Relevant bibliographies by topics / Cu-Sn Alloy

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers

Academic literature on the topic 'Cu-Sn Alloy'

Author: Grafiati
Published: 6 September 2023

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Cu-Sn Alloy.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Cu-Sn Alloy"

1

Watanabe, Hirohiko, Marie Nagai, Tsutomu Osawa, and Ikuo Shohji. "Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge Alloy." Key Engineering Materials 462-463 (January 2011): 70–75. http://dx.doi.org/10.4028/www.scientific.net/kem.462-463.70.

Full text
Abstract:
Dissolution properties of Cu in molten Sn-Ag-Cu-Ni-Ge alloys have been investigated. In particular, the effect of the Ni content in the alloys on the dissolution properties has been examined. Moreover, the dissolution properties have been compared with those of Sn-Ag and Sn-Ag-Cu alloys. To investigate the dissolution rate of Cu in molten alloys, Cu wires were dipped in molten alloys heated at 250, 270 and 290°C. Dissolution thickness of Cu wire is proportional to dipping time regardless of alloy type. The dissolution rates of Cu follow the order Sn-Ag > Sn-Ag-Cu > Sn-Ag-Cu-Ni-Ge. In Sn-Ag-Cu-Ni-Ge alloys, the dissolution rate of Cu decreases with increasing the Ni content. In cases of Sn-Ag and Sn-Ag-Cu alloys, a thin Cu-Sn compounds layer forms at the interface between Cu and the alloy and dissolution of Cu does not proceed uniformly. On the contrary, a thick reaction layer, which consists of granular Cu-Ni-Sn compounds, forms at the interface between Cu and the Sn-Ag-Cu-Ni-Ge alloy. Since the reaction layer inhibits dissolution of Cu in molten alloy, the dissolution rate slows down and dissolution of Cu proceeds uniformly in the Sn-Ag-Cu-Ni-Ge alloys.
APA, Harvard, Vancouver, ISO, and other styles
2

Kaneko, Daisuke, Mahoto Takeda, Takanari Nakajima, and Naokuni Muramatsu. "The Influence of Alloy Composition and Heat-Treatments on the Shape Memory Properties in a Cu-Sn-X Alloy." Materials Science Forum 941 (December 2018): 1282–87. http://dx.doi.org/10.4028/www.scientific.net/msf.941.1282.

Full text
Abstract:
We have focused on shape-memory properties of Cu-Sn based ternary alloys in this study. We have attempted to suppress degradation at room temperature aging and to improve the amount of shape recovery by adding the third element to a binary Cu-Sn alloy. The attempt has successfully conducted in Cu-Sn-Mn alloy, the degradation due to aging at room temperature was suppressed and the thermal stability was improved. Furthermore, the present study revealed that Cu-Sn-Mn alloy exhibited a large super elastic recovery in three point bending tests. We have also investigated the shape-memory properties of Cu-Sn-Si alloys and revealed that the ternary alloy has achieved super-elastic recovery better than the Cu-Sn-Mn alloy in the three-point bending tests.
APA, Harvard, Vancouver, ISO, and other styles
3

Yamauchi, Akira, Kenta Ida, Masahito Fukuda, and Takuma Yamaguchi. "Tensile Properties of Sn-Bi Lead-Free Solder Alloys." Solid State Phenomena 273 (April 2018): 72–76. http://dx.doi.org/10.4028/www.scientific.net/ssp.273.72.

Full text
Abstract:
The Influence of alloy composition on tensile properties of Sn-Bi, Sn-Bi-Cu and Sn-Bi-Ni lead-free solder alloys were investigated. It is found that the elongation of Sn-Bi alloys depend on Bi content, and Sn-40wt% Bi alloy has the highest elongation. The addition of Cu and Ni improves the ductility of Sn 35-45wt% Bi alloys. The fine microstructure of Sn-Bi-Cu or Ni alloys have an effect on the ductility of Sn-Bi based alloys. The elongation increases with decreasing strain rate and increasing temperature. Cu and Ni added to Sn-Bi alloy showed the super plasticity behavior at low strain rate and high temperature (more than 333 K). Moreover, strain rate sensitivity ‘m’ increases with temperature.
APA, Harvard, Vancouver, ISO, and other styles
4

Kong, Zhi Gang, and Feng Min Shi. "Effect of Ag on the Sn-Cu Lead-Free Material." Applied Mechanics and Materials 687-691 (November 2014): 4291–94. http://dx.doi.org/10.4028/www.scientific.net/amm.687-691.4291.

Full text
Abstract:
With the increasing focus on developing environmentally benign electronic packages, Pb-free alloys have received a great deal of attention. Among the lead-free solder materials, Sn–Ag–Cu alloy has advantages of good wetting property, superior interfacial properties, high creep resistance and low coarsening rate. In this article, the organization and mechanical performance of Sn-Ag-Cu Material are investigated. Series of inspections and analytical research methods are introduced. Experimental results show that Sn-Cu solder organization contains a large number of Cu6Sn5graphic, while Sn-Ag-Cu graphic is IMC Ag3Sn graphic. The mechanical propersity of Sn-Ag-Cu alloy is better than the Sn-Cu alloy. Fracture surfaces of the Sn-Ag3.0-Cu0.5 alloys specimen have many small size and homogeneously distributed dimples.
APA, Harvard, Vancouver, ISO, and other styles
5

Somidin, Flora, Stuart D. McDonald, and Kazuhiro Nogita. "Formation of Cu6Sn5/(Cu, Ni)6Sn5 Intermetallic Compounds between Cu3Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding." Solid State Phenomena 273 (April 2018): 14–19. http://dx.doi.org/10.4028/www.scientific.net/ssp.273.14.

Full text
Abstract:
This paper presents the use of the transient liquid phase concept to grow the high temperature Cu6Sn5intermetallic compound between Cu3Sn-rich powdered alloys and molten Sn. In this study, high temperature powdered alloys containing high fractions of Cu3Sn were fabricated from a chill-cast Sn-60 wt.%Cu alloy. A ternary alloy with composition of Sn-59 wt.%Cu-1 wt.%Ni was also prepared to investigate the effect of Ni. The reaction products were obtained at 250°C over a period of 30 minutes. The results provide new insight into the mechanism of the interfacial reaction between liquid Sn and solid Cu3Sn-rich alloy with and without Ni additions.
APA, Harvard, Vancouver, ISO, and other styles
6

Alam, S. N., N. Jindal, and N. Naithani. "Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy." Materials Science-Poland 37, no. 2 (June 1, 2019): 212–24. http://dx.doi.org/10.2478/msp-2019-0032.

Full text
Abstract:
AbstractThe present work reports the effect of Cu addition on the melting point, hardness and electrical resistivity of Sn-57 wt.% Bi eutectic solder alloy. Both binary eutectic Sn-57 wt.% Bi and ternary Sn-(57-x)Bi-xCu (x = 0.1, 0.3, 0.5, 0.7 and 1 wt.%) alloys containing various amounts of Cu were developed by melting casting route. The microstructure of the various solder alloys was analyzed using an optical microscope and a SEM. The variation in melting point, hardness and electrical resistivity of the Sn-Bi eutectic solder alloys with the addition of Cu was determined. The melting point of the eutectic Sn-Bi solder alloy was found to decrease up to the addition of 0.7 wt.% Cu. However, further addition of Cu led to an increase in the melting point of the alloy. Addition of Cu led to an increase in the hardness of the eutectic Sn-Bi solder alloy whereas the electrical resistivity of this alloy was found to increase up to the addition of 0.7 wt.% of Cu beyond which a decrease in the electrical resistivity was observed. A change in the microstructure of the solder alloy was observed when it was reheated above the melting temperature.
APA, Harvard, Vancouver, ISO, and other styles
7

Chen, Yan, Hong Hua Su, Yu Can Fu, and Z. C. Guo. "Investigation of Interface Microstructure of Diamond and Ti Coated Diamond Brazed with Cu-Sn-Ti Alloy." Key Engineering Materials 487 (July 2011): 199–203. http://dx.doi.org/10.4028/www.scientific.net/kem.487.199.

Full text
Abstract:
Cu-Sn-Ti brazing alloys are gaining importance as active brazing alloys for brazing diamond tools. The microstructure at the interface between diamond or Ti-coated diamond grits and Cu-Sn-Ti brazing alloy and bonding strength have been investigated in this paper. The results show that TiC layer forms between diamond and alloy matrix during the brazing process and Sn- and Ti-based intermetallic phase forms between TiC and the bonding matrix. And compound SnTi3forms between the Ti-coated diamond grits and Cu-Sn-Ti brazing alloy. Furthermore, the bonding strength between Ti-coated diamond grits and brazing alloy is higher than that between diamond grits and brazing alloy.
APA, Harvard, Vancouver, ISO, and other styles
8

Pi, Zhao Hui, Guang Qiang Li, Yan Ping Xiao, Zhan Zhang, Zhuo Zhao, and Yong Xiang Yang. "An Experimental Investigation on the Solubility of Zr in Cu-Sn Alloys." Advanced Materials Research 887-888 (February 2014): 324–28. http://dx.doi.org/10.4028/www.scientific.net/amr.887-888.324.

Full text
Abstract:
An experimental investigation on the solubility of Zr in Cu-Sn alloy was conducted in a resistance furnace. The solubility of Zr in Cu-Sn alloy was determined by investigating the influence of different conditions such as the ratio of Cu-Sn alloy and temperature. The solubility of Zr in Cu-Sn alloy changes with the proportion of Cu and Sn, and it increases with the increasing of Cu content. The experimental temperature has a significant effect on the solubility of Zr in Cu-Sn alloy. The maximum solubility of Zr in Cu-Sn alloy is 6.2 mass % at 900 °C with the mass ratio of Cu : Sn = 8:2.
APA, Harvard, Vancouver, ISO, and other styles
9

Yavuzer, B., D. Özyürek, and T. Tunçay. "Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys." Materials Science-Poland 38, no. 1 (March 1, 2020): 34–40. http://dx.doi.org/10.2478/msp-2020-0025.

Full text
Abstract:
AbstractThis study investigates microstructures and mechanical properties of the alloys obtained by adding Cu (0.7 % and 0.9 %) and Al (0.7 % and 0.9 %) to lead-free Sn-9Zn eutectic soldering alloy produced by investment casting method. The results show that Cu5Zn8 phase has formed in the structure of Cu added alloys and the Al2O3 phase has formed due to addition of Al. It was found that small and round-shaped Al2O3 phase increased the tensile strength of the new alloy compared to the eutectic alloy. In addition, it was observed that the microhardness of Cu added alloys was lower than that of Sn-9Zn eutectic alloy, but the microhardness of alloys containing Al was higher compared to the other eutectic Sn-9Zn alloy.
APA, Harvard, Vancouver, ISO, and other styles
10

Han, Duy Le, Yu-An Shen, Fupeng Huo, and Hiroshi Nishikawa. "Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints." Metals 12, no. 1 (December 24, 2021): 33. http://dx.doi.org/10.3390/met12010033.

Full text
Abstract:
The low melting temperature In-48Sn alloy is a promising candidate for flexible devices. However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid diffusion of Cu into the In-rich alloy. In this study, the effect of the addition of xCu (x = 2.0 and 8.0 wt.%) on wettability, interfacial reaction, and mechanical strength of the In-Sn-xCu/Cu joint is analyzed. The results demonstrate that both the In-48Sn and In-Sn-xCu alloys exhibit good wettability on the Cu substrate and that the contact angle increases with an increase in the Cu content. Furthermore, fine grains are observed in the alloy matrix of the In-Sn-xCu/Cu joint and the interfacial intermetallic compound (IMC) comprising the Cu-rich Cu6(In,Sn)5 near the Cu substrate and the Cu-deficient Cu(In,Sn)2 near the solder side. The In-Sn-2.0Cu/Cu joint with fine microstructure and a small amount of IMC in the alloy matrix shows the highest average shear strength of 16.5 MPa. Although the In-Sn-8.0Cu/Cu joint also exhibits fine grains, the presence of large number of voids and rough interfacial IMC layer causes the formation of additional stress concentration points, thereby reducing the average shear strength of the joint.
APA, Harvard, Vancouver, ISO, and other styles
More sources

Dissertations / Theses on the topic "Cu-Sn Alloy"

1

Ghosh, Swatilekha. "Electrodeposition of Cu, Sn and Cu-Sn alloy from choline chloride ionic liquid." Thesis, University of Newcastle upon Tyne, 2013. http://hdl.handle.net/10443/2279.

Full text
Abstract:
Copper, tin and their alloy deposits are popular for its various applications in industrial aspects like enhance corrosion resistance and provide decorative finish. This work concentrated on the fabrication of these coatings, accomplished by electrodeposition technique which allows the control of thickness and microstructure of the films. Previously these metals and alloy were electrodeposited from different aqueous electrolytes. However these baths suffer from various environmental issues and deposits suffers from H evolution and metal oxide formation. As a result solution 2 ionic liquid (IL) was proposed as an alternative. ILs are categorized as salts liquid at room temperature and consist only of cations and anions. Presently Choline chloride based IL was used due to its advantages of low cost, low melting point, low toxicity, low viscosity and high conductivity than other ILs. Physical properties of the ILs like density, viscosity and conductivity were measured with variation of temperature and concentration of added metallic salts. To determine the electrochemical properties of individual metals and alloy, voltammetry scans were carried out using various scan rates and agitation rates. For all these measurements the concentration of Cu and Sn were varied in a range of 0.01 to 0.2 M and 0.01 to 0.1 M respectively at temperature range of 25 to 55 °C using a platinum rotating disk electrode (RDE). Deposition experiments were then carried out under potentiostatic and galvanostatic conditions using a stainless steel RDE. Material properties of the deposits like crystalline structure, grain size, strain, deposit morphology and chemical composition were analyzed using x-ray diffraction (XRD), optical microscope and scanning electron microscopy (SEM). The measurement showed that density and viscosity decreases and conductivity increases with rise in operation temperature for the electrolyte with and without metal ions. The reduction of both the metal was found to be mass transfer control and limiting current for metal deposition was found. The diffusion co-efficient -7 2 -7 2 obtained for Cu and Sn in the IL system was 1.22x10 cm /s and 1.96x10 cm /s -3 respectively. For individual metal Cu and Sn, best deposits were obtained at 4.7x10 2 -3 2 A/cm and 1.6x10 A/cm respectively using RDE speed of 700 rpm at 25 °C. The Cu deposit showed face centered cubic structure of 66±10 nm grain size and that of Sn was 62±10 nm with tetragonal crystalline structure. The smooth and bright Cu-Sn alloy deposit was obtained by applying potential in the range of 0.35 to 0.36 V vs. Ag wire or -3 2 0.8 to 0.9x10 A/cm of RDE speed is 220 rpm at 25 °C. The obtained deposits showed orthorhombic CuSn structure with a grain size of 21±10 nm. On annealing the 3 crystalline structure changed to hexagonal CuSn structure and the crystalline size 103 was obtained as 77±50 nm.
APA, Harvard, Vancouver, ISO, and other styles
2

Caris, Joshua. "Heat Treatment Effects on Mechanical Behavior of Cu-15Ni-8Sn Produced via Powder Metallurgy." Case Western Reserve University School of Graduate Studies / OhioLINK, 2007. http://rave.ohiolink.edu/etdc/view?acc_num=case1184360740.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Cooper, Shellene. "Creep behaviour of the ternary lead-free solder alloy, Sn-3.8wt.%Ag-0.7wt.%Cu." Thesis, Open University, 2002. http://oro.open.ac.uk/54417/.

Full text
Abstract:
Electronic equipment is facing the challenge of both miniaturisation and the need to replace lead in interconnections. In service, interconnections generally fail by thermomechanical fatigue, and this behaviour is strongly affected by the creep process. This thesis examines the creep behaviour of a popular lead-free replacement alloy, Sn-3.8wt.%Ag-0.7wt%Cu (Sn-Ag-Cu), in joint and bulk form. Experimental work involved the determination of the creep properties of this alloy at various temperatures, over a range of stresses. Over the regions tested, the creep behaviour is best described by the Norton power law constitutive equation. The stress exponent for bulk Sn-Ag-Cu ranged between 10 and 18 (at 125 to -lOoC respectively) and indicates that a dispersion-strengthened mechanism is dominant in the creep process. The activation energy for creep in the bulk Sn-Ag-Cu is approximately 120kJ/moi and falls in the region similar to that observed for the self-diffusion of tin. In joint form the stress exponent is greater than 10 at high stresses but a change in mechanism is indicated at lower stress where the creep exponent falls to 3. The activation energy for creep in Sn-Ag-Cu when used in joint form is approximately 70kJ/moi and falls in the region similar to that observed for the short-circuit diffusion of tin. Results obtained from the ternary alloy were directly compared to those from Sn- 37wt.%Pb (Sn-Pb) and other prospective lead-free alloys in bulk form. The creep resistance of the ternary lead-free alloy at 75°C is superior to the conventional Sn-Pb alloy and the possible replacement alloys (tin-copper and tin-silver). This superiority is retained when tested at similar homologous temperatures. However, the Sn-3.8Ag- O.7Cu alloy is less ductile but generally possesses strains to failure above 10 percent in comparison to the 25 to 50 percent ductility of Sn-Pb.
APA, Harvard, Vancouver, ISO, and other styles
4

Horsley, Robert Michael. "Microstructural characterisation of solder joints using the Sn-Ag-Cu eutectic alloy in a no-clean surface mount technology (SMT) assembly process." Thesis, University of Salford, 2002. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.272696.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Benedict, Michael Scott. "Heterogeneous nucleation of Sn in Sn-Ag-Cu solder joints." Diss., Online access via UMI:, 2007.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
6

Yassin, Amal M. "Creep microstructure relationships in Sn-Sb and Sn-Sb-Cu alloys." Thesis, Heriot-Watt University, 1999. http://hdl.handle.net/10399/1182.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Pewnim, Naray. "Electrodeposition of Cu-Sn alloys from methanesulfonate electrolytes." Thesis, University of Newcastle Upon Tyne, 2012. http://hdl.handle.net/10443/1790.

Full text
Abstract:
The most commonly used alloy in the electronics industry has been the ubiquitous tinlead alloy. As the demand for electronic devices continues to increase, there have been concerns about the continued use of lead and its long term environmental impact. In the last decade there has been a push to ban the use of lead in electronic products. Legislation from various governments around the world limiting the use of lead has given rise to the drive to find suitable lead-free alternatives. The aim of this research project was to establish a systematic approach for the selection of electrochemical parameters for the electrodeposition of tin-rich copper-tin alloys from a single electroplating bath. By studying and understanding a model system such as copper-tin, one can then use the information obtained as a basis to successfully deposit various other tin binary alloys in the future. Tin-rich deposits were enabled by employing various strategies such as maintaining a high Sn to Cu ratio in the electrolyte and by using surface active agents that have been known to facilitate alloy co-deposition. The effect of surfactants on the tin content in the deposit was initially examined with the aid of a rotating cylinder Hull cell. It was found that the presence of fluorosurfactant was crucial in eliminating metal oxide formation. Cyclic voltammetry at a rotating disk electrode showed that inclusion of surfactant in the electrolyte had no effect on the reduction potential of tin which remained at -0.45 V vs SCE. However, the reduction potential for copper shifted from approximately -0.13 to -0.18 V vs SCE, thereby facilitating alloy co-deposition. Chronoamperometry and anodic stripping voltammetry showed that current efficiency for copper-tin deposition ranged from 55-92% depending on the deposition time and deposit composition. Results from voltammetry experiments were used in the next galvanostatic electrodeposition experiments at vitreous carbon electrodes. Deposits containing up to 96 wt.% tin were obtained from both direct current and pulse plating modes. It was found that an optimal current density of 22 mA cm-2 was needed to obtain desirable deposits. For pulse plating the peak current density should be set to 100 mA cm-2 with a duty cycle of 0.2. Cu-Sn alloys obtained consisted of two phases, tetragonal tin and a hexagonal Cu6Sn5 intermetallic compound. Deposit annealing showed that the Cu3Sn intermetallic was not formed.
APA, Harvard, Vancouver, ISO, and other styles
8

Kent, Damon. "Age hardening of sintered Al-Cu-Mg-Si-Sn alloys /." St. Lucia, Qld, 2004. http://www.library.uq.edu.au/pdfserve.php?image=thesisabs/absthe17893.pdf.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

ISHII, HENRIQUE A. "Elaboracao de ligas Ag-Sn-Cu para amalgama dentario por moagem de alta energia." reponame:Repositório Institucional do IPEN, 2003. http://repositorio.ipen.br:8080/xmlui/handle/123456789/11101.

Full text
Abstract:
Made available in DSpace on 2014-10-09T12:48:21Z (GMT). No. of bitstreams: 0
Made available in DSpace on 2014-10-09T13:57:22Z (GMT). No. of bitstreams: 1 08713.pdf: 6496941 bytes, checksum: 5803cb14028b4639afbb59fbc4cfa0d0 (MD5)
Tese (Doutoramento)
IPEN/T
Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP
APA, Harvard, Vancouver, ISO, and other styles
10

Picincu, Lucica. "The electrodeposition of Cu-Zn-Sn alloys from alkaline cyanide solutions." Thesis, University of Southampton, 2000. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.310845.

Full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Books on the topic "Cu-Sn Alloy"

1

(Editor), G. Petzow, and G. Effenberg (Editor), eds. Ternary Alloys: A Comprehensive Compendium of Evaluated Constitutional Data and Phase Diagrams, Vol. 5, Al-Cu-S to Al-Gd-Sn. Wiley-VCH, 1991.

Find full text
APA, Harvard, Vancouver, ISO, and other styles

Book chapters on the topic "Cu-Sn Alloy"

1

Honma, Tomoyuki, David W. Saxey, and Simon P. Ringer. "Effect of Trace Addition of Sn in Al-Cu Alloy." In Materials Science Forum, 203–8. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-408-1.203.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Zhang, L., Zhong Guang Wang, and J. K. Shang. "Creep Rupture of Sn-Ag-Cu Pb-Free Solder Alloy." In The Mechanical Behavior of Materials X, 585–88. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-440-5.585.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Fujiwara, Hiroshi, Takashi Nishimoto, Hiroyuki Miyamoto, and Kei Ameyama. "Microstructure and Mechanical Properties of Cu-Sn Alloy with Harmonic Structure." In PRICM, 2455–60. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2013. http://dx.doi.org/10.1002/9781118792148.ch304.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Fujiwara, Hiroshi, Takashi Nishimoto, Hiroyuki Miyamoto, and Kei Ameyama. "Microstructure and Mechanical Properties of Cu-Sn Alloy with Harmonic Structure." In Proceedings of the 8th Pacific Rim International Congress on Advanced Materials and Processing, 2455–60. Cham: Springer International Publishing, 2013. http://dx.doi.org/10.1007/978-3-319-48764-9_304.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Kawazoe, Yoshiyuki, Ursula Carow-Watamura, and Dmitri V. Louzguine. "Structural, thermal and mechanical properties of Cu-Ni-Sn-Ti alloy." In Phase Diagrams and Physical Properties of Nonequilibrium Alloys, 205–11. Berlin, Heidelberg: Springer Berlin Heidelberg, 2019. http://dx.doi.org/10.1007/978-3-662-57920-6_43.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Kawazoe, Yoshiyuki, Ursula Carow-Watamura, and Dmitri V. Louzguine. "Structural, thermal and mechanical properties of Cu-Sn-Ti-Zr alloy." In Phase Diagrams and Physical Properties of Nonequilibrium Alloys, 278–82. Berlin, Heidelberg: Springer Berlin Heidelberg, 2019. http://dx.doi.org/10.1007/978-3-662-57920-6_49.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Chen, Guohai, Ju Sheng Ma, and Zhi Ting Geng. "Fabrication and Properties of Lead-Free Sn-Ag-Cu-Ga Solder Alloy." In Materials Science Forum, 1747–50. Stafa: Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-960-1.1747.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Luo, Ji Hui, Xin Xin Deng, Li Zhang, Su Liang Wang, Zhong Fang Xie, and Xian Yue Ren. "Microstructure Evolution and Chemical Composition in Continuous Directional Solidification Cu–P–Sn Alloy." In TMS 2020 149th Annual Meeting & Exhibition Supplemental Proceedings, 1215–21. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-36296-6_112.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Luo, Ji Hui, Qin Li, Yan Hui Chen, Shu Liu, Qiu Yue Wen, and Hui Min Ding. "Effect of Heat Treatment on Microstructure of Continuous Unidirectional Solidified Cu–Ni–Sn Alloy." In Materials Processing Fundamentals 2019, 163–68. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-05728-2_15.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Zhao, Tao, Shuhui Yuy, Zhijun Zhang, Rong Sun, and Ruxu Du. "Preparation and Tribological Properties of Monodispersed Metallic Cu-Sn Alloy Nanoclusters with Modified Surface." In Advanced Tribology, 892–93. Berlin, Heidelberg: Springer Berlin Heidelberg, 2009. http://dx.doi.org/10.1007/978-3-642-03653-8_304.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Cu-Sn Alloy"

1

Liu, Libin, Cristina Andersson, Johan Liu, and Y. C. Chan. "Thermodynamic Assessment of Sn-Co-Cu Lead-Free Solder Alloy." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35126.

Full text
Abstract:
To select a lead-free solder system, factors such as eutectic/peritectic point, electron negativity, abundance, cost, toxicity of elements, world production capacity, segregation during solidification, possibility to form low melting phases with Pb, among others must be carefully considered. On the basis of thorough analysis of binary phase diagrams of Sn-X-systems (X represents other elements) and the properties of the element X, the Sn-Co-Cu eutectic ternary alloy system has been chosen as a new lead-free solder candidate. In order to find the eutectic point for the Sn-Co-Cu system, the Sn-Co binary system was thoroughly assessed with CALPHAD (CALculation of PHAse Diagram) methods. The ternary phase diagram of Sn-Co-Cu system was extrapolated with the assessed thermodynamic parameters of Sn-Co, Sn-Cu, and Co-Cu system. The eutectic point for L–Sn2Co+(Sn)+Cu6Sn5 is 224.4°C and 0.37%Co and 0.68%Cu and 98.95%Sn.
APA, Harvard, Vancouver, ISO, and other styles
2

Dadras, Massoud. "Microstructure of 3d printed supersaturated Cu-Sn alloy." In European Microscopy Congress 2020. Royal Microscopical Society, 2021. http://dx.doi.org/10.22443/rms.emc2020.1161.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Belyakov, Sergey A. "Ultrasonic modification of Sn-Ag-Cu alloy microstructure." In 2008 9th International Workshop and Tutorials on Electron Devices and Materials. IEEE, 2008. http://dx.doi.org/10.1109/sibedm.2008.4585865.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Hidaka, Noboru, Megumi Nagano, Masayoshi Shimoda, Hirohiko Watanabe, and Masahiro Ono. "Creep Properties and Microstructure of the Sn-Ag-Cu-Ni-Ge Lead-Free Solder Alloy." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73148.

Full text
Abstract:
A new lead-free solder alloy, Sn-Ag-Cu base adding a small amount of Ni, Ge, has been developed to improve their mechanical properties and prevent oxidation in solder alloys. In this paper, creep properties of two lead-free solder alloys, Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge (abbr. Sn-3.5Ag-0.5Cu-Ni-Ge) solder and Sn-3.0Ag-0.5Cu solder, were investigated at three temperatures ranging from 313K-398K. It was found that the creep strength of the Sn-3.5Ag-0.5Cu-Ni-Ge solder is higher than that of the Sn-3.0Ag-0.5Cu solder. Especially in the low stress region at 398K, the creep rupture time of the Sn-3.5Ag0.5Cu-Ni-Ge solder is about three times as long as that of the Sn-3.0Ag-0.5Cu solder. The microstructure of these solder alloys show that the addition of Ni was found to refine the effective grain size and provide a fine and uniform distribution of Ag3Sn in the solidified microstructure. The microstructure of the Sn-3.5Ag-0.5Cu-Ni-Ge solder is more stable than that of the Sn-3.0Ag-0.5Cu solder alloy after aging treatment at 398K, 1000 h. TEM observation was also performed, showing that precipitations of (Cu, Ni)6 Sn5, the diameter of which are about 0.5 μm, are distributed in the Ag3Sn/β-Sn phase eutectic area of the Sn-3.5Ag-0.5Cu-Ni-Ge solder after creep test at 398K, 5MPa. It is thought that the precipitations of (Cu, Ni)6 Sn5 contribute to creep strength in the Sn-3.5Ag-0.5Cu-Ni-Ge solder alloy.
APA, Harvard, Vancouver, ISO, and other styles
5

Qin, Yi, Abdul Wassay, Changqing Liu, G. D. Wilcox, Kun Zhao, and Changhai Wang. "Electrodeposition of Sn-Cu solder alloy for electronics interconnection." In High Density Packaging (ICEPT-HDP). IEEE, 2009. http://dx.doi.org/10.1109/icept.2009.5270643.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Kariya, Yoshiharu, Tomokazu Niimi, Tadatomo Suga, and Masahisa Otsuka. "Low Cycle Fatigue Properties of Solder Alloys Evaluated by Micro Bulk Specimen." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73165.

Full text
Abstract:
Micro-bulk fatigue testing was developed to investigate the fatigue lives and damage mechanisms of Sn-3.0Ag-0.5Cu and Sn-37Pb solder alloys. The fatigue lives of micro-bulk solder obeyed Manson-Coffin’s empirical law, and the fatigue ductility exponents were about 0.55 for both Sn-Ag-Cu and Sn-Pb alloys. The fatigue life of Sn-3.0Ag-0.5Cu alloy was 10 times longer than that of Sn-37Pb alloy under symmetrical wave profile, although fatigue resistance of Sn-3.0Ag-0.5Cu alloy was not so superior under asymmetrical wave condition. The fatigue crack was developed from extrusion and intrusion of slip band in Sn-3.0Ag-0.5Cu alloy, while the crack was observed at colony boundary in Sn-37Pb alloy. The difference in damage mechanism may affect the sensitivity of fatigue life to reversibility of loading profile.
APA, Harvard, Vancouver, ISO, and other styles
7

Pop, Petru A., Petru Ungur, Juan Lopez Martinez, and Gheorghe Bejinaru-Mihoc. "Theoretical and Practical Estimations Regarding of Borderline Conditions Imposed for Qualitative Achievement of Sliding Bimetallic Bearings From Steel-Bronze." In ASME 2009 International Manufacturing Science and Engineering Conference. ASMEDC, 2009. http://dx.doi.org/10.1115/msec2009-84193.

Full text
Abstract:
The paper has presented the reduced structure of horizontal centrifugal casting mechanism by high frequency current of bimetallic bushes from steel-bronze, with a chemical stability treatment of borderline alloy layer. This stabilizer borderline layer at interference of inner cylindrical surfaces from steel and external surfaces from bronze, has achieved by adding into filler metal of Cu-Sn a supplier non-ferrous metal added, with great specific weight and low melting point as Cu-Sn alloy, for example Sn with contents of 1% from Cu-Sn alloy. At high temperature and pressure, Sn is forming with Fe from steel mass of bimetallic bearing an inter-metallic compound FeSn2, which reactions with Cu-Sn alloy due to a stable metallic connection. The experimental tests have realized at Machine Tools ‘Infratirea’ Co from Oradea, achieved bimetallic bearings of steel-bronze, with a good physical and thermal stability and well adhesion between antifriction steel with bronze.
APA, Harvard, Vancouver, ISO, and other styles
8

Qin, Yi, Changqing Liu, G. D. Wilcox, Kun Zhao, and Changhai Wang. "Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection." In 2009 11th Electronics Packaging Technology Conference (EPTC). IEEE, 2009. http://dx.doi.org/10.1109/eptc.2009.5416536.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Yunus, Mohammad, Muthiah Venkateswaran, and Peter Borgesen. "Flip Chip Process Development and Relaibility Evaluation With Lead-Free Solder Alloy." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39253.

Full text
Abstract:
Usually, flipchip technology is based on either high-Pb or eutectic Sn/Pb solder forming the connections between the semiconductor chip and the carrier substrate. However decay of the 210Pb constituent, via 210Bi and 210Po, to 206Pb involves the emission of energetic alpha particles which have a tendency to cause soft errors in nearby active elements on the chip. Also, impending legislations in Europe and Japan on the elimination of Pb from electronic products have prompted the investigation of alternative solder alloys. This paper outlines an initial development effort focussed on the Sn/Ag/Cu (95.8/3.5/0.7) alloy. The study involved the development of a flip chip assembly process followed by a reliability evaluation comparing the fatigue resistance of the Sn/Ag/Cu alloy to that of eutectic Sn/Pb solder. The test vehicle used was a 225μm bump pitch, 11mm square die mounted on a ceramic substrate.
APA, Harvard, Vancouver, ISO, and other styles
10

Tokarieva, Iryna, and Antonina Maizelis. "Nucleation in the Process of Cu-Sn Alloy Nanoscale Films Electrodeposition." In 2020 IEEE 40th International Conference on Electronics and Nanotechnology (ELNANO). IEEE, 2020. http://dx.doi.org/10.1109/elnano50318.2020.9088835.

Full text
APA, Harvard, Vancouver, ISO, and other styles
You might also be interested in the extended bibliographies on the topic 'Cu-Sn Alloy' for particular source types:
Journal articles Dissertations / Theses
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography