.org/10.1063/1.349337.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Grigorenko, G. M., M. A. Poleshchuk, L. I. Adeeva, A. Yu Tunik, E. V. Zelenin, and S. N. Stepanyuk. "Peculiarities of structure of Cu–Cu, Ni–Cu and Steel–Cu joints produced by overlap friction stir welding method." Paton Welding Journal 2016, no. 6 (June 28, 2016): 75–80. http://dx.doi.org/10.15407/tpwj2016.06.13.

Full text
APA, Harvard, Vancouver, ISO, and other styles
11

Ekberg, J. O., M. C. Richardson, W. E. Behring, J. F. Seely, C. M. Brown, and U. Feldman. "Spectra and energy levels of Cu xxii, Cu xxiii, Cu xxiv, and Cu xxv." Journal of the Optical Society of America B 4, no. 3 (March 1, 1987): 420. http://dx.doi.org/10.1364/josab.4.000420.

Full text
APA, Harvard, Vancouver, ISO, and other styles
12

Wu, Lingmei, Jing Qian, Jiabing Yu, Haojie Guo, and Xianping Chen. "Optimal Cu paste thickness for large-area Cu-Cu joint." Materials Letters 291 (May 2021): 129533. http://dx.doi.org/10.1016/j.matlet.2021.129533.

Full text
APA, Harvard, Vancouver, ISO, and other styles
13

FURUYAMA, Daiki, Junta INOUE, Takuma NAKAGAWA, Koji TATSUMI, Sho NAKAGAWA, and Takuma KATASE. "Study for Cu-Cu Bonding Technology by Nanoporous Cu Structure." Journal of Smart Processing 11, no. 5 (September 10, 2022): 227–32. http://dx.doi.org/10.7791/jspmee.11.227.

Full text
APA, Harvard, Vancouver, ISO, and other styles
14

Yoshida, Makoto, Toshinori Muramatsu, Jia Fu Hong, and Hideo Nakae. "Solidification of Undercooled Cu, Cu-O and Cu-S Alloys." Journal of the Japan Institute of Metals 60, no. 11 (1996): 1095–100. http://dx.doi.org/10.2320/jinstmet1952.60.11_1095.

Full text
APA, Harvard, Vancouver, ISO, and other styles
15

Sakurada, Takafumi, Hideki Maekawa, and Toshio Yokokawa. "Cu(II)/Cu(I)/Cu Redox in Alkali Borate Melts." Materials Transactions, JIM 39, no. 7 (1998): 740–46. http://dx.doi.org/10.2320/matertrans1989.39.740.

Full text
APA, Harvard, Vancouver, ISO, and other styles
16

Egelhoff, W. F., and M. T. Kief. "Fe/Cu/Fe and Co/Cu/Co multilayers on Cu." IEEE Transactions on Magnetics 28, no. 5 (September 1992): 2742–44. http://dx.doi.org/10.1109/20.179614.

Full text
APA, Harvard, Vancouver, ISO, and other styles
17

Li, J. J., C. L. Cheng, T. L. Shi, J. H. Fan, X. Yu, S. Y. Cheng, G. L. Liao, and Z. R. Tang. "Surface effect induced Cu-Cu bonding by Cu nanosolder paste." Materials Letters 184 (December 2016): 193–96. http://dx.doi.org/10.1016/j.matlet.2016.08.085.

Full text
APA, Harvard, Vancouver, ISO, and other styles
18

Lin, Shih-kang, Cheng-liang Cho, and Hao-miao Chang. "Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples." Journal of Electronic Materials 43, no. 1 (September 4, 2013): 204–11. http://dx.doi.org/10.1007/s11664-013-2721-x.

Full text
APA, Harvard, Vancouver, ISO, and other styles
19

Cho, Byoung Jun, Jin Goo Park, Shohei Shima, and Satomi Hamada. "Characterization of Cu-BTA Organic Complexes on Cu during Cu CMP and Post Cu Cleaning." Solid State Phenomena 219 (September 2014): 205–8. http://dx.doi.org/10.4028/www.scientific.net/ssp.219.205.

Full text
Abstract:
Although copper have better electrical properties than aluminum such as low resistivity and high electro-migration resistivity, aluminum has been used as an interconnect material due to the difficulty in Cu dry etching. Since CMP process has been adapted to the semiconductor fabrication, Cu became the choice of materials for interconnection. However, copper CMP process introduces new defects on the surface such as slurry particle, organic residue, scratch and corrosion [1].
APA, Harvard, Vancouver, ISO, and other styles
20

Hedayati, Kambiz. "Structural and magnetic characterization of electrodeposited Ni–Cu/Cu and Fe–Ni–Cu/Cu multilayer." Applied Physics A 118, no. 3 (November 6, 2014): 975–79. http://dx.doi.org/10.1007/s00339-014-8851-z.

Full text
APA, Harvard, Vancouver, ISO, and other styles
21

Li, Junjie, Qi Liang, Tielin Shi, Ji Fan, Bo Gong, Chen Feng, Jinhu Fan, Guanglan Liao, and Zirong Tang. "Design of Cu nanoaggregates composed of ultra-small Cu nanoparticles for Cu-Cu thermocompression bonding." Journal of Alloys and Compounds 772 (January 2019): 793–800. http://dx.doi.org/10.1016/j.jallcom.2018.09.115.

Full text
APA, Harvard, Vancouver, ISO, and other styles
22

SEBO, P., P. SVEC, D. JANICKOVIC, and E. ILLEKOVA. "Influence of Sb and Cu in Sn-Sb-Cu alloys on wetting of Cu and Cu-solder-Cu joint strength." Metallic Materials 48, no. 6 (2010): 353–59. http://dx.doi.org/10.4149/km_2010_6_353.

Full text
APA, Harvard, Vancouver, ISO, and other styles
23

Chow, K. M., W. Y. Ng, and L. K. Yeung. "Interdiffusion of Cu substrate/electrodeposits for Cu/Co, Cu/Co-W, Cu/Co/Ni and Cu/Co-W/Ni systems." Surface and Coatings Technology 99, no. 1-2 (February 1998): 161–70. http://dx.doi.org/10.1016/s0257-8972(97)00524-0.

Full text
APA, Harvard, Vancouver, ISO, and other styles
24

Lee, Minjae, Sarah Eunkyung Kim, and Sungdong Kim. "Cu/SiO2CMP Process for Wafer Level Cu Bonding." Journal of the Microelectronics and Packaging Society 20, no. 2 (June 30, 2013): 47–51. http://dx.doi.org/10.6117/kmeps.2013.20.2.047.

Full text
APA, Harvard, Vancouver, ISO, and other styles
25

Hong, Junsung, Jung-Hoon Lee, You-Na Oh, Kwang-Jun Cho, Doh-Hyung Riu, Sung-Tag Oh, and Chang-Yong Hyun. "Direct Bonding of Cu/AlN using Cu-Cu2O Eutectic Liquid." Journal of Korean Powder Metallurgy Institute 20, no. 2 (April 28, 2013): 114–19. http://dx.doi.org/10.4150/kpmi.2013.20.2.114.

Full text
APA, Harvard, Vancouver, ISO, and other styles
26

Rebhan, B., G. Hesser, J. Duchoslav, V. Dragoi, M. Wimplinger, and K. Hingerl. "Low-Temperature Cu-Cu Wafer Bonding." ECS Transactions 50, no. 7 (March 15, 2013): 139–49. http://dx.doi.org/10.1149/05007.0139ecst.

Full text
APA, Harvard, Vancouver, ISO, and other styles
27

Ebbesen, Morten F., Dana Itskalov, Mischa Baier, and Laura Hartmann. "Cu Elimination from Cu-Coordinating Macromolecules." ACS Macro Letters 6, no. 4 (March 24, 2017): 399–403. http://dx.doi.org/10.1021/acsmacrolett.7b00124.

Full text
APA, Harvard, Vancouver, ISO, and other styles
28

Li, Y., M. Moldovan, D. P. Young, and E. J. Podlaha. "Electrodeposited Co–Cu/Cu multilayered microposts." Journal of Magnetism and Magnetic Materials 320, no. 23 (December 2008): 3282–87. http://dx.doi.org/10.1016/j.jmmm.2008.06.034.

Full text
APA, Harvard, Vancouver, ISO, and other styles
29

Tang, Ya-Sheng, Yao-Jen Chang, and Kuan-Neng Chen. "Wafer-level Cu–Cu bonding technology." Microelectronics Reliability 52, no. 2 (February 2012): 312–20. http://dx.doi.org/10.1016/j.microrel.2011.04.016.

Full text
APA, Harvard, Vancouver, ISO, and other styles
30

Robinson, I. K., K. L. Whiteaker, and D. A. Walko. "Cu island growth on Cu(110)." Physica B: Condensed Matter 221, no. 1-4 (April 1996): 70–76. http://dx.doi.org/10.1016/0921-4526(95)00907-8.

Full text
APA, Harvard, Vancouver, ISO, and other styles
31

Ernst, H. J., F. Fabre, and J. Lapujoulade. "Growth of Cu on Cu(100)." Surface Science 275, no. 1-2 (September 1992): L682—L684. http://dx.doi.org/10.1016/0039-6028(92)90641-i.

Full text
APA, Harvard, Vancouver, ISO, and other styles
32

Shin, Chanho, Sung Woo Ma, Jeong Hwan Lee, Ki Bum Kim, Minsuk Suh, Namseog Kim, and Young-Ho Kim. "Current-assisted direct Cu/Cu joining." Scripta Materialia 104 (July 2015): 21–24. http://dx.doi.org/10.1016/j.scriptamat.2015.03.016.

Full text
APA, Harvard, Vancouver, ISO, and other styles
33

Karimi, Majid, Tom Tomkowski, Gianfranco Vidali, and Ofer Biham. "Diffusion of Cu on Cu surfaces." Physical Review B 52, no. 7 (August 15, 1995): 5364–74. http://dx.doi.org/10.1103/physrevb.52.5364.

Full text
APA, Harvard, Vancouver, ISO, and other styles
34

Kusano, Kensuke Fujita, Masahito Uchikoshi, Kouji Mimura, and Minoru Isshiki. "Low-Temperature Oxidation of Cu(100), Cu(110) and Cu(111)." Oxidation of Metals 82, no. 3-4 (June 21, 2014): 181–93. http://dx.doi.org/10.1007/s11085-014-9486-3.

Full text
APA, Harvard, Vancouver, ISO, and other styles
35

Lefakis, H., and P. S. Ho. "Oxide characterization and behavior at CuCu and CuCuOx interfaces." Thin Solid Films 136, no. 2 (February 1986): L31—L34. http://dx.doi.org/10.1016/0040-6090(86)90291-9.

Full text
APA, Harvard, Vancouver, ISO, and other styles
36

Du, Li, Tielin Shi, Lei Su, Zirong Tang, and Guanglan Liao. "Hydrogen thermal reductive Cu nanowires in low temperature Cu–Cu bonding." Journal of Micromechanics and Microengineering 27, no. 7 (June 13, 2017): 075019. http://dx.doi.org/10.1088/1361-6439/aa74fb.

Full text
APA, Harvard, Vancouver, ISO, and other styles
37

Zhang, Xin, Jian-Kai Cheng, Ming-Jian Zhang, and Yuan-Gen Yao. "A new luminescent Cu(I) complex stabilized by Cu⋅⋅⋅Cu interactions." Inorganic Chemistry Communications 20 (June 2012): 101–4. http://dx.doi.org/10.1016/j.inoche.2012.02.027.

Full text
APA, Harvard, Vancouver, ISO, and other styles
38

TERAO, Hoshiaki, Hiroshi WADA, Hideaki KOBIKI, Hiroki OTA, and Naoyuki KANETAKE. "Thermal Properties of Cr-Cu Rolled and Cr-Cu/Cu Clad and Rolled Materials." Journal of the Japan Society for Technology of Plasticity 56, no. 652 (2015): 407–12. http://dx.doi.org/10.9773/sosei.56.407.

Full text
APA, Harvard, Vancouver, ISO, and other styles
39

Chikova, O. A., V. S. Tsepelev, and V. V. V’yukhin. "VISCOSITY OF HIGH-ENTROPY MELTS IN CU–SN–PB–BI–GA, CU–SN, CU–PB, CU–GA, AND CU–BI EQUIATOMIC COMPOSITIONS." Izvestiya Vuzov. Tsvetnaya Metallurgiya (Proceedings of Higher Schools. Nonferrous Metallurgy) 1, no. 2 (April 28, 2015): 9. http://dx.doi.org/10.17073/0021-3438-2015-2-9-13.

Full text
APA, Harvard, Vancouver, ISO, and other styles
40

Marques, V. M. F., C. Johnston, and P. S. Grant. "Microstructural evolution at Cu/Sn–Ag–Cu/Cu and Cu/Sn–Ag–Cu/Ni–Au ball grid array interfaces during thermal ageing." Journal of Alloys and Compounds 613 (November 2014): 387–94. http://dx.doi.org/10.1016/j.jallcom.2014.05.200.

Full text
APA, Harvard, Vancouver, ISO, and other styles
41

Lee, Mun-Ku, Chan-Ho Kim, Dong-Hun Shin, Byoung-Yun Jung, and In-Kee Paik. "Effects of Supplementary Copper Sources (Cu Sulfate, Cu-Methionine, Cu-Soy Proteinate) on the Performance Broiler Chickens." Korean Journal of Poultry Science 38, no. 2 (June 30, 2011): 121–28. http://dx.doi.org/10.5536/kjps.2011.38.2.121.

Full text
APA, Harvard, Vancouver, ISO, and other styles
42

Ohshima, Shigetoshi, Nobuo Tanaka, Shiro Kambe, and Katsuro Okuyama. "Relationship betweenTcand Cu Valence and Bond Lengths of Cu–Cu and Cu–O forBa2-xEu1+xCu3O7-yCompounds." Japanese Journal of Applied Physics 33, Part 1, No. 3A (March 15, 1994): 1314–19. http://dx.doi.org/10.1143/jjap.33.1314.

Full text
APA, Harvard, Vancouver, ISO, and other styles
43

Takeda, Hideki, Noriyuki Kataoka, Kazuaki Fukamichi, and Yutaka Shimada. "Giant Magnetoresistance in Bulk Cu-Rich Co-Cu, Co-Ni-Cu and Fe-Ni-Cu Granular Alloys." Japanese Journal of Applied Physics 33, Part 2, No. 1B (January 15, 1994): L102—L105. http://dx.doi.org/10.1143/jjap.33.l102.

Full text
APA, Harvard, Vancouver, ISO, and other styles
44

Ziegler, Micah S., K. V. Lakshmi, and T. Don Tilley. "Dicopper Cu(I)Cu(I) and Cu(I)Cu(II) Complexes in Copper-Catalyzed Azide–Alkyne Cycloaddition." Journal of the American Chemical Society 139, no. 15 (April 10, 2017): 5378–86. http://dx.doi.org/10.1021/jacs.6b13261.

Full text
APA, Harvard, Vancouver, ISO, and other styles
45

Charilaou, M., K. Lenz, and W. Kuch. "Spin-pumping-enhanced magnetic damping in ultrathin Cu(001)/Co/Cu and Cu(001)/Ni/Cu films." Journal of Magnetism and Magnetic Materials 322, no. 14 (July 2010): 2065–70. http://dx.doi.org/10.1016/j.jmmm.2010.01.035.

Full text
APA, Harvard, Vancouver, ISO, and other styles
46

Ma, Qiuchen, Yichen Cao, Wenwu Zhang, Weiwei Zhao, Hongtao Chen, Mingyu Li, Zhimin Liang, Yong Xiao, and Hongjun Ji. "Low energy ultrasonic welding for Cu-Cu joining accelerated via Cu nanoparticles." Journal of Materials Processing Technology 296 (October 2021): 117210. http://dx.doi.org/10.1016/j.jmatprotec.2021.117210.

Full text
APA, Harvard, Vancouver, ISO, and other styles
47

Kang, Y., T. Liu, T. Potnis, and M. K. Orlowski. "Composite Cu/VO and VO/Cu Nanofilaments in Cu/Ta2O5/Pt Devices." ECS Solid State Letters 2, no. 7 (May 7, 2013): Q54—Q57. http://dx.doi.org/10.1149/2.004307ssl.

Full text
APA, Harvard, Vancouver, ISO, and other styles
48

Chatterjee, Hirak, and Sujit Kumar Ghosh. "Solvent-Specific Controlled Oxidation of Cu Nanospheres to Cu@Cu2O@Cu Nanomatryushkas." Journal of Physical Chemistry C 123, no. 11 (March 7, 2019): 6888–97. http://dx.doi.org/10.1021/acs.jpcc.8b12444.

Full text
APA, Harvard, Vancouver, ISO, and other styles
49

Graedel, T. E., J. T. Plewes, J. P. Franey, G. W. Kammlott, and R. C. Stoffers. "Sulfidation under atmospheric conditions of Cu-Ni, Cu-Sn, and Cu-Zn binary and Cu-Ni-Sn and Cu-Ni-Zn ternary systems." Metallurgical Transactions A 16, no. 1 (January 1985): 275–84. http://dx.doi.org/10.1007/bf02815309.

Full text
APA, Harvard, Vancouver, ISO, and other styles
50

Graedel, T. E., J. T. Plewes, J. P. Franey, G. W. Kammlott, and R. C. Stoffers. "Sulfidation under atmospheric conditions of Cu-Ni, Cu-Sn, and Cu-Zn binary and Cu-Ni-Sn and Cu-Ni-Zn ternary systems." Metallurgical Transactions A 16, no. 2 (February 1985): 275–84. http://dx.doi.org/10.1007/bf02816054.

Full text
APA, Harvard, Vancouver, ISO, and other styles
You might also be interested in the bibliographies on the topic 'Cu' for other source types:
Dissertations / Theses Books
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography