Journal articles on the topic 'Cu'
Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles
Consult the top 50 journal articles for your research on the topic 'Cu.'
Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.
You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.
Browse journal articles on a wide variety of disciplines and organise your bibliography correctly.
Song, Inhyeop, Minjae Lee, Sungdong Kim, and Sarah Eunkyung Kim. "Development of Cu CMP process for Cu-to-Cu wafer stacking." Journal of the Microelectronics and Packaging Society 20, no. 4 (December 30, 2013): 81–85. http://dx.doi.org/10.6117/kmeps.2013.20.4.081.
Full textNakamura, Keishi, Yasunori Sakagami, and Shiomi Kikuchi. "Resistivity of Cu-Ni/Cu/Cu-Ni Multilayer Materials." Journal of the Japan Institute of Metals 71, no. 2 (2007): 270–74. http://dx.doi.org/10.2320/jinstmet.71.270.
Full textShuttleworth, I. G. "Investigation of the H–Cu and Cu–Cu bonds in hydrogenated Cu." Journal of Physics and Chemistry of Solids 74, no. 1 (January 2013): 128–34. http://dx.doi.org/10.1016/j.jpcs.2012.08.014.
Full textGrigorenko, G. M., M. A. Poleshchuk, L. I. Adeeva, A. Yu Tunik, E. V. Zelenin, and S. N. Stepanyuk. "Peculiarities of structure of Cu–Cu, Ni–Cu and Steel–Cu joints produced by overlap friction stir welding method." Автоматическая сварка 2016, no. 6 (June 28, 2016): 82–87. http://dx.doi.org/10.15407/as2016.06.13.
Full textPark, Jong-Myeong, Yeong-Rae Kim, Sung-Dong Kim, Jae-Won Kim, and Young-Bae Park. "Wet Etching Characteristics of Cu Surface for Cu-Cu Pattern Direct Bonds." Journal of the Microelectronics and Packaging Society 19, no. 1 (March 31, 2012): 39–45. http://dx.doi.org/10.6117/kmeps.2012.19.1.039.
Full textSommer, Ferdinand, Joachim Schott, and Bruno Predel. "Thermodynamic investigations of Cu-Dy, Cu-Er, Cu-Gd and Cu-La alloys." Journal of the Less Common Metals 125 (November 1986): 175–81. http://dx.doi.org/10.1016/0022-5088(86)90092-5.
Full textJhan, Jhih-Jhu, Kazutoshi Wataya, Hiroshi Nishikawa, and Chih-Ming Chen. "Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding." Journal of the Taiwan Institute of Chemical Engineers 132 (March 2022): 104127. http://dx.doi.org/10.1016/j.jtice.2021.10.027.
Full textGungor, A., K. Barmak, A. D. Rollett, C. Cabral, and J. M. E. Harper. "Texture and resistivity of dilute binary Cu(Al), Cu(In), Cu(Ti), Cu(Nb), Cu(Ir), and Cu(W) alloy thin films." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 20, no. 6 (2002): 2314. http://dx.doi.org/10.1116/1.1520549.
Full textShih, D. ‐Y, C. ‐A Chang, J. Paraszczak, S. Nunes, and J. Cataldo. "Thin‐film interdiffusions in Cu/Pd, Cu/Pt, Cu/Ni, Cu/NiB, Cu/Co, Cu/Cr, Cu/Ti, and Cu/TiN bilayer films: Correlations of sheet resistance with Rutherford backscattering spectrometries." Journal of Applied Physics 70, no. 6 (September 15, 1991): 3052–60. http://dx.doi.org/10.1063/1.349337.
Full textGrigorenko, G. M., M. A. Poleshchuk, L. I. Adeeva, A. Yu Tunik, E. V. Zelenin, and S. N. Stepanyuk. "Peculiarities of structure of Cu–Cu, Ni–Cu and Steel–Cu joints produced by overlap friction stir welding method." Paton Welding Journal 2016, no. 6 (June 28, 2016): 75–80. http://dx.doi.org/10.15407/tpwj2016.06.13.
Full textEkberg, J. O., M. C. Richardson, W. E. Behring, J. F. Seely, C. M. Brown, and U. Feldman. "Spectra and energy levels of Cu xxii, Cu xxiii, Cu xxiv, and Cu xxv." Journal of the Optical Society of America B 4, no. 3 (March 1, 1987): 420. http://dx.doi.org/10.1364/josab.4.000420.
Full textWu, Lingmei, Jing Qian, Jiabing Yu, Haojie Guo, and Xianping Chen. "Optimal Cu paste thickness for large-area Cu-Cu joint." Materials Letters 291 (May 2021): 129533. http://dx.doi.org/10.1016/j.matlet.2021.129533.
Full textFURUYAMA, Daiki, Junta INOUE, Takuma NAKAGAWA, Koji TATSUMI, Sho NAKAGAWA, and Takuma KATASE. "Study for Cu-Cu Bonding Technology by Nanoporous Cu Structure." Journal of Smart Processing 11, no. 5 (September 10, 2022): 227–32. http://dx.doi.org/10.7791/jspmee.11.227.
Full textYoshida, Makoto, Toshinori Muramatsu, Jia Fu Hong, and Hideo Nakae. "Solidification of Undercooled Cu, Cu-O and Cu-S Alloys." Journal of the Japan Institute of Metals 60, no. 11 (1996): 1095–100. http://dx.doi.org/10.2320/jinstmet1952.60.11_1095.
Full textSakurada, Takafumi, Hideki Maekawa, and Toshio Yokokawa. "Cu(II)/Cu(I)/Cu Redox in Alkali Borate Melts." Materials Transactions, JIM 39, no. 7 (1998): 740–46. http://dx.doi.org/10.2320/matertrans1989.39.740.
Full textEgelhoff, W. F., and M. T. Kief. "Fe/Cu/Fe and Co/Cu/Co multilayers on Cu." IEEE Transactions on Magnetics 28, no. 5 (September 1992): 2742–44. http://dx.doi.org/10.1109/20.179614.
Full textLi, J. J., C. L. Cheng, T. L. Shi, J. H. Fan, X. Yu, S. Y. Cheng, G. L. Liao, and Z. R. Tang. "Surface effect induced Cu-Cu bonding by Cu nanosolder paste." Materials Letters 184 (December 2016): 193–96. http://dx.doi.org/10.1016/j.matlet.2016.08.085.
Full textLin, Shih-kang, Cheng-liang Cho, and Hao-miao Chang. "Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples." Journal of Electronic Materials 43, no. 1 (September 4, 2013): 204–11. http://dx.doi.org/10.1007/s11664-013-2721-x.
Full textCho, Byoung Jun, Jin Goo Park, Shohei Shima, and Satomi Hamada. "Characterization of Cu-BTA Organic Complexes on Cu during Cu CMP and Post Cu Cleaning." Solid State Phenomena 219 (September 2014): 205–8. http://dx.doi.org/10.4028/www.scientific.net/ssp.219.205.
Full textHedayati, Kambiz. "Structural and magnetic characterization of electrodeposited Ni–Cu/Cu and Fe–Ni–Cu/Cu multilayer." Applied Physics A 118, no. 3 (November 6, 2014): 975–79. http://dx.doi.org/10.1007/s00339-014-8851-z.
Full textLi, Junjie, Qi Liang, Tielin Shi, Ji Fan, Bo Gong, Chen Feng, Jinhu Fan, Guanglan Liao, and Zirong Tang. "Design of Cu nanoaggregates composed of ultra-small Cu nanoparticles for Cu-Cu thermocompression bonding." Journal of Alloys and Compounds 772 (January 2019): 793–800. http://dx.doi.org/10.1016/j.jallcom.2018.09.115.
Full textSEBO, P., P. SVEC, D. JANICKOVIC, and E. ILLEKOVA. "Influence of Sb and Cu in Sn-Sb-Cu alloys on wetting of Cu and Cu-solder-Cu joint strength." Metallic Materials 48, no. 6 (2010): 353–59. http://dx.doi.org/10.4149/km_2010_6_353.
Full textChow, K. M., W. Y. Ng, and L. K. Yeung. "Interdiffusion of Cu substrate/electrodeposits for Cu/Co, Cu/Co-W, Cu/Co/Ni and Cu/Co-W/Ni systems." Surface and Coatings Technology 99, no. 1-2 (February 1998): 161–70. http://dx.doi.org/10.1016/s0257-8972(97)00524-0.
Full textLee, Minjae, Sarah Eunkyung Kim, and Sungdong Kim. "Cu/SiO2CMP Process for Wafer Level Cu Bonding." Journal of the Microelectronics and Packaging Society 20, no. 2 (June 30, 2013): 47–51. http://dx.doi.org/10.6117/kmeps.2013.20.2.047.
Full textHong, Junsung, Jung-Hoon Lee, You-Na Oh, Kwang-Jun Cho, Doh-Hyung Riu, Sung-Tag Oh, and Chang-Yong Hyun. "Direct Bonding of Cu/AlN using Cu-Cu2O Eutectic Liquid." Journal of Korean Powder Metallurgy Institute 20, no. 2 (April 28, 2013): 114–19. http://dx.doi.org/10.4150/kpmi.2013.20.2.114.
Full textRebhan, B., G. Hesser, J. Duchoslav, V. Dragoi, M. Wimplinger, and K. Hingerl. "Low-Temperature Cu-Cu Wafer Bonding." ECS Transactions 50, no. 7 (March 15, 2013): 139–49. http://dx.doi.org/10.1149/05007.0139ecst.
Full textEbbesen, Morten F., Dana Itskalov, Mischa Baier, and Laura Hartmann. "Cu Elimination from Cu-Coordinating Macromolecules." ACS Macro Letters 6, no. 4 (March 24, 2017): 399–403. http://dx.doi.org/10.1021/acsmacrolett.7b00124.
Full textLi, Y., M. Moldovan, D. P. Young, and E. J. Podlaha. "Electrodeposited Co–Cu/Cu multilayered microposts." Journal of Magnetism and Magnetic Materials 320, no. 23 (December 2008): 3282–87. http://dx.doi.org/10.1016/j.jmmm.2008.06.034.
Full textTang, Ya-Sheng, Yao-Jen Chang, and Kuan-Neng Chen. "Wafer-level Cu–Cu bonding technology." Microelectronics Reliability 52, no. 2 (February 2012): 312–20. http://dx.doi.org/10.1016/j.microrel.2011.04.016.
Full textRobinson, I. K., K. L. Whiteaker, and D. A. Walko. "Cu island growth on Cu(110)." Physica B: Condensed Matter 221, no. 1-4 (April 1996): 70–76. http://dx.doi.org/10.1016/0921-4526(95)00907-8.
Full textErnst, H. J., F. Fabre, and J. Lapujoulade. "Growth of Cu on Cu(100)." Surface Science 275, no. 1-2 (September 1992): L682—L684. http://dx.doi.org/10.1016/0039-6028(92)90641-i.
Full textShin, Chanho, Sung Woo Ma, Jeong Hwan Lee, Ki Bum Kim, Minsuk Suh, Namseog Kim, and Young-Ho Kim. "Current-assisted direct Cu/Cu joining." Scripta Materialia 104 (July 2015): 21–24. http://dx.doi.org/10.1016/j.scriptamat.2015.03.016.
Full textKarimi, Majid, Tom Tomkowski, Gianfranco Vidali, and Ofer Biham. "Diffusion of Cu on Cu surfaces." Physical Review B 52, no. 7 (August 15, 1995): 5364–74. http://dx.doi.org/10.1103/physrevb.52.5364.
Full textKusano, Kensuke Fujita, Masahito Uchikoshi, Kouji Mimura, and Minoru Isshiki. "Low-Temperature Oxidation of Cu(100), Cu(110) and Cu(111)." Oxidation of Metals 82, no. 3-4 (June 21, 2014): 181–93. http://dx.doi.org/10.1007/s11085-014-9486-3.
Full textLefakis, H., and P. S. Ho. "Oxide characterization and behavior at CuCu and CuCuOx interfaces." Thin Solid Films 136, no. 2 (February 1986): L31—L34. http://dx.doi.org/10.1016/0040-6090(86)90291-9.
Full textDu, Li, Tielin Shi, Lei Su, Zirong Tang, and Guanglan Liao. "Hydrogen thermal reductive Cu nanowires in low temperature Cu–Cu bonding." Journal of Micromechanics and Microengineering 27, no. 7 (June 13, 2017): 075019. http://dx.doi.org/10.1088/1361-6439/aa74fb.
Full textZhang, Xin, Jian-Kai Cheng, Ming-Jian Zhang, and Yuan-Gen Yao. "A new luminescent Cu(I) complex stabilized by Cu⋅⋅⋅Cu interactions." Inorganic Chemistry Communications 20 (June 2012): 101–4. http://dx.doi.org/10.1016/j.inoche.2012.02.027.
Full textTERAO, Hoshiaki, Hiroshi WADA, Hideaki KOBIKI, Hiroki OTA, and Naoyuki KANETAKE. "Thermal Properties of Cr-Cu Rolled and Cr-Cu/Cu Clad and Rolled Materials." Journal of the Japan Society for Technology of Plasticity 56, no. 652 (2015): 407–12. http://dx.doi.org/10.9773/sosei.56.407.
Full textChikova, O. A., V. S. Tsepelev, and V. V. V’yukhin. "VISCOSITY OF HIGH-ENTROPY MELTS IN CU–SN–PB–BI–GA, CU–SN, CU–PB, CU–GA, AND CU–BI EQUIATOMIC COMPOSITIONS." Izvestiya Vuzov. Tsvetnaya Metallurgiya (Proceedings of Higher Schools. Nonferrous Metallurgy) 1, no. 2 (April 28, 2015): 9. http://dx.doi.org/10.17073/0021-3438-2015-2-9-13.
Full textMarques, V. M. F., C. Johnston, and P. S. Grant. "Microstructural evolution at Cu/Sn–Ag–Cu/Cu and Cu/Sn–Ag–Cu/Ni–Au ball grid array interfaces during thermal ageing." Journal of Alloys and Compounds 613 (November 2014): 387–94. http://dx.doi.org/10.1016/j.jallcom.2014.05.200.
Full textLee, Mun-Ku, Chan-Ho Kim, Dong-Hun Shin, Byoung-Yun Jung, and In-Kee Paik. "Effects of Supplementary Copper Sources (Cu Sulfate, Cu-Methionine, Cu-Soy Proteinate) on the Performance Broiler Chickens." Korean Journal of Poultry Science 38, no. 2 (June 30, 2011): 121–28. http://dx.doi.org/10.5536/kjps.2011.38.2.121.
Full textOhshima, Shigetoshi, Nobuo Tanaka, Shiro Kambe, and Katsuro Okuyama. "Relationship betweenTcand Cu Valence and Bond Lengths of Cu–Cu and Cu–O forBa2-xEu1+xCu3O7-yCompounds." Japanese Journal of Applied Physics 33, Part 1, No. 3A (March 15, 1994): 1314–19. http://dx.doi.org/10.1143/jjap.33.1314.
Full textTakeda, Hideki, Noriyuki Kataoka, Kazuaki Fukamichi, and Yutaka Shimada. "Giant Magnetoresistance in Bulk Cu-Rich Co-Cu, Co-Ni-Cu and Fe-Ni-Cu Granular Alloys." Japanese Journal of Applied Physics 33, Part 2, No. 1B (January 15, 1994): L102—L105. http://dx.doi.org/10.1143/jjap.33.l102.
Full textZiegler, Micah S., K. V. Lakshmi, and T. Don Tilley. "Dicopper Cu(I)Cu(I) and Cu(I)Cu(II) Complexes in Copper-Catalyzed Azide–Alkyne Cycloaddition." Journal of the American Chemical Society 139, no. 15 (April 10, 2017): 5378–86. http://dx.doi.org/10.1021/jacs.6b13261.
Full textCharilaou, M., K. Lenz, and W. Kuch. "Spin-pumping-enhanced magnetic damping in ultrathin Cu(001)/Co/Cu and Cu(001)/Ni/Cu films." Journal of Magnetism and Magnetic Materials 322, no. 14 (July 2010): 2065–70. http://dx.doi.org/10.1016/j.jmmm.2010.01.035.
Full textMa, Qiuchen, Yichen Cao, Wenwu Zhang, Weiwei Zhao, Hongtao Chen, Mingyu Li, Zhimin Liang, Yong Xiao, and Hongjun Ji. "Low energy ultrasonic welding for Cu-Cu joining accelerated via Cu nanoparticles." Journal of Materials Processing Technology 296 (October 2021): 117210. http://dx.doi.org/10.1016/j.jmatprotec.2021.117210.
Full textKang, Y., T. Liu, T. Potnis, and M. K. Orlowski. "Composite Cu/VO and VO/Cu Nanofilaments in Cu/Ta2O5/Pt Devices." ECS Solid State Letters 2, no. 7 (May 7, 2013): Q54—Q57. http://dx.doi.org/10.1149/2.004307ssl.
Full textChatterjee, Hirak, and Sujit Kumar Ghosh. "Solvent-Specific Controlled Oxidation of Cu Nanospheres to Cu@Cu2O@Cu Nanomatryushkas." Journal of Physical Chemistry C 123, no. 11 (March 7, 2019): 6888–97. http://dx.doi.org/10.1021/acs.jpcc.8b12444.
Full textGraedel, T. E., J. T. Plewes, J. P. Franey, G. W. Kammlott, and R. C. Stoffers. "Sulfidation under atmospheric conditions of Cu-Ni, Cu-Sn, and Cu-Zn binary and Cu-Ni-Sn and Cu-Ni-Zn ternary systems." Metallurgical Transactions A 16, no. 1 (January 1985): 275–84. http://dx.doi.org/10.1007/bf02815309.
Full textGraedel, T. E., J. T. Plewes, J. P. Franey, G. W. Kammlott, and R. C. Stoffers. "Sulfidation under atmospheric conditions of Cu-Ni, Cu-Sn, and Cu-Zn binary and Cu-Ni-Sn and Cu-Ni-Zn ternary systems." Metallurgical Transactions A 16, no. 2 (February 1985): 275–84. http://dx.doi.org/10.1007/bf02816054.
Full text