Journal articles: 'Cu-Sn Alloy'

1

Watanabe, Hirohiko, Marie Nagai, Tsutomu Osawa, and Ikuo Shohji. "Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge Alloy." Key Engineering Materials 462-463 (January 2011): 70–75. http://dx.doi.org/10.4028/www.scientific.net/kem.462-463.70.

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Dissolution properties of Cu in molten Sn-Ag-Cu-Ni-Ge alloys have been investigated. In particular, the effect of the Ni content in the alloys on the dissolution properties has been examined. Moreover, the dissolution properties have been compared with those of Sn-Ag and Sn-Ag-Cu alloys. To investigate the dissolution rate of Cu in molten alloys, Cu wires were dipped in molten alloys heated at 250, 270 and 290°C. Dissolution thickness of Cu wire is proportional to dipping time regardless of alloy type. The dissolution rates of Cu follow the order Sn-Ag > Sn-Ag-Cu > Sn-Ag-Cu-Ni-Ge. In Sn-Ag-Cu-Ni-Ge alloys, the dissolution rate of Cu decreases with increasing the Ni content. In cases of Sn-Ag and Sn-Ag-Cu alloys, a thin Cu-Sn compounds layer forms at the interface between Cu and the alloy and dissolution of Cu does not proceed uniformly. On the contrary, a thick reaction layer, which consists of granular Cu-Ni-Sn compounds, forms at the interface between Cu and the Sn-Ag-Cu-Ni-Ge alloy. Since the reaction layer inhibits dissolution of Cu in molten alloy, the dissolution rate slows down and dissolution of Cu proceeds uniformly in the Sn-Ag-Cu-Ni-Ge alloys.

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Kaneko, Daisuke, Mahoto Takeda, Takanari Nakajima, and Naokuni Muramatsu. "The Influence of Alloy Composition and Heat-Treatments on the Shape Memory Properties in a Cu-Sn-X Alloy." Materials Science Forum 941 (December 2018): 1282–87. http://dx.doi.org/10.4028/www.scientific.net/msf.941.1282.

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We have focused on shape-memory properties of Cu-Sn based ternary alloys in this study. We have attempted to suppress degradation at room temperature aging and to improve the amount of shape recovery by adding the third element to a binary Cu-Sn alloy. The attempt has successfully conducted in Cu-Sn-Mn alloy, the degradation due to aging at room temperature was suppressed and the thermal stability was improved. Furthermore, the present study revealed that Cu-Sn-Mn alloy exhibited a large super elastic recovery in three point bending tests. We have also investigated the shape-memory properties of Cu-Sn-Si alloys and revealed that the ternary alloy has achieved super-elastic recovery better than the Cu-Sn-Mn alloy in the three-point bending tests.

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3

Yamauchi, Akira, Kenta Ida, Masahito Fukuda, and Takuma Yamaguchi. "Tensile Properties of Sn-Bi Lead-Free Solder Alloys." Solid State Phenomena 273 (April 2018): 72–76. http://dx.doi.org/10.4028/www.scientific.net/ssp.273.72.

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The Influence of alloy composition on tensile properties of Sn-Bi, Sn-Bi-Cu and Sn-Bi-Ni lead-free solder alloys were investigated. It is found that the elongation of Sn-Bi alloys depend on Bi content, and Sn-40wt% Bi alloy has the highest elongation. The addition of Cu and Ni improves the ductility of Sn 35-45wt% Bi alloys. The fine microstructure of Sn-Bi-Cu or Ni alloys have an effect on the ductility of Sn-Bi based alloys. The elongation increases with decreasing strain rate and increasing temperature. Cu and Ni added to Sn-Bi alloy showed the super plasticity behavior at low strain rate and high temperature (more than 333 K). Moreover, strain rate sensitivity ‘m’ increases with temperature.

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Kong, Zhi Gang, and Feng Min Shi. "Effect of Ag on the Sn-Cu Lead-Free Material." Applied Mechanics and Materials 687-691 (November 2014): 4291–94. http://dx.doi.org/10.4028/www.scientific.net/amm.687-691.4291.

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With the increasing focus on developing environmentally benign electronic packages, Pb-free alloys have received a great deal of attention. Among the lead-free solder materials, Sn–Ag–Cu alloy has advantages of good wetting property, superior interfacial properties, high creep resistance and low coarsening rate. In this article, the organization and mechanical performance of Sn-Ag-Cu Material are investigated. Series of inspections and analytical research methods are introduced. Experimental results show that Sn-Cu solder organization contains a large number of Cu6Sn5graphic, while Sn-Ag-Cu graphic is IMC Ag3Sn graphic. The mechanical propersity of Sn-Ag-Cu alloy is better than the Sn-Cu alloy. Fracture surfaces of the Sn-Ag3.0-Cu0.5 alloys specimen have many small size and homogeneously distributed dimples.

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5

Somidin, Flora, Stuart D. McDonald, and Kazuhiro Nogita. "Formation of Cu₆Sn₅/(Cu, Ni)₆Sn₅ Intermetallic Compounds between Cu₃Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding." Solid State Phenomena 273 (April 2018): 14–19. http://dx.doi.org/10.4028/www.scientific.net/ssp.273.14.

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This paper presents the use of the transient liquid phase concept to grow the high temperature Cu6Sn5intermetallic compound between Cu3Sn-rich powdered alloys and molten Sn. In this study, high temperature powdered alloys containing high fractions of Cu3Sn were fabricated from a chill-cast Sn-60 wt.%Cu alloy. A ternary alloy with composition of Sn-59 wt.%Cu-1 wt.%Ni was also prepared to investigate the effect of Ni. The reaction products were obtained at 250°C over a period of 30 minutes. The results provide new insight into the mechanism of the interfacial reaction between liquid Sn and solid Cu3Sn-rich alloy with and without Ni additions.

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Alam, S. N., N. Jindal, and N. Naithani. "Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy." Materials Science-Poland 37, no. 2 (June 1, 2019): 212–24. http://dx.doi.org/10.2478/msp-2019-0032.

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AbstractThe present work reports the effect of Cu addition on the melting point, hardness and electrical resistivity of Sn-57 wt.% Bi eutectic solder alloy. Both binary eutectic Sn-57 wt.% Bi and ternary Sn-(57-x)Bi-xCu (x = 0.1, 0.3, 0.5, 0.7 and 1 wt.%) alloys containing various amounts of Cu were developed by melting casting route. The microstructure of the various solder alloys was analyzed using an optical microscope and a SEM. The variation in melting point, hardness and electrical resistivity of the Sn-Bi eutectic solder alloys with the addition of Cu was determined. The melting point of the eutectic Sn-Bi solder alloy was found to decrease up to the addition of 0.7 wt.% Cu. However, further addition of Cu led to an increase in the melting point of the alloy. Addition of Cu led to an increase in the hardness of the eutectic Sn-Bi solder alloy whereas the electrical resistivity of this alloy was found to increase up to the addition of 0.7 wt.% of Cu beyond which a decrease in the electrical resistivity was observed. A change in the microstructure of the solder alloy was observed when it was reheated above the melting temperature.

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7

Chen, Yan, Hong Hua Su, Yu Can Fu, and Z. C. Guo. "Investigation of Interface Microstructure of Diamond and Ti Coated Diamond Brazed with Cu-Sn-Ti Alloy." Key Engineering Materials 487 (July 2011): 199–203. http://dx.doi.org/10.4028/www.scientific.net/kem.487.199.

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Cu-Sn-Ti brazing alloys are gaining importance as active brazing alloys for brazing diamond tools. The microstructure at the interface between diamond or Ti-coated diamond grits and Cu-Sn-Ti brazing alloy and bonding strength have been investigated in this paper. The results show that TiC layer forms between diamond and alloy matrix during the brazing process and Sn- and Ti-based intermetallic phase forms between TiC and the bonding matrix. And compound SnTi3forms between the Ti-coated diamond grits and Cu-Sn-Ti brazing alloy. Furthermore, the bonding strength between Ti-coated diamond grits and brazing alloy is higher than that between diamond grits and brazing alloy.

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8

Pi, Zhao Hui, Guang Qiang Li, Yan Ping Xiao, Zhan Zhang, Zhuo Zhao, and Yong Xiang Yang. "An Experimental Investigation on the Solubility of Zr in Cu-Sn Alloys." Advanced Materials Research 887-888 (February 2014): 324–28. http://dx.doi.org/10.4028/www.scientific.net/amr.887-888.324.

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An experimental investigation on the solubility of Zr in Cu-Sn alloy was conducted in a resistance furnace. The solubility of Zr in Cu-Sn alloy was determined by investigating the influence of different conditions such as the ratio of Cu-Sn alloy and temperature. The solubility of Zr in Cu-Sn alloy changes with the proportion of Cu and Sn, and it increases with the increasing of Cu content. The experimental temperature has a significant effect on the solubility of Zr in Cu-Sn alloy. The maximum solubility of Zr in Cu-Sn alloy is 6.2 mass % at 900 °C with the mass ratio of Cu : Sn = 8:2.

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9

Yavuzer, B., D. Özyürek, and T. Tunçay. "Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys." Materials Science-Poland 38, no. 1 (March 1, 2020): 34–40. http://dx.doi.org/10.2478/msp-2020-0025.

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AbstractThis study investigates microstructures and mechanical properties of the alloys obtained by adding Cu (0.7 % and 0.9 %) and Al (0.7 % and 0.9 %) to lead-free Sn-9Zn eutectic soldering alloy produced by investment casting method. The results show that Cu5Zn8 phase has formed in the structure of Cu added alloys and the Al2O3 phase has formed due to addition of Al. It was found that small and round-shaped Al2O3 phase increased the tensile strength of the new alloy compared to the eutectic alloy. In addition, it was observed that the microhardness of Cu added alloys was lower than that of Sn-9Zn eutectic alloy, but the microhardness of alloys containing Al was higher compared to the other eutectic Sn-9Zn alloy.

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10

Han, Duy Le, Yu-An Shen, Fupeng Huo, and Hiroshi Nishikawa. "Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints." Metals 12, no. 1 (December 24, 2021): 33. http://dx.doi.org/10.3390/met12010033.

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The low melting temperature In-48Sn alloy is a promising candidate for flexible devices. However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid diffusion of Cu into the In-rich alloy. In this study, the effect of the addition of xCu (x = 2.0 and 8.0 wt.%) on wettability, interfacial reaction, and mechanical strength of the In-Sn-xCu/Cu joint is analyzed. The results demonstrate that both the In-48Sn and In-Sn-xCu alloys exhibit good wettability on the Cu substrate and that the contact angle increases with an increase in the Cu content. Furthermore, fine grains are observed in the alloy matrix of the In-Sn-xCu/Cu joint and the interfacial intermetallic compound (IMC) comprising the Cu-rich Cu6(In,Sn)5 near the Cu substrate and the Cu-deficient Cu(In,Sn)2 near the solder side. The In-Sn-2.0Cu/Cu joint with fine microstructure and a small amount of IMC in the alloy matrix shows the highest average shear strength of 16.5 MPa. Although the In-Sn-8.0Cu/Cu joint also exhibits fine grains, the presence of large number of voids and rough interfacial IMC layer causes the formation of additional stress concentration points, thereby reducing the average shear strength of the joint.

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11

Hirunyagird, Jirutthitikalpongsri, Gobboon Lothongkum, and Ekasit Nisaratanaporn. "An Improvement in Tarnish and Corrosion Resistance of 94Ag-4Zn-Cu Alloys with Sn Addition." Advanced Materials Research 894 (February 2014): 138–42. http://dx.doi.org/10.4028/www.scientific.net/amr.894.138.

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The tarnish and corrosion resistance of 94Ag-4Zn-Cu-Sn alloys and Ag-5.89Sn alloy compared with Ag-5.95Cu alloy were investigated. The tarnish results show that the DE* value of Ag-5.95Cu alloy is higher than those of 94Ag-4Zn-Cu-Sn alloys and Ag-5.89Sn alloy due to the sulfide formations such as Ag2S, Cu2S and CuS. The DE* value significantly decreases with increasing tin content. This is attributed to the matrix enrichment of tin which protects the sulfur reaction on surface. From corrosion test results, 94Ag-4Zn-Cu-Sn alloys and Ag-5.89Sn alloy provide the noble shift in the corrosion potentials and pitting potentials but the negative shift in the corrosion current density compared with Ag-5.95Cu alloy. Corrosion rate of 94Ag-4Zn-Cu-Sn alloys and Ag-5.89Sn alloy decrease markedly compared with Ag-5.95Cu alloy because it depends on the alloying elements and the microstructural changes. Due to high solubility of zinc and tin, the microstructures of tin-rich alloys consist of the higher portion of single phase and less eutectic structure than that of Ag-5.95Cu alloy.

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12

Ye, Bora, and Sunjung Kim. "Formation of Nanocrystalline Surface of Cu–Sn Alloy Foam Electrochemically Produced for Li-Ion Battery Electrode." Journal of Nanoscience and Nanotechnology 15, no. 10 (October 1, 2015): 8217–21. http://dx.doi.org/10.1166/jnn.2015.11434.

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Cu–Sn alloy foam is a promising electrode material for Li-ion batteries. In this study, Cu–Sn alloy foam was produced by diffusion-limited electrodeposition in alkaline electrolyte using polyurethane (PU) foam template. Our major concern is to form Cu–Sn alloy foam with nanocrystalline surface morphology by adjusting electrodeposition conditions such as deposition potential and metal ion concentration. Cu–Sn alloy layers comprising of nanoclusters such as nanospheres, nanoellipsoids, and nanoflakes were created depending on electrodeposition conditions. Larger surface area of nanocluster-interconnected Cu–Sn alloy layer was created when both Sn concentration and negative deposition potential were higher. After decomposing PU template thermally, Cu–Sn alloy foam of Cu, Cu6Sn5, and Cu3Sn phases was finally produced.

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13

Qiu, Jialong, Yanzhi Peng, Peng Gao, and Caiju Li. "Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model." Materials 14, no. 9 (April 30, 2021): 2335. http://dx.doi.org/10.3390/ma14092335.

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The mechanical properties of solder alloys are a performance that cannot be ignored in the field of electronic packaging. In the present study, novel Sn-Zn solder alloys were designed by the cluster-plus-glue-atom (CPGA) model. The effect of copper (Cu) addition on the microstructure, tensile properties, wettability, interfacial characterization and melting behavior of the Sn-Zn-Cu solder alloys were investigated. The Sn29Zn4.6Cu0.4 solder alloy exhibited a fine microstructure, but the excessive substitution of the Cu atoms in the CPGA model resulted in extremely coarse intermetallic compound (IMC). The tensile tests revealed that with the increase in Cu content, the tensile strength of the solder alloy first increased and then slightly decreased, while its elongation increased slightly first and then decreased slightly. The tensile strength of the Sn29Zn4.6Cu0.4 solder alloy reached 95.3 MPa, which was 57% higher than the plain Sn-Zn solder alloy, which is attributed to the fine microstructure and second phase strengthening. The spreadability property analysis indicated that the wettability of the Sn-Zn-Cu solder alloys firstly increased and then decreased with the increase in Cu content. The spreading area of the Sn29Zn0.6Cu0.4 solder alloy was increased by 27.8% compared to that of the plain Sn-Zn solder due to Cu consuming excessive free state Zn. With the increase in Cu content, the thickness of the IMC layer decreased owing to Cu diminishing the diffusion force of Zn element to the interface.

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14

Haga, Toshio. "Casting of Clad Strip Consisting of Al-Sn Alloy and Pure Aluminum." Materials Science Forum 1007 (August 2020): 23–28. http://dx.doi.org/10.4028/www.scientific.net/msf.1007.23.

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Casting of clad strip consisting of Al-40%Sn-1%Cu alloy and 1050 pure aluminum from molten metals was attempted using an unequal diameter twin-roll caster equipped with a scraper. The liquidus line and solidus line of the Al-40% Sn-1% Cu alloy are 620 °C and 220 °C, respectively. The liquidus line and solidus line of the 1050 are 657 °C and 646 °C, respectively. Therefore, solidification temperatures of the two aluminum alloys are much different. When an Al-40%Sn-1%Cu solidification layer was bonded to a solidification layer of the 1050 alloy, the temperature of the 1050 solidification layer surface was higher than the solidus line of Al-40% Sn-1% Cu. However, the Al-40% Sn-1% Cu alloy could be bonded to the 1050 strip and a two-layer clad strip could be cast. The interface between the two strips was very clear. Electron Probe Microanalysis (EPMA) indicated that Sn in the Al-40% Sn-1% Cu alloy did not diffuse into the 1050 alloy. Tensile shear tests were conducted using the as cast clad strip, and no breakage occurred at the interface between the strips but only in the Al-40% Sn-1% Cu layer. This result confirmed that the two strips were strongly bonded at the interface.

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15

Zhang, Guodong, Junsheng Zhao, Pengfei Wang, Xiaoyu Li, Yudong Liu, and Xinyue Fu. "Molecular Dynamics Study on Mechanical Properties of Nanopolycrystalline Cu–Sn Alloy." Materials 14, no. 24 (December 16, 2021): 7782. http://dx.doi.org/10.3390/ma14247782.

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Molecular dynamics simulation is one kinds of important methods to research the nanocrystalline materials which is difficult to be studied through experimental characterization. In order to study the effects of Sn content and strain rate on the mechanical properties of nanopolycrystalline Cu–Sn alloy, the tensile simulation of nanopolycrystalline Cu–Sn alloy was carried out by molecular dynamics in the present study. The results demonstrate that the addition of Sn reduces the ductility of Cu–Sn alloy. However, the elastic modulus and tensile strength of Cu–Sn alloy are improved with increasing the Sn content initially, but they will be reduced when the Sn content exceeds 4% and 8%, respectively. Then, strain rate ranges from 1 × 109 s−1 to 5 × 109 s−1 were applied to the Cu–7Sn alloy, the results show that the strain rate influence elastic modulus of nanopolycrystalline Cu–7Sn alloy weakly, but the tensile strength and ductility enhance obviously with increasing the strain rate. Finally, the microstructure evolution of nanopolycrystalline Cu–Sn alloy during the whole tensile process was studied. It is found that the dislocation density in the Cu–Sn alloy reduces with increasing the Sn content. However, high strain rate leads to stacking faults more easily to generate and high dislocation density in the Cu–7Sn alloy.

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Ventura, Tina, Young Hee Cho, and Arne K. Dahle. "Solidification Mechanisms in the Sn-Cu-Ni Lead-Free Solder System." Materials Science Forum 654-656 (June 2010): 1381–84. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.1381.

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Pb-free solders based on near-eutectic Sn-0.7Cu-xNi alloys provide excellent solderability during wave soldering with cost advantages compared to Ag-containing alternatives. However, there is only limited knowledge of the solidification mechanisms in this alloy system and, furthermore, the ternary Sn-Cu-Ni phase diagram is not yet fully established. In this study, unidirectional solidification has been conducted in a Bridgman furnace using both binary alloys from the Sn-Cu6Sn5 system and ternary Sn-rich Sn-Cu-Ni alloys. The influence of Ni additions on the solidification mechanisms is assessed by comparing the microstructures of the ternary and binary alloys. The results are used to discuss the contrasting Sn-Cu-Ni phase diagrams reported in the literature. The results demonstrate the complex phase relations in the Sn-Cu alloy system, and the important role of trace amounts of various solute elements.

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Tsurusaki, Tatsuya, and Takeshi Ohgai. "Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films." Materials 13, no. 6 (March 14, 2020): 1330. http://dx.doi.org/10.3390/ma13061330.

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Enforced solid solution type Sn-Zn alloy films were electrochemically synthesized on Cu substrate from an aqueous solution containing citric acid complexes. The electrodeposition behavior of Sn-Zn alloys was classified to a normal co-deposition type, in which electrochemically nobler Sn deposits preferentially compared to Zn. Electrodeposited Sn-Zn alloy films were composed of a non-equilibrium phase, like an enforced solid solution, which was not observed in an equilibrium phase diagram of an Sn-Zn binary alloy system. By applying a thermal annealing process at 150 °C for 10 minutes, a pure Zn phase was precipitated from an electrodeposited Sn-based solid solution phase with excessively dissolved Zn atoms. During the soldering process, intermetallic phases such as Cu3Sn and Cu5Zn8 were formed at the interface between an Sn-Zn alloy and Cu substrate. Tensile strength and fracture elongation of solder-jointed Cu rods with Sn-8 at.%Zn alloy films reached ca. 40 MPa and 12%, respectively.

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18

Chen, Guohai, Ju Sheng Ma, and Zhi Ting Geng. "Fabrication and Properties of Lead-Free Sn-Ag-Cu-Ga Solder Alloy." Materials Science Forum 475-479 (January 2005): 1747–50. http://dx.doi.org/10.4028/www.scientific.net/msf.475-479.1747.

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Sn-Pb solder alloys, widely used in electronic industry, will be restricted because of the toxicity of Pb. That is paramount importance that developing viable alternative lead-free solders for electronic assemblies. Sn-Ag-Cu alloys are better alternative because of its good performance. But they have a melting temperature of 217-225°C that is much higher than that of Sn-Pb eutectic alloy, 183°C. It may be very difficulty to realize industrialization. Sn-Ag-Cu-Ga solder alloys have been studied in this paper, including a series of properties tests, such as melting point, hardness, shear strength and solderability. The best composition of Sn-Ag-Cu-Ga lead-free solder alloy has been obtained.

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19

Ma, Li, Qiang Hu, and Yan Bin Sun. "Effect of Cu on the Electrochemical Corrosion Behavior of Sn-8Zn-3Bi Lead-Free Solder Alloy." Advanced Materials Research 1095 (March 2015): 95–98. http://dx.doi.org/10.4028/www.scientific.net/amr.1095.95.

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The electrochemical corrosion behavior of the Sn-8Zn-3Bi-xCu lead-free solder in 3.5%NaCl solution was studied to reveal effect of Cu addition on the corrosion resistance of Sn-8Zn-3Bi solder alloy. The results showed that adding Cu element increased the corrosion potential of Sn-8Zn-3Bi-xCu solder alloysThe corrosion resistance of Sn-8Zn-3Bi-xCu solder alloys was improved correspondingly. The corrousion product of Sn-8Zn-3Bi-xCu alloy was mainly zinc oxide. More corrosion products were observed with the increse of Cu content.

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20

Lima, Thiago, Guilherme de Gouveia, Rudimylla da Silva Septimio, Clarissa da Cruz, Bismarck Silva, Crystopher Brito, José Spinelli, and Noé Cheung. "Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses." Metals 9, no. 2 (February 17, 2019): 241. http://dx.doi.org/10.3390/met9020241.

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In this study, experiments were conducted to analyze the effect of 0.05 and 0.1 wt.% Al additions during the unsteady-state growth of the Sn-0.5wt.%Cu solder alloy. Various as-solidified specimens of each alloy were selected so that tensile tests could also be performed. Microstructural aspects such as the dimensions of primary, λ1, and secondary, λ2, dendritic arrays, and intermetallic compounds (IMCs) morphologies were comparatively assessed for the three tested compositions, that is, Sn-0.5wt.%Cu, Sn-0.5wt.%Cu-0.05wt.%Al, and Sn-0.5wt.%Cu-0.1wt.%Al alloys. Al addition affected neither the primary dendritic spacing nor the types of morphologies identified for the Cu6Sn5 IMC, which was found to be either globular or fibrous regardless of the alloy considered. Secondary dendrite arm spacing was found to be enlarged and the eutectic fraction was reduced with an increase in the Al-content. Tensile properties remained unaffected with the addition of Al, except for the improvement in ductility of up to 40% when compared to the Sn-0.5wt.%Cu alloy without Al trace. A smaller λ2 in size was demonstrated to be the prime microstructure parameter associated with the beneficial effect on the strength of the Sn-0.5wt.%Cu(-x)Al alloys.

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Nakamura, Toshihiro, Tomio Nagayama, Takayo Yamamoto, Yasushi Mizutani, and Hidemi Nawafune. "Electrodeposition of CuSn Alloy from Noncyanide Sulfosuccinate Bath." Materials Science Forum 654-656 (June 2010): 1912–15. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.1912.

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Recently the regulation of nickel usage because of allergy issues has been strengthened in Europe and other countries. The Cu-Sn alloy (40-55 mass%Sn) is called “speculum alloy” or “white bronze” and has a silvery-white appearance. We developed a noncyanide Cu-Sn alloy plating bath consisting of sulfosuccinic acid, L-methionine and polyoxyethylene-α-naphthol, from which silvery-white Cu-Sn alloy (40-55mass%Sn) were obtained. It is anticipated that the Cu-Sn alloy films will be used as an alternative to nickel undercoating for decorative gold or chromium electroplating.

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Chen, Fang, Yun Fei Du, Rong Chang Zeng, Gui Sheng Gan, and Chang Hua Du. "Thermodynamics of Oxidation on Pb-Free Solders at Elevated Temperature." Materials Science Forum 610-613 (January 2009): 526–30. http://dx.doi.org/10.4028/www.scientific.net/msf.610-613.526.

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Based on the available thermodynamic and phase equilibria data, the thermodynamic criteria for oxidation in tin-based lead-free solders under soldering condition was deduced. The dependence of Gibbs free energy on temperature in Pb-free solder oxidation reaction was calculated by applying MATLAB program. The characteristics of oxidation reaction of a varity of solder alloy systems such as Sn-Ag, Sn-Cu, Sn-Sb, Sn-Zn, Sn-Ag-Cu and Sn-Pb eutectic alloys at elevated temperature were analyzed. The results suggested that zinc preferentially oxidized in Sn-Zn solder alloys in the elevated temperature state, while tin preferentially oxidized in the other alloys. The oxidation potential of the Sn-Zn eutectic alloys was higher than that of the pure tin at elevated temperature, whereas the oxidation potentials of Sn-Ag, Sn-Cu, Sn-Sb and Sn-Ag-Cu eutectic alloys were approxiately equal to that of the pure tin. All tin-based Pb-free solder alloys more easily oxidized than the Sn-Pb solder alloys. Oxidizability of these alloys followed in a decreasing order: Sn-Zn＞Sn-Sb＞Sn-Cu＞Sn-Ag＞Sn-Ag-Cu＞Sn-Pb.

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23

Hatta, Takeshi, Atsushi Ishikawa, Takuma Katase, and Akihiro Masuda. "Development of Lead Free Plating Chemical for Various Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 000944–67. http://dx.doi.org/10.4071/2012dpc-tp22.

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Flip chip connection has been applied to a lot of applications to shorten the connection length for high performance. Solder bumping is one of the key technologies for flip chip connection, and its quality strongly brings large impact on the reliability after packaging. Electroplating is one of the methods to form solder bumps. And Sn-Ag is considered as the first candidate of lead free alloy for electroplating method. We have released Sn-Ag plating chemical and it has been used by many customers in the world. In the future, flip chip technology will progress to further miniaturization and high integration with the new technologies such as Cu pillar and Through Silicon Via (TSV). At that time, further variations of alloys are necessary for electroplating method to meet various requirements. Even for Sn-Ag plating chemical, higher plating rate is required to improve productivity in mass production. In this time, we have developed new Sn-Ag high speed plating chemical based on our conventional technology. Furthermore, we have succeeded to develop Pure Sn and Sn-Cu chemicals for bumping method to meet customer's requirement. Sn-Cu is considered as a good candidate for bumping alloy to achieve high reliability, but the chemical stability is not so good. Therefore, we successfully modified the Sn-Cu chemical and extended chemical stability. We will update our current status about high speed Sn-Ag plating chemical and other chemicals like Sn-Cu and pure Sn in this time. By using these binary alloy chemicals, we are able to produce Sn-Ag-Cu solder bumps by stacking Sn-Ag and Sn-Cu. And it can bring further variation for bumping alloys.

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Nishikawa, Hiroshi, Yuki Hirata, Chih-han Yang, and Shih-kang Lin. "Effect of Low Bi Content on Reliability of Sn-Bi Alloy Joints Before and After Thermal Aging." JOM 74, no. 4 (February 1, 2022): 1751–59. http://dx.doi.org/10.1007/s11837-021-05146-3.

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AbstractSn-58Bi, an eutectic alloy, has been explored for use as a low-temperature lead-free solder alloy. However, the properties of Sn-Bi alloys as well as those of their joints need to be improved significantly so that these alloys can be applicable for practical use. In particular, two drawbacks need to be addressed: the intrinsic brittleness of Bi and the microstructure coarsening of these alloys during aging. In this study, Sn-Bi-Zn (SBZ) and SBZ-In (SBZI) alloys with low Bi contents were examined to elucidate the effects of the addition of Zn and In to the Sn-45Bi alloy on the interface and shear strengths of Cu/Cu joints before and after aging. In the case of the SBZ/Cu and SBZI/Cu joints, Bi coarsening was not observed either near or at the interfaces of the Cu/Cu joints. The shear strengths of the SBZ and SBZI joints remained unchanged after aging for 1008 h, suggesting that the SBZI alloy demonstrated the highest long-term reliability among all the joints examined.

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Melcioiu, Georgiana, Viorel Aurel Şerban, Mark Ashworth, Cosmin Codrean, Marin Liţă, and Geoffrey D. Wilcox. "An Evaluation of Sn-Cu-Ga and Sn-Cu-Ag Solder Alloys for Applications within the Electronics Industry." Solid State Phenomena 216 (August 2014): 91–96. http://dx.doi.org/10.4028/www.scientific.net/ssp.216.91.

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Components soldered with Sn-based alloys are susceptible to the growth of whiskers. Tin whiskers have been proven to be responsible for equipment failures in a wide range of industries. In order to reduce defects in electronic components a new solder alloy is proposed based on the Sn-Cu alloys. The Sn-Cu-Ga alloy utilised in this study was fabricated as a ribbons using melt-spinning method. These ribbons were then soldered onto electroplated tin layers. Preliminary characterization of the solder alloy is presented in this paper, including scanning electron microscopy, EDX mapping and X-ray diffraction. Key words: tin whiskers, PCB, printed circuit boards, melt spinning, solder, ribbons

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Nassef, Ahmed, and Medhat El-Hadek. "Microstructure and Mechanical Behavior of Hot Pressed Cu-Sn Powder Alloys." Advances in Materials Science and Engineering 2016 (2016): 1–10. http://dx.doi.org/10.1155/2016/9796169.

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Cu-Sn based alloy powders with additives of elemental Pb or C were densified by hot pressing technique. The influence of densifying on the properties of the hot pressed materials was investigated. The properties, such as the hardness, compressive strength, and wear resistance of these materials, were determined. The hot pressed Cu-Sn specimens included intermetallic/phases, which were homogeneously distributed. The presence of graphite improved the wear resistance of Cu-Sn alloys three times. Similarly, the presence of lead improved the densification parameter of Cu-Sn alloys three times. There was no significant difference in the mechanical behavior associated with the addition of Pb to the Cu-Sn alloys, although Cu-Pb alloys showed considerably higher ultimate strength and higher elongation. The Cu-Sn-C alloys had lower strength compared with those of Cu-Sn alloys. Evidence of severe melting spots was noticed in the higher magnifications of the compression fracture surface of 85% Cu-10% Sn-5% C and 80% Cu-10% Sn-10% Pb alloys. This was explained by the release of load at the final event of the fracture limited area.

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27

Xu, Gaolei, Yunqing Zhu, Lijun Peng, Haofeng Xie, Zengde Li, Shuhui Huang, Zhen Yang, Wenjing Zhang, and Xujun Mi. "Effect of Sn Addition on Microstructure, Aging Properties and Softening Resistance of Cu-Cr Alloy." Materials 15, no. 23 (November 27, 2022): 8441. http://dx.doi.org/10.3390/ma15238441.

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The relationship between microstructure evolution and properties of a Cu-Cr-Sn alloy during aging and high-temperature softening was investigated in detail in the present work. The results show that the addition of Sn refines obviously the size of the Cr phase and enhances the thermal stability of the alloy, which improves the peak-aged hardness of the Cu-Cr-Sn alloy reaching 139 HV after aging at 450 °C for 240 min. In addition, the recrystallization behavior of the Cu-Cr alloy with the 0.12 wt.% of Sn at high temperature is also significantly inhibited. Lots of precipitated Cr phases and a high density of dislocations are found in the Cu-Cr-Sn alloy annealed at high temperature, resulting in the softening temperature of the Cu-Cr-Sn alloy reaching 565 °C, which is higher than (about 50 °C) that of the Cu-Cr alloy.

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Madeni, J. C., and S. Liu. "Effect of thermal aging on the interfacial reactions of tin-based solder alloys and copper substrates and kinetics of formation and growth of intermetallic compounds." Soldagem & Inspeção 16, no. 1 (March 2011): 86–95. http://dx.doi.org/10.1590/s0104-92242011000100011.

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The formation and growth of intermetallic compounds at the interface between four solder alloys, Sn-3.5Ag, Sn-0.7Cu, Sn-3.2Ag0.8Cu and Sn-9Zn, and Cu-plated substrates have been studied. Thermal aging tests for 20, 100, 200, 500 hours at 70, 100 and 150 ºC were carried out. As expected, results indicate that the formation of the intermetallic layer is a diffusion-controlled process. Nevertheless, migration and dissolution of Cu into the solder was observed, especially at lower temperatures. The thickness of the layer of intermetallic compound increased with increasing aging temperature and time. The Sn-3.5Ag alloy showed the smallest intermetallic growth and the Sn-9Zn alloy the highest, compared to the other alloys. The results also show definite morphological differences between the Cu/Cu3Sn, the Cu3Sn/Cu6Sn5 and the Cu6Sn5/solder-matrix interfaces.

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Lee, Dae Hoon, Tae Suk Jang, J. H. Jung, S. S. Hong, E. S. Park, J. W. Lee, and B. K. Hahn. "Feasibility of Copper-Base Leadframe Preplated with a Cu-Sn Alloy instead of Ni." Solid State Phenomena 124-126 (June 2007): 227–30. http://dx.doi.org/10.4028/www.scientific.net/ssp.124-126.227.

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A preplated frame (PPF) consisting of Au/Pd/Cu-Sn/Cu substrate, i.e., preplated with a Cu-Sn alloy instead of Ni commercially used, was fabricated by electroplating and then the feasibility of the frame as an alternative PPF was investigated. The wettability of the Cu-Sn alloy was better than that of Ni, resulting in excellent contact with the substrate and smoother surface on the upper Au/Pd protective layer. By XPS analyses, it was confirmed that Cu atoms in the Cu-Sn alloy layer did not diffuse through the thin protective layer to the surface at temperatures used in IC assembly. The wire pull-strength and solderability of the Cu-Sn alloy PPF were almost equivalent to those of the Ni PPF. However, the former showed much better corrosion resistance than the latter.

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30

S, Jayesh, Jacob Elias, and Manoj Guru. "Factorial design and design of experiments for developing novel lead free solder alloy with Sn, Cu and Ni." International Journal for Simulation and Multidisciplinary Design Optimization 11 (2020): 18. http://dx.doi.org/10.1051/smdo/2020013.

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Inherent toxicity makes lead a banned material in solder alloy making process. Lead-tin alloy was a favorable alloy used for soldering in electronic packaging manufacturers. As a result of the ban on lead, electronics package industries were looking for novel lead free alloys which can substitute the conventional Sn-Pb alloy. Many alloys were discovered by the scientists. None of them were able to substitute the Sn-Pb alloy and become the market leader. In this paper a new composition with Sn, Cu and Ni is made to analyze which can potentially replace the lead containing solder alloy. Using the design of experiments method, the optimized composition of Cu and Ni is predicted. The full factorial design of experiments with two replications is used to find the optimized composition. Melting temperature, contact angle and hardness were taken as the critical output parameters. Results obtained shows that the optimum composition of Cu and Ni are 1 and 1% by wt.

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31

Issa, Tarik T., Sadeer M. Majeed, and Duha S. Ahmed. "Crystal Structure and Colorimetric Behavior of Low Melting Point Ternary Alloy." Materials Science Forum 1002 (July 2020): 12–20. http://dx.doi.org/10.4028/www.scientific.net/msf.1002.12.

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Elements of high purity (99.999) ,were used to prepare the alloy , Bi ,Sn,Zn and Cu .Two types alloy Bi – Sn – Zn and Bi – Sn – Cu were prepared by mechanical alloying technique (MA) .Annealing at 100 °Cfor 8 hours was applied for the resulting alloys . X-ray diffraction and differential scanning colorimetriy were tested for the two types of alloy before and after annealing. The best results was noticed in the ternary alloythat prepared at 4 hours milling time ,and annelid at 100 °C, for 8 hours ,under static air.

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32

Ervina, Efzan M. N., and S. Y. Tan. "Wettability of Molten Sn-Zn-Bi Solder on Cu Substrate Ervina Efzan." Applied Mechanics and Materials 315 (April 2013): 675–80. http://dx.doi.org/10.4028/www.scientific.net/amm.315.675.

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This work presents the studies of wettability Sn-6Zn-4Bi lead-free solder alloy in electronic applications. A reference solder Sn-3.1Ag-0.9 Cu lead-free solder alloy is used to compare the properties of both solders. Differential Scanning Calorimeter (DSC) profile, wettability and the microstructure of the solder were investigated. The melting temperature of Sn-Zn-Bi (Tm=194.97°C) is lower than Sn-Ag-Cu (Tm=220.40°C). Further, the wettability between molten solder and copper substrate was measured at different reflow temperature. The contact angle for Sn-Ag-Cu was decreasing from 28.23º to 24.97º and for Sn-Zn-Bi solder alloys were decreasing from 48.92º to 29.78º as the temperature increased from 230°C to 250°C. A significant increment of contact angle for Sn-Zn-Bi at 270°C and the contact angle did not change at 270°C for Sn-Ag-Cu. The result of spreading area is inversed with the contact angle. The layers of intermetallic compound were examined by energy-dispersive X-ray. The Sn-Zn-Bi solder exhibits a mixture of Cu-Sn+Cu-Zn phase and ϒ-Cu5Zn8phase. The Sn-Ag-Cu solder exhibits Cu6Sn5 (η-phase) and Cu3Sn (ε-phase). As a conclusion, Sn-Zn-Bi is a potential lead-free solder to develop based on its wettability properties than previous available solder materials.

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33

Qu, Xinghong, Hongxue Zeng, and Dong Xu. "Preparation and Microstructure Analysis of Continuous Unidirectional Solidification Cu–P–Sn Alloy." Journal of Nanoelectronics and Optoelectronics 16, no. 11 (November 1, 2021): 1815–19. http://dx.doi.org/10.1166/jno.2021.3153.

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Cu–10% P–6% Sn alloy rods with columnar crystal structure were synthesized in this study utilizing Cu–10% P–6% Sn alloy as the starting material. Continuous directional solidification was used to produce Cu–10% P–6% Sn (mass percentage) alloy rods with a diameter of 8 mm, and the heat treatment procedure was arried out under the condition of cast alloy. Optical microscopy and field emission scanning microscopy were then used to investigate the microstructure of the cast alloy. The impact of heat treatment on microstructure evolution was also investigated. The microstructure of a Cu–10% P–6% Sn alloy produced by continuous directed solidification had a Cu-rich dendritic structure, and the second phase structure was linear or spherical, according to the findings.

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34

Satyanarayan and K. N. Prabhu. "Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses." Materials Science Forum 830-831 (September 2015): 265–69. http://dx.doi.org/10.4028/www.scientific.net/msf.830-831.265.

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In the present work, the bond strength of Sn-0.7Cu, Sn-0.3Ag-0.7Cu, Sn-2.5Ag-0.5Cu and Sn-3Ag-0.5Cu lead free solders solidified on Cu substrates was experimentally determined. The bond shear test was used to assess the integrity of Sn–Cu and Sn–Ag–Cu lead-free solder alloy drops solidified on smooth and rough Cu substrate surfaces. The increase in the surface roughness of Cu substrates improved the wettability of solders. The wettability was not affected by the Ag content of solders. Solder bonds on smooth surfaces yielded higher shear strength compared to rough surfaces. Fractured surfaces revealed the occurrence of ductile mode of failure on smooth Cu surfaces and a transition ridge on rough Cu surfaces. Though rough Cu substrate improved the wettability of solder alloys, solder bonds were sheared at a lower force leading to decreased shear energy density compared to the smooth Cu surface. A smooth surface finish and the presence of minor amounts of Ag in the alloy improved the integrity of the solder joint. Smoother surface is preferable as it favors failure in the solder matrix.

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35

Soares, D., C. Vilarinho, J. Barbosa, F. Samuel, L. Trigo, and P. Bré. "Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates." Journal of Mining and Metallurgy, Section B: Metallurgy 43, no. 2 (2007): 131–39. http://dx.doi.org/10.2298/jmmb0702131s.

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Traditional Sn-Pb solder alloys are being replaced, because of environmental and health concerns about lead toxicity. Among some alternative alloy systems, the Sn-Zn and Sn-Cu base alloy systems have been studied and reveal promising properties. The reliability of a solder joint is affected by the solder/substrate interaction and the nature of the layers formed at the interface. The solder/substrate reactions, for Sn-Zn and Sn-Cu base solder alloys, were evaluated in what concerns the morphology and chemical composition of the interface layers. The effect of the addition of P, at low levels, on the chemical composition of the layers present at the interface was studied. The phases formed at the interface between the Cu or Ni substrate and a molten lead-free solder at 250?C, were studied for different stage times and alloy compositions. The melting temperatures, of the studied alloys, were determined by Differential Scanning Calorimetry (DSC). Identification of equilibrium phases formed at the interface layer, and the evaluation of their chemical composition were performed by Scanning Electron Microscopy (SEM/EDS). Different interface characteristics were obtained, namely for the alloys containing Zn. The obtained IML layer thickness was compared, for both types of alloy systems.

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36

Sungkhaphaitoon, Phairote, and Thawatchai Plookphol. "Effect of Cooling Rate on the Microstructure and Mechanical Properties of Sn-0.7wt.%Cu Solder Alloy." Key Engineering Materials 675-676 (January 2016): 513–16. http://dx.doi.org/10.4028/www.scientific.net/kem.675-676.513.

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The dependence of microstructure and mechanical properties of Sn-0.7wt.%Cu solder alloys on different cooling rates were investigated. Two cooling rates were employed during solidification: 0.04 °C/s (mold-cooled system) and 1.66 °C/s (water-cooled system). The results showed that the ultimate tensile strength of Sn-0.7wt.%Cu solder alloy increased but the elongation decreased when water-cooled system was used. The microstructure of Sn-0.7wt.%Cu solder alloys solidified by both cooling systems exhibited two phases of Sn-rich and Cu6Sn5 intermetallic compounds (IMCs). However, finer grains were observed in the water-cooled specimens.

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37

Papadopoulou, Olga, and Panayota Vassiliou. "The Influence of Archaeometallurgical Copper Alloy Castings Microstructure towards Corrosion Evolution in Various Corrosive Media." Corrosion and Materials Degradation 2, no. 2 (May 19, 2021): 227–47. http://dx.doi.org/10.3390/cmd2020013.

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The local patterns at the interfaces of corrosion stratification, developed on two archaeometallurgical bronzes (a Cu-Sn-Pb and a Cu-Zn-Sn-Pb alloy), in the as-cast condition, were assessed by OM and SEM-EDS systematic elemental chemical analyses. Previously, the alloys—whose metallurgical features and electrochemical behaviour were already well studied—have been subjected to laboratory corrosion experiments. The corrosion procedures involved electrochemical anodic polarization experiments in various chloride media: 0.1 mol/L NaCl, 0.6 mol/L NaCl and two other synthetic chloride-containing solutions, representing electrolytes present in marine urban atmosphere and in the soil of coastal sites. The characterization of the Cu-Sn-Pb alloy electrochemical patinas after anodic sweep (OCP+ 0.6 V) revealed that the metal in all electrolytes undergoes extensive chloride attack and selective dissolution of copper which initiates from the dendritic areas acting as anodic sites. The most abundant corrosion products identified by FTIR in all electrochemical patinas were Cu2(OH)3Cl), Cu2(OH)2CO3 and amorphous Cu and Sn oxides. The characterization of the Cu-Sn-Pb alloy electrochemical patina after slow anodic sweep (OCP+ 1.5 V) in 0.1 mol/L NaCl reveals selective oxidation of dendrites and higher decuprification rate in these areas. Corrosion products of Sn-rich interdendritic areas are dominated by oxygen species (oxides, hydroxides, hydroxyoxides) and Cu-rich dendrites by chlorides. In the case of Cu-Zn-Sn-Pb, Zn in dendritic areas is preferentially attacked. The alloy undergoes simultaneous dezincification and decuprification, with the former progressing faster, especially in dendritic areas. The two processes at the alloy/patina interface leave behind a metal surface where α-dendrites are enriched in Sn compared to the alloy matrix. The results of this study highlight the dynamic profile of corrosion layer build-up in bronze and brass. Moreover, the perception of the dealloying mechanisms progression on casting features, at mid-term corrosion stages, is extended.

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38

Novakovic, R. M., S. Delsante, and G. Borzone. "Wetting and interfacial reactions: Experimental study of the Sb-Sn-X (X = Cu, Ni) systems." Journal of Mining and Metallurgy, Section B: Metallurgy 54, no. 2 (2018): 251–60. http://dx.doi.org/10.2298/jmmb180124013n.

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Experimental studies of the Cu-Sb-Sn and Ni-Sb-Sn systems have been carried out by the wetting tests, followed by the analysis of the microstructural evolution occurring at the interface between the liquid alloy and solid substrate. The wetting experiments on the Sb30Sn70 / (Cu, Ni) and Sb38.4Sn61.6 / (Cu, Ni) systems have been performed by using a sessile drop apparatus. The wetting behaviour of the two alloys in contact with Cu-substrate differs from that observed in the case of Ni-substrate. The Sb-Sn alloy / substrate interface was characterised by SEM-EDS analyses. For each system, the solidliquid interactions and the phases formed at the interface were studied with the help of the corresponding phase diagrams.

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39

Alam, S. N., Prerna Mishra, and Rajnish Kumar. "Effect of Ag on Sn–Cu and Sn–Zn lead free solders." Materials Science-Poland 33, no. 2 (June 1, 2015): 317–30. http://dx.doi.org/10.1515/msp-2015-0048.

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AbstractLead and lead-containing compounds are considered as toxic substances due to their detrimental effect on the environment. Sn-based soldering systems, like Sn-Cu and Sn-Zn are considered as the most promising candidates to replace the eutectic Sn-Pb solder compared to other solders because of their low melting temperature and favorable properties. Eutectic Sn-0.7 wt.% Cu and near eutectic composition Sn-8 wt.% Zn solders have been considered here for study. For the Sn-Cu system, besides the eutectic Sn-0.7 wt.% Cu composition, Sn-1Cu and Sn-2Cu were studied. Three compositions containing Ag: Sn-2Ag-0.7Cu, Sn-2.5Ag-0.7Cu and Sn-4.5Ag-0.7Cu were also developed. Ag was added to the eutectic Sn-0.7 wt.% Cu composition in order to reduce the melting temperature of the eutectic alloy and to enhance the mechanical properties. For the Sn-Zn system, besides the Sn-8 wt.% Zn near eutectic composition, Sn-8Zn-0.05Ag, Sn-8Zn-0.1Ag and Sn-8Zn-0.2Ag solder alloys were developed. The structure and morphology of the solder alloys were analyzed using a scanning electron microscope (SEM), filed emission scanning electron microscope (FESEM), electron diffraction X-ray spectroscopy (EDX) and X-ray diffraction (XRD). Thermal analysis of the alloys was also done using a differential scanning calorimeter (DSC). Trace additions of Ag have been found to significantly reduce the melting temperature of the Sn-0.7 wt.% Cu and Sn-8 wt.% Zn alloys.

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40

Erer, Ahmet Mustafa, and Serkan Oguz. "Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems." Soldering & Surface Mount Technology 32, no. 1 (August 8, 2019): 19–23. http://dx.doi.org/10.1108/ssmt-08-2018-0028.

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Purpose This paper aims to invastigate of the wetting and interfacial properties of Sn-(3-x)Ag-0.5Cu-(x)Bi (x = 0.5, 1 and 2 in Wt.%) Pb-free solder alloys at various temperatures ( 250, 280 and 310°C) on Cu substrate in Ar atmosphere. Design/methodology/approach In this study, new Sn-(3-x)Ag-0.5Cu-xBi systems, low Ag content quaternary lead-free solder alloys, were produced by adding 0.5, 1 and 2% Bi to the near-eutectic SAC305 alloy. The wetting angles of three new alloys, Sn-2.5Ag-0.5Cu-0.5 Bi(SAC-0.5 Bi), Sn-2Ag-0.5Cu-1Bi(SAC-1Bi) and Sn-1Ag-0.5Cu-2Bi(SAC-2Bi) were measured by sessile drop technique on the Cu substrate in argon atmosphere. Findings In accordance with the interfacial analyses, intermetallic compounds of Cu3Sn, Cu6Sn5, and Ag3Sn were detected at the SAC-Bi/Cu interface. The results of wetting tests show that the addition of 1 Wt.% Bi improves the wetting properties of the Sn-3Ag-0.5Cu solder. The lowest wetting angle (θ) was obtained as 35,34° for Sn-2Ag-0.5Cu-1Bi alloy at a temperature of 310 °C. Originality/value This work was carried out with our handmade experiment set and the production of the quaternary lead-free solder alloy used in wetting tests belongs to us. Experiments were conducted using the sessile drop method in accordance with wetting tests.

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Luo, Ji Hui, Xue Feng Liu, Lai Xin Shi, and Chang Fei Cheng. "Experimental and Numerical Simulation of Surface Segregation in Two-Phase Zone Continuous Casting Cu–Sn Alloy." Materials Science Forum 850 (March 2016): 610–17. http://dx.doi.org/10.4028/www.scientific.net/msf.850.610.

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Surface segregation exists in two-phase zone continuous casting (TZCC) alloy with wide solid–liquid two phase zone. The surface segregation formation cannot be explained by the traditional solidification theories. ProCAST software was used to simulate the TZCC process for preparing the Cu–4.7 wt%Sn alloy with wide solid–liquid two phase zone. The Sn solute distribution in TZCC Cu–4.7 wt%Sn alloy was investigated, and the surface segregation mechanism of TZCC Cu–4.7 wt%Sn alloy was analyzed. The results showed that numerical simulation results were agreed with that of experimental. TZCC Cu–4.7 wt%Sn alloy in the center firstly started to solidify and resulted in “Λ” shape inclined solid/liquid (S/L) interface near the mold. Therefore, a narrow gap between the wall of the two-phase zone mold and the S/L interface formed. On the one hand, while Cu–4.7 wt%Sn alloy solidified along the opposite continuous casting direction, the solute redistribution between the solid and the liquid occurred, which lead to Sn solute decreased in solid and enriched in front of S/L interface. Because the narrow gap lies in front of inclined S/L interface near the two-phase zone mold, Sn solute enriches in liquid of the narrow gap. On the other hand, during the TZCC process, solid grains nucleate on the wall of the two-phase zone mold, while the melt feeds into the two-phase zone mold which the temperature is in the two-phase zone of the Cu–4.7 wt%Sn alloy. The solute redistribution also occurs while the solid grains grow, thus lead to Sn content increases in front of S/L interface near the wall of the two-phase zone mold. The enriched Sn solute is too late to diffuse, and will quickly flows into the narrow gap, resulting in further increasing of Sn content in the narrow gap. The liquid with enriched Sn solute in the narrow gap will become the surface layer after solidification, which lead to surface segregation layer during the TZCC Cu–4.7 wt%Sn alloy.

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Honma, Tomoyuki, David W. Saxey, and Simon P. Ringer. "Effect of Trace Addition of Sn in Al-Cu Alloy." Materials Science Forum 519-521 (July 2006): 203–8. http://dx.doi.org/10.4028/www.scientific.net/msf.519-521.203.

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The trace addition of Sn (0.01 at.%) to an Al-1.7Cu (at.%) alloy has been investigated using atom probe tomography (APT), transmission electron microscopy (TEM) and high resolution transmission electron microscope (HRTEM). We have studied samples in the as-quenched (AQ) condition and following ageing at both 160 and 200 °C for very short ageing times so as to better understand the early stages of the decomposition processes. Our data reveal independent Cu-Cu and Sn-Sn clusters in the AQ condition, though we did not observe Cu-Sn clustering. We observed for the first time that some of these initial Cu-clusters develop into GP zones during subsequent ageing at temperatures as high as 200 °C. The Sn atom clustering results in precipitation of independent 􀀂- Sn particles after aging for 30 sec. The GP zones consequently undergo reversion and this liberates Cu atoms which seem to participate in a cluster-assisted heterogeneous nucleation of the 􀀃􀀂 phase at the interface of the 􀀂-Sn. For ageing at 200 °C, this process is complete within 180 sec.

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Lee, Liu Mei, and Ahmad Azmin Mohamad. "Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review." Advances in Materials Science and Engineering 2013 (2013): 1–11. http://dx.doi.org/10.1155/2013/123697.

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This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions. The Sn-Ag-Cu solder alloys are examined in bulk and in thin film. It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed. Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology. Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies. Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.

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Rosley, Rozainita, Suzi Salwah Jikan, Nur Azam Badarulzaman, Fahmiruddin Esa, Siti Noraiza Ab Razak, Muhammad Sufi Roslan, and Munira Khalid. "Effect of Complexing Agent on The Morphology and Corrosion Effect of Cu-Sn-Zn Ternary Alloy via Electroplating." Key Engineering Materials 908 (January 28, 2022): 598–604. http://dx.doi.org/10.4028/p-7f1iu5.

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Copper-tin-zinc (Cu-Sn-Zn) ternary alloy coatings was successfully deposited from a less hazardous electrolyte containing copper (II) chloride, tin (II) chloride, zinc chloride, sodium hypophosphite and complexing agent. In this work, the impact of different complexing agent on morphology, chemical composition, current efficiency, microhardness, and corrosion rate were investigated by method of SEM equipped with EDX spectroscopy, weight gain measurements, XRD, Vickers microhardness test and potentiodynamic polarization measurement, respectively. It was discovered that, Cu-Sn-Zn alloys prepared using sodium formate shows the highest microhardness value. It is also can be concluded that, complexing agent have a significant impact on the appearance and the surface morphology of the Cu-Sn-Zn alloy electrodeposits.

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Yang, Bin, Bai Xiong Liu, Bao Jun Han, Li Na Zhang, and Ying Hui Zhang. "Investigation on Microstructure Evolution of Hot Deformed Free-Cutting Cu-Zn-Se-Bi-Sn Alloy." Advanced Materials Research 146-147 (October 2010): 682–86. http://dx.doi.org/10.4028/www.scientific.net/amr.146-147.682.

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The microstructure evolution of hot deformed Cu-Zn-Se-Bi-Sn alloy was investigated by Hitachi-800 transmission electron microscopy (TEM). The result shows that there are three different dislocation configurations such as dislocation network, dislocation wall and dislocation cell in hot deformed Cu-Zn-Se-Bi-Sn alloy. The dislocation network was firstly formed in some certain grains of Cu-Zn-Se-Bi-Sn alloy when the deformation strain amounted to 2%. Then dislocations initially arranged regularly beside original grain boundaries and the arranged dislocation walls were formed in some area and sub-grains merging emerged when the deformation strain amounted to 20%. Eventually, obvious dynamic recrystallization nucleation by sub-grain merging emerged in Cu-Zn-Se-Bi-Sn alloy when the strain attached 80%.

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46

Yan, A., L. Chen, H. S. Liu, F. F. Xiao, and X. Q. Li. "Study on strength and fracture toughness of Al-Zn-Mg-Cu-Ti(-Sn) alloys." Journal of Mining and Metallurgy, Section B: Metallurgy 51, no. 1 (2015): 73–79. http://dx.doi.org/10.2298/jmmb130122003y.

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The strength and fracture toughness of Al-Zn-Mg-Cu-Ti(-Sn) alloys were investigated by performing tensile and plane strain fracture toughness (KIC) tests. Detailed observations with optical, scanning electron and transmission electron microscopy were conducted to analyze microstructure and fracture surfaces of the alloys. The results revealed that addition of Sn refined the solution-aging grain size of matrix and reduced coarsening rate of precipitate during aging. Narrower precipitation free zones and more discontinuous distribution of grain boundary precipitates were observed to be displayed in the Sn-containing alloy. Small size second phase particles Mg2Sn were observed to form in the Sn-containing alloy and distribute in the fine dimples of fracture surface. These features of microstructure were believed to impart higher strength and fracture toughness of the Sn-containing alloy on overaging.

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Erer, Ahmet Mustafa, and Mukaddes Ökten Turacı. "Numerical computation of wetting angles of Sn–(3−x)Ag–0.5Cu−x(Bi,In) quaternary Pb-free solder alloy systems on Cu substrate." International Journal of Modern Physics C 31, no. 09 (July 20, 2020): 2050119. http://dx.doi.org/10.1142/s0129183120501193.

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This paper was aimed to study of the wetting angle ([Formula: see text]) of Sn–Ag–Cu, Sn–([Formula: see text])Ag–0.5Cu–([Formula: see text])Bi and Sn–([Formula: see text])Ag–0.5Cu–([Formula: see text])In ([Formula: see text], 1 and 2 in wt.%) Pb-free solder alloy systems at various temperatures (250, 280 and 310∘C) on Cu substrate in Ar atmosphere. The new Sn–([Formula: see text])Ag–0.5Cu–xBi and Sn–([Formula: see text])Ag–0.5Cu[Formula: see text]([Formula: see text]) In systems, low Ag content quaternary Pb-free solder alloys, were produced by adding 0.5%, 1% and 2% Bi and In separately to the near-eutectic Sn-3[Formula: see text]wt.%Ag–0.5[Formula: see text]wt.%Cu (SAC305) alloy. The wetting angles of new alloys, Sn[Formula: see text]2.5[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]0.5[Formula: see text]wt.%Bi (SAC-0.5Bi), Sn[Formula: see text]2[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]1[Formula: see text]wt.%Bi(SAC-1Bi), Sn[Formula: see text]1[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]2[Formula: see text]wt.%Bi(SAC-2Bi), Sn[Formula: see text]2.5[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]0.5[Formula: see text]wt.%In (SAC-0.5In), Sn[Formula: see text]2[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt.%Cu[Formula: see text]1[Formula: see text]wt.%In (SAC-1In) and Sn[Formula: see text]1[Formula: see text]wt.%Ag[Formula: see text]0.5[Formula: see text]wt%.Cu[Formula: see text]2[Formula: see text]wt.%In (SAC-2In) were measured by sessile drop method. Experimental results showed that additions of Bi and In separately to SAC305 resulted in a continuous decrease in the [Formula: see text] up to 1[Formula: see text]wt.% above which the [Formula: see text] value was increased and it is appeared that a correlation among the [Formula: see text], alloys compositions and the test temperatures exists which recommended an empirical model to estimate the [Formula: see text] at a given Bi and In content and temperature for a given alloy systems. The numerical model estimates the [Formula: see text] understandably well with the present work.

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48

Kim, Yong-Ho, Hyo-Sang Yoo, and Hyeon-Taek Son. "Effects of Trace Elements on Thermal and Mechanical Properties of Al–Zn–Cu Based Alloys Using Extrusion." Journal of Nanoscience and Nanotechnology 20, no. 7 (July 1, 2020): 4216–20. http://dx.doi.org/10.1166/jnn.2020.17543.

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Thermal properties and microstructure of Al-4 wt.% Zn-2 wt.% Cu–x (x = 2 wt%. Mg, 2 wt%. Sn, 0.7 wt.% Mg-0.7 wt.% Sn-0.7 wt.% Ca) alloys on cast and extrusion have been investigated with extrusion temperature of 400 °C. Al-4 wt.% Zn-2 wt.% Cu alloy was composed of Al and Al2Cu phases. By adding Mg contents, Al2Mg3Zn3 phase was increased and Al2Cu phase was decreased respectively. During hot extrusion, elongated in the extrusion direction because of severe deformation. The thermal conductivity with temperature and composition of as-extruded Al-4 wt.% Zn-2 wt.% Cu–x alloys decreases with adding 2 wt.% Mg, 2 wt.% Sn contents from 190.925 and 196.451 W/mK but thermal properties of addition of 0.7 wt.% Mg-0.7 wt.% Sn-0.7 wt.% Ca element slightly reduced from 222.32 to 180.775 W/mK. The ultimate tensile strength (UTS) for Al-4 wt.% Zn- 2 wt.% Cu alloy was 121.67 MPa. By adding 2 wt.% Mg contents, tensile strength was dramatically increased with 350.5 MPa.

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49

Watanabe, Masato, Takashi Shirai, Akihiko Ishibashi, and Hiromi Miura. "Dynamic Recrystallization Behaviour in Cu-Sn-P Alloy for High Strength Copper Tube." Materials Science Forum 654-656 (June 2010): 1271–74. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.1271.

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Dynamic recrystallization (DRX) behaviour in a newly developed Cu-Sn-P alloy for heat exchangers and tubes was systematically investigated. For this purpose, Cu-Sn-P alloys with different content of Sn were deformed in compression at temperatures between 1073 K and 1213 K and at various strain rates from 2 x 10-4 s-1 to 2 x 10-1 s-1. The onset of DRX was more advanced with increasing temperature and with decreasing strain rate. Full DRX was not achieved at the testing conditions of lower temperature and higher strain rate even after straining to ε = 1.0. This tendency was more significant in the alloy with higher Sn content. With increasing Sn content, the flow stress and the obtained grains size became higher and finer, respectively. These experimental results indicate the important role of Sn for strengthening and microstructual control.

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50

Yen, Yee-Wen, Chien-Chung Jao, and Chiapyng Lee. "Effect of Cu addition on interfacial reaction between Sn–9Zn solder and Ag." Journal of Materials Research 21, no. 12 (December 2006): 2986–90. http://dx.doi.org/10.1557/jmr.2006.0369.

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The effect of Cu added eutectic Sn–9Zn solder reacting with the Ag substrate has been investigated in this study. Three Ag–Zn intermetallic compounds (IMCs), ∈–AgZn3, γ–Ag5Zn8, and ζ–AgZn, were formed on the Sn–9Zn/Ag interface at 260 °C. While Cu was gradually added to the Sn–9Zn alloy, microstructures of intermetallic compounds changed dramatically. The intermetallic compound microstructures became loose and Sn and Cu atoms in the Ag-Zn intermetallic compounds increased. If more than 3 wt% of Cu was added to the Sn-9Zn alloy, Ag-Sn intermetallic compounds were formed on the Ag surface and massive spalling of Ag–Zn IMC layers from the Ag surface occurred in a short reaction time.

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Journal articles on the topic 'Cu-Sn Alloy'

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