Academic literature on the topic 'Cu micropillar array'

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Journal articles on the topic "Cu micropillar array"

1

Qiao, Zhen, Arben Kojtari, Jacob Babinec, and Hai-Feng Ji. "Synthesis of A Silver Nanowire Array on Cu-BTC MOF Micropillars." Sci 1, no. 1 (November 30, 2018): 4. http://dx.doi.org/10.3390/sci1010004.

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An array of Ag nanowires has been prepared from a facile, templated approach on Cu(BTC) (1,3,5-benzenetricarboxylic acid) metal organic framework (MOF) micropillars. The Ag-deposited scaffolding material may be used to prepare electronic or optoelectronic devices for various applications.
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2

Qiao, Zhen, Arben Kojtari, Jacob Babinec, and Hai-Feng Ji. "Synthesis of A Silver Nanowire Array on Cu-BTC MOF Micropillars." Sci 1, no. 1 (November 30, 2018): 4. http://dx.doi.org/10.3390/sci1010004.v1.

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Abstract:
An array of Ag nanowires has been prepared from a facile, templated approach on Cu(BTC) (1,3,5-benzenetricarboxylic acid) metal organic framework (MOF) micropillars. The Ag-deposited scaffolding material may be used to prepare electronic or optoelectronic devices for various applications.
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3

Gómez-Cortés, J. F., M. L. Nó, C. Jiao, G. A. López, and J. San Juan. "Evaluation of the Superelastic Behavior at Nano-scale on Long-term Cycling in Cu-Al-Ni Micropillars Array." Materials Today: Proceedings 2 (2015): S887—S890. http://dx.doi.org/10.1016/j.matpr.2015.07.424.

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4

Zhen, Qiao, Kojtari Arben, Babinec Jacob, and Ji Hai-Feng. "Synthesis of a Silver Nanowire Array on Cu-BTC MOF Micropillars." Aspects of Nanotechnology 3, no. 1 (June 21, 2021). http://dx.doi.org/10.36959/758/543.

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5

Zhu, Qing, Bucheng Li, Shangbin Li, Guan Luo, Baohui Zheng, and Junping Zhang. "Superamphiphobic Cu/CuO Micropillar Arrays with High Repellency Towards Liquids of Extremely High Viscosity and Low Surface Tension." Scientific Reports 9, no. 1 (January 24, 2019). http://dx.doi.org/10.1038/s41598-018-37368-y.

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Conference papers on the topic "Cu micropillar array"

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Rojo, Gerardo, and Jeff Darabi. "Copper-Carbon Nanotube Micropillars for Passive Thermal Management of High Heat Flux Electronic Devices." In ASME 2020 Heat Transfer Summer Conference collocated with the ASME 2020 Fluids Engineering Division Summer Meeting and the ASME 2020 18th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/ht2020-8998.

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Abstract Miniaturization of electronic products and a consequent rapid increase in power density of advanced microprocessors and electronic components have created a need for improved cooling techniques to efficiently remove heat from such devices. Traditional air-cooled heat sinks have been utilized for several decades as the most cost-effective cooling technique for electronic cooling applications. However, the existing thermal management solutions are unable to maintain the temperature of the next generation of complex electronic systems within acceptable limits without adding considerable weight and complexity. This paper reports a microstructured wick for application in passive thermal management systems such as heat pipes and vapor chambers. The wick structure consists of mushroom-like composite copper-carbon nanotubes (Cu-CNT) micropillars. The small spacing between micropillar heads provides a higher capillary pressure whereas the large spacing between the base of micropillars provides a higher permeability for liquid flow. The micropillar array was fabricated on a copper substrate using an electroplating technique. The micropillar array was then tested in a controlled environment to experimentally measure its thermal performance under several operating conditions. A heat removal capability of 80 W/cm2 was demonstrated at a wall superheat of 15° C. In addition, a computational study was performed using ANSYS Fluent to predict the thermal performance of the micropillar array. Model predictions were compared with the experimental results and good agreement was obtained.
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