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Journal articles on the topic 'Cu CODH'

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Published: 9 March 2023

Last updated: 10 March 2023

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1

Hollingsworth, Thilini S., Ryan L. Hollingsworth, Richard L. Lord, and Stanislav Groysman. "Cooperative bimetallic reactivity of a heterodinuclear molybdenum–copper model of Mo–Cu CODH." Dalton Transactions 47, no. 30 (2018): 10017–24. http://dx.doi.org/10.1039/c8dt02323a.

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2

Ghosh, Dibbendu, Soumen Sinhababu, Bernard D. Santarsiero, and Neal P. Mankad. "A W/Cu Synthetic Model for the Mo/Cu Cofactor of Aerobic CODH Indicates That Biochemical CO Oxidation Requires a Frustrated Lewis Acid/Base Pair." Journal of the American Chemical Society 142, no. 29 (June 29, 2020): 12635–42. http://dx.doi.org/10.1021/jacs.0c03343.

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3

Reginald, Stacy Simai, Michael Etzerodt, Deby Fapyane, and In Seop Chang. "Functional Expression of a Mo–Cu-Dependent Carbon Monoxide Dehydrogenase (CODH) and Its Use as a Dissolved CO Bio-microsensor." ACS Sensors 6, no. 7 (July 12, 2021): 2772–82. http://dx.doi.org/10.1021/acssensors.1c01243.

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4

Swist, Teresa, and Liam Magee. "Academic Publishing and its Digital Binds: Beyond the Paywall towards Ethical Executions of Code." Culture Unbound 9, no. 3 (February 1, 2018): 240–59. http://dx.doi.org/10.3384/cu.2000.1525.1793240.

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In this article we explore various constraints and potentials of academic publishing in the digital age. Advancement of digital platforms and their expansive reach amplify the underlying tensions of institutional and scholarly change. A key affordance of these platforms is that of speed: rapidly distributing the outputs of a precaritised profession and responding to pressures to publish as well as the profit motive of publishers. On the one hand, these systems make possible alternative modes of contributory content and peer-production for supporting the commons. On the other, they turn all too readily into privatising devices for contracting labour and profit in the corporate sector and, within the academy, for accentuating subtle power effects. Drawing upon platform studies and integrating insights from political philosophy and property law, our article seeks to problematise neat binaries of possession and dispossession associated with the sector. We examine in particular how co-existing and emergent socio-technical circuits—what we term digital binds—modulate the political economy of academic publishing on a number of scales. These entangled binds constrain but also indicate mechanisms for opening up new possibilities. We introduce three ethical executions of code towards this end: dissuading, detouring, and disrupting. Together, these mechanisms show how mutually beneficial boundaries can be drawn for designing otherwise: by blocking dominant systems and bargaining for fairer practices; exploring sanctioned and unsanctioned systems which offer more diverse publishing pathways; and, disrupting systemic processes and profits towards more inclusive and equitable conditions.

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5

Narrain, Siddharth. "Social Media, Violence and the Law: ’Objectionable Material’ and the Changing Countours of Hate Speech Regulation in India." Culture Unbound 10, no. 3 (February 13, 2019): 388–404. http://dx.doi.org/10.3384/cu.2000.1525.2018103388.

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With the advent of the internet and increasing circulation of hate speech, and material that has been linked to public order disturbances, there has been a shift in the legal discourse around hate speech. What has emerged, especially post the striking down of section 66A of the Information Technology Act, are categories such as ‘objectionable’, ‘provocative’ content. The focus has shifted from the content itself, what it says, and the intention of the author, to being able to pre-empt the circulation of such material. Law is increasingly invoked to prevent speech (through prior restraint) rather than post facto investigation and prosecutions. This in turn has given rise to a range of institutional mechanisms such as monitoring labs that are now part of policing practice. Additionally, civil society organizations are now collaborating with police to help trigger mechanisms to take content off internet platforms. Increasingly it is through keywords and algorithmic searches that the category of hate speech has been defined rather than traditional legal doctrine. In the words of Lawrence Lessig, code plays the role of law, and the architecture of the internet becomes policy. This paper will examine the issues outlined above relying heavily on a series of interviews with lawyers, policy analysts, journalists, academics, civil society activists, and police personnel conducted in Delhi, Bengaluru, Mumbai and Pune.

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6

Chen, L., and H. Sawada. "Characterization of sub-picosecond laser-produced fast electrons by modeling angularly resolved bremsstrahlung measurements with 3D hybrid particle-in-cell code." Physics of Plasmas 29, no. 9 (September 2022): 093104. http://dx.doi.org/10.1063/5.0089464.

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Hard x-rays produced by intense laser-produced fast electrons interacting with solids are a vital source for producing radiographs of high-density objects and implosion cores for inertial confinement fusion. Accurate calculation of hard x-ray sources requires a three-dimensional (3D) simulation geometry that fully models the electron transport dynamics, including electron recirculation and the generation of absolute photon yields. To date, 3D simulations of laser-produced bremsstrahlung photons over tens of picoseconds and code benchmarking have not been performed definitively. In this study, we characterize sub-picosecond laser-produced fast electrons by modeling angularly resolved bremsstrahlung measurements for refluxing and non-refluxing targets using the 3D hybrid particle-in-cell (PIC), Large Scale Plasma code. Bremsstrahlung radiation and escaped electron data were obtained by focusing a 50-TW Leopard laser (15 J, 0.35 ps, 2 × 1019 W/cm2) on a 100- μm-thick Cu foil and a Cu with a large plastic backing (Cu–CH target). Data for both the Cu and Cu–CH targets were reproduced for simulations with a given set of electron parameters. Comparison of the simulations revealed that the hard x-ray emission from the Cu target was significantly longer in duration than that from the Cu–CH target. The benchmarked hybrid PIC code could prove to be a powerful tool in the design and optimization of time- and angular-dependent bremsstrahlung sources for flash x-ray and gamma-ray radiography.

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7

Khan, M. Junaid Iqbal, Mubashra Shakeel, Iqra Majeed, Abid Latif, Javed Ahmad, Hamid Ullah, M. Fakhar-e-Alam, Zartasha Mustansar, Mazia Asghar, and Shaima A. M. Abdelmohsen. "Exploring structural, electronic, optical, magnetic, and thermoelectric properties of Pt doped and Pt-Cu/Au co-doped GaN." Physica Scripta 97, no. 4 (March 15, 2022): 045809. http://dx.doi.org/10.1088/1402-4896/ac5b43.

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Abstract We present a computational research on investigating the structural, electronic, optical, magnetic, and thermoelectric properties of Pt doped and Pt-Cu/Au co-doped GaN using the Wien2k code. The PBE-GGA approximation is employed in Wien2k code using density functional theory. Study of electronic properties reveals that the d-states of Pt, Cu, and Au atoms participate actively in transferring electron from valence to conduction band and their addition as mono and co-doped formation turns the non-magnetic character of GaN to magnetic. A blueshift in absorption spectrum appear and absorption is more pronounced for Pt-Cu/Au co-doped GaN, suggesting the use of these materials for high energy UV optoelectronics, spintronics, photonic, and sensing devices. However, lower reflection and enhanced conductivity of Pt-Cu/Au co-doped materials in the UV region extends their potential applications in high frequency electronics. Moreover, higher ZT value of Pt@GaN suggest it a better thermoelectric source other than Pt-Cu/Au@GaN.

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8

Gu, Zheng Gang, Min Wu, and Ping Ning. "Study of Heavy Metal Speciation in Surface Sediments of Lugu Lake, China." Applied Mechanics and Materials 448-453 (October 2013): 293–98. http://dx.doi.org/10.4028/www.scientific.net/amm.448-453.293.

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The speciation of the heavy metals Cu, Cr, and Pb in surface sediment samples collected from Lugu Lake in China was analyzed by European Community Bureau of Reference (BCR) sequential extraction methods. Heavy metal bioavailability was assessed by risk assessment code. This study demonstrates that BCR sequential extraction methods and risk assessment code can be used as valuable tools to assess heavy metal mobility, bioavailability and eco-toxicity. The distribution of Cu, Cr, and Pb in the surface sediment of Lugu Lake showed that all three metals were mainly present in the reducible fraction. The bioavailability of the heavy metals in the surface sediment was in the order Cu > Cr > Pb.

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9

Gójska, Aneta Maria, Karol Kozioł, Adam Wasilewski, Ewelina Agnieszka Miśta-Jakubowska, Piotr Mazerewicz, and Jakub Szymanowski. "FLUKA Simulations of Kβ/Kα Intensity Ratios of Copper in Ag–Cu Alloys." Materials 14, no. 16 (August 9, 2021): 4462. http://dx.doi.org/10.3390/ma14164462.

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The numerical simulations of Cu Kα and Cu Kβ fluorescence lines induced by Rh X-ray tube and by monoenergetic radiation have been presented. The copper Kβ/Kα intensity ratios for pure elements as well as for Ag–Cu alloys have been modeled. The results obtained by use of the FLUKA code, based on the Monte-Carlo approach, have been compared to available experimental and theoretical values. A visible relationship was found between the simulated Kβ/Kα intensity ratios and the copper content of the Ag–Cu alloy: as the Cu content increases, the Kβ/Kα coefficient decreases. The results can play role in elemental material analysis, especially in archaeometry.

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10

Wang, Qing, and Manel del Valle. "Determination of Chemical Oxygen Demand (COD) Using Nanoparticle-Modified Voltammetric Sensors and Electronic Tongue Principles." Chemosensors 9, no. 3 (February 27, 2021): 46. http://dx.doi.org/10.3390/chemosensors9030046.

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This manuscript reports the use of nanoparticle-modified voltammetric sensors for the rapid and green determination of chemical oxygen demand in river waters and waters from agricultural waste. Four different variants of modified electrodes have been prepared: CuO nanoparticles electrogenerated over Cu and covered with Nafion film (CuO/Cu-Nf), and graphite–epoxy composites modified with Cu, CuO, and Cu–Ni alloy nanoparticles. The response features of these electrodes were assessed by calibrating them vs. glucose, glycine, ethyleneglycol, and hydrogenphtalate in alkaline media, as samples providing different difficulty in their (bio)degradation characteristics. The most sensitive electrode was demonstrated to be the (CuO/Cu-Nf) electrode, with an LOD of 12.3 mg O2·L−1. The joint information provided by the sensor array showed the ability of estimating both the organic load and the type of sample in terms of difficulty of degradation, in what can be named an intelligent sensor assembly.

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11

Jain, A., K. M. Chi, M. J. Hampden-Smith, T. T. Kodas, J. D. Farr, and M. F. Paffett. "Chemical vapor deposition of copper via disproportionation of hexafluoroacetylacetonato(1,5 -cyclooctadiene)copper(I), (hfac)Cu(1,5-COD)." Journal of Materials Research 7, no. 2 (February 1992): 261–64. http://dx.doi.org/10.1557/jmr.1992.0261.

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Hot- and cold-wall chemical vapor deposition (CVD) using the volatile copper(I) compound (hfac)Cu(1,5-COD), where hfac = 1,1,1,5,5,5,-hexafluoroacetylacetonate and 1,5-COD = 1,5-cyclooctadiene, as a precursor was carried out in hot-wall and warm-wall, lamp-heated reactors using SiO2 substrates that had been patterned with Pt or W, over a temperature range 120 °C-250 °C. Deposition was observed onto Pt, W, and SiO2 over this temperature range at rates of up to 3750 Å/min to give copper films that contained no detectable impurities by Auger electron spectroscopy and gave resistivities of 1.9-5.7 μ ohm cm. The volatile by-products formed during deposition were 1,5-COD and Cu(hfac)2 and a mass balance was consistent with the quantitative disproportionation reaction: 2(hfac)Cu(1,5-COD) → Cu + Cu(hfac)2 + 2(1,5-COD). The measured activation energy for this CVD reaction was 26(2) kcal/mol. The absence of selectivity for metal surfaces in the presence of SiO2 is in contrast to CVD results for the related compounds (β-diketonate)Cu(PMe3) where β-diketonate = hfac, 1,1,1-trifluoroacetylacetonate (tfac), and acetylacetonate (acac).

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12

Sunardi, Sunardi, and C. Supriyanto. "COMPARISON TEST OF FNAA AND AAS METHOD FOR Cu, Cd, Cr, AND Pb ANALYSIS OF CODE RIVER SEDIMENT (INDONESIA)." Indonesian Journal of Chemistry 8, no. 2 (June 17, 2010): 158–62. http://dx.doi.org/10.22146/ijc.21634.

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Comparison test of Fast Neutron Activation Analysis (FNAA) and Atomic Absorption Spectrometry (AAS) method for analysis of Cu, Cd, Cr, Pb elements in Code river sediment samples has been done. Comparisons of test used Standard Reference materials (SRM) sample, covering the validation test, t test and F test for both method and then these methods were used to analyze the Code river sediment samples. Comparisons test result show that the validity of both method are around 92.69 % to 98.12 % and t test show that there is no significant difference in average concentration, F test of both methods show that there is no difference in accuracy. The analysis result of Code sediment using FNAA for Cu, Cd, Cr, Pb are (15.41 - 53.92) ppm, (1.82 - 3.66) ppm, (14.72 - 87.28) ppm, (18.23 - 109.31) ppm respectively, while those using AAS method are (13.71 - 51.11) ppm, (1.64 - 3.33) ppm, (12.81 - 86.75) ppm, (15.74 - 105.53) ppm, respectively. Statistic result test using ANOVA method showed that the concentration of Cr are not significantly differences within sampling locations, while those for Cd, Cr, Pb show a significant difference within sampling location Keywords: FNAA, AAS, Cu, Cd, Cr, Pb, sediment samples

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13

Burton, Edward D., Ian R. Phillips, Darryl W. Hawker, and Dane T. Lamb. "Copper behaviour in a Podosol. 1. pH-dependent sorption - desorption, sorption isotherm analysis, and aqueous speciation modelling." Soil Research 43, no. 4 (2005): 491. http://dx.doi.org/10.1071/sr04117.

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The effects of pH and Cu loading on the solid/solution partitioning of Cu in a Podosol from south-east Queensland, Australia was examined. Sorption–desorption of Cu exhibited maximum linear distribution coefficients (KD) at approximately pH 5. Observed decrease in KD values at pH >5 was attributed to increased solubility of native dissolved organic carbon (DOC) at higher pH and subsequent formation of non-sorbing Cu–DOC complexes. Speciation modelling with the MINTEQA2 code indicated that >90% of aqueous Cu was present as Cu–DOC complexes at pH >5.5. The effect of Cu loading was examined with sorption isotherm analysis at pH 5 using solid : solution ratio approaches that were both constant (1 : 2 and 1 : 10) and variable. As the solid : solution ratio increased, the proportion of Cu sorbed decreased due to the formation of Cu-DOC complexes. However, this effect was negligible once these Cu–DOC complexes were accounted for via free Cu2+ sorption isotherms. This indicated that Cu2+ sorption at concentrations <0.08 mg/L was described by a KD value of approximately 3000 L/kg. Despite this relatively high KD value for Cu2+ sorption, the results indicate that Cu–DOC complexes significantly enhance Cu solubility in soils high in DOC.

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14

TAN, N. X., and A. J. BOURDILLON. "WHY DOES HIGH Tc SOMETIMES DEPEND ON OXIDATION — AN INVESTIGATION OF MADELUNG POTENTIALS." International Journal of Modern Physics B 04, no. 03 (March 10, 1990): 517–24. http://dx.doi.org/10.1142/s0217979290000255.

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Some high temperature superconductors require atmospheres of oxygen for the formation of the superconducting phase, and others do not. The former corrode more easily and includes the doped compound ( La 1.5 Ba 0.5) CuO 4. In the latter class, Cu ions inhabit sites with large ionic potential, which apparently allows the formation of high charge states such as Cu (d8) or CuO +. An elementary code was used to examine potentials on a number of defect sites. Thus a high charge state on polyvalent Cu is a feature common to both types of superconductors.

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15

TAN, K. C., Y. P. GUO, A. T. S. WEE, and C. H. A. HUAN. "(2×1) OXYGEN SUPERSTRUCTURE ON Cu(210) SURFACE STUDIED BY QUANTITATIVE LEED ANALYSIS AND STM." Surface Review and Letters 06, no. 05 (October 1999): 859–63. http://dx.doi.org/10.1142/s0218625x99000913.

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Adsorption of oxygen at elevated temperatures on Cu(210) surface leads to the formation of a (2×1) superstructure similar to that found on Cu(110). Previous STM work done on this system showed diperiodic Cu–O rows running along the [001] direction. In this work, low energy electron diffraction (LEED) experiments were done on the Cu(210)-(2×1)O surface structure. Ten diffracted beams at normal incidence were used for multiple scattering calculations using the Barberi/Van Hove symmetrized tensor LEED code. Four models were optimized for the calculations and the best fit to experiment is found to be the model with alternate missing –Cu–0– rows and oxygen atom occupying the long bridge site. Oxygen to first and second Cu nearest neighbors are optimized to 1.81 and 1.92 Å respectively and the position of the oxygen atom above the (110) plane have been optimized to about 0.12 Å.

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16

Abdel-Waged, Khaled, and Nuha Felemban. "Nucleon shadowing effects in Cu + Cu and Au + Au collisions at RHIC within the HIJING code." Journal of Physics G: Nuclear and Particle Physics 45, no. 2 (January 12, 2018): 025104. http://dx.doi.org/10.1088/1361-6471/aaa101.

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17

Munakata, Megumu, Susumu Kitagawa, Hisao Shimono, and Hideki Masuda. "Synthesis, characterization, and molecular structures of binary and ternary copper(I) complexes with 1,5-cyclooctadiene (cod): [Cu(cod)2]ClO4 and [cu(cod)(2,2'-bipyridine)]PF6." Inorganic Chemistry 30, no. 12 (June 1991): 2610–14. http://dx.doi.org/10.1021/ic00012a009.

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18

Huang, Xinwen, Yingying Zhu, Wanquan Yang, Anhua Jiang, Xiaoqiang Jin, Yirong Zhang, Liang Yan, Geshan Zhang, and Zongjian Liu. "A Self-Supported CuO/Cu Nanowire Electrode as Highly Efficient Sensor for COD Measurement." Molecules 24, no. 17 (August 28, 2019): 3132. http://dx.doi.org/10.3390/molecules24173132.

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A self-supported CuO/Cu nanowire electrode (CuO/CuNWE), which was prepared by annealing Cu nanowires to form a porous Cu nanowire electrode (CuNWE) and then anodizing the as-prepared CuNWE in alkaline medium to generate Cu(OH)2 nanowires followed by calcination, was employed for chemical oxygen demand (COD) determination using cyclic voltammetry (CV). The structure and electrochemical behavior of the CuO/CuNWE were investigated by scanning electron microscopy, X-ray diffraction, and CV. The results indicated that the as-synthesized CuO/CuNWE, in which CuO nanowires with a length of several micrometers and a diameter of 100 to 300 nm could be found, was stable in alkaline medium and more electrocatalytically active for oxidizing a wide range of organic compounds in comparison with the CuNWE. Under optimized alkaline concentration and scan rate, the CuO/CuNWE exhibited a good performance for COD measurement, with a linear range of 5 to 1153 mg L−1, a sensitivity of 2.46× 10−2 mA /(mg L−1), and a detection limit of about 2.3 mg L−1. In addition, an excellent correlation was observed in COD values obtained by our method and the classic dichromate method (r = 0.9995, p < 0.01, n = 11). Finally, our method was successfully used to measure the COD values in real water samples, showing great potential for practical application in water pollution control.

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19

Chong, Fa Li. "Development of W/Cu Plasma Facing Component for Fusion Device." Materials Science Forum 809-810 (December 2014): 750–56. http://dx.doi.org/10.4028/www.scientific.net/msf.809-810.750.

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Tungsten was considered a promising plasma facing material in fusion device due to its high sputtering threshold, the high melting point,and so on. Several technologies fabricated tungsten armor on copper substrate were introduced, which included plasma sprayed tungsten coating, W/Cu functionally gradient material and the dispersiion strengtheded W alloys (W-TiC, W-La2O3). Meanwhile, W-Cu mock-up with the different compliant interlayers was optimizated by means of ANSYS code.

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20

Liu, Ying, An Ming Bao, and Xiang Liang Pan. "Depth Variability and Fractionation of Fe, Mn, Cu and Pb in Sediments from Bosten Lake in Xinjiang, Northwest China." Advanced Materials Research 864-867 (December 2013): 1036–41. http://dx.doi.org/10.4028/www.scientific.net/amr.864-867.1036.

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The abundance and layered evolution vs. depth of dissolved and solid species of Mn, Fe, Cu and Pb were investigated both in extracted porewaters and in sedimentary solid materials. The chemical speciations between five geochemical phases (exchangeable fraction, carbonate fraction, Fe/Mn oxide fraction, organic fraction, and the residual) versus depth of the heavy metals (Mn, Fe, Cu and Pb) were gotten using five-step sequential extraction procedures. The concentration of metals in porewaters and of sedimentary solid phases was analyzed by inductively coupled plasma mass spectrometry (ICP-MS). Heavy metal concentrations do not have distinct patterns along the depth. In Bosten Lake, the total concentrations of Cu is relative plentiful. Sedimentary Mn, Fe, Cu and Pb are found mainly in the residual fraction (7096%). According to the Risk Assessment Code (RAC), these sediments are Mn at between low and medium risk, Fe at no risk, Cu and Pb at low risk.

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21

Wang, Yufeng, Hui Zhou, Xuebin Zhao, Qingchen Zhang, Poru Zhao, Xiance Yu, and Yangkang Chen. "CuQ-RTM: A CUDA-based code package for stable and efficient Q-compensated reverse time migration." GEOPHYSICS 84, no. 1 (January 1, 2019): F1—F15. http://dx.doi.org/10.1190/geo2017-0624.1.

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Reverse time migration (RTM) in attenuating media should take absorption and dispersion effects into consideration. The latest proposed viscoacoustic wave equation with decoupled fractional Laplacians facilitates separate amplitude compensation and phase correction in [Formula: see text]-compensated RTM ([Formula: see text]-RTM). However, intensive computation and enormous storage requirements of [Formula: see text]-RTM prevent it from being extended into practical application, especially for large-scale 2D or 3D cases. The emerging graphics processing unit (GPU) computing technology, built around a scalable array of multithreaded streaming multiprocessors, presents an opportunity for greatly accelerating [Formula: see text]-RTM by appropriately exploiting GPUs architectural characteristics. We have developed the cu[Formula: see text]-RTM, a CUDA-based code package that implements [Formula: see text]-RTM based on a set of stable and efficient strategies, such as streamed CUDA fast Fourier transform, checkpointing-assisted time-reversal reconstruction, and adaptive stabilization. The cu[Formula: see text]-RTM code package can run in a multilevel parallelism fashion, either synchronously or asynchronously, to take advantages of all the CPUs and GPUs available, while maintaining impressively good stability and flexibility. We mainly outline the architecture of the cu[Formula: see text]-RTM code package and some program optimization schemes. The speedup ratio on a single GeForce GTX760 GPU card relative to a single core of Intel Core i5-4460 CPU can reach greater than 80 in a large-scale simulation. The strong scaling property of multi-GPU parallelism is demonstrated by performing [Formula: see text]-RTM on a Marmousi model with one to six GPU(s) involved. Finally, we further verified the feasibility and efficiency of the cu[Formula: see text]-RTM on a field data set.

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22

Narsimlu, N., K. Siva Kumar, and G. Sivarma Sastry. "Charge carrier transport in Cu(COOH)2 organic molecular single crystal." Materials Science and Engineering: B 40, no. 2-3 (September 1996): 203–5. http://dx.doi.org/10.1016/0921-5107(96)01597-8.

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23

Sychev, O., Y. F. Zhukovskii, Eugene A. Kotomin, and G. Borstel. "Ab initio Calculations of Copper Nanostructures of MgO Substrate." Solid State Phenomena 99-100 (July 2004): 219–22. http://dx.doi.org/10.4028/www.scientific.net/ssp.99-100.219.

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Ab initio slab simulations were performed for copper adhesion to a perfect MgO(001) surface using the DFT-LCGTF method as implemented in CRYSTAL98 computer code. In order to clarify the nature of interfacial bonding, we considered a slab model of the Cu/MgO(001) interface with regular 1/4 monolayer (ML), 1/2 ML, 1 ML and 2 ML substrate coverages and verified the results of our calculations. In particular, the dependences of the adhesion energy per Cu atom, projections of multipole moments as well as total and projected densities of states (DOS) on the substrate coverage by a metal are analyzed. Computer simulation indicated that physical adsorption makes the dominant contribution to bonding on the regular Cu/MgO(001) interface.

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24

Dong, Li Ming, Yu Zhao, Ze Min Qin, Lian Tong Zhou, and Su Chen. "Chemical Speciation of Heavy Metals and Trace Element in Urban Street Dusts of Beijing, China." Advanced Materials Research 955-959 (June 2014): 1103–6. http://dx.doi.org/10.4028/www.scientific.net/amr.955-959.1103.

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Sequential extraction was used to characteristic the heavy metals (Cd, Cr, Zn, Cu, Ni and Pb) and trace element (As) studied in these urban dusts. The ratio of the average total content (F1+F2+F3+F4+R) to the corresponding background value of Beijing soil decreased in the order of Cd>Pb>Cu>Zn>Ni>Cr>As. For fraction distribution, residual form predominated among for Zn, Ni, Cr and Pb. Oxidizable fraction was the leading fraction for Cd and Cu and was the second dominated fraction for Zn and Ni. The results of Risk assessment code (RAC) showed the medium environmental risk of Cd was found in Dongcheng and East 4thRing districts, while a high environmental risk for Cr was present in Xizhimen and Yongdingmen areas.

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25

Curtis, Thomas, Dolly Dowsett, Paul Simpson, James Hernon, Ahmed El Hadi, and Irshad Shaikh. "Robotic Retrieval of Cu‐IUD from Rectovaginal Septum." Colorectal Disease, February 17, 2023. http://dx.doi.org/10.1111/codi.16526.

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26

"KEMPER Cu-ETP (E-Cu)." Alloy Digest 67, no. 9 (September 1, 2018). http://dx.doi.org/10.31399/asm.ad.cu0879.

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Abstract Alloy Cu-ETP (UNS C11000) is a high conductivity pure copper alloy. The alloy is characterized by good electrical and thermal conductivity, and very good resistance to stress-corrosion cracking. This datasheet provides information on composition, physical properties, and bend strength. It also includes information on forming. Filing Code: Cu-879. Producer or source: Gebr. Kemper GmbH + Company KG Metallwerke.

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27

"CONCAST C89835." Alloy Digest 68, no. 5 (May 1, 2019). http://dx.doi.org/10.31399/asm.ad.cu0887.

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Abstract Concast C89835 is a lead-free casting alloy that can be interchangeable with C932 (Alloy Digest Cu-387, January 1980), C836 (Alloy Digest Cu-317, August 1976), and C844 (Alloy Digest Cu-349, March 1978). This datasheet provides information on composition, physical properties, hardness, and tensile properties. Filing Code: Cu-887. Producer or source: Concast Metal Products Company.

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"SUPERMET 2506 Cu." Alloy Digest 56, no. 8 (August 1, 2007). http://dx.doi.org/10.31399/asm.ad.ss0995.

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Abstract Supermet 2506 Cu is a rutile-coated electrode for welding copper bearing superduplex austenitic/ferritic stainless steels. This datasheet provides information on composition, hardness, and tensile properties as well as fracture toughness. It also includes information on forming and joining. Filing Code: SS-995. Producer or source: Metrode Products Ltd.

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"AURUBIS Cu-HCP." Alloy Digest 70, no. 1 (January 1, 2021). http://dx.doi.org/10.31399/asm.ad.cu0916.

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Abstract Aurubis Cu-HCP is a deoxidized, oxygen-free copper with a low residual phosphorus content. It combines very good formability and joining characteristics with high electrical conductivity (98% IACS minimum). This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as heat treating. Filing Code: Cu-916. Producer or source: Aurubis AG.

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30

"KEMPER Cu-PHC." Alloy Digest 67, no. 10 (October 1, 2018). http://dx.doi.org/10.31399/asm.ad.cu0880.

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Abstract Alloy Cu-PHC (UNS C52400) is an oxygen-free extra low-phosphorus alloy. Typical uses include electrical devices, switching elements, connectors, and terminals. This datasheet provides information on composition, physical properties, and bend strength. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Cu-880. Producer or source: Gebr. Kemper GmbH + Company KG Metallwerke.

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31

"KME Cu-DLP." Alloy Digest 70, no. 2 (February 1, 2021). http://dx.doi.org/10.31399/asm.ad.cu0917.

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Abstract KME Cu-DLP is a phosphorus-deoxidized copper that contains a minimum of 99.90% copper and a small amount of residual phosphorus. Owing to the presence of residual phosphorus the electrical conductivity of KME Cu-DLP is lower than that of the high-conductivity and oxygen-free coppers (Cu-ETP, Cu-FRHC, and Cu-OF). This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming and heat treating. Filing Code: Cu-917. Producer or source: KME Germany GmbH.

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32

"AURUBIS Cu-DLP." Alloy Digest 71, no. 1 (January 1, 2022). http://dx.doi.org/10.31399/asm.ad.cu0928.

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Abstract Aurubis Cu-DLP is a phosphorus-deoxidized copper that contains a minimum of 99.90% copper and a small amount of residual phosphorus. Owing to the presence of residual phosphorus, the electrical conductivity of Aurubis Cu-DLP is lower than that of the high-conductivity and oxygen-free coppers (Cu-ETP, Cu-FRHC, and Cu-OF). Its conductivity is, however, higher than that of Cu-DHP and Cu-HCP. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Cu-928. Producer or source: Aurubis AG.

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33

"AURUBIS Cu-PHC." Alloy Digest 69, no. 12 (December 1, 2020). http://dx.doi.org/10.31399/asm.ad.cu0915.

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Abstract Aurubis Cu-PHC is a deoxidized, oxygen-free copper with a very low residual phosphorus content. It combines good electrical conductivity with excellent hot and cold formability and excellent joining characteristics. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as heat treating and joining. Filing Code: Cu-915. Producer or source: Aurubis AG.

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34

"KME Cu-HCP." Alloy Digest 71, no. 3 (March 1, 2022). http://dx.doi.org/10.31399/asm.ad.cu0930.

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Abstract KME Cu-HCP is a phosphorus-deoxidized copper that contains a minimum of 99.95% copper and low residual phosphorus. It has very high electrical conductivity, and may be heat-treated, welded, or brazed without the need for special precautions to avoid hydrogen embrittlement. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Cu-930. Producer or source: KME Germany GmbH.

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"KME Cu-DHP." Alloy Digest 70, no. 8 (August 1, 2021). http://dx.doi.org/10.31399/asm.ad.cu0923.

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Abstract KME Cu-DHP is a phosphorus-deoxidized copper that contains a minimum of 99.90% copper and high residual phosphorus. The electrical conductivity of this type of copper is relatively low on account of the high phosphorus content. KME Cu-DHP possesses very good formability and joining properties and is resistant against hydrogen embrittlement. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and bend strength. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Cu-923. Producer or source: KME Germany GmbH.

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36

"CONCAST C89833." Alloy Digest 68, no. 7 (July 1, 2019). http://dx.doi.org/10.31399/asm.ad.cu0891.

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Abstract Concast C89833 is a lead-free casting alloy that can be interchangeable with C836 (Alloy Digest Cu-317, August 1976). C89833 is classified as a bismuth tin bronze. See also Federalloy I-844, Alloy Digest Cu-611, March 1997. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. Filing Code: Cu-891. Producer or source: Concast Metal Products Company.

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"KME Cu-ETP." Alloy Digest 69, no. 10 (October 1, 2020). http://dx.doi.org/10.31399/asm.ad.cu913.

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Abstract KME Cu-ETP (electrolytic tough pitch copper) is an electrolytically refined, high conductivity copper that contains a minimum of 99.90% Cu and a controlled amount of oxygen in the form of Cu2O. It has a minimum electrical conductivity of 100% IACS. Cu-ETP is the most widely used grade of copper in electrical applications all over the world and represents over half of global copper use. This datasheet provides information on composition, physical properties, hardness, tensile properties, and bend strength as well as fatigue. It also includes information on heat treating. Filing Code: Cu-913. Producer or source: KME Germany GmbH.

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"KME Cu-PHC (C10300)." Alloy Digest 72, no. 1 (January 1, 2023). http://dx.doi.org/10.31399/asm.ad.cu0937.

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Abstract KME Cu-PHC is a phosphorus-deoxidized copper that contains a minimum of 99.95% copper and low residual phosphorus. It has very high thermal and electrical conductivity, and good welding and soldering properties. The electrical conductivity of KME Cu-PHC is higher than that of Cu-HCP. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, and joining. Filing Code: Cu-937. Producer or source: KME Germany GmbH.

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"WRM ALLOY 4086." Alloy Digest 47, no. 12 (December 1, 1998). http://dx.doi.org/10.31399/asm.ad.cu0625.

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Abstract WRM Alloy 4086 is a modified Cu-Zn-Sn alloy with significantly better electrical conductivity than that of phosphor bronzes of equal strength. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. Filing Code: CU-625. Producer or source: Waterbury Rolling Mills Inc.

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40

"AMPCO-TRODE 150." Alloy Digest 42, no. 7 (July 1, 1993). http://dx.doi.org/10.31399/asm.ad.cu0585.

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Abstract AMPCO-TRODE 150 is recommended for overlay application and welding AMPCO 18 alloy (Alloy Digest Cu-51, June 1957). This datasheet provides information on composition, hardness, and tensile properties. It also includes information on machining and joining. Filing Code: CU-585. Producer or source: Ampco Metal Inc.

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41

"AMPCO-TRODE 250." Alloy Digest 42, no. 11 (November 1, 1993). http://dx.doi.org/10.31399/asm.ad.cu0591.

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Abstract AMPCO-TRODE 250 is used in extreme bearing applications and to weld AMPCO 21 castings (See Alloy Digest Cu-93, October 1960). This datasheet provides information on composition, hardness, and tensile properties. It also includes information on machining and joining. Filing Code: CU-591. Producer or source: Ampco Metal Inc.

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42

"WRM ALLOY 4252." Alloy Digest 47, no. 7 (July 1, 1998). http://dx.doi.org/10.31399/asm.ad.cu0619.

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Abstract WRM alloy 4252 is a modified copper-zinc-tin alloy similar to C42500 (see Alloy Digest Cu-280, June 1974), with improved conductivity, strength, and forming properties. This datasheet provides information on composition, physical properties, and tensile properties. Filing Code: CU-619. Producer or source: Waterbury Rolling Mills Inc.

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43

"CONCAST C89831." Alloy Digest 68, no. 6 (June 1, 2019). http://dx.doi.org/10.31399/asm.ad.cu0889.

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Abstract Concast C89831 is a lead-free casting alloy that can be interchangeable with C844 (Alloy Digest Cu-349, March 1978). C89831 is classified as a bismuth tin bronze. This datasheet provides information on composition, physical properties, and elasticity. Filing Code: Cu-889. Producer or source: Concast Metal Products Company.

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44

Choudhary, Mahesh, Aman Sharma, Aman Gandhi, Namrata Singh, Punit Dubey, Mahima Upadhyay, Utkarsha Mishra, et al. "Measurement of excitation functions for ^nat Cu(α,x) reactions with detailed covariance analysis." Journal of Physics G: Nuclear and Particle Physics, November 10, 2022. http://dx.doi.org/10.1088/1361-6471/aca1d7.

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Abstract The excitation functions of $^{66}$Ga, $^{67}$Ga, $^{65}$Zn and $^{64}$Cu radioisotopes produced via alpha-induced reaction on $^{nat}$Cu were measured using a stacked-foil activation method. The gamma-ray activity produced by the above-mentioned radionuclides was measured using the HPGe detector. The covariance analysis was performed to quantify the measured cross-section uncertainties as well as the correlation between different alpha energy cross sections. A covariance matrix and cross-sections for the $^{nat}$Cu($\alpha$,x)$^{66}$Ga, $^{nat}$Cu($\alpha$,x)$^{67}$Ga, $^{nat}$Cu($\alpha$,x)$^{65}$Zn and $^{nat}$Cu($\alpha$,x)$^{64}$Cu nuclear reactions in the projectile energy range of 15–37 MeV are reported in the present work. The measured reaction cross sections are compared with the existing experimental data and theoretically simulated results from the TALYS code.

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45

"CARPENTER TYPE 204-CU." Alloy Digest 47, no. 4 (April 1, 1998). http://dx.doi.org/10.31399/asm.ad.ss0711.

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Abstract Carpenter type 204-Cu is a low-nickel, Manganese containing, austenitic stainless steel with copper. The copper provides a reduced work hardening rate for superior forming when compared to other 200 series stainless steels. This datasheet provides information on composition, physical properties, and tensile properties as well as fatigue. It also includes information on low and high temperature performance, corrosion and wear resistance as well as forming, heat treating, machining, and joining. Filing Code: SS-711. Producer or source: Carpenter.

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46

"AURUBIS Cu-ETP." Alloy Digest 70, no. 7 (July 1, 2021). http://dx.doi.org/10.31399/asm.ad.cu0922.

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Abstract Aurubis Cu-ETP (electrolytic tough pitch copper) is an electrolytically refined, high conductivity copper that contains a minimum of 99.90% Cu and a controlled amount of oxygen (generally 0.02–0.04%). It has a minimum electrical conductivity of 100% IACS. Special precautions are necessary when heat treating, welding, or brazing Aurubis Cu-ETP in atmospheres containing hydrogen so as to avoid hydrogen embrittlement. Cu-ETP is the most widely used grade of copper in electrical applications and represents over half of global copper use. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming and heat treating. Filing Code: Cu-922. Producer or source: Aurubis AG.

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"AURUBIS Cu-OFE." Alloy Digest 69, no. 4 (April 1, 2020). http://dx.doi.org/10.31399/asm.ad.cu0907.

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Abstract Aurubis Cu-OFE (oxygen-free electronic) is an oxygen-free, high conductivity copper with 99.99% minimum copper. It offers the advantages of both electrolytic tough pitch (ETP) copper and phosphorus deoxidized (DHP) copper. Its high purity, with less than 5 ppm (0.0005%) oxygen, and the absence of deoxidizers accounts for minimum 101% IACS electrical conductivity as well as no susceptibility to hydrogen embrittlement. Cu-OFE has very good formability and can be soldered and welded, which makes it superior to Cu-ETP in these aspects. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming and machining. Filing Code: Cu-907. Producer or source: Aurubis AG.

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"AURUBIS Cu-OF." Alloy Digest 69, no. 8 (August 1, 2020). http://dx.doi.org/10.31399/asm.ad.cu0911.

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Abstract Aurubis Cu-OF is an oxygen-free, high conductivity copper with 99.95% minimum Cu. It offers the advantages of both electrolytic tough pitch (ETP) copper and phosphorus deoxidized (DHP) copper. Its high purity, with less than 10 ppm (0.001%) oxygen, and the absence of deoxidizers accounts for an electrical conductivity of 100% IACS minimum, as well as no susceptibility to hydrogen embrittlement. Due to the absence of oxides in the structure, Cu-OF is capable of withstanding extra deep drawing and severe forming, and is superior to Cu-ETP in this respect. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and bend strength. It also includes information on corrosion resistance as well as forming, heat treating, and joining. Filing Code: Cu-911. Producer or Source: Aurubis AG.

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"KOBELCO SUPERKFC." Alloy Digest 65, no. 12 (December 1, 2016). http://dx.doi.org/10.31399/asm.ad.cu0854.

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Abstract Kobelco Alloy SuperKFC has high strength and high conductivity for electronic applications. The alloy is nominally Cu-0.3Fe-0.1P. This datasheet provides information on composition, physical properties, hardness, and tensile properties. and bend strength. It also includes information on forming. Filing Code: Cu-854. Producer or source: Kobe Steel Ltd, Aluminum and Copper Business.

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50

"OLIN ALLOY C7025." Alloy Digest 48, no. 3 (March 1, 1999). http://dx.doi.org/10.31399/asm.ad.cu0631.

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Abstract Alloy C7025 is a second generation, high performance alloy whose strength comes from an age hardening heat treatment similar to that used for the beryllium coppers. With stress relaxation resistance comparable to Be-Cu alloys C170/C172 (see Olin 170, Alloy Digest Cu-615, July 1998, and Olin 172, Alloy Digest Cu-621, August 1998) and conductivity almost double that of brass, C7025 is well suited to high-reliability connector applications. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as joining. Filing Code: CU-631. Producer or source: Olin Brass.

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