Dissertations / Theses on the topic 'Cu-Ni-In'
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Bochi, Gabriel 1969. "Magnetic anisotropy in epitaxial Ni/Cu (001) thin films and Cu/Ni/Cu (001) sandwiches." Thesis, Massachusetts Institute of Technology, 1995. http://hdl.handle.net/1721.1/11514.
Full textVita.
Includes bibliographical references (leaves 156-161).
by Gabriel Bochi.
Ph.D.
Ha, Kin 1966. "Magnetoelastic couplings in epitaxial Cu/Ni/Cu/Si(001)." Thesis, Massachusetts Institute of Technology, 1999. http://hdl.handle.net/1721.1/85312.
Full textZhaojiang, Li. "Hardness characteristics in electrodeposited Cu/Ni multilayer systems." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1999. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape9/PQDD_0020/MQ52687.pdf.
Full textCoin, Kévin. "The Älgliden Ni-Cu-Au sulfide deposit, Skellefte Belt, Sweden : a magmatic Ni-Cu deposit in a subduction setting." Thesis, Université Grenoble Alpes (ComUE), 2017. http://www.theses.fr/2017GREAU034/document.
Full textMost major sulfide Ni-Cu deposits originated from komatiitic or tholeiitic magmas that formed in association with mantle plumes. Their genesis involves the segregation of a immiscible sulfide liquid, reaction of the sulfide liquid with silicate melt to upgrade the sulfide in chalcophile elements, and the concentration of the sulfide liquid in economic amounts. Saturation in sulfide is commonly achieved by lowering the sulfide solubility via assimilation of siliceous wall rock or by increasing the S content by adding S-bearing materials.The Älgliden dike in the Skellefte Belt in Sweden contains currently uneconomic Ni-Cu sulfide mineralization. The Älgliden mineralization is atypical insofar as it contains a significant amount of Au, has a low Ni/Cu ratio and formed in a subduction-related geodynamic setting. The host intrusion intrudes sulfide-bearing Cu-Au porphyry mineralization which led to the suggestion that the Älgliden Ni-Cu-Au mineralization was linked to the assimilation of sulfide-bearing wall rocks.The goals of this research project were to investigate the ore forming processes of the Älgliden mineralization and its ore potential, as well as to improve our understanding of the genesis of Ni-Cu deposits in subduction zones. The work is based on a petrological study of the ore and its host rocks, determination of mineral compositions, analyses of major and trace elements in bulk rocks, and sulfur isotope analyses. This was supported by the Boliden company which owns the deposit.The dike is composed mainly of olivine norites with minor leucogabbros. Bulk rock compositions, magmatic textures and mineral compositions suggest that the olivine norites formed by accumulation of olivine and that the leucogabbros represent residual melts with or without cumulus plagioclase ± orthopyroxene. The norites are interpreted to form by one or two injections of an olivine-rich crystal mush and subsequent fractional crystallization. The parental melt of the Älgliden rocks was a hydrous and evolved basalt estimated to contain ≈6 wt.% MgO.The sulfide ore is mainly disseminated throughout the whole Älgliden intrusion. Some weak ore concentrations occur as network to vein and massive sulfides that are spatially associated with the leucogabbros and wallrock xenoliths. The association between the leucogabbros and the concentrations of sulfide, their low ore grade and Ni/Cu ratio suggest that the sulfide segregated late in the differentiation process. This timing appears unfavorable for the Älgliden mineralization because it inhibited both sulfide-silicate liquid interaction and the accumulation of sulfide.Contamination of the Älgliden magma by its wall rocks is not supported by trace element data and S isotope compositions. Instead these data indicate that the Älgliden magma was emplaced above a subduction zone where the sulfide saturation is thought to occur by reduction of the oxidized and volatile-rich magma by magnetite fractionation and/or by degassing. Positive δ34S values suggest addition of slab-derived material which is thought to be responsible for the oxidized character of the Älgliden magma.The oxidation state of arc magmas allows them to carry large amounts of S and Au. Their evolved character is also responsible for their relatively high Au contents and low Ni/Cu. Such characteristics are likely to occur in magmatic sulfide mineralization in subduction zone settings, and if sulfide liquid segregation had occurred earlier than at Älgliden the process may have produced economic sulfide deposits
Othen, Peter. "A study of copper precipitation in Fe-Cu and Fe-Cu-Ni model alloys." Thesis, University of Oxford, 1992. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.333362.
Full textLapolli, André Luis. "Estudo de interações hiperfinas em compostos intermetálicos Gd(Ni,Pd,Cu)In, Tb(Ni,Pd)In, Dy(Ni,Pd)In e Ho(Ni,Pd)In." Universidade de São Paulo, 2006. http://www.teses.usp.br/teses/disponiveis/85/85131/tde-04042012-090858/.
Full textSystematic behavior of magnetic hyperfine field (Bhf) in the intermetallic compounds Gd(Ni,Pd,Cu)In , Tb(Ni,Pd)In, Dy(Ni,Pd)In and Ho(Ni,Pd)In was studied by Perturbed Gamma-Gamma Angular Correlation spectroscopy. The measurements of Bhf were carried out at the rare earth atom and In sites using the nuclear probes 140Ce and 111In respectively. The variation of hyperfine field with temperature, in most cases, follows the Brillouin function predicted from the molecular field theory. The hyperfine field values at rare earth atom sites obtained from 140Ce probe as well as at In sites obtained from 111In probe for each series of compounds were extrapolated to zero Kelvin Bhf(T=0) from these curves. These values were compared with the values of the literature for other compounds containing the same rare earth element and all of them show a linear relationship with the ordering temperature. This indicates that the main contribution to Bhf comes from the conduction electron polarization (CEP) through Fermi contact interaction and the principal mechanism of magnetic interaction in these compounds can be described by the RKKY type interaction. The values of Bhf(T=0) for each family of intermetallic compounds RNiIn and RPdIn when plotted as a function of 4f spin projection of rare earth element also shows a linear relationship. Exceptions are the results for the compounds RNiIn obtained with 111Cd probe where a small deviation from linearity is observed. The results of the measurements carried out with the 111Cd probe were also analyzed to obtain the hyperfine parameters of the quadrupole interaction as a function of temperature for RPdIn and GdNiIn compounds. The results show that for the compound GdPdIn there might be some Gd-In disorder at high temperature.
LAPOLLI, ANDRE L. "Estudo de interações hiperfinas em compostos intermetálicos Gd(Ni, Pd, Cu)In, Tb(Ni, Pd)In, Dy(Ni, Pd)In e Ho(Ni, Pd)In." reponame:Repositório Institucional do IPEN, 2006. http://repositorio.ipen.br:8080/xmlui/handle/123456789/11371.
Full textMade available in DSpace on 2014-10-09T13:56:53Z (GMT). No. of bitstreams: 0
Tese (Doutoramento)
IPEN/T
Instituto de Pesquisas Energeticas e Nucleares - IPEN-CNEN/SP
Manrique-Arias, J. C., and M. A. Avila-Rodriguez. "Metallic impurities in the Cu-fraction of Ni targets prepared from NiCl2 solutions." Helmholtz-Zentrum Dresden - Rossendorf, 2015. http://nbn-resolving.de/urn:nbn:de:bsz:d120-qucosa-166457.
Full textInglefield, Heather Elizabeth. "Misfit accomodation in thin films of Ni/Cu as measured by magnetic anisotropy." Thesis, Massachusetts Institute of Technology, 1995. http://hdl.handle.net/1721.1/32659.
Full textIncludes bibliographical references (leaves 134-137).
by Heather Elizabeth Inglefield.
Ph.D.
MacNicol, Roger. "The forms of combination of Cu, Ni and Zn in anaerobic sewage sludge." Thesis, University of Oxford, 1989. http://ora.ox.ac.uk/objects/uuid:ddd31ded-57f0-415d-9ab7-a390b9c8632a.
Full textShueh, Yinsheng. "Intermetallic phase formation and breakdown of Mo diffusion barriers in Ni-Mo-Cu and Ni-Mo-Monel 400 diffusion triads /." The Ohio State University, 1988. http://rave.ohiolink.edu/etdc/view?acc_num=osu1487595712157707.
Full textOh, Minseok. "Growth kinetics of intermetallic phases in the Cu-Sn binary and the Cu-Ni-Sn ternary systems at low temperatures." access full-text online access from Digital Dissertation Consortium, 1994. http://libweb.cityu.edu.hk/cgi-bin/er/db/ddcdiss.pl?9513132.
Full textBicker, Matthias. "Strukturelle Änderungen in dünnen amorphen Zr-Al-Ni-Cu- und Ta-Si-N-Schichten." [S.l. : s.n.], 2000. http://deposit.ddb.de/cgi-bin/dokserv?idn=960137440.
Full textLin, Chun-Sien. "The breakdown of Ag diffusion barrier in the model Cu-Ag-Ni diffusion triple /." The Ohio State University, 1985. http://rave.ohiolink.edu/etdc/view?acc_num=osu1487259580261377.
Full textMacFarlane, Bryan Matthew. "The partitioning and distribution of Zn, Ni, Cr, and Cu in western Lake Erie sediments." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1998. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape11/PQDD_0012/MQ52473.pdf.
Full textSong, Qian. "Composition dependence of superconductivity in YBa₂(Cu₁₋ x̳Ax̳)₃O₆₊[delta] system with A = Zn, Ni /." This resource online, 1987. http://scholar.lib.vt.edu/theses/available/etd-04122010-083602/.
Full textMOTTA, MARCELO SENNA. "IN-SITU REDUCTION SYNTHESIS AND MICROSTRUCTURAL CHARACTERIZATION OF CU-AL2O3 E NI-AL2O3 NANO-COMPOSITES." PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO, 2003. http://www.maxwell.vrac.puc-rio.br/Busca_etds.php?strSecao=resultado&nrSeq=4062@1.
Full textOs compósitos Cu-Al2O3 possuem excelente resistência a recozimentos em altas temperaturas bem como altas condutividades térmica e elétrica. Uma dispersão nanométrica uniforme de partículas cerâmicas na matriz metálica confere características únicas ao material, possibilitando a sua utilização como, por exemplo, resfriadores ativos. Por outro lado, estas propriedades são essencialmente dependentes da microestrutura do material, que por sua vez, varia de acordo com o método de preparação adotado. Os principais objetivos do presente trabalho são a introdução de um novo método de síntese e a caracterização microestrutural dos nano-compósitos Cu- Al2O3 e Ni- Al2O3. Este método é dividido em dois processos, ambos combinando as características de uma rota química para a preparação de uma mistura em pó de CuO ou NiO e Al2O3, com as vantagens do processamento in-situ de materiais, através da redução preferencial com H2 do CuO ou NiO. No processo 1, o Al2O3 é formado in-situ através da adição de uma solução de Al(NO3) 3 ao pó de CuO ou NiO. No processo 2, tanto o CuO ou NiO como o Al2O3 são formados in-situ a partir de uma solução contendo os nitratos de Cu ou Ni e Al. Os estudos termodinâmicos e cinéticos apresentados mostraram que as reduções do CuO para Cu e do NiO para Ni são viáveis, mesmo em baixas temperaturas (200-400oC). Amostras de Cu- Al2O3 (0,5, 1 e 5% em peso) foram analisadas por difração de Raios-X, microscopia eletrônica de varredura (MEV), e microscopia eletrônica de transmissão (MET) convencional, de alta resolução e de varredura. Os cristais de Cu da matriz variam de 50 a 250/300 nm para o Cu- Al2O3 (5% em peso)-processo 1 e possuem um tamanho médio de 500/600 nm para os compósitos contendo 0,5 e 1% em peso de Al2O3, também preparados pelo processo 1. O diâmetro das partículas de Al2O3 varia de 10 a 60/70 nm. Os nano- compósitos Cu- Al2O3 (0,5, 1 e 5 % em peso)-processo 2 possuem uma microestrutura formada por uma distribuição homogênea de Cu, Al e O. Os nano-compósitos preparados por ambos os processos apresentaram a formação de uma terceira fase, que pode ser CuAlO2 ou CuAl2O4. Nano-compósitos Ni- Al2O3 (0,5% em peso)-processo 2 também foram obtidos com sucesso, apresentando uma microestrutura similar a do Cu- Al2O3. Ligas Cu-Ni também foram obtidas em baixas temperaturas (400oC) através da redução por H2 de uma mistura de CuO-NiO preparada através do processo 2.
Cu-Al2O3 composites are reported to have excellent resistance to high temperature annealing as well as high thermal and electrical conductivities. The uniform dispersion of nanometric ceramic particles in the metallic matrix provides unique characteristics to the material, enabling their application in high temperature and corrosive atmospheres. The special physico-chemical and mechanical properties are essentially dependent on the material`s microstructure, which in turn, will vary according to the composite preparation method. The main objectives of the present work are the introduction of a novel method for the preparation of Cu-Al2O3, Ni-Al2O3 nano- scale composites and their characterization. The preparation method is divided into two processes. In process 1, Al2O3 is formed in-situ by the addition of Al (NO3)3 solution to CuO powder, while in process 2, CuO or NiO and Al2O3 are formed in-situ from a water solution containing the dissolved nitrates of Cu or Ni and Al. Both the processes combine the advantages of chemical routes with that of in-situ processing, through the preferential H2 reduction of the CuO or NiO, contained in the mixture. The thermodynamics and kinetics studies presented have shown that the reductions of CuO to Cu and NiO to Ni are viable at a very low temperature (200-450oC). The Cu-Al2O3 (0.5, 1 and 5 wt%) specimens thus prepared have been examined by X-ray diffraction, scanning electron microscopy (SEM) and conventional, high resolution and scanning transmission electron microscopy (CTEM, HRTEM and STEM). The Cu crystals range from 50 to 300 nm for the Cu-Al2O3 (5 wt%)-process 1 and have an average grain size of 500/600 nm for the Cu-Al2O3 (0,5 and 1 wt%)-process 1, while the Al2O3 particles range from 10 to 60/70 nm in all cases. The Cu- Al2O3 (0.5, 1 and 5 %Peso)-process 2 composites are composed of a homogeneous dispersion of Cu, Al and O. Composites prepared by both the processes, have exhibited the formation of a third phase, which is suggested to be CuAlO2 and/or CuAl2O4. The Ni-Al2O3 (0.5 wt%) nano-scale composites have also been successfully prepared through process 2 and their characterization revealed a microstructure similar to that of the Cu-Al2O3 samples. By applying process 2, it has also been possible to co-form CuO and NiO. This co-formed oxide mixture has been reduced in H2 atmosphere at a low temperature of 400oC to produce a homogeneous nano-powder of a Cu-Ni (50 at%) alloy.
Olivier, Louis. "Nuclear structure in the vicinity of ⁷⁸Ni : in-beam gamma-ray spectroscopy of ⁷⁹Cu through proton knockout." Thesis, Université Paris-Saclay (ComUE), 2017. http://www.theses.fr/2017SACLS212/document.
Full textThe nuclear shell structure is evolving when going into more and more exotic regions of the chart of isotopes and consequently, the conventional magic numbers (8, 20, 28, 50, 82, 126) may disappear far from stability, while some new magic numbers can appear. The ⁷⁸Ni nucleus, with its 28 protons and 50 neutrons, is one of the most exotic supposedly doubly-magic nuclei, making it of great interest. The evolution of the Z = 28 gap towards N = 50 can be studied by probing the single-particle character of the states in the copper isotopic chain, having one proton more than nickel. This work focuses on Cu, at N = 50.In the aim of performing the first in-beam gamma-ray spectroscopy of nuclei in the close vicinity of ⁷⁸Ni, an experiment was carried out at the Radioactive Isotope Beam Factory of RIKEN, in Japan. The ⁷⁹Cu nucleus was produced through the (p,2p) knockout reaction from a ⁸⁰Zn beam sent on the MINOS device, a liquid-hydrogen target coupled to a TPC used for proton tracking. The subsequent gamma-decay was detected in-beam with the DALI2 scintillator array. The BigRIPS and ZeroDegree spectrometers allowed an unambiguous identification of the incoming and outgoing nuclei, respectively.An analysis procedure based on gamma-gamma coincidences permitted to build the first level scheme of ⁷⁹Cu, with levels up to 4.6 MeV, and the results were compared to Monte-Carlo shell-model calculations for interpretation. The conclusions show that the ⁷⁹Cu nucleus is well described in terms of a valence proton outside a closed ⁷⁸Ni core, implying the magic character of the latter
Yu, Zhiqiang. "Transient Studies of Ni-, Cu-Based Electrocatalysts in CH4 Solid Oxide Fuel Cell." Akron, OH : University of Akron, 2007. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=akron1194625466.
Full text"December, 2007." Title from electronic dissertation title page (viewed 03/12/2008) Advisor, Steven S. C. Chuang; Committee members, Lu-Kwang Ju, Edward Evans, W. B. Arbuckle, Stephen Z. D. Cheng; Department Chair, Lu-Kwang Ju; Dean of the College, George K. Haritos; Dean of the Graduate School, George R. Newkome. Includes bibliographical references.
Kämäräinen, A. (Anne). "GIS-based spatial assessment of Au, Ni and Cu-Zn exploration conducted in Central Finnish Lapland." Master's thesis, University of Oulu, 2017. http://urn.fi/URN:NBN:fi:oulu-201705181953.
Full textCarpenter, John Stuart. "Estimates of Interfacial Properties in Cu/Ni Multilayer Thin Films using Hardness and Internal Stress Data." The Ohio State University, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=osu1285006915.
Full textNigam, Mohit. "The Stopping of Energetic Si, P and S Ions in Ni, Cu, Ge and GaAs Targets." Thesis, University of North Texas, 2001. https://digital.library.unt.edu/ark:/67531/metadc3004/.
Full textKnight, Robert. "The primary magmatic concentration and secondary remobilisation of platinum-group elements in Ni-Cu sulphide ores." Thesis, Cardiff University, 2014. http://orca.cf.ac.uk/65680/.
Full textUddin, Miah Md Ramiz. "Ecotoxicity assessment of Zn, Cu and Ni in contrasting soils using test organisms of different ecological niches." Thesis, University of Aberdeen, 2002. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.248590.
Full textJohannesen, A. (Anne). "Orthomagmatic Ni-Cu mineralisation in the Palaeoproterozoic Johan Petersen Intrusive Centre, Ammassalik Intrusive Complex, South-East Greenland." Master's thesis, University of Oulu, 2016. http://urn.fi/URN:NBN:fi:oulu-201604191511.
Full textBoros, Kristina. "Methodologies for Estimating Bioaccessibility of Six Metals in Household Dust: Zn, Pb, Cd, Cu, Ni, and Cr." Thesis, Université d'Ottawa / University of Ottawa, 2015. http://hdl.handle.net/10393/32446.
Full textNi, Ni. "Structural / magnetic phase transitions and superconductivity in Ba(Fe₁[subscript -x]TM[subscript x])₂As₂ (TM=Co, Ni, Cu, Co / Cu, Rh and Pd) single crystals." [Ames, Iowa : Iowa State University], 2009. http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:3389132.
Full textKhoda, Karami Mina, and Ali Kohanzadehmaranlou. "Influence of Ni, Mn, and Cu on the nitride formation in 20Cr alloys relevant to modern stainless steels." Thesis, KTH, Materialvetenskap, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-118092.
Full textHuyan, Fei. "A study of "475°C embrittlement" in Fe-20Cr and Fe-20Cr-X (X=Ni, Cu, Mn) alloys." Thesis, KTH, Metallografi, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-118155.
Full textSong, Xieyan, and 宋謝炎. "Geochemistry of permian flood basalts and related ni-cu-(pge) sulfide-bearing sills in Yangliuping, Sichuan province, China." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2004. http://hub.hku.hk/bib/B3124595X.
Full textJohnson, Lawrence H. "Complexes of Ni, Pd, Pt, Cu, Ag, and Au in liquid ammonia : a vibrational spectroscopic and electrolytic investigation." Thesis, University of Leeds, 1989. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.329547.
Full textViljoen, Willemien. "Phase relations in the system Cu-Fe-Ni-S and their application to the slow cooling of PGE matte." Pretoria : [s.n.], 2005. http://upetd.up.ac.za/thesis/available/etd-10132005-100921/.
Full textSmit, Danie Strydom. "The leaching behaviour of a Ni-Cu-Co sulphide ore in an oxidative pressure-acid medium / Danie Strydom Smit." Thesis, Potchefstroom University for Christian Higher Education, 2001. http://hdl.handle.net/10394/9626.
Full textThesis (MIng (Chemical Engineering))--Potchefstroom University for Christian Higher Education, 2001
Piercey, Stephen John. "An integrated study of magmatism, magmatic Ni-Cu sulphide mineralization and metallogeny in the Umiakoviarusek Lake Region, Labrador, Canada /." Internet access available to MUN users only, 1998. http://collections.mun.ca/u?/theses,32157.
Full textMayer, Christoph. "Ag- und Ag-Cu-Lagerstätten in der Region Atacama, Nordchile : lagerstättenkundliche und geochemische Untersuchungen am Beispiel der Distrikte Chañarcillo (Ag-[Co-Ni-As]) und El Jardín (Ag-Cu) /." Heidelberg : [Ruprecht-Karls-Universität], 1988. http://catalogue.bnf.fr/ark:/12148/cb374298971.
Full textStewart, A. Robin. "Effect of a metal mixture (Cu, Zn, Pb, and Ni) on the bioavailability and bioaccumulation of cadmium in natural systems." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1998. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp03/NQ32461.pdf.
Full textDey, Swagata. "Exploring “Metal to Metal” Charge Transfer Process in AWO4 and AMoO4 type compounds (A= Mn, Fe, Co, Ni, Cu, Zn)." The Ohio State University, 2014. http://rave.ohiolink.edu/etdc/view?acc_num=osu1377006312.
Full textLAVRADAS, RAQUEL TEIXEIRA. "DETERMINATION OF METALS (CU, FE, ZN, PB, CD AND NI) IN TISSUES OF MARINE ORGANISMS FROM ILHA GRANDE BAY, RJ, BRAZIL." PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO, 2012. http://www.maxwell.vrac.puc-rio.br/Busca_etds.php?strSecao=resultado&nrSeq=20536@1.
Full textCOORDENAÇÃO DE APERFEIÇOAMENTO DO PESSOAL DE ENSINO SUPERIOR
Neste estudo, foram determinadas as concentrações de Cu, Fe, Zn, Cd, Pb e Ni no tecido muscular e fígado de três espécies de peixe (Mugil liza – tainha, iliófago; Micropogonias furnieri – corvina, carnívoro e Trichiurus lepturus – peixe espada, piscívoro), no tecido muscular de uma espécie de camarão (Farfantepenaeus brasiliensis – camarão rosa, onívoro) e também, no tecido muscular, vísceras e ovos de uma espécie de siri (Callinectes spp. – siri azul, onívoro) coletados na Baía da Ilha Grande. As concentrações dos elementos foram determinadas por espectrometria de massa com fonte de plasma indutivamente acoplado (ICP-MS). A metodologia analítica apresentou ótima exatidão e precisão quando comparada com amostras certificadas (DORM-3 e TORT-2). As concentrações de Cu, Zn, Cd, Ni e Pb apresentaram-se abaixo dos limites estabelecidos pela legislação brasileira e americana para a ingestão humana de pescado. As maiores concentrações de Cu, Fe, Zn, Cd, Ni e Pb foram observadas nos crustáceos. Nos peixes, as maiores concentrações dos elementos analisados foram observadas no fígado, e no siri, nas vísceras. O sexo dos indivíduos não influenciou no acúmulo dos elementos para os peixes, porém influenciou na acumulação de Cu, Fe, Zn, Cd e Ni no siri. Nos peixes, a maioria dos elementos não apresentou correlação com o comprimento dos indivíduos, com exceção do Pb, que apresentou correlação negativa na tainha e na corvina, e do cádmio, que apresentou correlação negativa na corvina. Nos crustáceos, alguns elementos também apresentaram correlação negativa com estes parâmetros, indicando que, tanto nos peixes quanto nos crustáceos, estes elementos não foram acumulados ao longo do crescimento. As concentrações encontradas foram diferentes nas estações seca e chuvosa.
In this study the concentrations of Cu, Fe, Zn, Cd, Pb and Ni were determined in muscle tissue and liver of three fish species (Mugil liza – mullet, illiophagus; Micropogonias furnieri – croaker, carnivorous, and Trichiurus lepturus – cutlassfish, piscivore), in the muscle tissue of a shrimp species (Farfantepenaeus brasiliensis – pink shrimp, omnivore) and in muscle tissue, entrails and eggs of a soft crab (Callinectes spp. – siri azul, omnivore) sampled from the Ilha Grande Bay. The concentrations of the elements were determined by inductively coupled plasma mass spectrometry (ICP-MS). The methodology showed good accuracy and precision when tested with certified reference materials (DORM-3 and TORT-2). The concentrations of Cu, Zn, Cd, Ni and Pb were below the limits established by the Brazilian and American legislation for human ingestion of fish products. The highest concentrations of Cu, Fe, Zn, Pb, Cd and Ni were found in the crustacean samples. In fish, the highest concentrations were observed in the liver and, in the soft crab samples, in the entrails. Sex did not influence element accumulation in fish, but influenced the accumulation of Cu, Fe, Zn, Cd and Ni in the soft crab. In fish, most elements did not show any correlation to length and weight, with the exception of Pb, which showed negative correlations in mullet and croaker and Cd which showed negative correlations in croaker. In crustaceans, some elements also presented negative correlations to these parameters, indicating that both in fish and crustaceans these elements are not accumulated during organism growth. The concentrations of the elements analyzed were statistically different in the dry and rainy seasons.
Khan, Muhammad Yaqoob [Verfasser]. "Probing the antiferromagnetism of NixMn100−x with ferromagnetic Ni in exchange-biased bilayers and trilayers on Cu3Au(001) / Muhammad Yaqoob Khan." Berlin : Freie Universität Berlin, 2012. http://d-nb.info/1027816177/34.
Full textLamonier, Carole. "Caractérisations in situ des catalyseurs d'hydrogénation Ce-Cu-0, Ce-Ni-O et Al-(Ce)-Ni-O à différents stades de leur élaboration : influence des interactions dans les solides sur l'incorporation d'hydrogène." Lille 1, 1994. http://www.theses.fr/1994LIL10087.
Full textPasturel, Mathieu. "Modification par hydruration des propriétés structurales et physiques des intermétalliques CeTX (T = Mn, Ni, Cu ; X = Al, Ga, In, Si, Ge, Sn)." Phd thesis, Université Sciences et Technologies - Bordeaux I, 2004. http://tel.archives-ouvertes.fr/tel-00010063.
Full textEverest, John Owen. "The relationship of Cu-Ni-PGE veins in the Levack Gneiss Complex to contact magmatic ore at the McCreedy West Mine, Sudbury." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1999. http://www.collectionscanada.ca/obj/s4/f2/dsk1/tape8/PQDD_0016/MQ48590.pdf.
Full textLiu, Shun Cai, and 劉順財. "Electromigration tests in Cu/SnAg/Ni/Cu Flip Chip solder joints and Cu/SnAg/Cu microbumps." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/95944968763845461265.
Full text國立交通大學
材料科學與工程學系所
103
Due to the growing demands for high performance, small form factor and multi-functions in microelectronic packaging for different types of portable electronic devices, 3D stacking is an important issue nowadays in ICs industry. The first part of this study was the electromigration test using two different bump heights (15 μm and 30 μm) of Cu/SnAg/Ni/Cu flip-chip samples. We can investigate the effect of the bump height effect of failure mode in electromigration. The current density of the experimental conditions is 1.33x104 A/cm2, 1.45x104 A/cm2 and 1.57x104 A/cm2, we can observe the failure mode is void formation, when Ni UBM at the cathode side. When the anode with Cu UBM, we also found serious copper dissolution. The second part is electromigration test of Cu/8 μm SnAg/Cu microbumps. The test temperatures were 135 °C, 150 °C and 165 °C on hot plates. We found some sample had early failure, and further explored the reasons for the failure, then we can avoid the early failure. The third part is about Cu/8 μm SnAg/Cu microbumps reflowing at different times. The microbumps were reflowed on a 260 °C hot plate for 0, 5, 10, 20, and 40 min to investigate the variation of Ag concentration in the residual SnAg solder and the morphology of Ag3Sn precipitations.
Hsu, Yu-Ching, and 許玉青. "Elemental Diffusion Behavior in the Cu/Electroless Ni and Cu/Electroless Ni/Sn-37Pb Solder Joints During Annealing." Thesis, 2002. http://ndltd.ncl.edu.tw/handle/46771358765160335385.
Full text國立清華大學
材料科學工程學系
90
Cu is widely used in today's electronics packaging, and electroless Ni-P (EN)/Cu is popularly adopted in the under bump metallurgy (UBM) for flip chip application. The diffusion behavior of Cu in the metallization layer is an important issue. In this study, a joint in the Cu/EN/Pb-Sn structure with different EN thickness annealed at 240oC were employed to investigate the diffusion behavior of Cu for various annealing time. The concentration-distance profiles at the interface of EN/solders were evaluated by EPMA (Electron Probe Microanalyzer). The interdiffusion flux and effective interdiffusion coefficient of species Cu, Ni and P were evaluated with the aid of corresponding concentration profile. Ni3P precipitated layer and Ni3Sn4 intermetallic compound were observed near the interface of EN and Sn-Pb solder during annealing. According to detailed quantitative analysis by EPMA, the concentration of Cu in Ni3P and Ni3Sn4 intermetallic compound was around 0.5at% and 1.0at%, respectively, for the Cu/EN(7.5 m)/Sn-Pb solder joint, while it was 0.2-0.3at% and 0.8-0.9at%, respectively, for the Cu/EN(15 m)/Sn-Pb solder joint. With respect to the evaluated Cu concentration variation across the joint assembly, Ni3P can be regarded as diffusion barriers to prevent extra Cu diffusion through the EN layer to the solder. Another isothermal interdiffusion experiments were also carried out at 240oC for different time with solid-solid diffusion couples assembled in the Cu/electroless-Ni (Ni-10wt%P) and Cu/electroless Ni (Ni-10wt%P)/Sn-37Pb joint. The diffusion structure and concentration profile were examined by SEM and EPMA analysis. The interdiffusion fluxes of Cu, Ni and P were calculated from the concentration profile with the aid of Matano plane evaluation. The values of , and decreased with increasing annealing time. The average effective interdiffusion coefficients in the order of 10-14 cm2/s were also evaluated within the diffusion zone. Cu dissolved in intermetallic compound (IMC) Ni3Sn4 and Ni3P precipitate after annealing in Cu/electroless Ni/Sn-37Pb system was about 0.25 at% and 0.5 at%. For the short period of annealing, it appears that the presence of EN with Sn-Pb soldering reaction assisted the diffusion of Cu through the EN layer time.
Mei-JunWang and 王玫珺. "Effects of Ni UBM and Ni alloying on Ga-based Cu-to-Cu bonding in 3D IC packaging." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/t8j9t7.
Full textLi, Quei-Pin, and 李魁斌. "Cross-Interaction of Ni and Cu in Sn." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/02562079100995322371.
Full text國立中央大學
化學工程與材料工程研究所
93
In a real solder joint, the solder is always sandwiches between two metals. And the Ni/solder/Cu combination is one of the most common one in microelectronics devices. The objective of this study is to investigate whether the cross-interaction will occur between the interface of solder/Cu and Ni/solder. In fact, it is reported that the two interfaces of Ni/solder/Cu joint would interact after reflow. Therefore, it is known that the dissolved metal results in the system become complex. As the result, the Ni/Sn/Cu diffusion couples were prepared by electroplating in this study to investigate the cross-interaction of Cu and Ni in solder joint only in solid/solid reaction. Experiments were carried out at 200 ℃ for 15 minutes. It was found that Cu6Sn5 compound existed at both Ni/Sn and Cu/Sn interface. Basing on the result, we can say that the cross-interaction of Ni and Cu in a solder joint occurred very quickly at 200 ℃thermal aging. After long term thermal aging, the reaction product didn’t change at both Ni/Sn and Cu/Sn interface. There is(Cu1-xNix)6Sn5 at Ni/Sn interface and Cu6Sn5、Cu3Sn at Sn/Cu interface.Beside it, we found that the microstructure of these reaction product is different from Sn/Cu and Sn/Ni diffusion couple. In other words, the morphology of IMC is largger variation than Sn/Cu and Sn/Ni diffusion couple. In thermodynamic kinetics, it has been show that the formation of of (Cu1-xNix)6Sn5 over the Ni layer can reduce the Ni consumption rate. At the same time, the Cu consumption rate of the opposite side was accelerated.
Huang, T. A., and 黃田安. "Magnetoresistance in Co-Sputtered Cu-Ni-Fe Films." Thesis, 1997. http://ndltd.ncl.edu.tw/handle/43050901531354990396.
Full text義守大學
材料科學與工程研究所
85
Cu-Ni-Fe films have been grown on Si(100) substrates by a d.c. magnetron cosputtering. A strong composition dependence of the magnetoresistance behavior is found in these Cu-Ni-Fe films. The giant magnetoresistance contribution dominates the magnetoresistance behavior in the films with Cu content higher than 50%. However, the anisotropic magnetoresistance effect tends to icnrease as the Cu content decreases. For example, the Cu50Ni25Fe25 films consists of two components of magnetoresistance with anisotropic magnetoresistance at low fields and giant magnetoresistance extended to higher fields. The ARM effect is believed to be correlated with the electron scattering from the ferromagnetic (Ni, Fe)-rich phase. The very large saturation field (>6T) in the MR curve and the positive temperature dependence of MR ratio suggest that the observed GMR effect may come from the interfacial spin-dependent scattering as well as scattering due to magnetic fluctuations such as very fine superparamagnetic particles and/or ferromagnetic area around the (Ni, Fe)-rich phase. After annealing, the magnetizeor and MR ratio of films is increased, which is believe to be a result of the modification of microstructure.
Chi, Shang-Wei, and 紀尚緯. "Interfacial Reaction in Electroplated Cu/Ni/Sn System." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/87495446472521833248.
Full text國立中興大學
化學工程學系所
105
In this study, the electroplating copper substrate and tin, electroplating copper substrate electroplating nickel and tin two kinds of reaction comparison, and in the copper electroplating solution by adding the additive SPS for further comparison. The experimental results show that Cu / Sn mainly produces IMC as Cu6Sn5 in the reflow soldering reaction, and Ni(Ni, Cu)3Sn4 is formed after electroplating the Ni layer. No holes are present in the interface. The presence of SPS does not affect the results. In the heat treatment at 150°C, Cu / Sn forms Cu3Sn in addition to Cu6Sn5, and many pores are formed in the interface of IMC. The reaction is accelerated at 200 ° C and becomes a layered structure with more pores. Using additive SPS are produced no holes at 150 ° C or 200 ° C after the copper plating solution. Copper substrate after electroplating nickel layer in two kinds of heat treatment are no holes and layered structure, the use of additives SPS in copper plating solution does not affect the results. If extend the heat treatment time, nickel layer reaction will not appear holes immediately in the interface. The experimental results show that electroplating copper substrate electroplating nickel can effectively prevent the hole in IMC interface and can be used with the additive SPS without affecting the results, and elongation the electroplating nickel reaction time, will not be observed holes are produced in the interface.
Huang, Pin-Ju, and 黃品儒. "Interfacial Reactions in the Cu/Sn/In/Ni/Cu Multilayers Structure in 3D IC Packaging." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/19362648957929850039.
Full text國立臺灣科技大學
材料科學與工程系
100
With the development of technology, the 3-D IC packaging tends to replace the traditional 2-D packaging technology in the future. Flip chip (FC) technique is one of the methods in 3-D IC packaging. Recently, the copper pillar bump was used to replace tin-lead bumps for the reason that it could provide fine pitch without bump bridging and smaller amount of solder is needed. In this study, the Cu pillar/Sn and In/Ni/Cu multilayer structure were fabricated by the electroplating method. In the solid-liquid inter-diffusion (SLID) bonding process, Sn-In was used as a bonding layer to effectively reduce the soldering temperature. We hope this Cu pillar/Sn/In/Ni/Cu multilayer structure could act as the solder to replace conventional lead-free solder and be applied in 3-D IC packaging. The results indicate (Cu,Ni)6(Sn,In)5 phase were formed on the Cu pillar side in different temperature systems and the rough layer, which can be found in the middle, was ? phase. When the reflowing temperature was 180 oC, the intermetallic compounds (IMCs) formed from Cu pillar side to Ni side were Cu pillar/(Cu,Ni)6(Sn,In)5 /?? Ni. After aging for 10 h, the (Cu,Ni)6(Sn,In)5 and (Cu,Ni)(In,Sn)2 phases were formed at interface close to the Ni side. In addition, the IMCs didn’t change and the area of ? phase was reduced when we increase aging time. In the other system, couple was reflowed at 200oC, the IMCs formed from Cu pillar side to Ni side were Cu pillar/(Cu,Ni)6(Sn,In)5/??}(Cu,Ni)6(Sn,In)5/Ni. The (Cu,Ni)6(Sn,In)5 phase was formed more rapidly than 180 oC system on the Ni side. With longer aging time, the (Cu,Ni)(In,Sn)2 was formed at the interface close to the Ni side and the ??nphase was consumed completely. When aging for 300 h, the IMCs formed from Cu pillar side to Ni side were Cu pillar/ (Cu,Ni)6(Sn,In)5/ (Cu,Ni)(In,Sn)2/Ni, which was significantly different compared to the as-reflowed.
Zhang, Yong, and Yi Li. "Glass Forming Ability in Pr-(Cu, Ni)-Al Alloys." 2002. http://hdl.handle.net/1721.1/3974.
Full textSingapore-MIT Alliance (SMA)